CN110429170B - Ultraviolet light cured chip device packaging process - Google Patents
Ultraviolet light cured chip device packaging process Download PDFInfo
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- CN110429170B CN110429170B CN201910542874.2A CN201910542874A CN110429170B CN 110429170 B CN110429170 B CN 110429170B CN 201910542874 A CN201910542874 A CN 201910542874A CN 110429170 B CN110429170 B CN 110429170B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention provides a chip device packaging process using ultraviolet light for curing, which comprises the following steps: s1, stirring and uniformly mixing ultraviolet curing glue at room temperature, and then vacuumizing to remove bubbles to form uniform and stable ultraviolet curing glue; s2, uniformly coating ultraviolet curing glue on the surfaces of the packaging substrate and the chip, wherein the ultraviolet curing glue forms a coating structure on the chip and is in good contact with the packaging substrate and the chip; and S3, uniformly irradiating the near ultraviolet light with the required wavelength on the surface of the ultraviolet curing adhesive, and removing the near ultraviolet light after the ultraviolet curing adhesive is completely cured by reaction to finish the ultraviolet curing packaging process. The ultraviolet curing adhesive is prepared from the MTQ silicon resin, the MTQ silicon resin containing sulfydryl, the MTQ silicon resin containing phenyl and the photoinitiator, and the sealing performance and the transparent stability of the ultraviolet curing adhesive on chip packaging are greatly improved. The packaging process is low in cost, efficient and rapid, and has remarkable economic benefit.
Description
Technical Field
The invention belongs to the technical field of chip device packaging, and mainly relates to a chip device packaging process using ultraviolet light for curing.
Background
The packaging process is crucial in the production and manufacturing process of electronic devices, and the used packaging material has certain effects on improving the performance of the devices besides the functions of protecting the devices such as water resistance, oxidation resistance, moth prevention and the like.
In the photoelectronic device, the chip can be protected by using the lens package, and the light extraction efficiency can be improved. The encapsulating material used for manufacturing the lens is usually epoxy resin or silicone resin, and such thermosetting material needs to be heated and baked for tens of minutes at a certain temperature to be completely molded. For some devices which do not resist temperature, a long-time high-temperature baking environment can cause certain damage to the devices. For example, the patent publication No. CN105906955B discloses a transparent epoxy polyisobutylene potting material, the heating curing operation is segmented curing at 150 ℃ and 120 ℃, wherein the curing time at 120 ℃ is not less than 90min, and the curing time at 150 ℃ is less than 60 min. In the novel LED packaging structures and the packaging methods thereof disclosed by patent grant No. CN106848036B, utility model patent grant No. CN206116449U and CN206236702U, thermosetting silica gel or thermosetting resin is used as a manufacturing material of the LED lens. The thermosetting material has the defects of time consumption, energy consumption, large initial damage of devices and the like in the implementation process of the packaging process, increases the production cost and reduces the social benefit.
In the application of ultraviolet light curing materials, the invention patent publication No. CN108913083A discloses a strippable light curing adhesive which is 150mW/cm at UVA wave band2At light energy density, light curing requires 1 minute for each of the front and back sides, but it is easily softened and peeled off at a higher temperature, and is not suitable for application to packaging of devices. The invention patent publication No. CN109652001A discloses a high-transparency low-haze UV curing adhesive, which takes urethane acrylate, polyacrylamide, methacrylate and acrylate as main materials, and provides a binder with strong adhesive force and high transparency after curing, but the binder is not applied to a device packaging process, and the influence on the device packaging process is unknown. Utility model patent No. CN202395028U discloses a light-cured LED package structure, which is used for ultraviolet light-cured package with silica gel doped with photoresist at room temperature, however, the required time for light-cured is still several minutes, which is difficult to control the appearance of the lens and the distribution of doped phosphor.
Therefore, the research on the utilization of the novel packaging material improves the existing packaging process, realizes the packaging process which is low in cost, efficient and quick, and has remarkable economic benefit.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a process for packaging a device by ultraviolet curing by using a novel ultraviolet curing material and an improved packaging method. The invention has the advantages of low energy consumption, high speed and high efficiency in the process of packaging the device.
In order to achieve the purpose, the invention adopts the following technical scheme:
a chip device packaging process using ultraviolet light for curing comprises the following steps:
s1, stirring and uniformly mixing raw materials of the ultraviolet curing adhesive at room temperature, and then vacuumizing to remove bubbles to form uniform and stable ultraviolet curing adhesive;
s2, uniformly coating ultraviolet curing glue on the surfaces of the packaging substrate and the chip, wherein the ultraviolet curing glue forms a coating structure on the chip and is in good contact with the packaging substrate and the chip;
and S3, uniformly irradiating the near ultraviolet light with the required wavelength on the surface of the ultraviolet curing adhesive, and removing the near ultraviolet light after the ultraviolet curing adhesive is completely cured by reaction to finish the ultraviolet curing packaging process.
Specifically, the raw materials of the ultraviolet curing adhesive are MTQ silicon resin, MTQ silicon resin containing sulfydryl, MTQ silicon resin containing phenyl and a photoinitiator; the MTQ silicone resin is formed by polymerizing a monofunctional group Si-O unit, a trifunctional group Si-O unit and a tetrafunctional group Si-O unit; the time required for the rapid curing is within 30 s.
The packaging process of the chip device by ultraviolet light curing is different from thermocuring packaging, the curing time is short, heating is not needed, the packaging efficiency can be obviously improved, and the energy is reduced; the ultraviolet curing glue raw materials are mixed, bubbles are removed, and then the ultraviolet curing glue raw materials are irradiated by ultraviolet light, so that stable, uniform and transparent curing glue can be formed, and the sealing performance and the transparent stability of the ultraviolet curing glue to chip packaging are greatly improved.
Preferably, the photoinitiator is 1-hydroxycyclohexyl phenyl ketone and benzil dimethyl ether. Wherein 1-hydroxycyclohexyl phenyl ketone is used as a commercial photoinitiator 184, and benzil dimethyl ether is used as a commercial photoinitiator 651, which are all commercially available.
Preferably, S3 is specifically operated to uniformly irradiate 398nm near ultraviolet light on the surface of the ultraviolet curing glue, and the energy density of the surface of the glue is 68mW/cm2Irradiating at room temperature for 15-20s, and removing the near ultraviolet light.
Specifically, the ultraviolet curing adhesive is a chemical material combination which can generate a series of complex chemical combination reactions at normal temperature under the irradiation of near ultraviolet light, can form a highly transparent solid colloidal material after the reaction is finished, and has good adhesion with a packaging substrate and a chip.
Preferably, the device prepared by the ultraviolet curing chip device packaging process has a structure comprising a packaging substrate, a chip and ultraviolet curing glue from bottom to top, wherein the packaging substrate and the ultraviolet curing glue together form a coating structure for the chip.
Specifically, in the structure of the chip device, the upper surface of the package substrate is in close contact with the lower surface of the chip through a die bonding process, the upper surface and the side surfaces of the chip are in close contact with the ultraviolet curing adhesive, and no air bubbles exist on the contact surface.
Further preferably, the upper surface of the package substrate and the chip are soldered by solder paste to realize die bonding.
Preferably, in the structure of the device, the size, the geometric shape and the material of the packaging substrate are not required, the size, the geometric shape, the chip structure, the packaging mode, the performance and the like of the chip are not required, the chip is an optoelectronic device chip, and the packaging substrate and the ultraviolet curing adhesive form a coating structure for the chip together.
Preferably, a proper amount of additives such as a photoinitiator, an antioxidant and a polymerization inhibitor are added into the chemical material composition of the ultraviolet curing adhesive, so that the chemical reaction process has a faster rate, the surface dryness of the adhesive is better, and the like.
Compared with the prior art, the invention has the beneficial effects that:
1. aiming at the manufacturing process of the traditional packaging lens, the invention improves the packaging process by using a novel packaging material. The use of the ultraviolet curing glue changes the thermosetting mode of glue preparation-hot baking in the lens manufacturing process of the traditional thermosetting glue. Compared with a thermal curing mode, the ultraviolet curing mode of 'glue preparation-illumination' by applying the ultraviolet curing glue has the advantages that the curing time is greatly shortened, the device is packaged in the production and manufacturing process, the packaging efficiency is greatly improved, and the energy consumption is reduced.
2. According to the invention, the ultraviolet curing adhesive is prepared by packaging a device by using an ultraviolet curing technology and adopting MTQ silicon resin, MTQ silicon resin containing sulfydryl, MTQ silicon resin containing phenyl and a photoinitiator, so that the sealing property and the transparent stability of the ultraviolet curing adhesive to chip packaging are greatly improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a flip-chip LED device structure in the UV-curable device packaging process of the present invention;
FIG. 2 is a graph of the spectrum and relative optical power of a device packaged in example 1 during the UV curing process of the present invention;
fig. 3 is a graph of the spectrum and relative optical power of the device packaged in example 2 in the process of packaging the device by ultraviolet curing.
Fig. 4 is a graph of the spectrum and relative optical power of the device packaged in example 3 in the process of packaging the device by ultraviolet curing.
The labels in the figures are: 1-packaging substrate, 2-chip, 3-ultraviolet curing adhesive, 11-solder paste, 12-packaging substrate insulating area and 21-chip electrode.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments, but the scope of the present invention is not limited to the embodiments.
Example 1:
as shown in fig. 1, in the device packaging process using ultraviolet light curing, a structure of a packaged device is sequentially provided from bottom to top with a packaging substrate 1, a chip 2, and an ultraviolet curing adhesive 3, wherein the ultraviolet curing adhesive 3 can be rapidly cured and molded after being irradiated by near ultraviolet light at room temperature, and becomes a protection structure for the chip 2. The upper surface of the packaging substrate 1 and the electrode 21 of the chip 2 are welded through the soldering paste 11 to realize die bonding, the upper surface and the side surface of the chip 2 are in close contact with the uniformly mixed ultraviolet curing adhesive 3, and no air bubbles exist on the contact surface.
In the structure of the device, the size, the geometric shape and the material of the packaging substrate 1 are not required, the insulating region 12 can be arranged between the electrodes 21 of the chip 2 according to the practical application condition, the size and the geometric shape of the chip 2 are not required, the chip 2 is an optoelectronic device chip, and the packaging substrate 1 and the ultraviolet curing adhesive 3 jointly form a coating structure for the chip.
The packaging process of the chip device solidified by the ultraviolet light comprises the following specific operation steps:
(1) stirring and mixing the raw materials of the ultraviolet curing adhesive uniformly at room temperature, and then vacuumizing to remove bubbles to form uniform and stable ultraviolet curing adhesive 3; the raw materials of the ultraviolet curing adhesive are MTQ silicon resin, phenyl-containing MTQ silicon resin, mercapto-containing MTQ silicon resin and a photoinitiator; the composition comprises, by mass, 80 parts of MTQ silicone resin, 16 parts of MTQ silicone resin containing phenyl, 4 parts of MTQ silicone resin containing mercapto and 2 parts of photoinitiator. The photoinitiator is a commercial photoinitiator 1-hydroxycyclohexyl phenyl ketone (184#) and benzil dimethyl ether (651#), wherein the mass ratio is 1 part of photoinitiator 184#, and 1 part of photoinitiator 651 #.
(2) Welding electrodes 21 of the chip 2 on an aluminum packaging substrate 1 by soldering paste 11, uniformly coating ultraviolet curing glue 3 on the packaging substrate 1 and the chip 2, and forming a coating structure on the chip 2 by the packaging substrate 1 and the ultraviolet curing glue 3 and ensuring good contact;
(3) uniformly irradiating 398nm near ultraviolet light on the surface of the ultraviolet curing adhesive 3 colloid, wherein the energy density of the surface of the colloid is 68mW/cm2And irradiating for 20s at room temperature, removing the near ultraviolet light, curing and molding the colloid, and completing the ultraviolet curing packaging process.
In this embodiment, the light emitting wavelength of the chip device is 392nm and 450nm, and the light emitting power of the chip device before and after packaging is respectively increased by 10.0% and 11.4%. In this embodiment, the device performance test data of the uv curing encapsulation process is shown in fig. 2.
Example 2:
the preparation of the uv curable paste 3, and the process steps for coating on the package substrate and the chip are the same as in example 1. The difference from example 1 is that:
the raw materials of the ultraviolet curing adhesive 3 in example 2 are MTQ silicone resin and photoinitiator, wherein the components include, by mass, 80 parts of MTQ silicone resin, 16 parts of MTQ silicone resin containing phenyl, 4 parts of MTQ silicone resin containing mercapto, 1.5 parts of photoinitiator 1-hydroxycyclohexyl phenyl ketone (184#), and 1.5 parts of photoinitiator benzil dimethyl ether (651 #).
Uniformly irradiating 398nm near ultraviolet light on the surface of the ultraviolet curing adhesive 3 colloidThe surface energy density is 68mW/cm2And irradiating for 15s at room temperature, removing the near ultraviolet light, curing and molding the colloid, and obtaining good light transmittance, thereby completing the ultraviolet light curing packaging process.
In this embodiment, the light-emitting wavelength of the chip device is 392nm, the light-emitting power of the chip device before and after packaging is increased by 7.8%, and the near ultraviolet irradiation process only needs 15 s. The device performance test data of the uv curing encapsulation process applied in this embodiment is shown in fig. 3.
Example 3:
the ultraviolet curable adhesive 3 of example 3 was prepared from a different material and was otherwise the same as that of example 1.
The raw materials of the ultraviolet curing adhesive 3 in example 3 are MTQ silicone resin and photoinitiator, wherein the components include, by mass, 70 parts of MTQ silicone resin, 24 parts of MTQ silicone resin containing phenyl, 6 parts of MTQ silicone resin containing mercapto, 1.5 parts of photoinitiator 1-hydroxycyclohexyl phenyl ketone (184#), and 1.5 parts of photoinitiator benzil dimethyl ether (651 #).
Uniformly irradiating 398nm near ultraviolet light on the surface of the ultraviolet curing adhesive 3 colloid, wherein the energy density of the surface of the colloid is 68mW/cm2And irradiating for 15s at room temperature, removing the near ultraviolet light, curing and molding the colloid, and obtaining good light transmittance, thereby completing the ultraviolet light curing packaging process.
In this embodiment, the light-emitting wavelength of the chip device is 392nm, the light-emitting power of the chip device before and after packaging increases by 5.6%, and the near-ultraviolet light irradiation process is 15 s. The device performance test data of the uv curing encapsulation process applied in this embodiment is shown in fig. 4.
Variations and modifications to the above-described embodiments may occur to those skilled in the art, which fall within the scope and spirit of the above description. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and variations of the present invention should fall within the scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (7)
1. A chip device packaging process using ultraviolet light for curing is characterized in that a chip forms a coating structure by ultraviolet curing glue and a packaging substrate, and the ultraviolet curing glue can be rapidly cured and molded by near ultraviolet light irradiation at room temperature to complete the packaging process;
the raw materials of the ultraviolet curing adhesive are MTQ silicon resin, MTQ silicon resin containing sulfydryl, MTQ silicon resin containing phenyl and a photoinitiator; wherein the MTQ silicone resin is formed by polymerizing a monofunctional Si-O unit, a trifunctional Si-O unit and a tetrafunctional Si-O unit.
2. The packaging process of the chip device using ultraviolet light for curing according to claim 1, wherein the photoinitiator in the raw material of the ultraviolet curing adhesive is 1-hydroxycyclohexyl phenyl ketone and benzil dimethyl ether.
3. The packaging process for the chip device cured by the ultraviolet light as claimed in claim 1, wherein the raw material mass ratio of the ultraviolet curing glue is 60-80 parts of MTQ silicone resin, 16-32 parts of MTQ silicone resin containing phenyl, 4-8 parts of MTQ silicone resin containing mercapto, 1-2 parts of 1-hydroxycyclohexyl phenyl ketone and 1-2 parts of benzil dimethyl ether.
4. The process of claim 1, wherein the near-UV light is uniformly irradiated on the surface of the UV-curable adhesive, and the curing is completed by removing the near-UV light after irradiation at room temperature.
5. The process of claim 4, wherein the near UV irradiation time is less than 60s at room temperature.
6. The packaging process of the chip device cured by the ultraviolet light as claimed in claim 1, wherein the chip device has a structure in which the upper surface of the packaging substrate is in close contact with the lower surface of the chip through a die bonding process, the upper surface and the side surfaces of the chip are in close contact with the ultraviolet curing adhesive, and no air bubbles exist on the contact surfaces.
7. The device prepared by the packaging process of the ultraviolet light-cured chip device as claimed in any one of claims 1 to 6, wherein the structure of the device comprises a packaging substrate, a chip and ultraviolet curing glue from bottom to top, and the packaging substrate and the ultraviolet curing glue together form a coating structure for the chip.
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| CN201910542874.2A CN110429170B (en) | 2019-06-21 | 2019-06-21 | Ultraviolet light cured chip device packaging process |
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| CN112345963B (en) * | 2020-10-15 | 2022-09-23 | 厦门多彩光电子科技有限公司 | Method for evaluating quality of LED ultraviolet chip |
| CN113013045A (en) * | 2021-03-09 | 2021-06-22 | 鑫金微半导体(深圳)有限公司 | Novel rapid packaging method for COB packaged integrated circuit |
| CN114957972A (en) * | 2022-04-06 | 2022-08-30 | 深圳市创新精细玻璃有限公司 | High-temperature-resistant organic silicon resin composition for LED packaging and preparation process thereof |
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| JPH09183908A (en) * | 1995-12-28 | 1997-07-15 | Toray Dow Corning Silicone Co Ltd | Curable organopolysiloxane composition and method for bonding substrate to adherend therewith |
| JP2012136587A (en) * | 2010-12-24 | 2012-07-19 | Dow Corning Toray Co Ltd | Polysiloxane-hydrocarbylene aminohydrocarbylene multiblock copolymer and method for producing the same |
| KR101539486B1 (en) * | 2011-01-06 | 2015-07-24 | 주식회사 엘지화학 | Curable composition |
| JP2013133408A (en) * | 2011-12-27 | 2013-07-08 | Dow Corning Toray Co Ltd | Ordinary temperature-curable coating composition |
| WO2016044547A1 (en) * | 2014-09-17 | 2016-03-24 | Dow Corning Corporation | 3d printing method utilizing a photocurable silicone composition |
| CN104559196B (en) * | 2014-12-29 | 2017-05-03 | 大连理工常熟研究院有限公司 | Colorless and transparent light-cured 3D printing material |
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