CN110429045B - Management method and system for wafer monitoring wafer - Google Patents
Management method and system for wafer monitoring wafer Download PDFInfo
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- CN110429045B CN110429045B CN201910497663.1A CN201910497663A CN110429045B CN 110429045 B CN110429045 B CN 110429045B CN 201910497663 A CN201910497663 A CN 201910497663A CN 110429045 B CN110429045 B CN 110429045B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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Abstract
The invention relates to the technical field of monitoring wafer management, in particular to a method and a system for managing a wafer monitoring wafer. The management method of the wafer monitoring wafer comprises the following steps: detecting whether a wafer monitoring wafer is qualified or not according to a preset rule, and if the wafer monitoring wafer is qualified, carrying out code carving on the wafer monitoring wafer and storing the wafer monitoring wafer to a qualified wafer storage bin; and if the wafer monitoring wafer is unqualified, storing the wafer monitoring wafer to a scrapped wafer storage bin. The whole process is an automatic program flow, and no manual participation is needed in the process, so that the efficiency is greatly improved, and the problems of human errors and the like possibly existing in the manual detection process are solved.
Description
Technical Field
The invention relates to the technical field of monitoring wafer management, in particular to a method and a system for managing a wafer monitoring wafer.
Background
A wafer monitor wafer is a method for measuring and monitoring some process data instead of a product. In the prior art, most of the existing management means of the monitoring wafer are manual operation, visual identification, manual statistics and management control, and the management mode is not only low in efficiency, but also easily causes risks such as inventory omission, inaccurate monitoring, wafer pollution and wafer scrapping of the monitoring wafer.
Disclosure of Invention
Therefore, it is necessary to provide a management method for wafer monitor wafer, so as to solve the problems of low efficiency and improper error management in manual wafer monitor wafer management in the prior art. The specific technical scheme is as follows:
a management method of wafer monitor wafer includes the following steps: detecting whether a wafer monitoring wafer is qualified or not according to a preset rule, and if the wafer monitoring wafer is qualified, carrying out code carving on the wafer monitoring wafer and storing the wafer monitoring wafer to a qualified wafer storage bin; and if the wafer monitoring wafer is unqualified, storing the wafer monitoring wafer to a scrapped wafer storage bin.
Further, the step of detecting whether the wafer monitoring wafer is qualified according to the preset rule further comprises the steps of: carrying out surface treatment on the wafer monitoring wafer; detecting the granularity, the edge unfilled corner and the flatness of the wafer monitoring wafer after surface treatment; and carrying out acceptance grading on the wafer monitoring wafer according to a preset acceptance rule.
Further, the method also comprises the following steps: recording an event which occurs on the wafer monitoring wafer after the self-code-carving of the wafer monitoring wafer, and uploading relevant data of the event to a data processing center; the relevant data of the event comprises: basic information of the wafer monitoring sheet and production records of the wafer monitoring sheet.
Further, the method also comprises the following steps: the wafer monitoring wafer is used by identifying the engraving code on the wafer monitoring wafer, and relevant information is uploaded to a data processing center; the data processing center obtains different uploaded data, analyzes and processes the uploaded data, and generates inventory data, wherein the inventory data comprises: on-line inventory and on-inventory.
Further, the method also comprises the following steps: recycling and detecting a recycled wafer monitoring wafer, judging whether the wafer monitoring wafer meets the recycling standard, if so, continuing to use the wafer monitoring wafer, and uploading corresponding data to a data processing center; and if the wafer monitoring wafer does not meet the recycling standard, performing scrapping treatment on the wafer monitoring wafer, and uploading relevant scrapping treatment data to a data processing center.
In order to solve the technical problem, a management system of the wafer monitoring wafer is also provided, and the specific technical scheme is as follows:
a management system of wafer monitor wafer comprises: the device comprises a conveying track, a conveying arm, a detection module, a code carving module, a qualified sheet storage bin and a scrapped sheet storage bin; the conveying arm is arranged on the conveying track and used for: transmitting the wafer monitoring wafer to different area positions; the detection module is used for: detecting whether the wafer monitoring wafer is qualified or not according to a preset rule; the code carving module is used for: if the wafer monitoring wafer is qualified, carrying out code carving on the wafer monitoring wafer; the qualified piece storage bin is used for: storing qualified wafer monitoring sheets; the scrap sheet storage bin is used for: storing the unqualified wafer monitor wafer.
Further, the detection module comprises: the device comprises a surface treatment module, a granularity detection module, a flatness detection module and an acceptance rule module; each module is provided with a wafer monitoring piece inlet and outlet end; the surface treatment module is used for: carrying out surface treatment on the wafer monitoring wafer; the granularity detection module is used for: detecting the granularity and the edge unfilled corner of the wafer monitoring wafer after surface treatment; the flatness detection module is used for: carrying out flatness detection on the wafer monitoring wafer for detecting granularity and edge unfilled corners; the acceptance rule module is to: and carrying out acceptance grading on the wafer monitoring wafer according to a preset acceptance rule.
Further, the method also comprises the following steps: the production recording module and the data processing center; the production recording module is used for: recording an event which occurs on the wafer monitoring wafer after the self-code-carving of the wafer monitoring wafer, and uploading relevant data of the event to a data processing center; the relevant data of the event comprises: basic information of the wafer monitoring sheet and production records of the wafer monitoring sheet.
Further, the method also comprises the following steps: the control chip code identification module and the data processing center; the control chip code identification module is used for: the wafer monitoring wafer is used by identifying the engraving code on the wafer monitoring wafer, and relevant information is uploaded to a data processing center; the data processing center is configured to: acquiring different uploading data, analyzing and processing the uploading data, and generating stock data, wherein the stock data comprises: on-line inventory and on-inventory.
Further, the method also comprises the following steps: a recovery detection module; retrieve and detect the module and be used for: recycling and detecting a recycled wafer monitoring wafer, judging whether the wafer monitoring wafer meets the recycling standard, if so, continuing to use the wafer monitoring wafer, and uploading corresponding data to a data processing center; and if the wafer monitoring wafer does not meet the recycling standard, performing scrapping treatment on the wafer monitoring wafer, and uploading relevant scrapping treatment data to a data processing center.
The invention has the beneficial effects that: setting a preset rule, automatically detecting whether a wafer monitoring wafer is qualified or not according to the preset rule, if the wafer monitoring wafer is qualified, automatically carving codes on the wafer monitoring wafer and storing the wafer monitoring wafer to a qualified wafer storage bin; and if the wafer monitoring wafer is unqualified, storing the wafer monitoring wafer to a scrapped wafer storage bin. The whole process is an automatic program flow, and no manual participation is needed in the process, so that the efficiency is greatly improved, and the problems of human errors and the like possibly existing in the manual detection process are solved.
Furthermore, after the wafer monitor wafer is qualified and coded, an event occurring on the wafer monitor wafer is recorded, and related data of the event is uploaded to the data processing center, so that a user can access the related data of the event of the data processing center to obtain the use conditions of different wafer monitor wafers and the like.
Furthermore, the wafer monitoring wafer can be used by identifying the code engraved on the wafer monitoring wafer, relevant use information is uploaded to the data processing center, the data processing center obtains different uploaded data, the uploaded data are analyzed and processed, inventory data can be generated, and a user can know the use condition of the wafer monitoring wafer by accessing the inventory data, so that the wafer monitoring wafer can be managed and distributed conveniently.
Furthermore, the recycled wafer monitoring wafer can be automatically recycled and detected, so that the wafer monitoring wafer which meets the standard can be continuously used, the wafer monitoring wafer which does not meet the standard can be scrapped, and the service life of the wafer monitoring wafer can be used to the maximum extent.
Drawings
FIG. 1 is a flowchart illustrating a method for managing a wafer monitor wafer according to an embodiment;
FIG. 2 is a diagram illustrating a management system of a wafer monitor wafer according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating the steps of detecting a wafer monitor wafer according to a predetermined rule according to an embodiment;
FIG. 4 is a schematic diagram of a feeding detection table and a recovery detection table according to the embodiment;
FIG. 5 is a flowchart illustrating code scanning according to an embodiment;
FIG. 6 is a diagram illustrating basic information of a wafer monitor wafer and a wafer monitor wafer production record according to an embodiment;
FIG. 7 is a schematic illustration of inventory data according to an embodiment;
FIG. 8 is a diagram of a scrap information repository according to an embodiment;
FIG. 9 is a first block diagram of a wafer monitor wafer management system according to an embodiment;
FIG. 10 is a second block diagram of a wafer monitor wafer management system according to an embodiment of the present invention.
Description of reference numerals:
1. the conveying track is arranged on the conveying track,
2. a transmission arm for transmitting the data to the transmission arm,
3. the sheet-feeding end of the machine table,
4. a sheet-out end of the machine table,
5. a surface treatment module for treating the surface of the workpiece,
6. a particle size detection module for detecting the particle size of the particle,
7. a flatness detection module for detecting the flatness of the wafer,
8. a laser code-engraving module,
9. a storage bin for the qualified slice,
10. a scrap sheet storage bin for storing scrap sheets,
900. a management system of a wafer monitor wafer,
901. the conveying track is arranged on the conveying track,
902. a transmission arm for transmitting the data to the transmission arm,
903. a detection module for detecting the position of the optical fiber,
904. a code-carving module for carving the code on the surface of the object,
905. a storage bin for the qualified slice,
906. a scrap sheet storage bin for storing scrap sheets,
9031. a surface treatment module for treating the surface of the workpiece,
9032. a particle size detection module for detecting the particle size of the particle,
9033. a flatness detection module for detecting the flatness of the wafer,
9034. and an acceptance rule module.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 8, in the present embodiment, a method for managing a wafer monitor wafer can be applied to a management system of a wafer monitor wafer, as shown in fig. 2, the management system of a wafer monitor wafer includes: the automatic wafer monitoring device comprises a conveying track 1, a conveying arm 2, a machine table feeding end 3, a machine table discharging end 4, a surface processing module 5, a granularity detection module 6, a flatness detection module 7, a laser code carving module 8, a qualified wafer storage bin 9 and a scrapped wafer storage bin 10, wherein the conveying track 1 and the conveying arm 2 are used for completing conveying of a wafer monitoring wafer between machine tables, and the whole process is automatic and does not need manual participation and monitoring.
The following detailed description is provided for the embodiments of a method for managing a wafer monitor wafer:
step S101: and detecting whether the wafer monitoring wafer is qualified or not according to a preset rule.
If the wafer monitor wafer is qualified, executing step S102: and carrying out code carving on the wafer monitoring wafer and storing the wafer monitoring wafer to a qualified wafer storage bin.
If the wafer monitoring wafer is not qualified, step S103 is executed: storing the sheet to a scrap sheet storage bin.
Referring to fig. 3, the step S101 further includes the steps of:
step S301: and carrying out surface treatment on the wafer monitoring wafer.
Step S302: and detecting the granularity, the edge unfilled corner and the flatness of the wafer monitoring wafer after surface treatment.
Step S303: and carrying out acceptance grading on the wafer monitoring wafer according to a preset acceptance rule.
In the present embodiment, the surface treatment module is provided with a cleaning device, an etching device, and the like, so as to facilitate the surface treatment of the wafer monitor wafer. The wafer monitor wafer after surface treatment is sent to the particle size detection module for particle size and edge corner cut detection, and it should be noted that, in this embodiment, please refer to fig. 4, the detected data will be transmitted to the feeding detection table/the recycling detection table, the wafer monitor wafer with the particle size and edge corner cut up reaching the detection standard will continue to be sent to the flatness detection module for flatness detection, and similarly, the detected data will be transmitted to the feeding detection table/the recycling detection table, and in the above process, any wafer monitor wafer with the particle size and edge corner cut up reaching the detection standard will be sent to the scrap wafer storage bin. After the wafer monitoring wafer is subjected to granularity, edge unfilled corner and flatness detection, the wafer monitoring wafer is subjected to acceptance grade division according to a preset acceptance rule. In this implementation, the acceptance level can be divided into four levels of A/B/C/D for different production areas, wherein the level D is a fail level.
Setting a preset rule, automatically detecting whether a wafer monitoring wafer is qualified or not according to the preset rule, if the wafer monitoring wafer is qualified, automatically carving codes on the wafer monitoring wafer and storing the wafer monitoring wafer to a qualified wafer storage bin; and if the wafer monitoring wafer is unqualified, storing the wafer monitoring wafer to a scrapped wafer storage bin. The whole process is an automatic program flow, and no manual participation is needed in the process, so that the efficiency is greatly improved, and the problems of human errors and the like possibly existing in the manual detection process are solved.
Further, after the wafer monitor wafer is qualified and is subjected to code carving, the method further comprises the following steps: recording an event which occurs on the wafer monitoring wafer after the self-code-carving of the wafer monitoring wafer, and uploading relevant data of the event to a data processing center; the relevant data of the event comprises: basic information of the wafer monitoring sheet and production records of the wafer monitoring sheet. The method specifically comprises the following steps: in this embodiment, a laser code-engraving module is used to engrave a code on a qualified wafer monitoring wafer, the code is engraved in an invalid area on the back surface of the wafer monitoring wafer, such as a two-dimensional code, a three-dimensional code or other bar codes, after entering a production line, any program is performed to scan the back surface of the wafer monitoring wafer (the code scanning process can refer to fig. 5), and the obtained data of the wafer monitoring wafer event is uploaded to a data processing center, wherein the basic information of the wafer monitoring wafer and the production record of the wafer monitoring wafer can refer to fig. 6. The user can access the relevant data of the events of the data processing center to further acquire the use conditions of different wafer monitoring wafers and the like.
Furthermore, the wafer monitoring wafer can be used by identifying the engraving codes on the wafer monitoring wafer, and relevant information is uploaded to the data processing center; the data processing center obtains different uploaded data, analyzes and processes the uploaded data, and generates inventory data, wherein the inventory data comprises: the online stock and the in-stock (see fig. 7) are the stock of the control wafer on the production line, and the in-stock is the stock of the control wafer in the warehouse. The user can access the data of the stock quantity, inquire the data of the quantity, the online position, the use duration and the like of the wafer monitoring pieces, know the use condition of the wafer monitoring pieces, is convenient for managing and distributing the wafer monitoring pieces and the like, and can also set stock shortage alarms and the like.
Further, in the present embodiment, the method further includes the steps of: recycling and detecting a recycled wafer monitoring wafer, judging whether the wafer monitoring wafer meets the recycling standard, if so, continuing to use the wafer monitoring wafer, and uploading corresponding data to a data processing center (the recycling times can be checked in a recycling detection table); if the wafer monitoring wafer does not meet the standard of recycling, the wafer monitoring wafer is scrapped and relevant data of scrapping is uploaded to a data processing center (see fig. 8 for a scrapping information base).
Further, in this embodiment, all the related data are uploaded to the data processing center, and the data processing center integrates and processes the data to form an access integrated terminal that can be queried, traced, counted, and analyzed. Through the access integrated terminal, any required data can be acquired, and further deep management of the wafer monitoring wafer is facilitated.
Referring to fig. 9, in the present embodiment, a management system 900 for wafer monitor wafers is implemented as follows:
a management system 900 for wafer monitor wafers comprises: a conveying track 901, a conveying arm 902, a detection module 903, a code carving module 904, a qualified sheet storage bin 905 and a scrapped sheet storage bin 906; the transfer arm 902 is disposed on the transfer track 901, and the transfer arm 902 is configured to: transmitting the wafer monitoring wafer to different area positions; the detection module 903 is configured to: detecting whether the wafer monitoring wafer is qualified or not according to a preset rule; the code carving module 904 is configured to: if the wafer monitoring wafer is qualified, carrying out code carving on the wafer monitoring wafer; the good sheet storage bin 905 is used for: storing qualified wafer monitoring sheets; the scrap sheet storage bin 906 is configured to: storing the unqualified wafer monitor wafer.
Through setting up preset rule, transfer arm 902 conveys the wafer control piece to the position in different regions, and detection module 903 is used for whether qualified according to presetting rule automated inspection wafer control piece, and the sign indicating number module 904 is used for: if the wafer monitoring wafer is qualified, automatically carving the code of the wafer monitoring wafer and storing the wafer monitoring wafer to a qualified wafer storage bin 905; if the wafer monitor wafer is not qualified, it is stored in the scrap wafer storage bin 906. The whole system is automatic, and no manual participation is needed in the process, so that the efficiency is greatly improved, and the problems of human errors and the like possibly existing in the manual detection process are avoided.
Referring to fig. 10, further, the detecting module 903 includes: the device comprises a surface treatment module 9031, a granularity detection module 9032, a flatness detection module 9033 and an acceptance rule module 9034; each module is provided with a wafer monitoring piece inlet and outlet end; the surface treatment module 9031 is used for: carrying out surface treatment on the wafer monitoring wafer; granularity detects module 9032 is used for: detecting the granularity and the edge unfilled corner of the wafer monitoring wafer after surface treatment; the flatness detection module 9033 is used for: carrying out flatness detection on the wafer monitoring wafer for detecting granularity and edge unfilled corners; the accept rules module 9034 is configured to: and carrying out acceptance grading on the wafer monitoring wafer according to a preset acceptance rule.
In this embodiment, the surface treatment module 9031 is provided with a device for cleaning, etching, or the like, so as to facilitate surface treatment of the wafer monitor wafer. The wafer monitor wafer after surface treatment is sent to the granularity detecting module 9032 for granularity and edge unfilled corner detection, it should be noted that, in this embodiment, please refer to fig. 4, the detected data will be sent to the feeding detecting table/recycling detecting table, the wafer monitor wafer with granularity and edge unfilled corner reaching the standard will continue to be sent to the flatness detecting module 9033 for flatness detection, and similarly, the detected data will be sent to the feeding detecting table/recycling detecting table, and in the above process, any wafer monitor wafer with unqualified granularity will be sent to the scrap wafer storage bin 906. After the wafer monitoring wafer is subjected to granularity, edge unfilled corner and flatness detection, the wafer monitoring wafer is subjected to acceptance grade division according to a preset acceptance rule. In this implementation, the acceptance level can be divided into four levels of A/B/C/D for different production areas, wherein the level D is a fail level.
Further, the method also comprises the following steps: the production recording module and the data processing center; the production recording module is used for: recording an event which occurs on the wafer monitoring wafer after the self-code-carving of the wafer monitoring wafer, and uploading relevant data of the event to a data processing center; the relevant data of the event comprises: basic information of the wafer monitoring sheet and production records of the wafer monitoring sheet. The method specifically comprises the following steps: in this embodiment, a laser code-engraving module is used to engrave a code on a qualified wafer monitoring wafer, the code is engraved in an invalid area on the back surface of the wafer monitoring wafer, such as a two-dimensional code, a three-dimensional code or other bar codes, after entering a production line, any program is performed to scan the back surface of the wafer monitoring wafer (the code scanning process can refer to fig. 5), and the obtained data of the wafer monitoring wafer event is uploaded to a data processing center, wherein the basic information of the wafer monitoring wafer and the production record of the wafer monitoring wafer can refer to fig. 6. The user can access the relevant data of the events of the data processing center to further acquire the use conditions of different wafer monitoring wafers and the like.
Further, the method also comprises the following steps: the control chip code identification module and the data processing center; the control chip code identification module is used for: the wafer monitoring wafer is used by identifying the engraving code on the wafer monitoring wafer, and relevant information is uploaded to a data processing center; the data processing center is configured to: acquiring different uploading data, analyzing and processing the uploading data, and generating stock data, wherein the stock data comprises: the online stock and the in-stock (see fig. 7) are the stock of the control wafer on the production line, and the in-stock is the stock of the control wafer in the warehouse. The user can access the data of the stock quantity, inquire the data of the quantity, the online position, the use duration and the like of the wafer monitoring pieces, know the use condition of the wafer monitoring pieces, is convenient for managing and distributing the wafer monitoring pieces and the like, and can also set stock shortage alarms and the like.
Further, the method also comprises the following steps: a recovery detection module; retrieve and detect the module and be used for: recycling and detecting a recycled wafer monitoring wafer, judging whether the wafer monitoring wafer meets the recycling standard, if so, continuing to use the wafer monitoring wafer, and uploading corresponding data to a data processing center (the recycling times can be checked in a recycling detection table); if the wafer monitoring wafer does not meet the standard of recycling, the wafer monitoring wafer is scrapped and relevant data of scrapping is uploaded to a data processing center (see fig. 8 for a scrapping information base).
Further, in this embodiment, all the related data are uploaded to the data processing center, and the data processing center integrates and processes the data to form an access integrated terminal that can be queried, traced, counted, and analyzed. Through the access integrated terminal, any required data can be acquired, and further deep management of the wafer monitoring wafer is facilitated.
It should be noted that, although the above embodiments have been described herein, the invention is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by making changes and modifications to the embodiments described herein, or by using equivalent structures or equivalent processes performed in the content of the present specification and the attached drawings, which are included in the scope of the present invention.
