CN110446348A - A kind of half hole forming production technology of metal - Google Patents
A kind of half hole forming production technology of metal Download PDFInfo
- Publication number
- CN110446348A CN110446348A CN201910681605.4A CN201910681605A CN110446348A CN 110446348 A CN110446348 A CN 110446348A CN 201910681605 A CN201910681605 A CN 201910681605A CN 110446348 A CN110446348 A CN 110446348A
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- China
- Prior art keywords
- pcb board
- copper
- metal
- burr
- bore
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
Abstract
The present invention relates to metal half bore processing technique fields, and disclose a kind of half hole forming production technology of metal, include the following steps 1) preparation tool, 2) open up lower tool bore, 3) carry out half bore processing and forming, 4) determine molding feed scheme go forward side by side walk knife, 5) final test examine.The half hole forming production technology of metal, pass through the design using milling cutter, imposition layout, route interlamellar spacing Min0.2mm, soldermask layer Min0.25mm, and increase the outer copper face product of plate, reduce the case where orifice ring stress inwardly squeezes, the two-way way to get there of double V words is used in molding feed path simultaneously, solve plate thickness >=0.8MM, aperture >=0.5MM, the copper Burr phenomenon that the metal half bore hole edge of pitch of holes >=0.45MM (Kong Zhongxin is away from 0.95mm) is generated by stress problem, achieve the effect that forming process without copper Burr and burr, and the production technology overall flow is simplified, the problem of mitogenetic copper ashes of meeting generating unit and burr influence processing quality in turn when by Milling Process such as half hole formings to effective solution pcb board.
Description
Technical field
The present invention relates to metal half bore processing technique field, specially a kind of half hole forming production technology of metal.
Background technique
Numerically controlled lathe can carry out the processing of complex revolving body shape, and milling is after fixing blank with high-speed rotating milling cutter
The feed on blank, and the shape and feature of needs are cut out, it is special that traditional milling is more used for the simple shape such as milling wheel exterior feature and slot
Sign, CNC milling machine can carry out the processing of complex appearance and feature, and milling boring machining center can carry out three axis or multiaxis milling boring processing,
For processing mold, cubing, mould, thin-wall complicated curved surface, artificial prosthesis and blade etc., Milling Process is nowadays using
It is very extensive, while printed circuit board is also required to carry out corresponding Milling Process in processing.
Printed circuit board is also known as printed circuit board what pcb board etc., pcb board according to the wiring board number of plies can be divided into single sided board,
Dual platen, four laminates, six laminates and other multilayer circuit boards, printed circuit board develop to dual platen, multi-layer board from single layer and scratch
Property plate, and constantly develop to high-precision, high density and high reliability direction, constantly diminution volume, reduce cost and raising property
Can, so that printed circuit board in the development process of future electronic product, still maintains powerful vitality, the following printed circuit
Plate manufacturing technology development trend be in performance to high density, high-precision, fine pore, thin wire, small spacing, it is highly reliable,
Multiple stratification, high-speed transfer, light weight and slim direction are developed, it may be said that nowadays people's too busy to get away pcb board, and existing
In technology, the pcb board mitogenetic copper ashes of meeting generating unit and burr, the pig copper slag when by Milling Process such as half hole formings are influenced whether
The production quality of pcb board, so propose a kind of half hole forming production technology of metal solve the problems, such as it is above-mentioned proposed in.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of half hole forming production technology of metal, has forming process
Without copper Burr and the advantages that burr, solve pcb board when by Milling Process such as half hole formings can the mitogenetic copper ashes of generating unit and
The problem of burr and then influence processing quality.
(2) technical solution
Another technical problem to be solved by the present invention is that providing a kind of half hole forming production technology of metal, including following step
It is rapid:
1) preparation tool, Milling Process lathe, milling cutter, positioning fixture, drilling tool and pcb board to be processed is ready,
And be placed on pcb board on the workbench of Milling Process lathe, positioning fixture is clamped to being fixed on the outside of pcb board,
And then carry out next step；
2) lower tool bore is opened up, open up lower tool bore on pcb board using drilling tool and carries out typesetting, design method is positive positive row
Version, and should be noted that and avoid X and Y harmomegathus different the problem of Strip is shown in half bore size side occur；
3) half bore processing and forming is carried out, according to the effect that metal half bore stress point generates on molding feed path, utilizes milling
The design of knife, imposition layout, route interlamellar spacing Min0.2mm, soldermask layer Min0.25mm, and increase the outer copper face product of plate, it reduces
The case where orifice ring stress inwardly squeezes, by the double two-way ways to get there of V word of molding feed path, solve plate thickness >=0.8MM, aperture >=
The copper Burr problem that is generated by stress problem of metal half bore hole edge of 0.5MM, pitch of holes >=0.45MM (Kong Zhongxin is away from 0.95mm)；
4) determine that molding feed scheme is gone forward side by side knife of walking, aperture compensation is finished product 0.5mm, aperture 0.50mm, and spacing is
0.5mm increases orifice ring area, and less orifice ring stress inwardly squeezes, and final molding feed is diced as point of contact feed of A. extremely
Two holes center -0.025mm, bis- point of contacts B. retain 0.20mm layers of copper, and increase the copper face product at secondary point of contact, reduce orifice ring
Stress inwardly squeezes, and test verification is carried out after feed；
5) final test is examined, and the completion molding pcb board of metal half bore is transported to test point and is detected, test verification
It is divided into sampling and group surveys, pcb board test verification is detected according to the sampling proportion of 1:25, if nothing after sampling pcb board observation
Pig copper slag and burr phenomena then transport the pcb board of the batch to final test point, and still have in discovery sampling pcb board a small amount of
When pig copper slag and burr phenomena, the pcb board of the batch is subjected to integrated test inspection, the PCB that a final test verification finishes
Plate carries out second test, is completed and can carry out next step processing work or factory after qualification.
(3) beneficial effect
Compared with prior art, the present invention provides a kind of half hole forming production technology of metal, have it is following the utility model has the advantages that
1, the half hole forming production technology of metal passes through design, imposition layout, the route interlamellar spacing using milling cutter
Min0.2mm, soldermask layer Min0.25mm, and increase the case where outer copper face of plate is long-pending, and reduction orifice ring stress inwardly squeezes, while
Feed path is formed using the two-way way to get there of double V words, solves plate thickness >=0.8MM, aperture >=0.5MM, pitch of holes >=0.45MM (in hole
The heart is away from 0.95mm) the copper Burr phenomenon that is generated by stress problem of metal half bore hole edge, reached forming process without copper Burr and
The effect of burr is finished product 0.5mm, aperture 0.50mm, spacing 0.5mm by the aperture compensation of feed, and increases orifice ring
Area, less orifice ring stress inwardly squeeze, and can make pcb board is not in burr etc. when carrying out half bore processing and forming substantially
Phenomenon.
2, the half hole forming production technology of metal is transported by that will complete the molding pcb board of metal half bore to detection click-through
Row detection, pcb board test verification is detected according to the sampling proportion of 1:25, if after sampling pcb board observation without pig copper slag and
Burr phenomena then carries out next step, while if it find that have pig copper slag and burr phenomena then to detect by the gross, can effectively avoid
Pcb board, which occurs pig copper slag and burr when being produced, inaccurately leads to the problem of influencing quality because detecting, by pcb board one
It will do it secondary detection after secondary detection, the quality of pcb board next step processing work or factory can be made higher, to have
Solve the pcb board mitogenetic copper ashes of meeting generating unit and the burr when by Milling Process such as half hole formings of effect influence processed goods in turn
The problem of matter.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical solution in the embodiment of the present invention is clearly and completely retouched
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
A kind of half hole forming production technology of metal, which comprises the following steps:
1) preparation tool, Milling Process lathe, milling cutter, positioning fixture, drilling tool and pcb board to be processed is ready,
And be placed on pcb board on the workbench of Milling Process lathe, positioning fixture is clamped to being fixed on the outside of pcb board,
And then carry out next step；
2) lower tool bore is opened up, open up lower tool bore on pcb board using drilling tool and carries out typesetting, design method is positive positive row
Version, and should be noted that and avoid X and Y harmomegathus different the problem of Strip is shown in half bore size side occur；
3) half bore processing and forming is carried out, according to the effect that metal half bore stress point generates on molding feed path, utilizes milling
The design of knife, imposition layout, route interlamellar spacing Min0.2mm, soldermask layer Min0.25mm, and increase the outer copper face product of plate, it reduces
The case where orifice ring stress inwardly squeezes, by the double two-way ways to get there of V word of molding feed path, solve plate thickness >=0.8MM, aperture >=
The copper Burr problem that is generated by stress problem of metal half bore hole edge of 0.5MM, pitch of holes >=0.45MM (Kong Zhongxin is away from 0.95mm)；
4) determine that molding feed scheme is gone forward side by side knife of walking, aperture compensation is finished product 0.5mm, aperture 0.50mm, and spacing is
0.5mm increases orifice ring area, and less orifice ring stress inwardly squeezes, and final molding feed is diced as point of contact feed of A. extremely
Two holes center -0.025mm, bis- point of contacts B. retain 0.20mm layers of copper, and increase the copper face product at secondary point of contact, reduce orifice ring
Stress inwardly squeezes, and test verification is carried out after feed；
5) final test is examined, and the completion molding pcb board of metal half bore is transported to test point and is detected, test verification
It is divided into sampling and group surveys, pcb board test verification is detected according to the sampling proportion of 1:25, if nothing after sampling pcb board observation
Pig copper slag and burr phenomena then transport the pcb board of the batch to final test point, and still have in discovery sampling pcb board a small amount of
When pig copper slag and burr phenomena, the pcb board of the batch is subjected to integrated test inspection, the PCB that a final test verification finishes
Plate carries out second test, is completed and can carry out next step processing work or factory after qualification.
The beneficial effects of the present invention are: the half hole forming production technology of metal, passes through the design using milling cutter, typesetting cloth
Office, route interlamellar spacing Min0.2mm, soldermask layer Min0.25mm, and increase the outer copper face product of plate, it reduces orifice ring stress and inwardly squeezes
The case where, while plate thickness >=0.8MM, aperture >=0.5MM, pitch of holes are solved using the two-way way to get there of double V words in molding feed path
The copper Burr phenomenon that the metal half bore hole edge of >=0.45MM (Kong Zhongxin is away from 0.95mm) is generated by stress problem, has reached and had formed
The effect of Cheng Wutong Burr and burr are finished product 0.5mm by the aperture compensation of feed, aperture 0.50mm, and spacing is
0.5mm, and increase orifice ring area, less orifice ring stress inwardly squeezes, and can make pcb board base when carrying out half bore processing and forming
Originally phenomena such as being not in burr, the half hole forming production technology of metal are transported by that will complete the molding pcb board of metal half bore
It is detected to test point, pcb board test verification is detected according to the sampling proportion of 1:25, if after sampling pcb board observation
No pig copper slag and burr phenomena then carry out next step, while if it find that have pig copper slag and burr phenomena then to detect by the gross, energy
It is enough effectively to avoid the problem that pcb board occurs pig copper slag and burr when being produced and inaccurately causes to influence quality because detecting, lead to
Crossing pcb board will do it secondary detection after one-time detection, can make the quality of pcb board next step processing work or factory
It is higher, thus effective solution pcb board when by Milling Process such as half hole formings can the mitogenetic copper ashes of generating unit and burr into
And the problem of influencing processing quality.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (1)
1. a kind of half hole forming production technology of metal, which comprises the following steps:
1) preparation tool, Milling Process lathe, milling cutter, positioning fixture, drilling tool and pcb board to be processed is ready, and will
Pcb board is placed on the workbench of Milling Process lathe, and positioning fixture is clamped to being fixed on the outside of pcb board, in turn
Carry out next step；
2) lower tool bore is opened up, open up lower tool bore on pcb board using drilling tool and carries out typesetting, design method is positive positive typesetting, and
And it should be noted that and avoid X and Y harmomegathus different the problem of Strip is shown in half bore size side occur；
3) half bore processing and forming is carried out, according to the effect that metal half bore stress point generates on molding feed path, utilizes milling cutter
Design, imposition layout, route interlamellar spacing Min0.2mm, soldermask layer Min0.25mm, and increase the outer copper face product of plate, reduce orifice ring
The case where stress inwardly squeezes, by the double two-way ways to get there of V word of molding feed path, solve plate thickness >=0.8MM, aperture >=0.5MM,
The copper Burr problem that the metal half bore hole edge of pitch of holes >=0.45MM (Kong Zhongxin is away from 0.95mm) is generated by stress problem；
4) determine that molding feed scheme is gone forward side by side knife of walking, aperture compensation is finished product 0.5mm, aperture 0.50mm, and spacing is
0.5mm increases orifice ring area, and less orifice ring stress inwardly squeezes, and final molding feed is diced as point of contact feed of A. extremely
Two holes center -0.025mm, bis- point of contacts B. retain 0.20mm layers of copper, and increase the copper face product at secondary point of contact, reduce orifice ring
Stress inwardly squeezes, and test verification is carried out after feed；
5) final test is examined, and the completion molding pcb board of metal half bore is transported to test point and is detected, test verification is divided into
Sampling and group survey, and pcb board test verification is detected according to the sampling proportion of 1:25, if without the pig copper after sampling pcb board observation
Slag and burr phenomena then transport the pcb board of the batch to final test point, and still have a small amount of pig copper in discovery sampling pcb board
When slag and burr phenomena, the pcb board of the batch is subjected to integrated test inspection, the pcb board that a final test verification finishes into
Row second test is completed and can carry out next step processing work or factory after qualification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910681605.4A CN110446348A (en) | 2019-07-26 | 2019-07-26 | A kind of half hole forming production technology of metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910681605.4A CN110446348A (en) | 2019-07-26 | 2019-07-26 | A kind of half hole forming production technology of metal |
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| Publication Number | Publication Date |
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| CN110446348A true CN110446348A (en) | 2019-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910681605.4A Pending CN110446348A (en) | 2019-07-26 | 2019-07-26 | A kind of half hole forming production technology of metal |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312680A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Method for processing metallized half hole of circuit board |
| CN112654176A (en) * | 2020-12-08 | 2021-04-13 | 深圳市祺利电子有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN114025498A (en) * | 2021-11-30 | 2022-02-08 | 深圳市明正宏电子有限公司 | Efficient metal semi-hole coil copper sheet preparation device and method |
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| CN202750332U (en) * | 2012-08-20 | 2013-02-20 | 长沙牧泰莱电路技术有限公司 | PCB circuit board |
| CN103179791A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Metal half-hole forming method and printed circuit board manufacture method |
| CN103179805A (en) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | Metal half hole molding method and manufacture method of printed circuit board |
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2019
- 2019-07-26 CN CN201910681605.4A patent/CN110446348A/en active Pending
Patent Citations (3)
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| CN103179791A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Metal half-hole forming method and printed circuit board manufacture method |
| CN103179805A (en) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | Metal half hole molding method and manufacture method of printed circuit board |
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Non-Patent Citations (1)
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312680A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Method for processing metallized half hole of circuit board |
| CN112654176A (en) * | 2020-12-08 | 2021-04-13 | 深圳市祺利电子有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN112654176B (en) * | 2020-12-08 | 2022-02-15 | 深圳市祺利电子有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN114025498A (en) * | 2021-11-30 | 2022-02-08 | 深圳市明正宏电子有限公司 | Efficient metal semi-hole coil copper sheet preparation device and method |
| CN114025498B (en) * | 2021-11-30 | 2023-10-13 | 深圳市福源晖集成电子有限公司 | Metal half-hole rolled copper sheet preparation device and method thereof |
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Application publication date: 20191112 |