CN110467819A - A kind of siliceous aryne resin composition of high temperature resistant and its application - Google Patents

A kind of siliceous aryne resin composition of high temperature resistant and its application Download PDF

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Publication number
CN110467819A
CN110467819A CN201910807030.6A CN201910807030A CN110467819A CN 110467819 A CN110467819 A CN 110467819A CN 201910807030 A CN201910807030 A CN 201910807030A CN 110467819 A CN110467819 A CN 110467819A
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Prior art keywords
high temperature
aryne resin
siliceous aryne
temperature resistant
resin composition
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马峰岭
李小慧
金石磊
段家真
聂婭
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Shanghai Institute of Materials
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Shanghai Institute of Materials
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08L83/16—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
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    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
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    • B32B2260/021—Fibrous or filamentary layer
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    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
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    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
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    • B32—LAYERED PRODUCTS
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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    • C08J2383/16—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
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    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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Abstract

The present invention relates to a kind of siliceous aryne resin compositions of high temperature resistant and application, which includes following components: siliceous aryne resin, vinyl silsesquioxane, crosslinking agent, curing accelerator, inorganic filler and fire retardant.The siliceous aryne resin composition is used to prepare prepreg and copper-clad plate.Compared with prior art, the present invention selects the characteristic component of dielectric properties and the excellent siliceous aryne resin of high temperature resistance as the composition, cross-linking modified using vinyl silsesquioxane and allyl iso cyanurate progress.The fields such as high-frequency high-speed circuit board substrate are applicable to excellent dielectric properties, low thermal coefficient of expansion, heat-resisting quantity and high glass-transition temperature by the way that substrate is dipped in the invention resin combination and dries the prepreg of preparation.

Description

A kind of siliceous aryne resin composition of high temperature resistant and its application
Technical field
The invention belongs to technical field of polymer materials, it is related to a kind of siliceous aryne resin composition of high temperature resistant and its application
Background technique
In recent years, with the high-performance of information network equipment, the development of multifunction, in order to meet high-speed transfer and great Rong Information data processing is measured, transmission signal also develops towards high frequency, this also proposed new requirement to circuit substrate.
Existing high-frequency circuit board, the excellent hydrocarbon resin of extensive exploitation application dielectric properties and polytetrafluoroethylene (PTFE) tree Rouge.Although these resin dielectrics are had excellent performance, because of high temperature resistance deficiency, plexiglas transition temperature is on 200 DEG C of left sides The right side influences its processing and application under the high temperature conditions, and especially hot environment is to material thermal expansion coefficient, mechanical property and Jie The influence of electrical property.Meanwhile signal under the operation of high-speed high frequency, therefore circuit substrate can generate a large amount of heat, if Heat cannot conduct in time, will be subjected to long term high temperature environment, this is to form huge examine to circuit substrate heat resistance It tests.
The one kind of siliceous aryne resin as fire resistant resin, glass transition temperature are up to 450 DEG C, while having both excellent Different dielectric properties are influenced very little by temperature, frequency, humidity.Currently, because it is with high temperature-resistance characteristic, siliceous aryne Resin is mainly used in aerospace field, but research application is really had no as dielectric medium material.
Chinese patent CN101134816A, which is disclosed, utilizes eight (dimethyl silica) silsesquioxanes and siliceous aryne oligomerisation Object prepares a kind of sesquialter siloxane polyaryne hybrid resin, and silsesquioxane has good thermomechanically performance and dielectricity Can, therefore modified resin has excellent processability, heat resistance, mechanical mechanics property and a dielectric properties, however resins synthesis work Skill is considerably complicated.
Chinese patent CN 201811596062.8 discloses a kind of resin combination, preliminary-dip piece used for printed circuit and covers gold Belong to laminate.The resin combination includes: silicon aryne resin；Polyphenylene oxide resin containing unsaturated bond；And butadiene polymer. By using resin combination, metal-coated laminated board obtained can at least have low-dielectric loss factor, high-fire resistance, low-heat One in the characteristics such as the coefficient of expansion.Chinese patent CN 201811596192.1 discloses a kind of resin combination, printed circuit With preliminary-dip piece and metal-coated laminated board.The resin combination includes: silicon aryne resin；Cyanate esters；And maleimide Amine compounds.By using resin combination, metal-coated laminated board obtained can at least have low-dielectric loss factor, height resistance to One in the characteristics such as hot, low thermal coefficient of expansion.Above-mentioned resin combination greatly reduce aryne resin heat resistance and Glass transition temperature, thermal expansion coefficient also have and reduce to a certain degree, limited in high-temperature field application.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of siliceous virtues of high temperature resistant Alkynes resin combination and its preparing the application in prepreg and copper-clad plate.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of siliceous aryne resin composition of high temperature resistant, including following components and parts by weight content: siliceous aryne resin 45- 90 parts, 5-60 parts of vinyl silsesquioxane, 2-30 parts of crosslinking agent, 0.05-5 parts of curing accelerator, 0.1-30 parts of inorganic filler, 0.1-25 parts of fire retardant.
Siliceous aryne resin is as a kind of fire resistant resin, and solidification crosslink density is higher, and mechanical strength is lower, material performance Brittleness out, when its as circuit substrate in use, processing performance and adhesive property are poor, need to its toughening modifying.
Technical characterstic of the invention is to improve siliceous aryne resin by using vinyl silsesquioxane blended cross linking Toughness of material, improve processing performance close adhesive property, maintain good dielectric properties and high temperature resistance.
The siliceous aryne resin composition includes following components and parts by weight content as a preferred technical solution: Siliceous aryne resin 45-90 parts, 20-50 parts of vinyl silsesquioxane, 5-15 parts of crosslinking agent, 0.05-5 parts of curing accelerator, 0.1-30 parts of inorganic filler, 0.1-25 parts of fire retardant.
This is because a small amount of addition of vinyl silsesquioxane is not obvious the toughening modifying of aryne resin, when reaching When to 20 loading, toughness of material is obviously increased；The additive amount of crosslinking agent should not be too many simultaneously, and more crosslinking agent can be one Determine the heat resistance that siliceous aryne resin is reduced in degree.
The siliceous aryne resin composition of high temperature resistant can be prepared as follows as a preferred technical solution: Dissolution is blended in siliceous aryne resin, vinyl silsesquioxane and crosslinking agent to be dispersed in solvent toluene, solidification is added and promotes Agent, inorganic filler and fire retardant obtain siliceous aryne and vinyl silsesquioxane cross-linking system, siliceous virtue as of the invention Alkynes resin combination.The composition have good processing characteristics and dielectric properties, while also maintain siliceous aryne resin compared with High temperature-resistance characteristic, the raising in conjunction with fire retardant to flame retardant property, can be applied to high-frequency high-speed wiring board art.
Further, the number-average molecular weight of the siliceous aryne resin is 500-5000, is mainly contained such as flowering structure:
Wherein, wherein R1、R2、R3、R4It is any selected from hydrogen, alkyl or aryl it is one or more, n is positive integer.
Further, the vinyl silsesquioxane contains one or more vinyl active groups, and structure is such as Under:
Wherein, R1、R2、R3、R4、R5、R6、R7、R8Any one selected from substituent groups such as vinyl, alkyl, alkylene or aryl Kind is a variety of, and wherein contents of ethylene is 1~8, to meet effective polymerizing condition of aryne resin and siloxanes.R1、R2、R3、 R4、R5、R6、R7、R8Representative flexible group quantity is more, improves to the toughness of material of composition about obvious.
Further, the curing accelerator is peroxide or acetyl acetone salt, and it is different to be selected from peroxidating two Propyl benzene, cumyl t-butyl peroxide, dibenzoyl peroxide, peroxidized t-butyl perbenzoate, the hydrogen peroxide tert-butyl alcohol, peroxide Change hydrogen diisopropylbenzene (DIPB), nickel acetylacetonate, manganese acetylacetonate, acetylacetone cobalt, chromium acetylacetonate, one of zinc acetylacetonate or It is several.The selection of curing accelerator can be adjusted accordingly according to the demand of product preparation process, be wanted with meeting technological temperature It asks.
Curing accelerator is used to promote the crosslinking copolymerization of aryne resin and vinyl silsesquioxane.
Further, the crosslinking agent can be triallyl isocyanate or methyl triallyl isocyanate.Three second Alkenyl isocyanates can be further improved resin combination co-crosslinking reactivity and toughness of material, while with higher resistance to Hot temperature.
Further, the inorganic filler is selected from silica, glass powder, boron nitride, aluminium nitride, silicon carbide, hydrogen-oxygen Change one or more of aluminium or titanium dioxide, the inorganic filler is hollow sphere or entity.The addition of inorganic filler can be with It further increases the heat resistance of composition and reduces its thermal expansion coefficient, meanwhile, according to the different dielectric property of filler, pass through Different additive amounts is adjusted, the product of different application field different dielectric properties demand is prepared.
Further, the fire retardant is selected from one or both of phosphonium flame retardant or brominated flame-retardant, described to contain Phosphorus fire retardant is selected from one of alkyl aryl phosphate ester, alkylaryl phosphatase, alkyl phosphine oxide or triphenyl phosphate or several Kind；The brominated flame-retardant is selected from one of deca-BDE, decabromodiphenylethane, tetrabromobisphenol A or hexabromocyclododecane Or it is several.The fire retardant is used to improve the heat-resisting quantity and anti-flammability of composition.
A kind of siliceous aryne resin composition of high temperature resistant as described above is preparing the application in prepreg, the semi-solid preparation The preparation method of piece includes: to immerse substrate in such as above-mentioned siliceous aryne resin composition, and be dried described to get arriving Prepreg.
Further, the substrate is the fabric or adhesive-bonded fabric of glass fibre, carbon fiber or organic fiber.
Application of the prepreg as described above in preparation copper-clad plate, the copper-clad plate copper-clad plate by multiple one sides or The two-sided prepreg overlapping composition for covering copper foil.
Compared with prior art, the invention has the characteristics that:
1) present invention selects siliceous aryne resin as main component, so that composition has preferable dielectric properties and Nai Gao Warm nature；
2) present invention selects vinyl silsesquioxane for the brittleness of siliceous aryne resin and the disadvantages of low adhesive property And inorganic filler carries out toughening modifying, and improves its processing performance；
3) there are preferable dielectric properties to be used for high temperature resistance for prepreg prepared by the present invention and copper-clad plate, applicable In fields such as high-frequency circuit board substrates.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.The present embodiment is based on the technical solution of the present invention Implemented, the detailed implementation method and specific operation process are given, but protection scope of the present invention be not limited to it is following Embodiment.
Embodiment 1:
By the vinyl iso-butyl base sesquialter of the siliceous aryne resin (number-average molecular weight 2000) of 60 mass parts and 50 mass parts In toluene solution, dissolution is complete for siloxanes (Hybrid OL1123) and 5 mass parts trivinyl isocyanates mixed dissolutions The cumyl t-butyl peroxide of 0.5 mass parts is added afterwards as initiator, 6 parts of decabromodiphenylethane are as fire retardant, 30 matter Part silicon dioxide powder is measured as inorganic filler, obtains siliceous aryne resin composition after mixing evenly.
Then resin combination composition glue liquid is infiltrated into E- glass fabric, the heat drying 5min at 150 DEG C, obtains half Cured sheets.
Copper foil is fitted in the prepreg two sides made to obtain on vacuum hotpressing machine after 230 DEG C of hot pressing 4h Copper-clad plate, and test its dielectric properties, bending strength and glass transition temperature.
Embodiment 2:
By the vinyl iso-butyl base sesquialter of the siliceous aryne resin (number-average molecular weight 2000) of 60 mass parts and 30 mass parts In toluene solution, dissolution is complete for siloxanes (Hybrid OL1123) and 5 mass parts trivinyl isocyanates mixed dissolutions The cumyl t-butyl peroxide of 0.5 mass parts is added afterwards as initiator, 6 parts of decabromodiphenylethane are as fire retardant, 30 matter Part silicon dioxide powder is measured as inorganic filler, obtains siliceous aryne resin composition after mixing evenly.
Then resin combination composition glue liquid is infiltrated into E- glass fabric, the heat drying 5min at 150 DEG C, obtains half Cured sheets.
Copper foil is fitted in the prepreg two sides made to obtain on vacuum hotpressing machine after 230 DEG C of hot pressing 4h Copper-clad plate, and test its dielectric properties, bending strength and glass transition temperature.
Embodiment 3:
By the vinyl iso-butyl base sesquialter of the siliceous aryne resin (number-average molecular weight 2000) of 60 mass parts and 10 mass parts In toluene solution, dissolution is complete for siloxanes (Hybrid OL1123) and 5 mass parts trivinyl isocyanates mixed dissolutions The cumyl peroxide of 0.5 mass parts is added afterwards as initiator, 6 parts of decabromodiphenylethane are as fire retardant, 30 mass parts Silicon dioxide powder obtains siliceous aryne resin composition as inorganic filler after mixing evenly.
Then resin combination composition glue liquid is infiltrated into E- glass fabric, the heat drying 5min at 150 DEG C, obtains half Cured sheets.
Copper foil is fitted in the prepreg two sides made to obtain on vacuum hotpressing machine after 230 DEG C of hot pressing 4h Copper-clad plate, and test its dielectric properties, bending strength and glass transition temperature.
Comparative example 1:
The siliceous aryne resin (number-average molecular weight 2000) of 60 mass parts is dissolved in toluene solution, after dissolution completely The cumyl peroxide of 0.5 mass parts is added as initiator, 6 parts of decabromodiphenylethane are as fire retardant, 30 mass parts two Silica powder obtains siliceous aryne resin composition as inorganic filler after mixing evenly.
Then resin combination composition glue liquid is infiltrated into E- glass fabric, the heat drying 5min at 150 DEG C, obtains half Cured sheets.
Copper foil is fitted in the prepreg two sides made to obtain on vacuum hotpressing machine after 230 DEG C of hot pressing 4h Copper-clad plate, and test its dielectric properties, bending strength and glass transition temperature.
Performance test
Prepreg solidfied material prepared by above-described embodiment 1-3 and comparative example 1 carries out traditional performance test, comparative analysis It can be found that the addition of vinyl silsesquioxane effectively improves toughness of material, and as vinyl silsesquioxane exists The increase of content in mixture, dielectric constant, dielectric loss and bending strength are improved, and glass transition temperature truly has institute It reduces, but still shows higher heat resisting temperature.This is because the unsaturated alkynyl of aryne resin is difficult fully reacting, unreacted Interior ethynylene group reduce its product dielectric properties, dielectric loss is significantly higher, the addition of vinyl silsesquioxane, on the one hand Since it is with excellent dielectric properties and high temperature resistance, on the other hand can complete to react with the co-crosslinking of aryne resin, Ethynylene group greatly reduces in aryne resin, and dielectric properties significantly improve, meanwhile, vinyl silsesquioxane and trivinyl isocyanide Acid esters increases the activity space of cross-linked network molecular structure, and toughness of material improves, so that its bending strength obviously increases, material Processing service performance is enhanced.
Correlated performance result as shown in the table below:
Embodiment 4:
By eight vinyl silsesquioxanes (HybridOL1170) of the siliceous aryne resin of 90 mass parts and 10 mass parts The cumyl t-butyl peroxide of 1 mass parts is added as initiator, 5 in toluene solution in mixed dissolution after dissolving completely Part decabromodiphenylethane, as inorganic filler, obtains resin combination as fire retardant, 10 mass parts titanium oxide after mixing evenly.
Then resin combination composition glue liquid is infiltrated into E- glass fabric, the heat drying 5min at 150 DEG C, obtains half Cured sheets.
Embodiment 5:
By the vinyl-dimethyl base siloxy silsesquioxane of the siliceous aryne resin of 45 mass parts and 50 mass parts (Hybrid OL1163) mixed dissolution in toluene solution, dissolve completely after be added 1 mass parts dibenzoyl peroxide, The equal mass mixings object of peroxidized t-butyl perbenzoate and peroxidating azelaic acid di tert butyl carbonate is as initiator, the alkane of 25 mass parts The equal mass mixings object of base aryl phosphate ester and tetrabromobisphenol A as fire retardant, the glass powder of 60 mass parts and boron nitride etc. Mass mixing object obtains resin combination as inorganic filler and the acrylic silane coupling agent of 5 mass parts after mixing evenly.
Then resin combination composition glue liquid is infiltrated into E- glass fabric, the heat drying 5min at 150 DEG C, obtains half Cured sheets.
Embodiment 6:
By the vinyl-dimethyl base siloxy silsesquioxane of the siliceous aryne resin of 60 mass parts and 20 mass parts The di-tert-butyl peroxide of 1 mass parts is added in toluene solution in (Hybrid OL1163) mixed dissolution after dissolving completely The mass mixings such as object, p-menthane hydroperoxide, nickel acetylacetonate object is as initiator, the decabromodiphenylethane of 5 mass parts, hexabromo ring The equal mass mixings object of dodecane and tetrabromobisphenol A is as mass mixings such as fire retardant, the barium titanate of 15 mass parts, aluminium hydroxides Object is as inorganic filler to obtain resin combination after mixing evenly.
