CN110428760A - A kind of display panel test method, display panel and display device - Google Patents
A kind of display panel test method, display panel and display device Download PDFInfo
- Publication number
- CN110428760A CN110428760A CN201910572560.7A CN201910572560A CN110428760A CN 110428760 A CN110428760 A CN 110428760A CN 201910572560 A CN201910572560 A CN 201910572560A CN 110428760 A CN110428760 A CN 110428760A
- Authority
- CN
- China
- Prior art keywords
- measured
- data line
- scan line
- tested point
- flip chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
The present invention discloses a kind of display panel test method, display panel and display device, and display panel test method is the following steps are included: choose tested point in the default section of scan line to be measured;It will be cut off by the data line of tested point, to obtain connect in data line with flip chip one section as testing data line segment;Scan line to be measured is electrically connected with testing data line segment;By the electrical connection cutting between flip chip and printed circuit board;The output signal at tested point is detected by flip chip.Testing data line segment is equivalent to a conducting wire, and the output signal of scan line to be measured is led to flip chip, so that can directly be detected to the output signal of tested point by flip chip, without independent bracing wire to printed circuit board;Also, by the electrical connection between cutting flip chip and printed circuit board, interference of the printed circuit board to testing result can be eliminated, the accuracy of testing result is helped to improve.
Description
Technical field
The present invention relates to the technical fields of display product, in particular to show the field of test technology of product, and in particular to
A kind of display panel test method, display panel and display device.
Background technique
The fast development of display panel industry then needs to make so that the technical requirements of opposite board industry are increasingly stringenter
The person's of making moment pays close attention to whether properties of product meet design requirement.To go into battle column substrate gate driving (Gate driven to panel
On Array, GOA) product scan line output waveform and the scan line waveform after RC time delay tested for into
Row explanation, general design will not individually pull to come on line to printed circuit board (Printed Circuit Board, PCB) plate
Output waveform is detected, therefore, by the prior art, when hardly resulting in accurate scan line output waveform and passing through RC
Between postpone after scan line waveform.
Summary of the invention
The main object of the present invention is to propose a kind of display panel test method, display panel and display device, it is intended to
Solve the problems, such as that traditional GOA product can not measure accurate scan line output waveform.
To achieve the above object, a kind of display panel test method proposed by the present invention, using in a display device, including
Following steps:
Tested point is chosen in the default section of scan line to be measured;
It will cut off by the data line of the tested point position, connect with obtaining in the data line with flip chip
One section, as testing data line segment;
The scan line to be measured is electrically connected with the testing data line segment;
By the electrical connection cutting between the flip chip and printed circuit board;And
By the flip chip, output signal of the scan line to be measured at the tested point is detected.
Optionally, in described the step of choosing tested point in the default section of scan line to be measured, the scan line to be measured
With the connecting pin for being electrically connected to array substrate gate driving circuit, the tested point is located at the default section close to the company
The one end at end is connect, to detect the proximal end output waveform for obtaining the scan line to be measured.
Optionally, in described the step of choosing tested point in the default section of scan line to be measured, the scan line to be measured
With the connecting pin for being electrically connected to array substrate gate driving circuit, the tested point is located at the default section far from the company
The one end at end is connect, to detect the distal end output waveform for obtaining the scan line to be measured.
Optionally, the both ends of the scan line to be measured are electrically connected array basal plate gate driving circuit;
In described the step of choosing tested point in the default section of scan line to be measured, the tested point is located at described two
The middle-end of array substrate gate driving circuit, to detect the distal end output waveform for obtaining the scan line to be measured.
Optionally, it is described will by the tested point position data line cut off, with obtain in the data line with
One section of flip chip connection, the step of as testing data line segment in, the data line cut-off part is located at the tested point institute
Deviate from the side of the flip chip in position, the data line cut-off part is arranged close to the tested point position.
Optionally, described the step of being electrically connected the scan line to be measured with the testing data line segment, includes:
It is described to be measured to realize by laser machine by the lap position welding of the testing data line segment and the tested point
Conducting between scan line and the testing data line segment.
Optionally, the display device further includes thin film transistor switch, and the grid of the thin film transistor switch is electrically connected
Connect the scan line to be measured;
Described the step of being electrically connected the scan line to be measured with the testing data line segment includes:
By laser machine by the grid welding of the testing data line segment and the thin film transistor switch, described in realizing
Conducting between scan line to be measured and the testing data line segment.
