CN110536508A - A kind of three-primary color LED lamp group array arrangement circuit board - Google Patents
A kind of three-primary color LED lamp group array arrangement circuit board Download PDFInfo
- Publication number
- CN110536508A CN110536508A CN201910698465.1A CN201910698465A CN110536508A CN 110536508 A CN110536508 A CN 110536508A CN 201910698465 A CN201910698465 A CN 201910698465A CN 110536508 A CN110536508 A CN 110536508A
- Authority
- CN
- China
- Prior art keywords
- circuit
- band
- circuit band
- groups
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims abstract description 3
- 235000012431 wafers Nutrition 0.000 claims description 31
- 229910052594 sapphire Inorganic materials 0.000 claims description 23
- 239000010980 sapphire Substances 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 230000007704 transition Effects 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 241001062009 Indigofera Species 0.000 claims description 4
- 210000004209 hair Anatomy 0.000 claims description 4
- 238000005485 electric heating Methods 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 3
- 239000003086 colorant Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 238000003491 array Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000005976 Citrus sinensis Nutrition 0.000 description 1
- 240000002319 Citrus sinensis Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention discloses a kind of three-primary color LED lamp group array arrangement circuit board, including at least two groups of circuit band groups, every circuit band group includes three circuit bands for corresponding installation for three-color light-emitting chip respectively arranged side by side in parallel, respectively the first circuit band, second circuit band and tertiary circuit band are each formed with several on every circuit band for the welding position of luminescent wafer welding；First circuit band of all circuit band groups, second circuit band and tertiary circuit band is respectively parallel with one another connects.This case breaks through the prior art at one stroke can change the small limitation in design space, not only expand lamp power can scope of design, and array of source arrangement shape conversion design is very flexible, particularly ideally solves the technical problem for the relatively powerful quadrate array arrangement light source that the prior art is unable to get.
Description
Technical field
The present invention relates to LED lamp fields, in particular to a kind of three-primary color LED lamp group array to arrange circuit board.
Background technique
In the solution of LED lamplight, need for the luminescent wafer of RGB three primary colours to be laid out in one piece of whole plate, and root
According to the current demand that shines, such as green light luminous flux: feux rouges luminous flux: blue light luminous flux is the relationship of 6:3:1 to be laid out, In
Under the control of control system, the light of all kinds of colors can be formed, meets required lighting effects.Due to three kinds of color chips
Power is different, and red wafer, green wafer and blue light chip needs are connected with external power supply respectively, so in the prior art
Conventional layout style, using three primary colours uniform array and every primary colours are arranged in two column upside-down mounting tandems, i.e., are set as 6 altogether
Column, sequentially respectively red wafer, green wafer, blue light chip, upside-down mounting red wafer, upside-down mounting green wafer and upside-down mounting blue light are brilliant
Piece, wherein red wafer and red wafer, green wafer and upside-down mounting green wafer and blue light chip and upside-down mounting blue light chip,
Respectively series connection and respective external power supply.
There are significant limitations for the existing conventional layout style, in practical applications almost without alterable design
Space, for example under the 48V electric supply system electric power thus supplied sought unity of standard at present, every primary colours sequential circuit is series connected to shine
Chip number is limited, arranges along with three primary colours are limited in 6 column uniform arrays, in this way, not only limiting lamp power in design
It does not increase, and the flexible transformation design of limiting light source array arrangement shape, such as wants the relatively powerful square of design
Array arrangement light source, routine techniques can not be accomplished at present.
In view of this, the applicant furthers investigate regarding to the issue above, there is this case generation then.
Summary of the invention
The purpose of the present invention is to provide a kind of three-primary color LED lamp group arrays to arrange circuit board, and it is variable to break through the prior art
Change the small limitation in design space, not only expand lamp power can scope of design, but also array of source arrangement shape conversion is set
Meter is very flexible, solves to remarkable especially the relatively powerful quadrate array arrangement light source that the prior art is unable to get
Technical problem.
In order to achieve the above objectives, solution of the invention is:
A kind of three-primary color LED lamp group array arrangement circuit board, including at least two groups of circuit band groups, every circuit band group include flat
Three circuit bands for corresponding installation for three-color light-emitting chip respectively that row is arranged side by side, respectively the first circuit band, the
Two circuit bands and tertiary circuit band are each formed with several on every circuit band for the welding position of luminescent wafer welding；All electricity
First circuit band of road band group, second circuit band and tertiary circuit band is respectively parallel with one another connects.
The circuit band group is equipped with three groups, corresponding three first circuit bands, three second circuit bands and three tertiary circuits
Band is respectively parallel with one another to be connect.
The circuit board is equipped with three groups of circuit band groups, the parallel nine circuit bands side by side of composition, corresponding three first electricity
Road band, three second circuit bands and three tertiary circuit bands are respectively parallel with one another connects, every circuit band is equipped with nine welding positions；
Make totally 81 crystalline substances that shine that 9 and 9 series windings connect with 27 red wafers, 27 green wafers and 27 blue light chips on circuit board
Piece.
81 luminescent wafers are 81 blue light flip chips, are divided into three groups；Wherein one group of 27 blue light upside-down mounting is brilliant
Piece, location interval is equipped with sapphire fluorophor immediately ahead of its light direction, which includes burning on sapphire
Glass powder and green emitting phosphor are tied, the green emitting phosphor and glass powder sintering are formed in where sapphire correspondence back to illuminator
On the surface of side；Further 27 blue light flip chips of group, location interval is equipped with sapphire fluorescence immediately ahead of its light direction
Body, the sapphire fluorophor include that sintered glass powder and red fluorescence powder, the red fluorescence powder and glass powder are burnt on sapphire
Knot is formed in sapphire correspondence back on the surface of illuminator side.
The blue light flip chip has conductive and heat-conductive positive plate, conductive and heat-conductive negative plate, insulator and LED brilliant pearl；Absolutely
Edge body is between conductive and heat-conductive positive plate and conductive and heat-conductive negative plate, the anode drop of conductive and heat-conductive positive plate and LED brilliant pearl
It is connected, which is connected with the cathode electric heating of LED brilliant pearl.
81 blue light flip chips are peripherally installed with thermal coefficient in the high thermal conductivity ring of 8w/mk or more.
81 blue light flip chips appoint the gap between adjacent two plates to fill out high reflectivity white silica gel.
The luminescent wafer uses 45*45mil high-power chip, and 9 and 9 strings form quadrate array arrangement light source.
Respectively the first circuit band, second circuit band and the tertiary circuit band parallel with one another connect, is made using 0 Ohmic resistance
Cross-line connection.
The circuit board is equipped with three groups of circuit band groups, and circuit band group is routed with symmetrical two groups of parallel connection cross-lines, this is simultaneously
Connection cross-line wire laying mode is that three first circuit bands have one-to-one three the first connecting wires, this three first connections
Conducting wire is direct and couples；Three second circuit bands have one-to-one three the second connecting wires, this three second connections are led
Line is directly staggered one by one with three the first connecting wires, and 0 Ohmic resistance is used between adjacent two the second connecting wires
Make to connect across the cross-line of the first connecting wire；Three tertiary circuit bands have one-to-one three third connecting wires, appoint
There is the first connecting wire and the second connecting wire directly next to setting, in this close to setting between adjacent two third connecting wires
Be equipped with bridging transition wire between the first connecting wire and the second connecting wire set, every bridging transition wire and its two sides it is adjoining the
Three connecting wires are made to connect across the cross-line of the first connecting wire or the second connecting wire using 0 Ohmic resistance.
After adopting the above scheme, a kind of three-primary color LED lamp group array of the present invention arranges circuit board, has abandoned tradition completely
Using the design concept of positive and negative opposed alignment series connection, using the positive and negative design concept for being collectively aligned and coupling, in this way, identical
Powersupply system and using under the premise of existing LED wafer, the setting group number of this case circuit band group, each electricity of every circuit band group
The digit for the welding position that road takes may be implemented effectively to extend compared with prior art, and it is alterable to break through the prior art at one stroke
The small limitation in design space, not only expand lamp power can scope of design, but also array of source arrangement shape conversion design
Very flexibly, the relatively powerful quadrate array arrangement light source that the prior art is unable to get particularly ideally is solved
Technical problem.