Then resin combination composition glue liquid is infiltrated into E- glass fabric, the heat drying 5min at 150 DEG C, obtains half Cured sheets.
The above description of the embodiments is intended to facilitate ordinary skill in the art to understand and use the invention. Person skilled in the art obviously easily can make various modifications to these embodiments, and described herein general Principle is applied in other embodiments without having to go through creative labor.Therefore, the present invention is not limited to the above embodiments, ability Field technique personnel announcement according to the present invention, improvement and modification made without departing from the scope of the present invention all should be of the invention Within protection scope.

Claims (10)

1. a kind of siliceous aryne resin composition of high temperature resistant, which is characterized in that the composition includes that following components and parts by weight contain Amount: siliceous aryne resin 45-90 parts, 5-60 parts of vinyl silsesquioxane, 2-30 parts of crosslinking agent, curing accelerator 0.05-5 Part, 0.1-30 parts of inorganic filler, 0.1-25 parts of fire retardant.
2. the siliceous aryne resin composition of a kind of high temperature resistant according to claim 1, which is characterized in that the siliceous virtue The number-average molecular weight of alkynes resin is 500-5000, is mainly contained such as flowering structure:
Wherein, R1、R2、R3、R4It is any selected from hydrogen, alkyl or aryl it is one or more, n is positive integer.
3. the siliceous aryne resin composition of a kind of high temperature resistant according to claim 1, which is characterized in that the vinyl Silsesquioxane contains one or more vinyl active groups, and structure is as follows:
Wherein, R1、R2、R3、R4、R5、R6、R7、R8It is any to be selected from the one or more of vinyl, alkyl, alkylene or aryl, Medium vinyl content is 1~8.
4. the siliceous aryne resin composition of a kind of high temperature resistant according to claim 1, which is characterized in that the crosslinking agent choosing From triallyl isocyanate or methyl triallyl isocyanate.
5. the siliceous aryne resin composition of a kind of high temperature resistant according to claim 1, which is characterized in that the solidification promotees It is peroxide or acetyl acetone salt into agent, is selected from cumyl peroxide, cumyl t-butyl peroxide, peroxidating Dibenzoyl, peroxidized t-butyl perbenzoate, the hydrogen peroxide tert-butyl alcohol, di-isopropylbenzene hydroperoxide, nickel acetylacetonate, levulinic One or more of ketone manganese, acetylacetone cobalt, chromium acetylacetonate, zinc acetylacetonate.
6. the siliceous aryne resin composition of a kind of high temperature resistant according to claim 1, which is characterized in that described inorganic to fill out Material is in silica, glass powder, boron nitride, aluminium nitride, silicon carbide, aluminium hydroxide, titanium dioxide or metatitanic acid metal salt It is one or more of.
7. the siliceous aryne resin composition of a kind of high temperature resistant according to claim 1, which is characterized in that the fire retardant Selected from one or both of phosphonium flame retardant or brominated flame-retardant, the phosphonium flame retardant is selected from alkyl aryl phosphate ester, alkane One or more of base aryl phosphoric acids enzyme, alkyl phosphine oxide or triphenyl phosphate；The brominated flame-retardant is selected from decabrominated dipheny One or more of ether, decabromodiphenylethane, tetrabromobisphenol A or hexabromocyclododecane.
8. a kind of semi-solid preparation based on the siliceous aryne resin composition preparation of high temperature resistant described in any one of claims 1 to 7 Piece, which is characterized in that by the way that substrate to be immersed to the siliceous aryne resin group of high temperature resistant as described in any one of claims 1 to 7 It closes in object, and is dried to get the prepreg is arrived.
9. prepreg according to claim 8, which is characterized in that the substrate is glass fibre, carbon fiber or has The fabric or adhesive-bonded fabric of machine fiber.
10. a kind of copper-clad plate based on the preparation of prepreg described in any one of claim 8 or 9, which is characterized in that this is covered Copper sheet is made of multiple one sides or the two-sided prepreg overlapping for covering copper foil.
CN201910807030.6A 2019-08-29 2019-08-29 A kind of siliceous aryne resin composition of high temperature resistant and its application Pending CN110467819A (en)

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Application publication date: 20191119