CN110537394B - 印刷电路纳米纤维网制造方法及印刷电路纳米纤维网 - Google Patents

印刷电路纳米纤维网制造方法及印刷电路纳米纤维网 Download PDF

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CN110537394B
CN110537394B CN201880025889.5A CN201880025889A CN110537394B CN 110537394 B CN110537394 B CN 110537394B CN 201880025889 A CN201880025889 A CN 201880025889A CN 110537394 B CN110537394 B CN 110537394B
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nanoweb
printed circuit
nanofiber web
circuit pattern
region
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CN110537394A (zh
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徐寅踊
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Amogreentech Co Ltd
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Amogreentech Co Ltd
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Priority claimed from KR1020170051596A external-priority patent/KR20180118374A/ko
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/0283Stretchable printed circuits
    • HELECTRICITY
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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    • H05K3/108Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/32Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
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    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2201/00Polymeric substrate or laminate
    • B05D2201/02Polymeric substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
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Abstract

提供一种印刷电路纳米纤维网的制造方法。本发明一个实施例的印刷电路纳米纤维网的制造方法包括:(1)将包含纤维形成成分的纺纱溶液进行静电纺丝而制造纳米纤维网的步骤;及(2)通过无电电镀法,以被覆所述纳米纤维网上预定区域内包含的纳米纤维的外部面的方式形成电路图案部的步骤。据此,可以体现印刷有具有柔韧性及复原性的电路图案的印刷电路纳米纤维网,以便适合于未来型智能设备。另外,利用无电电镀法,在柔软的纳米纤维网上,电路图案部可以形成得具有致密、均一的厚度,同时,通过具有多个气孔的纳米纤维网,满足防水性和通气性特性,因而包括生物贴片等的医疗设备、智能设备等的电子设备在内,可以在各种未来产业领域多样地应用。

Description

印刷电路纳米纤维网制造方法及印刷电路纳米纤维网
技术领域
本发明涉及印刷电路纳米纤维网,更详细而言,涉及一种具有柔韧性、复原性、防水性及通气性的印刷电路纳米纤维网的制造方法、通过其制造的印刷电路纳米网及利用其的电子设备。
背景技术
一般而言,印刷电路板(PCB)是成为多样领域的电气、电子制品基础的部件,从日用家电制品到半导体用模块、检查装置、汽车、国防产业及人造卫星,印刷电路板的用途正在逐渐扩大。
另一方面,未来将开发使用的未来型智能设备,预计将与现在的装置在结构上、概念上存在差异,特别是最近,智能设备正在开发用于穿戴于人体而使人类生活更便利的眼镜、服装等,并一同内置电子部件。在这种变化趋势下,开发使用者能穿戴的印刷电路板,将会促进诸如智能服装的未来型装置的开发,因而对提高柔韧性并可穿戴于人体的印刷电路板的研究及技术开发必不可少。
普通的印刷电路板可以分为在环氧树脂中添加玻璃纤维等加强材料而粘合铜箔的刚性印刷电路板(Rigid Printed Circuit Board;Rigid PCB)、在聚酰亚胺(polyimide)基材上粘合铜箔的柔性印刷电路板(Flexible Printed Circuit Board;FPCB)及结合了刚性印刷电路板与柔性印刷电路板优点的刚性-柔性印刷电路板(Rigid-Flexible PrintedCircuit Board;R-F PCB),在韩国授权专利公报第10-1139970号(专业文献1)中公开了一种柔性印刷电路板的制造方法,其特征在于,包括:在柔性的绝缘基板上形成的片层上形成电路图案的1步骤;在所述电路图案上涂覆第一感光物质的2步骤;将所述第一感光物质暴光显影而在所述电路图案上形成保护图案的3步骤;蚀刻所述片层的4步骤;及剥离所述保护图案的5步骤;所述第一感光物质为液态或薄膜型感光剂。
