CN110441315A - Electronic component test equipment and method - Google Patents
Electronic component test equipment and method Download PDFInfo
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- CN110441315A CN110441315A CN201910711395.9A CN201910711395A CN110441315A CN 110441315 A CN110441315 A CN 110441315A CN 201910711395 A CN201910711395 A CN 201910711395A CN 110441315 A CN110441315 A CN 110441315A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Provide a kind of equipment for being tested electronic component, it include: image collecting device, its first image for being used to acquire the electronic component when the light along first direction irradiates the electronic component, and the second image of the electronic component is acquired when light in a second direction irradiates the electronic component, the first direction is different from the second direction；And image combining unit, it is used to combine the first image and second image to generate combined image, and the distribution of the gray value at each pixel in the combined image characterizes the relative depth of each corresponding position in the electronic component.According to obtained combined image, the detection to bump defects and/or depression defect can be simply implemented.
Description
Technical field
This application involves electronic component manufacturing fields, more particularly to the test to electronic component, and relate more specifically to
Detection to the surface defect of electronic component.
Background technique
The surface defect of the electronic component of such as semiconductor chip can result in the decrease in yield of semiconductor devices, performance
The problems such as deterioration.Routine test machine can by acquire as inspected object electronic component image, then in image
Defect on middle detection electronics surface.
Bump defects and depression defect on electronic component surface have phase in the image acquired by routine test machine
As appearance.For example, bump defects and depression defect are all shown as the speck on image under the conditions of particular light, alternatively,
Bump defects and depression defect are all shown as the blackening on image, accordingly, it is difficult to distinguish bump defects and depression defect.So
And bump defects can be distinguished and depression defect is important, because depression defect is often more serious than bump defects.For example,
Depression defect can be actual defects, and bump defects may be only the dust on electronic component surface.
On the one hand, the defect of detection artificially can be further judged after detecting defect by routine test machine is
Bump defects or depression defect.
On the other hand, detected object can be obtained by other means such as stereoscopic camera, camera array, structure light
Depth image with depth information distinguishes bump defects and depression defect using the depth information.
It is intended to provide a kind of improved plan for distinguishing bump defects and depression defect.
Summary of the invention
It provides for improving equipment of being tested electronic component and method, it being capable of low cost, efficiently and accurately
Protrusion and depression defect in detection electronics.
According to one embodiment of present invention, a kind of equipment for being tested electronic component is provided.It is described to set
Standby includes: image collecting device, is used to acquire the electronic component when the light along first direction irradiates the electronic component
The first image, and acquire when light in a second direction irradiates the electronic component the second image of the electronic component,
The first direction is different from the second direction, wherein the electronic component is the electronic component to be tested；Image combination
Unit is used to combine the first image and second image to generate combined image, in the combined figure
The distribution of the gray value at each pixel as in characterizes the relative depth of each corresponding position in the electronic component；And
Output unit is used for the combined image output.
According to another embodiment of the invention, a kind of method for being tested electronic component is provided.It is described
Method include: receive the first image of the electronic component acquired when the light along first direction irradiates the electronic component and
Second image of the electronic component acquired when light in a second direction irradiates the electronic component, the first direction is not
It is same as the second direction, wherein the electronic component is the electronic component to be tested；Combine the first image and described
To generate combined image, the distribution of the gray value at each pixel in the combined image characterizes second image
The relative depth of each corresponding position in the electronic component；And the combined image is exported.
Each embodiment according to the present invention, it is only necessary to the ministry of electronics industry to be tested is illuminated from different direction of illuminations using light source
Part acquires at least two images corresponding to different directions of electronic component, combines the image of acquisition, so that in combined image
Grey value profile can characterize relative depth information, it will be able to the protrusion in the image detection electronic component based on the combination
And/or recess.On the one hand, by simply combining the image of the irradiation acquisition of corresponding different directions, the distinctive gray scale of the image
Distribution value can symbolize the relative depth of image position, thus have an opportunity according to the distinctive grey value profile letter of the image
Breath is realized to the raised or sunken automatic detection in electronic component, and time and manpower are saved.On the other hand, according to the present invention
Embodiment testing electronic parts device and method, it is thus only necessary to carried out on the basis of current test machine simple
It improves, is compared to the depth image with real depth information by acquisitions such as stereoscopic camera, camera array, structure lights
Speech, the combination image of embodiment according to the present invention only needs to show depth information (being properly termed as pseudo- 3D rendering), without obtaining
True depth value is obtained, this greatly reduces cost on the basis of simple computation.Specifically, above-mentioned at least two images
It can only be obtained by the single camera being such as arranged in routine inspection machine, without additional camera or camera array.
For example, it will only be necessary to the light source of mobile light source position or offer at multiple positions, and the camera of single fixed position is only provided.
In addition, the light for irradiating electronic component from different directions is not necessarily to be designed to complicated structure light.Therefore, the complexity of equipment and at
Originally it substantially reduces.
Other advantages of the invention will be recognized in those skilled in the art after reading and understanding are described in detail below.
Detailed description of the invention
Fig. 1 shows the block diagram of the equipment according to an embodiment of the invention for being tested electronic component；
Fig. 2 (a) and Fig. 2 (b) respectively illustrates to be measured when irradiating along different directions according to one embodiment of present invention
The image acquired when the electronic component of examination；
Fig. 3 is shown according to one embodiment of present invention to when irradiating electronic component to be tested along different directions
The combined image that the image of acquisition is combined；
Fig. 4 (a) and Fig. 4 (b) respectively illustrate the protrusion in combined image according to an embodiment of the invention
Defect and depression defect；And
Fig. 5 shows the process of the method according to an embodiment of the invention for being tested electronic component
Figure.
Specific embodiment
Fig. 1 shows the frame of the equipment 100 according to an embodiment of the invention for being tested electronic component
Figure.
Equipment 100 includes supporter 101, can carry the electronic component to be tested thereon, such as half with surface
Conductor chip 10.In the manufacturing process of semiconductor chip, due to technology etc., it may be left on the surface of chip scarce
It falls into.It will be appreciated by those skilled in the art that electronic component can be any electronic component for needing to carry out it defects detection, example
Such as, sheet metal, conducting wire etc..
Equipment 100 further includes the image collecting device 102 of such as camera, can be disposed in 101 top of supporter
Semiconductor chip 10 can be carried out at the position of Image Acquisition.Camera 102 can in the case where itself is not moved, with
At least two images of same angle acquisition semiconductor chip 10, each image correspond respectively to utilize illumination semiconductor
The different direction of illuminations of chip 10.For example, camera acquires semiconductor when the light from a direction irradiates semiconductor chip 10
The piece image of chip 10.In this way, after the light from least two directions 11,12 irradiates semiconductor chip 10 respectively, energy
Enough obtain at least two images of semiconductor chip 10.It should be noted that irradiation semiconductor chip 10 should be understood semiconductor chip
10 should be illuminated enough to become clear so that entire semiconductor chip 10 can be imaged in camera.It is understood that coming from
The degree that the light of different directions will necessarily make the same edge of semiconductor chip 10 be illuminated in different images is different.
Equipment 100 further includes image combining unit 103, and at least two images generation that can be acquired according to camera is partly led
The combined image of body chip 10.The combined image is different from adopting using when irradiating semiconductor chip 10 from a direction
The image of collection, wherein the distribution of the gray value of each pixel in combined image can embody partly leading in the image
The relative depth of each section of body chip 10.The distribution of the gray value of each pixel especially refers in specific pixel and its neighborhood
Each pixel between gray value distribution, such as between the gray value of each pixel in the gray value and its neighborhood of specific pixel
Relativeness.
For example, distribution (i.e. each pixel and the pixel in its neighborhood of the gray value of each pixel of combined image
The relativeness of gray value) enable to the image visually to embody stereoscopic effect.
In one example, determine that the grey value difference of each pixel and the pixel in its neighborhood is (such as ash in specific image
Spend gradient).In this way, if it find that the difference of specific image region and its peripheral region meets preassigned, then can
Enough judge that the image-region for bump defects, equally can also judge depression defect.The preassigned can for example rule of thumb
It is manually set, or can be determined according to machine learning method, as described hereinbelow, which includes threshold
Value.
Since composograph can't provide actual depth value, it is understood as pseudo- 3D rendering.Although utilizing picture
The gray value of element describes the embodiment of the invention, but those skilled in the art can be envisaged that other attribute energy of pixel
It is enough in and characterizes relative depth information in combined image, for example, being directed to the chromatic value of color image.
Equipment 100 further includes output unit 104, is used to export combined image.
In one embodiment, output unit 104 includes display unit.
Display unit can be used in showing combined image, such as be shown to user to observe.In general, user's energy
The visual stereo effect enough embodied according to shown combined image and on this image with pixel grey scale Distribution value
Directly judge bump defects and/or depression defect in semiconductor chip 10.This need defect in the picture enough obviously with
Make it possible to by visually differentiating.
In a preferred embodiment, in order to realize more robust and more accurate defects detection, and in order to realize
The process flow more automated, equipment 100 further include defects detection and taxon 105.
In this case, combined image is input to the defects detection and taxon 105 is further processed, with
It identifies therein raised or sunken.Defects detection and taxon 105 can be automatically based on combined image to identify
The defect of semiconductor chip 10, and can automatically determine that defect belongs to bump defects or depression defect.This field skill
Art personnel can be envisaged that a variety of existing image processing techniques to identify according to the grey value profile in combined image
Bump defects and/or depression defect.For example, passing through image segmentation, can there will be the region of similar gray-value pixel in image
It is partitioned into form the different zones on image.Pass through the gray scale difference between different zones and/or the transition between different zones
The feature in region can identify bump defects and/or depression defect in combined image.
In a preferred embodiment, defects detection and taxon 105 can be based on pre- by machine learning method
First trained model identifies the bump defects and/or depression defect in combined image.
For example, by with several of specific gray value distribution and corresponding known bump defects and/or depression defect
Image trains the model.Specific gray value distribution in the multiple image is similar to combined image according to the present invention
Grey value profile, i.e., can also characterize the relative depth of each section in image.In one example, pass through machine learning method
It can determine the preassigned for judging bump defects or depression defect.
The combined image that principle according to the present invention is obtained is input in trained model, and model can be certainly
It whether is exported in the combined image inputted dynamicly comprising bump defects and/or depression defect.
Machine learning method based on training pattern further increases the accuracy and robustness of defect recognition.
Defects detection and taxon 105 can be single by output to the testing result of bump defects and/or depression defect
Member 104 and exported.
In one embodiment, equipment 100 further includes lighting device 106.Lighting device 106 can include normal in this field
The light source for illumination seen, such as point light source.Lighting device 106 can include being arranged on different location with never Tongfang
To the multiple light sources of transmitting light.Multiple light sources are sequentially activated, to distinguish 11,12 irradiation semiconductor chip from different directions
10.Alternatively, lighting device 106 can only include single source.The single source can be by including the cause in lighting device 106
Dynamic device (not shown) rotates to different angle or is moved at different location, with 11,12 irradiations are partly led from different directions respectively
Body chip 10.
It is understood that lighting device 106 can be provided as a part of equipment 100.Or lighting device 106 can be
The external illuminators of equipment 100.
In a preferred embodiment, two sides opposite about semiconductor chip 10 above semiconductor chip 10
Transmitting light to irradiate semiconductor chip 10 respectively upwards.For example, from the two of the upper left side and upper right side that are located at semiconductor chip 10
A relative direction emits light to semiconductor chip 10 respectively, and when from each direction transmitting light irradiation semiconductor chip 10,
The image of a width semiconductor chip 10 is acquired respectively.
It will be appreciated by those skilled in the art that image collecting device 102, image combining unit 103, output unit 104 with
And defects detection and taxon 105 can be implemented as the software module that control has the hardware of corresponding function.
Fig. 2 (a) shows the image 201 acquired when the irradiation semiconductor chip of the upper left side from two relative directions, and
And Fig. 2 (b) shows the image 202 acquired when the irradiation semiconductor chip of the upper right side from two relative directions.By this two width
Image is combined into combined image.
Although, it can be seen that the image acquired when irradiating semiconductor chip from single direction from Fig. 2 (a) and Fig. 2 (b)
Also with the different distributions of gray value, but the gray value in these images is only capable of providing plane visual effect.Allow to from this
A little images judge that different zones have the different depths, but can not intuitively judge which deeper region of which region more
Shallowly.
Fig. 3 show it is according to an embodiment of the invention be composed using image 201 and image 202 it is combined
Pseudo- 3D rendering 301.The respective pixel of image 201 and image 202 is combined by following formula:
log(x1+1.0)-log(x2+ 1.0) (1),
Wherein, x1Indicate the gray value of the respective pixel of image 201, and x2Indicate the gray scale of the respective pixel of image 201
Value.By x1And x2Taking logarithm respectively is the dynamic range in order to expand gray value, so that obtained composograph contains more
Few noise.Before taking logarithm, on each gray value plus 1 so that it is guaranteed that Logarithmic calculation will not be carried out to zero.
The value obtained according to above-mentioned formula (1) is normalized in the range of 0-255, to form the correspondence picture of image 301
The gray value of element.Therefore, the gray value of each pixel of image 301 is given by the following formula:
Normalize (log (x1+1.0)-log(x2+ 1.0), 0,255), (2),
So that each pixel of finally obtained image 301 has the gray value in 0-255 range.
Except mode except through taking logarithm to gray value, image 201 and figure can also be combined by following formula
As 202 and each grey scale pixel value of determining image 301:
Normalize (1/ (256-x1)-1/(256-x2),0,255) (3)。
Under teachings of the present application, those skilled in the art can be envisaged that the mode of other combination images.
It can be, it is evident that image 301 can visually embody stereoscopic effect, although the image only has in Fig. 3
There is gray value information and does not have the depth value for each pixel.Therefore, no matter visually or in automatic algorithms
In, it can be based on the stereochemical structure that image 301 judges 10 surface of semiconductor chip.
Fig. 4 (a) and Fig. 4 (b) respectively illustrates the partial enlarged view of the combined image of embodiment according to the present invention
As 401,402, wherein the partial enlargement image 401 of Fig. 4 (a) shows the bump defects irised out by circle, and Fig. 4 (a)
Partial enlargement image 402 shows the depression defect irised out by circle.By contrast images 401 and 402, bump defects and recess
The appearance of defect has significant difference and corresponds with the mankind to the visual perception of protrusion and recess.
Return to Fig. 1, in the range of the noise level allowed, the principle of the application allow to issue from light source the direction of light with
Angle theta between the surface of semiconductor chip 10 can be small in the range of 5 ° -25 °.To which, the application can be realized pair
Shallowly to the detection of 10 μm of protrusion and/or recess.And such as stereoscopic camera based on binocular parallax usually requires that two cameras lean on
Closely on the surface of semiconductor chip, to not allow too small angle theta, therefore it can not realize that the application can reach
Identification either shallow.
Experimental data is it has been shown that the principle of the application can be realized up to 99.55% detection for being directed to > 30 μm of either shallow
Accuracy and for the either shallow between 10 μm -30 μm up to 97.69% accuracy in detection.
Fig. 5 shows the process of the method according to an embodiment of the invention for being tested electronic component
Figure.
In 501, the of the electronic component acquired when the light along first direction irradiates the electronic component is received
Second image of one image and the electronic component acquired when light in a second direction irradiates the electronic component, described
One direction is different from the second direction.
In 502, the first image and second image are combined to generate combined image, described combined
Image in each pixel at the distribution of gray value characterize the relative depth of each corresponding position in the electronic component.
In 503, the combined image is exported.
Although referring to the first image and the second iamge description the embodiment of the present invention is combined, it will be understood that when necessary
Multiple image can be combined.
It is understood that there is identical and/or similar embodiment with according to the equipment of the application according to the present processes.
It can be carried out by running the computer program of code form according to the present processes.The computer journey
Sequence can be stored in any suitable storage medium, for example, non-transient computer-readable storage media.
The memory for storing above-mentioned computer program can be included together in processor for testing electronic parts
In system, the processor can run the computer program of storage in the memory to execute method of the invention.
It is described reference only to embodiment shown in fig. 5 above method of the invention, it is possible to understand institute in above-described embodiment
Including operations be not limiting, can according to need and be deleted, combine, changing, splitting and/or group again
It closes, with increase/corresponding function of modification/deletion.
System and method of the invention are described above by reference to each embodiment, it is mentioned that embodiment may include spy
Fixed feature, structure or characteristic, each embodiment of but not necessarily include the specific feature, structure or characteristic.This
Outside, some embodiments can have some or all of for feature described in other embodiments or without for other realities
Apply feature described in example.
Each feature of different embodiment or examples can be with some features for being included and the other spies excluded
Sign carries out a variety of combinations to adapt to a variety of different applications.Attached drawing and foregoing description give the example of embodiment.This field skill
Art personnel will be understood that one or more of described element can be combined into individual feature element.Alternatively, certain elements
It is segmented into multiple function element.Element from one embodiment can be added to another embodiment.For example, being described herein
The sequence of process can change and be not limited to manner described herein.In addition, the operation of any flow chart is not needed with institute
The sequence shown is realized；Also it is not necessarily required to execute all operations.In addition, can be with it independent of those of other operations operation
He operates and is performed in parallel.The range of embodiment is certainly by no means limited by these specific examples limitation.Regardless of whether clear in the description
It provides, many variations of such as operation order, product form and the difference in structure are possible.
Claims (16)
1. a kind of equipment for being tested electronic component, comprising:
Image collecting device is used to acquire the of the electronic component when the light along first direction irradiates the electronic component
One image, and the second image of the electronic component is acquired when light in a second direction irradiates the electronic component, it is described
First direction is different from the second direction, wherein the electronic component is the electronic component to be tested；
Image combining unit is used to combine the first image and second image to generate combined image, in institute
State each corresponding position in the distribution characterization electronic component of the gray value at each pixel in combined image
Relative depth；And
Output unit is used for the combined image output.
2. equipment according to claim 1, wherein the output unit further include:
Display unit is used to show combined image.
3. equipment according to claim 1, further includes:
Defects detection and taxon are used for based on the bump defects in electronic component described in the combined image detection
And/or depression defect；
Wherein, the output unit is used to export the testing result of the bump defects and/or depression defect.
4. equipment according to claim 3, wherein
The defects detection and taxon detected based on model trained in advance the bump defects in the electronic component and/
Or depression defect, wherein the model trained in advance is obtained according to multiple image training, every in the multiple image
Width shows known bump defects and/or depression defect and has corresponding grey value profile.
5. equipment described in any one of -4 according to claim 1, further includes:
Lighting device is used to irradiate the electronic component from the first direction and the second direction respectively.
6. according to equipment described in claim according to claim 1 any one of -4, wherein
Described image assembled unit is determined based on the gray value of respective pixel in the first image and second image and is indicated
The data of the difference of the gray value at respective pixel in the first image and second image；It determines based on the data
The gray value of each pixel in the combined image.
7. equipment according to claim 6, wherein
Described image assembled unit determines the data by following formula:
log(x1+1.0)-log(x2+ 1.0),
Wherein, x1It is the gray value of a pixel in the first image, and x2It is the respective pixel in second image
Gray value；
And described image assembled unit is determined every in the combined image by the way that the data are normalized
The gray value of a pixel.
8. equipment described in any one of -4 according to claim 1,
Wherein, the first direction and the second direction are in 5 ° -25 ° with the angle on the surface of the electronic component respectively
In range.
9. a kind of method for being tested electronic component, comprising:
It receives the first image of the electronic component acquired when the light along first direction irradiates the electronic component and works as edge
The light of second direction irradiates the second image of the electronic component acquired when the electronic component, and the first direction is different from
The second direction, wherein the electronic component is the electronic component to be tested；
Combination the first image and second image are each in the combined image to generate combined image
The distribution of gray value at a pixel characterizes the relative depth of each corresponding position in the electronic component；And
Export the combined image.
10. according to the method described in claim 9, wherein, exporting the combined image further include:
Show the combined image.
11. according to the method described in claim 9, further include:
Based on the bump defects and/or depression defect in electronic component described in the combined image detection, and
Export the testing result of the bump defects and/or depression defect.
12. according to the method for claim 11, wherein based in electronic component described in the combined image detection
Bump defects and/or depression defect further include:
The bump defects and/or depression defect in the electronic component are detected based on model trained in advance, wherein described pre-
First trained model is obtained according to multiple image training, and every width in the multiple image shows known bump defects
And/or depression defect and have corresponding grey value profile.
13. according to claim method according to any one of claim 9-12, wherein based on the combined figure
As detecting bump defects and/or depression defect in the electronic component further include:
Expression the first image and institute are determined based on the gray value of respective pixel in the first image and second image
State the data of the difference of the gray value at the respective pixel in the second image；And
The gray value of each pixel in the combined image is determined based on the data.
14. according to the method for claim 13, wherein based in electronic component described in the combined image detection
Bump defects and/or depression defect further include:
The data are determined by following formula:
log(x1+1.0)-log(x2+ 1.0),
Wherein, x1It is the gray value of a pixel in the first image, and x2It is the respective pixel in second image
Gray value；And
The gray value of each pixel in the combined image is determined by the way that the data are normalized.
15. the method according to any one of claim 9-12,
Wherein, the first direction and the second direction are in 5 ° -25 ° with the angle on the surface of the electronic component respectively
In range.
16. a kind of system for being tested electronic component, comprising:
Memory stores computer program code；And
Processor runs the computer program code to execute the side according to any one of claim 9-15
Method.
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| CN111044522A (en) * | 2019-12-14 | 2020-04-21 | 中国科学院深圳先进技术研究院 | Defect detection method and device and terminal equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4974261A (en) * | 1988-11-15 | 1990-11-27 | Matsushita Electric Works, Ltd. | Optical surface inspection method |
| GB9506207D0 (en) * | 1994-03-26 | 1995-05-17 | Jenoptik Technologie Gmbh | Method for detection of defects in the inspection of structured surfaces |
| CN102292805A (en) * | 2009-01-26 | 2011-12-21 | 恪纳腾公司 | Systems and methods for detecting defects on a wafer |
| CN102567960A (en) * | 2010-12-31 | 2012-07-11 | 同方威视技术股份有限公司 | Image enhancing method for security inspection system |
| CN108445007A (en) * | 2018-01-09 | 2018-08-24 | 深圳市华汉伟业科技有限公司 | A kind of detection method and its detection device based on image co-registration |
| CN108830796A (en) * | 2018-06-20 | 2018-11-16 | 重庆大学 | Based on the empty high spectrum image super-resolution reconstructing method combined and gradient field is lost of spectrum |
| CN109871895A (en) * | 2019-02-22 | 2019-06-11 | 北京百度网讯科技有限公司 | The defect inspection method and device of circuit board |
| CN109934808A (en) * | 2019-03-04 | 2019-06-25 | 佛山市南海区广工大数控装备协同创新研究院 | One kind being based on image Multiple Shape normal direction gradient difference value pcb board defect classification method |
| CN109946303A (en) * | 2017-12-21 | 2019-06-28 | 东友精细化工有限公司 | Check device and method |
-
2019
- 2019-08-02 CN CN201910711395.9A patent/CN110441315B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4974261A (en) * | 1988-11-15 | 1990-11-27 | Matsushita Electric Works, Ltd. | Optical surface inspection method |
| GB9506207D0 (en) * | 1994-03-26 | 1995-05-17 | Jenoptik Technologie Gmbh | Method for detection of defects in the inspection of structured surfaces |
| CN102292805A (en) * | 2009-01-26 | 2011-12-21 | 恪纳腾公司 | Systems and methods for detecting defects on a wafer |
| CN102567960A (en) * | 2010-12-31 | 2012-07-11 | 同方威视技术股份有限公司 | Image enhancing method for security inspection system |
| CN109946303A (en) * | 2017-12-21 | 2019-06-28 | 东友精细化工有限公司 | Check device and method |
| CN108445007A (en) * | 2018-01-09 | 2018-08-24 | 深圳市华汉伟业科技有限公司 | A kind of detection method and its detection device based on image co-registration |
| CN108830796A (en) * | 2018-06-20 | 2018-11-16 | 重庆大学 | Based on the empty high spectrum image super-resolution reconstructing method combined and gradient field is lost of spectrum |
| CN109871895A (en) * | 2019-02-22 | 2019-06-11 | 北京百度网讯科技有限公司 | The defect inspection method and device of circuit board |
| CN109934808A (en) * | 2019-03-04 | 2019-06-25 | 佛山市南海区广工大数控装备协同创新研究院 | One kind being based on image Multiple Shape normal direction gradient difference value pcb board defect classification method |
Non-Patent Citations (1)
| Title |
|---|
| 李达辉: "《数字图像处理核心技术及应用》", 31 March 2019 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111044522A (en) * | 2019-12-14 | 2020-04-21 | 中国科学院深圳先进技术研究院 | Defect detection method and device and terminal equipment |
| CN111044522B (en) * | 2019-12-14 | 2022-03-11 | 中国科学院深圳先进技术研究院 | Defect detection method and device and terminal equipment |
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