Detailed description of the invention
Fig. 1 is the circuit layout of three-primary color LED lamp group array arrangement circuit board of the present invention；
Fig. 2 is the structural schematic diagram of circuit band group part in Fig. 1；
Fig. 3 is the implementation example figure that three-primary color LED lamp group array arranges on circuit board of the present invention；
Fig. 4 is the structural schematic diagram of luminescent wafer of the present invention.
Label declaration
Circuit band group 1,
First circuit band 11, the first connecting wire 111,
Second circuit band 12, the second connecting wire 121,
Tertiary circuit band 13, third connecting wire 131, bridging transition wire 132.
Specific embodiment
This case is described in further detail With reference to embodiment.
This case is related to a kind of three-primary color LED lamp group array arrangement circuit board, as shown in Figs 1-4, including at least two groups of circuits
Band group 1, every circuit band group include three circuit bands, respectively the first circuit band 11, second circuit band 12 and tertiary circuit band 13；
Three appropriate spacing of circuit band are arranged side by side in parallel, correspond install for three-color light-emitting chip (R, G, B) respectively.Every electricity
Road, which takes, is each formed with several for the welding position P of luminescent wafer welding.First circuit band 11, second of all circuit band groups 1
Circuit band 12 and tertiary circuit band 13 are respectively parallel with one another to be connect.
In this way, a kind of three-primary color LED lamp group array of this case arranges circuit board, abandon completely conventionally employed positive and negative opposite
The design concept for arranging series connection, using the positive and negative design concept for being collectively aligned and coupling, in identical powersupply system and
Under the premise of existing LED wafer, the available extension of the setting group number of this case circuit band group 1 (is set) by 3 multiple expansion, every electricity
The digit of welding position P on each circuit band of road band group can also carry out reasonable extensions, and (theoretical maximum can extend to existing 2
Times), breaking through the prior art at one stroke can change the small limitation in design space, not only expand lamp power can scope of design, and
And array of source arrangement shape conversion design is very flexible.This case three-primary color LED lamp group array arranges circuit board connection PWM control
Device realizes RGB circuit control based on PWM, can design 1024 color ranges and modulate to obtain the purple full-color light effect of white of the yellowish green ultramarine of blood orange.
The circuit band group 1 has at least two groups, and a preferred embodiment is equipped with three groups, then corresponds to three first circuit bands
11, three second circuit bands 12 and three tertiary circuit bands 13 are respectively parallel with one another connects.Certain circuit band group 1 is according to actual design
Demand can extend to four groups, five groups etc..Further more, at least two groups of circuit band groups 1 are constituted altogether 3n (n >=2) circuit band,
The 3n circuit band is arranged in parallel, and putting in order can be that can be also symmetrically arranged with sequence repeated arrangement with positive-negative sequence.It is repeated with sequence
Arrangement refers to that each circuit tape sort of circuit band group 1 is identical, and for lifting three groups of circuit band groups 1,3*3 bars of circuit band is according to the first/the
Two/tertiary circuit band-first/second/tertiary circuit band-first/second/such repeated arrangement of tertiary circuit band, corresponding 3n item
Putting in order for three-color light-emitting chip can be R/G/B-R/G/B-R/G/B on circuit band.Positive-negative sequence symmetric arrays refer to adjacent
Two circuit band groups 1 make positive-negative sequence balanced sorting, and for lifting three groups of circuit band groups 1,3*3 circuit band is according to first/second/third
Circuit band-third/the second/the first circuit band-first/second/tertiary circuit band is so symmetrically arranged, on corresponding 3n circuit band
Putting in order for three-color light-emitting chip can be R/G/B-B/G/R-R/G/B.