Claims (8)
1. A method for managing a wafer monitor wafer comprises the following steps:
detecting whether a wafer monitoring wafer is qualified or not according to a preset rule, and if the wafer monitoring wafer is qualified, carrying out code carving on the wafer monitoring wafer and storing the wafer monitoring wafer to a qualified wafer storage bin; if the wafer monitoring wafer is unqualified, storing the wafer monitoring wafer to a scrapped wafer storage bin;
the wafer monitoring wafer is used by identifying the engraving code on the wafer monitoring wafer, and relevant information is uploaded to a data processing center;
the data processing center obtains different uploaded data, analyzes and processes the uploaded data, and generates inventory data, wherein the inventory data comprises: on-line inventory and on-inventory.
2. The method as claimed in claim 1, wherein the wafer monitor wafer is a wafer monitor wafer,
the method for detecting whether the wafer monitoring wafer is qualified according to the preset rule further comprises the following steps:
carrying out surface treatment on the wafer monitoring wafer;
detecting the granularity, the edge unfilled corner and the flatness of the wafer monitoring wafer after surface treatment;
and carrying out acceptance grading on the wafer monitoring wafer according to a preset acceptance rule.
3. The method as claimed in claim 1, further comprising the steps of:
recording an event which occurs on the wafer monitoring wafer after the self-code-carving of the wafer monitoring wafer, and uploading relevant data of the event to a data processing center;
the relevant data of the event comprises: basic information of the wafer monitoring sheet and production records of the wafer monitoring sheet.
4. The method as claimed in claim 1, further comprising the steps of:
recycling and detecting a recycled wafer monitoring wafer, judging whether the wafer monitoring wafer meets the recycling standard, if so, continuing to use the wafer monitoring wafer, and uploading corresponding data to a data processing center;
and if the wafer monitoring wafer does not meet the recycling standard, performing scrapping treatment on the wafer monitoring wafer, and uploading relevant scrapping treatment data to a data processing center.
5. A management system for wafer monitor wafer is characterized in that it includes: the device comprises a conveying track, a conveying arm, a detection module, a code carving module, a qualified sheet storage bin and a scrapped sheet storage bin;
the conveying arm is arranged on the conveying track and used for: transmitting the wafer monitoring wafer to different area positions;
the detection module is used for: detecting whether the wafer monitoring wafer is qualified or not according to a preset rule;
the code carving module is used for: if the wafer monitoring wafer is qualified, carrying out code carving on the wafer monitoring wafer;
the qualified piece storage bin is used for: storing qualified wafer monitoring sheets;
the scrap sheet storage bin is used for: storing unqualified wafer monitoring sheets;
further comprising: the control chip code identification module and the data processing center;
the control chip code identification module is used for: the wafer monitoring wafer is used by identifying the engraving code on the wafer monitoring wafer, and relevant information is uploaded to a data processing center;
the data processing center is configured to: acquiring different uploading data, analyzing and processing the uploading data, and generating stock data, wherein the stock data comprises: on-line inventory and on-inventory.
6. The system as claimed in claim 5, wherein the wafer monitor wafer is a wafer monitor wafer,
the detection module comprises: the device comprises a surface treatment module, a granularity detection module, a flatness detection module and an acceptance rule module;
each module is provided with a wafer monitoring piece inlet and outlet end;
the surface treatment module is used for: carrying out surface treatment on the wafer monitoring wafer;
the granularity detection module is used for: detecting the granularity and the edge unfilled corner of the wafer monitoring wafer after surface treatment;
the flatness detection module is used for: carrying out flatness detection on the wafer monitoring wafer for detecting granularity and edge unfilled corners;
the acceptance rule module is to: and carrying out acceptance grading on the wafer monitoring wafer according to a preset acceptance rule.
7. The system as claimed in claim 5, further comprising: the production recording module and the data processing center;
the production recording module is used for: recording an event which occurs on the wafer monitoring wafer after the self-code-carving of the wafer monitoring wafer, and uploading relevant data of the event to a data processing center; the relevant data of the event comprises: basic information of the wafer monitoring sheet and production records of the wafer monitoring sheet.
8. The system as claimed in claim 5, further comprising: a recovery detection module;
retrieve and detect the module and be used for: recycling and detecting a recycled wafer monitoring wafer, judging whether the wafer monitoring wafer meets the recycling standard, if so, continuing to use the wafer monitoring wafer, and uploading corresponding data to a data processing center; and if the wafer monitoring wafer does not meet the recycling standard, performing scrapping treatment on the wafer monitoring wafer, and uploading relevant scrapping treatment data to a data processing center.
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