CN110514937A - A kind of non-solder type device detection compoboard - Google Patents
A kind of non-solder type device detection compoboard Download PDFInfo
- Publication number
- CN110514937A CN110514937A CN201910892729.7A CN201910892729A CN110514937A CN 110514937 A CN110514937 A CN 110514937A CN 201910892729 A CN201910892729 A CN 201910892729A CN 110514937 A CN110514937 A CN 110514937A
- Authority
- CN
- China
- Prior art keywords
- measurement circuit
- fuse
- main body
- copper sheet
- sheet main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 18
- 238000001514 detection method Methods 0.000 title claims abstract description 17
- 238000005259 measurement Methods 0.000 claims abstract description 64
- 238000012360 testing method Methods 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 230000001012 protector Effects 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 8
- 230000003068 static effect Effects 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000006835 compression Effects 0.000 abstract description 3
- 238000007906 compression Methods 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000004224 protection Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a kind of non-solder type device detection compoboards, including measurement circuit plate and test fixture, fuse measurement circuit is horizontally arranged on measurement circuit plate, the end of the fuse measurement circuit is external connection exit, two ends of the fuse measurement circuit have hole, the inside of hole is connected with fuse measurement circuit, pad is connected in the middle part of fuse measurement circuit, electrostatic protector measurement circuit is vertically arranged on measurement circuit plate, the lower end of electrostatic protector measurement circuit has static gun hitting region, the upper end is radio-frequency terminals welding section, test fixture includes copper sheet main body, spring is connected in copper sheet main body, copper contact chip is hung on spring, mask placement device between copper contact chip and copper sheet main body, test fixture is welded on pad.It when the present invention is assessed and tested to device, does not need to be welded, is tested in such a way that compression joint type contacts, avoid device from scrapping, and may be reused, save the cost.
Description
Technical field
The present invention relates to the testing field of electronic component, in particular to a kind of non-solder type device detection compoboard.
Background technique
The passive protections component such as static suppressor ESD and paster fuse FUSE, is prepared, In using thick film printing technique
Because product can not weld in preparation process, so can not assess product, prepare after finished product if it find that bad will be by the gross
It scraps, wastes a large amount of time and cost.
When testing passive protection component using existing test board, need for device to be welded on test board；
Device after test then needs to be blown off from test board with heat-sealing rifle, have to pad and device certain if necessary to analyze
Damage, device are scrapped substantially, and test board can only at most use 3 times；The bond pad surface of this solder type test board need by
Gold-plated processing, the cost is relatively high, and test board cannot reuse, and a large amount of waste is caused in production cost.
Summary of the invention
In order to solve the above technical problems, the purpose of the present invention is to provide a kind of non-solder type device detection compoboard, In
It when device is assessed and tested, does not need to be welded, is directly tested in such a way that compression joint type contacts, avoid device
Part is scrapped, and may be reused, save the cost.
To realize above-mentioned technical purpose and the technique effect, the invention is realized by the following technical scheme: Yi Zhongfei
Solder type device detection compoboard, including measurement circuit plate and test fixture are horizontally arranged with fusing on the measurement circuit plate
Device measurement circuit, the end of the fuse measurement circuit are external connection exit, two ends of the fuse measurement circuit
With hole, and the hole is through-hole, and the inside of hole is connected with fuse measurement circuit, the middle part of the fuse measurement circuit
It is connected with pad by the way that route is connected, is also vertically arranged with electrostatic protector measurement circuit on the measurement circuit plate, the electrostatic
The lower end of protector measurement circuit has static gun hitting region, and the upper end of the electrostatic protector measurement circuit is radio-frequency terminals welding
The terminal for connecting oscillograph is welded in area, the radio-frequency terminals welding section, and the test fixture includes copper sheet main body, copper sheet master
It is connected with spring in vivo, copper contact chip is hung on the spring, needs to test for placing between copper contact chip and copper sheet main body
Device, the test fixture is welded on the pad.
In above-mentioned technical proposal, the measurement circuit plate is pcb board, and surface is etched to define fuse survey after covering copper foil
Try route and electrostatic protector measurement circuit.
As a further improvement of the above technical scheme, the fuse measurement circuit and electrostatic protector measurement circuit table
Face is gold-plated.
As a further improvement of the above technical scheme, the inside spray of described hole is equipped with tin layers, and tin layers are again by gold-plated
Processing.
In above-mentioned technical proposal, the copper sheet main body has top, bottom and vertical component effect, and the spring is welded on copper sheet master
On the top of body, device to be tested is needed to be placed between copper contact chip and the bottom of copper sheet main body.
In above-mentioned technical proposal, multiple test fixtures are welded on the pad.
As a further improvement of the above technical scheme, the copper sheet main body is silver coated.
The beneficial effects of the present invention are:
(1) the test compoboard when in use, will need device to be tested to be placed in the copper contact chip and copper of test fixture
Between the bottom of piece main body, under the cooperation of spring, in such a way that compression joint type contacts, device passes through test fixture and p-wire
Plate conducting in road, without being welded, to avoid generating scrapping for device, is tested to realize the assessment and test to device
Plate and reusable, save the cost；
(2) spring is set in test fixture, so that the size for the device being put into test fixture is adjustable, is suitable for not
With the device of size, test board is remake without the variation because of device size；
(3) device tested can be finished product and be also possible to semi-finished product, if device semi-finished product printed table electrode can
To be assessed using the test compoboard, do not need that termination electrode is electroplated in production；
(4) process assessed device and tested using test compoboard of the invention is simple, can find in time
Defective products avoids material and waste of time；
(5) after the completion of assessing device and testing, device directly can be removed from test compoboard, it will not be to pad
Damage is generated with appearance of device；
(6) the test compoboard can be adapted for different types of device assessment, have a wide range of application.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the measurement circuit plate in non-solder type device detection compoboard of the present invention.
Fig. 2 is the structural schematic diagram of the test fixture in non-solder type device detection compoboard of the present invention.
Specific embodiment
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
As depicted in figs. 1 and 2, a kind of non-solder type device detection compoboard, including measurement circuit plate 1 and test fixture 2,
It is horizontally arranged with fuse measurement circuit 11 on the measurement circuit plate 1, the end of the fuse measurement circuit 11 is external connection
Exit, two ends of the fuse measurement circuit 11 have hole 111, and the hole 111 is through-hole, hole 111
Internal to be connected with fuse measurement circuit 11, the middle part of the fuse measurement circuit 11 is connected with pad by the way that route 112 is connected
113, electrostatic protector measurement circuit 12 is also vertically arranged on the measurement circuit plate 1, the electrostatic protector measurement circuit 12
Lower end there is static gun hitting region 121, the upper end of the electrostatic protector measurement circuit 12 is radio-frequency terminals welding section, the radio frequency
The terminal for connecting oscillograph is welded in terminal welding section, and the test fixture 2 includes copper sheet main body 21, in the copper sheet main body 21
It is connected with spring 22, copper contact chip 23 is hung on the spring 22, is needed between copper contact chip 23 and copper sheet main body 21 for placing
Device to be tested, the test fixture 2 are welded on the pad 113.
Wherein, measurement circuit plate 1 is pcb board, and surface, which is covered, is etched to define fuse measurement circuit 11 and quiet after copper foil
Non-electricity protector measurement circuit 12, then in 12 surface gold-plating of fuse measurement circuit 11 and electrostatic protector measurement circuit.
In order to realize that inside and the fuse measurement circuit 11 of hole 111 are connected, the inside spray of hole 111 sets tin layers, tin
Layer passes through gold-plated processing again.The external connection exit of fuse measurement circuit 11 is connect with external power supply, and external power supply passes through molten
Disconnected device measurement circuit 11 and hole 111 are connected to measurement circuit plate 1.
Wherein, the copper sheet main body 21 has top, bottom and vertical component effect, and the spring 22 is welded on copper sheet main body 21
On top, device to be tested is needed to be placed between copper contact chip 23 and the bottom of copper sheet main body 21.
Wherein, multiple test fixtures 2 can be welded on pad 113.It, can by mobile solder joint when welding test fixture 2
To adjust the distance between test fixture, so as to be suitable for various sizes of device.
In addition, test fixture 2 is using the silver-plated material of copper, resistance is relatively small, does not influence electric conductivity, completely can be with
Meet the needs of device detection.
When in use, chip fuse is put between the copper contact chip 23 of test fixture 2 and the bottom of copper sheet main body 21,
Under the action of spring 22, copper contact chip 23 crimps chip fuse, the bottom of iron plate fuse and copper sheet main body 21
Contact；The external connection exit of fuse measurement circuit 11 is connect with external power supply, connects external power supply with measurement circuit plate 1
It is logical, and connected by pad 113 and test fixture 2, measurement circuit plate 1 and chip fuse, to be carried out to chip fuse
Test and assessment.After the completion of test and assessment, directly chip fuse can be removed from test fixture 2.In test electrostatic
When protector, electrostatic protector is put into test fixture 2, ground wire connects the hole 111 on fuse measurement circuit 11, electrostatic
The static gun hitting region 121 of electrostatic protector measurement circuit 12, radio-frequency terminals welding section solder terminal are beaten in gunslinging, and terminal connection is shown
Wave device, tests electrostatic protector, and oscillograph captures test image, to assess the performance of electrostatic protector.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (7)
1. a kind of non-solder type device detection compoboard, it is characterised in that: including measurement circuit plate and test fixture, the test
Fuse measurement circuit is horizontally arranged on wiring board, the end of the fuse measurement circuit is external connection exit, the fusing
Two ends of device measurement circuit have hole, and the hole is through-hole, and the inside of hole is connected with fuse measurement circuit,
The middle part of the fuse measurement circuit is connected with pad by the way that route is connected, and is also vertically arranged with electrostatic on the measurement circuit plate
The lower end of protector measurement circuit, the electrostatic protector measurement circuit has static gun hitting region, the electrostatic protector p-wire
The upper end on road is radio-frequency terminals welding section, which welds the terminal for connecting oscillograph, and the test is controlled
Tool includes copper sheet main body, is connected with spring in the copper sheet main body, copper contact chip, copper contact chip and copper sheet master are hung on the spring
Device to be tested is needed for placing between body, the test fixture is welded on the pad.
2. a kind of non-solder type device detection compoboard according to claim 1, it is characterised in that: the measurement circuit plate
For pcb board, surface is etched to define fuse measurement circuit and electrostatic protector measurement circuit after covering copper foil.
3. a kind of non-solder type device detection compoboard according to claim 1, it is characterised in that: the fuse test
Route and electrostatic protector measurement circuit surface gold-plating.
4. a kind of non-solder type device detection compoboard according to claim 1, it is characterised in that: the inside of described hole
Spray is equipped with tin layers, and tin layers pass through gold-plated processing again.
5. a kind of non-solder type device detection compoboard according to claim 1, it is characterised in that: the copper sheet main body tool
There are top, bottom and vertical component effect, the spring to be welded on the top of copper sheet main body, device to be tested is needed to be placed in copper contact
Between piece and the bottom of copper sheet main body.
6. a kind of non-solder type device detection compoboard according to claim 1, it is characterised in that: welded on the pad
There are multiple test fixtures.
7. a kind of non-solder type device detection compoboard according to claim 1, it is characterised in that: the copper sheet main body plating
There is silver layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910892729.7A CN110514937A (en) | 2019-09-20 | 2019-09-20 | A kind of non-solder type device detection compoboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910892729.7A CN110514937A (en) | 2019-09-20 | 2019-09-20 | A kind of non-solder type device detection compoboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110514937A true CN110514937A (en) | 2019-11-29 |
Family
ID=68631614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910892729.7A Pending CN110514937A (en) | 2019-09-20 | 2019-09-20 | A kind of non-solder type device detection compoboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110514937A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511019A (en) * | 1991-07-04 | 1993-01-19 | Nippon Mektron Ltd | Circuit component testing method and flexible circuit board therefor |
| JPH0552778U (en) * | 1991-12-17 | 1993-07-13 | 沖電気工業株式会社 | Pressure welding jig for test board |
| JPH07226244A (en) * | 1994-02-10 | 1995-08-22 | Chikaya Yamashita | Solderless device for wire connection of board |
| JP2004077238A (en) * | 2002-08-14 | 2004-03-11 | Murata Mfg Co Ltd | Characteristic measuring device of electronic component |
| CN101136252A (en) * | 2006-08-30 | 2008-03-05 | 台湾积体电路制造股份有限公司 | Repair circuitry and method for preventing electrical fuse from being burned during static discharge testing |
| US20100245025A1 (en) * | 2009-03-25 | 2010-09-30 | Littelfuse, Inc. | Solderless surface mount fuse |
| CN204330983U (en) * | 2014-12-31 | 2015-05-13 | 昆山埃维奥电机有限公司 | Fusing inductance opening time proving installation |
| CN210775703U (en) * | 2019-09-20 | 2020-06-16 | 苏州晶讯科技股份有限公司 | Non-welding type device test compoboard |
-
2019
- 2019-09-20 CN CN201910892729.7A patent/CN110514937A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511019A (en) * | 1991-07-04 | 1993-01-19 | Nippon Mektron Ltd | Circuit component testing method and flexible circuit board therefor |
| JPH0552778U (en) * | 1991-12-17 | 1993-07-13 | 沖電気工業株式会社 | Pressure welding jig for test board |
| JPH07226244A (en) * | 1994-02-10 | 1995-08-22 | Chikaya Yamashita | Solderless device for wire connection of board |
| JP2004077238A (en) * | 2002-08-14 | 2004-03-11 | Murata Mfg Co Ltd | Characteristic measuring device of electronic component |
| CN101136252A (en) * | 2006-08-30 | 2008-03-05 | 台湾积体电路制造股份有限公司 | Repair circuitry and method for preventing electrical fuse from being burned during static discharge testing |
| US20100245025A1 (en) * | 2009-03-25 | 2010-09-30 | Littelfuse, Inc. | Solderless surface mount fuse |
| CN204330983U (en) * | 2014-12-31 | 2015-05-13 | 昆山埃维奥电机有限公司 | Fusing inductance opening time proving installation |
| CN210775703U (en) * | 2019-09-20 | 2020-06-16 | 苏州晶讯科技股份有限公司 | Non-welding type device test compoboard |
Non-Patent Citations (1)
| Title |
|---|
| 章俊华等: "电子技术基础实验指导", 西南交通大学出版社, pages: 273 - 274 * |
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