If Fig. 1 provides a specific embodiment, circuit board is equipped with three groups of circuit band groups 1, parallel nine electricity side by side of composition
Road band, corresponding three first circuit bands, 11, three second circuit bands 12 and three tertiary circuit bands 13 are respectively parallel with one another connects, often
Nine welding position P are equipped on bar circuit band.Have on circuit board and makees totally 81 luminescent wafers that 9 and 9 series windings connect, this 81 hairs
Light chip respectively corresponds as 27 red wafers, 27 green wafers and 27 blue light chips, and 27 red wafers are respectively welded
On 27 welding position P of three first circuit bands 11, similarly, 27 green wafers are respectively welded at three second circuit bands 12
27 welding position P on, 27 red wafers are respectively welded on 27 welding position P of three tertiary circuit bands 13.The hair
Light chip can choose different capacity Dimension Types, and in embodiment, using 45*45mil high-power chip, thus 9 and 9 strings are formed
Relatively powerful quadrate array arrangement light source.
Preferred embodiment, 81 luminescent wafers are 81 blue light flip chips, are divided into three groups；Wherein one group of 27 indigo plant
Light flip chip, location interval is equipped with sapphire fluorophor immediately ahead of its light direction, which is included in indigo plant
Sintered glass powder and green emitting phosphor on jewel, the green emitting phosphor and glass powder sintering are formed in sapphire correspondence back to hair
On the surface of body of light side.The sapphire fluorophor 25 of composition is equivalent to including sapphire glass 251 and green emitting phosphor
252 double-layer structures, it is required photochromic out to be formed that blue light flip chip excites green emitting phosphor.The 27 blue light upside-down mountings of another group are brilliant
Piece, location interval is equipped with sapphire fluorophor immediately ahead of its light direction, which includes burning on sapphire
Glass powder and red fluorescence powder are tied, the red fluorescence powder and glass powder sintering are formed in where sapphire correspondence back to illuminator
On the surface of side.Similarly, the sapphire fluorophor of composition is equivalent to including sapphire glass and red fluorescence powder double-layer structure,
Blue light flip chip excitated red fluorescent powder is required photochromic out to be formed.
Preferred embodiment, the blue light flip chip have conductive and heat-conductive positive plate 21, conductive and heat-conductive negative plate 22, insulator
23 and LED brilliant pearl 24；Insulator 23 is between conductive and heat-conductive positive plate 21 and conductive and heat-conductive negative plate 22, conductive and heat-conductive anode
Plate 21 is connected with the anode drop of LED brilliant pearl 24, which is connected with the cathode electric heating of LED brilliant pearl 24.LED
Brilliant pearl 24 has illuminator 241, anode strip 242 and cathode sheets 243, and anode strip 242 is sticked on conductive and heat-conductive positive plate 21, should
Cathode 243 is sticked on conductive and heat-conductive negative plate 22, and anode strip 242 and cathode sheets 242 are connected with illuminator 241 respectively.In this way,
The anode and cathode of LED brilliant pearl 24 is attached on conductive and heat-conductive positive plate 21 and conductive and heat-conductive negative plate 22 completely respectively, mutually
The contact surface of attaching can be designed to that the plate of opposite large area contacts, and so enable LED wafer 2 itself overall thermal conductivity very
It is excellent.
Preferred embodiment, 81 blue light flip chips are peripherally installed with thermal coefficient in the high thermal conductivity of 8w/mk or more
Ring 26 brings the heat conduction and heat radiation effect that chip is all good.
Preferred embodiment, 81 blue light flip chips appoint the gap between adjacent two plates to fill out high reflectivity white silicon
Glue, in the reflection utilization rate that this promotes light.
Preferred embodiment, respectively the first circuit band 11, second circuit band 12 and the tertiary circuit band 13 parallel with one another connect,
Cross-line connection is made using 0 Ohmic resistance.Such as Fig. 1, circuit board is equipped with three groups of circuit band groups 1, and the two of corresponding circuits band group 1 are in parallel
End has the wiring of symmetrically arranged two groups of parallel connection cross-lines.Every group of parallel connection cross-line wire laying mode are as follows:
1. three first circuit bands 11 have one-to-one three the first connecting wires 111, this three first connections are led
Line 111 is direct and couples；It is connected to keep wiring succinct and be conducive to cross-line, in three the first connecting wires 111, three first companies
Connecing conducting wire 111, to make L-type bending mutually nested and be set in distance, and union end it is corresponding it is outer draw setting and constitute have the first circuit band 11
Power solder end (R+, R-) 112.
