CN110535373A - A kind of thermoelectric generator - Google Patents
A kind of thermoelectric generator Download PDFInfo
- Publication number
- CN110535373A CN110535373A CN201910912741.XA CN201910912741A CN110535373A CN 110535373 A CN110535373 A CN 110535373A CN 201910912741 A CN201910912741 A CN 201910912741A CN 110535373 A CN110535373 A CN 110535373A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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Abstract
The present disclosure discloses a kind of thermoelectric generators, including hot end module, cooling end module and module connecting line；The hot end module includes n to thermocouple micromodule, and the cooling end module includes n to thermocouple assembly, and m passes through module connecting line to N-type semiconductor microcomponent in thermocouple micromodule and P-type semiconductor microcomponent respectively and is correspondingly connected with cooling end module；M connect N-type semiconductor element in thermocouple assembly with m+1 to P-type semiconductor element in thermocouple assembly in cooling end module, and m+1 connect P-type semiconductor element in thermocouple assembly with m+1 to P-type semiconductor microcomponent in thermocouple micromodule；The head end of first P-type semiconductor element and the end of the last one N-type semiconductor element are connect by output line with outside energy storage device.The thermoelectric generator hot end is highly integrated, and more semiconductor microactuator elements can be arranged in limited heating surface (area) (HS, and generating efficiency is higher, and is not limited by Conventional thermoelectric arm lengths and sectional area ratio.
Description
Technical field
This disclosure relates to thermo-electric generation field, and in particular to a kind of thermoelectric generator.
Background technique
Only there is provided background technical informations relevant to the disclosure for the statement of this part, it is not necessary to so constitute first skill
Art.
Thermoelectric generator is a kind of static power generating device based on thermoelectric material Seebeck effect, has structure simple, body
The features such as product is small, and the service life is long, movement-less part, noiseless.However, limit of the existing thermoelectric generator because of material property and structure
It is not high to guide pyrogenicity photoelectric transformation efficiency, becomes a serious short slab of the thermoelectric generator compared with other generation modes.It is restricting
In many factors of thermoelectric generator efficiency, people's more attention is the research of semiconductor material at present, such as in semiconductor
Micro other elements etc. are adulterated in material, this mode has been demonstrated have the semiconductor heat photoelectric transformation efficiency that has a certain upgrade
Effect, but the amplitude promoted has been similarly subjected to limitation, is difficult to huge breakthrough occur in a short time.Meanwhile the existing temperature difference
Electric organ because it is higher using temperature, some thermoelectricity capabilities it is good but can not be resistant to the material of high temperature receive in use it is very big
Limitation, also results in the thermoelectric conversion efficiency under worst hot case and is difficult further to be promoted.
Summary of the invention
To solve the above-mentioned problems, the present disclosure proposes a kind of thermoelectric generators, with heating end is highly integrated, can be used for
Worst hot case, hot and cold side separation, generating efficiency is higher, arranges the advantages that easy to use.
To achieve the goals above, the disclosure adopts the following technical scheme that
The disclosure provides a kind of thermoelectric generator, including hot end module, cooling end module and module connecting line；
The hot end module includes n to thermocouple micromodule, and the cooling end module includes n to thermocouple assembly,
1 pair of thermocouple micromodule includes 1 N-type semiconductor microcomponent and 1 P-type semiconductor microcomponent, and m is to thermocouple
N-type semiconductor microcomponent and P-type semiconductor microcomponent pass through in module connecting line and cooling end module the m pairs respectively in micromodule
N-type semiconductor element and P-type semiconductor element are correspondingly connected in thermocouple assembly；
M is to N-type semiconductor element in thermocouple assembly and m+1 to p-type in thermocouple assembly half in cooling end module
Conductor element connection, m+1 is to P-type semiconductor element in thermocouple assembly and m+1 to P-type semiconductor in thermocouple micromodule
Microcomponent connection；Wherein, n is the integer more than or equal to 1, and m is the integer more than or equal to 1 and less than or equal to n-1；
The head end of cooling first P-type semiconductor element of end module and the end of the last one N-type semiconductor element pass through
Output line is connect with external energy storage device.
As possible some implementations, the hot end module further includes endothermic substrate and hot end circuit board, the heat
Terminal circuit plate is equipped with 2n evenly distributed fitting positions, and N-type semiconductor microcomponent and P-type semiconductor microcomponent intersect and be spaced
It is distributed on the fitting position of hot end circuit board；First P-type semiconductor microcomponent and first N-type semiconductor microcomponent composition the
1 pair of thermocouple micromodule, successively arranges backward, forms n altogether to thermocouple micromodule.
As possible some implementations, it is equipped with circuit on the inside of the endothermic substrate, is by near-thermal on the inside of endothermic substrate
The side of terminal circuit plate, the endothermic substrate pass through circuit for the N-type semiconductor microcomponent and P in every a pair of of thermocouple micromodule
Type semiconductor microactuator element connects.
As possible some implementations, the hot end circuit board is equipped with one or more hot ends module interface, N-type half
Conductor microcomponent is connected close to one end of endothermic substrate by circuit interval with P-type semiconductor microcomponent, and the other end is connected to heat
Hot end module interface on terminal circuit plate, the hot end module interface are connect with one end of module connecting line.
As possible some implementations, the cooling end module includes colling end circuit board and colling end heat exchanger fin, P
Half guiding element of type and N-type semiconductor element and intersect and interval be set to colling end circuit board and colling end heat exchanger fin it
Between.
As possible some implementations, the colling end heat exchanger fin is close to N-type semiconductor element and P-type semiconductor member
The side of part is equipped with circuit, and the N-type semiconductor element and P-type semiconductor element pass through electricity close to one end of colling end heat exchanger fin
The connection of road interval.
As possible some implementations, the colling end circuit board is equipped with one or more colling end module interfaces, N
Type semiconductor element and P-type semiconductor element are connected to colling end module interface close to one end of colling end circuit board, described cold
But end module interface is connect by module connecting line with the hot end module interface.
As possible some implementations, hot end module and cooling end module are there are when temperature difference, the heat of hot end module
Galvanic couple micromodule is connect with the thermocouple assembly of cooling end module, constitutes circuit,
That is first P-type semiconductor element is micro- by first P-type semiconductor that module connecting line is connected to hot end module
First P-type semiconductor microcomponent of element, hot end module passes through the circuit and first N-type semiconductor infinitesimal on endothermic substrate
Part connection, first N-type semiconductor microcomponent is again by module connecting line and first N-type semiconductor member for cooling down end module
Part connection, and so on, until flowing through to the last one N-type semiconductor element, cooling end module is connected external by output line
Energy storage device completes power generation.
Compared with prior art, the disclosure has the beneficial effect that
Present disclose provides a kind of novel thermoelectric generators, and the thermoelectric generator hot end is highly integrated, can be limited
Heating surface (area) (HS on arrange more semiconductor microactuator elements, generating efficiency is higher, and not by Conventional thermoelectric arm lengths and sectional area ratio
The limitation of value.
The thermoelectric generator hot end module of the disclosure and cooling end module are separated from each other, and effectively reduce the direct heat at both ends
Amount exchange, reduces thermal loss, and keep the arrangement of thermoelectric generator more flexible；The structure of the disclosure allows heat simultaneously
End and colling end use different semiconductor materials, and hot end uses semiconductor resistant to high temperature, and cold end then uses hot under cooling temperature
The preferable material of electrical property solves the problems, such as that existing thermoelectric generator tolerable temperature is limited.
Arbitrary shape or flexible material can be made in the thermoelectric generator hot end module of the disclosure, adapt to more operating conditions
Demand, being also applied for surface shape can changed occasion.
Each building block of the disclosure can mass machinery production, can be effectively reduced production cost.
Detailed description of the invention
The Figure of description for constituting a part of this disclosure is used to provide further understanding of the disclosure, and the disclosure is shown
Meaning property embodiment and its explanation do not constitute the improper restriction to the disclosure for explaining the disclosure.
Fig. 1 is disclosure thermoelectric generator structural schematic diagram；
Fig. 2 is disclosure schematic diagram of circuit connection structure；
Wherein, 1, thermoelectricity integrated circuit board, 2, endothermic substrate, 3, hot end module interface, 4, insulating layer, 5, module connection
Line, 6, colling end circuit board, 7, colling end heat exchanger fin, 8, P-type semiconductor element, 9, N-type semiconductor element, 10, colling end mould
Block interface, 11, output line, 12, hot end module, 13, cooling end module, 14, P-type semiconductor microcomponent, 15, N-type semiconductor it is micro-
Element.
Specific embodiment:
The disclosure is described further with embodiment with reference to the accompanying drawing.
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the disclosure.Unless another
It indicates, all technical and scientific terms used herein has usual with disclosure person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the disclosure.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
As described in the background art, thermoelectric generator is a kind of static electric organ based on thermoelectric material Seebeck effect
Part, Seebeck effect are also referred to as the first pyroelectric effect, refer to the temperature difference due to two kinds of different electric conductors or semiconductor and draw
Play the pyroelectric phenomena of the voltage difference between two kinds of substances.In the circuit that two different metals or conductor are constituted, if two connect
The temperature of contact is different, then generates electric current, referred to as thermocurrent in the loop, which has become the technical foundation of thermo-electric generation.
Because of defect present in material property and structure limitation as existing for existing thermoelectric generator, the present disclosure proposes a kind of temperature difference
Electric organ, with heating end is highly integrated, can be used for worst hot case, hot and cold side separation, generating efficiency is higher, arrangement is easy to use
The advantages that.
Embodiment 1
As shown in Figure 1, the disclosure provides a kind of thermoelectric generator, including hot end module 12, cooling end module 13, the heat
End module 12 is connect by module connecting line 5 with cooling end module 13, realizes hot and cold side separation；The cooling end module 13 connects
Output line 11, for being connected to the devices such as external pressure regulation or energy storage, will generate electricity can be output to the devices such as external pressure regulation or energy storage.
The hot end module 12 includes hot end circuit board 1, endothermic substrate 2 and 2n semiconductor microactuator element；N be more than or equal to
1 integer；
The hot end circuit board 1 is the thermoelectricity integrated circuit board of high integration；
The hot end circuit board is equipped with 2n evenly distributed fitting positions, corresponds with 2n semiconductor microactuator element；
The semiconductor microactuator element is N-type semiconductor microcomponent 15 and P-type semiconductor microcomponent 14, the N-type semiconductor microcomponent 15
Intersect with P-type semiconductor microcomponent 14 and is distributed on the fitting position；
There are gaps for each P-type semiconductor microcomponent 14 semiconductor microactuator interelement adjacent thereto, do not contact with each other,
Equally, there are gaps for each N-type semiconductor microcomponent 15 semiconductor microactuator interelement adjacent thereto, do not contact with each other；
First P-type semiconductor microcomponent 14 and first N-type semiconductor microcomponent 15 form the 1st pair of thermocouple micro-group
Part successively arranges backward, forms n altogether to thermocouple micromodule.
The endothermic substrate 2 is the plate that inside is machined with circuit, is close to hot end circuit board 1 on the inside of endothermic substrate 2
Side；The endothermic substrate 2 passes through circuit for the N-type semiconductor microcomponent and P-type semiconductor in every a pair of of thermocouple micromodule
Microcomponent connects；
The N-type semiconductor microcomponent 15 and P-type semiconductor microcomponent 14 pass through conductor electricity close to one end of endothermic substrate 2
Road connection, the other end are respectively connected to the hot end module interface 3 on hot end circuit board 1；
Hot end circuit board 1 is equipped with one or more hot ends module interface 3, the hot end module interface 3 and module connecting line 5
One end connection；
Connection semiconductor microactuator element and hot end module interface are respectively provided on 2n of hot end circuit board 1 fitting position
Circuit, N-type semiconductor microcomponent 15 and P-type semiconductor microcomponent 14 pass through the heat in circuit connection to hot end circuit board 1 respectively
End module interface 3, and be connected by module connecting line 5 with cooling end module 13.
Insulating layer 4 is equipped with outside the hot end module 12, the insulating layer is set to hot end module surrounding and close to hot end
The outside of circuit board 1, for reducing thermal loss；
When hot end module overall performance is rigid material, hardness or flexibly thermal insulation material is can be used in the insulating layer；When
When hot end module overall performance is flexible material, the insulating layer also uses flexibly thermal insulation material.
Further, since thermoelectric generator is higher using temperature, to fully consider because temperature change leads to unlike material modification
Degree does not have to, it is necessary to which equilibrium stress maintains not change using structure for a long time, but also to make hot end integrated level high, mentions
High generation efficiency；
So hot end module use semiconductor element size will be much smaller than cold end module semiconductor component size, such as
In the present embodiment, the circuit board of semiconductor element, i.e. N-type semiconductor microcomponent and p-type half are made of microelectronic processing technique
Conductor microcomponent transpostion interval is distributed on the circuit board of hot end, makes hot end integrated level higher in this way, on limited hot end area
It arranges more thermoelectric elements, increases generating efficiency.
The cooling end module 13 includes colling end circuit board 6, colling end heat exchanger fin 7 and 2n semiconductor element,
The colling end circuit board 6 is integrated circuit board, and the semiconductor element is that N-type semiconductor element 9 and p-type are partly led
Element 8；
The N-type semiconductor element 9 and half guiding element 8 of p-type intersect and what is be spaced is set to colling end circuit board 6 and cooling
It holds between heat exchanger fin 7；
N-type semiconductor element 9 and 8 one end of P-type semiconductor element are set on colling end circuit board, the cooling terminal circuit
Plate is equipped with 2n evenly distributed fitting positions, corresponds with 2n semiconductor element；The N-type semiconductor element 9 and p-type
Semiconductor element 8 intersects and is distributed on the fitting position；First N-type semiconductor element 9 and P-type semiconductor element 8
The 1st pair of thermocouple assembly is formed, is successively arranged backward, forms n altogether to thermocouple assembly.
N-type semiconductor element 9 and 8 other end of P-type semiconductor element are set on colling end heat exchanger fin 7, the colling end
Heat exchanger fin 7 is equipped with circuit close to the side of N-type semiconductor element 9 and P-type semiconductor element 8, and the colling end heat exchanger fin 7 passes through
Circuit connects P-type semiconductor element in N-type semiconductor element in first pair of thermocouple assembly and second pair of thermocouple assembly
Come, and so on, N-type semiconductor element 9 and P-type semiconductor element 8 pass through conductor separation close to one end of colling end heat exchanger fin 7
Connection, m+1 connect P-type semiconductor element in thermocouple assembly and m+1 to P-type semiconductor microcomponent in thermocouple micromodule
It connects, m is the integer more than or equal to 1 and less than or equal to n-1.
The colling end circuit board 6 is equipped with one or more colling end module interfaces 10, N-type semiconductor element 9 and p-type half
Conductor element 8 is connected to colling end module interface 10 close to one end of colling end circuit board, and the colling end module interface 10 is logical
Module connecting line 5 is crossed to connect with the hot end module interface 3；
N-type semiconductor element 9 and P-type semiconductor element 8 are connected to colling end module interface 10 on colling end circuit board, lead to
Module connecting line 5 is crossed, with 14 phase of N-type semiconductor microcomponent 15 and P-type semiconductor microcomponent connecting at hot end module interface 3
Even；
First N-type semiconductor element passes through first N on module connecting line 5 and hot end circuit board on colling end circuit board
Type semiconductor microactuator element connects, and first P-type semiconductor element passes through module connecting line 5 and hot end circuit on colling end circuit board
First P-type semiconductor microcomponent connection on plate；So 2n semiconductor is partly led with 2n in the module of hot end in cooling end module
Body microcomponent is connected one to one by module connecting line.
The end of the head end of first semiconductor element of colling end circuit board and the last one semiconductor element respectively with institute
State the positive and negative grade connection of output line 11.