Optionally, described by the flip chip, to output signal of the scan line to be measured at the tested point
After the step of being detected, further includes:
By the electrical connection cutting between the scan line to be measured and the testing data line segment;
The flip chip and the printed circuit board are conducted;And
It will be conducted by the data line of the tested point position.
In addition, the present invention also proposes that a kind of display panel, the display panel include:
In the fine scanning line and multiple columns of data lines for intersecting laying;And
First mends binding structure, on at least column data line in the multiple columns of data lines, for conduct it is described extremely
A few column data line.
In addition, the present invention also proposes that a kind of display device, the display device include:
Printed circuit board;
In the fine scanning line and multiple columns of data lines for intersecting laying;
Array substrate gate driving circuit is electrically connected the fine scanning line;
Flip chip, both ends are respectively electrically connected to the printed circuit board and the multiple columns of data lines;
First mends binding structure, on at least column data line in the multiple columns of data lines, for conduct it is described extremely
A few column data line;And
Second mends binding structure, on the conducting wire between the printed circuit board and the flip chip, for conducting
The printed circuit board and the flip chip.
It is described to be measured after the testing data line segment and the scan line electrical connection to be measured in technical solution of the present invention
Data line segment is equivalent to a conducting wire, the output signal of the scan line to be measured is led to the flip chip, so that passing through institute
State flip chip, can the output signal directly to the scan line to be measured detect, it is electric to the printing without independent bracing wire
Road plate;Also, by cutting off the electrical connection between the flip chip and the printed circuit board, the printed circuit can be eliminated
Influence of the plate to testing result, helps to improve the accuracy of testing result.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the flow diagram of an embodiment of display panel test method provided by the invention;
Fig. 2 is that the display panel test method in Fig. 1 applies the structural schematic diagram in display device;
Fig. 3 is the enlarged diagram of the part-structure in Fig. 1 at scan line to be measured and testing data line segment electrical connection;
Fig. 4 is the structural schematic diagram after the display device test in Fig. 1.
Drawing reference numeral explanation:
Label | Title | Label | Title |
1 | Printed circuit board | 5 | Flip chip |
2 | Scan line | 6 | First mends binding structure |
21 | Scan line to be measured | 7 | Second mends binding structure |
22 | Tested point | 8 | Thin film transistor switch |
3 | Data line | 81 | Grid |
31 | Testing data line segment | 82 | Drain electrode |
32 | Test data line | 83 | Source electrode |
4 | Array substrate gate driving circuit |
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that if relating to directionality instruction (such as up, down, left, right, before and after ...) in the embodiment of the present invention,
Then directionality instruction be only used for explain under a certain particular pose (as shown in the picture) between each component relative positional relationship,
Motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, being somebody's turn to do " first ", " second " etc. if relating to the description of " first ", " second " etc. in the embodiment of the present invention
Description be used for description purposes only, be not understood to indicate or imply its relative importance or implicitly indicate indicated skill
The quantity of art feature." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one spy
Sign.In addition, the meaning of the "and/or" occurred in full text, including three schemes arranged side by side, by taking " A and/or B " as an example, including the side A
The scheme that case or B scheme or A and B meet simultaneously.In addition, the technical solution between each embodiment can be combined with each other, but
To be based on can be realized by those of ordinary skill in the art, when the combination of technical solution occur it is conflicting or can not
Will be understood that the combination of this technical solution is not present when realization, also not the present invention claims protection scope within.
The fast development of display panel industry then needs to make so that the technical requirements of opposite board industry are increasingly stringenter
The person's of making moment pays close attention to whether properties of product meet design requirement.To go into battle column substrate gate driving (Gate driven to panel
On Array, GOA) product scan line output waveform and the scan line waveform after RC time delay tested for into
Row explanation, general design will not individually pull to come on line to printed circuit board (Printed Circuit Board, PCB) plate
Output waveform is detected, therefore, by the prior art, when hardly resulting in accurate scan line output waveform and passing through RC
Between postpone after scan line waveform.
In consideration of it, the present invention provides a kind of display panel test method, Fig. 1 to Fig. 3 is display panel provided by the invention
The embodiment of test method.