2. three second circuit bands 12 have one-to-one three the second connecting wires 121, this three second connections are led
Line 121 is directly staggered one by one with three the first connecting wires 111, thus by between adjacent two article of second connecting wire 121
One connecting wire 111 separates, and makees to connect across the cross-line of the first connecting wire using 0 Ohmic resistance herein, and union end is corresponding
Draw setting outside and constitutes the power solder end (G+, G-) 122 for having second circuit band 12；It is described to be staggered one by one, three second companies
It connects conducting wire 121 and is extended with L-type bending is made, the correspondence lateral part after bending is formed to be staggered one by one.
3. three tertiary circuit bands 13 have one-to-one three third connecting wires 131, adjacent two thirds is appointed to connect
Connect the first connecting wire 111 and the second connecting wire 121 having between conducting wire 131 directly next to setting；It is disposed proximate in this
Bridging transition wire 132, every bridging transition wire 132 and its two sides phase are equipped between first connecting wire 111 and the second connecting wire 121
Made using 0 Ohmic resistance across the first connecting wire 111 or the second connecting wire 121 between neighbouring third connecting wire 131
Cross-line connection.And the corresponding outer power solder end (B+, B-) 133 drawn setting composition and have tertiary circuit band 12 of union end.
The above description is only a preferred embodiment of the present invention, all equivalent changes done with scope of the invention as claimed and
Modification, should belong to the range of the claims in the present invention.
Claims (10)
1. a kind of three-primary color LED lamp group array arranges circuit board, it is characterised in that: including at least two groups of circuit band groups, every circuit
It include three circuit bands for corresponding installation for three-color light-emitting chip respectively arranged side by side in parallel with group, respectively first
Circuit band, second circuit band and tertiary circuit band are each formed with several on every circuit band for the welding of luminescent wafer welding
Position；First circuit band of all circuit band groups, second circuit band and tertiary circuit band is respectively parallel with one another connects.
2. a kind of three-primary color LED lamp group array as described in claim 1 arranges circuit board, it is characterised in that: the circuit band
Group is equipped with three groups, corresponding three first circuit bands, three second circuit bands and three tertiary circuit bands are respectively parallel with one another connects.
3. a kind of three-primary color LED lamp group array as described in claim 1 arranges circuit board, it is characterised in that: the circuit board
It is equipped with three groups of circuit band groups, the parallel nine circuit bands side by side of composition, corresponding three first circuit bands, three second circuit bands
And three tertiary circuit bands are respectively parallel with one another connects, every circuit band is equipped with nine welding positions；It is red with 27 on circuit board
Light chip, 27 green wafers and 27 blue light chips make totally 81 luminescent wafers that 9 and 9 series windings connect.
4. a kind of three-primary color LED lamp group array as claimed in claim 3 arranges circuit board, it is characterised in that: the luminous crystalline substance
Piece uses 45*45mil high-power chip, and 9 and 9 strings form quadrate array arrangement light source.
5. a kind of three-primary color LED lamp group array as claimed in claim 3 arranges circuit board, it is characterised in that: 81 hairs
Light chip is 81 blue light flip chips, is divided into three groups；Wherein one group of 27 blue light flip chip, in its light direction just before
Orientation, which is set, is equipped at intervals with sapphire fluorophor, which includes sintered glass powder and green fluorescence on sapphire
Powder, the green emitting phosphor and glass powder sintering are formed in sapphire correspondence back on the surface of illuminator side；Further
27 blue light flip chips of group, location interval is equipped with sapphire fluorophor, the sapphire fluorophor immediately ahead of its light direction
Including sintered glass powder and red fluorescence powder on sapphire, it is sapphire right that the red fluorescence powder and glass powder sintering are formed in
It should be back on the surface of illuminator side.
6. a kind of three-primary color LED lamp group array as claimed in claim 5 arranges circuit board, it is characterised in that: the blue light falls
Filling chip has conductive and heat-conductive positive plate, conductive and heat-conductive negative plate, insulator and LED brilliant pearl；Insulator is being located at conductive and heat-conductive just
Between pole plate and conductive and heat-conductive negative plate, conductive and heat-conductive positive plate is connected with the anode drop of LED brilliant pearl, the conductive and heat-conductive cathode
Plate is connected with the cathode electric heating of LED brilliant pearl.
7. a kind of three-primary color LED lamp group array as claimed in claim 5 arranges circuit board, it is characterised in that: 81 indigo plant
Light flip chip is peripherally installed with thermal coefficient in the high thermal conductivity ring of 8w/mk or more.
8. a kind of three-primary color LED lamp group array as claimed in claim 5 arranges circuit board, it is characterised in that: 81 indigo plant
Light flip chip appoints the gap between adjacent two plates to fill out high reflectivity white silica gel.
9. a kind of three-primary color LED lamp group array as described in claim 1 arranges circuit board, it is characterised in that: the respective phase
The first circuit band, second circuit band and tertiary circuit band mutual and couple, make cross-line connection using 0 Ohmic resistance.
10. a kind of three-primary color LED lamp group array as described in claim 1 arranges circuit board, it is characterised in that: the circuit board
Three groups of circuit band groups are equipped with, circuit band group is routed with symmetrical two groups of parallel connection cross-lines, which is three
Item the first circuit band has one-to-one three the first connecting wires, and three first connecting wires are direct and couple；Three
Second circuit band has one-to-one three the second connecting wires, three second connecting wires and three the first connecting wires
It is directly staggered, and is made using 0 Ohmic resistance across the first connecting wire between adjacent two the second connecting wires one by one
Cross-line connection；Three tertiary circuit bands have one-to-one three third connecting wires, appoint adjacent two third connecting wires
Between there is the first connecting wire and the second connecting wire directly next to setting, in first connecting wire being disposed proximate to and the
Bridging transition wire is equipped between two connecting wires, every bridging transition wire and the adjoining third connecting wire in its two sides use 0 ohm
Resistance is made to connect across the cross-line of the first connecting wire or the second connecting wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910698465.1A CN110536508A (en) | 2019-07-31 | 2019-07-31 | A kind of three-primary color LED lamp group array arrangement circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910698465.1A CN110536508A (en) | 2019-07-31 | 2019-07-31 | A kind of three-primary color LED lamp group array arrangement circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110536508A true CN110536508A (en) | 2019-12-03 |
Family
ID=68662032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910698465.1A Pending CN110536508A (en) | 2019-07-31 | 2019-07-31 | A kind of three-primary color LED lamp group array arrangement circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110536508A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005079171A (en) * | 2003-08-28 | 2005-03-24 | Kyocera Corp | SAPPHIRE SUBSTRATE FOR SEMICONDUCTOR ELEMENT, ITS MANUFACTURING METHOD, GaN SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND GaN SEMICONDUCTOR WHITE EMITTING LIGHT ELEMENT |
| JP2009071227A (en) * | 2007-09-18 | 2009-04-02 | Panasonic Corp | Led module |
| CN202352674U (en) * | 2011-11-10 | 2012-07-25 | 江苏爱科新能源科技有限公司 | Light-emitting diode (LED) substrate with U-shaped return circuit |
| CN104428582A (en) * | 2012-07-13 | 2015-03-18 | 夏普株式会社 | Light-emitting device |
| CN105387355A (en) * | 2015-12-10 | 2016-03-09 | 山东晶泰星光电科技有限公司 | Parallel-connection type light emitting diode (LED) illuminants and LED illuminating lamp |
| US20160131313A1 (en) * | 2014-11-11 | 2016-05-12 | Toyoda Gosei Co., Ltd. | Light emitting device |
| JP2018029177A (en) * | 2016-08-12 | 2018-02-22 | 四国計測工業株式会社 | Multicolor led illumination device and illumination apparatus |
| WO2018126421A1 (en) * | 2017-01-05 | 2018-07-12 | 格瑞电子（厦门）有限公司 | Positive-negative-separated led component, automobile lamp and flashlight |
| CN109841720A (en) * | 2018-12-12 | 2019-06-04 | 华中科技大学鄂州工业技术研究院 | A kind of white light LEDs preparation method and white light LED part |
| CN210491272U (en) * | 2019-07-31 | 2020-05-08 | 格瑞电子（厦门）有限公司 | Array arrangement circuit board for three-primary-color LED lamp set |
-
2019
- 2019-07-31 CN CN201910698465.1A patent/CN110536508A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005079171A (en) * | 2003-08-28 | 2005-03-24 | Kyocera Corp | SAPPHIRE SUBSTRATE FOR SEMICONDUCTOR ELEMENT, ITS MANUFACTURING METHOD, GaN SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND GaN SEMICONDUCTOR WHITE EMITTING LIGHT ELEMENT |
| JP2009071227A (en) * | 2007-09-18 | 2009-04-02 | Panasonic Corp | Led module |
| CN202352674U (en) * | 2011-11-10 | 2012-07-25 | 江苏爱科新能源科技有限公司 | Light-emitting diode (LED) substrate with U-shaped return circuit |
| CN104428582A (en) * | 2012-07-13 | 2015-03-18 | 夏普株式会社 | Light-emitting device |
| US20160131313A1 (en) * | 2014-11-11 | 2016-05-12 | Toyoda Gosei Co., Ltd. | Light emitting device |
| CN105387355A (en) * | 2015-12-10 | 2016-03-09 | 山东晶泰星光电科技有限公司 | Parallel-connection type light emitting diode (LED) illuminants and LED illuminating lamp |
| JP2018029177A (en) * | 2016-08-12 | 2018-02-22 | 四国計測工業株式会社 | Multicolor led illumination device and illumination apparatus |
| WO2018126421A1 (en) * | 2017-01-05 | 2018-07-12 | 格瑞电子（厦门）有限公司 | Positive-negative-separated led component, automobile lamp and flashlight |
| CN109841720A (en) * | 2018-12-12 | 2019-06-04 | 华中科技大学鄂州工业技术研究院 | A kind of white light LEDs preparation method and white light LED part |
| CN210491272U (en) * | 2019-07-31 | 2020-05-08 | 格瑞电子（厦门）有限公司 | Array arrangement circuit board for three-primary-color LED lamp set |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101886759B (en) | Light emitting device using alternating current and manufacturing method thereof | |
| CN103270614A (en) | Light emitting devices and methods | |
| CN103189981A (en) | High density multi-chip LED devices | |
| CN100573934C (en) | The light source that is used for image-generating unit | |
| CN100508204C (en) | AC light emitting apparatus and preparation method thereof | |
| CN208970508U (en) | Luminescent device and LED display | |
| CN105789195A (en) | 360-degree light emitting LED device and 360-degree light emitting LED light source | |
| CN105805616A (en) | LED area light source modules capable of being spliced in array | |
| CN203868993U (en) | Extending type LED lamp with heat dissipation structure | |
| CN105627125A (en) | Large-chip LED lamp filament and large-chip LED lamp filament bulb | |
| CN113921688A (en) | Novel colorful LED light source | |
| CN102759024B (en) | LED (Light Emitting Diode) light source and manufacturing method thereof | |
| CN101982883A (en) | Luminescent device formed by inverted luminous cell array and manufacture method thereof | |
| CN106195659B (en) | COB light source, integrated module and lamp | |
| CN110536508A (en) | A kind of three-primary color LED lamp group array arrangement circuit board | |
| CN210491272U (en) | Array arrangement circuit board for three-primary-color LED lamp set | |
| CN216698417U (en) | Novel colorful LED light source | |
| CN202327686U (en) | Light-emitting diode (LED) light source | |
| CN217134401U (en) | Double-colored COB light source | |
| CN205956829U (en) | Optoelectronic integration COB light source | |
| CN101308841B (en) | Semiconductor light emitting diode | |
| CN114783314A (en) | LED light-emitting module | |
| CN201680214U (en) | Light-emitting device using alternating current | |
| CN208951719U (en) | A kind of light emitting device and light-emitting component | |
| CN205678478U (en) | A kind of can array splicing LED area light source module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |