CN110440690A - A kind of device and method for single-point diamond lathe linear axis error measure - Google Patents
A kind of device and method for single-point diamond lathe linear axis error measure Download PDFInfo
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- CN110440690A CN110440690A CN201910697658.5A CN201910697658A CN110440690A CN 110440690 A CN110440690 A CN 110440690A CN 201910697658 A CN201910697658 A CN 201910697658A CN 110440690 A CN110440690 A CN 110440690A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
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- Machine Tool Sensing Apparatuses (AREA)
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Abstract
The invention discloses a kind of device and methods for single-point diamond lathe linear axis error measure, belong to Ultra-precision Turning equipment field of precision measurement.The device includes standard target Array Plate, micro- camera, micro- feature extraction program module and error calculation program module, micro- camera obtains micro- characteristic image according to micro- feature on preset path scanning standard target Array Plate, micro- feature extraction program module is used to extract annulus pattern center location and the radius parameter in micro- feature, and error calculation program module is for calculating at least one of linear axis position error, horizontal linear degree error and error of perpendicularity.The advantages of high-acruracy survey of linear axis position error, horizontal linear degree error and the error of perpendicularity may be implemented in measuring device and method of the invention, has measurement range big, easy to implement and rapid survey.
Description
Technical field
The invention belongs to Ultra-precision Turnings to equip field of precision measurement, be related to a kind of for single-point diamond lathe linear axis
The device and method of error measure hangs down more particularly, to a kind of single-point diamond lathe linear axis based on standard target array
Straight degree error measuring means and method.
Background technique
Single-point diamond lathe is one of typical Ultra-precision Turning equipment, by developing for a long time, in constant temperature, perseverance
The condition of the Ultra-precision Turnings such as pressure, active vibration isolation environment and the advanced technologies such as straight-line static-pressure guide rail and air bearing spindles equipment
Under, processing performance has reached the limit of tradition machinery manufacture, realizes micron-sized dimensional accuracy and nanoscale surface is thick
Rugosity.Its excellent performance relies on machine tool motion accuracy guarantee, and the error of perpendicularity is an important geometric error of lathe, especially
For single-point diamond lathe, its feed accuracy is influenced, thereby reduces workpiece size machining accuracy.Only it is improved verticality mistake
The detection level of difference improves the machining accuracy of Ultra-precision Turning equipment by error compensation and improvement processing technology, promotes super
The development of precision processing technology.
Existing error of perpendicularity method has square method, diagonal method and microscope group method based on laser interference metering,
And based on ball bar data analysis etc., these measurement method precision are limited, and are limited to machine tool structure arrangement, measurement range
It is limited, it is only applicable to machine tool, is unable to satisfy the detection demand of Ultra-precision Turning equipment.
Therefore, need that a kind of measurement range is wider, the higher apparatus and method of measurement accuracy.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, it is straight for single-point diamond lathe that the present invention provides one kind
The device of spool error measure, it is intended that can be carried out in the total travel of linear axis based on special standard target array
Micro- characteristic image scanning, the correlated error of single-point diamond lathe linear axis is calculated in conjunction with image zooming-out technology automatically, thus real
Error precise measurement in existing single-point diamond lathe linear axis total travel, thus solution prior art measurement range is limited, surveys
The limited technical problem of accuracy of measurement.
To achieve the above object, according to one aspect of the present invention, it provides a kind of for single-point diamond lathe straight line
The device of axis error measurement, including micro- camera, standard target Array Plate, micro- feature extraction program module and error calculation program
Module；
The length of the standard target Array Plate is greater than the stroke of the linear axis X of single-point diamond lathe to be measured, and width is big
In the stroke of the linear axis Z of single-point diamond lathe to be measured；The one side of the standard target Array Plate is equipped with by calibrated
Ranks micro- character array that equally distributed micro- feature forms at equal intervals；
Micro- feature includes supplemental characteristic and target signature；Supplemental characteristic includes matrix pattern pattern and multiple direction fields word
The arrow of shape pattern center, for assisting micro- camera quickly to find and positioning target signature；Target signature is annulus pattern, position
In matrix pattern pattern center location；
Under use state, micro- camera is mounted on the motion platform of the linear axis X of single-point diamond lathe to be measured；It is described
Standard target Array Plate is mounted on the motion platform of the linear axis Z of single-point diamond lathe to be measured, and is equipped with micro- character array
A processing planar registration facing towards microfacies machine and with single-point diamond lathe to be measured；
Micro- feature extraction program module is used for the micro- feature scanned according to micro- camera according to preset path, and positioning target is special
Levy and extract the center location and radius size of annulus pattern；Error calculation program module is used for the center of circle position according to annulus pattern
The position error, horizontal linear degree error and verticality for calculating single-point diamond lathe linear axis X, Z with radius size is set to miss
At least one of difference.
Further, micro- character array is processed in a side surface of the mask blank of rectangle using photoetching process,
It reuses metering type three-coordinates measuring machine to demarcate the positional relationship of micro- character array on mask blank, be made described
Standard target Array Plate.
Further, the multiple arrow for being directed toward matrix pattern pattern center, the circumferential direction along matrix pattern pattern are uniformly distributed.
Further, the micro- camera includes microcobjective and high-speed CCD camera, and microcobjective is used for the standard
Micro- feature on target Array Plate carries out micro- amplification, and high-speed CCD camera is for acquiring amplified micro- characteristic image.
Further, micro- feature extraction program module is identified in called execute based on border following algorithm
The outer circle and inner circle of annulus pattern, and then extract the central coordinate of circle and radius of annulus pattern outer circle and inner circle respectively, by outer circle with
Center location of the average value of the central coordinate of circle of inner circle as annulus pattern, using the semidiameter of outer circle and inner circle as annulus pattern
Width.
Further, micro- feature extraction program module is in called execute, for micro- each of on scan path
Feature extracts position and the radius of annulus pattern in accordance with the following steps:
(1) micro- characteristic image of micro- camera (4) acquisition is progressively scanned, until encountering first non-zero points；It will
Starting point of the non-zero points as outer circle carries out the tracking of 8- neighborhood to the outer circle, and records the x coordinate and y-coordinate for being tracked point；
(2) after tracking, the x coordinate and y-coordinate value of the circle boundary point obtained using tracking carry out least square fitting,
Obtain the fitting center of circle (X of outer circle1i,Y1i) and radius R1i；
(3) using the circle region of exradius n pixel of reduction as new scanning area, according to step (1), the side of (2)
Method obtains the fitting center of circle (X of the inner circle of annulus pattern2i,Y2i) and radius R2i；
(4) using the average value of the central coordinate of circle of outer circle and inner circle as the central coordinate of circle (X of annulus patterni,Yi) it is as follows:
By the semidiameter R of outer circle and inner circle1i-R2iWidth Delta R as annulus patterni；
Wherein, i is that the acquisition order of micro- feature is numbered, and first micro- feature number of acquisition is i=0.
Further, error calculation program module for calculating the positioning of single-point diamond lathe linear axis as follows
Error, horizontal linear degree error and the error of perpendicularity:
For linear axis X (1), the first micro- feature acquired along linear axis X (1) motion process with micro- camera (4)
Position (X of the center of circle in ccd image0,Y0) it is reference data, the other micro- feature center of circle (Xi,Yi) relative to (X0,Y0) In
The offset of X-direction in ccd image is position error Δ di, the offset of the Y direction in ccd image is Δ vi；It is right
ΔdiIt carries out least square fitting and obtains the position error of (1) linear axis X, to Δ viIt carries out least square fitting and obtains linear axis X
(1) horizontal linear degree and horizontal linear degree error；
Wherein:
In formula, D is the actual nominal width value of annulus pattern；
Position error, horizontal linear degree and the horizontal linear degree error of (8) linear axis Z can similarly be obtained；
After the horizontal linear degree for obtaining linear axis X (1) and linear axis Z (8), error of perpendicularity S is calculatedxzAre as follows:
Sxz=arctank2-arctank1-90°
In formula, k1With k2The respectively horizontal linear degree of linear axis Z (8) and linear axis X (1).
It is another aspect of this invention to provide that providing a kind of based on above-mentioned apparatus progress single-point diamond lathe linear axis mistake
The method of difference measurements, includes the following steps:
(1) the linear axis X and linear axis Z of single-point diamond lathe is driven to move to the initial position of zero stroke respectively, it will
Micro- camera is mounted on the motion platform of linear axis X, and standard target Array Plate is mounted on to the straight line of single-point diamond lathe
On the motion platform of axis Z, standard target Array Plate is made to be equipped with the one side and the processing of single-point diamond lathe of micro- character array
Planar registration adjusts the distance between micro- camera and standard target Array Plate, and until can clearly present, micro- feature is micro- to be put
Big image；
(2) driving linear axis X drives micro- camera uniform motion, while it is micro- to acquire micro- feature that micro- camera scanning arrives
Enlarged drawing, the stop motion after linear axis X moves complete stroke；Linear axis Z is driven to drive standard target Array Plate even again
Speed movement, while the micro- enlarged drawing of micro- feature that micro- camera scanning arrives is acquired, it is complete until the complete stroke of linear axis Z movement
At L-shaped scanning motion track；
(3) while step scans or after the completion of step scans, using micro- feature extraction program module to micro- camera
Collected micro- characteristic image carries out feature extraction, obtains the center location and radius size of the annulus pattern of micro- feature, passes through
Error calculation program module calculates single-point diamond lathe linear axis position error, horizontal linear degree error and the error of perpendicularity
At least one of, complete measurement.
In general, the above technical scheme conceived by the present invention compared with prior art, can obtain following beneficial to effect
Fruit:
(1) measurement accuracy is high: use calibrated standard target Array Plate as scanning extraction object, with compared with it is high-precision
Degree；Micro- camera is recycled, in conjunction with microtechnic with micro- characteristic image extractive technique, it can be achieved that micro- on standard target Array Plate
Feature precise positioning and high-precision characteristic parameter extraction, to realize single-point diamond lathe linear axis error of perpendicularity high-precision
Measurement；The processing plane that plane is single-point diamond lathe is detected in actual measurement, can more reflect the lathe error of perpendicularity pair
The influence of machining accuracy；In addition, using photoetching technique processing criterion target Array Plate, available high-precision micro- feature battle array
Column, while demarcating the positional relationship between micro- character array on plate with metering type three-coordinates measuring machine, can be with
It is further ensured that the high-precision of standard target Array Plate.
(2) measurement range is big, it can be achieved that total travel measures: existing method is since measuring device component is more, by lathe
Portion and exterior space limitation, can only measure lathe local motion stroke, and the local stroke error of perpendicularity and total travel
Error of perpendicularity difference is huge；The present invention is greater than the standard target Array Plate of machine tool motion stroke using size, and machine can be realized
The error of perpendicularity of bed total travel.
(3) easy to implement and rapid survey: existing measurement method, such as the microscope group method based on laser interference, by site space
And the limitation of measuring principle, installation and debugging are more difficult, and need multiple adjustment；In contrast, the present invention is based on standard targets
Array Plate and micro- camera realize that device is constituted simply, and installation and debugging are relatively easy to, and only need an adjustment that can complete
Measurement.
(4) in short, measuring device and method of the invention, in order to realize to the error of perpendicularity of single-point diamond lathe into
Row measurement manufactures High-precision standard target Array Plate using photoetching technique, in conjunction with microtechnic and micro- Feature Extraction Technology, realizes
Single-point diamond lathe linear axis positioning accuracy, horizontal linear degree and between centers error of perpendicularity, this method measurement accuracy is high,
It is big with measurement range, the advantages of easy to implement and rapid survey.
Detailed description of the invention
Fig. 1 is the dress for single-point diamond lathe linear axis error of perpendicularity method of the preferred embodiment of the present invention
Set schematic diagram；
Fig. 2 is the preferred embodiment of the present invention for the micro- of single-point diamond lathe linear axis error of perpendicularity method
Feature schematic layout pattern；
Fig. 3 is the circle for single-point diamond lathe linear axis error of perpendicularity method of the preferred embodiment of the present invention
Ring patterns schematic diagram；
Fig. 4 is the mark for single-point diamond lathe linear axis error of perpendicularity method of the preferred embodiment of the present invention
Quasi- target Array Plate structural schematic diagram；
Fig. 5 is the preferred embodiment of the present invention for the aobvious of single-point diamond lathe linear axis error of perpendicularity method
Microfacies machine structural schematic diagram；
Fig. 6 is the error of perpendicularity schematic diagram calculation of the preferred embodiment of the present invention, and curve a is to extract micro- spy along linear axis X
The circle center line connecting obtained, straight line b are the fitting a straight line of curve a, and curve c is to extract the center of circle that micro- feature obtains along linear axis Z
Line, straight line d are the fitting a straight line of curve c.
In all the appended drawings, identical appended drawing reference is used to denote the same element or structure, in which:
The micro- camera of the micro- camera fixation kit 3- of 1- linear axis X, 2- adjusts component, the micro- camera of 4-, and 5- L shape is swept
Retouch motion profile, 6- standard target Array Plate, 7- supporting block, 8- linear axis Z, 9- microcobjective, 10-CCD camera.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
Fig. 1 is the device of the invention schematic diagram.As shown in Figure 1, the preferred embodiment of the present invention is used for single-point diamond lathe
Linear axis error measuring means, comprising: linear axis X1, micro- camera fixation kit 2, micro- camera adjust component 3, microfacies
Machine 4, standard target Array Plate 6, supporting block 7, linear axis Z8, L shape scanning motion track 5.
The micro- camera 4 adjusts component 3 with micro- camera by micro- camera fixation kit 2 and is mounted on linear axis X1's
On motion platform, the standard target Array Plate 6 is mounted on the movement of the linear axis Z of single-point diamond lathe by supporting block 7
On platform, makes the processing planar registration of 6 upper surface of standard target Array Plate and single-point diamond lathe, pass through micro- camera
Adjustment component 3 adjusts the distance between the micro- camera 4 and described 6 upper surface of standard target Array Plate, until can be clear
Until the micro- enlarged drawing of micro- feature is presented.
Fig. 2 is standard target Array Plate structural schematic diagram shown in Fig. 1, and the present embodiment is preferably rectangular-shaped photo etched mask
Plate, length and width are slightly larger than the stroke of single-point diamond lathe linear axis X1 and linear axis Z8 respectively, are existed using photoetching process
The upper surface processing of mask blank is in ranks equally distributed micro- character array at equal intervals, reuses metering type three-dimensional coordinates measurement
Instrument demarcates the positional relationship of micro- character array on mask blank, and the standard target Array Plate 6 is made.
Fig. 3 is micro- feature schematic diagram of standard target Array Plate upper surface shown in Fig. 1 and Fig. 2, and micro- feature includes auxiliary
Feature and target signature, it is preferable that supplemental characteristic includes the finger that matrix pattern pattern and four are uniformly looped around matrix pattern pattern
To arrow, arrow is directed toward matrix pattern pattern center.For quickly being found under micro- camera and positioning target signature, target signature
For annulus pattern, it is located at matrix pattern pattern center location.
Fig. 4 is object construction feature --- the enlarged diagram of annulus pattern of micro- feature in Fig. 3, by two concentric loops
Composition, is preferably dimensioned to be micron order.
Fig. 5 is micro- camera structural schematic diagram shown in Fig. 1, is the miniature micro- camera of coaxial light source, is integrated with height
Multiplying power microcobjective 9 and high-speed CCD camera 10 carry out micro- amplification and figure to micro- feature on the standard target Array Plate 6
As acquisition.
It will be detailed below carrying out single-point diamond lathe linear axis verticality using measurement method according to the invention
Error measure:
(1) initial position for adjusting the linear axis X1 and linear axis Z8 of single-point diamond lathe, by the micro- camera 4
It adjusts component 3 with micro- camera by micro- camera fixation kit 2 to be mounted on the motion platform of linear axis X1, then by the mark
Quasi- target Array Plate 6 is mounted on the motion platform of linear axis Z8 of single-point diamond lathe by supporting block 7, makes the standard
The processing planar registration of 6 upper surface of target Array Plate and single-point diamond lathe is adjusted described by micro- camera adjustment component 3
The distance between the microcobjective 9 of micro- camera 4 and 6 upper surface of standard target Array Plate, until high-speed CCD camera 10 can
Until the micro- enlarged drawing of micro- feature is clearly presented.
(2) the linear axis X1 uniform speed slow movement of the micro- camera 4 is installed in driving, is acquired by high-speed CCD camera 10
The micro- enlarged drawing of micro- feature that the micro- camera 4 scans, the stop motion after linear axis X1 moves complete stroke；Again
The linear axis Z8 uniform speed slow movement of the standard target Array Plate 6 is installed in driving, acquires the mark by high-speed CCD camera 10
The micro- enlarged drawing of micro- feature that quasi- target Array Plate 6 scans under micro- camera 4, until linear axis Z8 moves complete stroke
Until, complete L shape scanning motion track 5.
(3) feature is carried out to the micro- collected micro- characteristic image of camera 4 using micro- feature extraction program module to mention
Take, obtain the center location of the annulus pattern of micro- feature with and the parameters such as radius size, then use error calculation program
Module analysis simultaneously calculates single-point diamond lathe linear axis position error, horizontal linear degree error and the error of perpendicularity, completes
Measurement.
Wherein, micro- feature extraction program module is in called execute, for feature micro- each of on scan path,
Position and the radius of annulus pattern are extracted in accordance with the following steps:
(3.1) micro- characteristic image of micro- camera acquisition is progressively scanned, until encountering first non-zero points；It should
Starting point of the non-zero points as outer circle carries out the tracking of 8- neighborhood to the outer circle, and records the x coordinate and y-coordinate for being tracked point；
(3.2) after tracking, it is quasi- that the x coordinate and y-coordinate value of the circle boundary point obtained using tracking carry out least square
It closes, obtains the fitting center of circle (X of outer circle1i,Y1i) and radius R1i；
(3.3) exradius is reduced into the circle region of n pixel as new scanning area, according to step (3.1),
(3.2) method obtains the fitting center of circle (X of the inner circle of annulus pattern2i,Y2i) and radius R2i；Wherein, n is empirical value, is made
With being that scanning range is contracted to inside outer circle, so that first non-zero points that progressive scan obtains are exactly on interior circle contour
Point, the preferred n=5 of the present embodiment.
(3.4) using the average value of the central coordinate of circle of outer circle and inner circle as the central coordinate of circle (X of annulus patterni,Yi) it is as follows:
By the semidiameter R of outer circle and inner circle1i-R2iWidth Delta R as annulus patterni；
Wherein, i is that the acquisition order of micro- feature is numbered, and first micro- feature number of acquisition is i=0.
Error calculation program module for calculating single-point diamond lathe linear axis position error, level as follows
Straightness error and the error of perpendicularity:
Error calculation program module for calculating single-point diamond lathe linear axis position error, level as follows
Straightness error and the error of perpendicularity:
(3.5) for linear axis X1, the first micro- feature acquired along linear axis X1 motion process with micro- camera 4
Position (X of the center of circle in ccd image0,Y0) it is reference data, the other micro- feature center of circle (Xi,Yi) relative to (X0,Y0) in CCD
The offset of X-direction in image is position error Δ di, the offset of the Y direction in ccd image is Δ vi；To Δ
diIt carries out least square fitting and obtains the position error E of linear axis X1dw, to Δ viIt carries out least square fitting and obtains linear axis X1
Horizontal linear degree and horizontal linear degree error Ehs；
Wherein:
In formula, D is the actual nominal width value of annulus pattern；
Position error, horizontal linear degree and the horizontal linear degree error of linear axis Z8 can similarly be obtained；
As shown in fig. 6, calculating error of perpendicularity S after the horizontal linear degree of acquisition linear axis X1 and linear axis Z8xzAre as follows:
Sxz=γ -90 °=- alpha-beta=arctank2-arctank1-90°
In formula, α is the angle of straight line d Yu single-point diamond lathe Z axis, and β is straight line b and single-point diamond lathe X-axis
Angle, γ are the angle of straight line b Yu straight line d, k1With k2The horizontal linear degree of respectively linear axis Z8 and linear axis X1.
The present invention proposes a kind of measurement of high-precision total travel for the single-point diamond lathe linear axis error of perpendicularity
Method devises high-precision standard target array, proposes a kind of annulus pattern extraction algorithm based on Edge track, improves lathe
The accuracy of linear axis motion positions precision measure, to realize that single-point diamond lathe linear axis error of perpendicularity high-precision is surveyed
Amount.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (8)
1. a kind of device for single-point diamond lathe linear axis error measure, which is characterized in that including micro- camera (4),
Standard target Array Plate (6), micro- feature extraction program module and error calculation program module；
The length of the standard target Array Plate (6) is greater than the stroke of the linear axis X (1) of single-point diamond lathe to be measured, width
Greater than the stroke of the linear axis Z (8) of single-point diamond lathe to be measured；The one side of the standard target Array Plate (6) is equipped with by marking
Surely what is crossed is in ranks micro- character array that equally distributed micro- feature forms at equal intervals；
Micro- feature includes supplemental characteristic and target signature；Supplemental characteristic includes matrix pattern pattern and multiple direction matrix pattern figures
The arrow at case center, for assisting micro- camera (4) quickly to find and positioning target signature；Target signature is annulus pattern, position
In matrix pattern pattern center location；
Under use state, micro- camera (4) is mounted on the motion platform of linear axis X (1) of single-point diamond lathe to be measured；Institute
It states standard target Array Plate (6) to be mounted on the motion platform of linear axis Z (8) of single-point diamond lathe to be measured, and is equipped with micro-
Processing planar registration of the one of character array facing towards microfacies machine (4) and with single-point diamond lathe to be measured；
Micro- feature extraction program module is used for the micro- feature scanned according to micro- camera (4) according to preset path, and positioning target is special
Levy and extract the center location and radius size of annulus pattern；Error calculation program module is used for the center of circle position according to annulus pattern
It sets and calculates single-point diamond lathe linear axis X (1), the position error of Z (8), horizontal linear degree error with radius size and hang down
At least one of straight degree error.
2. device as described in claim 1, which is characterized in that using photoetching process the mask blank of rectangle side table
Face processes micro- character array, reuses metering type three-coordinates measuring machine to the position of micro- character array on mask blank
Relationship is demarcated, and the standard target Array Plate (6) is made.
3. device as claimed in claim 1 or 2, which is characterized in that the multiple arrow for being directed toward matrix pattern pattern center, edge
The circumferential direction of matrix pattern pattern is uniformly distributed.
4. device as claimed in claim 1 or 2, which is characterized in that the micro- camera (4) includes microcobjective (9) and height
Fast CCD camera (10), microcobjective (9) is used to carry out micro- amplification to micro- feature on the standard target Array Plate (6), high
Fast CCD camera (10) is for acquiring amplified micro- characteristic image.
5. device as described in claim 1, which is characterized in that micro- feature extraction program module in called execute,
The outer circle and inner circle of annulus pattern are identified based on border following algorithm, and then extract the circle of annulus pattern outer circle and inner circle respectively
Heart coordinate and radius, using the average value of the central coordinate of circle of outer circle and inner circle as the center location of annulus pattern, by outer circle with it is interior
Width of the round semidiameter as annulus pattern.
6. device as claimed in claim 5, which is characterized in that micro- feature extraction program module in called execute,
For feature micro- each of on scan path, position and the radius of annulus pattern are extracted in accordance with the following steps:
(1) micro- characteristic image of micro- camera (4) acquisition is progressively scanned, until encountering first non-zero points；This is non-
Starting point of the zero point as outer circle carries out the tracking of 8- neighborhood to the outer circle, and records the x coordinate and y-coordinate for being tracked point；
(2) after tracking, the x coordinate and y-coordinate value of the circle boundary point obtained using tracking carry out least square fitting, obtain
The fitting center of circle (the X of outer circle1i,Y1i) and radius R1i；
(3) the circle region that exradius reduces n pixel is obtained as new scanning area according to step (1), the method for (2)
Take the fitting center of circle (X of the inner circle of annulus pattern2i,Y2i) and radius R2i；
(4) using the average value of the central coordinate of circle of outer circle and inner circle as the central coordinate of circle (X of annulus patterni,Yi) it is as follows:
By the semidiameter R of outer circle and inner circle1i-R2iWidth Delta R as annulus patterni；
Wherein, i is that the acquisition order of micro- feature is numbered, and first micro- feature number of acquisition is i=0.
7. device as claimed in claim 6, which is characterized in that error calculation program module is single for calculating as follows
Point diamond lathe linear axis position error, horizontal linear degree error and the error of perpendicularity:
For linear axis X (1), with the circle for first micro- feature that micro- camera (4) acquires along linear axis X (1) motion process
Position (X of the heart in ccd image0,Y0) it is reference data, the other micro- feature center of circle (Xi,Yi) relative to (X0,Y0) scheme in CCD
The offset of X-direction as in is position error Δ di, the offset of the Y direction in ccd image is Δ vi；To Δ di
It carries out least square fitting and obtains the position error of (1) linear axis X, to Δ viIt carries out least square fitting and obtains linear axis X (1)
Horizontal linear degree and horizontal linear degree error；
Wherein:
In formula, D is the actual nominal width value of annulus pattern；
Position error, horizontal linear degree and the horizontal linear degree error of (8) linear axis Z can similarly be obtained；
After the horizontal linear degree for obtaining linear axis X (1) and linear axis Z (8), error of perpendicularity S is calculatedxzAre as follows:
Sxz=arctank2-arctank1-90°
In formula, k1With k2The respectively horizontal linear degree of linear axis Z (8) and linear axis X (1).
8. carrying out the side of single-point diamond lathe linear axis error measure based on device described in claim 1~7 any one
Method, which comprises the steps of:
(1) the linear axis X (1) of single-point diamond lathe and linear axis Z (8) is driven to move to the initial position of zero stroke respectively,
Micro- camera (4) is mounted on the motion platform of (1) linear axis X, standard target Array Plate (6) is mounted on single-point diamond
On the motion platform of the linear axis Z (8) of lathe, standard target Array Plate (6) is made to be equipped with the one side and single-point of micro- character array
The processing planar registration of diamond lathe adjusts the distance between micro- camera (4) and standard target Array Plate (6), Zhi Daoke
The micro- enlarged drawing of micro- feature is clearly presented；
(2) driving linear axis X (1) drives micro- camera (4) uniform motion, while acquiring micro- spy that micro- camera (4) scans
Micro- enlarged drawing is levied, the stop motion after linear axis X (1) moves complete stroke；Linear axis Z (8) are driven to drive standard again
Target Array Plate (6) uniform motion, while the micro- enlarged drawing of micro- feature that micro- camera (4) scans is acquired, until straight line
Axis Z (8) moves complete stroke, complete at L-shaped scanning motion track (5)；
(3) while step (2) are scanned or after the completion of step (2) scans, using micro- feature extraction program module to microfacies
The collected micro- characteristic image of machine (4) carries out feature extraction, obtains the center location and radius size of the annulus pattern of micro- feature,
Single-point diamond lathe linear axis position error, horizontal linear degree error and verticality are calculated by error calculation program module
At least one of error completes measurement.
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| CN114663689A (en) * | 2022-05-18 | 2022-06-24 | 沈阳和研科技有限公司 | Multi-step feeding measurement method |
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