CN110473165A - A kind of welding quality of circuit board detection method and device - Google Patents
A kind of welding quality of circuit board detection method and device Download PDFInfo
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- CN110473165A CN110473165A CN201910588264.6A CN201910588264A CN110473165A CN 110473165 A CN110473165 A CN 110473165A CN 201910588264 A CN201910588264 A CN 201910588264A CN 110473165 A CN110473165 A CN 110473165A
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- 238000001514 detection method Methods 0.000 title claims abstract description 42
- 238000003466 welding Methods 0.000 title claims abstract description 42
- 238000012360 testing method Methods 0.000 claims abstract description 30
- 238000012545 processing Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims description 3
- 238000003709 image segmentation Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 241001292396 Cirrhitidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000039 congener Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2518—Projection by scanning of the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/11—Region-based segmentation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/187—Segmentation; Edge detection involving region growing; involving region merging; involving connected component labelling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/194—Segmentation; Edge detection involving foreground-background segmentation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
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- Theoretical Computer Science (AREA)
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- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
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- Quality & Reliability (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a kind of welding quality of circuit board detection method and device, which comprises uses laser scanning circuit board under test；Obtain the laser stripe image on the circuit board under test；The laser stripe image is handled, the deviant of laser rays is obtained；The deviant is compared with standard value, when the difference of the deviant and the standard value is greater than preset threshold, i.e., the described circuit board under test welding quality is unqualified, and when the difference is less than the preset threshold, i.e., the described welding quality of circuit board is qualified.The present invention is compared the deviant with standard value by the deviant of acquisition laser rays, with this to determine whether qualified, overcome the problem that traditional artificial detection method reliability is low, efficiency is low, Machine automated detection is realized, work efficiency is high, and false detection rate is low.
Description
Technical field
The present invention relates to board quality detection fields, more particularly, to a kind of welding quality of circuit board detection method and dress
It sets.
Background technique
Printed circuit board (Printed Circuit Board) abbreviation pcb board, is the various carriers for electronic component,
Microelectronic component for various different sizes, different function provides physical connection, is most basic electronic component.With integrated
The continuous development of circuit engineering, there has also been some transformations for the welding manner of component.But either traditional manual welding is still
The welding defect of component, can all occur in modern times welding, the defect mainly risen herein to the installation and welding of component
Detection, and it is necessary that it is a set of, which to design this, because there are a little deficiency, artificial detection masters for traditional artificial detection method
The property seen is too strong, works long hours and is easy fatigue, not can guarantee detection quality, for certain small size parts, be manually difficult to ensure
The reliability of detection, inefficiency are unable to satisfy actually detected demand.
Summary of the invention
The present invention is directed to solve one of the technical problem in related describe at least to a certain extent.For this purpose, of the invention
The welding quality of circuit board detection method and device that one purpose is to provide a kind of high reliablity, improves detection efficiency.
The technical scheme adopted by the invention is that:
In a first aspect, the present invention provides a kind of welding quality of circuit board detection method, comprising the following steps:
Step 1, using laser scanning circuit board under test；
Step 2, the laser stripe image on the circuit board under test is obtained；
Step 3, the laser stripe image is handled, obtains the deviant of laser rays；
Step 4, the deviant is compared with standard value, when the difference of the deviant and the standard value is greater than
When preset threshold, i.e., the described circuit board under test welding quality is unqualified, when the difference is less than the preset threshold, i.e., described
Welding quality of circuit board is qualified.
Further, the step 3 the following steps are included:
Step 31, binary conversion treatment is carried out to the laser stripe image, generates binary image；
Step 32, Denoising disposal is carried out to the binary image；
Step 33, the pixel offset value of laser rays is obtained.
Further, the step 31 specifically includes: being divided using threshold operator the laser stripe image
It cuts, is target area and background area by the laser stripe image segmentation, generates corresponding binary image.
Further, the step 32 specifically includes:
Step 321, the binary image is divided into multiple connected domains, removes otiose connected domain；
Step 322, remaining connected domain is fitted, obtains area-of-interest.
Second aspect, the present invention provides a kind of welding quality of circuit board detection devices, comprising:
Laser module, for using laser scanning circuit board under test；
Image capture module, for obtaining the laser stripe image on the circuit board under test；
Image processing module obtains the deviant of laser rays for handling the laser stripe image；
Computing module, for comparing the deviant with standard value, when the deviant and the standard value
When difference is greater than preset threshold, i.e., the described circuit board under test welding quality is unqualified, when the difference is less than the preset threshold
When, i.e., the described welding quality of circuit board is qualified.
Further, described image processing module further include:
Binary processing module carries out binary conversion treatment to the laser stripe image, generates binary image；
Noise processed module carries out Denoising disposal to the binary image；
Extraction module obtains the pixel offset value of laser rays.
Further, the noise processed module includes:
Divide module, the binary image is divided into multiple connected domains, removes otiose connected domain；
Fitting module is fitted remaining connected domain, obtains area-of-interest.
It further, further include mobile support plate, the mobile support plate can make many places position on the circuit board under test
Setting can be scanned by the laser module.
The beneficial effects of the present invention are:
The present invention obtains the laser stripe image on the circuit board under test by using laser scanning circuit board under test；
The laser stripe image is handled, the deviant of laser rays is obtained, the deviant is compared with standard value, with
This overcomes the problem that traditional artificial detection method reliability is low, efficiency is low to determine whether qualification, realizes machine certainly
Dynamicization detection, work efficiency is high, and false detection rate is low.
Detailed description of the invention
Fig. 1 is the flow chart of a specific embodiment in a kind of welding quality of circuit board detection method of the present invention；
Fig. 2 is the structure chart of a specific embodiment in a kind of welding quality of circuit board detection device of the present invention.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
A kind of welding quality of circuit board detection method, comprising the following steps:
Step 1, using laser scanning circuit board under test；
Step 2, the laser stripe image on the circuit board under test is obtained；
Step 3, the laser stripe image is split using threshold operator, by the laser stripe image
It is divided into target area and background area, generates corresponding binary image；The binary image is divided into multiple connections
Otiose connected domain is removed in domain, is fitted to remaining connected domain, obtains area-of-interest, obtains the pixel of laser rays
Deviant；
Step 4, the deviant is compared with standard value, when the difference of the deviant and the standard value is greater than
When preset threshold, i.e., the described circuit board under test welding quality is unqualified, when the difference is less than the preset threshold, i.e., described
Welding quality of circuit board is qualified.
The present invention leads to Image Acquisition and being used cooperatively for laser just realizes the defect risen to the installation and welding of component
Detection laser opening is scanned circuit board, obtains the image of laser stripe, is obtained with this in the detection process
The relative height differential of soldered elements on circuit board, detects the welding of element, and work efficiency is high, and false detection rate is low.
Embodiment 1
Using laser scanning circuit board under test, after obtaining laser picture, to its binary image (by 256 brightness etc.
The gray level image of grade, which is chosen to obtain by threshold value appropriate, still can reflect image entirety and local feature) it is handled,
Using the target area to be extracted in image (laser stripe) and difference of its black background in gamma characteristic,
Image regards the combination in the two class regions (target area and background area) with different grey-scale as, and it is reasonable to choose a comparison
Threshold value, to determine, each pixel should belong to target area or background area in image, to generate corresponding binary map
Picture.
The choosing method of threshold value is to utilize threshold (Image1, Regions1,48,253) operator in halcon
The image of acquisition is split, because target area and background area comparison are obvious, directly carries out threshold value in software
The adjusting of size, and (48,253) are exactly reasonable threshold value range required for us, so that the effect that we want is obtained,
Noise is removed to the bianry image of acquisition later, since laser stripe is thinner, so use region segmentation at more herein
(a region G on complex plane does a simple closed curve if appointed wherein to a connected domain, and the inside of closed curve always belongs to
In G, just G is referred to as simply connected region), but due to whole region plane be not only exist a simply connected region, so
Former region has been divided into multiple connected domains, unwanted connected domain can just be carried out anti-choosing removal in this way,
It is selected unwanted region is counter, connection (Regions1, ConnectedRegions1) is utilized to calculate
Son, then using select_shape (ConnectedRegions1, SelectedRegions1, ' area', ' and',
108.72,500) operator is removed otiose connected domain by the selection of area, and (108.72,500) are exactly in this operator
The areal extent of the connected domain needed elects the connected domain in this areal extent, by other unwanted connected domains into
The anti-choosing removal of row, can thus remove some lesser interference regions, so that area-of-interest in figure be chosen.
Finally connected domain fitting is got up using union1 (SelectedRegions1, RegionUnion1) operator, shape
At a whole region.Then pixel value difference comparison is carried out, carries out defects detection due to only needing to carry out relative difference herein, and
And pixel scale precision is very high, so the pixel value difference of the pixel value difference measured and congener qualified products is carried out pair
Than not needing to compare carrying out being converted into actual height so that whether obtain product qualified.The original measured using structural light three-dimensional
Reason, using line laser structured light circuit board, by acquiring the image of laser stripe, using image processing software halcon to acquisition
Image is handled, and the offset of laser rays in the picture is obtained, so that the elevation information of component is obtained, due to being to use herein
In the defects detection that component is installed and welded, so being comparing property of the elevation information measurement to same type component, that is, survey
Its relative height differential is measured, it is with this to determine whether qualified.
The present invention provides a kind of welding quality of circuit board detection devices, comprising:
Laser module, for using laser scanning circuit board under test；
Image capture module, for obtaining the laser stripe image on the circuit board under test；
Image processing module obtains the deviant of laser rays for handling the laser stripe image；
Computing module, for comparing the deviant with standard value, when the deviant and the standard value
When difference is greater than preset threshold, i.e., the described circuit board under test welding quality is unqualified, when the difference is less than the preset threshold
When, i.e., the described welding quality of circuit board is qualified.
Preferably, described image processing module further include:
Binary processing module carries out binary conversion treatment to the laser stripe image, generates binary image；
Noise processed module carries out Denoising disposal to the binary image；
Extraction module obtains the pixel offset value of laser rays.
Preferably, the noise processed module includes:
Divide module, the binary image is divided into multiple connected domains, removes otiose connected domain；
Fitting module is fitted remaining connected domain, obtains area-of-interest.
It preferably, further include mobile support plate, the mobile support plate can make plurality of positions on the circuit board under test
It can be scanned by the laser module.
Embodiment 2
Laser module is line width < 100m, the red laser that shooting angle is 60 degree, Image Acquisition mould in the present embodiment
Block is to grind magnificent 5,000,000 pixel network interface cameras.
As shown in Fig. 2, it illustrates a kind of welding quality of circuit board detection device, including two supporting structures 1 and 3, point
Not Wei the bracket of laser 2 and the bracket of camera 4, laser 2 and camera 4 are separately fixed on position and angle to top,
Camera 4 and 2 same horizontal line of laser are placed, it is preferred that 4 optical axis of camera and workbench 7 are at 45 degree of angles.And it protects
Whole circuit board 5 is demonstrate,proved within camera fields of view, is test product circuit board 5 immediately below laser 2, circuit board 5 is placed on shifting
In dynamic support plate 6, this movement support plate 6 is matched with the guide rail on workbench 7 using ball, can on workbench edge
Guide rail is mobile.The testing principle of this system: passed through using the principle that structural light three-dimensional measures using line laser structured light circuit board
The image for acquiring laser stripe, obtains the elevation information of component, due to being the defect installed and welded for component herein
Detection is judged with this so be to measure its relative height differential to the measurement of the comparing property of elevation information of same type component
It is whether qualified.
By camera and laser with the use of the detection for just realizing the defect risen to the installation and welding of component, In
In detection process, circuit board under test is placed in mobile support plate, laser opening is scanned circuit board, and pass through camera
The image that shooting obtains laser stripe is carried out, is detected with this to obtain relative height differential to it, work efficiency is high, false detection rate
It is low.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (8)
1. a kind of welding quality of circuit board detection method, which comprises the following steps:
Step 1, using laser scanning circuit board under test；
Step 2, the laser stripe image on the circuit board under test is obtained；
Step 3, the laser stripe image is handled, obtains the deviant of laser rays；
Step 4, the deviant is compared with standard value, is preset when the difference of the deviant and the standard value is greater than
When threshold value, i.e., the described circuit board under test welding quality is unqualified, when the difference is less than the preset threshold, i.e., the described circuit
Plate welding quality is qualified.
2. welding quality of circuit board detection method according to claim 1, which is characterized in that the step 3 includes following
Step:
Step 31, binary conversion treatment is carried out to the laser stripe image, generates binary image；
Step 32, Denoising disposal is carried out to the binary image；
Step 33, the pixel offset value of laser rays is obtained.
3. welding quality of circuit board detection method according to claim 2, which is characterized in that the step 31 is specifically wrapped
It includes: the laser stripe image being split using threshold operator, be target area by the laser stripe image segmentation
Domain and background area generate corresponding binary image.
4. welding quality of circuit board detection method according to claim 2, which is characterized in that the step 32 is specifically wrapped
It includes:
Step 321, the binary image is divided into multiple connected domains, removes otiose connected domain；
Step 322, remaining connected domain is fitted, obtains area-of-interest.
5. a kind of welding quality of circuit board detection device characterized by comprising
Laser module, for using laser scanning circuit board under test；
Image capture module, for obtaining the laser stripe image on the circuit board under test；
Image processing module obtains the deviant of laser rays for handling the laser stripe image；
Computing module, for comparing the deviant with standard value, when the difference of the deviant and the standard value
When greater than preset threshold, i.e., the described circuit board under test welding quality is unqualified, when the difference is less than the preset threshold, i.e.,
The welding quality of circuit board is qualified.
6. welding quality of circuit board detection device according to claim 5, which is characterized in that described image processing module is also
Include:
Binary processing module carries out binary conversion treatment to the laser stripe image, generates binary image；
Noise processed module carries out Denoising disposal to the binary image；
Extraction module obtains the pixel offset value of laser rays.
7. welding quality of circuit board detection device according to claim 6, which is characterized in that the noise processed module packet
It includes:
Divide module, the binary image is divided into multiple connected domains, removes otiose connected domain；
Fitting module is fitted remaining connected domain, obtains area-of-interest.
8. according to the described in any item welding quality of circuit board detection devices of claim 5 to 7, which is characterized in that it further includes
Mobile support plate, the mobile support plate can be such that plurality of positions on the circuit board under test is scanned by the laser module.
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| CN201910588264.6A CN110473165A (en) | 2019-07-02 | 2019-07-02 | A kind of welding quality of circuit board detection method and device |
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| CN201910588264.6A CN110473165A (en) | 2019-07-02 | 2019-07-02 | A kind of welding quality of circuit board detection method and device |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111624199A (en) * | 2020-05-18 | 2020-09-04 | Oppo（重庆）智能科技有限公司 | Detection method and system, and storage medium |
| CN111709937A (en) * | 2020-06-18 | 2020-09-25 | 上海网钜信息科技有限公司 | Method for detecting pin of circuit board based on machine vision |
| CN111795971A (en) * | 2020-07-14 | 2020-10-20 | 深圳市格灵人工智能与机器人研究院有限公司 | Optical appearance detection device |
| CN112102456A (en) * | 2020-08-20 | 2020-12-18 | 佛山科学技术学院 | Ceramic wafer height detection method and device and computer readable storage medium |
| CN112333440A (en) * | 2020-10-28 | 2021-02-05 | 深圳市金锐显数码科技有限公司 | TV board card detection method and device, terminal equipment and storage medium |
| CN112529861A (en) * | 2020-12-04 | 2021-03-19 | 武汉锐科光纤激光技术股份有限公司 | Detection method for laser cutting surface stripes |
| CN113409251A (en) * | 2021-05-31 | 2021-09-17 | 广西格思克实业有限责任公司 | Data processing method for integrated circuit manufacturing |
| CN113418935A (en) * | 2021-05-31 | 2021-09-21 | 广西格思克实业有限责任公司 | Online automatic optical detection method for circuit board production |
| CN114062391A (en) * | 2020-08-06 | 2022-02-18 | 苏州加贺智能设备有限公司 | Detection method and system of automatic optical detection equipment |
| CN114199160A (en) * | 2021-12-16 | 2022-03-18 | 武汉工程大学 | Circuit board component geometric detection method based on binary coding grating defocused projection |
| CN114549530A (en) * | 2022-04-26 | 2022-05-27 | 海门裕隆光电科技有限公司 | PCB welding quality evaluation method based on image processing |
| CN116934745A (en) * | 2023-09-14 | 2023-10-24 | 创新奇智(浙江)科技有限公司 | Quality detection method and detection system for electronic component plugging clip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101961819A (en) * | 2009-07-22 | 2011-02-02 | 中国科学院沈阳自动化研究所 | Device for realizing laser welding and seam tracking and control method thereof |
| WO2018010391A1 (en) * | 2016-07-13 | 2018-01-18 | 广州视源电子科技股份有限公司 | Board inspection method and device |
| CN109001224A (en) * | 2017-06-07 | 2018-12-14 | 宁德时代新能源科技股份有限公司 | Welding seam detection method and detection device |
-
2019
- 2019-07-02 CN CN201910588264.6A patent/CN110473165A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101961819A (en) * | 2009-07-22 | 2011-02-02 | 中国科学院沈阳自动化研究所 | Device for realizing laser welding and seam tracking and control method thereof |
| WO2018010391A1 (en) * | 2016-07-13 | 2018-01-18 | 广州视源电子科技股份有限公司 | Board inspection method and device |
| CN109001224A (en) * | 2017-06-07 | 2018-12-14 | 宁德时代新能源科技股份有限公司 | Welding seam detection method and detection device |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111624199A (en) * | 2020-05-18 | 2020-09-04 | Oppo（重庆）智能科技有限公司 | Detection method and system, and storage medium |
| CN111709937A (en) * | 2020-06-18 | 2020-09-25 | 上海网钜信息科技有限公司 | Method for detecting pin of circuit board based on machine vision |
| CN111795971A (en) * | 2020-07-14 | 2020-10-20 | 深圳市格灵人工智能与机器人研究院有限公司 | Optical appearance detection device |
| CN114062391A (en) * | 2020-08-06 | 2022-02-18 | 苏州加贺智能设备有限公司 | Detection method and system of automatic optical detection equipment |
| CN112102456A (en) * | 2020-08-20 | 2020-12-18 | 佛山科学技术学院 | Ceramic wafer height detection method and device and computer readable storage medium |
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Application publication date: 20191119 |