如果利用所述专利文献1的制造方法,虽然可以体现具有柔韧性的印刷电路板,但基材是诸如聚酰亚胺膜的柔性的绝缘基板,因而无法具有充分的柔韧性,也无法期待折叠或起皱后重新展开的复原特性,不具有通气性,存在在要求可穿戴的智能设备等中无法应用的缺点。
因此,迫切需要开发一种关于印刷电路板的技术,在具有柔韧性、复原性及通气性的同时制作成可穿戴形态,即使是柔软的电子元件或未来型可穿戴智能设备也可以应用。
发明内容
解决的技术问题
本发明正是鉴于如上所述问题而研发的,其目的在于提供一种在纳米纤维网上印刷电路图案而具有柔韧性及复原性的印刷电路板的制造方法及利用其的电子设备。
另外,本发明另一目的在于提供一种提高电路图案部的致密性及厚度均一性并能够在诸如纳米纤维网的柔软基材上对电路图案部镀金的利用了无电电镀法的印刷电路板的制造方法及利用其的电子设备。
而且,本发明又一目的在于提供一种将由纳米尺寸的纤维堆积形成的具有多个气孔的纳米纤维网用作印刷电路板的基材,满足生物贴片或医疗用传感器要求的柔韧性、复原性及通气性的印刷电路板的制造方法及利用其的电子设备。
技术方案
为了解决上述课题,本发明提供一种印刷电路纳米纤维网的制造方法,包括:(1)将包含纤维形成成分的纺纱溶液进行静电纺丝而制造纳米纤维网的步骤;及(2)通过无电电镀法,以被覆所述纳米纤维网上预定区域内包含的纳米纤维的外部面的方式形成电路图案部的步骤。
另外,根据本发明的一个实施例,所述纳米纤维网的厚度可以为5~200μm。
另外,所述纳米纤维网的气孔度可以为10~80%。
另外,被覆于所述纳米纤维的电路图案部的厚度可以为0.1~10μm。
另外,所述纳米纤维网的厚度可以为10~150μm及孔隙度可以为30~60%,被覆于所述纳米纤维的电路图案部的厚度可以为0.1~3μm。
另外,所述(2)步骤可以还包括:2-1)使所述纳米纤维网浸渍于催化剂溶液而进行催化处理的步骤;2-2)使经催化处理的所述纳米纤维网激活的步骤;及2-3)使激活的所述纳米纤维网通过无电电镀法形成电路图案部的步骤。
另外,在执行所述(2)步骤之前,可以还包括:使所述纳米纤维网脱脂或亲水化处理的步骤。
另外,所述催化剂溶液可以包含选自由Ti、Sn、Au、Pt、Pd、Ni、Cu、Ag、Al、Zn及Fe的盐构成的组的任意一种以上化合物。
另外,所述2-2)步骤可以是在硫酸溶液中浸渍、激活的步骤。
另外,所述(2)步骤的无电电镀法可以是使将在所述纳米纤维网上形成电路图案部的部分之外的其余面掩蔽并浸渍于镀金溶液的步骤。
另外,所述镀金溶液可以包含选自由Ti、Sn、Au、Pt、Pd、Ni、Cu、Ag、Al、Zn及Fe构成的组的金属。
另外,所述印刷电路纳米纤维网可以分别包括借助于电路图案部而形成的上部区域的第一图案和下部区域的第二图案,所述第一图案和第二图案可以以彼此相同的图案形成。
另外,所述电路图案部可以包括在所述纳米纤维网的上部面形成的第一电路图案部及在下部面形成的第二电路图案部,所述第一电路图案部及第二电路图案部可以以彼此相同的电路图案形成。
另外,印刷电路纳米纤维网可以在与印刷了电路图案部的纳米纤维网一面相向的面还具备强度加强用支撑体。
另外,所述纤维形成成分可以包括选自由聚氨酯(polyurethane)、聚苯乙烯(polystyrene)、聚乙烯醇(polyvinylalcohol)、聚甲基丙烯酸甲酯(polymethylmethacrylate)、聚乳酸(polylactic acid)、聚氧化乙烯(polyethyleneoxide)、聚醋酸乙烯酯(polyvinyl acetate)、聚丙烯酸(polyacrylic acid)、聚己酸内酯(polycaprolactone)、聚丙烯腈(polyacrylonitrile)、聚乙烯吡咯烷酮(polyvinylpyrrolidone)、聚氯乙烯(polyvinylchloride)、聚碳酸酯(polycarbonate)、聚醚酰亚胺(polyetherimide)、聚醚砜(polyesthersulfone)、聚苯并咪唑(polybenzimidazole)、聚对苯二甲酸乙二醇酯(polyethylene terephthalate)、聚对苯二甲酸丁二醇酯(polybutylene terephthalate)及氟类化合物构成的组的一种以上化合物。
另外,本发明提供一种印刷电路纳米纤维网,包括:纳米纤维网,其包括多个纳米纤维;及电路图案部,其被覆在所述纳米纤维网上预定区域内包含的纳米纤维的外部面而形成。
另外,本发明提供一种电子装置,包括:上述的印刷电路纳米纤维网;及贴装于所述印刷电路纳米纤维网的至少一个以上的电子部件。
发明效果
根据本发明的印刷电路纳米纤维网的制造方法,可以体现印刷有具有柔韧性及复原性的电路图案的印刷电路纳米纤维网,以便适合于未来型智能设备。另外,利用无电电镀法,在柔软的纳米纤维网上,电路图案部可以形成得具有致密、均一的厚度,同时,通过具有多个气孔的纳米纤维网,满足防水性和通气性特性,因而包括生物贴片等医疗设备、智能设备等的电子设备在内,可以在各种未来产业领域多样地应用。
附图说明
图1是显示以往蒸镀-光刻工序的图,
图2是显示本发明一个实施例的无电电镀法的顺序图,
图3是显示根据本发明一个实施例而在纳米纤维网预定区域上形成电路图案部的状态的模式图,
图4是显示沿图3所示的X-X'界线的纳米纤维剖面的立体图,
图5至图7作为显示在不同镀金条件下镀金的电路图案部厚度的扫描电子显微镜照片,图5显示了在纳米纤维上镀金的电路图案部的厚度最薄地被覆的状态,图6a及6b显示了在纳米纤维上镀金的电路图案部的厚度被覆得比图5厚的状态,图7a及7b显示了在纳米纤维上镀金的电路图案部厚度最厚地被覆的状态,而且,
图8及图9是显示以本发明一个实施例的制造方法制造的印刷电路纳米纤维网的图。
具体实施方式
下面以附图为参考,对本发明的实施例进行详细说明,以便本发明所属技术领域的普通技术人员能够容易地实施。本发明可以以多种相异的形态体现,不限于在此说明的实施例。为了在附图中明确说明本发明,省略与说明无关的部分,在通篇说明书中,对相同或类似的构成要素赋予相同的附图标记。
本发明的印刷电路纳米纤维网的制造方法包括:(1)将包含纤维形成成分的纺纱溶液进行静电纺丝而制造纳米纤维网的步骤;及(2)通过无电电镀法,以被覆所述纳米纤维网上预定区域内包含的纳米纤维的外部面的方式形成电路图案部的步骤。
所述(1)步骤是将包含纤维形成成分的纺纱溶液进行静电纺丝而制造具备电路图案部的纳米纤维网的步骤。在说明本发明制造方法的(1)步骤之前,首先对使用纳米纤维网作为形成电路图案部的基材的理由进行说明。
普通的印刷电路板可以分为在环氧树脂中添加玻璃纤维等加强材料而粘合铜箔的刚性印刷电路板(Rigid Printed Circuit Board;Rigid PCB)、在聚酰亚胺(polyimide)基材上粘合铜箔的柔性印刷电路板(Flexible Printed Circuit Board;FPCB)及结合了刚性印刷电路板与柔性印刷电路板优点的刚性-柔性印刷电路板(Rigid-Flexible PrintedCircuit Board;R-F PCB)。特别是反映最近趋势的诸如智能设备的未来型装置用印刷电路板,要求优秀的柔韧性,要求即使折叠或起皱也能够保持原来扁平状态的复原力及高弯曲特性。但是,以往柔性印刷电路板使用的聚酰亚胺虽然具有一定水平的柔韧性,但折叠或起皱后重新回归原来扁平状态的复原力很低,在弯曲方面也表现出脆弱的特性,因而对于未来型装置而言,存在稍显不合适的一面。
因此,本发明通过在由多个纳米纤维随机堆积构成的纳米纤维网上印刷电路图案的制造方法,体现在具有优秀柔韧性和复原性的同时表现出优秀弯曲特性的印刷电路纳米纤维网,以便适合于上述未来型智能设备。
即,以本发明的制造方法体现的印刷电路纳米纤维网如图2的顺序图所示,以包围构成纳米纤维网的纳米纤维的外部表面的方式形成电路图案部,可以充分利用纳米纤维本身的优秀柔韧性,由于随机层叠的所述纳米纤维,折叠或起皱后重新恢复的复原特性也可以提高。进而,体现网结构的片材,因而可以提高面向超轻薄设备或可穿戴装置等未来指向型装置的使用度。
就所述纳米纤维网而言,只要是具备纳米纤维并形成三维网形状的纤维网的方法,则可以无限制地使用。优选地,所述纳米纤维网可以将包含纤维形成成分的纺纱溶液进行静电纺丝而形成纳米纤维网。
就用于制造所述纳米纤维网的纺纱溶液中包含的纤维形成成分而言,只要是本行业通常可以使用的纤维形成成分,便可以无限制地使用,优选地,可以包括选自由聚氨酯(polyurethane)、聚苯乙烯(polystyrene)、聚乙烯醇(polyvinylalcohol)、聚甲基丙烯酸甲酯(polymethyl methacrylate)、聚乳酸(polylactic acid)、聚氧化乙烯(polyethyleneoxide)、聚醋酸乙烯酯(polyvinyl acetate)、聚丙烯酸(polyacrylicacid)、聚己酸内酯(polycaprolactone)、聚丙烯腈(polyacrylonitrile)、聚乙烯吡咯烷酮(polyvinylpyrrolidone)、聚氯乙烯(polyvinylchloride)、聚碳酸酯(polycarbonate)、聚醚酰亚胺(polyetherimide)、聚醚砜(polyethersulfone)、聚苯并咪唑(polybenzimidazole)、聚对苯二甲酸乙二醇酯(polyethylene terephthalate)、聚对苯二甲酸丁二醇酯(polybutylene terephthalate)及氟类化合物构成的组的一种以上化合物。
另外,所述氟类化合物可以包括选自由聚四氟乙烯(PTFE)类、四氟乙烯-全氟烷基乙烯基醚共聚物(PFA)类、四氟乙烯-六氟丙烯共聚物(FEP)类、四氟乙烯-六氟丙烯-全氟烷基乙烯基醚共聚物(EPE)类、乙烯-四氟乙烯共聚物(ETFE)类、聚三氟氯乙烯(PCTFE)类、三氟氯乙烯-乙烯共聚物(ECTFE)类及聚偏氟乙烯(PVDF)类构成的组的一种以上化合物,优选地,可以包括聚偏氟乙烯(PVDF)。
此时,当所述纳米纤维包含PVDF作为纤维形成成分时,所述PVDF的重均分子量可以为10,000~1,000,000,优选地,可以为300,000~600,000,但并非限定于此。
所述纤维形成成分可以在纺纱溶液中包含5~30重量%,优选地,可以包含8~20重量%。如果纤维形成成分不足5重量%,则难以形成为纤维,纺丝时无法纺丝成纤维状,而是以液滴状态喷射,即使实现纺丝,也大量形成珠体,溶剂挥发不好,会发生气孔堵塞的现象。另外,当纤维形成成分超过30重量%时,粘度上升,在溶液表面出现固化,难以长时间纺丝,纤维直径增加,无法制成微米以下大小的纤维状。
另外,所述纺丝溶液可以还包含溶剂,就所述溶剂而言,只要是不生成纤维形成成分的沉淀物,不对后述纳米纤维的纺丝性产生影响的溶剂,便可以无限制地使用,但优选地,可以包括选自由γ-丁内酯、环己酮、3-己酮、3-庚酮、3-辛酮、N-甲基吡咯烷酮、二甲基乙酰胺、丙酮二甲基亚砜、二甲基甲酰胺构成的组的任意一种以上。作为一个示例,所述溶剂可以为二甲基乙酰胺与丙酮的混合溶剂。
上述制备的纺纱溶液可以通过公知的静电纺丝装置及方法,制造成纳米纤维。作为一个示例,所述静电纺丝装置可以使用具备纺丝喷嘴为1个的单一纺丝组件的静电纺丝装置,或为了提高批量生产性,可以使用具备多个单一纺丝组件或具备喷嘴为多个的纺丝组件的静电纺丝装置。另外,在静电纺丝方式方面,可以利用干式纺丝或具备外部凝固槽的湿式纺丝,没有方式上的限制。
当向所述静电纺丝装置投入经搅拌的纺纱溶液,在收集器上,例如在纸上进行静电纺丝时,可以收得由纳米纤维形成的纳米纤维网。就所述静电纺丝所需的具体条件而言,作为一个示例,在纺丝组件的喷嘴配备的空气喷射喷嘴,空气喷射的气压可以设置为0.01~0.2MPa范围。如果气压不足0.01Mpa,则不会有利于捕集、收集,当超过0.2Mpa时,纺丝喷嘴的圆锥凝固,发生堵针的现象,会发生纺丝问题。另外,当对所述纺纱溶液进行纺丝时,每喷嘴的纺纱溶液注入速度可以为10~30μl/min。另外,所述喷嘴的尖端至收集器的距离可以为10~30㎝。不过,并非限定于此,可以根据目标而变更实施。
执行所述(1)步骤而制造的纳米纤维网的厚度可以为5~200μm,优选地,厚度可以为10~150μm。如果所述纳米纤维网的厚度不足5μm,则对在纳米纤维网具备的纳米纤维的外部面被覆的电路图案部的支撑功能会低下,印刷电路纳米纤维网的耐久性及机械物性会低下。另外,如果所述纳米纤维网的厚度超过200μm,则在无电式电镀过程中发生的空气会无法从纳米纤维网内流出,耐久性及工序性会低下,会不利于薄型化。
另外,所述纳米纤维网的孔隙度可以为10~80%,优选地,可以为30~60%。如果所述纳米纤维网的孔隙度不足10%,则伸缩性会低下,在无电式电镀时,会发生纤维网的剥离现象,耐久性会低下,如果孔隙度超过80%,则印刷电路纳米纤维网的耐久性、工序性及机械物性会低下,电气特性会低下。
另一方面,为了加强所述纳米纤维网本身不足的强度,提高在所述纳米纤维网上形成的电路图案部的稳定性,在后述的印刷电路纳米纤维网中,可以在与印刷有电路图案部的纳米纤维网一面相向的面还具备强度加强用支撑体。此时,可以包括在所述强度加强用支撑体的一面或两面层叠的第一纳米纤维网或第二纳米纤维网而体现,但并非限定于此。
另一方面,以往普通的印刷电路板的制造方法如图1所示,利用(a)至(g)步骤的光刻工序,此时利用金属粒子在基材表面形成片层的工序象溅射工序一样,由于施加既定压力的外力,因而在象纳米纤维一样柔软材料的基材上,难以形成电路图案部,即使形成,与电路图案相接的纳米纤维表面被损伤或形成凹凸,与电路图案的粘合性低下,因此,导电特性会下降,利用其的电子部件的可靠性会下降。
因此,本发明的制造方法的(2)步骤通过无电电镀法,以被覆所述纳米纤维网上预定区域内包含的纳米纤维的外部面的方式形成电路图案部。
无电电镀法作为利用了不在外部施加电气而借助于溶液内存在的物质的自发性氧化还原反应来形成金属皮膜的技术,如果为了在本发明的纳米纤维网形成电路图案部而利用所述无电电镀法,则具有如下优点。
第一,可以既定地保持镀金的电路图案部的均一性,可以提高导电特性及利用其的电子部件的可靠性。即,不同于用于形成金属皮膜的普通光刻工序或电镀法,无电电镀法利用还原反应而使金属析出,因而可以在基材表面均一地形成金属皮膜,因而不仅可以提高制品形状的均一性,而且可以提高电子部件的稳定性。不过,为了形成均一的电路图案部,需确保金属镀金溶液的均一性,另外,为了形成氧化皮膜,防止发生凹凸,可以执行后述的激活步骤。
第二,可以通过无电电镀法而容易地调节电路图案部的厚度,可以在多样的产业群提高使用度。即,无电电镀法利用了镀金溶液内存在的物质在基材表面的氧化还原反应,因而可以调节反应温度和pH,控制还原的金属的析出速度,因而可以更容易地调节电路图案部的厚度。根据一个示例,在通过无电电镀法使镍镀金溶液镀金的情况下,在pH 4~6范围内具有最高析出速度,因而可以通过适度pH调节,调节电路图案部的厚度。不过,一般而言,pH越低,金属可以还原的镀金溶液的寿命越长,因而可以考虑析出速度和镀金溶液的寿命及电路图案部的厚度而适当地设计,使得符合目标产业群。
第三,通过无电电镀法,可以同时在大量的纳米纤维网上形成电路图案部,可以获得简化工序及节省成本的效果。即,如果供应充分量的金属离子和还原剂,则可以比使用相同的镀金溶液量的电镀进行10~30倍的处理,可以更迅速地制造大量的印刷电路纳米纤维网,可以显著有益于与此相关的工序的简化,减少废弃的材料量,在环保和节省成本方面具有优点。
第四,如上所述,无电电镀法由于浸渍于镀金溶液,利用氧化还原反应,因而不需要对如同纳米纤维网一样柔软的基材表面施加外力,具有无需特殊处理,不损伤基材表面便可以使电路图案镀金的优点。
此时,为了制造本发明的印刷电路纳米纤维网,可以执行掩蔽在纳米纤维网上除形成电路图案部的部分之外的其余面的步骤。
所述掩蔽用于只在纳米纤维网的特定部分形成电路图案部,在不影响纳米纤维网物性的范围内,公知的化学电镀用掩蔽工序可以无限制地使用。作为一个示例,将带形态的掩蔽剂粘贴于除要形成电路图案部的部分之外的纳米纤维网前面,从而可以调节电路图案部形成的位置,作为另一示例,可以利用以喷涂方式涂覆由液态硅胶构成的掩蔽剂的方法。作为又一示例,通过制作成纳米纤维网可以引入的容器形态的掩模,可以只在特定位置形成电路图案部。然后,如上所述掩蔽的纳米纤维网浸渍于后述的镀金溶液,可以只在特定部分形成电路图案部。
另一方面,所述(2)步骤可以还包括:2-1)使所述纳米纤维网浸渍于催化剂溶液而进行催化处理的步骤;2-2)使经催化处理的所述纳米纤维网激活的步骤;及2-3)使激活的所述纳米纤维网通过无电电镀法形成电路图案部的步骤。此时,在执行所述(2)步骤之前,可以还包括:使所述纳米纤维网脱脂或亲水化处理的步骤。
所述脱脂步骤是利用酸或碱性界面活性剂,处理、清洗在将形成电路图案部的纳米纤维网表面存在的氧化物或异物质特别是油脂成分等的步骤。此时,如果未通过所述脱脂步骤,清洗将形成电路图案部的纳米纤维网表面,则会因异物质或空洞现象而阻碍催化剂或激活步骤的化学反应,电路图案部的镀金无法均一地形成,即使镀金,电路图案部与纳米纤维网的粘合力非常不良,存在制品可靠性极为低下的忧虑。不过,如果脱脂步骤中使用的酸或碱性界面活性剂未完全清洗,则因此会作为对后续处理溶液(催化剂溶液或激活溶液)的污染物质进行作用,应通过适度范围的温度和压力,充分清洗所述界面活性剂。
所述亲水化步骤是在将疏水性纳米纤维网表面转换成亲水性的同时,将羧基、胺基、羟基等官能基导入纳米纤维网表面,使得金属离子容易吸附,在纳米纤维网表面形成微细孔洞,提高表面粗糙度,提高析出的金属皮膜与纳米纤维网表面的粘合力的步骤。所述亲水化步骤可以将碱金属氢氧化物或氮化合物与界面活性剂混合执行,所述氢氧化物可以使用氢氧化钠(NaOH)、氢氧化钾(KOH)等,所述氮化合物可以包括铵盐或胺化合物等。所述铵盐例如可以使用氢氧化铵、氯化铵、硫酸铵、碳酸铵或三乙基铵盐、四乙基铵盐、三甲基铵盐、四甲基铵盐、三氟铵盐、四氟铵盐等烷基或芳基被取代的铵盐等,所述胺化合物例如可以使用甲胺、乙胺、二甲胺、二乙胺、三甲胺、乙二胺、二乙烯三胺等脂肪族胺化合物,或尿素和肼衍生物等。所述界面活性剂可以使用烷基磺酸钠(SAS)、烷基硫酸酯钠(AS)、烯烃磺酸钠(AOS)、烷基苯磺酸盐(LAS)等阴离子界面活性剂、阳离子界面活性剂或中性界面活性剂等。此时,在包含所述化合物的亲水化溶液中,在20~100℃下,浸渍纳米纤维网1~20分钟,执行亲水化步骤。
而且,所述2-1)步骤是为了在经过脱脂及亲水化步骤的纳米纤维网表面使催化剂颗粒析出并容易镀金而执行催化(Catalyzing)处理的步骤。
所述催化剂溶液可以包含选自由Ti、Sn、Au、Pt、Pd、Ni、Cu、Ag、Al、Zn及Fe的盐构成的组的任意一种以上化合物,优选地,可以使用由Ti、Sn、Au、Pt、Pd、Ni、Cu、Ag、Al、Zn及Fe的盐构成的胶体溶液或贵金属络离子等。作为一个示例,所述胶体溶液可以使用每1升去离子水包含选自由盐酸50~250ml、氯化钠或氯化钾50~300g、氯化锡(SnCl2)5~60g、氯化钯(PdCl2)0.1~5g构成的组的1种以上盐的溶液。
此时,在所述2-1)执行前,为了提高所述催化剂颗粒的吸附效率,作为预备催化剂处理步骤,可以执行预浸渍(pre-dip)工序,所述预浸渍工序是在催化剂处理前,在较低温度的催化剂溶液中浸渍纳米纤维网,用于防止在催化剂处理步骤中使用的催化剂溶液被污染或浓度发生变化的处理步骤。
然后,执行激活经催化处理的所述纳米纤维网的2-2)步骤。
所述激活步骤是用于在催化步骤之后提高吸附的金属颗粒的活性度和无电式电镀溶液的析出活动的步骤。通过这种激活步骤,可以去除包围胶体颗粒的金属颗粒,使得只留下被吸附的催化剂,更容易地进行化学金属皮膜的析出。作为一个示例,所述激活工序可以是在蒸馏水及硫酸的混合溶液中浸渍30秒~5分钟时间,优选地,浸渍30秒~3分钟时间的步骤。
然后,执行在被激活的所述纳米纤维网上通过无电电镀法形成电路图案部的2-3)步骤。
所述无电电镀法一般可以分为还原镀金法和置换镀金法,还原镀金法是通过还原反应而析出金属并在基材表面镀金的方法,置换镀金法是借助于金属的还原力差异而使还原力相对较大的金属析出并镀金的方法,所述2-3)步骤可以根据本发明的一个示例而利用置换镀金法。
所述置换镀金法作为,使纳米纤维浸渍于还原力相对较小的一次镀金溶液,然后使纳米纤维网浸渍于还原力相对较强的二次镀金溶液,使二次镀金溶液的金属析出而镀金的方法,所述一次及二次镀金溶液可以包含选自由Ti、Sn、Au、Pt、Pd、Ni、Cu、Ag、Al、Zn及Fe构成的组的金属,这种置换镀金法可以在40~80℃下浸渍0.5分~10分钟时间,优选地,在45~75℃下浸渍1分~8分钟时间,从而最终可以获得铜离子镀金的印刷电路纳米纤维网。
通过所述(2)步骤而在印刷电路纳米纤维网上形成的电路图案部,被覆在纳米纤维网上预定区域内包含的纳米纤维的外部面而形成。即,如果参照图3及图4,形成有电路图案部的纳米纤维网的预定区域(A区域)的纳米纤维,不同于未形成有电路图案部的纳米纤维网的区域(B区域),可以由在纳米纤维外部面被覆有电路图案部的诸如鞘/芯形态的纳米纤维构成。
另外,所述电路图案部的厚度可以为0.1~10μm,优选地,厚度可以为0.2~3μm。如果所述电路图案部的厚度不足0.1μm,虽然有利于薄型化,但电路图案部的厚度过薄,存在通过电路图案部的电气特性的稳定性低下的忧虑,电路图案部与纳米纤维网的粘合力低下,在制品耐久性及可靠性方面会发生问题,随着印刷电路纳米纤维网孔隙度的提高,耐久性及机械物性会下降。另外,如果电路图案部的厚度超过10μm,则由于电路图案部的重量,纳米纤维网的支撑功能会低下,机械物性会低下,作为小型电子制品的用途,在轻量化及薄型化方面会不利,随着印刷电路纳米纤维网孔隙度下降,会存在伸缩性低下的问题,耐久性及工序性会低下。
另一方面,本发明一个实施例的纳米纤维网可以分别包括借助于电路图案部而形成的上部区域的第一图案和下部区域的第二图案,所述第一图案和第二图案可以以彼此相同的图案形成。此时,可以调节纳米纤维网的厚度,通过一次浸渍便可以形成相同的电路图案,具有简化工序及经济性方面的优点。另外,与此相反,第一图案部及第二图案部可以以互不相同的电路图案体现,可以考虑本发明的印刷电路纳米纤维网的目的及用途而适当选择,因而电路图案部的形状及大小不特别限制。
另一方面,所述印刷电路纳米纤维网可以取代所述(2)步骤中使用无电电镀法而通过印刷电子技法,在纳米纤维网的至少一面形成电路图案层。此时,由于只将目标电路图案部分,利用导电性电子墨水印刷于基板或薄膜等而制造,因而可以利用两个步骤的工序来印刷电路图案,可以极大有助于简化工序,电路图案形成的准确性提高,几乎没有浪费的材料,可以极大降低制造单价。
此时,所述印刷电子技法可以是本行业通常可以使用的印刷电子技法,优选地,可以以喷墨印刷(Inkjet Printing)及柔版印刷法(Flexography)中任意一种方法执行。不过,本发明中的印刷电子技法并非限定于所述提及的方法,可以包括可用作印刷电子技法的所有方法。
此时,所述喷墨印刷(Inkjet Printing)方法是从喷头吐出微细大小的导电性墨滴(以下称为液滴),碰撞目的基材而形成电路图案的方式,根据液滴吐出方式,可以分为连续吐出液滴的连续(Continuous)方式和选择性地吐出液滴的按需喷墨(Drop On Demand)方式。此时,其特征在于,连续方式一般要求大型装置,用于低分辨率的图案化(Patterning),相反,按需喷墨方式在需要高分辨率的图案化的情况下使用。
另外,所述按需喷墨(Drop On Demand)方式可以再分为利用压电元件向墨水施加压力而使液滴吐出的压电(Piezo)方式及向墨水施加热而使之瞬间产生气泡后借助于气泡的压力使液滴吐出的喷泡(Bubblejet)方式。在所述压电(Piezo)方式的情况下,由于不对墨水施加热,因而喷头寿命比较长,在墨水的选择方面没有需考虑热变性的限制,这两点比较有利,但为了高分辨率的图案化,喷头的生产费用上升,在这点上会不利。
所述柔版印刷(Flexography)方法是在具有均一网格(Grating)的网纹传墨辊(Anilox Roller)上涂覆导电墨水,通过刮墨刀片均一地展开后,使所述网纹传墨辊(Anilox Roller)与印刷辊接触,将导电墨水转写到在所述印刷辊的柔软性树脂板上阳刻的图案,从而印刷于目标基材表面的方式。
此时,所述印刷电子技法可以包括在纳米纤维网上喷射导电墨水的步骤及将喷射的导电墨水烧结而在纳米纤维网的至少一面形成电路图案层的步骤。
在所述喷射导电墨水的步骤中,所述导电墨水可以包括金、银、铜、铂、钯、镍、铝及碳粒子中至少一种以上的导电性粒子,如果考虑到导电性及耐化学性,优选金、银、铂,如果考虑到费用及后述烧结温度,银会更优选。不过,所述导电墨水中包含的导电性粒子不限定于所述提及的金属,包括可用作导电墨水材料的所有金属或非金属。例如可以包含甲酸金、甲酸银、甲酸铜、甲酸铂、甲酸钯、甲酸镍、甲酸铝、乙酸金、乙酸银、乙酸铜、乙酸铂、乙酸钯、乙酸镍、乙酸铝、草酸金、草酸银、草酸铜草酸铂、草酸钯、草酸镍、草酸铝、丙二酸金、丙二酸银、丙二酸铜、丙二酸铂、丙二酸钯、丙二酸镍、丙二酸铝、邻苯二甲酸金、邻苯二甲酸银、邻苯二甲酸铜、邻苯二甲酸铂、邻苯二甲酸钯、邻苯二甲酸镍、邻苯二甲酸铝等作为所述导电墨水的导电性粒子。此时,所述导电性粒子可以为纳米或微米尺度,根据电路图案层的物性,可以适当地选择导电性粒子的种类和导电墨水的含有比率,因而不特别限定。
另外,所述导电墨水为了所述导电性粒子的均一分散,可以还包括溶剂及粘合剂,根据目标用途及需要,可以在不对本发明效果造成影响的范围内,含有作用于印刷电子的添加剂。作为一个示例,可以例如粘度助剂、导电助剂、抗粉化(Chalking)剂,抗氧化剂、pH助剂、抗干燥剂、增粘剂、防腐剂、消泡剂、均染剂(leveling agent)、表面活性剂等,在添加粘合剂的情况下,与纳米纤维网的粘合性提高,可以诱导导电墨水的均一分散。如此追加的添加剂的组成和组成比,可以考虑电路图案层的物性而适当地选择,以便能够通过后述烧结过程而全部蒸发,形成均一的电路图案层。
另一方面,可以将所述导电墨水中包含的导电性粒子如上所述分散于溶剂(solvent)而制作,分散初期,导电性粒子以非常不稳定的状态分散,因而可以防止导电性粒子重新凝集的现象。特别是如本发明所示,在以纳米尺寸使用导电性粒子的情况下,由于这种凝集,通过印刷工序形成电路图案时,会发生电路图案层的均一性(uniformity)及导电特性变差的电气特性低下。
因此,在后述的形成电路图案层的步骤中,可以执行烧结,不特别地使用控制分散的分散剂等,可以形成均一的电路图案层。
然后,执行对喷射的导电墨水进行烧结,在纳米纤维网的至少一面形成电路图案层的步骤。
所述形成电路图案层的步骤是使导电墨水固化而形成电路图案层的步骤,作为如上所述追加的效果,是提高导电墨水的分散稳定性及均一度,形成更均一的电路图案层的步骤。
所谓烧结(sintering),意味着粉体在受到来自外部的强能量的情况下,在粉体粒子之间发生结合而凝固的现象,当是以所述金属粒子构成的导电墨水时,如果经过烧结过程,则不仅粒子彼此单纯地结合,粒子尺寸增大,变为理想的不存在空隙的薄膜形态,而且,为了提高分散稳定性,在金属颗粒表面追加包含的添加剂等物质因热分散或挥发而消失,因而可以使导电率特性最大化。
本发明一个示例的烧结处理方式可以利用烘箱(oven)或炉(furnace),对在基板上印刷的墨水执行热处理。不过,不限制于此,可以在不影响形成有电路图案层的纳米纤维网物性的范围内,执行公知的多样烧结处理方式。
另一方面,本发明的体现印刷电路纳米纤维网的制造方法可以利用无电电镀法,在柔软的纳米纤维网上,电路图案部可以形成得具有致密而均一的厚度,同时,通过具有多个气孔的纳米纤维网,满足防水性与通气性特性,因而包括生物贴片等医疗器械、智能设备等电子设备在内,可以在各种未来产业领域多样地应用。
另外,本发明如图3所示,体现一种印刷电路纳米纤维网,所述印刷电路纳米纤维网包括纳米纤维网100及电路图案部120,其中,所述纳米纤维网100包括多个纳米纤维110,电路图案部120被覆在所述纳米纤维网100上预定区域内包含的纳米纤维110的外部面而形成,所述预定区域意味着将在纳米纤维网100形成电路图案部120的区域(A)。其他对印刷电路纳米纤维网的说明与上述的制造方法(2)步骤的说明相同,因而省略。
另外,如果参照图8及图9,可以在柔软材料的纳米纤维网上,形成多样形态的电路图案部。即,本发明的印刷电路纳米纤维网不仅具有比以往柔性印刷电路板显著提高的柔韧性及复原力,而且拥有优秀的柔软性及伸缩性,因而不仅是用作最近倍受瞩目的医疗产业领域的生物贴片,还可以制作成实质上可以附着于身体任意部位的多样传感器的形态,能够提高以后在诸如物联网的与电子设备相关的多样产业领域的使用度,促进相关产业领域的发展。
另外,本发明体现包括所述印刷电路纳米纤维网及贴装于所述印刷电路纳米纤维网的至少一个以上电子部件的电子装置。
所述电子部件可以根据目标的多样产业而适当选择,作为一个示例,所述电子部件可以是包括用于测量使用者的身体状态的生物传感器与用于感知周边环境的环境感知传感器中至少一种的传感器单元、在近距离无线通信中使用的近距离通信模块、在无线通信中使用的天线图案及用于执行信号处理功能的控制单元的电子设备。
具体实施例
通过下述实施例,更具体地说明本发明,但下述实施例并非限定本发明的范围,应解释为其用于帮助理解本发明。
<实施例1>
首先,为了制备纺纱溶液,作为纤维形成成分,相对于聚偏氟乙烯100重量份,混合聚氨酯30重量份,在二甲基乙酰胺与丙酮的重量比为70:30的85g中,在80℃温度下,在6小时期间,使用磁棒使所述纤维形成成分15g溶解,制备了混合溶液。将所述纺丝溶液投入静电纺丝装置的溶液箱,按15μl/min/hole的速度吐出。此时,纺丝区间的温度保持30℃、湿度保持50%,收集器与纺丝喷嘴尖端间距离为20㎝,使用高电压发生器,向纺丝喷嘴组(SpinNozzle Pack)赋予40kV以上的电压,同时,每纺丝组喷嘴赋予0.03MPa的空气压力,制造了以PVDF/PU复合纳米纤维形成的纤维网。然后,为了使所述纤维网中残存的溶剂、水分干燥,按140℃以上的温度及1kgf/cm2施加热和压力,实施压延成型工序。此时,制造的纳米纤维网的厚度为20μm,孔隙度为55%。
然后,为了制造将形成图案的掩模,将包含硅粘性成分的PET膜沿图案模具,通过冲压工序而形成掩模。制造的PET掩模相向地附着于制造的纳米纤维网的两面,使得只有图案露出,从而准备经掩蔽的纳米纤维网。
然后,在经掩蔽的纳米纤维网上形成镍/铜的金属鞘部。具体而言,在纳米纤维网实施镍/铜无电式电镀,为此,将纳米纤维网在60℃的脱脂溶液(ATS condiclean 10%,纯水)中浸渍30秒后用纯水清洗,再在60℃的蚀刻溶液(5M NaOH,纯水)中浸渍1分钟后用纯水清洗。然后将清洗的纳米纤维网在常温的催化剂溶液(Pd 0.9%,HCl 20%,纯水)中浸渍3分钟后,用纯水洗涤。然后,将纤维网在用于提高催化剂活性的50℃的硫酸溶液(H2SO485ml/L,纯水)中浸渍30秒后,用纯水洗涤,然后将纤维网在60℃的镍离子溶液中浸渍30秒后,用纯水洗涤,将厚度0.05μm的镍金属鞘部被覆于纳米纤维网的纳米纤维的外部面。然后,在40℃的铜离子溶液中浸渍2分钟后用纯水清洗,使厚度0.15μm的铜金属鞘部被覆于形成有镍金属鞘部的纳米纤维的外部面。金属鞘部形成后,去除掩模,制造了线幅0.3cm、长度10cm的印刷电路纳米纤维网。
<实施例2~12>
与实施例1相同地实施制造,如下表1至表3所示,变更纳米纤维网的厚度、孔隙度、电路图案部的厚度及电路图案部形成方法等,制造了如表1至表3所示的印刷电路纳米纤维网。
<比较例1>
与实施例1相同地实施制造,但不是通过化学电镀而是通过电阻加热式真空蒸镀法执行溅射,使得蒸镀镍/铜,达到平均厚度0.2μm,而后进行光刻工序。利用旋涂机,将光刻胶(Photo Resist)涂覆于表面后,利用经图案化的掩模照射UV(紫外线)。然后,在显影液中浸渍30秒时间,形成图案后,通过蚀刻工序形成电路图案部,制造了线幅0.3cm、长度10cm的印刷电路纳米纤维网。
<比较例2>
与实施例1相同地实施制造,但取代纳米纤维网而使用聚酰亚胺基板制造了印刷电路板。
<实验例>
针对实施例及比较例制造的印刷电路纳米纤维网,测量下述物性,显示于表1至表3。
1.柔韧性及复原性评价
针对根据实施例及比较例制造的印刷电路纳米纤维网,利用直径30mm的不锈钢棒,进行180°折弯及复原后,测量与初始电阻比较的变动率,评价了柔韧性及复原性。
2.伸缩性评价
针对根据实施例及比较例制造的印刷电路纳米纤维网,利用夹具,将电路图案沿纵向拉伸1.2倍后,测量与初始电阻比较的变动率,评价了伸缩性。
3.耐久性评价
针对根据实施例及比较例制造的印刷电路纳米纤维网,将执行柔韧性、复原性及伸缩性评价中不发生任何问题的情形标记为○、将发生电路图案部的剥离、裂隙等任何异常的情形标识为×,评价了耐久性。
4.工序性评价
在根据实施例及比较例而制造印刷电路纳米纤维网的工序中,将没有任何异常的情形标识为○、将发生电路损伤及不均一、纤维网剥离等任何异常的情形标识为×,评价了工序性。
5.电阻测量
针对根据实施例及比较例制造的印刷电路纳米纤维网,通过电阻测量仪(日置3540mΩHITESTER,日置公司)测量了印刷电路表面的电阻。
【表1】
Figure GDA0002238559950000161
Figure GDA0002238559950000171
【表2】
Figure GDA0002238559950000172
【表3】
Figure GDA0002238559950000173
Figure GDA0002238559950000181
正如从所述表1至3可知的,全部满足本发明的纳米纤维网的厚度、孔隙度、电路图案部的厚度及电路图案部形成方法等的实施例1、3、4、7、8及11,与其中落掉一项的实施例2、5、6、9、10、12及比较例1~2相比,柔韧性、复原性、伸缩性、耐久性及工序性优秀,同时,满足可以用作电路的电阻的最小值,且表现出显著较低的电阻值。
以上对本发明的一个实施例进行了说明,但本发明的思想不限定于本说明中提示的实施例,理解本发明思想的从业人员可以在相同的思想范围内,借助于构成要素的附加、变更、删除、追加等,容易地提出其他实施例,这也属于本发明的思想范围内。

Claims (14)

1.一种印刷电路纳米纤维网的制造方法,其中,包括:
(1)将包含纤维形成成分的纺纱溶液进行静电纺丝而制造包括多个纳米纤维的纳米纤维网的步骤;及
(2)通过无电电镀法,以被覆所述纳米纤维网上预定区域内包含的多个纳米纤维的外部面的方式形成电路图案部的步骤;其中
所述(2)步骤是掩蔽除A区域之外的B区域并浸于镀金溶液,其中,所述A区域是要在所述纳米纤维网上形成所述电路图案部的区域,从而在所述A区域包含的多个纳米纤维的外部面形成金属皮膜,所述B区域的纳米纤维的外部面不被覆,在所述纳米纤维网上的所述A区域形成以既定图案形成的所述电路图案部,以使所述纳米纤维网的所述B区域成为印刷电路板的基材的步骤,是以纳米纤维网为基材,制造将被覆金属皮膜的纳米纤维作为电路图案部的印刷电路纳米纤维网的步骤,
所述(2)步骤包括:
2-1)使所述纳米纤维网浸渍于催化剂溶液而进行催化剂化处理以使催化剂粒子在纳米纤维网表面析出的步骤;
2-2)使经催化剂化处理的所述纳米纤维网沉积于激活溶液以激活的步骤;及
2-3)使激活的所述纳米纤维网通过无电电镀法形成电路图案部的步骤。
2.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
所述纳米纤维网的厚度为5~200μm。
3.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
所述纳米纤维网的孔隙度为10~80%。
4.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
被覆于所述纳米纤维的电路图案部的厚度为0.1~10μm。
5.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
所述纳米纤维网的厚度为10~150μm及孔隙度为30~60%,
被覆于所述纳米纤维的电路图案部的厚度为0.1~3μm。
6.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
在执行所述(2)步骤之前,还包括:
使所述纳米纤维网脱脂或亲水化处理的步骤。
7.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
所述催化剂溶液包含选自由Ti、Sn、Au、Pt、Pd、Ni、Cu、Ag、Al、Zn及Fe的盐构成的组的任意一种以上化合物。
8.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
所述2-2)步骤是在硫酸溶液中浸渍、激活的步骤。
9.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
所述镀金溶液包含选自由Ti、Sn、Au、Pt、Pd、Ni、Cu、Ag、Al、Zn及Fe构成的组的金属。
10.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
所述印刷电路纳米纤维网分别包括借助于电路图案部而形成的上部区域的第一图案和下部区域的第二图案,
所述第一图案和第二图案以彼此相同的图案形成。
11.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
印刷电路纳米纤维网在与印刷了电路图案部的纳米纤维网一面相向的面还具备强度加强用支撑体。
12.根据权利要求1所述的印刷电路纳米纤维网的制造方法,其中,
所述纤维形成成分包括选自由聚氨酯(polyurethane)、聚苯乙烯(polystyrene)、聚乙烯醇(polyvinylalcohol)、聚甲基丙烯酸甲酯(polymethyl methacrylate)、聚乳酸(polylactic acid)、聚氧化乙烯(polyethyleneoxide)、聚醋酸乙烯酯(polyvinylacetate)、聚丙烯酸(polyacrylic acid)、聚己酸内酯(polycaprolactone)、聚丙烯腈(polyacrylonitrile)、聚乙烯吡咯烷酮(polyvinylpyrrolidone)、聚氯乙烯(polyvinylchloride)、聚碳酸酯(polycarbonate)、聚醚酰亚胺(polyetherimide)、聚醚砜(polyesthersulfone)、聚苯并咪唑(polybenzimidazole)、聚对苯二甲酸乙二醇酯(polyethylene terephthalate)、聚对苯二甲酸丁二醇酯(polybutylene terephthalate)及氟类化合物构成的组的一种以上化合物。
13.一种印刷电路纳米纤维网,包括:
纳米纤维网,其包括多个纳米纤维;及
电路图案部,其被覆在所述纳米纤维网上预定区域内包含的纳米纤维的外部面而形成;其中
所述纳米纤维网包括A区域和B区域,所述A区域和B区域分别包括多个纳米纤维,
所述A区域包括的多个纳米纤维的外部面用金属皮膜被覆,所述B区域包括的多个纳米纤维的外部面不被覆,
所述A区域包括的用所述金属皮膜被覆的多个纳米纤维以既定图案形成,在所述纳米纤维网上形成所述电路图案部,所述B区域包括的所述金属皮膜不被覆的多个纳米纤维成为印刷电路板的基材,所述印刷电路板的基材为纳米纤维网,所述电路图案部为被覆金属皮膜的纳米纤维,
所述电路图案部是使所述纳米纤维网浸渍于催化剂溶液进行催化剂化处理以使催化剂粒子在纳米纤维网表面析出后,使经催化剂化处理的所述纳米纤维网沉积于激活溶液以激活,并在激活的所述纳米纤维网上执行无电电镀法而形成。
14.一种电子装置,其中,包括:
权利要求13所述的印刷电路纳米纤维网;及
贴装于所述印刷电路纳米纤维网的至少一个以上的电子部件。
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