CN110519424A - The shell and electronic equipment of electronic equipment - Google Patents
The shell and electronic equipment of electronic equipment Download PDFInfo
- Publication number
- CN110519424A CN110519424A CN201910768138.9A CN201910768138A CN110519424A CN 110519424 A CN110519424 A CN 110519424A CN 201910768138 A CN201910768138 A CN 201910768138A CN 110519424 A CN110519424 A CN 110519424A
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- shell
- electronic equipment
- irradiation unit
- equipment according
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
This application discloses the shell of a kind of electronic equipment and electronic equipment, electronic equipment has Anneta module, and Anneta module is located at the inside of shell, and shell includes ontology, and ontology includes: matrix and irradiation unit.The mounting hole for running through matrix along the thickness direction of matrix is formed on matrix, irradiation unit is mounted in mounting hole, and irradiation unit is suitable for being oppositely arranged with Anneta module, and the dielectric constant of irradiation unit is less than the dielectric constant of matrix.According to the shell of the electronic equipment of the embodiment of the present application, it is possible to reduce signal passes through the loss generated when shell, and the selection of matrix can be made more flexible, and while thereby may be ensured that the mechanical performance of shell, the gain and efficiency of Anneta module can be improved.
Description
Technical field
This application involves technical field of electronic equipment, more particularly, to the shell and electronic equipment of a kind of electronic equipment.
Background technique
In the related technology, such as the shell of the electronic equipments such as mobile phone is difficult to combine shell due to the limitation of its structure
Mechanical performance and influence to signal.For example, shell have preferable mechanical performance when, signal pass through shell when loss compared with
Greatly；When shell influences smaller for the loss of signal, the mechanical performance of entire shell not can guarantee.
Summary of the invention
Present applicant proposes the shell of a kind of electronic equipment, which has good mechanical performance and antenna can be improved
The gain and efficiency of module.
The application also proposed a kind of electronic equipment with above-mentioned shell.
According to the shell of the electronic equipment of the application first aspect embodiment, the electronic equipment has Anneta module, institute
The inside that Anneta module is located at the shell is stated, the shell includes ontology, and the ontology includes: matrix, shape in described matrix
At have along described matrix thickness direction run through described matrix mounting hole；Irradiation unit, the irradiation unit are mounted on the installation
In hole, the irradiation unit is suitable for being oppositely arranged with the Anneta module, and the dielectric constant of the irradiation unit is less than described matrix
Dielectric constant.
According to the shell of the electronic equipment of the embodiment of the present application, by by the ontology of shell be arranged to include dielectric constant not
Two same parts, can make the structure of shell and selection more flexible, due to the irradiation unit being oppositely arranged with Anneta module
Dielectric constant it is smaller, it is possible to reduce the loss that generates when signal passes through shell.And it is possible to make the selection of matrix more clever
It is living, such as matrix can select the material of good mechanical property to be made, it, can be with while thereby may be ensured that the mechanical performance of shell
Improve the gain and efficiency of Anneta module.
According to the electronic equipment of the application second aspect embodiment, comprising: shell, the shell are above-mentioned according to the application
The shell of the electronic equipment of first aspect embodiment；Display screen component, the display screen component are connected with the shell, described aobvious
Installation space is limited between display screen component and the shell；Mainboard, the mainboard are located in the installation space, the display
Screen assembly is electrically connected with the mainboard；Anneta module, Anneta module are located in the installation space and are electrically connected with the mainboard.
It can make the structure and choosing of shell by the way that above-mentioned shell is arranged according to the electronic equipment of the embodiment of the present application
Material is more flexible, it is ensured that while the mechanical performance of shell, the gain and efficiency of Anneta module can be improved.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the main view according to the shell of the electronic equipment of some embodiments of the application；
Fig. 2 is the partial cutaway view according to the shell of the electronic equipment of some embodiments of the application；
Fig. 3 is the partial cutaway view according to the shell of the electronic equipment of the application other embodiments；
Fig. 4 is the partial cutaway view according to the shell of the electronic equipment of the other embodiment of the application；
Fig. 5 is illustrated according to the Anneta module of the electronic equipment of some embodiments of the application and the relative position of irradiation unit
Figure；
Fig. 6 is illustrated according to the Anneta module of the electronic equipment of the application other embodiments and the relative position of irradiation unit
Figure；
Fig. 7 is the schematic diagram according to the electronic equipment of some embodiments of the application.
Appended drawing reference:
Electronic equipment 100；
Shell 1；
Ontology 11；Matrix 111；Main part 1111；Frame portion 1112；Irradiation unit 112；First radiant section 1121；Second radiation
Section 1122；Second step face 1123；First terrace 113；
Adhesive-layer 12；Decorative layer 13；
Mainboard 2；Anneta module 3；
Display screen component 5.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
Below with reference to Fig. 1-Fig. 6 description according to the shell 1 of the electronic equipment of the embodiment of the present application.
As shown in figs 1 to 6, according to the shell 1 of the electronic equipment of the application first aspect embodiment, the electronic equipment
100 have an Anneta module 3, and Anneta module 3 is located at the inside of shell 1, and (" inside of shell 1 " refers to the neighbouring electricity of shell 1
The side at the center of sub- equipment 100).
Specifically, shell 1 includes ontology 11, ontology 11 includes: matrix 111 and irradiation unit 112.It is formed on matrix 111
Have a mounting hole for running through matrix 111 along the thickness direction of matrix 111, the cross section of mounting hole can for round, polygon (such as
Rectangle), ellipse etc..Irradiation unit 112 is mounted in mounting hole, and the size of irradiation unit 112 is adapted with mounting hole, irradiation unit
112 are suitable for being oppositely arranged with Anneta module 3, and the dielectric constant of irradiation unit 112 is less than the dielectric constant of matrix 111.
When the shell 1 is used for electronic equipment 100, since irradiation unit 112 and Anneta module 3 are oppositely arranged, antenna mould
The signal wave that block 3 emits is essentially across irradiation unit 112 to external radiation.Since the dielectric constant of irradiation unit 112 is less than matrix 111
Dielectric constant all partially passes through compared with external radiation from matrix 111 with signal wave, it is possible to reduce Anneta module 3 is to external radiation
The loss generated when signal wave improves the antenna performance of complete machine so as to improve the gain and efficiency of Anneta module 3.Also,
The selection of matrix 111 can be made more flexible, such as matrix 111 can select the material of good mechanical property to be made, so as to
It to guarantee the mechanical performance of shell 1, such as can make shell 1 that integrally there is preferable structural strength, toughness etc., meet and use
It is required that.
Certainly, when Anneta module 3 receives signal, external signal wave can pass through irradiation unit 112 and reach Anneta module 3,
The loss generated when can also reduce signal wave across shell 1 mentions so that Anneta module 3 can receive stronger signal wave
The antenna performance of high complete machine.
It should be noted that irradiation unit 112 is nonmetal parts, such as irradiation unit 112 can be ceramic member, glass workpiece, tree
Rouge part etc..The material of matrix 111 with no restriction, meets requirement, for example, matrix 111 can for metalwork, ceramic member,
Glass workpiece, resin piece etc..
According to the shell 1 of the electronic equipment of the embodiment of the present application, by the way that the ontology 11 of shell 1 is arranged to include that dielectric is normal
Two different parts of number, can make the structure of shell 1 and selection more flexible, due to what is be oppositely arranged with Anneta module 3
The dielectric constant of irradiation unit 112 is smaller, it is possible to reduce signal passes through the loss generated when shell 1.And it is possible to make matrix
111 selection is more flexible, such as matrix 111 can select the material of good mechanical property to be made, and thereby may be ensured that shell 1
While mechanical performance, the gain and efficiency of Anneta module 3 can be improved.
According to some embodiments of the present application, the dielectric constant of irradiation unit 112 is less than 5.Radiation is passed through in signal wave as a result,
When portion 112, loss can be preferably reduced, guarantee transmitting and receives the intensity of signal.
According to some embodiments of the present application, the dielectric loss of irradiation unit 112 is less than the dielectric loss of matrix 111.As a result,
When so that the dielectric constant and dielectric loss of irradiation unit 112 being respectively less than matrix 111, loss can be preferably reduced, guarantees transmitting
With the intensity for receiving signal.
According to some embodiments of the present application, the dielectric loss of irradiation unit 112 is less than 0.0005.It is worn as a result, in signal wave
When overshoot portion 112, loss can be preferably reduced, guarantee transmitting and receives the intensity of signal.
According to some embodiments of the present application, matrix 111 is ceramic member or glass workpiece.Thus, it is possible to have matrix 111
There is higher structural strength, so that the whole structural strength with higher of shell 1, meets requirement.For example, matrix
111 can be aluminosilicate glass part.Thus, it is possible to further make the structural strength with higher of matrix 111, so that shell
The whole structural strength with higher of body 1, meets requirement.
According to some embodiments of the present application, irradiation unit 112 can be glass workpiece or resin piece.As a result, irradiation unit
112 have lower dielectric constant and dielectric loss, when signal wave passes through irradiation unit 112, it is possible to reduce loss.
Optionally, irradiation unit 112 can be quartz glass part.As a result, irradiation unit 112 has lower dielectric constant
And dielectric loss.For example, the dielectric constant of irradiation unit 112 can be radiated down to 3.7 when irradiation unit 112 is quartz glass part
The dielectric loss in portion 112 can be down to 0.0003.
Optionally, irradiation unit 112 or PMMA resin piece, PC resin part or PE resin piece.As a result, irradiation unit
112 have lower dielectric constant and dielectric loss, when signal wave passes through irradiation unit 112, it is possible to reduce loss.For example, In
When irradiation unit 112 is PC resin part, the dielectric constant of irradiation unit 112 can be down to 3.1.
For example, matrix 111 is aluminosilicate glass part in some specific embodiments of the application, irradiation unit 112 is quartzy glass
Glass part, the mechanical performance of aluminosilicate glass part are better than the mechanical performance of quartz glass part, the dielectric constant and dielectric of quartz glass part
Loss is below aluminosilicate glass part.Thus it can both guarantee the structural strength of matrix 111, to guarantee the structural strength of shell 1, together
When the dielectric constant of irradiation unit 112 and dielectric loss can be made to be below matrix 111, reduce signal wave and pass through irradiation unit 112
When the loss that generates, guarantee the nature performance of complete machine.
According to some embodiments of the present application, referring to figure 5 and figure 6, Anneta module 3 is located at irradiation unit in the projection of the plane of reference
112 in the projection of the plane of reference, such as irradiation unit 112 can be slightly larger than Anneta module 3 in the plane of reference in the projection of the plane of reference
Projection, thickness direction of the plane of reference perpendicular to irradiation unit 112.Thus, it is possible to which the signal wave for generating Anneta module 3 is most
Slave irradiation unit 112 more than possible is passed through and is passed through as few as possible from matrix 111, is worn so as to further reduce signal wave
The loss generated when crossing shell 1.For example, Anneta module 3 is respectively 23mm, 4.2mm, irradiation unit in the length and width of the projection of the plane of reference
112 in the length and width of the projection of the plane of reference be respectively 24mm, 4.5mm.
According to some embodiments of the present application, includes main part 1111 and be connected to main body with Fig. 5, matrix 111 referring to Fig.1
The frame portion 1112 of side on the thickness direction in portion 1111, circumferentially extending of the frame portion 1112 along main part 1111, the formation of frame portion 1112
For annular, the mounting hole for installing irradiation unit 112 is formed in main part 1111.As a result, in Anneta module 3 and main part
When 1111 face, the mounting hole for installing irradiation unit 112 can be set on main part 1111, and can make irradiation unit
Larger, the loss generated when preferably reducing signal wave across shell 1 of 112 settings.
According to some embodiments of the present application, referring to Fig. 6, matrix 111 includes main part 1111 and is connected to main part
The frame portion 1112 of side on 1111 thickness direction, along the circumferentially extending of main part 1111, frame portion 1112 is formed as frame portion 1112
Annular, the mounting hole for installing irradiation unit 112 are formed in frame portion 1112.As a result, in Anneta module 3 and 1112 face of frame portion
When, the mounting hole for installing irradiation unit 112 can be set in frame portion 1112, so that the position of Anneta module 3 is more flexible,
Such as the thickness for being conducive to reduce complete machine in the peripheral side of the mainboard 2 of electronic equipment 100 can be set in Anneta module 3.
In other examples, matrix 111 includes main part 1111 and is connected on the thickness direction of main part 1111
The frame portion 1112 of side, frame portion 1112 along main part 1111 circumferentially extending, frame portion 1112 be formed as annular, 1111 He of main part
It could be formed with the mounting hole for installing irradiation unit 112 in frame portion 1112, so that the position of Anneta module 3 is configured
It is more flexible.
According to some embodiments of the present application, referring to Fig.1, Fig. 5 and Fig. 6, between the mounting hole for installing irradiation unit 112 is
Every multiple (such as two) of setting, the quantity of irradiation unit 112 and the quantity of mounting hole it is identical and correspond.Thus, it is possible to
Enhance the ability that electronic equipment 100 receives and emits signal.
" multiple " refer to two or more it should be noted that described herein.
It can be led between irradiation unit 112 and the inner wall of mounting hole according to some embodiments of the present application referring to Fig. 2-Fig. 4
Adhesive-layer 12 is crossed to be connected.Irradiation unit 112 is facilitated to be fixed in mounting hole as a result,.Optionally, adhesive-layer 12 can be UV glue
Layer, it is possible thereby to make bonding strength with higher between irradiation unit 112 and matrix 111.
Optionally, referring to Fig. 2-Fig. 4, the value range of the thickness d of adhesive-layer 12 is 0.03-0.08mm, such as adhesive-layer
12 thickness d can be 0.05mm.Thus, it is possible to guarantee the bonding strength of irradiation unit 112 Yu matrix 111, and make adhesive-layer
12 materials are less.
For example, matrix 111 and irradiation unit 112 are Transparent Parts, such as matrix in some specific embodiments of the application
111 be aluminosilicate glass part, and irradiation unit 112 is quartz glass part, passes through adhesive-layer 12 between irradiation unit 112 and the inner wall of mounting hole
Be connected, wherein adhesive-layer 12 can be transparent adhesive tape so that the junction of irradiation unit 112 and matrix 111 be also it is transparent, make
It obtains irradiation unit 112 and matrix 111 combines together in appearance, do not see line of demarcation.
According to some embodiments of the present application, can also be connected with welding between irradiation unit 112 and the inner wall of mounting hole, such as
It can be welded to connect by sweat soldering, laser welding etc. between irradiation unit 112 and the inner wall of mounting hole.Thus, it is possible to
So that realizing reliable connection between irradiation unit 112 and the inner wall of mounting hole.Compare in the material of matrix 111 and irradiation unit 112
When close, such as when matrix 111 is aluminosilicate glass part, and irradiation unit 112 is quartz glass part, irradiation unit 112 and mounting hole
Using being welded to connect between inner wall, irradiation unit 112 and the connection of matrix 111 can be made more reliable.
According to some embodiments of the present application, referring to figure 5 and figure 6, the outer surface of irradiation unit 112 is corresponding with matrix 111
Partial outer surface be generally aligned in the same plane or same curved surface in.As a result, the outer surface of shell 1 is with better sense of touch and outside
See aesthetics.
Further, referring to figure 5 and figure 6, in the outer surface of the outer surface of irradiation unit 112 and the corresponding part of matrix 111
Be generally aligned in the same plane or same curved surface in while, the inner surface of the corresponding part of the inner surface and matrix 111 of irradiation unit 112
Can be generally aligned in the same plane or same curved surface in.As a result, the inner surface of ontology 11 be generally aligned in the same plane or same curved surface in,
And make the outer surface of ontology 11 be generally aligned in the same plane or same curved surface in so that the structure of ontology 11 is simple, beautiful, and have
Preferable sense of touch.For example, matrix 111 with a thickness of 0.55mm, the thickness of irradiation unit 112 is also 0.55mm.
According to some embodiments of the present application, referring to Fig. 4, along the thickness direction of matrix 111, for installing irradiation unit 112
Mounting hole include different the first hole sections and the second hole section in aperture, the aperture of the first hole section can be greater than the hole of the second hole section
Diameter, the first hole section can neighbouring shell 1 inside (the direction e in Fig. 4 be directed towards shell 1 inside direction), irradiation unit 112
Including cross-sectional area different the first radiant section 1121 and the second radiant section 1122, the cross-sectional area of the first radiant section 1121 is greater than
The cross-sectional area of second radiant section 1122, the first radiant section 1121 cooperate in the first hole section, and the cooperation of the second radiant section 1122 exists
In second hole section.Thus, it is possible to be formed with First terrace 113 and the first spoke between the first hole section and the second hole section
The second step face 1123 being formed between section 1121 and the second radiant section 1122 with the cooperation of First terrace is penetrated, it is possible thereby to increase
Connection area between large radiation portion 112 and the inner wall of mounting hole further improves the connection of irradiation unit 112 Yu matrix 111
Intensity and connection reliability.
According to some embodiments of the present application, referring to Fig. 3, shell 1 includes: decorative layer 13, and decorative layer 13 is located at ontology 11
Inner surface and ontology 11 at least one of outer surface on.For example, decorative layer 13 can be only defined the inner surface of ontology 11
Upper (direction that the direction e in Fig. 3 is directed towards the inside of shell 1), decorative layer 13 can cover the entire inner surface of ontology 11, by
This can cover the interior line of demarcation of the junction of irradiation unit 112 and matrix 111；Alternatively, decorative layer 13 can be only defined ontology 11
Outer surface on, decorative layer 13 can cover the entire outer surface of ontology 11, it is possible thereby to cover irradiation unit 112 and matrix 111
Junction outer line of demarcation；Alternatively, the inner surface of ontology 11 and the outer surface of ontology 11 are equipped with decorative layer 13, can cover
The interior line of demarcation of the junction of irradiation unit 112 and matrix 111 and the junction that irradiation unit 112 Yu matrix 111 can be covered simultaneously
Outer line of demarcation.Thus, it is possible to make that the junction of irradiation unit 112 and matrix 111 is covered so that appearance is more aesthetically pleasing, and
It can make the appearance more horn of plenty of shell 1 by the decorative layer 13 of setting different color, texture.In addition, decorative layer 13
The protective effect of the junction to irradiation unit 112 Yu matrix 111 can be played.
Optionally, decorative layer 13 can be ink layer, film plating layer, foil layer etc..
For example, matrix 111 and irradiation unit 112 can be Transparent Parts so that ontology 11 be it is transparent, can be at this
The inner surface of body 11 covers decorative layer 13, so as to see color, the texture etc. of the display of decorative layer 13 from the appearance, enriches shell
The appearance of body 1.Also, decorative layer 13 can cover the interior line of demarcation of the junction of irradiation unit 112 and matrix 111, and one
Determining decorative layer 13 in degree can be with the outer line of demarcation in reduced radiation portion 112 and the junction of matrix 111.
Referring to Fig. 5-Fig. 7 and Fig. 1-Fig. 4 is combined, according to the electronic equipment 100 of the application second aspect embodiment, comprising:
Shell 1, display screen component 5, mainboard 2.
Shell 1 is according to the shell 1 of the electronic equipment of the above-mentioned first aspect embodiment of the application, display screen component 5 and shell
Body 1 is connected, and limits installation space between display screen component 5 and shell 1.Mainboard 2 is located in installation space and display screen component 5
It is electrically connected with mainboard 2, Anneta module 3 is located in installation space and Anneta module 3 is electrically connected with mainboard 2.
Optionally, Anneta module 3 is millimeter wave antenna module.As a result, it is possible thereby to which making the propagation of signal has more greatly
Bandwidth, improve signal transmission quality and transmission speed.
According to the regulation [1] of 38.101 agreement of 3GPP TS, 5G NR mainly uses two band frequencies: FR1 frequency range and FR2 frequency
Section.The frequency range of FR1 frequency range is 450MHz~6GHz, is called sub-6GHz frequency range；The frequency range of FR2 frequency range is
24.25GHz~52.6GHz is usually its millimeter wave (mm Wave).
It can make the structure of shell 1 by the way that above-mentioned shell 1 is arranged according to the electronic equipment 100 of the embodiment of the present application
It is more flexible with selection, it is ensured that while the mechanical performance of shell 1, the gain and efficiency of Anneta module 3 can be improved.
Illustratively, the electronic equipment 100 of the application can be mobile or portable and execute the various types of of wireless communication
Any one of computer system device of type (only illustratively shows a kind of form) in Fig. 7.Specifically, electronic equipment
100 can be mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable game
Play equipment (such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone
TM), laptop computer, PDA, portable Internet appliance, music player and data storage device, other handheld devices with
And wrist-watch, In-Ear Headphones, pendant, headphone etc., electronic equipment 100 can also be other wearable devices
(for example, such as electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics are tatooed, electronic equipment 100 or smartwatch
Headset equipment (HMD)).
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the application, this
The range of application is defined by the claims and their equivalents.
Claims (21)
1. the shell of a kind of electronic equipment, which is characterized in that the electronic equipment has Anneta module, and the Anneta module is located at
The inside of the shell, the shell include ontology, and the ontology includes:
Matrix is formed with the mounting hole for running through described matrix along the thickness direction of described matrix in described matrix；
Irradiation unit, in the mounting hole, the irradiation unit is suitable for being oppositely arranged with the Anneta module for the irradiation unit installation,
The dielectric constant of the irradiation unit is less than the dielectric constant of described matrix.
2. the shell of electronic equipment according to claim 1, which is characterized in that the dielectric constant of the irradiation unit is less than 5.
3. the shell of electronic equipment according to claim 1, which is characterized in that the dielectric loss of the irradiation unit is less than institute
State the dielectric loss of matrix.
4. the shell of electronic equipment according to claim 1, which is characterized in that the dielectric loss of the irradiation unit is less than
0.0005。
5. the shell of electronic equipment according to claim 1, which is characterized in that described matrix is ceramic member or glass workpiece.
6. the shell of electronic equipment according to claim 5, which is characterized in that described matrix is aluminosilicate glass part.
7. the shell of electronic equipment according to claim 1, which is characterized in that the irradiation unit is glass workpiece or resin
Part.
8. the shell of electronic equipment according to claim 7, which is characterized in that the irradiation unit is quartz glass part.
9. the shell of electronic equipment according to claim 7, which is characterized in that the irradiation unit is PMMA resin piece, PC
Resin piece or PE resin piece.
10. the shell of electronic equipment according to claim 1, which is characterized in that throwing of the Anneta module in the plane of reference
Shadow is located at the irradiation unit in the projection of the plane of reference, thickness direction of the plane of reference perpendicular to the irradiation unit.
11. the shell of electronic equipment according to claim 1, which is characterized in that the mounting hole is spaced more
A, the quantity of the irradiation unit is identical as the quantity of the mounting hole and corresponds.
12. the shell of electronic equipment according to claim 1, which is characterized in that described matrix includes main part and connection
The frame portion of side on the thickness direction of the main part, circumferentially extending of the frame portion along the main part, the mounting hole
It is formed on the main part.
13. the shell of electronic equipment according to claim 1, which is characterized in that described matrix includes main part and connection
The frame portion of side on the thickness direction of the main part, circumferentially extending of the frame portion along the main part, the mounting hole
It is formed in the frame portion.
14. the shell of electronic equipment according to claim 1, which is characterized in that the irradiation unit and the mounting hole
It is connected between inner wall by adhesive-layer.
15. the shell of electronic equipment according to claim 14, which is characterized in that the thickness range of the adhesive-layer is
0.03-0.08mm。
16. the shell of electronic equipment according to claim 1, which is characterized in that the irradiation unit and the mounting hole
It is welded to connect between inner wall.
17. the shell of electronic equipment according to claim 1, which is characterized in that the outer surface of the irradiation unit with it is described
The outer surface of the corresponding part of matrix be generally aligned in the same plane or same curved surface in.
18. the shell of electronic equipment according to claim 1, which is characterized in that described in the thickness direction along described matrix
Mounting hole includes different the first hole section and the second hole section in aperture, and the irradiation unit includes the first different radiant section of cross-sectional area
With the second radiant section, the first radiant section cooperation is in first hole section, and the second radiant section cooperation is described second
In hole section.
19. the shell of electronic equipment described in any one of -18 according to claim 1 characterized by comprising decorative layer, institute
Decorative layer is stated to be located at least one of the inner surface of the ontology and the outer surface of the ontology.
20. a kind of electronic equipment characterized by comprising
Shell, the shell are the shell of the electronic equipment according to any one of claim 1-19；
Display screen component, the display screen component are connected with the shell, limit between the display screen component and the shell
Installation space out；
Mainboard, the mainboard are located in the installation space, and the display screen component is electrically connected with the mainboard；
Anneta module, Anneta module are located in the installation space and are electrically connected with the mainboard.
21. electronic equipment according to claim 20, which is characterized in that the Anneta module is millimeter wave antenna module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910768138.9A CN110519424A (en) | 2019-08-20 | 2019-08-20 | The shell and electronic equipment of electronic equipment |
| PCT/CN2020/100947 WO2021031735A1 (en) | 2019-08-20 | 2020-07-08 | Electronic device housing and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910768138.9A CN110519424A (en) | 2019-08-20 | 2019-08-20 | The shell and electronic equipment of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110519424A true CN110519424A (en) | 2019-11-29 |
Family
ID=68625887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910768138.9A Pending CN110519424A (en) | 2019-08-20 | 2019-08-20 | The shell and electronic equipment of electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110519424A (en) |
| WO (1) | WO2021031735A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021031735A1 (en) * | 2019-08-20 | 2021-02-25 | Oppo广东移动通信有限公司 | Electronic device housing and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021031735A1 (en) | 2021-02-25 |
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