CN110517960B - 一种cof基板高强度凸块的制造方法 - Google Patents
一种cof基板高强度凸块的制造方法 Download PDFInfo
- Publication number
- CN110517960B CN110517960B CN201910784085.XA CN201910784085A CN110517960B CN 110517960 B CN110517960 B CN 110517960B CN 201910784085 A CN201910784085 A CN 201910784085A CN 110517960 B CN110517960 B CN 110517960B
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- CN
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- Prior art keywords
- bump
- photoresist
- insulating substrate
- film
- dry film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 91
- 239000000758 substrate Substances 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 54
- 238000005530 etching Methods 0.000 claims abstract description 43
- 238000009713 electroplating Methods 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 56
- 229910052759 nickel Inorganic materials 0.000 claims description 28
- 239000011889 copper foil Substances 0.000 claims description 26
- 239000010931 gold Substances 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 239000012286 potassium permanganate Substances 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 5
- 239000003814 drug Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 abstract description 4
- 238000007772 electroless plating Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 101000695187 Homo sapiens Protein patched homolog 1 Proteins 0.000 description 1
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 102100028680 Protein patched homolog 1 Human genes 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910784085.XA CN110517960B (zh) | 2019-08-23 | 2019-08-23 | 一种cof基板高强度凸块的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910784085.XA CN110517960B (zh) | 2019-08-23 | 2019-08-23 | 一种cof基板高强度凸块的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110517960A CN110517960A (zh) | 2019-11-29 |
CN110517960B true CN110517960B (zh) | 2021-03-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910784085.XA Active CN110517960B (zh) | 2019-08-23 | 2019-08-23 | 一种cof基板高强度凸块的制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN110517960B (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101365300A (zh) * | 2007-08-08 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | 电路板导电线路的制作方法 |
JP2010062189A (ja) * | 2008-09-01 | 2010-03-18 | Hitachi Cable Ltd | 配線板の製造方法および配線板 |
US8258055B2 (en) * | 2010-07-08 | 2012-09-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming semiconductor die |
TW201926605A (zh) * | 2017-11-22 | 2019-07-01 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
CN109979834A (zh) * | 2019-03-29 | 2019-07-05 | 颀中科技(苏州)有限公司 | 用于半导体封装的凸块制造方法 |
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2019
- 2019-08-23 CN CN201910784085.XA patent/CN110517960B/zh active Active
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Publication number | Publication date |
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CN110517960A (zh) | 2019-11-29 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 221000 north of Liaohe Road and west of Huashan Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Jiangsu SHANGDA Semiconductor Co.,Ltd. Address before: 221000 north of Liaohe Road and west of Huashan Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: Jiangsu Shangda Electronics Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A manufacturing method of high strength bump of COF substrate Effective date of registration: 20220726 Granted publication date: 20210330 Pledgee: Jiangsu Zhangjiagang Rural Commercial Bank Co.,Ltd. Pizhou sub branch Pledgor: Jiangsu SHANGDA Semiconductor Co.,Ltd. Registration number: Y2022320000399 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |