CN110503038B

CN110503038B - Fingerprint sensor, display module device and electronic equipment

Info

Publication number: CN110503038B
Application number: CN201910779951.6A
Authority: CN
Inventors: 袁石林
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-08-22
Filing date: 2019-08-22
Publication date: 2021-09-24
Anticipated expiration: 2039-08-22
Also published as: CN110503038A

Abstract

The application discloses a fingerprint sensor, a display assembly device and an electronic device. The fingerprint sensor includes a substrate and a wiring layer. The circuit layer comprises a plurality of first circuits and a plurality of second circuits. The orthographic projection of the first lines and the second lines on the substrate are intersected. The first line comprises a first top surface and a first bottom surface which are opposite, and the second line comprises a second top surface and a second bottom surface which are opposite. The line width of the first line at the first top surface is larger than the line width of the first line at the first bottom surface, and the line width of the second line at the second top surface is larger than the line width of the second line at the second bottom surface. In the embodiment of the application, the line width of the first line at the first top surface is greater than the line width of the first line at the first bottom surface, and the line width of the second line at the second top surface is greater than the line width of the second line at the second bottom surface, so that the problem that a user sees appearance problems such as grid lines and graying of a screen due to reflection of external light rays from the first line and the second line when the external light rays are incident on the line layer can be avoided.

Description

Fingerprint sensor, display module device and electronic equipment

Technical Field

The present application relates to the field of fingerprint identification technology, and more particularly, to a fingerprint sensor, a display assembly device, and an electronic apparatus.

Background

With the continuous development of the intelligent mobile terminal technology, the application of fingerprint identification is more and more extensive. For example, fingerprint recognition may be used for screen unlocking, quick payment, encryption, fingerprint key functionality, and the like. Fingerprint recognition is typically achieved by a fingerprint sensor. The fingerprint identification sensor comprises a circuit layer, when external light enters the circuit layer, the external light is easily reflected by a circuit in the circuit layer, and therefore the user sees appearance problems such as grid lines, graying of a screen and the like.

Disclosure of Invention

The embodiment of the application provides a fingerprint sensor, a display assembly device and electronic equipment.

The fingerprint sensor of this application embodiment includes substrate and circuit layer, the circuit layer includes many first circuits and many second circuits, many first circuit is in with many the second circuit orthographic projection on the substrate is crossing, first circuit includes first top surface and the first bottom surface that carries on the back mutually, the second circuit includes second top surface and the second bottom surface that carries on the back mutually, first circuit is in the linewidth of first top surface department is greater than first circuit is in the linewidth of first bottom surface department, the second circuit is in the linewidth of second top surface department is greater than the second circuit is in the linewidth of second bottom surface department.

The display assembly device comprises a display module, a fingerprint sensor and a cover plate, wherein the fingerprint sensor is positioned between the cover plate and the display module and covers a display surface of the display module so as to sense a user fingerprint touching the cover plate; the fingerprint sensor comprises a substrate and a circuit layer, wherein the circuit layer comprises a plurality of first circuits and a plurality of second circuits, the plurality of first circuits and the plurality of second circuits are intersected in orthographic projection on the substrate, the first circuits comprise first top surfaces and first bottom surfaces which are opposite, the second circuits comprise second top surfaces and second bottom surfaces which are opposite, the line width of the first circuits at the first top surfaces is larger than the line width of the first circuits at the first bottom surfaces, and the line width of the second circuits at the second top surfaces is larger than the line width of the second circuits at the second bottom surfaces; the substrate and the circuit layer are arranged along the light emitting direction of the display module.

The electronic equipment of the embodiment of the application comprises a shell and a display component device, wherein the display component device is combined with the shell; the display component device comprises a display module, a fingerprint sensor and a cover plate, wherein the fingerprint sensor is positioned between the cover plate and the display module and covers the display surface of the display module so as to sense the fingerprint of a user touching the cover plate; the fingerprint sensor comprises a substrate and a circuit layer, wherein the circuit layer comprises a plurality of first circuits and a plurality of second circuits, the plurality of first circuits and the plurality of second circuits are intersected in orthographic projection on the substrate, the first circuits comprise first top surfaces and first bottom surfaces which are opposite, the second circuits comprise second top surfaces and second bottom surfaces which are opposite, the line width of the first circuits at the first top surfaces is larger than the line width of the first circuits at the first bottom surfaces, and the line width of the second circuits at the second top surfaces is larger than the line width of the second circuits at the second bottom surfaces; the substrate and the circuit layer are arranged along the light emitting direction of the display module.

In the fingerprint sensor, the display module device and the electronic equipment of the embodiment of the application, the line width of the first line at the first top surface is greater than the line width of the first line at the first bottom surface, the line width of the second line at the second top surface is greater than the line width of the second line at the second bottom surface, so that the situation that external light is reflected by the first line and the second line when being incident on a line layer can be avoided, and a user sees appearance problems such as grid lines and graying of a screen is caused.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIGS. 1 and 2 are schematic structural views of an electronic device according to some embodiments of the present application;

FIG. 3 is an exploded schematic view of a display assembly apparatus according to certain embodiments of the present application;

FIG. 4 is a schematic cross-sectional view of a display assembly apparatus according to certain embodiments of the present application;

FIG. 5 is a schematic cross-sectional view of a fingerprint sensor according to certain embodiments of the present application;

FIG. 6 is a schematic exploded perspective view of a fingerprint sensor according to certain embodiments of the present application;

fig. 7 is a schematic view of a first circuit having a first shielding line and a second circuit having a second shielding line according to some embodiments of the present disclosure;

FIGS. 8 and 9 are schematic cross-sectional views of display assembly apparatus according to certain embodiments of the present application;

FIGS. 10 and 11 are schematic plan views of wiring layers according to certain embodiments of the present application;

FIG. 12 is a schematic cross-sectional view of a Liquid Crystal Display (LCM) Display screen in accordance with certain embodiments of the present application;

FIG. 13 is a schematic cross-sectional view of an Organic Light-Emitting Diode (OLED) display panel according to some embodiments of the present disclosure;

FIGS. 14-16 are schematic cross-sectional views of display modules according to certain embodiments of the present disclosure;

FIGS. 17-22 are schematic cross-sectional views of display assembly apparatus according to certain embodiments of the present application;

FIG. 23 is a schematic cross-sectional view of a display assembly apparatus according to certain embodiments of the present application;

FIG. 24 is a schematic cross-sectional view of a polarizer according to certain embodiments of the present application;

FIG. 25 is a schematic cross-sectional view of an LCM display screen according to certain embodiments of the present application;

FIG. 26 is a schematic cross-sectional view of an OLED display screen according to certain embodiments of the present application;

FIGS. 27-29 are schematic cross-sectional views of display assembly apparatus according to certain embodiments of the present application;

fig. 30 to 32 are schematic views illustrating the working states of the fingerprint sensor and the display module according to some embodiments of the present disclosure.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the embodiments of the present application.

Referring to fig. 1, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 200 and a display assembly apparatus 100. The display module apparatus 100 is combined with the set cover 200. Specifically, the electronic device 1000 may be a mobile phone, a tablet computer, a display, a notebook computer, a teller machine, a gate, a smart watch, a head-up display device, a game console, and the like. In the embodiment of the present application, the electronic device 1000 is a mobile phone as an example, and it is understood that the specific form of the electronic device 1000 is not limited to the mobile phone.

The chassis 200 may be used to mount the display assembly apparatus 100, or the chassis 200 may serve as a mounting carrier of the display assembly apparatus 100. Specifically, referring to fig. 2, the chassis 200 includes a front case 210, and the display device assembly 100 may be assembled with the front case 210 by side glue or glue. The chassis 200 may also be used to install functional modules of the electronic device 1000, such as a power supply device, an imaging device, and a communication device, so that the chassis 200 provides protection for the functional modules, such as dust prevention, drop prevention, and water prevention.

Referring to fig. 3 and 4, the display device 100 includes a display module 30, a fingerprint sensor 20 and a cover plate 10. The fingerprint sensor 20 is located between the cover plate 10 and the display module 30 and covers the display surface 31 of the display module 30 to sense the fingerprint of a user touching the cover plate 10. Referring to fig. 5 to 7, the fingerprint sensor 20 includes a substrate 23 and a circuit layer 25 disposed along the light emitting direction of the display module 30. The wiring layer 25 includes a plurality of first wirings 251 and a plurality of second wirings 252, and the plurality of first wirings 251 intersect with orthographic projections of the plurality of second wirings 252 on the substrate 23. The first circuit 251 includes opposing first top and

bottom surfaces

2511 and 2512, and the second circuit 252 includes opposing second top and

bottom surfaces

2521 and 2522. The line width a1 of the first circuit 251 at the first top surface 2511 is greater than the line width a2 of the first circuit 251 at the first bottom surface 2512, and the line width A3 of the second circuit 252 at the second top surface 2521 is greater than the line width a4 of the second circuit 252 at the second bottom surface 2522.

Wherein the fingerprint sensor 20 is a sheet structure, the fingerprint sensor 20 may be a full screen capacitive fingerprint sensor. "full screen" means that the fingerprint sensor 20 covers the display surface 31 up to a predetermined percentage. For example, the fingerprint sensor 20 covers the display surface 31 by 80%, 85%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99% or 100%, and even the fingerprint sensor 20 covers the display surface 31 by more than 100%, where the fingerprint sensor 20 covers and extends beyond the display surface 31.

It can be understood that with the continuous development of the intelligent mobile terminal technology, the application of fingerprint identification is more and more extensive. For example, fingerprint recognition may be used for screen unlocking, quick payment, encryption, fingerprint key functionality, and the like. The current fingerprint identification scheme is mainly optical fingerprint identification under a partial screen. The optical fingerprint identification collects fingerprint pictures through the camera, then the fingerprint pictures are matched with user fingerprints input in the system, and if the fingerprint pictures are matched with the user fingerprints input in the system, the fingerprint identification is passed. However, the camera is bulky and requires a lot of space.

In the fingerprint sensor 20, the display assembly device 100 and the electronic device 1000 according to the embodiment of the application, the fingerprint sensor 20 covers the display surface 31, so that a full-screen fingerprint identification function can be realized, and the operation is more convenient and faster compared with a local fingerprint; in addition, compared with optical fingerprint identification, the fingerprint identification is performed by adopting the capacitive fingerprint sensor 20, and compared with the optical fingerprint identification, a camera with a larger volume is not required to be arranged, only one layer of fingerprint sensor 20 is required, the thickness is thinner, and the space design is more advantageous; furthermore, the line width a1 of the first circuit 251 at the first top surface 2511 is greater than the line width a2 of the first circuit 251 at the first bottom surface 2512, and the line width A3 of the second circuit 252 at the second top surface 2521 is greater than the line width a4 of the second circuit 252 at the second bottom surface 2522, so that the external light is prevented from being reflected by the first circuit 251 and the second circuit 252 when entering the circuit layer 25, and a user can see appearance problems such as grid lines and gray screen.

Referring to fig. 3 and 4, in the present embodiment, the display device 100 includes a cover plate 10, a fingerprint sensor 20, a display module 30 and a glue 40.

The display device 100 has a light emitting direction, and the display module 30, the fingerprint sensor 20 and the cover plate 10 are disposed along the light emitting direction; or, the cover plate 10, the fingerprint sensor 20 and the display module 30 are disposed in the opposite direction of the light emitting direction. In the embodiment of the present application, the light emitting direction of the display device 100 is the light emitting direction of the display module 30.

The cover plate 10 serves to protect the fingerprint sensor 20. The cover plate 10 may be made of any one of Sapphire (Sapphire), glass, Polyimide (PI), Polyethylene terephthalate (PET), and composite sheets. The composite plate includes Polymethyl methacrylate (PMMA) and polyamide resin (PC).

In one embodiment, the cover plate 10 is made of sapphire. Sapphire is a generic term for corundum stones of other colors than Ruby (Ruby). Sapphire has the advantages of high hardness, high transparency (about 85%), low dielectric constant (9.3-11.5) and the like. When the cover plate 10 is made of sapphire, the cover plate 10 has the advantages of high hardness, high strength, good sand paper falling effect (the cement ground can bear the falling of 1.2m height), scratch resistance and the like. When the cover plate 10 is made of sapphire, the thickness of the cover plate 10 is 0.2 mm-0.5 mm. That is, the thickness of the cap plate 10 is any value between 0.2mm and 0.5 mm. For example, the thickness of the cap plate 10 is 0.2mm, 0.23mm, 0.26mm, 0.29mm, 0.32mm, 0.35mm, 0.38mm, 0.41mm, 0.44mm, 0.47mm, 0.5mm, or the like.

In one embodiment, the cover plate 10 is made of glass. When the cover plate 10 is made of glass, the cover plate 10 has the advantages of high strength, low cost and the like. When the cover plate 10 is made of glass, the thickness of the cover plate 10 is 0.1 mm-0.4 mm. That is, the thickness of the cap plate 10 is any value between 0.1mm and 0.4 mm. For example, the thickness of the cap plate 10 is 0.1mm, 0.13mm, 0.16mm, 0.19mm, 0.22mm, 0.25mm, 0.28mm, 0.31mm, 0.34mm, 0.37mm, 0.4mm, or the like.

In one embodiment, the material of the cover plate 10 is PI. When the material of apron 10 is PI, apron 10 is flexible apron, and has advantages such as abrasive paper falls effectually. When the material of the cover plate 10 is PI, the thickness of the cover plate 10 is 0.1 mm-0.3 mm. That is, the thickness of the cap plate 10 is any value between 0.1mm and 0.3 mm. For example, the thickness of the cap plate 10 is 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, 0.3mm, etc.

In one embodiment, the cover plate 10 is made of PET. When the material of apron 10 is PET, apron 10 is flexible apron, and has the advantage such as abrasive paper falls effectually. When the cover plate 10 is made of PET, the thickness of the cover plate 10 is 0.1 mm-0.3 mm. That is, the thickness of the cap plate 10 is any value between 0.1mm and 0.3 mm. For example, the thickness of the cap plate 10 is 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, 0.3mm, etc.

In one embodiment, the cover plate 10 is made of a composite plate. The composite board is made of PMMA + PC through processes of welding, pressing and the like. PMMA has the advantages of scratch resistance and the like, while PC has the advantages of good toughness and the like, so that, when the cover plate 10 is made of a composite plate, the cover plate 10 has the advantages of scratch resistance, good toughness and the like. When the cover plate 10 is made of the composite plate, the thickness of the cover plate 10 is 0.1 mm-0.4 mm. That is, the thickness of the cap plate 10 is any value between 0.1mm and 0.4 mm. For example, the thickness of the cap plate 10 is 0.1mm, 0.13mm, 0.16mm, 0.19mm, 0.22mm, 0.25mm, 0.28mm, 0.31mm, 0.34mm, 0.37mm, 0.4mm, or the like. Wherein the thickness of PMMA is about 0.07 mm.

It will be appreciated that when the electronic device 1000 is used for fingerprint recognition, a user's finger presses on the cover 10. If the thickness of the cover plate 10 is large, the sensitivity of the fingerprint sensor 20 will be affected, and the electronic device 1000 cannot be thinned; if the thickness of the cover plate 10 is small, the fingerprint sensor 20 cannot be well protected by being pressed by a user. Therefore, when the material and thickness of the cover plate 10 satisfy the conditions in the above embodiments, the sensitivity of the fingerprint sensor 20 can be ensured, and the electronic device 1000 can be thinned, and the fingerprint sensor 20 can be protected under the pressing force of the user.

Referring to fig. 8, the cover plate 10 includes a cover plate light-emitting surface 11 and a cover plate back surface 12 opposite to each other. The cover back 12 is opposite the fingerprint sensor 20. The cover plate back surface 12 may be provided with an ink layer 13. Specifically, the ink layer 13 may be formed on the cover plate back surface 12 by a screen printing technique. The ink layer 13 has a high attenuation rate for visible light, for example, up to 70%, so that it is difficult for a user to see the area covered by the ink in the electronic device 1000 with naked eyes in normal use. For example, it is difficult for a user to see the fingerprint sensor 20 and the display module 30 inside the electronic device 1000 through the cover plate 10, and the electronic device 1000 has a beautiful appearance.

The thickness of the ink layer 13 is less than or equal to 0.2 mm. The thickness of the ink layer 13 is less than or equal to 0.2mm, so that the thickness of the display module device 100 is relatively thin, which is also beneficial for reducing the thickness of the electronic device 1000.

Referring to fig. 4 again, the fingerprint sensor 20 is located between the cover 10 and the display module 30 and covers the display surface 31 of the display module 30 to sense the fingerprint of the user touching the cover 10. The fingerprint sensor 20 may be disposed on the cover 10, particularly on one side of the cover back 12, by means of a glue 40. The fingerprint sensor 20 comprises a sensor light exit surface 21 and a sensor back surface 22, which are opposite each other. The sensor light emitting surface 21 is opposite to the cover 10 (specifically, opposite to the cover back 12), and the sensor back 22 is opposite to the display module 30. The thickness of the fingerprint sensor 20 is about 0.3 mm.

The fingerprint sensor 20 may cover the entire display surface 31 to better implement a full screen fingerprint recognition function. Namely: the fingerprint sensor 20 covers up to 100% or more than 100% of the display surface 31. When fingerprint sensor 20 covered whole display surface 31, the user can press at the optional position that display module assembly 30 corresponds, and the homoenergetic reaches fingerprint identification's purpose, and is not limited to certain specific position that display module assembly 30 corresponds, and user operation is comparatively convenient. Alternatively, the same user may press a plurality of corresponding positions on the display module 30 by using a plurality of fingers simultaneously or in a time-sharing manner; or, a plurality of users can adopt a plurality of fingers to press a plurality of positions that correspond on the display module assembly 30 simultaneously or timesharing to realize carrying out the purpose of discerning a plurality of fingerprints, strengthen the security level that electronic equipment 1000 encrypted and unlocked.

Referring to fig. 4, in an embodiment, the fingerprint sensor 20 just covers the entire display surface 31 (that is, the fingerprint sensor 20 just covers the display surface 31 by 100%), the edges of the fingerprint sensor 20 and the display module 30 are neatly arranged, which is beneficial to ensuring the stability of the combination of the fingerprint sensor 20 and the display module 30, and the fingerprint sensor 20 can realize the capacitance fingerprint identification function of the entire display module 30 with a small area. Referring to fig. 9, in another embodiment, the fingerprint sensor 20 covers and exceeds the entire display surface 31 (i.e. the fingerprint sensor 20 covers more than 100% of the display surface 31) to ensure the reliability of the fingerprint identification performance of the edge position of the display module 30.

Referring to fig. 5 and 6, the fingerprint sensor 20 includes a substrate 23, a shielding layer 24, a circuit layer 25 and a protection layer 27 disposed along the light emitting direction of the display module 30. The substrate 23, the shield layer 24, the wiring layer 25, and the protective layer 27 are sequentially stacked. The surface of the substrate 23 opposite to the shield layer 24 serves as the sensor back surface 22, and the surface of the protective layer 27 opposite to the wiring layer 25 serves as the sensor back surface 22.

The substrate 23 is made of glass or PI. The light transmittance of the glass and the PI is high, and the normal display of the display module 30 cannot be influenced. In addition, when the substrate 23 is made of glass, the fingerprint sensor 20 has low cost; when the substrate 23 is made of PI, the fingerprint sensor 20 can be conveniently formed into a flexible sensor.

The shield layer 24 is located between the substrate 23 and the line layer 25. The shielding layer 24 (or referred to as a high barrier layer) may be a high resistance film, the shielding layer 24 being made of a transparent material. In one embodiment, the composition of the barrier layer 24 is a mixture of graphite oxide, tin oxide, a surfactant, and a cross-linking agent. Set up shielding layer 24 between substrate 23 and circuit layer 25, can play the shielding effect, reduce mutual interference between fingerprint sensor 20 and the display module assembly 30, avoid because mutual interference between fingerprint sensor 20 and the display module assembly 30, and influence fingerprint sensor 20 and display module assembly 30's function.

The thickness of the shielding layer 24 may be 20nm to 60 nm. That is, the thickness of the shielding layer 24 is any value between 20nm and 60 nm. For example, the thickness of the shielding layer 24 is 20nm, 24nm, 28nm, 32nm, 36nm, 40nm, 44nm, 48nm, 52nm, 56nm, 60nm, or the like.

Referring to fig. 6, the circuit layer 25 includes a plurality of first circuits 251 and a plurality of second circuits 252. For example, in fig. 6, the first line 251 has seven lines (for example only, the actual number of lines is much larger than that), and the second line 252 also has seven lines (for example only, the actual number of lines is much larger than that). The plurality of first lines 251 are regularly arranged, and the plurality of second lines 252 are also regularly arranged. Specifically, the plurality of first lines 251 may be parallel to each other, and the plurality of second lines 252 may be parallel to each other.

Referring to fig. 7, the first circuit 251 includes a first top surface 2511 and a first bottom surface 2512 opposite to each other, and the second circuit 252 includes a second top surface 2521 and a second bottom surface 2522 opposite to each other. The line width a1 of the first circuit 251 at the first top surface 2511 is greater than the line width a2 of the first circuit 251 at the first bottom surface 2512, and the line width A3 of the second circuit 252 at the second top surface 2521 is greater than the line width a4 of the second circuit 252 at the second bottom surface 2522. It can be understood that, since the fingerprint sensor 20 is disposed on the back surface 12 of the cover plate, when external light enters the circuit layer 25, the external light is easily reflected by the first circuit 251 and the second circuit 252, so that when the display module 30 is in a screen-off state, a user can see that the screen is grayed; and under the bright screen state of display module assembly 30, the user sees that there is the grid line, gives the not good experience of user. In the embodiment of the present application, the line width a1 of the first line 251 at the first top surface 2511 is greater than the line width a2 of the first line 251 at the first bottom surface 2512, the line width A3 of the second line 252 at the second top surface 2521 is greater than the line width a4 of the second line 252 at the second bottom surface 2522, and the first line 251 and the second line 252 are respectively in an inverted trapezoid shape as a whole, so that side light reflection of the first line 251 and the second line 252 can be avoided, and the appearance problems of grid lines, graying of screens and the like seen by a user can be avoided.

Referring to fig. 7, a first shielding line 261 is disposed on the first top surface 2511, and a second shielding line 262 is disposed on the second top surface 2521. The first shielding line 261 corresponds to the first circuit 251 in position, and the second shielding line 262 corresponds to the second circuit 252 in position. Specifically, an orthographic projection of the first shielding line 261 on the substrate 23 may coincide with an orthographic projection of the first line 251 on the substrate 23, and an orthographic projection of the second shielding line 262 on the substrate 23 may coincide with an orthographic projection of the second line 252 on the substrate 23. The first shielding lines 261 can be formed on the first top surface 2511 by sputtering, and the second shielding lines 262 can be formed on the second top surface 2521 by sputtering. The first shielding line 261 and the second shielding line 262 are made of black light absorbing material. The first top surface 2511 is provided with the first shielding line 261, and the second top surface 2521 is provided with the second shielding line 262, so that front reflection of the first line 251 and the second line 252 (namely, reflection of the first top surface 2511 and the second top surface 2521) can be avoided, and appearance problems of grid lines, graying of screens and the like seen by a user can be further avoided.

Referring to fig. 6 and 7, the circuit layer 25 may be formed by: firstly, a layer of the first circuit 251 is arranged, and a first shielding line 261 is sputtered on the first top surface 2511, and then a layer of the second circuit 252 is arranged, and a second shielding line 262 is sputtered on the second top surface 2521; alternatively, without limitation, a layer of the second circuit 252 is disposed and the second shielding line 262 is sputtered on the second top surface 2521, and a layer of the first circuit 251 is disposed and the first shielding line 261 is sputtered on the first top surface 2511. The circuit layer 25 may further include an insulating layer disposed between the first circuit 251 and the second circuit 252, and the insulating layer may prevent a short circuit from occurring between the first circuit 251 and the second circuit 252.

The material of the first circuit 251 is any one of molybdenum, aluminum, molybdenum, copper, or silver. That is, the material of the first circuit 251 may be mo, al, mo; alternatively, the first line 251 is made of copper; alternatively, the first line 251 is made of silver. Referring to fig. 10, the line width a1 of the first circuit 251 (i.e., the line width a1 of the first circuit 251 at the first top surface 2511) is 3 μm to 10 μm. That is, the line width a1 of the first line 251 is an arbitrary value between 3 μm and 10 μm. For example, the line width A1 of the first line 251 is 3 μm, 3.5 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 9.5 μm, 10 μm, or the like. The spacing a5 between two adjacent first lines 251 (i.e., the spacing between two adjacent first lines 251 at the first top surface 2511) is 40 μm to 120 μm. That is, the distance a5 between two adjacent first lines 251 is any value between 40 μm and 120 μm. For example, the pitch A5 between two adjacent first lines 251 is 40 μm, 45 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, or the like.

The line type of the first line 251 is any one or more of a straight line, a curved line, or a bent line. That is, the line type of the first line 251 is a straight line; alternatively, the line shape of the first line 251 is a curve; alternatively, the line type of the first line 251 is a meander line; alternatively, the line type of the first line 251 is a straight line and a curved line; alternatively, the line type of the first line 251 is a straight line and a bent line; alternatively, the line type of the first line 251 is a curved line or a bent line; alternatively, the line type of the first line 251 is a straight line, a curved line, or a bent line. Here, when the first lines 251 include at least two line types, it may be that each portion has a different line type in the same first line 251. For example, the first line 251 is divided into 3 portions from one end to the other end, the first portion is a straight line, the second portion is a curved line, and the third portion is a bent line. Alternatively, when the first lines 251 include at least two line types, it may also refer to that each of the first lines 251 has a different line type among the plurality of first lines 251. For example, there are three first lines 251, the first line 251 is a straight line, the second line 251 is a curved line, and the third line 251 is a bent line. Note that the line type of the first line 251 is a line type of the first line 251 as a whole, and the inverted trapezoidal structure of the first line 251 is omitted.

The line width of the first shielding line 261 may be equal to the line width a1 of the first line 251, and the line type of the first shielding line 261 may be identical to the line type of the first line 251. That is, the line width of the first shielding line 261 is also 3 μm to 10 μm, and the line shape of the first shielding line 261 is also any one or more of a straight line, a curved line, or a bent line, which will not be described in detail herein.

The second line 252 is made of any one of molybdenum, aluminum, molybdenum, copper, or silver. That is, the material of the second circuit 252 may be mo, al, mo; alternatively, the second line 252 is made of copper; alternatively, the second line 252 is made of silver. Referring to fig. 10, the line width A3 of the second circuit 252 (i.e., the line width A3 of the second circuit 252 at the second top surface 2521) is 3 μm to 10 μm. That is, the line width a3 of the second wiring 252 is an arbitrary value between 3 μm and 10 μm. For example, the line width A3 of the second line 252 is 3 μm, 3.5 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 9.5 μm, 10 μm, or the like. The spacing a6 between two adjacent second lines 252 (i.e., the spacing between two adjacent second lines 252 at the second top surface 2521) is 40 μm to 120 μm. That is, the pitch a6 between two adjacent second lines 252 is any value between 40 μm and 120 μm. For example, the pitch a6 between two adjacent second lines 252 is 40 μm, 45 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, or the like.

The second line 252 may have any one or more of a straight line, a curved line, and a bent line. That is, the line type of the second line 252 is a straight line; alternatively, the second line 252 has a linear shape; alternatively, the line shape of the second line 252 is a meander line; alternatively, the line type of the second line 252 is a straight line and a curved line; alternatively, the line type of the second line 252 is a straight line and a bent line; alternatively, the second line 252 may have a curved line or a bent line; alternatively, the line type of the second line 252 may be a straight line, a curved line, or a bent line. When the second line 252 includes at least two line types, the fingers may be in the same second line 252, and each portion has a different line type. For example, the second line 252 is divided into 3 portions from one end to the other end, the first portion is a straight line, the second portion is a curved line, and the third portion is a meander line. Alternatively, when the second line 252 includes at least two line types, it may also be referred to that each second line 252 has a different line type among the plurality of second lines 252. For example, the second lines 252 have three lines, the first line 252 is a straight line, the second line 252 is a curved line, and the third line 252 is a bent line. Note that the line type of the second line 252 is a line type of the second line 252 as a whole, and the inverted trapezoidal structure of the second line 252 is omitted.

The line width of the second shielding line 262 may be equal to the line width a3 of the second line 252, and the line type of the second shielding line 262 may be identical to the line type of the second line 252. That is, the line width of the second shielding line 262 is also 3 μm to 10 μm, and the line shape of the second shielding line 262 is also any one or more of a straight line, a curved line, or a bent line, which will not be described in detail herein.

The material of the first line 251 and the material of the second line 252 may be the same or different. For example, the first circuit 251 and the second circuit 252 are made of molybdenum, aluminum, molybdenum; for another example, the first line 251 is made of mo-al-mo, and the second line 252 is made of cu. The line width a1 of the first line 251 and the line width A3 of the second line 252 may be the same or different. For example, the line width a1 of the first line 251 and the line width A3 of the second line 252 are both 3 μm; for another example, the line width a1 of the first line 251 is 3 μm, and the line width A3 of the second line 252 is 5 μm. The distance a5 between two adjacent first lines 251 and the distance a6 between two adjacent second lines 252 may be the same or different. For example, the spacing a5 between two adjacent first lines 251 and the spacing a6 between two adjacent second lines 252 are both 40 μm; for another example, the pitch a5 between two adjacent first lines 251 is 40 μm, and the pitch a6 between two adjacent second lines 252 is 50 μm. The line type of the first line 251 may be the same as or different from that of the second line 252. For example, the line type of the first line 251 and the line type of the second line 252 are both straight lines; for another example, the first line 251 has a straight line shape, and the second line 252 has a bent line shape. When the material of the first circuit 251, the line width a1, the line shape, and the distance a5 between two adjacent first circuits 251 are the same as the material of the second circuit 252, the line width A3, the line shape, and the distance a6 between two adjacent second circuits 252, the manufacturing of the circuit layer 25 is facilitated (for example, the second circuit 252 can be obtained by rotating the first circuit 251 by 90 degrees).

Referring to fig. 6, 10 and 11, the orthographic projections of the first lines 251 and the second lines 252 on the substrate 23 intersect, which specifically includes: the orthographic projections of the first lines 251 and the second lines 252 on the substrate 23 form acute angles and obtuse angles, or as shown in fig. 10, the orthographic projections of the first lines 251 and the second lines 252 on the substrate 23 are perpendicular to each other.

In the present embodiment, the fingerprint sensor 20 adopts a capacitive coupling principle (specifically, mutual capacitance type), the first line 251 can be used as a transmitting end, and the second line 252 can be used as a receiving end (or the second line 252 can be used as a transmitting end, and the first line 251 can also be used as a receiving end). The first line 251 is connected to a power source for emitting an excitation signal. The second line 252 is connected to the output terminal for receiving the signal and outputting the capacitance value to the sensor chip 201 (as shown in fig. 3). The first circuit 251 and the second circuit 252 intersect to form a capacitor, and the first circuit 251 and the second circuit 252 respectively form two poles of the capacitor. When the electronic device 1000 is used for fingerprint recognition, a finger of a user presses on the fingerprint sensor 20 through the cover plate 10, which affects the coupling between the two electrodes near the touch point, thereby changing the capacitance value of the corresponding intersection point. Because the surface of the finger has wave crests and wave troughs which have different influences on the capacitance values of the intersection points, corresponding fingerprint images can be obtained according to the change of the capacitance values of the different intersection points.

In addition, the circuit layer 25 may further include electronic components such as a Thin-film transistor (TFT) and a capacitor. The TFT is used for realizing signal switching and controlling signals to be scanned row by row or column by column.

The fingerprint sensor 20 acquires a fingerprint image by using a capacitance value, so as to perform fingerprint recognition, and compared with optical fingerprint recognition, the fingerprint recognition device has the advantages of higher recognition speed and high sensitivity, does not need the self-luminescence of the Display Module 30 to collect a fingerprint picture, can perform fingerprint recognition in a dark scene, can support a Liquid Crystal Display (LCM) Display screen, and is lower in cost.

Referring to fig. 5 and 6, the protection layer 27 is disposed on the circuit layer 25, and the protection layer 27 is used for protecting the circuit layer 25. The protection layer 27 may be made of a material having characteristics of high transmittance, corrosion resistance, scratch resistance, etc. so as to not affect the normal display of the display module 30 and to better protect the circuit layer 25. The thickness of the protective layer 27 is less than or equal to 50 μm, so that the thickness of the fingerprint sensor 20 is thin. The dielectric constant of the protective layer 27 is greater than 4. It is understood that the dielectric constant of the protection layer 27 is positively correlated with the penetration thickness, and when the dielectric constant of the protection layer 27 is greater than 4, the penetration thickness of the protection layer 27 is greater, which does not affect the normal operation of the fingerprint sensor 20.

Referring to fig. 4, the display module 30 can be used for displaying images such as pictures, videos, and texts. The display module 30 is disposed on the fingerprint sensor 20 through the adhesive 40, and is specifically disposed on one side of the sensor back 22. The display module 30 includes a display surface 31 and a screen back surface 32 opposite to each other. The display surface 31 is opposite the fingerprint sensor 20 (in particular opposite the sensor back surface 22). In the above embodiment, when the fingerprint sensor 20 just covers the entire display surface 31, the area of the sensor back surface 22 is equal to the area of the display surface 31 (as shown in FIG. 4), the length of the sensor back surface 22 is equal to the length of the display surface 31, and the width of the sensor back surface 22 is equal to the width of the display surface 31. When the fingerprint sensor 20 covers and extends beyond the entire display surface 31, the area of the sensor back 22 is greater than the area of the display surface 31 (as shown in FIG. 9), the length of the sensor back 22 is greater than the length of the display surface 31, and the width of the sensor back 22 is equal to the width of the display surface 31; alternatively, the length of the sensor back 22 is equal to the length of the display surface 31, and the width of the sensor back 22 is greater than the width of the display surface 31; alternatively, the length of the sensor back surface 22 is greater than the length of the display surface 31, and the width of the sensor back surface 22 is greater than the width of the display surface 31.

The display module 30 may be a hard screen or a flexible screen. Preferably, when the display module 30 is a hard screen, the substrate 23 is made of glass, so that the cost is low; the first line 251 and the second line 252 are made of any one of metal, ITO, or nano silver paste. When the display module 30 is a flexible screen, the substrate 23 is made of PI to form a flexible sensor; the first circuit 251 and the second circuit 252 are made of ITO or nano silver paste to form a flexible circuit. Of course, in other embodiments, when the display module 30 is a hard screen, the material of the fingerprint sensor 20 may also be PI, which is not limited herein.

Referring to fig. 12 and 13, the display module 30 may be an LCM display 33 or an Organic Light-Emitting Diode (OLED) display 34 (including an Active-matrix Organic Light-Emitting Diode (AMOLED)). Because the fingerprint sensor 20 performs fingerprint identification through the capacitance value, the display module 30 does not need to self-emit light to collect a fingerprint picture, and therefore when the display module 30 is an LCM display screen 33, an OLED display screen 34 or other types of display screens, the capacitance fingerprint identification function can be achieved, that is, the display module 30 is not limited to the OLED display screen 34.

Referring to fig. 12, when the display module 30 is an LCM display screen 33, it is beneficial to reduce the cost of the electronic device 1000 (the cost of the LCM display screen 33 is lower than that of the OLED display screen). The LCM display panel 33 may include a backlight module 331, a lower polarizer 332, a TFT substrate 333, a liquid crystal layer 334, a color filter 335, and an upper polarizer 336 disposed along the light exit direction of the display device 100. The surface of the upper polarizer 336 opposite to the color filter 335 serves as the display surface 31, and the surface of the backlight module 331 opposite to the lower polarizer 332 serves as the screen back surface 32. The LCM display screen 33 emits light through the backlight module 331, and the light sequentially passes through the lower polarizer 332, the TFT substrate 333, the liquid crystal layer 334, the color filter 335, the upper polarizer 336, the fingerprint sensor 20, and the cover plate 10 to reach the outside, and is perceived by human eyes, so that the human eyes acquire images displayed by the display module 30.

Referring to fig. 13, when the display module 30 is an OLED display 34, a curved screen or other forms can be implemented to provide more choices for users. The OLED display 34 may include a glass TFT substrate 341, an organic light emitting diode 342, an encapsulation glass 343, and an OLED polarizer 344 disposed along a light emitting direction of the display module apparatus 100. The surface of the OLED polarizer 344 opposite to the encapsulation glass 343 serves as the display surface 31, and the surface of the glass TFT substrate 341 opposite to the organic light emitting diode 342 serves as the screen back surface 32. The OLED display 34 emits light through the organic light emitting diode 342, and the light sequentially passes through the encapsulation glass 343, the OLED polarizer 344, the fingerprint sensor 20, and the cover plate 10 to reach the outside, and is sensed by human eyes, so that the human eyes can acquire images displayed by the display module 30.

Referring to fig. 14 and 15, the display module 30 of the present embodiment may be integrated with a touch function in addition to the display function. At this time, the display module 30 may further include a touch sensor 35. As shown in fig. 14, when the display module 30 is an LCM display 33, the backlight module 331, the lower polarizer 332, the TFT substrate 333, the liquid crystal layer 334, the color filter 335, and the upper polarizer 336 (or the polarizer 60) serve as a display module, and the touch sensor 35 serves as a touch module. As shown in fig. 15, when the display module 30 is an OLED display 34, the glass TFT substrate 341, the organic light emitting diode 342, the encapsulation glass 343, and the OLED polarizer 344 (or the polarizer 60 later) are used as a display module, and the touch sensor 35 is used as a touch module. The display module and the touch module can be relatively independent two modules, and the two modules are integrated through a rear-end laminating process. Alternatively, referring to fig. 16, the touch module can be embedded in the display module, for example, in fig. 16, the touch sensor 35 is disposed between the color filter 335 and the liquid crystal layer 334. Alternatively, the touch sensor 35 is formed by forming an element such as a transparent electrode directly on the surface of the color filter 335 facing the liquid crystal layer 334. The touch sensor 35 according to the embodiment of the present invention may be a resistive touch sensor, a capacitive touch sensor, an infrared touch sensor, an acoustic wave touch sensor, an optical imaging touch sensor, an electromagnetic induction touch sensor, or the like, and is not limited thereto.

Referring to fig. 4 again, the adhesive 40 is used for adhering the cover plate 10, the fingerprint sensor 20 and the display module 30. Adopt colloid 40 bonding apron 10, full-screen electric capacity fingerprint sensor 20 and display module assembly 30, can guarantee the structural strength of display module 100 and the reliability of fingerprint identification performance. When the display module 30 is the LCM display 33, the adhesive 40 is used to adhere the cover plate 10, the fingerprint sensor 20 and the upper polarizer 336. When the display module 30 is the OLED display 34, the adhesive 40 is used for adhering the cover plate 10, the fingerprint sensor 20 and the OLED polarizer 344.

The glue 40 is used for bonding the cover plate 10, the fingerprint sensor 20 and the display module 30, and means that: the glue 40 adheres the cover plate 10, the fingerprint sensor 20 and the display module 30. For example, the glue 40 adheres the cover plate 10 and the fingerprint sensor 20, and adheres the fingerprint sensor 20 and the display module 30 at the same time; or, the glue 40 adheres the cover plate 10 and the fingerprint sensor 20, and adheres the cover plate 10 and the display module 30 at the same time; or the colloid 40 adheres the cover plate 10 and the display module 30, and also adheres the fingerprint sensor 20 and the display module 30; or, colloid 40 bonds apron 10 and fingerprint sensor 20, bonds apron 10 and display module assembly 30 simultaneously, bonds fingerprint sensor 20 and display module assembly 30 simultaneously.

The colloid 40 may be any one of an optical Adhesive, specifically, an Optically Clear Adhesive (OCA), a PolyVinyl Butyral Film (PVB), or a Die Attach Film (DAF). That is, the colloid 40 is OCA; alternatively, the colloid 40 is PVB; alternatively, the colloid 40 is DAF.

Referring to fig. 4, in one embodiment, the glue 40 includes a first optical glue 41 and a second optical glue 42. The first optical adhesive 41 is used for bonding the cover plate 10 and the fingerprint sensor 20, and specifically bonds the cover plate back 12 and the sensor light emitting surface 21. The second optical adhesive 42 is used for bonding the fingerprint sensor 20 and the display module 30, and specifically bonds the sensor back 22 and the display surface 31. In this embodiment, the cover plate 10, the first optical adhesive 41, the fingerprint sensor 20, the second optical adhesive 42 and the display module 30 are sequentially stacked along the opposite direction of the light emitting direction of the display device 100.

The first optical adhesive 41 may be adhered to the cover plate 10 and the fingerprint sensor 20 by a full-lamination method.

The method for bonding the cover plate 10 and the fingerprint sensor 20 by adopting the full-lamination mode is as follows: the cover plate 10 and the fingerprint sensor 20 are completely adhered together in a seamless manner, the first optical glue 41 coats the entire surface of the cover plate 10 or the entire surface of the fingerprint sensor 20, and there is no air layer between the cover plate 10 and the fingerprint sensor 20. Adopt bonding apron 10 and fingerprint sensor 20 of full laminating mode for it is more firm to bond between apron 10 and the fingerprint sensor 20, and fingerprint sensor 20 can not take place the skew along with the increase of live time for the position of apron 10, is favorable to improving fingerprint sensor 20 and carries out fingerprint identification's reliability, in addition, also can reduce the probability that dust, moisture etc. got into between apron 10 and the fingerprint sensor 20.

First optical adhesive 41 may include any one of OCA, PVB, or DAF. When first optical cement 41 is OCA, first optical cement 41 is softer, and laminating processing technology is simple, and when user's finger pressed on apron 10, first optical cement 41 can play certain cushioning effect to apron 10 and fingerprint sensor 20. When first optical cement 41 is PVB, the bonding effect of first optical cement 41 is stronger, which is beneficial to ensuring the stability of the structure between cover plate 10 and fingerprint sensor 20. When the first optical adhesive 41 is a DAF, the problem of bubbles generated during the attaching process can be reduced, which is beneficial to improving the attaching yield and improving the flatness between the cover plate 10 and the fingerprint sensor 20.

When the first optical adhesive 41 is OCA, PVB, or DAF, the thickness of the first optical adhesive 41 is 0.05mm to 0.15 mm. That is, the thickness of the first optical glue 41 is any value between 0.05mm and 0.15 mm. For example, the thickness of the first optical glue 41 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, or the like. Preferably, the thickness of the first optical adhesive 41 is 0.1mm, which not only ensures the stability of the attachment between the cover plate 10 and the fingerprint sensor 20, but also does not excessively increase the thickness of the electronic device 1000.

The second optical adhesive 42 can be adhered to the fingerprint sensor 20 and the display module 30 in a full-lamination manner or a frame lamination manner.

Adopt full laminating mode bonding fingerprint sensor 20 and display module assembly 30 to be promptly: paste fingerprint sensor 20 and display module assembly 30 together with seamless mode completely, the whole face of second optical cement 42 coating fingerprint sensor 20 or the whole face of display module assembly 30 do not have the air bed between fingerprint sensor 20 and the display module assembly 30. Adopt bonding fingerprint sensor 20 and display module assembly 30 of full laminating mode for it is more firm to bond between fingerprint sensor 20 and the display module assembly 30, and display module assembly 30 can not take place the skew along with the increase of live time for fingerprint sensor 20's position, is favorable to improving the regional uniformity of display area and fingerprint identification, in addition, also can reduce the probability between dust, moisture etc. entering fingerprint sensor 20 and the display module assembly 30.

Referring to fig. 17, the frame-bonding method for bonding the fingerprint sensor 20 and the display module 30 is as follows: frame part or edge part with fingerprint sensor 20 and display module assembly 30 pastes together, and second optical cement 42 coating fingerprint sensor 20 all around or display module assembly 30 around (round around), can exist the air layer between fingerprint sensor 20 and the display module assembly 30. Of course, some transparent materials (e.g., PET, which costs less than optical cement) can be used to fill the air layer, so that the structure is more stable and the probability of dust, moisture, etc. entering between the fingerprint sensor 20 and the display module 30 is reduced. Adopt frame mode bonding fingerprint sensor 20 and display module assembly 30 for the usable floor area of second optical cement 42 is less, is favorable to saving the cost, and the laminating yield is higher. In addition, when the fingerprint sensor 20 is damaged, the fingerprint sensor 20 can be easily detached from the display module 30, the fingerprint sensor 20 is replaced, and the fingerprint sensor 20 and the display module 30 do not need to be replaced; or, when display module assembly 30 takes place to damage, can dismantle display module assembly 30 from fingerprint sensor 20 very easily, carry out display module assembly 30's change, and need not to change display module assembly 30 and fingerprint sensor 20 all.

Second optical adhesive 42 may include any one of OCA, PVB, or DAF. When second optical cement 42 is OCA, second optical cement 42 is softer, and laminating processing technology is simple, and when user's finger pressed on apron 10, second optical cement 42 can play certain cushioning effect to fingerprint sensor 20 and display module assembly 30. When second optical cement 42 is PVB, second optical cement 42's adhesive effect is stronger, is favorable to guaranteeing the stability of structure between fingerprint sensor 20 and the display module assembly 30. When the second optical adhesive 42 is a DAF, the problem of bubbles generated during the attaching process can be reduced, which is beneficial to improving the attaching yield and improving the flatness between the fingerprint sensor 20 and the display module 30.

When the second optical adhesive 42 is OCA, PVB or DAF, the thickness of the second optical adhesive 42 is 0.05 mm-0.15 mm. That is, the thickness of the second optical glue 42 is anywhere between 0.05mm to 0.15 mm. For example, the thickness of the second optical glue 42 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, etc. Preferably, the thickness of the second optical adhesive 42 is 0.1mm, which not only ensures the stability of the attachment between the cover plate 10 and the fingerprint sensor 20, but also does not excessively increase the thickness of the electronic device 1000.

It should be noted that the kind of the first optical glue 41 and the kind of the second optical glue 42 may be the same or different, for example, when the kind of the first optical glue 41 is the same as the kind of the second optical glue 42, both the first optical glue 41 and the second optical glue 42 are OCA, both PVB, or both DAF. When the type of the first optical adhesive 41 is different from that of the second optical adhesive 42, the first optical adhesive 41 is OCA, and the second optical adhesive 42 is PVB; alternatively, the first optical adhesive 41 is PVB, and the second optical adhesive 42 is DAF; alternatively, the first optical adhesive 41 is DAF, the second optical adhesive 42 is OCA, and so on, which are not listed here. The thickness of the first optical glue 41 and the thickness of the second optical glue 42 may be the same or different, for example, when the thickness of the first optical glue 41 is the same as the thickness of the second optical glue 42, the thickness of the first optical glue 41 and the thickness of the second optical glue 42 are both 0.09mm, or both 0.1mm, or both 0.11 mm. When the thickness of the first optical adhesive 41 is different from that of the second optical adhesive 42, the thickness of the first optical adhesive 41 is 0.09mm, and the thickness of the second optical adhesive 42 is 0.1 mm; or the thickness of the first optical cement 41 is 0.1mm, and the thickness of the second optical cement 42 is 0.11 mm; alternatively, the thickness of the first optical glue 41 is 0.11mm, the thickness of the second optical glue 42 is 0.1mm, and so on, which are not listed here.

Referring to fig. 18, in another embodiment, the glue 40 includes a first optical glue 41 and a second optical glue 42. The first optical adhesive 41 is used for bonding the cover plate 10 and the fingerprint sensor 20, and specifically bonds the cover plate back 12 and the sensor light emitting surface 21. The second optical adhesive 42 is used for bonding the cover plate 10 and the display module 30, and specifically bonds the cover plate back surface 12 and the display surface 31. In this embodiment, in the opposite direction of the light emitting direction of the display device 100, in the middle area of the cover plate 10, the first optical cement 41, the fingerprint sensor 20 and the display module 30 are sequentially stacked; in the edge area of the cover plate 10, the second optical adhesive 42 and the display module 30 are sequentially stacked.

As in the previous embodiment, the first optical adhesive 41 may be a full-lamination adhesive for bonding the cover plate 10 and the fingerprint sensor 20; first optical adhesive 41 may include any one of OCA, PVB, or DAF; when the first optical adhesive 41 is OCA, PVB, or DAF, the thickness of the first optical adhesive 41 is 0.05mm to 0.15mm, and will not be described in detail herein.

The second optical adhesive 42 can be used to bond the cover plate 10 and the display module 30 by frame adhesion.

The method of adhering the cover plate 10 and the display module 30 by frame adhesion is as follows: the cover plate 10 and the frame portion or the edge portion of the display module 30 are adhered together, the second optical adhesive 42 coats the periphery of the cover plate 10 or the periphery (one circle) of the display module 30, and an air layer may exist between the cover plate 10 and the display module 30 (as shown in fig. 18). Of course, some transparent materials (e.g. PET, which costs less than optical cement) can be used to fill the air layer, so that the structure is more stable and the probability of dust, moisture, etc. entering between the cover plate 10 and the display module 30 is reduced. The air layer can also be formed at the periphery of the second optical cement 42 instead of between the second optical cement 42 and the first optical cement 41 as shown in fig. 18, and at this time, the air layer can also be used for placing electronic components or performing circuit routing to save space. Or, because first optical cement 41 and fingerprint sensor 20 are located between apron 10 and display module assembly 30, first optical cement 41 and fingerprint sensor 20 have just filled the air gap between apron 10 and the display module assembly 30 for there is not the air bed (as shown in fig. 19) between apron 10 and the display module assembly 30. The cover plate 10 and the display module 30 are bonded by adopting a frame bonding mode, so that the use area of the second optical cement 42 is smaller, the cost is saved, and the bonding yield is higher. In addition, the thickness of the second optical adhesive 42 may be equal to or approximately equal to the sum of the thicknesses of the first optical adhesive 41 and the fingerprint sensor 20, and compared to the case (shown in fig. 4) where the first optical adhesive 41 bonds the cover plate 10 and the fingerprint sensor 20, and the second optical adhesive 42 bonds the fingerprint sensor 20 and the display module 30, the thickness of the display device 100 is only composed of the cover plate 10, the first optical adhesive 41, the fingerprint sensor 20 and the display module 30, i.e., the thickness of the second optical adhesive 42 is saved, the thickness of the display device 100 is smaller, which is beneficial to implementing the light and thin of the electronic device 1000. Moreover, when the cover plate 10 is damaged, the cover plate 10 can be easily detached from the display module 30 to replace the cover plate 10, and the cover plate 10 and the display module 30 do not need to be replaced; or, when the display module 30 is damaged, the display module 30 can be easily detached from the cover plate 10 to replace the display module 30, and the display module 30 and the cover plate 10 do not need to be replaced.

As in the previous embodiment, second optical adhesive 42 may include any one of OCA, PVB, or DAF; when the second optical adhesive 42 is OCA, PVB or DAF, the thickness of the second optical adhesive 42 is 0.05 mm-0.15 mm; the kind of the first optical glue 41 and the kind of the second optical glue 42 may be the same or different.

Referring to fig. 20, the display device 100 may further include a reinforcing layer 50, wherein the reinforcing layer 50 is disposed between the fingerprint sensor 20 and the display module 30, and particularly between the sensor back 22 and the display surface 31. The reinforcing layer 50 includes a reinforcing light-emitting surface 51 and a reinforcing back surface 52 opposite to each other. The reinforcing light emitting surface 51 is opposite to the sensor back surface 22, and the reinforcing back surface 52 is opposite to the display surface 31.

The reinforcing layer 50 and the cover plate 10 form a double-layer cover plate structure. The reinforcement layer 50 may reinforce the strength of the entire display assembly apparatus 100 with a cover plate 10 having a thickness of only 0.3mm or less, reducing the probability of failure of the fingerprint sensor 20 due to impact or shock during subsequent use of the electronic device 1000.

The material of the reinforcing layer 50 may be any one of sapphire, glass, PI, PET, or a composite plate. The above explanations of sapphire, glass, PI, PET, and composite plates are also applicable to the embodiments of the present application, and will not be described in detail herein. When the material of the reinforcing layer 50 is any one of sapphire, glass, PI, PET, or a composite plate, the thickness of the reinforcing layer 50 is 0.1mm to 0.5 mm. That is, the thickness of the reinforcing layer 50 is any value between 0.1mm and 0.5 mm. For example, the thickness of the reinforcing layer 50 is 0.1mm, 0.14mm, 0.18mm, 0.22mm, 0.26mm, 0.3mm, 0.34mm, 0.38mm, 0.42mm, 0.46mm, 0.5mm, or the like.

When the display device assembly 100 includes the reinforcing layer 50, the adhesive 40 is used to adhere the cover plate 10, the fingerprint sensor 20, the reinforcing layer 50 and the display module 30. The colloid 40 is used for bonding the cover plate 10, the fingerprint sensor 20, the reinforcing layer 50 and the display module 30, and means that: the glue 40 bonds the cover plate 10, the fingerprint sensor 20, the reinforcing layer 50 and the display module 30. For example, the glue 40 adheres the cover plate 10 and the fingerprint sensor 20, adheres the fingerprint sensor 20 and the reinforcing layer 50, and adheres the reinforcing layer 50 and the display module 30; or, the colloid 40 bonds the cover plate 10 and the fingerprint sensor 20, simultaneously bonds the fingerprint sensor 20 and the reinforcing layer 50, and simultaneously bonds the fingerprint sensor 20 and the display module 30; or the colloid 40 bonds the cover plate 10 and the fingerprint sensor 20, simultaneously bonds the fingerprint sensor 20 and the display module 30, and simultaneously bonds the reinforcing layer 50 and the display module 30; or, colloid 40 bonds apron 10 and fingerprint sensor 20, bonds fingerprint sensor 20 and strengthening layer 50 simultaneously, bonds fingerprint sensor 20 and display module assembly 30 simultaneously, bonds strengthening layer 50 and display module assembly 30 etc. simultaneously, does not do the restriction here.

Referring to fig. 20, in one embodiment, the glue 40 includes a first optical glue 41, a third optical glue 43, and a fourth optical glue 44. The first optical adhesive 41 is used for bonding the cover plate 10 and the fingerprint sensor 20, and specifically bonds the cover plate back 12 and the sensor light emitting surface 21. The third optical adhesive 43 is used for bonding the fingerprint sensor 20 and the reinforcing layer 50, and specifically for bonding the sensor back 22 and the reinforcing light-emitting surface 51. The fourth optical adhesive 44 is used for bonding the reinforcing layer 50 and the display module 30, and specifically for bonding the reinforcing back 52 and the display surface 31. In this embodiment, along the opposite direction of the light emitting direction of the display device assembly 100, the cover plate 10, the first optical cement 41, the fingerprint sensor 20, the third optical cement 43, the reinforcing layer 50, the fourth optical cement 44 and the display module 30 are sequentially stacked, that is, the original second optical cement 42 is replaced by the third optical cement 43 and the fourth optical cement 44, and the reinforcing layer 50 disposed between the fingerprint sensor 20 and the display module 30 is added.

The third optical adhesive 43 may be bonded to the fingerprint sensor 20 and the reinforcing layer 50 by a full-lamination method or a frame-lamination method.

Referring to fig. 20, the bonding of the fingerprint sensor 20 and the reinforcing layer 50 by the full-lamination method is: the fingerprint sensor 20 and the reinforcing layer 50 are completely adhered together in a seamless manner, the third optical cement 43 coats the whole surface of the fingerprint sensor 20 or the whole surface of the reinforcing layer 50, and no air layer exists between the fingerprint sensor 20 and the reinforcing layer 50. Adopt full laminating mode bonding fingerprint sensor 20 and strengthening layer 50 for it is more firm to bond between fingerprint sensor 20 and the strengthening layer 50, and the reinforcement effect is better, in addition, also can reduce the probability that dust, moisture etc. got into between fingerprint sensor 20 and the strengthening layer 50.

Referring to fig. 21, the frame-bonding method for bonding the fingerprint sensor 20 and the reinforcing layer 50 is as follows: the fingerprint sensor 20 and the frame portion or the edge portion of the reinforcing layer 50 are adhered together, the third optical cement 43 coats the periphery of the fingerprint sensor 20 or the periphery (one circle) of the reinforcing layer 50, and an air layer can exist between the fingerprint sensor 20 and the reinforcing layer 50. Of course, some transparent material (e.g. PET, which costs less than optical glue) may be used to fill the air layer to make the structure more stable and to reduce the chance of dust, moisture, etc. getting in between the fingerprint sensor 20 and the stiffening layer 50. The fingerprint sensor 20 and the reinforcing layer 50 are bonded in a frame bonding mode, so that the using area of the third optical cement 43 is small, cost saving is facilitated, and the bonding yield is high.

Third optical adhesive 43 may include any one of OCA, PVB, or DAF. When the third optical cement 43 is OCA, the third optical cement 43 is softer, the attaching process is simple, and when the user's finger presses on the cover plate 10, the third optical cement 43 can play a certain buffering role for the fingerprint sensor 20. When the third optical cement 43 is PVB, the bonding effect of the third optical cement 43 is strong, which is beneficial to ensuring the stability of the structure between the fingerprint sensor 20 and the reinforcing layer 50. When the third optical adhesive 43 is DAF, the problem of bubbles generated during the attaching process can be reduced, which is beneficial to improving the attaching yield and improving the flatness between the fingerprint sensor 20 and the reinforcing layer 50.

When the third optical adhesive 43 is OCA, PVB, or DAF, the thickness of the third optical adhesive 43 is 0.05mm to 0.15 mm. That is, the thickness of the third optical paste 43 is any value between 0.05mm and 0.15 mm. For example, the thickness of the third optical paste 43 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, or the like. Preferably, the thickness of the third optical adhesive 43 is 0.1mm, which not only ensures the stability of the attachment between the fingerprint sensor 20 and the reinforcing layer 50, but also does not excessively increase the thickness of the electronic device 1000.

Similarly, the fourth optical adhesive 44 can be bonded to the reinforcing layer 50 and the display module 30 by a full-lamination method or a frame-lamination method.

Referring to fig. 20, the method for bonding the reinforcing layer 50 and the display module 30 by full lamination is as follows: the reinforcing layer 50 and the display module 30 are completely adhered together in a seamless manner, the fourth optical cement 44 coats the whole surface of the reinforcing layer 50 or the whole surface of the display module 30, and no air layer exists between the reinforcing layer 50 and the display module 30. Adopt full laminating mode bonding strengthening layer 50 and display module assembly 30 for it is more firm to bond between strengthening layer 50 and the display module assembly 30, and the reinforcement effect is better, in addition, also can reduce the probability between dust, moisture etc. entering strengthening layer 50 and the display module assembly 30.

Referring to fig. 22, the frame-bonding method for bonding the reinforcing layer 50 to the display module 30 is as follows: the frame portion or the edge portion of the display module 30 is adhered to the reinforcing layer 50, the fourth optical adhesive 44 is coated around the reinforcing layer 50 or around the display module 30 (one circle), and an air layer may exist between the reinforcing layer 50 and the display module 30. Of course, some transparent materials (e.g., PET, which costs less than optical cement) may be used to fill the air layer, so as to make the structure more stable and reduce the possibility of dust, moisture, etc. entering between the strengthening layer 50 and the display module 30. The reinforcing layer 50 and the display module 30 are bonded by frame bonding, so that the use area of the fourth optical cement 44 is small, cost saving is facilitated, and the bonding yield is high.

Fourth optical adhesive 44 may include any one of OCA, PVB, or DAF. When fourth optical cement 44 is OCA, fourth optical cement 44 is softer, and laminating processing technology is simple, and when user's finger pressed on apron 10, fourth optical cement 44 can play certain cushioning effect to display module assembly 30. When the fourth optical cement 44 is PVB, the adhesion effect of the fourth optical cement 44 is stronger, which is beneficial to ensuring the stability of the structure between the reinforcing layer 50 and the display module 30. When the fourth optical adhesive 44 is DAF, the problem of bubbles generated during the bonding process can be reduced, which is beneficial to improving the bonding yield and improving the flatness between the reinforcing layer 50 and the display module 30.

When the fourth optical adhesive 44 is OCA, PVB, or DAF, the thickness of the fourth optical adhesive 44 is 0.05mm to 0.15 mm. That is, the thickness of the fourth optical paste 44 is anywhere between 0.05mm to 0.15 mm. For example, the thickness of the fourth optical paste 44 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, etc. Preferably, the thickness of the fourth optical cement 44 is 0.1mm, which not only can ensure the stability of the adhesion between the reinforcing layer 50 and the display module 30, but also does not excessively increase the thickness of the electronic device 1000.

Referring to FIG. 23, in some embodiments, the display device 100 may further include a polarizer 60. The polarizer 60 is disposed on the cover plate 10, particularly on one side of the cover plate back 12, through the glue 40. The polarizer 60 is located between the cover 10 and the fingerprint sensor 20, and specifically between the cover back 12 and the sensor light-emitting surface 21. Polarizer 60 includes a polarized light exit surface 61 and a polarized back surface 62 opposite to each other. The polarized light exit surface 61 is opposite to the cover back 12, and the polarized light back 62 is opposite to the sensor exit surface 21.

The polarizer 60 has a thickness of 100 to 150 μm. That is, the thickness of the polarizer 60 is any value between 100 μm and 150 μm. For example, the thickness of the polarizer 60 is 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm, or the like.

The polarizer 60 is an optical film formed by compounding multiple layers of polymer materials and having a function of generating polarized light, and the polarizer 60 can convert natural light without polarization into polarized light, so that light rays perpendicular to an electric field pass through the polarizer, and the passing or not of the light rays is controlled. The polarizer 60 is additionally arranged between the cover plate 10 and the fingerprint sensor 20, so that the brightness of the incident light of the external light from the cover plate 10 to the fingerprint sensor 20 can be reduced, and the phenomenon that the appearance of the display assembly device 100 is different in color at a certain angle (such as the phenomenon of displaying earthy yellow) due to the reflection of the metal grid wires on the fingerprint sensor 20 is reduced.

Referring to FIG. 24, the polarizer 60 may be a circular polarizer. The polarizer 60 includes a protective film 63, a Triacetyl Cellulose (TAC) functional film 64, a polyvinyl alcohol (PVA) film 65, a light plate TAC film 66, a pressure sensitive adhesive 67, and a release film 68, which are disposed along a light emitting direction of the display module device 100. Wherein some processing may be performed on the surface of the TAC functional film 64 to achieve corresponding additional functions. For example, the surface of the TAC functional film 64 may be subjected to an anti-glare treatment (AG), an anti-glare + low reflection treatment (AG + LR), a transparent curing + low reflection treatment (CHC + LR), a transparent curing treatment (CHC), an anti-reflection treatment (AR), or the like. Different surface treatment methods can meet different application requirements of the electronic device 1000. The embodiment of the application performs the anti-reflection treatment on the surface of the TAC functional film 64, so that the TAC functional film 64 has the anti-reflection function (the reflection light of the front and back surfaces of the film is mutually eliminated by utilizing the interference effect to reduce the reflection), so as to reduce the reflection light generated by the fingerprint sensor 20, and further reduce the phenomenon that the display component device 100 appears yellowish due to the reflection of the metal grid lines on the fingerprint sensor 20 at a specific angle.

Since the polarizer 60 reduces the brightness of the display module 30, the original polarizer in the display module 30 can be eliminated.

Specifically, referring to fig. 12 and 25, when the display module 30 is an LCM display 33, the LCM display 33 includes a backlight module 331, a lower polarizer 332, a TFT substrate 333, a liquid crystal layer 334, a color filter 335, and an upper polarizer 336 (as shown in fig. 12) disposed along the light emitting direction of the display device 100, and the upper polarizer 336 can be eliminated, that is, the LCM display 33 includes the backlight module 331, the lower polarizer 332, the TFT substrate 333, the liquid crystal layer 334, and the color filter 335 (as shown in fig. 25) disposed along the light emitting direction of the display device 100, and the polarizer 60 can be used as the upper polarizer 336 in the LCM display 33.

Referring to fig. 13 and 26, when the display module 30 is the OLED display panel 34, the OLED display panel 34 includes a glass TFT substrate 341, an organic light emitting diode 342, an encapsulation glass 343, and an OLED polarizer 344 (as shown in fig. 13) disposed along the light emitting direction of the display device 100, the OLED polarizer 344 may be eliminated, that is, the OLED display panel 34 includes the glass TFT substrate 341, the organic light emitting diode 342, and the encapsulation glass 343 (as shown in fig. 26) disposed along the light emitting direction of the display device 100, and the polarizer 60 may be used as the OLED polarizer 344 in the OLED display panel 34.

Of course, in other embodiments, the original polarizer in the display module 30 may not be eliminated, but only the brightness of the display module 30 is slightly reduced, and at this time, the display module 30 still adopts the structure shown in fig. 12 and 13.

When the display module assembly 100 includes the polarizer 60, the adhesive 40 is used to adhere the cover plate 10, the polarizer 60, the fingerprint sensor 20 and the display module 30.

Referring to fig. 23, in an embodiment, when the adhesive 40 includes a first optical adhesive 41 and a second optical adhesive 42, the first optical adhesive 41 is used for bonding the cover plate 10 and the polarizer 60, and specifically for bonding the cover plate back 12 and the polarization light-emitting surface 61. The second optical adhesive 42 is used for bonding the fingerprint sensor 20 and the display module 30, and specifically bonds the sensor back 22 and the display surface 31. In this embodiment, the cover plate 10, the first optical adhesive 41, the polarizer 60, the fingerprint sensor 20, the second optical adhesive 42 and the display module 30 are sequentially stacked along the opposite direction of the light emitting direction of the display module device 100. The first optical adhesive 41 may be fully attached to the cover plate 10 and the polarizer 60. The second optical adhesive 42 can be adhered to the fingerprint sensor 20 and the display module 30 in a full-lamination manner or a frame lamination manner.

Referring to fig. 27, in another embodiment, when the glue 40 includes the first optical glue 41 and the second optical glue 42, the first optical glue 41 is used for bonding the cover 10 and the polarizer 60, and specifically, the cover back 12 and the polarization light-emitting surface 61. The second optical adhesive 42 is used for bonding the cover plate 10 and the display module 30, and specifically bonds the cover plate back surface 12 and the display surface 31. In this embodiment, in the opposite direction of the light emitting direction of the display device assembly 100, in the middle area of the cover plate 10, the first optical adhesive 41, the polarizer 60, the fingerprint sensor 20 and the display module 30 are sequentially stacked; in the edge area of the cover plate 10, the second optical adhesive 42 and the display module 30 are sequentially stacked. The first optical adhesive 41 may be used to adhere the cover plate 10 and the polarizer 60 in a full-lamination manner, and the second optical adhesive 42 may be used to adhere the cover plate 10 and the display module 30 in a frame lamination manner.

Referring to FIG. 28, in some embodiments, the display assembly apparatus 100 can further include a reflection preventing film 70. The reflection preventing film 70 is located between the cover 10 and the fingerprint sensor 20, specifically, between the cover back 12 and the sensor light emitting surface 21. The anti-reflection film 70 includes an anti-reflection light-emitting surface 71 and an anti-reflection back surface 72 which are opposite to each other. The anti-reflection light emitting surface 71 is opposite to the cover plate back 12, and the anti-reflection back 72 is opposite to the sensor light emitting surface 21.

The thickness of the antireflection film 70 is 200nm to 300 nm. That is, the thickness of the antireflection film 70 is an arbitrary value between 200nm and 300 nm. For example, the thickness of the antireflection film 70 is 200nm, 210nm, 220nm, 230nm, 240nm, 250nm, 260nm, 270nm, 280nm, 290nm, 300nm, or the like.

The antireflection film 70 is also referred to as an antireflection film, an antireflection film, an AR (Anti-reflection) film, or the like. The reflection preventing film 70 is formed by plating a multilayer composite optical film on a substrate by a sputtering process, and uses a low refractive index (L) material and a high refractive index (H) material to alternately form a film stack, and reduces the surface reflection of the substrate by using an interference effect through film layer design and film thickness control. In the present embodiment, the substrate may be the cover plate 10 or the fingerprint sensor 20.

Specifically, the reflection preventing film 70 may be formed on the cover back 12 (as shown in fig. 29) or on the sensor light emitting surface 21 (as shown in fig. 28). The anti-reflection film 70 is formed on the back surface 12 of the cover plate or the light-emitting surface 21 of the sensor, so that the reflection light generated by the fingerprint sensor 20 can be reduced, the phenomenon of yellowing of the side edge of the display module 30 caused by the reflection of the metal grid lines on the fingerprint sensor 20 is reduced, and the appearance display effect is improved; meanwhile, the anti-glare effect can be achieved, and under the action of strong light, a user can clearly see the image displayed by the display module 30.

It should be noted that, compared to the structures of the display device assembly 100 shown in fig. 3, 4, 8, 9, 17, 18, 19, 20, 21 and 22, the display device assembly 100 of the embodiment of the present application only adds one anti-reflection film 70 on the back surface 12 of the cover plate or the light exit surface 21 of the sensor, and other structures may be the same as those in the above drawings. After the addition of one layer of anti-reflection film 70, the other structures in the above-described figures can be changed accordingly. For example, the adhesive 40 is used to adhere the cover plate 10, the anti-reflection film 70, the fingerprint sensor 20, and the display module 30. When the glue body 40 includes the first optical glue 41 and the second optical glue 42, the first optical glue 41 is used to adhere the reflection preventing film 70 to the fingerprint sensor 20 (as shown in fig. 29); alternatively, first optical adhesive 41 is used to adhere cover 10 to anti-reflection film 70 (as shown in fig. 28), and a description thereof is omitted here.

Referring to fig. 4 and 14, in some embodiments, the fingerprint sensor 20 is not only used for fingerprint identification, but also used as the touch sensor 35 of the display module 30 for touch control. That is to say, the display module assembly 30 need not to set up touch sensor 35 in addition (the structure of display module assembly 30 is shown in fig. 12 and fig. 13), can realize fingerprint identification and touch-control dual function through fingerprint sensor 20, and display module assembly device 100's simple structure, thickness are thinner, the integrated level is high, the cost is lower, the light transmissivity is also better, can also reduce the quantity, the volume and the design degree of difficulty of the connecting terminal of display module assembly device 100.

The fingerprint recognition function and the touch function of the fingerprint sensor 20 may be time-division multiplexed. When the fingerprint sensor 20 is used to implement a fingerprint recognition function, the fingerprint sensor 20 is not used to implement a touch function; when the fingerprint sensor 20 is used to implement a touch function, the fingerprint sensor 20 is not used to implement a fingerprint recognition function.

Referring to fig. 3, the display device 100 may further include a sensor chip 201, and the sensor chip 201 is connected to the fingerprint sensor 20. The sensor chip 201 is configured to read a capacitance value detected by the fingerprint sensor 20, and then form a fingerprint image according to the capacitance value and perform fingerprint recognition, thereby implementing a fingerprint recognition function. Or, the sensor chip 201 is configured to read a capacitance value detected by the fingerprint sensor 20, and then determine a touch point coordinate, a pressing track, and the like according to the capacitance value, so as to implement a touch function.

After the sensor chip 201 reads the capacitance detected by the fingerprint sensor 20, it is specifically used for implementing a fingerprint identification function or a touch function, and may be determined according to an application scenario of the electronic device 1000. For example, when the electronic device 1000 is applied to an encryption scenario, an unlocking scenario, a payment scenario, etc., the sensor chip 201 reads the capacitance value detected by the fingerprint sensor 20 to implement a fingerprint identification function. When the electronic device 1000 is applied to a scene other than the above-mentioned scene, the sensor chip 201 is used to realize a touch function after reading the capacitance value detected by the fingerprint sensor 20.

Of course, in other embodiments, the electronic device 1000 may further provide other determination logic to determine whether the fingerprint sensor 20 and the sensor chip 201 are used for implementing the fingerprint identification function or the touch function, which is not limited herein.

Referring to fig. 1 and 3, in some embodiments, the electronic device 1000 may further include a motherboard chip 220. The display assembly apparatus 100 further includes a sensor chip 201 and a display chip 301. The sensor chip 201 is connected with the fingerprint sensor 20, and the display chip 301 is connected with the display module 30. The sensor chip 201 and the display chip 301 are also both connected to the motherboard chip 220. The sensor chip 201 is connected to the motherboard chip 220 to realize the fingerprint recognition function, and the display chip 301 is connected to the motherboard chip 220 to realize the display function.

The main board chip 220 can control the fingerprint sensor 20 and the display module 30 to work in a time-sharing manner through the sensor chip 201 and the main board chip 220. Specifically, referring to fig. 30, when the fingerprint sensor 20 is used to realize the fingerprint identification function, the sensor chip 201 controls the fingerprint sensor 20 to operate according to the first operating signal T1, and meanwhile, the main board chip 220 obtains the first synchronization signal T10 corresponding to the first operating signal T1 from the sensor chip 201, and controls the display chip 301 according to the first synchronization signal T10, so that the display module 30 does not operate. Alternatively, referring to fig. 31, when the display module 30 is used to implement the display function, the display chip 301 controls the display module 30 to operate according to the second operating signal T2, and meanwhile, the main board chip 220 obtains the second synchronizing signal T20 corresponding to the second operating signal T2 from the display chip 301, and controls the sensor chip 201 according to the second synchronizing signal T20, so that the fingerprint sensor 20 does not operate. In the embodiment of the application, the fingerprint sensor 20 works with the display module 30 in a time-sharing manner, and the first working signal T1 and the second working signal T2 are staggered, so that the problem that the fingerprint sensor 20 and the display module 30 work disorderly and interfere with each other in the process of using the electronic device 1000 by a user is avoided.

Wherein, the display frequency of the display module 30 can be greater than the fingerprint detection frequency of the fingerprint sensor 20. A plurality of second operating signals T2 may be included between two adjacent first operating signals T1. For example, in fig. 32, the display frequency of the display module 30 is twice the fingerprint detection frequency of the fingerprint sensor 20. Two second operating signals T2 are included between two adjacent first operating signals T1. It can be understood that the user generally uses display module assembly 30 comparatively frequently, and the condition that needs to use fingerprint sensor 20 is less, consequently, display module assembly 30's display frequency is greater than fingerprint sensor 20's fingerprint detection frequency, can satisfy the actual user demand of user better.

In the description herein, references to the description of the terms "certain embodiments," "one example," "exemplary," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present application, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. A fingerprint sensor comprises a substrate and a line layer, wherein the line layer comprises a plurality of first lines and a plurality of second lines, the plurality of first lines and the plurality of second lines are intersected in orthographic projection on the substrate, the first lines comprise first top surfaces and first bottom surfaces which are opposite, the second lines comprise second top surfaces and second bottom surfaces which are opposite, the line width of the first lines at the first top surfaces is larger than the line width of the first lines at the first bottom surfaces, and the line width of the second lines at the second top surfaces is larger than the line width of the second lines at the second bottom surfaces.

2. The fingerprint sensor of claim 1, wherein the first top surface has a first shading line disposed thereon, and the second top surface has a second shading line disposed thereon.

3. The fingerprint sensor of claim 1, further comprising a shield layer between the substrate and the wiring layer.

4. The fingerprint sensor of claim 2, wherein the first shielding line has a line width equal to a line width of the first line at the first top surface, and the second shielding line has a line width equal to a line width of the second line at the second top surface.

5. The fingerprint sensor according to claim 2, wherein a pitch between two adjacent first lines is 40 μm to 120 μm; and/or

The line width of the first line is 3-10 mu m; and/or

The distance between two adjacent second lines is 40-120 mu m; and/or

The line width of the second line is 3-10 mu m; and/or

The line width of the first shielding line is 3-10 mu m; and/or

The line width of the second shielding line is 3-10 mu m.

6. The fingerprint sensor of claim 2, wherein the first shielding line has a linear shape corresponding to the linear shape of the first line, and the second shielding line has a linear shape corresponding to the linear shape of the second line.

7. The fingerprint sensor of claim 2, wherein the first line is one or more of a straight line, a curved line, or a bent line; and/or

The line type of the second line is any one or more of a straight line, a curve line or a bending line; and/or

The line type of the first shielding line is any one or more of a straight line, a curve line or a bending line; and/or

The line type of the second shielding line is any one or more of a straight line, a curve line or a bending line.

8. The fingerprint sensor of claim 1, further comprising a protective layer disposed on the wiring layer, the protective layer configured to protect the wiring layer.

9. A display device, comprising a display module, the fingerprint sensor of any one of claims 1 to 7, and a cover plate, wherein the fingerprint sensor is located between the cover plate and the display module and covers a display surface of the display module to sense a user's fingerprint touching the cover plate; the substrate and the circuit layer are arranged along the light emitting direction of the display module.

10. The display assembly device of claim 9, further comprising a glue body, wherein the glue body comprises a first optical glue and a second optical glue, the first optical glue is used for bonding the cover plate and the fingerprint sensor, and the second optical glue is used for bonding the fingerprint sensor and the display module; or

The first optical cement is used for bonding the cover plate and the fingerprint sensor, and the second optical cement is used for bonding the cover plate and the display module.

11. The display assembly device of claim 10, wherein the first optical adhesive is applied in a full-lamination manner, and the second optical adhesive is applied in a full-lamination manner or a frame-lamination manner; and/or

The first optical adhesive comprises any one of an optically transparent adhesive, a polyvinyl butyral film or an adhesive sheet film; and/or

The second optical adhesive comprises any one of an optically transparent adhesive, a polyvinyl butyral film or a film-adhered sheet.

12. The display module apparatus according to claim 9, wherein the cover plate is made of any one of sapphire, glass, polyimide film, polyethylene terephthalate, or a composite plate, and the composite plate comprises polymethyl methacrylate and polyamide resin; and/or

The substrate is made of glass or a polyimide film; and/or

The first circuit is made of any one of molybdenum, aluminum, molybdenum, copper or silver; and/or

The second circuit is made of any one of molybdenum, aluminum, molybdenum, copper or silver.

13. The display assembly device of claim 9, wherein the display module is a hard screen or a flexible screen; and/or

The display module is a liquid crystal display screen or an organic light emitting diode display screen.

14. The display assembly device of claim 9, further comprising a stiffening layer between the fingerprint sensor and the display module.

15. An electronic device, comprising:

a housing; and

the display assembly device of any one of claims 9 to 14, in combination with the housing.