The cooling end module can be bonded with external cooling heat exchanger, and it is more that air-cooled or water cooling etc. can be used in cooling heat exchanger
Kind form.
The colling end module size is separated much larger than hot end module and with hot end module, can be in hot end module height collection
The large scale high efficiency and heat radiation of colling end is realized in the case where, while avoiding the direct heat exchange at cold and hot both ends.
In the present embodiment, hot end module and cooling end module are there are when temperature difference, the thermocouple micromodule of hot end module
It is connect with the thermocouple assembly of cooling end module, constitutes circuit, electric current is generated in circuit, is i.e. first P-type semiconductor element is logical
First P-type semiconductor microcomponent that module connecting line is connected to hot end module is crossed, first P-type semiconductor of hot end module is micro-
Element is connect by the circuit on endothermic substrate with first N-type semiconductor microcomponent, and first N-type semiconductor microcomponent is again
It is connect by module connecting line with first N-type semiconductor element of cooling end module, and so on, until electric current is flowed through to most
The latter N-type semiconductor element, cooling end module connect the external devices such as pressure regulation or energy storage by output line, complete power generation.
The above is only preferred embodiment of the present disclosure, are not limited to the disclosure, for those skilled in the art
For member, the disclosure can have various modifications and variations.It is all the disclosure spirit and principle within, it is made it is any modification,
Equivalent replacement, improvement etc., should be included within the protection scope of the disclosure.
Although above-mentioned be described in conjunction with specific embodiment of the attached drawing to the disclosure, model not is protected to the disclosure
The limitation enclosed, those skilled in the art should understand that, on the basis of the technical solution of the disclosure, those skilled in the art are not
Need to make the creative labor the various modifications or changes that can be made still within the protection scope of the disclosure.
Claims (10)
1. a kind of thermoelectric generator, which is characterized in that including hot end module, cooling end module and module connecting line；
The hot end module includes n to thermocouple micromodule, and the cooling end module includes n to thermocouple assembly,
1 pair of thermocouple micromodule includes 1 N-type semiconductor microcomponent and 1 P-type semiconductor microcomponent, and m is to thermocouple micro-group
N-type semiconductor microcomponent and P-type semiconductor microcomponent pass through module connecting line with m in cooling end module to thermoelectricity respectively in part
N-type semiconductor element and P-type semiconductor element are correspondingly connected in even component；
M is to N-type semiconductor element and m+1 in thermocouple assembly to P-type semiconductor in thermocouple assembly in cooling end module
Element connection, m+1 is to P-type semiconductor element in thermocouple assembly and m+1 to P-type semiconductor infinitesimal in thermocouple micromodule
Part connection；Wherein, n is the integer more than or equal to 1, and m is the integer more than or equal to 1 and less than or equal to n-1；
The head end of cooling first P-type semiconductor element of end module and the end of the last one N-type semiconductor element pass through output
Line is connect with external energy storage device.
2. a kind of thermoelectric generator as described in claim 1, characterized in that
The hot end module further includes endothermic substrate and hot end circuit board, and it is a evenly distributed that the hot end circuit board is equipped with 2n
It is bonded position, N-type semiconductor microcomponent and P-type semiconductor microcomponent intersect and be distributed on the fitting position of hot end circuit board；
First P-type semiconductor microcomponent and first N-type semiconductor microcomponent form the 1st pair of thermocouple micromodule, successively to heel row
Column form n to thermocouple micromodule altogether.
3. a kind of thermoelectric generator as claimed in claim 2, characterized in that
It is equipped with circuit on the inside of the endothermic substrate, is close to the side of hot end circuit board, the endothermic substrate on the inside of endothermic substrate
By circuit by every a pair of of thermocouple micromodule N-type semiconductor microcomponent and P-type semiconductor microcomponent connect.
4. a kind of thermoelectric generator as claimed in claim 2, characterized in that
The hot end circuit board is equipped with one or more hot ends module interface, N-type semiconductor microcomponent and P-type semiconductor microcomponent
One end close to endothermic substrate is connected by circuit interval, and the other end is connected to the hot end module interface on the circuit board of hot end, institute
Hot end module interface is stated to connect with one end of module connecting line.
5. a kind of thermoelectric generator as claimed in claim 4, characterized in that
2n fitting position of the hot end circuit board is equipped with the circuit for connecting semiconductor microactuator element and hot end module interface,
N-type semiconductor microcomponent and P-type semiconductor microcomponent pass through the hot end module interface in circuit connection to hot end circuit board respectively,
And it is connected by module connecting line with cooling end module.
6. a kind of thermoelectric generator as described in claim 1, characterized in that
The cooling end module includes colling end circuit board and colling end heat exchanger fin, and half guiding element of p-type and N-type semiconductor element are simultaneously
And intersect and interval be set between colling end circuit board and colling end heat exchanger fin.
7. a kind of thermoelectric generator as claimed in claim 6, characterized in that
The colling end heat exchanger fin is equipped with circuit, the N-type half close to the side of N-type semiconductor element and P-type semiconductor element
Conductor element is connected close to one end of colling end heat exchanger fin by circuit interval with P-type semiconductor element.
8. a kind of thermoelectric generator as claimed in claim 6, characterized in that
The colling end circuit board is equipped with one or more colling end module interfaces, N-type semiconductor element and P-type semiconductor element
One end close to colling end circuit board is connected to colling end module interface, the colling end module interface by module connecting line with
The hot end module interface connection.
9. a kind of thermoelectric generator as claimed in claim 6, characterized in that
N-type semiconductor element and P-type semiconductor element on the colling end circuit board are connected to colling end module interface, pass through
Module connecting line is connected with the N-type semiconductor microcomponent and P-type semiconductor microcomponent connecting at the module interface of hot end.
10. a kind of thermoelectric generator as described in claim 1, characterized in that
Hot end module and cooling end module are there are when temperature difference, the thermoelectricity of the thermocouple micromodule of hot end module and cooling end module
Even component connection, constitutes circuit,
That is first P-type semiconductor element is connected to first P-type semiconductor microcomponent of hot end module by module connecting line,
First P-type semiconductor microcomponent of hot end module is connected by circuit on endothermic substrate and first N-type semiconductor microcomponent
It connects, first N-type semiconductor microcomponent connects again by first N-type semiconductor element of module connecting line and cooling end module
It connects, and so on, until flowing through to the last one N-type semiconductor element, cooling end module connects external energy storage by output line
Device completes power generation.
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| CN201910912741.XA CN110535373A (en) | 2019-09-25 | 2019-09-25 | A kind of thermoelectric generator |
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| CN201910912741.XA CN110535373A (en) | 2019-09-25 | 2019-09-25 | A kind of thermoelectric generator |
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| CN101719747A (en) * | 2009-12-11 | 2010-06-02 | 天津大学 | Separated cold/hot end novel n-type temperature-difference power generation module and method for manufacturing same |
| CN103000799A (en) * | 2012-12-09 | 2013-03-27 | 雍占锋 | Cold end and hot end separated type thermoelectric refrigeration semiconductor technology |
| CN104993740A (en) * | 2015-07-07 | 2015-10-21 | 天津大学 | Segmental thermoelectric generator structure design method |
| CN109579353A (en) * | 2019-01-04 | 2019-04-05 | 山东省科学院能源研究所 | A kind of semiconductor cooler |
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2019
- 2019-09-25 CN CN201910912741.XA patent/CN110535373A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101719747A (en) * | 2009-12-11 | 2010-06-02 | 天津大学 | Separated cold/hot end novel n-type temperature-difference power generation module and method for manufacturing same |
| CN103000799A (en) * | 2012-12-09 | 2013-03-27 | 雍占锋 | Cold end and hot end separated type thermoelectric refrigeration semiconductor technology |
| CN104993740A (en) * | 2015-07-07 | 2015-10-21 | 天津大学 | Segmental thermoelectric generator structure design method |
| CN109579353A (en) * | 2019-01-04 | 2019-04-05 | 山东省科学院能源研究所 | A kind of semiconductor cooler |
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