CN110418483A - A kind of plasma generator, device, implementation method - Google Patents
A kind of plasma generator, device, implementation method Download PDFInfo
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- CN110418483A CN110418483A CN201910616129.8A CN201910616129A CN110418483A CN 110418483 A CN110418483 A CN 110418483A CN 201910616129 A CN201910616129 A CN 201910616129A CN 110418483 A CN110418483 A CN 110418483A
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- 238000000034 method Methods 0.000 title claims abstract description 15
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 81
- 239000007921 spray Substances 0.000 claims description 80
- 238000001514 detection method Methods 0.000 claims description 64
- 229910052802 copper Inorganic materials 0.000 claims description 56
- 239000010949 copper Substances 0.000 claims description 56
- 238000002955 isolation Methods 0.000 claims description 35
- 239000003990 capacitor Substances 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 15
- 230000036470 plasma concentration Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 7
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 120
- 150000002500 ions Chemical class 0.000 description 45
- 230000002787 reinforcement Effects 0.000 description 21
- 230000005611 electricity Effects 0.000 description 10
- 150000001450 anions Chemical class 0.000 description 9
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 7
- 150000001768 cations Chemical class 0.000 description 7
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- 230000001954 sterilising effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000700605 Viruses Species 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000004146 energy storage Methods 0.000 description 2
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- 230000002155 anti-virotic effect Effects 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
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- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
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Abstract
The present invention relates to a kind of plasma generators, device, implementation method, it is related to the technical field of air environmental protection, the loss power for solving big resistance is big, the problem of reducing the efficiency of plasma generation, it includes the discharge electrode for generating plasma, the discharge electrode includes several laminar substrates, several laminar substrates are successively defined as the first laminar substrate, second laminar substrate, ..., N-1 laminar substrate, n-th layer substrate, it is parallel with one another to form odd number distribution capacity two-by-two between adjacent odd layer, it is parallel with one another to form even number distribution capacity two-by-two between neighbouring even-numbered layer, odd number distribution capacity and even number distribution capacity are connected serially in ion generator current supply circuit.The present invention, which has, reduces loss power, improves the effect of the generation efficiency of plasma.
Description
Technical field
The present invention relates to the technical fields of air environmental protection, more particularly, to a kind of plasma generator, implementation method.
Background technique
Common air cleaning can only reduce PM2.5, when removing odors, mainly use charcoal bag, or using clear
The cover of pastil progress peculiar smell.
It is then main using spray and ozone sterilization for killing virus.Spray is mainly used for some pairs of exigent fields of antivirus
It closes, carries out operation when generally requiring in nobody.And ozone sterilizing, it is also used for going in nobody occasion, such as refrigerator
Taste or nobody some factory floors etc..
And cation and anion can be released energy, can be decomposed in most of air when burying in oblivion mutually in air
Organic matter can achieve the effect for de-tasting, killing bacterial virus.This positive and negative ion we be known as plasma.
Generally there are two types of methods for the generation of conventional plasma.
The first generates plasma using DC high-voltage.Every under certain safe distance, putting an anion respectively
Generator and a cation generator, positive and negative ion all uses the power supply of high direct voltage, and is generated by ionized air
Ion.
Second using AC high voltage generation plasma.High pressure both ends using wire or metal needle as electrode,
It is discharged by medium (generally glass or air), positive and negative ion is alternately discharged in discharge end, to generate plasma.
By the way of DC high-voltage, because positive and negative ion distance is farther out, the probability buried in oblivion is low, and a large amount of ion
All absorbed by the earth and other objects without effect, therefore low efficiency.Meanwhile it being had accumulated around the spray point for generating ion
A large amount of ions cause total ion concentration not high so that new ion be prevented to generate, so whole efficiency is very low, therefore, direct current
The mode of high-voltage electricity is not suitable in actual production and processing.
By the way of AC high voltage, due to discharging positive and negative ion simultaneously, the distance of positive and negative ion is very short, easily
Generation is buried in oblivion, to greatly improve the efficiency for de-tasting and sterilizing, but simultaneously as high pressure both ends distance is close, the breakdown of medium
Effect can generate biggish breakdown current, to generate a large amount of ozone, high-concentrated ozone is harmful to the human body.
Prior art among the above has the following deficiencies:
By way of reducing discharge current, the generation of ozone can be reduced, makes electric discharge always in ionic discharge and compared with low energy
The corona discharge state of grade.And discharge current is tens microamperes, and big resistance is needed to connect in discharge loop, and still, big resistance
Loss power it is big, reduce plasma generation efficiency, there is room for improvement.
Summary of the invention
The first object of the present invention is to provide a kind of plasma generator, will reduce loss power, improves plasma
Generation efficiency.
Foregoing invention purpose of the invention has the technical scheme that
A kind of plasma generator, including the discharge electrode for generating plasma, the discharge electrode includes several laminar substrates, if will
Dried layer substrate be successively defined as the first laminar substrate, the second laminar substrate ..., N-1 laminar substrate, n-th layer substrate, adjacent odd layer it
Between it is parallel with one another to form odd number distribution capacity two-by-two, it is parallel with one another to form even number distribution electricity two-by-two between neighbouring even-numbered layer
Hold, odd number distribution capacity and even number distribution capacity are connected serially in ion generator current supply circuit.
By using above-mentioned technical proposal, by the generation of distribution capacity, thus instead of the use of resistance, meanwhile, electricity
Resistance belongs to energy consumption component, and capacitor belongs to energy storage component, therefore in electric appliance for the use of, and capacitor will not consume electric energy,
Once using high-voltage capacitance, since the volume of high-voltage capacitance is big, price is high, in order to reduce influence of the distribution capacity to electric discharge, electricity
Appearance must be put in close to discharge end, to can stop air duct again, and used the state of the distribution capacity between substrate, then reduced
Area, and distribution capacity is present in by two there are between the conductor of voltage difference and mutually insulated, therefore in any circuit, appoints
What two there are can all form distribution capacity between the insulated electric conductor of pressure difference, to play reduction loss power, improve etc. from
The effect of the generation efficiency of son.
The present invention is further arranged to: the substrate is provided with 4 layers, and the first laminar substrate and third laminar substrate pass through via hole simultaneously
For connection to generate the first distribution capacity, the second laminar substrate is in parallel to generate the second distribution capacity by via hole with the 4th laminar substrate, the
One distribution capacity and the second distribution capacity are connected serially in ion generator current supply circuit.
By using above-mentioned technical proposal, using 4 layers of substrate, so that 2 groups of distribution capacity are generated, by two groups of distribution capacity
Parallel connection is carried out, to improve capacitance, then is connected serially in current supply circuit and carries out using practical.
The present invention is further arranged to: first laminar substrate include first cover copper group, discharge lines on first, with first on
First lower discharge lines of discharge lines cooperation are set to first through hole on first between discharge lines and the first lower discharge lines, first
Cover copper sheet；
Second laminar substrate includes the second through-hole, the second copper-clad piece that second copper-clad group and first through hole are arranged in correspondence with each other；
The third laminar substrate includes that third covers copper group, the third through-hole being arranged in correspondence with each other with the second through-hole and second copper-clad
The one-to-one third of piece covers copper sheet；
4th laminar substrate include the corresponding with second copper-clad group the 4th cover copper group, discharge lines on the 4th, with the 4th on discharge
The 4th of line cooperation descends discharge lines, is set to the fourth hole on the 4th between discharge lines and the 4th lower discharge lines, and the described 4th
Lower discharge lines are covered copper group with the 4th and are connect；
Discharge lines correspond in discharge lines and the 4th on described first, and the described first lower discharge lines and the 4th lower discharge lines are one by one
It is corresponding；
First lower discharge lines are covered copper group with second copper-clad group, the 4th and are connect, discharge lines and second copper-clad piece, third on described first
Cover copper sheet, discharge lines connection on the 4th.
By using above-mentioned technical proposal, copper group is covered in use first and first covers copper sheet progress conduction, discharge lines on first
It is discharged with the first lower discharge lines by first through hole, to bury in oblivion for cation and the mutual of anion, the first laminar substrate
It is consistent with the principle of the 4th laminar substrate, and the second laminar substrate and third laminar substrate are attached and the first laminar substrate or the 4th in parallel
Laminar substrate, to improve the size of distribution capacity.
The present invention is further arranged to: further including the ion detection component for detecting ionic weight；
The ion detection component includes for generating the generation layer of plasma, the detection layers for detecting ion.
By using above-mentioned technical proposal, the generation of plasma is carried out by the way that layer occurs, and is passing through detection layers to plasma
Amount detected, improve whole accuracy in detection, it is practical.
The present invention is further arranged to: the ion detection component further includes the reinforcement for improving plasma yield
Layer.
By using above-mentioned technical proposal, the plasma amount since layer occurs generates limited, additional enhancement layer progress
The generation of plasma to improve the yield of plasma, and synchronizes detection for detection layers, improves the accuracy of detection
And efficiency.
The present invention is further arranged to: the generation layer includes first layer generating plate, second layer generating plate, third layer generation
Plate, the 4th layer of generating plate,
The first layer generating plate include first cover copper portion, occur on first spray point, with first on generation spray point match
The lower generation spray point of first closed, first be set on first between generation spray point and the first lower generation spray point are fallen into oblivion
Go out hole, the first generation electrode slice, the first generation isolation channel being set between the first generation electrode slice；
The second layer generating plate includes second covering copper portion, burying in oblivion the second generation that hole is arranged in correspondence with each other with first
Bury in oblivion hole, isolation channel occurs with the first generation isolation channel corresponding second；
The third layer generating plate includes that third covers copper portion, buries in oblivion the third generation that hole is arranged in correspondence with each other with second
Bury in oblivion hole, isolation channel occurs with second, and isolation channel occurs for corresponding third；
The 4th layer of generating plate includes covering copper portion the corresponding 4th with second to cover copper portion, discharge on the 4th
Needle, with the 4th on the 4th lower generation spray point of spray point cooperation occurs, be set on the 4th and spray point occurs issued with the 4th
The 4th between raw spray point bury in oblivion hole, the 4th generation electrode slice, be set to the 4th and occur between electrode slice and and third
Isolation channel the corresponding 4th occurs, isolation channel occurs；
Described first covers copper portion covers copper portion and connect with the first lower generation spray point, third, and described first occurs electrode
Piece is connect with the 4th generation electrode slice, and spray point occurs on described first and connect with generation spray point on the 4th；
Occur that spray point one-to-one correspondence occurs on spray point and the 4th on described first, the described first lower generation spray point and the 4th
Lower generation spray point corresponds.
By using above-mentioned technical proposal, it is similar to the principle of discharge electrode to occur layer, by the first lower generation spray point with
Spray point occurs on first, spray point occurs on the 4th lower generation spray point and the 4th is buried in oblivion mutually, thus offer etc. from
Son.
The present invention is further arranged to: further including the control assembly for controlling ion detection component, the control assembly
Obtain preset forward voltage information or backward voltage information；
It layer occurs forms corresponding plasma to control according to forward voltage information or backward voltage information and controls default
Corresponding plasma is blown to detection layers by blower；
Corresponding plasma concentration is detected and forms corresponding detection current information by detection layers.
By using above-mentioned technical proposal, by the setting of control assembly, thus to forward voltage information and backward voltage
The acquisition of information is simultaneously controlled, and is kept entirety more intelligent, is improved the generation efficiency of plasma.
The second object of the present invention is to provide a kind of plasma generator arrangement, will reduce loss power, improve etc. from
The generation efficiency of son.
Foregoing invention purpose of the invention has the technical scheme that
A kind of plasma generator arrangement, including upper mounting plate, lower installation board, discharge electrode be provided with it is several and in be equally spaced in
Between upper mounting plate and lower installation board, discharge electrode is installed on one end of upper mounting plate, and the other end of upper mounting plate is equipped with control
Component and between upper mounting plate and lower installation board, from discharge electrode to control assembly direction be sequentially installed with enhancement layer, occur layer,
Detection layers, and layer, detection layers, enhancement layer occurs and is all set between upper mounting plate and lower installation board.
By using above-mentioned technical proposal, by the setting of upper mounting plate and lower installation board, thus by discharge electrode, control group
Part, generation layer, detection layers, enhancement layer are installed, and whole integrality is improved, practical.
The third object of the present invention is to provide a kind of implementation method of plasma generator, will reduce loss power, improves
The generation efficiency of plasma.
Foregoing invention purpose of the invention has the technical scheme that
A kind of implementation method of plasma generator, discharge electrode include several laminar substrates, and several laminar substrates are successively defined as
One laminar substrate, the second laminar substrate ..., N-1 laminar substrate, n-th layer substrate, it is parallel with one another to be formed two-by-two between adjacent odd layer
Odd number distribution capacity, it is parallel with one another to form even number distribution capacity, odd number distribution capacity and idol two-by-two between neighbouring even-numbered layer
Number distribution capacity is connected serially in ion generator current supply circuit.
By using above-mentioned technical proposal, by the generation of distribution capacity, thus instead of the use of resistance, meanwhile, electricity
Resistance belongs to energy consumption component, and capacitor belongs to energy storage component, therefore in electric appliance for the use of, and capacitor will not consume electric energy,
Once using high-voltage capacitance, since the volume of high-voltage capacitance is big, price is high, in order to reduce influence of the distribution capacity to electric discharge, electricity
Appearance must be put in close to discharge end, to can stop air duct again, and used the state of the distribution capacity between substrate, then reduced
Area, and distribution capacity is present in by two there are between the conductor of voltage difference and mutually insulated, therefore in any circuit, appoints
What two there are can all form distribution capacity between the insulated electric conductor of pressure difference, to play reduction loss power, improve etc. from
The effect of the generation efficiency of son.
The present invention is further arranged to: the control method of the control assembly is as follows:
Obtain preset forward voltage information or backward voltage information；
It layer occurs forms corresponding plasma to control according to forward voltage information or backward voltage information and controls default
Corresponding plasma is blown to detection layers by blower；
Corresponding plasma concentration is detected and forms corresponding detection current information by detection layers.
By using above-mentioned technical proposal, by the setting of control assembly, thus to forward voltage information and backward voltage
The acquisition of information is simultaneously controlled, and is kept entirety more intelligent, is improved the generation efficiency of plasma.
In conclusion advantageous effects of the invention are as follows:
1. reducing loss power, the generation efficiency of plasma is improved；
2. saving space, component is saved.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of plasma generator arrangement.
Fig. 2 is the schematic diagram of 4 laminar substrates of discharge electrode.
Fig. 3 is the structural schematic diagram of discharge electrode.
Fig. 4 is the structural schematic diagram that layer occurs.
Fig. 5 is the structural schematic diagram of enhancement layer.
Fig. 6 is the structural scheme of mechanism of detection layers.
Fig. 7 is the circuit block diagram of control assembly.
In figure, 1, control assembly；2, discharge electrode；20, the first laminar substrate；201, first covers copper group；202, it discharges on first
Line；203, the first lower discharge lines；204, first through hole；205, first covers copper sheet；21, the second laminar substrate；211, second copper-clad group；
212, the second through-hole；213, second copper-clad piece；22, third laminar substrate；221, third covers copper group；222, third through-hole；223,
Three cover copper sheet；23, the 4th laminar substrate；231, the 4th covers copper group；232, discharge lines on the 4th；233, the 4th lower discharge lines；234,
Fourth hole；3, ion detection component；31, layer occurs；311, first layer generating plate；3111, first covers copper portion；3112,
Spray point occurs on first；3113, the first lower generation spray point；3114, first buries in oblivion hole；3115, first occurs electrode
Piece；3116, first occurs isolation channel；312, second layer generating plate；3121, second covers copper portion；3122, second buries in oblivion
Hole；3123, second occurs isolation channel；313, third layer generating plate；3131, third covers copper portion；3132, third is buried in oblivion
Hole；3133, isolation channel occurs for third；314, the 4th layer of generating plate；3141, the 4th covers copper portion；3142, it puts on the 4th
Acusector；3143, the 4th lower generation spray point；3144, the 4th buries in oblivion hole；3145, the 4th occurs electrode slice；3146, the 4th
Isolation channel occurs；32, detection layers；321, the first detection plate；3211, copper portion is covered in the first detection；322, the second detection plate；3221,
Copper portion is covered in first detection；33, enhancement layer；331, first layer stiffening plate；3311, first reinforces covering copper portion；3312, reinforce on first
Spray point；3313, the first lower reinforcement spray point；3314, first reinforces burying in oblivion hole；3315, the first intensifier electrode piece；3316,
One reinforces isolation channel；332, second layer stiffening plate；3321, second reinforces covering copper portion；3322, second reinforces burying in oblivion hole；3323,
Two reinforce isolation channel；333, third layer stiffening plate；3331, copper portion is covered in third reinforcement；3332, hole is buried in oblivion in third reinforcement；3333,
Three reinforce isolation channel；334, the 4th layer of stiffening plate；3341, the 4th reinforces covering copper portion；3342, reinforce spray point on the 4th；3343,
4th lower reinforcement spray point；3344, the 4th reinforces burying in oblivion hole；3345, the 4th intensifier electrode piece；3346, the 4th reinforces isolation channel；
4, upper mounting plate；5, lower installation board；61, the first via hole；62, the second via hole.
Specific embodiment
Below in conjunction with attached drawing, invention is further described in detail.
It referring to Fig.1, is a kind of plasma generator arrangement disclosed by the invention, including upper mounting plate 4, lower installation board 5, control
Component 1 processed, ion detection component 3, discharge electrode 2.Ion detection component 3 is for detecting ionic weight and including layer 31 occurs, reinforces
Layer 33, detection layers 32.Layer 31 occurs for generating plasma, detection layers 32 are for detecting ion, and enhancement layer 33 is for raising etc.
Ion generation amount, control assembly 1 is for controlling ion detection component 3.
In the present embodiment, preferably 4 laminar substrates, the first laminar substrate 20 and third laminar substrate 22 are in parallel to generate by via hole
First distribution capacity, the second laminar substrate 21 and the 4th laminar substrate 23 are in parallel to generate the second distribution capacity by via hole, and first point
Cloth capacitor and the second distribution capacity are connected serially in ion generator current supply circuit.The original of distribution capacity is had using pcb board interlayer
Reason, has done 4 layers of conductor planes on 4 laminar substrates, and the distribution capacity between every layer is in parallel, forms a biggish capacitor,
This capacitor is connected into discharge loop again.Conductor planes i.e. first covers copper group 201, second copper-clad group 211, third and covers copper group
221, the 4th covers copper group 231.
Upper mounting plate 4, lower installation board 5, control assembly 1, generation layer 31, enhancement layer 33, detection layers 32, discharge electrode 2 are
Pcb board, upper mounting plate 4, control assembly 1, occur layer 31, enhancement layer 33, detection layers 32, weld on discharge electrode 2 lower installation board 5
It is connected to electronic component.And plug together being welded and fixed by solder stick and soldering iron from each other.Welding and fixed mode category
In the common knowledge of those skilled in the art, this will not be repeated here.
Discharge electrode 2 is provided with several, and is preferably 8 pieces in the present embodiment, and in being equally spaced simultaneously between 8 pieces of discharge electrodes 2
It is installed between upper mounting plate 4 and lower installation board 5, and discharge electrode 2, control assembly 1, generation layer 31, detection layers 32, enhancement layer 33
It is orthogonal with upper mounting plate 4 and lower installation board 5.From discharge electrode 2 to 1 direction of control assembly be sequentially installed with enhancement layer 33,
Layer 31, detection layers 32 occurs.
Atmospherical discharges mainly have the modes such as ionic discharge, corona discharge, spark discharge, by discharging in the case that voltage is certain
Electric current determines discharge mode, ion is all generated from ionic discharge to spark discharge, the corona that ozone typically occurs in high-energy is put
Electricity and spark discharge.
In order to reduce ozone, by the way of reducing discharge current, make electric discharge always in ionic discharge and lower level
Corona discharge.Since discharge current is very small, only tens microamperes, the general side using the series resistance in discharge loop
Formula, but due to needing biggish resistance, loss power is very big, and efficiency is very low.Because being ac high-voltage, in order to solve efficiency
Resistance is changed to capacitor by low problem, due to itself not consuming power on capacitor theory, can greatly improve efficiency.But it is high
Voltage capacitance volume is big, and price is high, and in order to reduce influence of the distribution capacity to electric discharge, capacitor must be put in close to discharge end, thus
It can stop air duct again.Therefore using high insulating materials pcb board as ion generator.
Referring to shown in Fig. 2, plasma generator includes the discharge electrode 2 for generating plasma, and discharge electrode 2 includes several
Laminar substrate, by several laminar substrates be successively defined as the first laminar substrate 20, the second laminar substrate 21 ..., N-1 laminar substrate, n-th layer base
Plate, it is parallel with one another to form odd number distribution capacity two-by-two between adjacent odd layer, between neighbouring even-numbered layer two-by-two it is parallel with one another with
Even number distribution capacity is formed, odd number distribution capacity and even number distribution capacity are connected serially in ion generator current supply circuit.
First covers copper group 201, third covers 221 space crossings of copper group, and second copper-clad group the 211, the 4th covers the friendship of the interval of copper group 231
Fork.It is connected by 61 first laminar substrate 20 of the first via hole with third laminar substrate 22, by the second via hole 62 the second laminar substrate 21
It is connected with the 4th laminar substrate 23, so that the capacitor formed is connected with discharge lines, increase machining area, and discharge lines 202 on first,
First lower discharge lines 203 are set to one side, and discharge lines 232, the 4th lower discharge lines 233 are set to another side on the 4th, make positive and negative
Two sides, which all synchronizes, buries in oblivion, and carries out electric discharge using 3 groups in the present embodiment and buries in oblivion, while also can according to need, can be random
Increase or reduce the quantity of discharge lines.And electrode A and electrode C connect high pressure both ends and are powered.It is attached using via hole
Mode belongs to the common knowledge of those skilled in the art, and this will not be repeated here.
It sinks in discharge lines 233 under discharge lines the 232, the 4th in discharge lines the 203, the 4th under discharge lines 202, first on first
Gold prevents discharge electrode by electrion calcination, extends the service life.And can only discharge on one of the electrodes from a point when discharging,
He will not discharge in place, therefore discharge lines 202, first are descended in discharge lines the 203, the 4th under discharge lines the 232, the 4th in use first
Discharge lines 233, then can be at it elsewhere apart from closer if a place, by calcination, the distance of two electrodes will increase
He discharges in place, can so greatly increase the service life.
Pcb board material uses FR-4 grade, and medium 1mm pressure resistance is 35KV, and every layer of dielectric thickness is 0.2mm, and pressure resistance is
7KV, much higher than real work voltage 2KV or so, it can be ensured that safety is not in punch-through.By actual measurement, using capacitor
In the case where same ionic weight and electric discharge number of poles, input power only uses 20% or so of conductive discharge, greatly improves for electric discharge
Circuit cost is reduced while efficiency.
Referring to shown in Fig. 3, the first laminar substrate 20 include first cover discharge lines 202 in copper group 201, first, with first on put
The lower discharge lines 203 of the first of the cooperation of electric wire 202, first be set on first between discharge lines 202 and the first lower discharge lines 203
Through-hole 204, first cover copper sheet 205.First lower discharge lines 203 and the 4th lower discharge lines 233 correspond, discharge lines on first
Discharge lines 232 correspond on 202 and the 4th.
Second laminar substrate 21 include second copper-clad group 211, the second through-hole 212 being arranged in correspondence with each other with first through hole 204,
Second copper-clad piece 213.
Third laminar substrate 22 include third cover copper group 221, the third through-hole 222 being arranged in correspondence with each other with the second through-hole 212,
Copper sheet 223 is covered with the one-to-one third of second copper-clad piece 213.
4th laminar substrate 23 include the corresponding with second copper-clad group 211 the 4th cover discharge lines 232 in copper group the 231, the 4th, with
Discharge lines 232 cooperate on 4th the 4th lower discharge lines 233, be set on the 4th under discharge lines 232 and the 4th discharge lines 233 it
Between fourth hole 234, the 4th lower discharge lines 233 cover copper group 231 with the 4th and connect.
First lower discharge lines 203 are covered copper group 231 with second copper-clad group the 211, the 4th and are connect, discharge lines 202 and the on first
Two cover copper sheet 213, third is covered discharge lines 232 on copper sheet the 223, the 4th and connected.
Pressing is fixed mutually between 4 laminar substrates, pcb board can for it is double-deck, four layers etc., the multilayer manufacture of pcb board belongs to this
The common knowledge of field technical staff, this will not be repeated here.
Referring to shown in Fig. 4, it includes first layer generating plate 311, second layer generating plate 312, third layer generating plate that layer 31, which occurs,
313, the 4th layer of generating plate 314.The principle that the generation plasma of layer 31 occurs is consistent with the principle of discharge electrode 2, and this will not be repeated here.
First layer generating plate 311, second layer generating plate 312, third layer generating plate 313, the 4th layer of generating plate 314 are formed for Compound Machining
Pcb board.
First layer generating plate 311 include first cover in copper portion 3111, first generation spray point 3112, with first on send out
First lower generation spray point 3113 of the life cooperation of spray point 3112 is set to generation spray point 3112 and the first lower generation on first
First between spray point 3113, which buries in oblivion hole 3114, first, occurs electrode slice 3115, is set to the first generation electrode slice
First between 3115 occurs isolation channel 3116.
Second layer generating plate 312 includes second covering copper portion 3121, burying in oblivion hole 3114 with first and set in correspondence with each other
Second set buries in oblivion hole 3122, isolation channel 3123 occurs with the first generation isolation channel 3116 corresponding second.
Third layer generating plate 313 includes that third covers copper portion 3131, buries in oblivion hole 3122 with second and set in correspondence with each other
The third set buries in oblivion hole 3132, isolation channel 3123 occurs with second, and isolation channel 3133 occurs for corresponding third.
4th layer of generating plate 314 includes covering copper portion 3121 the corresponding 4th with second to cover copper portion the 3141, the 4th
It is upper to occur that the spray point 3142 cooperates the 4th lower generation spray point 3143 occurs on spray point 3142 and the 4th, be set to the 4th
Upper the 4th occurred between spray point 3142 and the 4th lower generation spray point 3143 buries in oblivion hole the 3144, the 4th and electrode slice occurs
3145, it is set between the 4th generation electrode slice 3145 and isolation channel 3133 the corresponding 4th occurs with third and isolation channel occurs
3146。
First covers copper portion 3111 covers copper portion 3131 and connect with the first lower generation spray point 3113, third, and first
Electrode slice 3115 occurs to connect with the 4th generation electrode slice 3145, occurs that spray point occurs on spray point 3112 and the 4th on first
3142 connect, and occur that the one-to-one correspondence of spray point 3142 occurs on spray point 3112 and the 4th on first, the first lower generation spray point
Generation spray point 3143 corresponds under 3113 and the 4th.
Referring to Figure 5, enhancement layer 33 includes first layer stiffening plate 331, second layer stiffening plate 332, third layer stiffening plate
333, the 4th layer of stiffening plate 334.The principle that enhancement layer 33 generates plasma is consistent with the principle of discharge electrode 2, and this will not be repeated here.
First layer stiffening plate 331, second layer stiffening plate 332, third layer stiffening plate 333, the 4th layer of stiffening plate 334 are formed for Compound Machining
Pcb board.
First layer stiffening plate 331 is reinforced covering including first to be reinforced adding on spray point 3312 and first in copper portion 3311, first
First lower reinforcement spray point 3313 of the strong cooperation of spray point 3312 is set on first and reinforces reinforcing under spray point 3312 and first
First between spray point 3313 reinforces burying in oblivion hole 3314, the first intensifier electrode piece 3315, being set to the first intensifier electrode piece
First between 3315 reinforces isolation channel 3316.
Second layer stiffening plate 332 includes second reinforcing covering copper portion 3321, burying in oblivion hole 3314 with the first reinforcement and set in correspondence with each other
Second set is reinforced burying in oblivion hole 3322, reinforces isolation channel 3323 with the first reinforcement isolation channel 3316 corresponding second.
Third layer stiffening plate 333 includes that third reinforcement covers copper portion 3331, buries in oblivion hole 3322 with the second reinforcement and set in correspondence with each other
Hole 3332 is buried in oblivion in the third reinforcement set, reinforcing isolation channel 3323 with second, corresponding third reinforces isolation channel 3333.
4th layer of stiffening plate 334 includes covering copper portion 3321 the corresponding 4th with the second reinforcement to reinforce covering copper portion the 3341, the 4th
It is upper to reinforce reinforcing the spray point 3342 cooperates the 4th lower reinforcement spray point 3343 on spray point 3342 and the 4th, be set to the 4th
Upper the 4th reinforced between spray point 3342 and the 4th lower reinforcement spray point 3343 reinforces burying in oblivion hole 3344, the 4th intensifier electrode piece
3345, it is set between the 4th intensifier electrode piece 3345 and reinforces isolation channel 3333 the corresponding 4th with third and reinforce isolation channel
3346。
First reinforcement covers copper portion 3311 and covers copper portion 3331 with the first lower reinforcement spray point 3313, third reinforcement and connect, and first
Upper reinforcement spray point 3312 is connect with reinforcement spray point 3342 on the 4th, reinforces reinforcing putting on spray point 3312 and the 4th on first
Acusector 3342 corresponds, and the first lower reinforcement spray point 3313 and the 4th lower reinforcement spray point 3343 correspond.
Referring to shown in Fig. 6, detection layers 32 include the first detection plate 321, the second detection plate 322.First detection plate 321 and
Two detection plates 322 are to be compounded to form pcb board.And first is provided with the first detection in detection plate 321 and covers copper portion 32213211, second
It is provided with the second detection in detection plate 322 and covers copper portion.Electronic component is also welded in detection plate.
Control assembly 1 obtains preset forward voltage information or backward voltage information；
It layer 31 occurs forms corresponding plasma to control according to forward voltage information or backward voltage information and controls and preset
Blower corresponding plasma is blown to detection layers 32；
Corresponding plasma concentration is detected and forms corresponding detection current information by detection layers 32
Referring to shown in Fig. 4-6, electrode X and the connected copper tow sides of electrode Y have, and all exposed, do not cover green oil.Electricity
Pole Y send single-chip microcontroller after connecing operational amplifier amplification.Electrode X in Fig. 4 is connected with the electrode X in Fig. 5,6, and electrode Y is in Fig. 4
In the encirclement of 3 plate electrode X.In Fig. 5, the connected copper of electrode X only has front to have, and exposed not lid green oil outside.
When electrode X passes through single-chip microcontroller control ± 12V controller output+12V, the plasma that ion generator generates is by wind
When blowing over the space between 3 plates, anion is absorbed by electrode X, and cation is ostracised, and is absorbed by electrode Y, and electrode Y generates one
Positive current over the ground.
As electrode X input -12V, cation is absorbed, and anion is absorbed by electrode Y, and electrode Y generates one and bears over the ground
Electric current.Voltage is converted to after electrode Y amplifies earth-current by operational amplifier and is sent to MCU processing, and MCU is according to voltage change
The value of negative ions amount can be calculated, to be accurately controlled ionic weight size.
In Fig. 6, the connected copper of electrode X only has reverse side to have, not lid green oil.Other are facade element, and RC2 and RC1 are temperature-sensitive
Resistance measures used in temperature, and R3 is that heating resistor and RC1 connect together.The power of R3 is fixed, and when wind speed is high, temperature rise is small,
Wind speed hour, Wen Shenggao.The temperature of RC2 measurement room temperature, this temperature and RC1 compare, and can measure the size of wind speed.MCU root
According to wind speed size, it can be closed in low wind speeds reduction ionic weight, blowing-out and not generate ion.
Referring to shown in Fig. 7,12V power supply provides power supply for complete machine.5V Voltage stabilizing module provides power supply for MCU.Short-circuit protection exists
When high-pressure section has short circuit to occur, MCU is transmitted a signal to by sample resistance, to make protection, the danger for preventing high pressure from occurring
Danger.Over-and under-voltage is protected when supply voltage is excessively high or too low, is sent sampled signal to MCU, is made stoppage protection.
- 12V conversion circuit exports -12V voltage to ± 12V conversion module by a DC-DC converter.± 12V conversion
Module controls output+12V voltage or -12V voltage according to MCU.PWM regulated power supply is controlled by MCU, determines the how many electricity of output
It presses to high pressure generator.High pressure generator generates high pressure using the 30KHZ push-pull signal of MCU output, and high pressure size is adjustable by PWM
The power supply control of power supply output, voltage is higher, and high pressure is higher.
High pressure generator is boosted by transformer, is isolated between primary and secondary, and secondary high pressure terminates ion plate electrode A and electrode
C.Because high pressure needed for negative ions generate is different, it is influenced bigger by temperature humidity, and general anion is easier
It generates, in order to guarantee that negative ions size is similar, electrode C is connect into high pressure and is filtered over the ground, connects one 102 high-voltage electricity over the ground
Hold, this capacitor can make the ion of output more stable, while guarantee that negative ions size is similar, to form plasma.
Concrete principle be when export anion it is high when, a large amount of anions by air release, transformer secondary output end can generate one it is right
Ground positive current, this electric current form a direct-flow positive voltage over the ground, the friendship of this positive voltage and transformer secondary output to capacitor charging
High pressure superposition is flowed, so that high voltage discharge electrode is rectified high pressure and increases, negative high voltage is reduced, so that cation be made to increase, anion is reduced, directly
Reach balance.Situation is exactly the opposite when cation is high.Negative ions quantity is essentially identical after reaching balance.
The signal of ion plate and ion inductor integrated board feedback is sent to MCU processing, leads to after amplifying by operational amplifier
It crosses the measurement to ionic weight size and constantly adjusts PWM regulated power supply voltage, finally adjust high pressure, to control plasma size.
Measuring wind speed measures wind speed size, and ion generator, while measuring wind speed are closed when wind speed becomes smaller or stops
On thermistor can also measure environment temperature, ion is also switched off when being in extreme environment and (for example is exposed to the sun under sun in summer
Automobile).Humidity measurement uses humidity sensor, tests ambient humidity.When humidity is too high, for example 90% or more when, (washes in bathroom
When bath), it is difficult to generate ion, plasma efficiency can decline, and at this moment can close plasma, Wait-to-Restore.
Based on the same inventive concept, the embodiment of the present invention provides a kind of implementation method of plasma generator, including electric discharge
Plate 2 include several laminar substrates, by several laminar substrates be successively defined as the first laminar substrate 20, the second laminar substrate 21 ..., N-1 layers
Substrate, n-th layer substrate, it is parallel with one another to form odd number distribution capacity two-by-two between adjacent odd layer, two between neighbouring even-numbered layer
Two is parallel with one another to form even number distribution capacity, and odd number distribution capacity and even number distribution capacity are connected serially to ion generator confession
In electrical circuit.
Based on the same inventive concept, the embodiment of the present invention provides a kind of implementation method of plasma generator, control assembly 1
Control method it is as follows:
Obtain preset forward voltage information or backward voltage information；
It layer 31 occurs forms corresponding plasma to control according to forward voltage information or backward voltage information and controls and preset
Blower corresponding plasma is blown to detection layers 32；
Corresponding plasma concentration is detected and forms corresponding detection current information by detection layers 32.
The embodiment of present embodiment is presently preferred embodiments of the present invention, not limits protection of the invention according to this
Range, therefore: the equivalence changes that all structures under this invention, shape, principle are done, should all be covered by protection scope of the present invention it
It is interior.
Claims (10)
1. a kind of plasma generator, which is characterized in that including the discharge electrode (2) for generating plasma, the discharge electrode (2)
Including several laminar substrates, by several laminar substrates be successively defined as the first laminar substrate (20), the second laminar substrate (21) ..., N-1 layers
Substrate, n-th layer substrate, it is parallel with one another to form odd number distribution capacity two-by-two between adjacent odd layer, two between neighbouring even-numbered layer
Two is parallel with one another to form even number distribution capacity, and odd number distribution capacity and even number distribution capacity are connected serially to ion generator confession
In electrical circuit.
2. a kind of plasma generator according to claim 1, it is characterised in that: the substrate is provided with 4 layers, first layer
Substrate (20) and third laminar substrate (22) are in parallel to generate the first distribution capacity by via hole, the second laminar substrate (21) with the 4th layer
Substrate (23) generates the second distribution capacity by via hole parallel connection, and the first distribution capacity and the second distribution capacity are connected serially to ion hair
In raw device current supply circuit.
3. a kind of plasma generator according to claim 2, it is characterised in that: first laminar substrate (20) includes the
One cover copper group (201), discharge lines (202) on first, with first on discharge lines (202) cooperation first lower discharge lines (203), set
The first through hole (204) that is placed between discharge lines on first (202) and first lower discharge lines (203), first cover copper sheet (205)；
Second laminar substrate (21) include second copper-clad group (211), be arranged in correspondence with each other with first through hole (204) it is second logical
Hole (212), second copper-clad piece (213)；
The third laminar substrate (22) includes that third is covered copper group (221), led to the third that the second through-hole (212) are arranged in correspondence with each other
Copper sheet (223) are covered with second copper-clad piece (213) one-to-one third in hole (222)；
4th laminar substrate (23) include the corresponding with second copper-clad group (211) the 4th cover copper group (231), discharge lines on the 4th
(232), with the 4th on discharge lines (232) cooperation the 4th lower discharge lines (233), be set on the 4th discharge lines (232) and the
Copper group (231) are covered even with the 4th in fourth hole (234) between four lower discharge lines (233), the described 4th lower discharge lines (233)
It connects；
Discharge lines (232) correspond in discharge lines (202) and the 4th on described first, described first lower discharge lines (203) with
4th lower discharge lines (233) correspond；
First lower discharge lines (203) are covered copper group (231) with second copper-clad group (211), the 4th and are connect, discharge lines on described first
(202) cover that copper sheet (223), discharge lines (232) are connect on the 4th with second copper-clad piece (213), third.
4. a kind of plasma generator according to claim 1, it is characterised in that: further include for detect ionic weight from
Sub- detection components (3)；
The ion detection component (3) includes for generating the generation layer (31) of plasma, the detection layers for detecting ion
(32)。
5. a kind of plasma generator according to claim 4, it is characterised in that: the ion detection component (3) is also wrapped
Include the enhancement layer (33) for improving plasma yield.
6. a kind of plasma generator according to claim 4, it is characterised in that: the generation layer (31) includes first layer
Generating plate (311), second layer generating plate (312), third layer generating plate (313), the 4th layer of generating plate (314),
The first layer generating plate (311) includes first covering copper portion (3111), spray point (3112) occurring on first and the
First lower generation spray point (3113) of spray point (3112) cooperation occur on one, are set to generation spray point (3112) on first
First between first lower generation spray point (3113) buries in oblivion hole (3114), the first generation electrode slice (3115), setting
Occur first between electrode slice (3115) in first and isolation channel (3116) occur；
The second layer generating plate (312) covers copper portion (3121) including second, buries in oblivion hole (3114) with first mutually
Second be correspondingly arranged buries in oblivion hole (3122), isolation channel occurs with the first generation isolation channel (3116) corresponding second
(3123)；
The third layer generating plate (313) includes that third covers copper portion (3131), buries in oblivion hole (3122) with second mutually
The third being correspondingly arranged buries in oblivion hole (3132), isolation channel (3123) occur with second, and isolation channel occurs for corresponding third
(3133)；
The 4th layer of generating plate (314) includes covering copper portion (3121) the corresponding 4th with second to cover copper portion
(3141), occur on the 4th spray point (3142), with the 4th on the 4th lower generation spray point of spray point (3142) cooperation occurs
(3143), the 4th occurred on the 4th between spray point (3142) and the 4th lower generation spray point (3143) is set to bury in oblivion
Hole (3144), the 4th occur electrode slice (3145), are set between the 4th generation electrode slice (3145) and are isolated with third
Isolation channel (3146) occur for slot (3133) the corresponding 4th；
Described first, which covers copper portion (3111), covers copper portion (3131) even with first lower generation spray point (3113), third
It connects, described first occurs electrode slice (3115) connect with the 4th generation electrode slice (3145), and spray point occurs on described first
(3112) it is connect with generation spray point (3142) on the 4th；
Occur that spray point (3142) one-to-one correspondence occurs on spray point (3112) and the 4th on described first, occurs under described first
Spray point (3113) is corresponded with the 4th lower generation spray point (3143).
7. a kind of plasma generator according to claim 4, it is characterised in that: further include for controlling ion detection group
The control assembly (1) of part (3), the control assembly (1) obtain preset forward voltage information or backward voltage information；
According to forward voltage information or backward voltage information with control occur layer (31) form corresponding plasma and control it is pre-
If blower corresponding plasma is blown to detection layers (32)；
Corresponding plasma concentration is detected and forms corresponding detection current information by detection layers (32).
8. a kind of plasma generator arrangement, it is characterised in that: including upper mounting plate (4), lower installation board (5), discharge electrode (2) is set
It is equipped with several and is in be equally spaced between upper mounting plate (4) and lower installation board (5), discharge electrode (2) is installed on upper mounting plate (4)
One end, the other end of upper mounting plate (4) is equipped with control assembly (1) and between upper mounting plate (4) and lower installation board (5),
Enhancement layer (33) is sequentially installed with from discharge electrode (2) to control assembly (1) direction, layer (31), detection layers (32) occur, and is occurred
Layer (31), detection layers (32), enhancement layer (33) are all set between upper mounting plate (4) and lower installation board (5).
9. a kind of implementation method of plasma generator, it is characterised in that: discharge electrode (2) includes several laminar substrates, by several layers
Substrate be successively defined as the first laminar substrate (20), the second laminar substrate (21) ..., N-1 laminar substrate, n-th layer substrate, adjacent odd
It is parallel with one another to form odd number distribution capacity two-by-two between layer, it is parallel with one another to form even number distribution two-by-two between neighbouring even-numbered layer
Capacitor, odd number distribution capacity and even number distribution capacity are connected serially in ion generator current supply circuit.
10. a kind of implementation method of plasma generator according to claim 9, it is characterised in that: the control assembly
(1) control method is as follows:
Obtain preset forward voltage information or backward voltage information；
According to forward voltage information or backward voltage information with control occur layer (31) form corresponding plasma and control it is pre-
If blower corresponding plasma is blown to detection layers (32)；
Corresponding plasma concentration is detected and forms corresponding detection current information by detection layers (32).
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| US6974744B1 (en) * | 2000-09-05 | 2005-12-13 | Marvell International Ltd. | Fringing capacitor structure |
| JP2005093476A (en) * | 2003-09-12 | 2005-04-07 | Toshiba Corp | Semiconductor device |
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