CN110534288A - A kind of inductor - Google Patents
A kind of inductor Download PDFInfo
- Publication number
- CN110534288A CN110534288A CN201910915577.8A CN201910915577A CN110534288A CN 110534288 A CN110534288 A CN 110534288A CN 201910915577 A CN201910915577 A CN 201910915577A CN 110534288 A CN110534288 A CN 110534288A
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- China
- Prior art keywords
- organic filler
- main body
- inductor
- powder particle
- inductor according
- Prior art date
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Abstract
The invention discloses an inductors, including with coil, surround the magnetic material of the coil and the main body of resin;External electrode is arranged at least one surface of main body.The main body being arranged in inductor includes particle, which can be with external impact of the emollescence on inductor other than acting on magnetic material and resin, and the external impact can be physical impact or thermal shock.
Description
Technical field
The present invention relates to inductors technique fields, are specially related to one kind and are adapted for carrying out large capacity, the power of compact product
Inductor with the module area in one group of electronic product of significant reduction, and realizes high price valve system (SiP) pattern in encapsulation
Block.
Background technique
As electronic product becomes to become increasingly complex and has multiple functions, need it is compact, high current and high capacity
Electronic building brick.When the size for reducing coil is so that when compact power inductor, the inner core for being formed with coil can also be reduced
Body region volume.When the volume of inner core part reduces, inductor it may be easily affected by external stress or thermal shock.
In addition, the power inductor used in a system-in-package (sip) substantially ensures the reliable of its internal environment
Property, and the reliability of power inductor may be influenced by external factor and including material property in a package.Power
Inductor itself.
Summary of the invention
An aspect of this disclosure can provide a kind of inductor, which can effectively disperse may be because acting on
Thermal shock on the inductor and the stress generated, and the inductor can especially prevent the impact being applied thereto by outside
Caused rupture.
According to the one side of the disclosure, inductor may include main body and base resin, which includes that tool is magnetic
Magnetic powder particles.Main body may include the organic filler being dispersed in base resin.
According to another aspect of the present disclosure, a kind of inductor may include: main body comprising coil；And external electrode,
On its outer surface for being arranged in the main body.Main body may include magnetic powder particles, base resin and buffering powder particle.
Detailed description of the invention
Fig. 1 is the schematic sectional view according to the inductor of one embodiment；
Fig. 2 is the amplification of region A shown in FIG. 1；
Fig. 3 be after carrying out thermal shock, deformed shape from organic filler to region A schematic diagram；
Fig. 4 is the schematic sectional view of inductor according to another embodiment；
Fig. 5 is the amplification of region B shown in Fig. 4；
Fig. 6 is to buffer the schematic diagram of the deformed shape of powder particle after carrying out thermal shock to region B；
Fig. 7 A, 7B and 7C are the schematic sectional views for buffering the outside of powder particle.
Specific embodiment
Hereinafter, embodiment of the disclosure will be described with reference to the drawings.
However, the disclosure can carry out example in many different forms, and should not be construed as limited to set forth herein
Specific embodiment.On the contrary, thesing embodiments are provided so that the disclosure will be thorough and complete, and will be to those skilled in the art
Sufficiently convey the scope of the present disclosure.
Throughout the specification, it will be appreciated that, when such as layer, the element of region or chip (substrate) etc is referred to as
" " another element "upper", when " being connected to " or " being coupled to " another element, it, which can be, is directly present in another element "upper",
It " being connected to " or " being coupled to " another element or the other elements be inserted into therebetween.On the contrary, when an element is referred to as " directly
" another element "upper" between them may be without it when " being directly connected to " or " being directly coupled to " another element
His element or layer.In full text, the identical element of identical digital representation.As used herein, term "and/or" includes one or more
Any and all combinations of a associated listed item.
It is readily apparent that although term first, second can be used herein, third etc. describes various components, component,
Region, layer and/or part, but these components, component, region, layer and/or part should not be limited by these clauses.This
A little terms are only used for distinguishing a member, component, region, layer or part and another region, layer or part.Therefore, it is not departing from
In the case where the introduction of exemplary embodiment, first component discussed below, component, region, layer or part can be referred to as the
Two components, component, region, layer or part.
For ease of description, it can be used herein such as " top ", " top ", the sky of " lower section " and " lower section " etc
Between relative terms, to describe relationship of the element relative to another element, as shown in Figure 1.Number.It will be appreciated that removing
Except the orientation described in attached drawing, spatially relative term alsos attempt to cover the different orientation of device in use or operation.Example
Such as, if the device in attached drawing is reversed, the element for being described as " top " or " top " relative to other elements will be opposite
" lower section " or " lower section " is oriented in other elements or feature.Therefore, it is orientated depending on the specific direction of attached drawing, term " on
Above and below orientation can be covered in side ".
Term as used herein only describes specific embodiment, and the present disclosure is not limited thereto.As it is used herein,
" one " of singular, "one" and "the" are also intended to include plural form, unless the context clearly indicates otherwise.It will also be appreciated that
, when used in this manual, term " includes " and/or " comprising " are specified in the presence of stated feature, integer, step
Suddenly, it operates, member, element and/or its group, but without excluding other one or more features, integer, step is operated, at
Member, the presence or addition of element and/or its group.
Hereinafter, example will be described implementation of the disclosure with reference to the schematic diagram for showing embodiment of the disclosure.In attached drawing
In, for example, can estimate the modification of shown shape due to manufacturing technology and/or tolerance.Therefore, embodiment of the disclosure is not answered
It is construed as limited to the specific shape of regions illustrated herein, for example, to include the change in shape caused by manufacturing.Reality below
The mode of applying can also be separately formed or combine composition.
Content of this disclosure described below can have various configurations, and only propose required match herein
It sets, but the present disclosure is not limited thereto.
Hereinafter, inductor according to the embodiment will be described, but the present disclosure is not limited thereto.
Fig. 1 is the schematic sectional view according to the inductor of one embodiment.Figure.Fig. 2 is putting for region A shown in FIG. 1
Big figure.1.
Referring to Fig.1, inductor 100 may include the main body 1 that can be wherein embedded in coil 11, and be arranged in main body 1
The first external electrode 21 and the second external electrode 22 at least one outer surface.
Coil 11 can be the winding type coil formed using winding method, the film type coil or benefit formed using membrane process
The laminated coil formed with layered manner.Hereinafter, as an example, using the thin of film process formation using shown in FIG. 1
Membranous type coil.It will be described referring to Fig.1.Coil 11 may include: supporting member 11 and first coil 11 1 and the second coil
11b is arranged on the surface and on opposite surface, respectively.First and second coil 11 1 and 11b are formed as supporting
Component coating 11, using electroplating technology, can be from the viewpoint of the slimming from inductor is advantageous 100.First via
It is electrically connected the 11 to the second coil of first coil 11b, can be by punching press or drilling, wherein by by region to be formed, In
11 are formed on the thickness direction of the supporting member to form through-hole, and logical by being formed by with conductive material filling
The inside in hole.The through-hole can be formed by coating, perhaps by electroplating technology conductive material plating or can be by filling out
The conductive layer being sintered after conductive paste is filled to be formed.
First and second coil 11 1 and 11b may include that a material has excellent electric conductivity, and possible, example
Such as, golden (Au), silver-colored (Ag), platinum (Pt), at least one (copper is formed) of copper, nickel (Ni), palladium (Pd), aluminium (Al) and titanium (Ti) or
Their alloy, but can use without restriction, as long as it may include common conductive material.
As shown in Fig. 2, main body 1 may include having magnetic magnetic powder particles 12, base resin 13 and organic filler
14, to be embedded in coil.
Magnetic powder particles 12 can be formed by having magnetic magnetic material, for example, Fe, Fe-Ni based alloy, Fe-Si
Based alloy, at least one of Fe-Si-Al based alloy., Fe-Cr-Si based alloy, Fe base noncrystal alloy, the conjunction of Fe base nanometer crystal body
Gold, Co base noncrystal alloy, Fe-Co based alloy, Fe-N based alloy, MnZn based ferrite and NiZn based ferrite.
Base resin 13 can be used to be formed as the epoxy resin of thermosetting resin, and can also use polyimides
Resin is formed as the example of thermosetting resin.
Organic filler 14 may include polymer material, and particularly, can preferably include thermoplastic resin.Example
Such as, organic filler 14 may include acrylonitrile-butadiene-styrene resin (ABS), cellulose acetate, nylon, polymethyl
Sour methyl esters (PMMA), polybenzimidazoles, polycarbonate, polyether sulfone, polyether-ether-ketone (PEEK), polyetherimide (PEI), poly- second
Alkene, polylactic acid, polyformaldehyde, polyphenylene oxide, polyphenylene sulfide, polypropylene, polystyrene, polyvinyl chloride, ethylene vinyl acetate, poly- second
Enol or polyethylene oxide.
Particularly, organic filler 14 can be PMMA pearl.
PMMA pearl can be formed to have close to approximately spherical shape.Here, PMMA pearl can permit organic filler
The significant increase of 14 surface area, therefore be conducive to disperse and remove the external stress for being applied to organic filler 14.
Because PMMA pearl has excellent dispersibility in epoxy resin and magnetic powder particles including Fe, and in temperature
Its physical property has relatively small variation (low modulus) when degree increases, so PMMA pearl is suitably adapted for absorbing stress.Work as heat
Percussion, may be due to mismatching and this thing happens when on PMMA magnetic bead between thermal expansion coefficient (CTE).
Organic filler 14 can have the independent crystal boundary different from magnetic powder particles.In other words, organic filler 14
Different from the magnetic particle with common Magnaglo-organic compound, or with the magnetic formed by insulating material of polymer
The particle of the multilayered structure of property powder particle, inorganic insulation layer and polymer insulation layer.
Organic filler 14 can have the composition different from another organic filler, which fills out with organic
It fills object 14 and is adjacent to dispersion.For example, PMMA pearl can be applied to including on a part of organic filler in the body, and
The acrylic resin that ellipse is formed can also be applied on the rest part of organic filler, this can be according to the material of user
Material design is to select.With required physical property.
Based on the magnetic powder particles 12 of 100 weight %, main body 1 may include 1 weight % or more and 50 weight % are below
The organic filler 14 of base resin 13 and 0.01 weight % or more and 50 weight %.Or it is less.Magnetic powder particles 12, base
Plinth resin 13 and the content of organic filler 14 can change according to the required physical property or environment of inductor 100.Work as basis
When the content of resin 13 is less than 1wt%, the dispersibility of magnetic powder particles 12 also, it is unable to ensure organic filler material sometimes
14, and when the content of base resin 13 is greater than 50 weight %, it is possible to it is unable to get the magnetic permeability of inductor 100.With similar
Mode, when the content of organic filler 14 be less than 0.01wt% when, pooling feature may be unable to give full play.When organic filler 14
Content be greater than 50 weight % when, may include excessive polymer material, it may be difficult to ensure magnetic permeability.
Fig. 3 be on high wind-warm syndrome region A shown in Fig. 2 after, the schematic diagram of the deformed shape of organic filler.
As shown in figure 3, organic filler 14 may be used as buffer, magnetic powder particles 12 and base can be reduced and removed
Stress between plinth resin 13.
Because organic filler 14 has since thermal shock is without being badly deformed and is suitable for dispersing and reducing stress
Low modulus, so being applied to the inside of organic filler 14, therefore organic filler 14 can keep the intensity of body entirety.
When inductor 100 to be mounted in packaging, due between the thermal expansion coefficient for a variety of materials for including in packaging
Mismatch, when field trash occurs, the internal stress of the main body 1 of inductor 100 may be will increase.Thermal shock.This interior
In the case that portion's stress is not properly dispersed or removed, inductor 100 may rupture.According to embodiment, inductor
100 can be solved the above problems by including additional organic filler in main body 1.
It will be briefly described the mechanism for being used as stress buffer including the organic filler 14 in main body 1.Work as inductor
The temperature of 100 main body 1 at high temperature there is the organic filler 14 for stablizing modulus can have due to extreme thermal shock and when increasing
Effect ground absorbs the impact of the mismatch due to caused by the temperature raising of main body 1 or repulsion.It means that working as the temperature liter of main body 1
Gao Shi compared with main body 1 does not include the case where organic filler, is included in main body 1 if main body 1 includes the case where organic filler
In material movement or the variation degree of physical property may be smaller.Organic filler is added with predetermined amount, basis can be reduced
Temperature change, especially to the raised sensibility of temperature.
Even if organic filler 14 is also used as reducing hot shadow in the case where organic filler 14 does not include thermoplastic resin
Loud material, as long as organic filler 14 is the buffering powder particle for indicating certain physical properties.
According to another embodiment, a kind of inductor may include buffering powder particle, which replaces having
Machine filler and have function corresponding with the function for the organic filler for including in vivo.
Fig. 4 is the perspective view of inductor 100' according to another embodiment.Figure.Fig. 4 is different from Fig. 4.1 only in the inductor
Main body 100' include that buffer powder particle replaces organic filler, and including substantially the same component diagram.1.Therefore, weight
It is described again including element in both figures.
Hereinafter, as shown in Figures 1 to 4, the appended drawing reference of corresponding component repeats no more in the accompanying drawings.By using upper
Mark (') indicate Fig. 1 and Fig. 4.
It may include that can wherein be embedded in the main body 1' of coil 11' and be arranged in main body 1' referring to Fig. 4, inductor 100'
At least one outer surface on the first external electrode 21' and the second external electrode 22'.
Fig. 5 is the enlarged drawing of region B shown in Fig. 4.4.Figure.Fig. 6 be high wind-warm syndrome in region B shown in fig. 5 it
Afterwards, the schematic diagram of the deformed shape of powder particle is buffered.5.
The result of study of people according to the present invention, the buffering powder particle 14' of Fig. 3 are formed powdered.Material shown in fig. 5
Material can preferably satisfy following physical property.
Firstly, the glass transition temperature (Tg) of buffering powder particle 14' can have 100 DEG C or more and 200 DEG C or less
Temperature range and thermal expansion coefficient (CTETg.Low) value.Within the temperature range of being lower than glass transition temperature (Tg)
Buffering powder particle 14') be preferably less than the thermal expansion coefficient of buffering powder particle 14' at room temperature
(CTETg.High) value.Higher than the temperature range of glass transition temperature (Tg).In addition, the thermal expansion system of buffering powder particle
14' of number (CTETg.Low) values within the temperature range of being lower than glass transition temperature (Tg) can be preferably 150ppm/K with
Under.
When the glass transition temperature (Tg) for buffering powder particle 14' is more than the temperature range, with pack environment temperature
The variation of degree, buffering powder particle 14' may be not used to steadily disperse or go de-stress.Use inductor 100', inductance
Device 100' may change physical property, and may be insufficiently to serve as stress buffer.
In addition, when the thermal expansion of buffering powder particle 14' within the temperature range of being lower than glass transition temperature (Tg)
The value of coefficient (CTETg.Low) is greater than thermal expansion coefficient (Tg of CTE, high buffering powder particle) 14' and is higher than glass transition temperature
In the range of degree (Tg) or temperature be greater than 150ppm /K, buffering powder particle 14' can become rise in temperature it is excessive
Environment as sensitivity, it is likely that can deform, this may be undesirable.
In addition, buffering powder particle 14' can preferably have 10MPa or more and 1500MPa hardness number below.Hardness number
It can be the index of the degree of the mechanical impact strength about buffering powder particle 14'.
The minute-pressure head according to the load acted on buffering powder particle 14' by measurement displacement such as depth can be passed through
Method obtains hardness number.When the hardness for buffering powder particle 14' is lower than 10MPa, in appropriate dispersion by magnetic powder particles
Or before the stress of epoxy resin generation, the displacement of buffering powder particle 14' may excessively be changed in advance.When buffering powder
When the hardness of grain 14' is higher than 1,500MPa, buffering powder particle 14' may be insensitive to the generation of displacement, reaches buffering powder
The degree of particle 14.
When generating the stress as caused by thermal shock, the outside of buffering powder particle 14' can be changed, and buffer powder
Grain 14' absorbs and is reduced or removed stress, as can be seen that from the comparison between Fig. 1 to Fig. 4.5 and 6." can change above
The meaning of change " can be, and at least part of the initial outward of the buffering powder particle 14' for manufacturing main body 1' is deformed with right
It should be in a part of the outside of Magnaglo.The particle adjacent with buffering powder particle 14'.
The initial outward of buffering powder particle 14' can be spherical shape, as shown in Figure 2.As shown in Figure 7 A, it can be ellipse
Shape, as shown in Figure 7 A.As shown in Figure 7 B, it or may include cross section, include turning in part of it (that is, shape on it
At the curved shape for having recess portion), as shown in Figure 6B.7C.The outside of buffering powder particle 14' is not particularly limited.
As described above, a kind of inductor can be provided according to one embodiment, it can disperse and remove due to acting on
The mismatch between thermal shock and thermal expansion coefficient (CTE) inside inductor and the stress being likely to occur.
Although exemplary embodiment has been shown and described above, will be apparent to those skilled in the art
, in the case where not departing from the scope of the present invention being defined by the following claims, can modify and modification.
Claims (10)
1. a kind of inductor, comprising: the main body including coil；With the external electrode in setting outside the main body surface, wherein main body
It further comprise having magnetic magnetic powder particles, base resin and organic filler.
2. inductor according to claim 1, wherein the organic filler has the crystalline substance with the magnetic powder particles
The different crystal boundary in boundary, and the organic filler is randomly dispersed in the base resin together with the magnetic powder particles
In.
3. inductor according to claim 1, wherein the organic filler is thermoplastic resin.
4. inductor according to claim 3, wherein the organic filler includes acrylonitrile-butadiene-styrene (ABS)
(ABS), cellulose acetate, nylon, polymethyl methacrylate (PMMA), polybenzimidazoles, polycarbonate, polyether sulfone, polyethers
Ether ketone (PEEK), polyetherimide (PEI), polyethylene, polylactic acid, polyformaldehyde, polyphenylene oxide, polyphenylene sulfide, polypropylene, polyphenyl second
Alkene, polyvinyl chloride, ethylene vinyl acetate, polyvinyl alcohol or polyethylene oxide.
5. inductor according to claim 4, wherein the organic filler is polymethyl methacrylate pearl.
6. inductor according to claim 1, wherein the composition of the organic filler is different from and the organic filler phase
The composition of adjacent another organic filler.
7. inductor according to claim 1, wherein the base resin is epoxy resin or polyimide resin.
8. inductor according to claim 1, wherein the 100 weight % based on the magnetic powder particles, the basis
The content of resin is 1 weight % to 50 weight %, and the content of the organic filler is 0.01 weight % to 50 weight %.
9. a kind of inductor, comprising: the main body including coil；With the external electrode in setting outside the main body surface, wherein main body
It further comprise having magnetic magnetic powder particles, base resin and buffering powder particle.
10. inductor according to claim 9, wherein glass transition temperature (Tg) value of the buffering powder particle
For 100 DEG C or more and 200 DEG C hereinafter, thermal expansion coefficient (CTETg.Low) is 1.0 DEG C, it is being lower than glass transition temperature (Tg)
Within the temperature range of buffering powder particle be less than be higher than glass within the temperature range of buffering powder particle thermal expansion system
(CTETg.Low is lower than glass transition temperature for the value of the value transition temperature (Tg) of number (CTETg.High) and thermal expansion coefficient
(Tg) within the temperature range of, the α of powder particle is buffered) it is 150ppm/K or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910915577.8A CN110534288A (en) | 2019-09-26 | 2019-09-26 | A kind of inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910915577.8A CN110534288A (en) | 2019-09-26 | 2019-09-26 | A kind of inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110534288A true CN110534288A (en) | 2019-12-03 |
Family
ID=68670227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910915577.8A Withdrawn CN110534288A (en) | 2019-09-26 | 2019-09-26 | A kind of inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110534288A (en) |
-
2019
- 2019-09-26 CN CN201910915577.8A patent/CN110534288A/en not_active Withdrawn
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Application publication date: 20191203 |