The display panel test method is applied in a display device, referring to Fig. 2, the display device includes at least picture
Plain structure and its driving circuit, wherein the dot structure includes the fine scanning line 2 and multiple columns of data lines 3 for being in intersection laying,
The driving circuit specifically includes scan drive circuit and data drive circuit, and the scan drive circuit is electrically connected the multirow
Scan line 2, for providing driving signal for the fine scanning line 2, the data drive circuit is electrically connected the multi-column data
Line 3, for providing driving signal for the multiple columns of data lines 3.The side of the scan drive circuit and the data drive circuit
Case can be set to difference according to the difference of the display device, but in the present invention, mainly with array substrate gate driving electricity
Road 4 is used as the scan drive circuit, the IC with flip chip 5 (Chip on Film, COF) as the data drive circuit
The technical solution of packaged type is illustrated.In addition, a variety of optical components in the display device are usually with printing electricity
Road plate 1 is used as its medium and carrier interconnected.In the present invention, the printed circuit board 1 and the flip chip 5 are electrically connected
It connects, for providing electric signal for the flip chip 5.
Based on above-mentioned, Fig. 1 and Fig. 2 are please referred to, in the present embodiment, the display panel test method includes following step
It is rapid:
S10: tested point 22 is chosen in the default section of scan line 21 to be measured;
The scan line to be measured 21 refers in the fine scanning line 2 that testing staff was currently detected sweeps
Retouch line;The quantity of the scan line to be measured 21 can be set to one or more of any needs;The choosing of the tested point 22
Access amount can also be set as one or more according to actual needs.The default section can refer to the scan line to be measured
The section of entire section or random length between 21 both ends tie points.
S20: will cut off by the data line 3 of 22 position of tested point, with obtain in the data line 3 with flip
One section of the connection of film 5, as testing data line segment 32;
Since the fine scanning line 2 and the multiple columns of data lines 3 are in laying is intersected, so that scan line 2 described in every a line
On will interval pass through the multiple columns of data lines 3, when the tested point 22 position determine after, by described in the tested point 22
Data line (for ease of understanding, the data line defined below by the tested point 22 is test data line 31) can also be therewith
It determines.The test data line 31 is cut off in for example radium-shine mode, is allowed to form open circuit, so that the data
Driving circuit does not continue to provide driving signal for the test data line 31.If at this point, the test data line 31 only one
Section is connect with the flip chip 5, it is determined that the section is the testing data line segment 32;If 31 two sections of the test data line is
It is connect with a flip chip 5, then chooses and be wherein used as the testing data line segment 32 for any one section, accordingly, in following step
The flip chip 5, refer to the flip chip 5 connecting with the testing data line segment 32.
S30: the scan line 21 to be measured is electrically connected with the testing data line segment 32;
In view of above-mentioned, the testing data line segment 32 is equivalent to a conducting wire, the scan line 21 to be measured and the number to be measured
According to the electrical connection of line segment 32, so that when the array substrate gate driving circuit 4 is that the scan line 21 to be measured provides driving letter
Number when, by the testing data line segment 32, the driving signal is directly transferred at the flip chip 5.
S40: the electrical connection between the flip chip 5 and printed circuit board 1 is cut off;And
Wherein, there are many adoptable cutting modes, for example, when the corresponding display device it is subsequent still need in use,
Can pointedly by between the flip chip 5 and the printed circuit board 1 conducting wire or stitch progress can disconnect in repair,
It is described to disconnect in repair, namely make after the completion of test, reconnection can be carried out to gap by modes such as weldings, so that
The display device can be repaired the functional status to before recovery;And it is not used when the corresponding display device is subsequent
When, directly the flip chip 5 can be removed from the printed circuit board 1, so that the simpler side of the operation of testing staff
Just.
S50: by the flip chip 5, to output signal of the scan line 21 to be measured at the tested point 22 into
Row detection.
The present embodiment with no restriction, such as can refer specifically to output waveform to the specific manifestation form of the output signal,
At this point, corresponding tie point in the flip chip 5 can be electrically connected by such as oscillograph, detecting real-time simultaneously stores institute on demand
The output waveform at tested point 22 is stated, in favor of subsequent analysis and research.
It is described after the testing data line segment 32 and the scan line to be measured 21 electrical connection in technical solution of the present invention
Testing data line segment 32 is equivalent to a conducting wire, and the output signal of the scan line 21 to be measured is led to the flip chip 5, is made
By the flip chip 5, can the output signal directly to the scan line 21 to be measured detect, be not necessarily to independent bracing wire extremely
The printed circuit board 1;Also, by cutting off the electrical connection between the flip chip 5 and the printed circuit board 1, it can disappear
Interference except the printed circuit board 1 to testing result, helps to improve the accuracy of testing result.
When the output signal refers specifically to output waveform, the tested point 22 at different location is chosen, inspection can be corresponded to
It surveys and obtains different output waveforms.In the embodiment of the present invention step S10, the scan line 21 to be measured, which has, is electrically connected to institute
The connecting pin of array substrate gate driving circuit 4 is stated, the tested point 22 is located at the default section close to the connecting pin
One end, to detect the proximal end output waveform for obtaining the scan line 21 to be measured.For example, can choose near the connecting pin
One column data line 3 or several column data lines 3 are used as the test data line 31, and will pass through institute on the test data line 31
The point of scan line 21 to be measured is stated as the tested point 22 in the present embodiment.Since the tested point 22 is closer to the array
Substrate gate driving circuit 4, line loss is negligible, therefore, detected output waveform at the tested point 22, Ji Kezuo
For the proximal end output waveform of the scan line 21 to be measured.
In the case where referring specifically to output waveform also in the output signal, in another embodiment of the invention, institute
It states in step S10, the scan line 21 to be measured has the connecting pin for being electrically connected to the array substrate gate driving circuit 4, institute
It states tested point 22 and is located at the described one end of default section far from the connecting pin, obtain the remote of the scan line 21 to be measured to detect
Hold output waveform.Since there are a constant impedance, the scan line 2 and the data lines 3 for the scan line 2 and the data line 3
Equivalent impedance be RC network that a series of series RC circuit is constituted, voltage signal will cause prolonging for waveform in transmission process
Distortion late, and with gradually increasing at a distance between the array substrate gate driving circuit 4, the degree of the delay distortion
It generally can be gradually serious.The distortion of voltage signal is easy to cause the displays such as brightness disproportionation, flashing, the crosstalk of the display device not
Good, therefore, the measurement to the distal end output waveform helps to obtain RC retardation ratio in the scan line to be measured 21 and is distorted the most
The output waveform seriously located, to facilitate subsequent progress, targetedly wire delay is analyzed.
Specifically, when the display device is driven namely the scan line to be measured 21 by the bis- panel routes that drive of GOA
When both ends are electrically connected array basal plate gate driving circuit 4, in the step S10, the tested point 22 is located at described
The middle-end of two array substrate gate driving circuits 4, to detect the distal end output waveform for obtaining the scan line 21 to be measured.This is
Because distance of the middle-end away from any one in described two array substrate gate driving circuits 4 is farthest, that is,
Existing delay distortion is also relatively the most serious.
Then, in the step S20 of another embodiment, 31 cut-off part of test data line is located at the tested point
22 positions deviate from the side of the flip chip 5, help to reserve enough length for the test data line 31, for after
It is continuous to be electrically connected with the scan line 21 to be measured;31 cut-off part of test data line is close to 22 position of tested point
Setting, facilitates the impedance for reducing the testing data line segment 32, to reduce the interference to testing result, improves testing result
Accuracy.
In addition, in the step S30, tool that the scan line 21 to be measured is electrically connected with the testing data line segment 32
Body mode can there are many, referring to Fig. 3, after the test data line 31 is cut off at the A, the scan line 21 to be measured
It can be electrically connected at B with the testing data line segment 32, that is, by laser machine, by the testing data line segment 32
Carry out welding with the lap position of the tested point 22, with realize the scan line to be measured 21 and the testing data line segment 32 it
Between conducting, and in particular to the laser machine operating method and welding process, can refer to the prior art, not make herein
It is described in detail.So set, the posetionof weld is made to correspond to 22 position of tested point, facilitating directly will be described to be measured
The output signal of point 22 is transmitted at the flip chip 5 through the testing data line segment 32, reduces loss, and it is accurate to improve detection
Property.
Alternatively, when the display device further includes thin film transistor switch 8, please continue to refer to Fig. 3, the test data
After line 31 is cut off at the A, the scan line 21 to be measured can also be electrically connected with the testing data line segment 32 at C
It connects.Generally, the thin film transistor switch 8 grid 81 be electrically connected scan line 2, drain electrode 82 electrical connection one data lines 3, with
And source electrode 83 is electrically connected a pixel electrode.Therefore, according to shown in C, the grid 81 of the thin film transistor switch 8 is electrically connected institute
Scan line 21 to be measured is stated, then by laser machine, by the grid of the testing data line segment 32 and the thin film transistor switch 8
81 weldings, to realize the conducting between the scan line to be measured 21 and the testing data line segment 32.Similarly, and in particular to
The operating method and welding process of the laser machine can refer to the prior art, not be described further herein.Since the film is brilliant
Body pipe switch 8 has bigger weldable metal covering compared to above-mentioned lap position, carries out fusing operation for testing staff,
And be not easy to fuse, while ensuring that the scan line to be measured 21 and the testing data line segment 32 both are connected to, more
The operation of convenient testing staff.
It should be noted that above two electric connection mode can use simultaneously, that is, both carrying out at the lap position
Welding, and by 81 welding of grid of the testing data line segment 32 and the thin film transistor switch 8, realize that dual connection is protected
Barrier.
Further, it should be noted that the display panel test method provided by the invention is taken, to the display device
After being detected, the structure of the display device can also be subjected to reparation reduction, specifically, in the step as needed
After S50, further includes:
S60: the electrical connection between the scan line 21 to be measured and the testing data line segment 32 is cut off;
S70: the flip chip 5 and the printed circuit board 1 are conducted;And
S80: it will be conducted by the data line 3 of 22 position of tested point.
That is, by the operation of the step S60~S80, having after the output characteristics for accurately measuring the display device
Help repair the structure of the display device, be allowed to be restored to the functional status before detection, is conducive to the display dress
Set carry out it is subsequent detect or continue to use again, improve the recycling rate of waterused of the display device, and reduce because test produces
Raw economic attrition.
Certainly, since the display panel test method has reducibility, the display panel test method is for example
It is applicable to the occasion that manufacturer carries out sampling observation or full inspection to the display device, the display device after test generally may be used
It continues with, without being revoked or abandoning.Based on this, the present invention also provides a kind of display panel, the display panel is at least
Including above-mentioned dot structure and array substrate gate driving circuit 4, wherein the dot structure includes laying in intersection
Fine scanning line 2 and multiple columns of data lines 3;The array substrate gate driving circuit 4 is electrically connected the fine scanning line 2, is used for
Driving signal is provided for the fine scanning line 2;In addition, the display panel further includes the first benefit binding structure 6, described first is mended
Binding structure 6 is set on at least column data line 3 in the multiple columns of data lines 3, for conducting an at least column data line
3.That is, after cutting off the test data line 31, foring the testing data line segment in the display panel test method
32 and one section remaining, the first benefit binding structure 6 is used for the testing data line segment 32 and tells remaining one section
Reconnection is carried out, so that the test data line 31 is repaired and is connected again.Described first mends the specific manifestation form of binding structure 6
With no restriction, the e.g. connector etc. of welding structure or other special configurations.
In addition, the present invention also provides a kind of display devices, referring to Fig. 4, for the display device provided by the invention
Specific embodiment.
The display device includes above-mentioned dot structure and its driving circuit, the first benefit binding structure 6 and the second benefit binding
Structure 7, specifically, the dot structure include in the fine scanning line 2 and multiple columns of data lines 3 for intersecting laying, the driving circuit
Including array substrate gate driving circuit 4, printed circuit board 1 and flip chip 5, the array substrate gate driving circuit 4
It is electrically connected the fine scanning line 2;The both ends of the flip chip 5 are respectively electrically connected to the printed circuit board 1 and described more
Column data line 3.With it is above-mentioned similarly, it is described first mend binding structure 6 be set to the multiple columns of data lines 3 in an at least column data line
On 3, for conducting an at least column data line 3;In addition, described second mends binding structure 7 set on 1 He of printed circuit board
It is right for after being tested using the display panel test method on conducting wire or stitch between the flip chip 5
The printed circuit board 1 after cutting electrical connection carries out reparation with the flip chip 5 and connects.
The foregoing is merely alternative embodiments of the invention, are not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (10)
1. a kind of display panel test method, using in a display device, which comprises the following steps:
Tested point is chosen in the default section of scan line to be measured;
It will be cut off by the data line of the tested point position, to obtain connect in the data line with flip chip one
Section, as testing data line segment;
The scan line to be measured is electrically connected with the testing data line segment;
By the electrical connection cutting between the flip chip and printed circuit board;And
By the flip chip, output signal of the scan line to be measured at the tested point is detected.
2. display panel test method as described in claim 1, which is characterized in that the default section in scan line to be measured
In the step of interior selection tested point, the scan line to be measured has the connecting pin for being electrically connected to array substrate gate driving circuit,
The tested point is located at the default section close to one end of the connecting pin, to detect the proximal end for obtaining the scan line to be measured
Output waveform.
3. display panel test method as described in claim 1, which is characterized in that the default section in scan line to be measured
In the step of interior selection tested point, the scan line to be measured has the connecting pin for being electrically connected to array substrate gate driving circuit,
The tested point is located at one end that the default section deviates from the connecting pin, to detect the distal end for obtaining the scan line to be measured
Output waveform.
4. display panel test method as described in claim 1, which is characterized in that the both ends of the scan line to be measured are electric respectively
Connect array basal plate gate driving circuit;
In described the step of choosing tested point in the default section of scan line to be measured, the tested point is located at described two arrays
The middle-end of substrate gate driving circuit, to detect the distal end output waveform for obtaining the scan line to be measured.
5. display panel test method as described in claim 1, which is characterized in that described to pass through the tested point institute in place
The data line cutting set, to obtain connect in the data line with flip chip one section, the step of as testing data line segment
In, the data line cut-off part is located at the side of the tested point position far from the flip chip, and the data line is cut
It is disconnected to locate to be arranged close to the tested point position.
6. display panel test method as described in claim 1, which is characterized in that it is described by the scan line to be measured with it is described
Testing data line segment be electrically connected the step of include:
By laser machine by the lap position welding of the testing data line segment and the tested point, to realize the scanning to be measured
Conducting between line and the testing data line segment.
7. display panel test method as described in claim 1, which is characterized in that the display device further includes film crystal
The grid of pipe switch, the thin film transistor switch is electrically connected the scan line to be measured;
Described the step of being electrically connected the scan line to be measured with the testing data line segment includes:
It is described to be measured to realize by laser machine by the grid welding of the testing data line segment and the thin film transistor switch
Conducting between scan line and the testing data line segment.
8. display panel test method as described in claim 1, which is characterized in that it is described by the flip chip, to institute
After stating the step of output signal of the scan line to be measured at the tested point is detected, further includes:
By the electrical connection cutting between the scan line to be measured and the testing data line segment;
The flip chip and the printed circuit board are conducted;And
It will be conducted by the data line of the tested point position.
9. a kind of display panel, which is characterized in that the display panel includes:
In the fine scanning line and multiple columns of data lines for intersecting laying;And
First mends binding structure, on at least column data line in the multiple columns of data lines, for conducting described at least one
Column data line.
10. a kind of display device, which is characterized in that the display device includes:
Printed circuit board;
In the fine scanning line and multiple columns of data lines for intersecting laying;
Array substrate gate driving circuit is electrically connected the fine scanning line;
Flip chip, both ends are respectively electrically connected to the printed circuit board and the multiple columns of data lines;
First mends binding structure, on at least column data line in the multiple columns of data lines, for conducting described at least one
Column data line;And
Second mends binding structure, described for conducting on the conducting wire between the printed circuit board and the flip chip
Printed circuit board and the flip chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910572560.7A CN110428760A (en) | 2019-06-27 | 2019-06-27 | A kind of display panel test method, display panel and display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910572560.7A CN110428760A (en) | 2019-06-27 | 2019-06-27 | A kind of display panel test method, display panel and display device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110428760A true CN110428760A (en) | 2019-11-08 |
Family
ID=68409840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910572560.7A Pending CN110428760A (en) | 2019-06-27 | 2019-06-27 | A kind of display panel test method, display panel and display device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110428760A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110570795A (en) * | 2019-09-04 | 2019-12-13 | 深圳市华星光电技术有限公司 | Test method of display panel |
CN110796975A (en) * | 2019-11-25 | 2020-02-14 | Tcl华星光电技术有限公司 | Display panel and display device |
CN111795799A (en) * | 2020-06-17 | 2020-10-20 | 深圳市华星光电半导体显示技术有限公司 | Test method and device |
CN112331115A (en) * | 2020-11-05 | 2021-02-05 | 北海惠科光电技术有限公司 | Liquid crystal panel and GOA circuit detection method of liquid crystal panel |
CN112331117A (en) * | 2020-11-05 | 2021-02-05 | 北海惠科光电技术有限公司 | Liquid crystal panel and liquid crystal panel data line voltage detection method |
CN112331120A (en) * | 2020-11-05 | 2021-02-05 | 北海惠科光电技术有限公司 | Array substrate row driving reset circuit and method and display device |
CN113487988A (en) * | 2021-06-23 | 2021-10-08 | 惠科股份有限公司 | Display panel detection method and display panel |
WO2021243800A1 (en) * | 2020-06-02 | 2021-12-09 | Tcl华星光电技术有限公司 | Method and apparatus for analyzing defect of display panel |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1584719A (en) * | 2003-08-19 | 2005-02-23 | 三星电子株式会社 | LCD device |
KR20070075161A (en) * | 2006-01-12 | 2007-07-18 | 삼성전자주식회사 | Liquid crystal display |
US20090167976A1 (en) * | 2007-12-26 | 2009-07-02 | Te-Chen Chung | Array Substrate of Liquid Crystal Display, Method of Repairing Same, and Liquid Crystal Display |
CN101567160A (en) * | 2009-05-31 | 2009-10-28 | 上海广电光电子有限公司 | GIP type liquid crystal display panel and detecting method thereof |
US20120081344A1 (en) * | 2009-06-09 | 2012-04-05 | Sharp Kabushiki Kaisha | Electronic device |
CN102621721A (en) * | 2012-04-10 | 2012-08-01 | 深圳市华星光电技术有限公司 | Liquid crystal panel, liquid crystal module and method for clarifying reasons resulting in poor screen images thereof |
WO2013155757A1 (en) * | 2012-04-16 | 2013-10-24 | 深圳市华星光电技术有限公司 | Circuit structure in line distribution area of liquid crystal display panel and liquid crystal display panel test method |
KR101471391B1 (en) * | 2013-11-08 | 2014-12-10 | (주)넥스틴 | Testing method for oled display device and tester for the same |
CN104916243A (en) * | 2015-06-29 | 2015-09-16 | 深圳市华星光电技术有限公司 | Detection method and device for scan driving circuit and liquid crystal panel |
CN104932164A (en) * | 2015-07-16 | 2015-09-23 | 合肥鑫晟光电科技有限公司 | Array substrate and manufacturing method, testing method, display panel and display device of array substrate |
CN105759521A (en) * | 2016-05-06 | 2016-07-13 | 深圳市华星光电技术有限公司 | Test circuit for liquid crystal display panels with half source driving pixel arrays |
CN106157858A (en) * | 2016-08-31 | 2016-11-23 | 深圳市华星光电技术有限公司 | The test circuit of the gate driver circuit of display panels and method of work thereof |
US20170092209A1 (en) * | 2015-09-25 | 2017-03-30 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Common circuit for goa test and eliminating power-off residual images |
CN107797355A (en) * | 2017-11-27 | 2018-03-13 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display device and its detection method |
CN108873525A (en) * | 2018-07-17 | 2018-11-23 | 深圳市华星光电半导体显示技术有限公司 | A kind of measurement circuit of the grid line of array substrate |
CN109389919A (en) * | 2017-08-08 | 2019-02-26 | 京东方科技集团股份有限公司 | The detection method and device of display panel |
-
2019
- 2019-06-27 CN CN201910572560.7A patent/CN110428760A/en active Pending
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1584719A (en) * | 2003-08-19 | 2005-02-23 | 三星电子株式会社 | LCD device |
KR20070075161A (en) * | 2006-01-12 | 2007-07-18 | 삼성전자주식회사 | Liquid crystal display |
US20090167976A1 (en) * | 2007-12-26 | 2009-07-02 | Te-Chen Chung | Array Substrate of Liquid Crystal Display, Method of Repairing Same, and Liquid Crystal Display |
CN101567160A (en) * | 2009-05-31 | 2009-10-28 | 上海广电光电子有限公司 | GIP type liquid crystal display panel and detecting method thereof |
US20120081344A1 (en) * | 2009-06-09 | 2012-04-05 | Sharp Kabushiki Kaisha | Electronic device |
CN102621721A (en) * | 2012-04-10 | 2012-08-01 | 深圳市华星光电技术有限公司 | Liquid crystal panel, liquid crystal module and method for clarifying reasons resulting in poor screen images thereof |
WO2013155757A1 (en) * | 2012-04-16 | 2013-10-24 | 深圳市华星光电技术有限公司 | Circuit structure in line distribution area of liquid crystal display panel and liquid crystal display panel test method |
KR101471391B1 (en) * | 2013-11-08 | 2014-12-10 | (주)넥스틴 | Testing method for oled display device and tester for the same |
CN104916243A (en) * | 2015-06-29 | 2015-09-16 | 深圳市华星光电技术有限公司 | Detection method and device for scan driving circuit and liquid crystal panel |
CN104932164A (en) * | 2015-07-16 | 2015-09-23 | 合肥鑫晟光电科技有限公司 | Array substrate and manufacturing method, testing method, display panel and display device of array substrate |
US20170092209A1 (en) * | 2015-09-25 | 2017-03-30 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Common circuit for goa test and eliminating power-off residual images |
CN105759521A (en) * | 2016-05-06 | 2016-07-13 | 深圳市华星光电技术有限公司 | Test circuit for liquid crystal display panels with half source driving pixel arrays |
CN106157858A (en) * | 2016-08-31 | 2016-11-23 | 深圳市华星光电技术有限公司 | The test circuit of the gate driver circuit of display panels and method of work thereof |
CN109389919A (en) * | 2017-08-08 | 2019-02-26 | 京东方科技集团股份有限公司 | The detection method and device of display panel |
CN107797355A (en) * | 2017-11-27 | 2018-03-13 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display device and its detection method |
CN108873525A (en) * | 2018-07-17 | 2018-11-23 | 深圳市华星光电半导体显示技术有限公司 | A kind of measurement circuit of the grid line of array substrate |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110570795A (en) * | 2019-09-04 | 2019-12-13 | 深圳市华星光电技术有限公司 | Test method of display panel |
CN110796975A (en) * | 2019-11-25 | 2020-02-14 | Tcl华星光电技术有限公司 | Display panel and display device |
WO2021243800A1 (en) * | 2020-06-02 | 2021-12-09 | Tcl华星光电技术有限公司 | Method and apparatus for analyzing defect of display panel |
CN111795799A (en) * | 2020-06-17 | 2020-10-20 | 深圳市华星光电半导体显示技术有限公司 | Test method and device |
CN112331115A (en) * | 2020-11-05 | 2021-02-05 | 北海惠科光电技术有限公司 | Liquid crystal panel and GOA circuit detection method of liquid crystal panel |
CN112331117A (en) * | 2020-11-05 | 2021-02-05 | 北海惠科光电技术有限公司 | Liquid crystal panel and liquid crystal panel data line voltage detection method |
CN112331120A (en) * | 2020-11-05 | 2021-02-05 | 北海惠科光电技术有限公司 | Array substrate row driving reset circuit and method and display device |
CN112331117B (en) * | 2020-11-05 | 2022-06-03 | 北海惠科光电技术有限公司 | Liquid crystal panel and liquid crystal panel data line voltage detection method |
CN113487988A (en) * | 2021-06-23 | 2021-10-08 | 惠科股份有限公司 | Display panel detection method and display panel |
CN113487988B (en) * | 2021-06-23 | 2022-03-22 | 惠科股份有限公司 | Display panel detection method and display panel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110428760A (en) | A kind of display panel test method, display panel and display device | |
CN110444135B (en) | Display device and detection method thereof and chip on film | |
CN103926767B (en) | Liquid crystal display and detection method thereof | |
CN104965321B (en) | display panel detection system and detection method | |
CN102636928B (en) | Line structure for distributing district of liquid crystal display panel and testing method for liquid crystal display panel | |
US8975905B2 (en) | Display apparatus with reduced number of test lines for array test process and method of testing the same | |
CN105632382A (en) | Display device and method for detecting binding condition of binding area | |
CN110850651B (en) | Display panel and test system | |
TW201020609A (en) | LCD panel having shared shorting bars for array test and panel test | |
US20070064192A1 (en) | Liquid crystal display apparatus | |
CN106847145A (en) | Array base palte test circuit and array base palte | |
KR20030051923A (en) | Liquid crystal panel for testing signal line of line on glass type | |
KR101160076B1 (en) | Film type probe block for testing panel | |
KR101000418B1 (en) | Blade type probe block | |
TW201017191A (en) | Auto prove device and method of testing liquid crystal panel using the same | |
CN103676243B (en) | Array substrate assembly, measurement method of array substrate assembly and display device | |
CN103454794B (en) | Lighting test jig and liquid crystal panel method of testing | |
CN101464575B (en) | Liquid crystal display panel test method | |
JP4661300B2 (en) | LCD module | |
CN106601161A (en) | Liquid crystal display panel and testing method thereof | |
CN102681222B (en) | Method for testing line defect, and liquid crystal display | |
CN106847142A (en) | The detection means and detection method of gate driving circuit | |
KR101146526B1 (en) | Data driving unit of line on glass type LCD and LCD having the same | |
WO2007069818A1 (en) | Detachable integrated probe block | |
CN101359105B (en) | Method for detecting electrical property of conductivity lead wire of glass substrate of liquid crystal display |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |