CN110429072A - A kind of upside-down mounting radio frequency chip and a kind of radio-frequency devices - Google Patents
A kind of upside-down mounting radio frequency chip and a kind of radio-frequency devices Download PDFInfo
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- CN110429072A CN110429072A CN201910754759.1A CN201910754759A CN110429072A CN 110429072 A CN110429072 A CN 110429072A CN 201910754759 A CN201910754759 A CN 201910754759A CN 110429072 A CN110429072 A CN 110429072A
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- radio frequency
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of upside-down mounting radio frequency chips, including radio frequency bare die and substrate；Radio frequency bare die is located at substrate surface, and radio frequency bare die is provided with the first signal pins towards one side surface of substrate, and the first signal pins are fixed on substrate towards one side surface of radio frequency bare die by the first conductive column；It is provided in the conductive circuit layer of substrate for providing the conductor wire of preset matching inductance.Above-mentioned radio frequency bare die is specifically mounted on substrate surface in a manner of upside-down mounting, and generated heat focuses primarily upon in the first conductive column in information exchanging process.Since the first conductive column has certain diameter, thermal diffusivity is higher, and reliability is higher is hardly damaged, so that upside-down mounting radio frequency chip thermal diffusivity with higher and reliability.The present invention also provides a kind of radio-frequency devices, equally have above-mentioned beneficial effect.
Description
Technical field
The present invention relates to fields of communication technology, more particularly to a kind of upside-down mounting radio frequency chip and a kind of radio-frequency devices.
Background technique
5th generation (5G) mobile communication standard is just orderly to push ahead, next-generation mobile terminal such as smart phone, plate
Computer and wearable device etc. will need support more operating modes and frequency range.In addition, in order to support so numerous nothings
Line communication protocol, multiple antenna design are adopted more and more widely for realizing the operation of multiple-input and multiple-output (MIMO), into
And high data transfer rate is obtained, sensibility is improved and avoids crosstalk.
But in the prior art, it is poor that the thermal diffusivities such as the radio frequency chip of front end, such as RF switch are particularly applied to,
Reliability is lower.So how to improve the thermal diffusivity of radio frequency chip and reliability to be that those skilled in the art are urgently to be solved ask
Topic.
Summary of the invention
The object of the present invention is to provide a kind of upside-down mounting radio frequency chip, thermal diffusivity with higher and reliability；Of the invention
Another object is to provide a kind of radio-frequency devices, thermal diffusivity with higher and reliability.
In order to solve the above technical problems, the present invention provides a kind of upside-down mounting radio frequency chip, including radio frequency bare die and substrate；
The radio frequency bare die is located at the substrate surface, and the radio frequency bare die is provided with towards one side surface of substrate
One signal pins, first signal pins are fixed on the substrate towards radio frequency bare die side table by the first conductive column
Face；It is provided in the conductive circuit layer of the substrate for providing the conductor wire of preset matching inductance.
Optionally, first conductive column is copper post.
Optionally, the diameter of the copper post cross section is not more than 1mm.
Optionally, the substrate has second signal pin, the second signal backwards to one side surface of radio frequency bare die
Pin surface is provided with the second conductive column.
Optionally, the second signal pin is tin column.
Optionally, the metal layer in the substrate is provided with the conductor wire for being used for transmission signal in the radio frequency bare die.
The present invention also provides a kind of radio-frequency devices, the upside-down mounting radio frequency chip including circuit board and as described in any of the above-described；
The upside-down mounting radio frequency chip and the circuit board communication connection.
A kind of upside-down mounting radio frequency chip provided by the present invention, including radio frequency bare die and substrate；Radio frequency bare die is located at substrate table
Face, radio frequency bare die are provided with the first signal pins towards one side surface of substrate, and the first signal pins are fixed by the first conductive column
In substrate towards one side surface of radio frequency bare die；It is provided in the conductive circuit layer of substrate for providing the conduction of preset matching inductance
Line.Above-mentioned radio frequency bare die is specifically mounted on substrate surface in a manner of upside-down mounting, the radio frequency bare die especially by the first conductive column with
Substrate is communicated, and generated heat focuses primarily upon in the first conductive column in information exchanging process accordingly.Due to
One conductive column has certain diameter, and thermal diffusivity is higher, and reliability is higher is hardly damaged, so that upside-down mounting radio frequency chip has
There are higher thermal diffusivity and reliability；The upside-down mounting of radio frequency bare die can be effectively reduced into the body of radio frequency chip in substrate surface simultaneously
Product, to be conducive to the raising of the integrated degree of radio frequency chip；It, in this application can be due to canceling bonding wire in the prior art
It is arranged in the conductive circuit layer of substrate for providing the conductor wire of preset matching inductance, to match the parasitic electricity of radio frequency bare die bring
Hold.
The present invention also provides a kind of radio-frequency devices, equally have above-mentioned beneficial effect, are no longer repeated herein.
Detailed description of the invention
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of radio frequency chip in the prior art；
Fig. 2 is the overlooking structure diagram of Fig. 1；
Fig. 3 is a kind of structural schematic diagram of upside-down mounting radio frequency chip provided by the embodiment of the present invention；
Fig. 4 is the side structure schematic view of Fig. 3；
Fig. 5 is the overlooking structure diagram of Fig. 3；
Fig. 6 is a kind of structural schematic diagram of specific upside-down mounting radio frequency chip provided by the embodiment of the present invention；
Fig. 7 is the side structure schematic view of Fig. 6.
In figure: 1. radio frequency bare dies, 2. substrates, 21. conductive circuit layers, 3. first conductive columns, 4. second conductive columns.
Specific embodiment
Core of the invention is to provide a kind of upside-down mounting radio frequency chip.Fig. 1 and Fig. 2 is please referred to, Fig. 1 is to penetrate in the prior art
The structural schematic diagram of frequency chip；Fig. 2 is the overlooking structure diagram of Fig. 1.Referring to Fig. 1 and Fig. 2, in the prior art, radio frequency
Bare die is usually just loaded on substrate surface, and radio frequency bare die is connect by bonding wire with substrate, electric signal caused by radio frequency bare die
Substrate can be transferred to by bonding wire.At this point, generated heat focuses primarily upon in bonding wire in information exchanging process.By
It is very thin in bonding wire, so that the thermal diffusivity of radio frequency chip is poor；Simultaneously because bonding wire is exposed above substrate, so that radio frequency
The reliability of chip is lower.
And a kind of upside-down mounting radio frequency chip provided by the present invention, including radio frequency bare die and substrate；Radio frequency bare die is located at substrate
Surface, radio frequency bare die are provided with the first signal pins towards one side surface of substrate, and the first signal pins are solid by the first conductive column
Due to substrate towards one side surface of radio frequency bare die；It is provided in the conductive circuit layer of substrate for providing leading for preset matching inductance
Electric wire.Above-mentioned radio frequency bare die is specifically mounted on substrate surface in a manner of upside-down mounting, and the radio frequency bare die is especially by the first conductive column
It is communicated with substrate, generated heat focuses primarily upon in the first conductive column in information exchanging process accordingly.Due to
First conductive column has certain diameter, and thermal diffusivity is higher, and reliability is higher is hardly damaged, so that upside-down mounting radio frequency chip
Thermal diffusivity with higher and reliability；The upside-down mounting of radio frequency bare die can be effectively reduced into radio frequency chip in substrate surface simultaneously
Volume, to be conducive to the raising of the integrated degree of radio frequency chip；Due to canceling bonding wire in the prior art, in this application can
It is arranged in the conductive circuit layer of substrate for providing the conductor wire of preset matching inductance, it is parasitic to match radio frequency bare die bring
Capacitor.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Referring to FIG. 3, Fig. 4 and Fig. 5, Fig. 3 are a kind of structure of upside-down mounting radio frequency chip provided by the embodiment of the present invention
Schematic diagram；Fig. 4 is the side structure schematic view of Fig. 3；Fig. 5 is the overlooking structure diagram of Fig. 3.
Referring to Fig. 3, Fig. 4 and Fig. 5, in embodiments of the present invention, upside-down mounting radio frequency chip includes radio frequency bare die 1 and substrate 2；
The radio frequency bare die 1 is located at 2 surface of substrate, and the radio frequency bare die 1 is provided with the first letter towards 2 one side surface of substrate
Number pin, first signal pins are fixed on the substrate 2 towards the 1 side table of radio frequency bare die by the first conductive column 3
Face；It is provided in the conductive circuit layer 21 of the substrate 2 for providing the conductor wire of preset matching inductance.
Above-mentioned radio frequency bare die 1 is Die, in embodiments of the present invention i.e. for mainly realizing the component of radio frequency chip function.
Specific structure in relation to radio frequency bare die 1 can refer to the prior art, no longer be repeated herein.In embodiments of the present invention, it penetrates
Frequency bare die 1 is specifically packaged in 2 surface of substrate, i.e. radio frequency bare die 1 is located at 2 surface of substrate, is fixedly connected with substrate 2.Specifically, should
Radio frequency bare die 1 is provided with the first signal pins towards 2 one side surface of substrate, and first signal pins are solid by the first conductive column 3
Due to substrate 2 towards 1 one side surface of radio frequency bare die, i.e., above-mentioned 1 upside-down mounting of radio frequency bare die is in 2 surface of substrate.On it should be noted that
The pin that the first signal pins do not have stretching usually is stated, i.e., above-mentioned first signal pins usually in the form of sheets, are located at radio frequency bare die 1
Towards 2 one side surface of substrate.At this point, electric signal caused by being communicated between radio frequency bare die 1 and substrate 2 can be led via first
Electric column 3 transmits, and one of at main hot concentration when copper post, that is, radio frequency chip work.
In embodiments of the present invention, above-mentioned first conductive column 3 is usually copper post, and copper post has good electric conductivity, thermally conductive
Property and lower price, can make radio frequency chip provided by the embodiment of the present invention have enough heat dissipation performances while,
The effectively cost of manufacture of control radio frequency chip.Under normal conditions, the diameter of above-mentioned copper post cross section is not more than 1mm, i.e., above-mentioned copper
The diameter of column cross section is usually other in the micron-scale.Above-mentioned copper post is usually to pass through growth technique to be grown in radio frequency bare die 1 in substrate 2
Between, play the role of fixed, support and transmitting information.
In embodiments of the present invention, it is provided in the conductive circuit layer 21 of substrate 2 for providing leading for preset matching inductance
Electric wire.It is provided with conductive circuit layer 21 in aforesaid substrate 2, as its name suggests, is provided with conductor wire in above-mentioned conductive circuit layer 21, it should
Conductor wire is commonly used in the electric signal in transferring substrates 2, i.e. electric signal caused by radio frequency bare die 1.Due to 1 structure of radio frequency bare die
The reason of, particularly due to the parasitic couplings of metal contact wires act in radio frequency bare die 1, it can introduce and be unfavorable for radio frequency chip performance
Capacity effect, i.e. introducing parasitic capacitance.
In embodiments of the present invention, for the matching of better completing port, good insertion loss and isolation are realized
Can, it needs that the inductance to match with above-mentioned parasitic capacitance, i.e. preset matching inductance are arranged in radio frequency chip.Preset matching inductance
Inductance value need the capacitance of parasitic capacitance introduced with radio frequency bare die 1 to form good matching, above-mentioned preset matching inductance
Specific inductance value need self-setting according to the actual situation, be not specifically limited herein.In embodiments of the present invention, specific logical
It crosses conductive circuit layer 21 in the substrate 2 and conductor wire corresponding with preset matching inductance is set, to realize preset matching inductance
Setting, i.e., above-mentioned conductor wire can be used as preset matching inductance, so that having in radio frequency chip opposite with parasitic capacitance value
The matching inductance value answered.
It should be noted that in the prior art, traditional bonding wire, its general 1mm equivalent length is approximately equal to the electricity of 1nH
Inductance value, and generally there are the bonding wire of certain equivalent length between radio frequency bare die 1 and substrate 2, the equivalent length of the bonding wire is
Substrate 2 is relative at least increased length required for radio frequency bare die 1.And in embodiments of the present invention, since radio frequency bare die 1 is specific
Upside-down mounting is not provided with bonding wire in 2 surface of substrate, so that substrate 2 in upside-down mounting radio frequency chip provided by the embodiment of the present invention
Length can be generally equalized with the length of radio frequency bare die 1, to reduce the length of radio frequency chip, and then reduces radio frequency bare die 1
Area.
A kind of upside-down mounting radio frequency chip provided by the embodiment of the present invention, including radio frequency bare die 1 and substrate 2；Radio frequency bare die 1
In 2 surface of substrate, radio frequency bare die 1 is provided with the first signal pins towards 2 one side surface of substrate, and the first signal pins pass through first
Conductive column 3 is fixed on substrate 2 towards 1 one side surface of radio frequency bare die；It is provided in the conductive circuit layer 21 of substrate 2 pre- for providing
If the conductor wire of matching inductance.Above-mentioned radio frequency bare die 1 is specifically mounted on 2 surface of substrate in a manner of upside-down mounting, the radio frequency bare die 1 tool
Body is communicated by the first conductive column 3 with substrate 2, and generated heat focuses primarily upon in information exchanging process accordingly
In first conductive column 3.Since the first conductive column 3 has certain diameter, thermal diffusivity is higher, and reliability is higher is hardly damaged,
So that upside-down mounting radio frequency chip thermal diffusivity with higher and reliability；Simultaneously by 1 upside-down mounting of radio frequency bare die in 2 surface of substrate,
The volume of radio frequency chip can be effectively reduced, to be conducive to the raising of the integrated degree of radio frequency chip；Due to canceling the prior art
In bonding wire, can be arranged in the conductive circuit layer 21 of substrate 2 for providing the conduction of preset matching inductance in this application
Line, to match 1 bring parasitic capacitance of radio frequency bare die.
It will be done in following inventive embodiments in detail in relation to a kind of specific structure of upside-down mounting radio frequency chip provided by the present invention
It is thin to introduce.
Fig. 6 and Fig. 7 is please referred to, Fig. 6 is a kind of knot of specific upside-down mounting radio frequency chip provided by the embodiment of the present invention
Structure schematic diagram；Fig. 7 is the side structure schematic view of Fig. 6.
It is different from foregoing invention embodiment, the embodiment of the present invention is on the basis of foregoing invention embodiment, further
The structure of upside-down mounting radio frequency chip is specifically limited.Remaining content is described in detail in foregoing invention embodiment,
It is no longer repeated herein.
Referring to Fig. 6 and Fig. 7, in embodiments of the present invention, the substrate 2 has backwards to 1 one side surface of radio frequency bare die
There is second signal pin, the second signal pin surface is provided with the second conductive column 4.
The above-mentioned second signal pin positioned at substrate 2 backwards to 1 one side surface of radio frequency bare die is the pin of entire radio frequency chip,
The second signal pin surface is fixed with the second conductive column 4, second conductive column 4 be in use process radio frequency chip and it is extraneous its
Remaining part part, conducive to the channel communicated between the circuit board of the radio frequency chip is equipped with.It is mentioned in the specifically installation embodiment of the present invention
When the radio frequency chip of confession, in circuit board surface, which can be especially by second signal pin for radio frequency chip meeting upside-down mounting
It is electrically connected with the second conductive column 4.It should be noted that above-mentioned second signal pin does not have the pin of stretching usually, i.e., it is above-mentioned
Second signal pin usually in the form of sheets, is located at substrate 2 backwards to 1 one side surface of radio frequency bare die.At this point, radio frequency chip and circuit board it
Between communicated caused by electric signal can be transmitted via the second conductive column 4.
Specifically, in embodiments of the present invention, above-mentioned second conductive column 4 is usually tin column, and tin column is with good conductive
Property while, there is certain flexibility, the deformation that shape can be slight is conducive to radio frequency chip upside-down mounting in circuit board table
Face.
In embodiments of the present invention, the metal layer in the substrate 2 is provided with to be used for transmission in the radio frequency bare die 1 and believe
Number conductor wire.In conventional substrate 2, metal layer includes conductive circuit layer 21 and stratum, is wherein arranged in conductive circuit layer 21
Have to be used for transmission and states the conductor wire that radio frequency bare die 1 generates electric signal, and stratum is usually a flood metal layer, in the stratum usually
It is not used in the electric signal that transmitting radio frequency bare die 1 generates, and is defined as ground, i.e. GND.And in embodiments of the present invention, it is above-mentioned
Metal layer in substrate 2 is provided with the conductor wire for being used for transmission signal in radio frequency bare die 1, i.e. metal layer in substrate 2 at this time
It is conductive circuit layer 21 rather than stratum, is not provided with stratum in substrate 2 at this time.Due in use, being equipped with this hair
It is necessarily provided with stratum in the wiring board of radio frequency chip provided by bright embodiment, and is not provided in the substrate of radio frequency chip 2
Height after thering is stratum to can effectively improve installation between stratum and the interior conductor wire for providing preset matching inductance of aforesaid substrate 2
Degree, i.e. height between raising preset matching inductance and stratum, so that the Q value of preset matching inductance is effectively increased, so that above-mentioned
Conductor wire for providing preset matching inductance can provide high Q inductor, realize the design of broadband and low consumption.
A kind of upside-down mounting radio frequency chip provided by the embodiment of the present invention, by the way that the metal layer in substrate 2 is provided with use
The conductor wire of signal in transmission radio frequency bare die 1 so that be not provided with stratum in substrate 2, thus improve preset matching inductance with
Height between stratum, so that the Q value of preset matching inductance is effectively increased, so that above-mentioned for providing leading for preset matching inductance
Electric wire can provide high Q inductor, realize the design of broadband and low consumption.
The present invention also provides a kind of radio-frequency devices, including circuit board and as provided by any of the above-described inventive embodiments
Upside-down mounting radio frequency chip, wherein the upside-down mounting radio frequency chip and the circuit board communication connection.Remaining structure of related radio-frequency devices
The prior art can be referred to, is no longer repeated herein.
Upside-down mounting radio frequency chip thermal diffusivity with higher and reliability as provided by foregoing invention embodiment, to make
Obtain radio-frequency devices thermal diffusivity equally with higher and reliability provided by the embodiment of the present invention.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
A kind of upside-down mounting radio frequency chip provided by the present invention and a kind of radio-frequency devices are described in detail above.Herein
In apply that a specific example illustrates the principle and implementation of the invention, the explanation of above example is only intended to sides
Assistant solves method and its core concept of the invention.It should be pointed out that for those skilled in the art, not
, can be with several improvements and modifications are made to the present invention under the premise of being detached from the principle of the invention, these improvement and modification are also fallen into
In the protection scope of the claims in the present invention.
Claims (7)
1. a kind of upside-down mounting radio frequency chip, which is characterized in that including radio frequency bare die and substrate；
The radio frequency bare die is located at the substrate surface, and the radio frequency bare die is provided with the first letter towards one side surface of substrate
Number pin, first signal pins are fixed on the substrate towards one side surface of radio frequency bare die by the first conductive column；
It is provided in the conductive circuit layer of the substrate for providing the conductor wire of preset matching inductance.
2. upside-down mounting radio frequency chip according to claim 1, which is characterized in that first conductive column is copper post.
3. upside-down mounting radio frequency chip according to claim 2, which is characterized in that the diameter of the copper post cross section is not more than
1mm。
4. upside-down mounting radio frequency chip according to claim 1, which is characterized in that the substrate is backwards to radio frequency bare die side
Surface has second signal pin, and the second signal pin surface is provided with the second conductive column.
5. upside-down mounting radio frequency chip according to claim 4, which is characterized in that the second signal pin is tin column.
6. according to claim 1 to upside-down mounting radio frequency chip described in any one of 5 claims, which is characterized in that in the substrate
Metal layer be provided with the conductor wire for being used for transmission signal in the radio frequency bare die.
7. a kind of radio-frequency devices, which is characterized in that including circuit board and as described in any one of claim 1 to 6 claim
Upside-down mounting radio frequency chip；The upside-down mounting radio frequency chip and the circuit board communication connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910754759.1A CN110429072A (en) | 2019-08-15 | 2019-08-15 | A kind of upside-down mounting radio frequency chip and a kind of radio-frequency devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910754759.1A CN110429072A (en) | 2019-08-15 | 2019-08-15 | A kind of upside-down mounting radio frequency chip and a kind of radio-frequency devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110429072A true CN110429072A (en) | 2019-11-08 |
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ID=68416532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910754759.1A Pending CN110429072A (en) | 2019-08-15 | 2019-08-15 | A kind of upside-down mounting radio frequency chip and a kind of radio-frequency devices |
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| CN (1) | CN110429072A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339407A (en) * | 2010-07-27 | 2012-02-01 | 钒创科技股份有限公司 | Thin circuit board with induction coil and method for manufacturing circuit board |
| CN103119786A (en) * | 2011-02-28 | 2013-05-22 | 株式会社村田制作所 | Wireless communication device |
| CN108711569A (en) * | 2018-08-10 | 2018-10-26 | 付伟 | With the multichip packaging structure and preparation method thereof for accommodating filter chip chamber |
-
2019
- 2019-08-15 CN CN201910754759.1A patent/CN110429072A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339407A (en) * | 2010-07-27 | 2012-02-01 | 钒创科技股份有限公司 | Thin circuit board with induction coil and method for manufacturing circuit board |
| CN103119786A (en) * | 2011-02-28 | 2013-05-22 | 株式会社村田制作所 | Wireless communication device |
| CN108711569A (en) * | 2018-08-10 | 2018-10-26 | 付伟 | With the multichip packaging structure and preparation method thereof for accommodating filter chip chamber |
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Application publication date: 20191108 |
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| RJ01 | Rejection of invention patent application after publication |