CN110530693B - Method for measuring flow stress and flow stress-strain curve of metal film material - Google Patents
Method for measuring flow stress and flow stress-strain curve of metal film material Download PDFInfo
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Abstract
The invention provides a method for measuring the flow stress and the flow stress-strain curve of a metal film material, belonging to the field of heat/force simulation experiments. The method comprises the steps of depositing a metal film material to be tested on a material with the same or similar volume as the metal film material to be tested to obtain a sample, overlapping and sealing the two samples together in a contact mode of the metal film to be tested to form a compression sample, and performing a compression experiment; and measuring the diameter of the metal film in the compressed sample at a certain height reduction rate to obtain the flow stress of the metal film to be measured at the corresponding height reduction rate. And carrying out an isothermal constant strain rate compression experiment on the compression sample with different height reduction rates, respectively obtaining a series of flow stress and strain of the metal film to be detected by measuring the diameter and the thickness of the film in the compression sample with the series of height reduction rates, and establishing a flow stress and a flow stress-strain curve of the metal film material to be detected. The invention overcomes the problem that the metal film cannot be directly processed into the sample size required by the compression experiment because of being too thin.
Description
Technical Field
The invention belongs to the technical field of heat/force simulation experiments, and particularly relates to a method for measuring flow stress and a flow stress-strain curve of a metal film material.
Background
SiCfthe/Ti composite material is an important candidate structural material of the ultra-high sound speed aerospace craft and the next generation advanced aeroengine due to high specific strength, high specific stiffness and good high temperature resistance. SiCfThe most common preparation method of the/Ti composite material is as follows: firstly, SiC is addedfDepositing a layer of thin film titanium alloy coating with the thickness within 100 mu m on the fiber by a PVD (physical vapor deposition) process to obtain SiCfA Ti precursor wire; then mixing SiCfStacking Ti precursor wires according to hexagonal arrangement and putting the Ti precursor wires into a titanium alloy sheath for vacuum sealing welding to obtain SiCfA Ti preform; finally to SiCfHot Pressing (HP) or Hot Isostatic Pressing (HIP) densification of the/Ti preform to obtain fully dense SiCfa/Ti composite material.
From SiCfPreparation of fully dense SiC from Ti preformfthe/Ti composite material is made of SiCfThe PVD thin film titanium alloy on the Ti precursor wire is realized by plastic flow and creep deformation in the HP or HIP process. Therefore, it is possible to use the HP or HIP process to convert SiCfthe/Ti preform can be fully densified and depends on the plastic deformation capacity and deformation resistance of the PVD film titanium alloyThe magnitude of force and deformation resistance is closely related to the selection of HP or HIP process, and reasonable HP or HIP process can enable the PVD thin-film titanium alloy to present large plastic deformation capacity and small deformation resistance, which can help SiCfFull densification of the/Ti preform. In order to develop a reasonable HP or HIP process, the plastic flow behavior of PVD thin film titanium alloys at different temperatures and strain rates must be studied and clarified in advance. For this reason, the flow stress and the flow stress-strain curve of the PVD thin film titanium alloy at different temperatures, different strain rates and different strains need to be tested.
The traditional trial and error method is adopted to carry out HP or HIP process design and optimization, time and labor are consumed, cost is high, and the requirements of efficient and low-cost production cannot be met. Analyzing and optimizing SiC using finite element numerical simulation techniquesfThe HP or HIP process of the/Ti preform would be advantageous to solve this problem. However, to optimize the HP or HIP process by finite element numerical simulation techniques, the flow stress constitutive relation of the deformed material needs to be established. For this reason, it is also necessary to test the flow stress and flow stress-strain curve of the PVD thin film titanium alloy at different temperatures, different strain rates and different strains. In addition, the flow stress and the flow stress-strain relationship curve are also the main basis for correctly selecting the tonnage of the HP or HIP equipment.
In summary, the flow stress and the flow stress-strain curve of the PVD film titanium alloy under different temperatures, different strain rates and different strains are tested by calculating the deformation resistance of the PVD film titanium alloy and reasonably formulating SiCfThe method comprises the steps of performing HP or HIP process on a/Ti preform, correctly selecting tonnage of HP or HIP equipment, accurately constructing a flow stress constitutive relation of the PVD thin-film titanium alloy, and optimizing basic data of the HP or HIP process by adopting a finite element technology.
For volume materials, compression experiments or tensile experiments are generally adopted to obtain flow stress data and flow stress-strain curves of the material at different temperatures, different strain rates and different strains, and the flow stress data and the flow stress-strain curves can be directly output by special data acquisition software configured by experimental equipment. However, for the PVD thin film material, since the thickness dimension is too small to be directly processed into the sample dimension required for the compression experiment or the tensile experiment (for example, the common compression sample dimension is Φ 8 × 12mm), the flow stress data and the flow stress-strain curve of the metal thin film material cannot be obtained directly by the conventional compression experiment or the tensile experiment.
Therefore, it is necessary to provide a method for testing the flow stress and the flow stress-strain curve of the metal thin film material, and the method has important application value.
Disclosure of Invention
In view of the above, the present invention is directed to a method for measuring flow stress and a flow stress-strain curve of a metal thin film material. The method of the invention overcomes the problem that the flowing stress can not be obtained by directly processing the metal film material into the sample size required by the compression experiment to carry out the compression experiment because the metal film material is too thin.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides a method for measuring flow stress of a metal film material, which comprises the following steps:
selecting a volume material with the same or similar components as the metal film material to be detected as a matrix, and processing the matrix into a sample of phi 8mm X (6-X) mm, wherein: x is the thickness of the metal film material to be measured;
depositing a layer of metal film material to be measured with the thickness of Xmm at one end of the sample of phi 8mm multiplied by (6-X) mm to obtain the sample of phi 8mm multiplied by 6 mm;
stacking two identical phi 8mm multiplied by 6mm samples according to a mode that metal thin film materials to be detected are mutually contacted, and sealing and welding the samples to be connected to obtain a phi 8mm multiplied by 12mm compressed sample;
set temperature T0And strain rate
Carrying out isothermal constant strain rate compression experiment on the compressed sample, and compressing the compressed sample to a certain set height HiObtaining a compressed sample; the height reduction HRR of the compressed sampleiIs (12-H)i) 12 and obtaining a high reduction HRRiDeformation load P corresponding to time compression samplei；
Determining the diameter d of the metal film material to be measured in the compressed sampleiObtaining the temperature T of the metal film material to be measured by using the formula (1)0Strain rate
And high reduction HRRiFlow stress ofi；
σi＝Pi/(0.25πdi 2) Formula (1);
wherein: sigmaiFlow stress, MPa; piIs the deformation load, N; diFor high reduction HRRiThe diameter m of the metal film material to be measured in the sample is compressed.
Preferably, the preparation method of the metal film material to be detected on the sample comprises physical vapor deposition; the thickness X of the metal film material to be detected obtained by physical vapor deposition is 60-100 mu m.
The invention also provides a method for measuring the flow stress-strain curve of the metal film material, which comprises the following steps:
(1) the method according to any one of claims 1 to 2, wherein the temperature T is obtained at a set temperature0And strain rate
Compressing the compressed sample to a series of high reduction ratios HRRiFlow stress sigma of metal film material to be measured of corresponding compression samplei；
(2) Measuring the height reduction rate HRR of the series of step (1)iCompressing the thickness h of the metal film material to be measured in the sampleiObtaining a series of height reduction ratios HRR by using a formula (2)iCompressing the strain of the metal film material to be measured in the samplei；
i＝-ln(hi/(2X)) formula (2);
wherein:iis strain; h isiFor a series of high reduction ratios HRRiCompressing the thickness of the metal film material to be detected in the sample to be micrometer;
(3) the HRR is the serial height reduction rate obtained in the step (1)iFlow stress σ of compressed sampleiAs a ordinate, obtaining a series of height reduction ratios HRR in the step (2)iStrain of compressed sampleiIs an abscissa, and the obtained sigma-curve is the set temperature T of the metal film material0And strain rate
Lower flow stress-strain curve;
the steps (1) and (2) are not limited in time.
Preferably, h is obtainediThe method comprises the following steps: HRR is the reduction rate of the series of heightsiThe compressed sample is cut in half along the axial direction, and the HRR of the serial height reduction rate is measured in a metallographic microscopeiCompressing the thickness h of the metal film material to be measured in the samplei。
The invention provides a method for measuring the flow stress of a metal film material, which comprises the steps of depositing a metal film material to be measured on a volume material with the same or similar components to the metal film material to obtain a sample, overlapping and sealing the two samples together in a contact mode of the metal film to be measured to form a compression sample, and carrying out a compression experiment; and measuring the diameter of the metal film material in the compressed sample at a certain height reduction rate to obtain the flow stress of the metal film material to be measured at the corresponding height reduction rate. The method of the invention overcomes the problem that the flowing stress can not be obtained by directly processing the metal film material into the sample size required by the compression experiment to carry out the compression experiment because the metal film material is too thin.
The invention also provides a method for measuring the flow stress-strain curve of the metal film material, which comprises the steps of obtaining a series of compression samples of the high reduction rate after a series of compression experiments of the high reduction rate, and obtaining the flow stress and the strain of the metal film material to be measured in the series of compression samples under the corresponding deformation degree by measuring the diameter and the thickness of the metal film material in the series of compression samples of the high reduction rate; and obtaining a flow stress-strain curve of the metal film material based on the flow stress and strain data of the metal film material to be detected under the series of deformation degrees. The flow stress-strain curve obtained by the determination method has high accuracy.
Drawings
FIG. 1 is a schematic representation of a sample of phi 8mm X (6-X) mm provided by the present invention;
FIG. 2 is a schematic structural diagram of a sample of phi 8mm × 6mm formed after deposition of a metal thin film material of Xmm thickness according to the present invention;
FIG. 3 is a schematic structural diagram of a compressed sample of 8mm by 12mm in diameter provided by the present invention;
FIG. 4 is a schematic diagram of a sample of 8mm by 5.9mm in diameter provided by an embodiment of the present invention;
FIG. 5 is a schematic diagram of a sample of 8mm by 6mm in diameter provided by an embodiment of the present invention;
FIG. 6 is a schematic diagram of a sample of 8mm by 12mm in diameter provided by an embodiment of the present invention;
FIG. 7 shows PVD thin film materials provided by embodiments of the invention with a temperature of 850 ℃ and a strain rate of 0.001s-1Schematic of the flow stress-strain curve below.
Detailed Description
The invention provides a method for measuring flow stress of a metal film material, which comprises the following steps:
selecting a volume material with the same or similar components as the metal film material to be detected as a matrix, and processing the matrix into a sample of phi 8mm X (6-X) mm, wherein: x is the thickness of the metal film material to be measured;
depositing a layer of metal film material to be measured with the thickness of Xmm at one end of the sample of phi 8mm multiplied by (6-X) mm to obtain the sample of phi 8mm multiplied by 6 mm;
stacking two identical phi 8mm multiplied by 6mm samples according to a mode that metal thin film materials to be detected are mutually contacted, and sealing and welding the samples to be connected to obtain a phi 8mm multiplied by 12mm compressed sample;
set temperature T0And strain rate
Subjecting the compressed sample to isothermal constant strain rate compressionExperiment, compressing the compressed sample to a certain set height HiObtaining a compressed sample; the height reduction HRR of the compressed sampleiIs (12-H)i) 12 and obtaining a high reduction HRRiDeformation load P corresponding to time compression samplei；
Determining the diameter d of the metal film material to be measured in the compressed sampleiObtaining the temperature T of the metal film material to be measured by using the formula (1)0Strain rate
And high reduction HRRiFlow stress ofi；
σi＝Pi/(0.25πdi 2) Formula (1);
wherein: sigmaiFlow stress, MPa; piIs the deformation load, N; diFor high reduction HRRiThe diameter m of the metal film material to be measured in the sample is compressed.
The invention selects a volume material with the same or similar components as the metal film material to be detected as a matrix, and processes the matrix into a sample of phi 8mm X (6-X) mm, wherein: and X is the thickness of the metal film material to be measured.
The method for processing the volume material into the sample is not particularly limited as long as the sample with the corresponding size can be obtained. In the present invention, the size of the sample is Φ 8mm × (6-X) mm, and the schematic view of the structure is shown in fig. 1.
The invention selects the volume material with the same or similar components as the metal film to be measured as the matrix, so that the plastic deformation capacity of the volume material is close to that of the metal film material, the volume material and the metal film material to be measured can be ensured to generate the plastic deformation which is approximately equivalent in the compression process, and the measurement of the flow stress and the strain of the metal film material to be measured is favorably realized. If the volume material has large deformability and the metal film material to be tested has poor deformability, the deformation in the compression process mainly occurs in the volume material, and the metal film material to be tested hardly or rarely deforms, so that the test purpose is difficult to realize; on the contrary, if the volume material has poor deformability and the metal thin film material to be tested has large deformability, the deformation of the compression process mainly occurs in the metal thin film material layer to be tested in the early stage, so that the metal thin film material to be tested is extruded (flowed) in the early stage of the deformation, and the metal thin film material layer to be tested remains a lot, and the test purpose is difficult to achieve.
After a phi 8 mmX (6-X) mm sample is obtained, a layer of metal film material to be measured with the thickness of Xmm is deposited at one end of the phi 8 mmX (6-X) mm sample, and the phi 8 mmX 6mm sample is obtained.
The invention does not specifically limit the components of the metal film material to be measured, and a person skilled in the art can set the metal film material to be measured according to actual needs. The method for depositing the metal film material to be detected and the thickness of the deposited metal film to be detected are not particularly limited, and can be selected by a person skilled in the art according to actual needs. In the embodiment of the invention, the mode of depositing the metal film material to be detected on the sample is preferably Physical Vapor Deposition (PVD), and the thickness X of the PVD-deposited metal film material to be detected is preferably 60-100 μm; the invention does not specifically limit the parameters of the PVD deposition metal thin film material to be measured, and adopts the technical scheme known by the technical personnel in the field. The thickness of the PVD deposited metal film material to be measured is adjusted to be 60-100 mu m, so that the metal film material to be measured is guaranteed to have a certain thickness after being compressed and deformed and can be accurately measured; meanwhile, the metal film material to be measured and the volume material have proper bonding strength, so that the metal film material to be measured is not easy to fall off after sample preparation and compression experiments, and the measurement of flow stress and strain is facilitated.
In the invention, a layer of metal film material to be measured with the thickness of Xmm is deposited on a sample of phi 8mm X (6-X) mm shown in figure 1 to obtain a sample of phi 8mm X6 mm, and the structural schematic diagram is shown in figure 2.
After obtaining a phi 8mm multiplied by 6mm sample, the invention stacks two same phi 8mm multiplied by 6mm samples according to the mode that metal film materials to be measured are contacted with each other, and seals and welds the samples to obtain a phi 8mm multiplied by 12mm compressed sample.
In the invention, the samples are stacked in a manner that one sides of the metal film materials to be measured of the two samples are contacted with each other.
The parameters of the sealing connection are not particularly limited, and the sealing parameters known to those skilled in the art can be adopted. The purpose of the sealing connection of the present invention is to form a complete compression sample from two samples, i.e. to seal the outer surface of two samples of phi 8mm x 6mm stacked together by one turn, with a shallow depth of weld, so that the effect of the weld zone is negligible. In the present invention, a schematic view of the structure of a compressed sample obtained by stacking the samples shown in FIG. 2 in the manner provided by the present invention is shown in FIG. 3.
After obtaining a compressed sample with phi 8mm multiplied by 12mm, the invention sets the temperature T0And strain rate
Carrying out isothermal constant strain rate compression experiment on the compressed sample, and compressing the compressed sample to a certain set height HiObtaining a compressed sample; the height reduction HRR of the compressed sampleiIs (12-H)i) 12 and obtaining a high reduction HRRiDeformation load P corresponding to time compression samplei。
The invention is suitable for the temperature T0And strain rate
The setting of (A) has no special requirements, and the skilled person can select the setting according to the actual needs. In the present invention, the compression test is preferably performed on a hot working simulation tester. In the present invention, the deformation load P of the compressed sampleiAnd directly outputting and reading the data through special data acquisition software configured by the thermal processing simulation testing machine.
Obtaining the high reduction ratio HRRiAfter the sample is compressed, the diameter d of the metal film material to be measured in the compressed sample is measured by the inventioniObtaining the metal film material to be measured by using the formula (1)Temperature T0Strain rate
And high reduction HRRiFlow stress ofi；
σi＝Pi/(0.25πdi 2) Formula (1);
wherein: sigmaiFlow stress, MPa; piIs the deformation load, N; diFor high reduction HRRiThe diameter, m, of the metal thin film material to be measured in the compressed sample.
The method for obtaining the diameter of the metal film material to be measured in the compressed sample is not particularly limited, and a measuring method known to those skilled in the art can be adopted.
The invention also provides a method for measuring the flow stress-strain curve of the metal film material, which comprises the following steps:
(1) the method according to any one of claims 1 to 2, wherein the temperature T is obtained at a set temperature0And strain rate
Compressing the compressed sample to a series of high reduction ratios HRRiFlow stress sigma of metal film material to be measured of corresponding compression samplei；
(2) Measuring the height reduction rate HRR of the series of step (1)iCompressing the thickness h of the metal film material to be measured in the sampleiObtaining a series of height reduction ratios HRR by using a formula (2)iCompressing the strain of the metal film material to be measured in the samplei；
i＝-ln(hi/(2X)) formula (2);
wherein:iis strain; h isiFor a series of high reduction ratios HRRiCompressing the thickness of the metal film material to be detected in the sample to be micrometer;
(3) the HRR is the serial height reduction rate obtained in the step (1)iFlow stress σ of compressed sampleiAs ordinate, in the steps(2) Obtaining a series of high reduction ratios HRRiStrain of compressed sampleiIs an abscissa, and the obtained sigma-curve is the set temperature T of the metal film material0And strain rate
Lower flow stress-strain curve;
the steps (1) and (2) are not limited in time.
According to the measuring method of the technical scheme, the temperature T at the set temperature is obtained0And strain rate
Compressing the compressed sample to a series of high reduction ratios HRRiThe flow stress sigma of the metal film material to be measured in the corresponding compression samplei。
The invention compresses the compressed sample to a series of high reduction ratios HRRiIn the compression experiment, the set number of the high reduction ratios is not specifically limited, and for the same set temperature and the same set strain ratio, the more the set number of the high reduction ratios is, the more the flow stress and strain data of the series of high reduction ratio compression samples are measured, and the smoother the flow stress-strain curve is obtained; meanwhile, the more the set series of height reduction rate values are, the more the measurement times and the cost are obviously increased; therefore, those skilled in the art can determine the number of the series of the draft ratios according to the purpose and need of use.
After setting a series of height reduction rate values and numbers, the invention does not specifically limit the difference between every two or several height reduction rate values, and the skilled in the art can select the values according to the interest and the need, wherein the values are dense near the interested deformation degree and sparse near the uninteresting deformation degree. For example, the regions are dense near peak flow stress and sparse in the non-peak flow stress regions.
The invention measures the HRR of the series of high reduction ratiosiCompressing the thickness h of the metal film material to be measured in the sampleiObtaining a series of height reduction ratios HRR by using a formula (2)iCompressing the strain of the metal film material to be measured in the samplei；
i＝-ln(hi/(2X)) formula (2);
wherein:iis strain; h isiFor a series of high reduction ratios HRRiAnd compressing the thickness of the metal film material to be detected in the sample, wherein the thickness is mum.
In the present invention, h is obtainediThe method (2) is preferably: HRR is the reduction rate of the series of heightsiThe compressed sample is cut in half along the axial direction, and the HRR of the serial height reduction rate is measured in a metallographic microscopeiCompressing the thickness h of the metal film material to be measured in the samplei。
After the flow stress and the strain of a series of high reduction rate compression samples are obtained, the method uses the series of high reduction rate HRRiFlow stress σ of compressed sampleiAs ordinate, in the series of height reduction ratios HRRiStrain of compressed sampleiIs an abscissa, and the obtained sigma-curve is the set temperature T of the metal film material0And strain rate
Flow stress-strain curve below.
According to the method, the flow stress and the strain of the metal film material to be detected are respectively obtained by obtaining the diameter and the thickness of the metal film material to be detected in the compression sample, so that the accuracy of the flow stress and the strain of the metal film material to be detected is improved, and an accurate flow stress-strain curve of the metal film material is obtained.
In the present invention, the set temperature is changed to TiAt a strain rate of
According to the method for measuring the flow stress-strain curve of the metal film material in the technical scheme, the metal film material to be measured at the set temperature T can be obtainediAnd strain rate
Flow stress-strain curve below.
The following will describe the method for measuring the flow stress and the flow stress-strain curve of the metal thin film material provided by the present invention in detail with reference to the examples, but they should not be construed as limiting the scope of the present invention.
Example 1
The metal film material to be detected is TC17 titanium alloy; the components of the volume material are consistent with those of the metal film to be detected and are also TC17 titanium alloy;
a method for determining a flow stress-strain curve of a thin metal film material, comprising the steps of:
the TC17 titanium alloy volume material is processed into a test sample with the size of phi 8mm multiplied by 5.9mm, and the structure schematic diagram is shown in FIG. 4;
depositing a metal thin film material to be measured with the thickness of 100 microns on one end face of the sample through PVD to obtain a sample with the diameter of 8mm multiplied by 6.0mm, wherein the structural schematic diagram is shown in figure 5;
two identical phi 8mm multiplied by 6.0mm samples are overlapped in a mode that metal films to be measured are mutually contacted and are sealed and welded to obtain phi 8mm multiplied by 12mm compressed samples, and the structural schematic diagram is shown in figure 6;
set temperature 850 ℃ and strain rate 0.001s-1Carrying out isothermal constant strain rate compression experiments on the compressed sample with different height reduction rates (the height reduction rates are respectively 5%, 8%, 15%, 25%, 35%, 45%), obtaining 6 height reduction rate samples, and directly obtaining the deformation load P of the 6 height reduction ratesi(KN)(Pi1.39, 2.06, 2.04, 1.52, 1.78, 2.02), respectively);
measuring the diameter d of the metal film material to be measured in the 6 high reduction rate compression samplesi(mm)(di8.5, 9.6, 9.9, 10.9, 11.7, 12.2) and a thickness h, respectivelyi(μm)(hi187, 182, 157, 132, 107, 83, respectively), using equations (1) and (2), respectively, to obtain 6 flow stresses σi(MPa)(σiAre respectively 24.49, 28.62, 26.31, 21.83 and 18.48, 17.22) and 6 strainsi(i0.064, 0.091, 0.24, 0.41, 0.62, 0.87, respectively);
σi＝Pi/0.25πdi 2formula (1);
i＝-ln(hi/200)) formula (2);
at 6 strainsiOn the abscissa, the 6 flow stresses σ corresponding to the strainiAs ordinate, the strain rate of 0.001s at a temperature of 850 ℃ was obtained-1Next, a flow stress-strain curve of the PVD test metal thin film material is shown in fig. 7.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (4)
1. A method for measuring flow stress of a metal film material is characterized by comprising the following steps:
selecting a volume material with the same or similar components as the metal film material to be detected as a matrix, and processing the matrix into a sample of phi 8mm X (6-X) mm, wherein: x is the thickness of the metal film material to be measured;
depositing a layer of metal film material to be measured with the thickness of X mm at one end of the sample of phi 8mm multiplied by (6-X) mm to obtain the sample of phi 8mm multiplied by 6 mm;
stacking two identical phi 8mm multiplied by 6mm samples according to a mode that metal thin film materials to be detected are mutually contacted, and sealing and welding the samples to be connected to obtain a phi 8mm multiplied by 12mm compressed sample;
set temperature T0And strain rate0Carrying out isothermal constant strain rate compression experiment on the compressed sample, and compressing the compressed sample to a certain set height HiObtaining a compressed sample; the height reduction HRR of the compressed sampleiIs (12-H)i) 12 and obtaining a high reduction HRRiDeformation load P corresponding to time compression samplei；
Determining the diameter d of the metal film material to be measured in the compressed sampleiObtaining the temperature T of the metal film material to be measured by using the formula (1)0Strain rate0And high reduction HRRiFlow stress ofi；
σi＝Pi/(0.25πdi 2) Formula (1);
wherein: sigmaiFlow stress, MPa; piIs the deformation load, N; diFor high reduction HRRiThe diameter m of the metal film material to be measured in the sample is compressed.
2. The method according to claim 1, wherein the method for preparing the metal thin film material to be measured on the sample comprises physical vapor deposition; the thickness X of the metal film material to be detected obtained by physical vapor deposition is 0.06-0.1.
3. A method for determining a flow stress-strain curve of a metal thin film material, comprising the steps of:
(1) the method according to any one of claims 1 to 2, wherein the temperature T is obtained at a set temperature0And strain rate0Compressing the compressed sample to a series of high reduction ratios HRRiFlow stress sigma of metal film material to be measured of corresponding compression samplei；
(2) Measuring the height reduction rate HRR of the series of step (1)iCompressing the thickness h of the metal film material to be measured in the sampleiObtaining a series of height reduction ratios HRR by using a formula (2)iCompressing the strain of the metal film material to be measured in the samplei；
i＝-ln(hi/(2X)) formula (2);
wherein:iis strain; h isiFor a series of high reduction ratios HRRiCompressing the thickness, mm, of the metal film material to be detected in the sample;
(3) the HRR is the serial height reduction rate obtained in the step (1)iCompression sampleFlow stress sigma of productiAs a ordinate, obtaining a series of height reduction ratios HRR in the step (2)iStrain of compressed sampleiIs an abscissa, and the obtained sigma-curve is the set temperature T of the metal film material0And strain rate0Lower flow stress-strain curve;
the steps (1) and (2) are not limited in time.
4. The assay according to claim 3, wherein h is obtainediThe method comprises the following steps: HRR is the reduction rate of the series of heightsiThe compressed sample is cut in half along the axial direction, and the HRR of the serial height reduction rate is measured in a metallographic microscopeiCompressing the thickness h of the metal film material to be measured in the samplei。
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