CN110534460A - A kind of modified patch device - Google Patents
A kind of modified patch device Download PDFInfo
- Publication number
- CN110534460A CN110534460A CN201910802048.7A CN201910802048A CN110534460A CN 110534460 A CN110534460 A CN 110534460A CN 201910802048 A CN201910802048 A CN 201910802048A CN 110534460 A CN110534460 A CN 110534460A
- Authority
- CN
- China
- Prior art keywords
- frame
- scolding tin
- mounting plate
- baffle
- moving assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 107
- 238000003466 welding Methods 0.000 claims abstract description 46
- 238000003825 pressing Methods 0.000 claims abstract description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 210000002421 cell wall Anatomy 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 230000000630 rising effect Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 claims 1
- 238000012797 qualification Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 206010041662 Splinter Diseases 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of modified patch devices, including rack, are arranged on the rack the track for placing frame, the transfer member for moving frame along track, and along point tin device, film pressing device and the paster apparatus of the setting of frame direction of travel；Point tin device includes guard assembly and scolding tin station machine；Scolding tin station machine includes spot welding head and Welding Area；Guard assembly includes scolding tin gear shield component and driving mechanism；The surface of Welding Area is arranged in scolding tin gear shield component；Scolding tin gear shield component includes the horizontal baffle and vertical baffle being fixedly connected；Driving mechanism is for driving scolding tin gear shield component lifting, so that vertical baffle stretches out or protrude into the groove of frame；When vertical baffle protrudes into the groove of frame, vertical baffle separates other positions in the chip bearing area of frame and frame, and horizontal baffle is blocked in the upper surface of frame；Spot welding head is towards Welding Area.The present invention can prevent scolding tin from splashing on the pin of frame, to improve product qualification rate.
Description
Technical field
The present invention relates to be used to for chip being fixed in semiconductor packaging device field more particularly to semiconductor packaging process
Patch device on frame.
Background technique
Semiconductor packages refers to process to obtain according to product type and functional requirement by the wafer tested and can be used for respectively
The process of semiconductor devices in kind electronic product.Wherein patch device is to complete the weight of paster technique in semiconductor packaging process
Equipment is wanted, is fixed on frame for isolated chip will to be cut.
Fig. 1-2 schematically illustrate it is a kind of commonly for carrying the frame 30 of chip, in the frame 30 shown in, core
Not in approximately the same plane, chip bearing area 33 is formed the pin 34 of piece supporting region 33 and frame 30 relative to 34 place plane of pin
There are multiple pins 34 in one groove 32, the upper surface 31 of frame around groove 32 is circumferentially distributed；Wherein, the bottom surface of groove 32 is chip
Supporting region 33；In paster technique, a tin operation is carried out in chip bearing area 33 first, since frame structure has been heated to
High temperature, then the scolding tin being located in chip bearing area 33 will be carried out by fast melt by putting the scolding tin in chip bearing area 33
Chip dress so that scolding tin is matched with the mold cavity shapes of press mold, then is attached to the weldering in chip bearing area 33 by paster apparatus by press mold
It on tin, is finally cooled down, completes paster technique.In this process, in discovery point tin operating procedure, scolding tin occurs now and then quick-fried
The problem of splitting splashing, since the depth of groove 32 is shallower, scolding tin is easy to be splashed at pin 34, and then influences subsequent bonding wire station
The reliability of welding.To avoid scolding tin from being splashed at pin 34, the prior art prevents to weld frequently with baffle a as shown in Figure 2
Tin splashes at pin 34, and still, existing baffle a is fixed in machine track, can not with moving left and right for product and
Moved up and down accordingly, thus in order to avoid in the moving process to the right of frame 30 baffle a pin 34 is caused to rub,
In use, baffle a needs keep certain gap between the upper surface of frame 31 always, therefore, scolding tin still can be from this
Gap is splashed to pin 34, can not effectively solve the quality problems that scolding tin is splashed on pin 34.
Patent document CN208977024U, which discloses one kind, prevents scolding tin splinter device, including pedestal, Z axis to line slide rail,
Fixed sliding rail rack, movable sliding rail rack, Y-axis fine-tuning stent, X axis fine-tuning stent, high temperature stent, anti-scolding tin fly
Device, Z axis are splashed to limited block and inductor, cylinder and gas path device.The utility model reduces defective products caused by scolding tin splashes；
The utility model can replace various sizes of pressing plate or claw, directly as carrier presser device.But the device is not
Specifically in conjunction with patch device, there are problems that being adapted to existing patch device.
Patent document CN205571657U disclose scolding tin sputtering prevention device include a solder stick mobile mechanism and
The notching mechanism of one solder stick, mobile mechanism include a support wheel by motor drive, and notching mechanism uses a position
Cutting disc above support wheel.Solder stick passes through between support wheel and cutting disc, a delay being located above solder stick
Contact switch is with motor at being electrically connected, and when solder stick is straightened, solder stick touches delayed contact switch according to set time
Drive motor cuts solder stick by cutting disc.The preventing mean makes heated vaporization in the longitudinally slit notch of solder stick
Rosin flies out from notch, not will lead to the splashing of scolding tin.Guarantee welding quality, easy to operate, save the cost.But the device is main
For the welding of circuit board, while also needing not being suitable for by manual operation that high precision, full-automatic patch is needed to set
It is standby.
The present invention is the product qualification rate improved in semiconductor packaging process, seeks a kind of new technical solution.
Summary of the invention
For overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of modified patch device, can prevent
Only scolding tin splashes on the pin of frame, to improve product qualification rate.
The purpose of the present invention adopts the following technical scheme that realization:
A kind of modified patch device, including rack are provided with along the length of the rack in the rack upper surface and are used for
The track of frame is placed, it further includes transfer member that the rack, which is equipped with the heating device for heating to track, the transfer
Component is moved for will place frame in orbit along track, and setting has tin device, film pressing device and a patch in the rack
Sheet devices, successively the direction of travel of frame is arranged along the track for described tin device, film pressing device and paster apparatus, described
Point tin device includes guard assembly and scolding tin station machine, and the guard assembly is located at the side of the scolding tin station machine；Wherein,
The scolding tin station machine includes spot welding head and Welding Area；The Welding Area is located on track and is located at what frame was advanced
On track；
The guard assembly includes scolding tin gear shield component and driving mechanism；The scolding tin gear shield component is arranged in the spot welding
The surface in area；The scolding tin gear shield component includes horizontal baffle and vertical baffle；The horizontal baffle offers described in perforation
The through-hole of horizontal baffle upper and lower surface；The vertical baffle is fixed on the horizontal baffle and is located under the horizontal baffle
Side；The vertical baffle around the through-hole circumferentially extending and be enclosed tubular structure up and down；The driving mechanism
For driving the scolding tin gear shield component lifting, so that the vertical baffle can stretch out or protrude into the frame positioned at the Welding Area
In the groove of frame；In the case of in the groove that the vertical baffle protrudes into the frame, the vertical baffle is located at described
The outer periphery in the chip bearing area of frame, other positions in the chip bearing area of the frame and the frame are separated, and
The horizontal baffle is blocked in the upper surface of the frame；
In the case of carrying out the operation of tin, through-hole described in the spot welding head face, and the spot welding head is towards the point
Welding zone.
Further, the bottom surface of the spot welding head is formed as horizontal gear mask, and the horizontal gear mask is located at the through-hole
Surface.
Further, the driving mechanism includes pedestal, the first mounting plate, X to fine tuning structure, moving assembly and cylinder；
The moving assembly can be mounted on the base with moving along Y-direction；The cylinder is for driving the moving assembly to transport along Y-direction
It is dynamic；First mounting plate can to moving be mounted on the moving assembly along X；The scolding tin gear shield component is mounted on described
On first mounting plate；The X includes adjusting screw and the adjusting screw thread that is provided on first mounting plate to fine tuning structure
Hole；The adjusting screw is mounted on the moving assembly, and the relatively described moving assembly in X to fixation, and in the adjusting
The axial direction of screw can be rotated；The bar portion for adjusting screw and the adjusting screw hole cooperate.
Further, fixed card slot is offered on the moving assembly, the head for adjusting screw can axially turn along it
It is installed in the fixed card slot dynamicly.
Further, the head end for adjusting screw offers polygon groove.
Further, the fixed card slot X to a wherein cell wall run through have notch upward locating slot, the tune
The bar portion activity of section screw is plugged in the locating slot；The fixed card slot X to another cell wall on through there is escape port, institute
Stating escape port makes the polygon groove expose outside.
Further, first mounting plate is fixed with the first guide rod, and the moving assembly offers the first waist type groove；
The first guide rod activity is plugged in the first waist type groove.
Further, the moving assembly includes the second mounting plate, third mounting plate and retaining mechanism；Third mounting plate can
It is mounted on the base with moving along Y-direction；The output end and third mounting plate of the cylinder are sequentially connected；Second mounting plate is logical
The retaining mechanism is crossed to be mounted on the third mounting plate；The retaining mechanism includes lock-screw, is provided with described second
The second waist type groove on mounting plate and the locking screw holes being provided on the third mounting plate；The second waist type groove is along Z-direction
Extend；The bar portion of the lock-screw passes through the second waist type groove and the locking screw holes threaded.
Further, the modified patch device further includes buffer spring, and the both ends of the buffer spring are installed respectively
On the moving assembly and the pedestal, the buffer spring is used to provide downward drawing when the moving assembly rises
Power.
Further, the scolding tin gear shield component is made of mould steel.
Compared with prior art, the beneficial effects of the present invention are:
Frame is transferred to Welding Area by transfer member by the present invention, and scolding tin is kept off shield component and dropped to by cooperation driving mechanism
Protrude into vertical baffle in the groove of frame, at this point, flying due to the through-hole of spot welding head face horizontal baffle in this way, scolding tin occurs
When splashing, under the prevention of vertical baffle, scolding tin is avoided to splash between horizontal baffle and the upper surface of frame and fall in frame
Pin on, and when scolding tin splashes to out outside through-hole, horizontal baffle further prevents scolding tin from falling on the pin of frame, such as
This, can be improved product qualification rate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of available frame；
Fig. 2 is the use state diagram of existing baffle；
Fig. 3 is the assembly structure diagram of modified patch device of the present invention；
Fig. 4 is the simplified structure diagram of modified patch device of the present invention；
Fig. 5 is the assembly structure diagram of guard assembly of the present invention；
Fig. 6 is the fractionation structural representation of guard assembly of the present invention；
Fig. 7 is the schematic enlarged-scale view of part A in Fig. 6 of the present invention；
Fig. 8 is the structural schematic diagram of scolding tin of the present invention gear shield component.
In figure: 10, guard assembly；11, scolding tin gear shield component；111, horizontal baffle；112, vertical baffle；113, through-hole；
12, driving mechanism；121, pedestal；122, the first mounting plate；123, X is to fine tuning structure；1231, screw is adjusted；1232, spiral shell is adjusted
Pit；124, moving assembly；1241, the second mounting plate；1242, third mounting plate；125, cylinder；20, scolding tin station machine；21,
Spot welding head；22, transfer member；30, frame；31, the upper surface of frame；32, groove；33, chip bearing area；34, pin；40,
Fixed card slot；50, the first guide rod；60, the first waist type groove；70, escape port；80, retaining mechanism；81, lock-screw；82,
Two waist type grooves；83, locking screw holes；90, welding wire；100, buffer spring；110, locating slot；120, polygon groove；130, heat release hole；
140, rack；150, track；160, press mold head；170, placement head.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention, it should be noted that not
Under the premise of conflicting, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
A kind of modified patch device as shown in figs 3-6 and 8, including rack 140, in 140 upper surface of rack along machine
140 length direction of frame is provided with the track 150 for placing frame 30, and rack 140 is equipped with to be added for what is heated to track 150
Thermal further includes transfer member 22, and transfer member 22 is for moving the frame 30 being placed on track 150 along track 150；
Setting has tin device, film pressing device and a paster apparatus in rack 140, puts tin device, film pressing device and paster apparatus successively edge
The direction of travel setting of frame 30, corresponds to be formed on track 150 with film pressing device and paster apparatus on track 150
Press mold area and Chip Area.Point tin device includes guard assembly 10 and scolding tin station machine 20, and guard assembly 10 is located at the scolding tin
The side of station machine 20；Wherein, scolding tin station machine 20 includes spot welding head 21 and Welding Area；Welding Area is located on track 150 and position
In on the track that frame 30 is advanced；Optionally, which can be used existing following implementation: embodiment one is moved
Sending component 22 includes push plate and cylinder 125, and cylinder 125 drives push plate to push frame 30, it should be noted that the cylinder 125
The replacement such as linear motor can be used, as long as the existing dynamic structure of linear motion can be realized；Embodiment two, transfer member
22 include hook, linear motor and rotating electric machine；Rotating electric machine drives hook rotation to catch on or far from frame 30, linear motor
Output shaft be fixedly connected with the body of rotating electric machine, in this way, by rotating electric machine drive hook catch on frame 30, linear motor
It drives rotating electric machine mobile, frame 30 can be driven mobile.
Wherein, as seen in figures 3-6, guard assembly 10 includes scolding tin gear shield component 11 and driving mechanism 12；Scolding tin keeps off shield portion
The surface of Welding Area is arranged in part 11；Scolding tin gear shield component 11 includes horizontal baffle 111 and vertical baffle 112；Specifically, water
Flat baffle 111 offers through-hole 113, which penetrates through the upper and lower surface of the horizontal baffle 111；Vertical baffle 112 is fixed on
On the horizontal baffle 111 and it is located at 111 lower section of horizontal baffle；The vertical baffle 112 around the through-hole 113 circumferentially extending and enclose
Close the tubular structure formed up and down；It is to be understood that the through-hole 113 of horizontal baffle 111 connects each other with vertical baffle 112
It is logical, and be connected to respectively with outside；Furthermore above-mentioned tubular structure is not limited in cylindric, cube etc.；The driving mechanism
12 for driving scolding tin gear shield component 11 to go up and down, so that vertical baffle 112 can stretch out or protrude into the frame 30 positioned at Welding Area
Groove 32 in；In this way, vertical baffle 112 can then stretched out recessed when driving mechanism 12 drives scolding tin gear shield component 11 to rise
Slot 32；Correspondingly, when driving mechanism 12 drives scolding tin gear shield component 11 to decline, then vertical baffle 112 can be made to protrude into groove 32；
In the case of vertical baffle 112 protrudes into the groove 32 of frame 30, vertical baffle 112 is located at the chip bearing area of frame 30
33 outer periphery separates other positions of chip bearing area 33 and frame 30, and horizontal baffle 111 is blocked in the upper of frame
Surface 31；In the case of carrying out the operation of tin, 21 face through-hole 113 of spot welding head, and spot welding head 21 is towards Welding Area；In this way,
The welding wire 90 of spot welding head 21 can directly fall in the chip of the frame 30 on Welding Area out of through-hole 113 and vertical baffle 112
On supporting region 33.
On the basis of above structure, when using this modified patch device, according to circumstances selectivity uses driving mechanism
12 drive scolding tin gear shield components 11 rise to certain position, which keeps off the shield not transfer to subsequent frame 30 of component 11 with scolding tin
It causes subject to obstruction；Frame 30 is transferred to Welding Area by transfer member 22, at this point, 33 face of chip bearing area of control framework 30
Through-hole 113；Scolding tin gear shield component 11 is driven to decline the groove 32 for making vertical baffle 112 protrude into frame 30 using driving mechanism 12
It is interior；In this way, under the prevention of vertical baffle 112, avoiding scolding tin when spot welding head 21 carries out a tin operation and scolding tin splashing occurs
It splashes between horizontal baffle 111 and the upper surface 31 of frame and falls on the pin 34 of frame 30, and splashed in scolding tin
When through-hole 113 is outer, horizontal baffle 111 further prevents scolding tin from falling on the pin 34 of frame 30, in this way, product conjunction can be improved
Lattice rate.
Herein it should be noted that the work of integrated injection molding can be used in above-mentioned horizontal baffle 111 and vertical baffle 112
Skill is process, and can also be produced and be achieved a fixed connection by welding respectively in the later period.
Furthermore existing 34 side of pin is exposed in the groove 32 of frame 30, the cell wall of groove 32 is splashed in scolding tin
When upper, it is lower to also result in product qualification rate, and in the present invention, vertical baffle 112 protrudes into groove 32, can be to the slot of groove 32
Wall carries out gear shield, to further increase product qualification rate.
Specifically, above-mentioned scolding tin station machine 20 can be used current version be ESEC2007SSIPLUS tin soldering machine or
The tin soldering machine etc. of model ESEC2009SSI；In this way, in the tin soldering machine using any of the above-described kind of model as in the present embodiment
Scolding tin station machine 20 when, guard assembly 10 is mounted on the base of tin soldering machine.
The bottom surface of above-mentioned spot welding head 21 is formed as horizontal gear mask, and level gear mask is located at right above the through-hole 113,
In this way, scolding tin can be further prevented to fly out outside through-hole 113；The bottom surface of the spot welding head 21 can also be inclined surface, still, in area phase
With on the basis of, level gear mask relative tilt face its to block range bigger.
As illustrated in figs. 5-7, specifically, above-mentioned driving mechanism 12 is tied including pedestal 121, the first mounting plate 122, X to fine tuning
Structure 123, moving assembly 124 and cylinder 125；Moving assembly 124 can be mounted on the pedestal 121 with moving along Y-direction；Cylinder 125
For driving moving assembly 124 to move along Y-direction；First mounting plate 122 can to moving be mounted on moving assembly 124 along X；Weldering
Tin gear shield component 11 is mounted on the first mounting plate 122；In this way, can pass through when cylinder 125 drives moving assembly 124 to move
First mounting plate 122 linkage scolding tin gear shield component 11 is gone up and down.
As seen in figs. 5-6, more specifically, X including adjusting screw 1231 and is provided with the first installation to fine tuning structure 123
Adjusting threaded hole 1232 on plate 122；It adjusts screw 1231 to be mounted on moving assembly 124, and relatively moves component 124 in X
It can be rotated to fixation, and in the axial direction for adjusting screw 1231；It is to be understood that adjust screw 1231 can be rotated and can not
Along X to moving；It adjusts the bar portion of screw 1231 and adjusts 1232 threaded of threaded hole；In this way, in use, being adjusted by turn
Screw 1231 can not adjust threaded hole 1232 and adjust screw 1231 due to adjusting screw 1231 along X to moving at this time
Cooperation under, the first mounting plate 122 along adjust screw 1231 bar portion move, and adjust scolding tin gear shield component 11 X to position
It sets, and then the relative position of the groove 32 of vertical baffle 112 and frame 30, in this way, vertical baffle 112 can be reduced in decline process
In friction occur with the cell wall of groove 32 or offset the possibility touched with frame 30.
Following manner installation can be used in above-mentioned adjusting screw 1231, specifically, offers fixing card on moving assembly 124
Slot 40, the head for adjusting screw 1231 axially can be rotationally installed in fixed card slot 40 along it, at this point, the slot of fixed card slot 40
Wall prevents to adjust screw 1231 along X to moving, simple installation.
Preferably, adjust screw 1231 head end offer polygon groove 120, in this way, polygon groove 120 can with it is outer
The head of portion's screwdriver matches inserting, consequently facilitating adjusting the turn of screw 1231；Optionally, in addition to being arranged to polygon groove
Outside 120, flat recess, cross recess, rice pilot trench etc. may also be arranged to.
In order to realize adjust screw 1231 installation ground steadily, it is highly preferred that fixed card slot 40 X to a wherein slot
Wall runs through the locating slot 110 for having notch upward, and the bar portion activity for adjusting screw 1231 is plugged in locating slot 110, it is possible to understand that ground
It is that, when the head for adjusting screw 1231 is installed in fixed card slot 40, the bar portion for adjusting screw 1231 is plugged in the locating slot
In 110, it can further avoid adjusting the deflection of screw 1231.
At the same time, fixed card slot 40 X to another cell wall on through there is escape port 70, escape port 70 makes polygon groove
120 expose outside, match convenient for external screwdriver with polygon groove 120 and can go on smoothly rotation process.
In order to realize the displacement of the first mounting plate 122, it is preferable that the first mounting plate 122 is fixed with the first guide rod
50, moving assembly 124 offers the first waist type groove 60, it is to be understood that the first waist type groove 60 is along X to extension；First guiding
50 activity of bar is plugged in the first waist type groove 60, in this way, generating orientation to the movement of the first mounting plate 122 in the first waist type groove 60
Effect.
Specifically, heat release hole 130 can be also offered on the first mounting plate 122, heat release hole 130 increases the first mounting plate
122 and air contact area, in this way, radiating efficiency can be improved, and mitigate overall weight；It is understood that above-mentioned dissipates
The quantity of hot hole 130 can be multiple.
Further, moving assembly 124 includes the second mounting plate 1241, third mounting plate 1242 and retaining mechanism 80；
Third mounting plate 1242 can be mounted on pedestal 121 with moving along Y-direction；The output end and third mounting plate 1242 of cylinder 125 pass
Dynamic connection；Second mounting plate 1241 is mounted on third mounting plate 1242 by retaining mechanism 80；Retaining mechanism 80 includes locking
Screw 81, the second waist type groove 82 being provided on the second mounting plate 1241 and the locking being provided on third mounting plate 1242
Screw hole 83；Second waist type groove 82 extends along Z-direction；The bar portion of lock-screw 81 passes through the second waist type groove 82 and is spirally connected with locking screw holes 83
Cooperation；First mounting plate 122 and adjusting screw 1231 are installed on the second mounting plate 1241.
On the basis of the said structure, in use, making the head of lock-screw 81 close to third by turn lock-screw 81
Mounting plate 1242 can be achieved under being matched for clamping tightly of the head of lock-screw 81 and third mounting plate 1242 at this time by the second installation
Plate 1241 is fixed on third mounting plate 1242；Furthermore by unscrewing lock-screw 81 and unclamping the second mounting plate 1241, second
Mounting plate 1241 can be moved along the extending direction of the second waist type groove 82, at this point, adjustable scolding tin gear shield component 11 is in the position of Z-direction
It sets, further avoids the cell wall friction of vertical baffle 112 and groove 32 or offset with frame 30 to touch.
Specifically, cylinder 125 drives moving assembly 124 to move upwards when being passed through gas, and in order to avoid moving assembly
124 risings are too quickly, it is preferable that this modified patch device further includes buffer spring 100, and the both ends of buffer spring 100 are pacified respectively
On moving assembly 124 and pedestal 121, buffer spring 100 is used to provide downward pulling force when moving assembly 124 rises；
Herein it should be noted that above-mentioned buffer spring 100 can be also buffer spring column, buffer spring piece etc., as long as can be real
Existing elastic stretching.
In order to avoid scolding tin is adhered on scolding tin gear shield component 11, the scolding tin gear shield component 11 in the present invention preferably uses mould
Tool steel is made, and scolding tin will not stick on scolding tin gear shield component 11, does not need frequently disassembly and cleans and maintains, it is steady to enhance work
It is qualitative；Furthermore scolding tin gear shield component 11 also can be used alloy measuring instrument steel, heat resisting steel etc. material and be made.
In a kind of preferred embodiment, film pressing device includes press mold head 160 and press mold driving part, press mold driving part
A kind of embodiment be using motor, to drive press mold head 160 close to or away from the frame 30 on track 150.Press mold head 160
The position of frame oriented 30 is square setting, while being arranged by bottom opening and the cavity that upwardly extends, with formed only have to
The press mold chamber of next opening, press mold chamber are also configured as rectangular accordingly.When press mold head 160 is in the driving of press mold driving part
Under, when carrying out press mold to the scolding tin melted in the chip bearing area 33 for being located at frame 30, flowing is filled press mold by scolding tin
Chamber, to form rectangular scolding tin in chip bearing area 33, the shape of rectangular scolding tin and chip it is similar, it can be achieved that chip with
The Maximum Contact area of scolding tin, enables chip to be more firmly secured on scolding tin.
In a kind of preferred embodiment, paster apparatus includes placement head 170, wafer carrying area and patch driving part.
The end of placement head 170 is equipped with vacuum cups, is equipped with thimble below wafer carrying area.When carrying out paster technique, patch is driven
Dynamic component drives thimble to eject isolated chip is cut upwards from chip bottom, while placement head 170 being driven to be moved to the core
Above piece, by the vacuum cups absorption chip of 170 end of placement head, then placement head 170 is driven to be moved on track 150
33 top of chip bearing area of frame 30, and placement head 170 is driven to move down, one single chip is fixed on chip bearing area
On rectangular scolding tin on 33.The frame 30 for being equipped with chip is transferred into out Chip Area finally by transfer member 22, is cooled down
Cooling, chip is fixed in the chip bearing area 33 of frame 30 by realization.To facilitate subsequent progress wire bonding, molding and cutting
The technological operations such as molding.In this preferred embodiment, it is not this that the specific structure of patch driving part, which is techniques known,
Improvement and claimed scheme are made in invention, and it will not be described here.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (10)
1. a kind of modified patch device, it is characterised in that: including rack, set along the length of the rack in the rack upper surface
It is equipped with the track for placing frame, it further includes transfer member that the rack, which is equipped with the heating device for heating to track,
The transfer member is moved for will place frame in orbit along track, and setting has a tin device, press mold in the rack
Device and paster apparatus, described tin device, film pressing device and paster apparatus successively along the track frame direction of travel
Setting, described tin device includes guard assembly and scolding tin station machine, and the guard assembly is located at the one of the scolding tin station machine
Side；Wherein,
The scolding tin station machine includes spot welding head and Welding Area；The Welding Area is located on track and is located at the track that frame is advanced
On；
The guard assembly includes scolding tin gear shield component and driving mechanism；The Welding Area is arranged in the scolding tin gear shield component
Surface；The scolding tin gear shield component includes horizontal baffle and vertical baffle；The horizontal baffle offers the perforation level
The through-hole of baffle upper and lower surface；The vertical baffle is fixed on the horizontal baffle and is located at below the horizontal baffle；Institute
Vertical baffle is stated around the circumferentially extending of the through-hole and is enclosed tubular structure up and down；The driving mechanism is used for band
The scolding tin gear shield component lifting is moved, so that the vertical baffle can stretch out or protrude into the recessed of the frame positioned at the Welding Area
In slot；In the case of in the groove that the vertical baffle protrudes into the frame, the vertical baffle is located at the frame
The outer periphery in chip bearing area separates other positions in the chip bearing area of the frame and the frame, and the water
Flat baffle is blocked in the upper surface of the frame；
In the case of carrying out the operation of tin, through-hole described in the spot welding head face, and the spot welding head is towards the Welding Area.
2. modified patch device as described in claim 1, it is characterised in that: the bottom surface of the spot welding head is formed as horizontal gear
Mask, the horizontal gear mask are located at right above the through-hole.
3. modified patch device as described in claim 1, it is characterised in that: the driving mechanism includes pedestal, the first peace
Loading board, X are to fine tuning structure, moving assembly and cylinder；The moving assembly can be mounted on the base with moving along Y-direction；Institute
Cylinder is stated for driving the moving assembly to move along Y-direction；First mounting plate can to moving be mounted on described move along X
On component；The scolding tin gear shield component is mounted on first mounting plate；The X to fine tuning structure include adjust screw and
The adjusting threaded hole being provided on first mounting plate；The adjusting screw is mounted on the moving assembly, and opposite institute
Moving assembly is stated in X to fixation, and can be rotated in the axial direction for adjusting screw；The bar portion and the adjusting for adjusting screw
Screw hole cooperation.
4. modified patch device as claimed in claim 3, it is characterised in that: offer fixing card on the moving assembly
Slot, the head for adjusting screw axially can be rotationally installed in the fixed card slot along it.
5. modified patch device as claimed in claim 4, it is characterised in that: the head end for adjusting screw offers
Polygon groove.
6. modified patch device as claimed in claim 5, it is characterised in that: the fixed card slot X to wherein one
Cell wall runs through the locating slot for having notch upward, and the bar portion activity for adjusting screw is plugged in the locating slot；The fixing card
Slot X to another cell wall on through there is an escape port, it is external that the escape port exposes the polygon groove.
7. modified patch device as claimed in claim 3, it is characterised in that: first mounting plate is fixed with the first guiding
Bar, the moving assembly offer the first waist type groove；The first guide rod activity is plugged in the first waist type groove.
8. modified patch device as claimed in claim 3, it is characterised in that: the moving assembly include the second mounting plate,
Third mounting plate and retaining mechanism；Third mounting plate can be mounted on the base with moving along Y-direction；The output end of the cylinder
It is sequentially connected with third mounting plate；Second mounting plate is mounted on the third mounting plate by the retaining mechanism；The lock
Tight mechanism includes lock-screw, the second waist type groove being provided on second mounting plate and is provided with the third installation
Locking screw holes on plate；The second waist type groove extends along Z-direction；The bar portion of the lock-screw pass through the second waist type groove with
The locking screw holes threaded.
9. modified patch device as claimed in claim 3, it is characterised in that: the modified patch device further includes buffering
Spring, the both ends of the buffer spring are separately mounted on the moving assembly and the pedestal, and the buffer spring is used for
The moving assembly provides downward pulling force when rising.
10. such as the described in any item modified patch devices of claim 1-9, it is characterised in that: the scolding tin gear shield component is adopted
It is made of mould steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910802048.7A CN110534460A (en) | 2019-08-28 | 2019-08-28 | A kind of modified patch device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910802048.7A CN110534460A (en) | 2019-08-28 | 2019-08-28 | A kind of modified patch device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110534460A true CN110534460A (en) | 2019-12-03 |
Family
ID=68664799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910802048.7A Pending CN110534460A (en) | 2019-08-28 | 2019-08-28 | A kind of modified patch device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110534460A (en) |
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|---|---|---|---|---|
| US20090101628A1 (en) * | 2005-07-28 | 2009-04-23 | Werner Kaeseler | Spot welding cap changer |
| KR100969531B1 (en) * | 2009-12-01 | 2010-07-12 | (주)에이에스티 | Head part of led die bonder |
| CN103785915A (en) * | 2014-01-17 | 2014-05-14 | 浙江田中精机股份有限公司 | Linear tin soldering machine |
| CN105478984A (en) * | 2016-01-07 | 2016-04-13 | 广州市明森机电设备有限公司 | Chip spot-welding device for double-interface card |
| CN205571657U (en) * | 2016-03-23 | 2016-09-14 | 大连樱田机械制造有限公司 | Soldering tin prevention device that splashes |
| CN208977024U (en) * | 2018-09-18 | 2019-06-14 | 皮润奇 | One kind preventing scolding tin splinter device |
| CN210296312U (en) * | 2019-08-28 | 2020-04-10 | 深圳赛意法微电子有限公司 | Improved patch mounting equipment |
-
2019
- 2019-08-28 CN CN201910802048.7A patent/CN110534460A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090101628A1 (en) * | 2005-07-28 | 2009-04-23 | Werner Kaeseler | Spot welding cap changer |
| KR100969531B1 (en) * | 2009-12-01 | 2010-07-12 | (주)에이에스티 | Head part of led die bonder |
| CN103785915A (en) * | 2014-01-17 | 2014-05-14 | 浙江田中精机股份有限公司 | Linear tin soldering machine |
| CN105478984A (en) * | 2016-01-07 | 2016-04-13 | 广州市明森机电设备有限公司 | Chip spot-welding device for double-interface card |
| CN205571657U (en) * | 2016-03-23 | 2016-09-14 | 大连樱田机械制造有限公司 | Soldering tin prevention device that splashes |
| CN208977024U (en) * | 2018-09-18 | 2019-06-14 | 皮润奇 | One kind preventing scolding tin splinter device |
| CN210296312U (en) * | 2019-08-28 | 2020-04-10 | 深圳赛意法微电子有限公司 | Improved patch mounting equipment |
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