CN110412964A - A kind of the walk-in type heat testing method and system of instrument electric-control system - Google Patents
A kind of the walk-in type heat testing method and system of instrument electric-control system Download PDFInfo
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- CN110412964A CN110412964A CN201910645770.4A CN201910645770A CN110412964A CN 110412964 A CN110412964 A CN 110412964A CN 201910645770 A CN201910645770 A CN 201910645770A CN 110412964 A CN110412964 A CN 110412964A
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- 238000012360 testing method Methods 0.000 title claims abstract description 44
- 238000001514 detection method Methods 0.000 claims abstract description 242
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 5
- 230000006641 stabilisation Effects 0.000 claims description 4
- 238000011105 stabilization Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000003321 atomic absorption spectrophotometry Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention discloses a kind of walk-in type heat testing method of instrument electric-control system and systems, wherein, this method comprises: infrared thermoviewer carries out infrared detection to the circuit board that electric-control system includes to obtain initial survey temperature cloud picture and be sent to heat detection computer in normal temperature environment；Then heat detection computer will obtain the high temperature component on circuit board at high temperature dot position；The temperature sampler being deployed on high temperature component acquires the temperature of itself when high temperature component works in several particular detection temperature environments in room temperature and respectively and collected temperature value is sent to heat detection computer；Heat detection computer analyzes the operating ambient temperature, own temperature and operating temperature threshold of high temperature component respectively, obtains the hot underproof failure component of detection performance in high temperature component.By means of the invention it is possible to the temperature when electronic device for quickly and easily detecting that electric-control system includes works at a certain temperature, and improve the accuracy of heat detection.
Description
Technical field
The present invention relates to the Thermal test field of electric-control system, in particular to a kind of walk-in type Thermal test of instrument electric-control system
Method and system.
Background technique
Automobile, excavator, aircraft, ship, electric vehicle and locomotive, motor-car for rail transport all generally possess automatically controlled system
System, such as the electric-control system of automobile, the circuit board integrated level of electric-control system is higher and higher at present, and unit area power consumption is increasing,
It is easy to cause circuit local temperature excessively high, heat dissipation problem is got worse, and component overheat can make electric-control system penalty or not
Stablize, even results in electric-control system and break down, directly affect the reliability of electronic product, therefore, the circuit board of electric-control system
Carrier as component, it is necessary to have good heat dissipation performance.
Since the electronic circuit of electric-control system is more complicated, easily there is unreasonable problem and leads in the design layout of circuit
It causes heat dissipation abnormal, therefore is just necessary to ensure that the reasonable circuit layout of electric-control system when electric-control system factory, improve heat dissipation performance.
Existing hot detection method is mostly that the temperature value of each components at work is directly detected by temperature sensor, still
Temperature that is too time-consuming and laborious, and detecting is detected one by one using each components of this detection method to electric-control system
Spending parameter is to be unable to judge accurately out the heat resistance of components, hot detection effect is unable to reach most preferably under normal temperature state
State.
Summary of the invention
The present invention provides the walk-in type heat testing method and system of a kind of instrument electric-control system, can quickly and easily detect
The temperature when electronic device that electric-control system includes out works at a certain temperature, and improve the accuracy of heat detection.
According to an aspect of the invention, there is provided a kind of walk-in type heat testing method of instrument electric-control system, including with
Lower step:
In normal temperature environment, infrared thermoviewer carries out infrared detection to the circuit board that the electric-control system includes, and obtains institute
State the initial survey temperature cloud picture of circuit board；
The initial survey temperature cloud picture is sent to heat detection computer by the infrared thermoviewer；
According to the initial survey temperature cloud picture, the heat detection computer obtains the height on the circuit board at high temperature dot position
Warm component；
The temperature sampler being deployed on the high temperature component acquires the high temperature component and works in normal temperature environment
The temperature of Shi Zishen；
It is specific at several respectively that the temperature sampler being deployed on the high temperature component acquires the high temperature component
The temperature of itself when working in detection temperature environment；
The temperature sampler is by the collected high temperature component respectively in room temperature and several particular detection temperature
The temperature of itself is sent to the heat detection computer when working in degree environment；
The heat detection computer analyzes the high temperature member device under room temperature and several particular detection temperature environments respectively
Operating ambient temperature, own temperature and the operating temperature threshold of part obtain hot detection performance in the high temperature component and do not conform to
The failure component of lattice.
Preferably, the temperature sampler being deployed on the high temperature component acquires the high temperature component in normal temperature environment
When middle work after the temperature of itself, this method is further comprising the steps of:
Be placed with the chamber of the electric-control system by the temperature in the chamber from room temperature with fixed heating rate
It is stepped up；
It is specific at several respectively that the temperature sampler being deployed on the high temperature component acquires the high temperature component
The temperature of itself when working in detection temperature environment, specifically:
It is described when the temperature in the chamber reaches each particular detection temperature of several particular detection temperature
After the fixed duration of high temperature component work and own temperature are stablized, the temperature sampler being deployed on the high temperature component is adopted
Collect when the high temperature component works in each described particular detection temperature environment the temperature of itself.
Preferably, the heat detection computer analyzes the height under room temperature and several particular detection temperature environments respectively
Operating ambient temperature, own temperature and the operating temperature threshold of warm component obtain heat detection property in the high temperature component
After the underproof failure component of energy, this method is further comprising the steps of:
After staff replaces the failure component, in normal temperature environment, the infrared thermoviewer is to having replaced
Circuit board after the failure component carries out infrared detection, obtains the reinspection temperature cloud picture of the circuit board；
The reinspection temperature cloud picture is sent to the heat detection computer by the infrared thermoviewer；
The heat detection computer compares the initial survey temperature cloud picture and the reinspection temperature cloud picture, judges the reinspection temperature
It spends in cloud atlas with the presence or absence of the high temperature dot in the initial survey temperature cloud picture；
If not, the component that the temperature sampler on the component being deployed in after replacement is acquired respectively after the replacement exists
The temperature of itself when working in each particular detection temperature environment of several particular detection temperature；
The temperature sampler is by the component after the collected replacement respectively in several described particular detection temperature
The temperature of itself is sent to heat detection computer when working in each particular detection temperature environment of degree.
Preferably, several are specific described by the component after the collected replacement respectively for the temperature sampler
It detects the temperature of itself when working in each particular detection temperature environment of temperature to be sent to after heat detection computer, the party
Method is further comprising the steps of:
The heat detection computer analyzes first device under each described particular detection temperature environment after the replacement respectively
Operating ambient temperature, own temperature and the operating temperature threshold of part whether there is two in the component after judging the replacement
Grade failure component；
If so, the heat detection computer shows position of the secondary failure component in the circuit board
To check and replace for staff；
It shows if not, heat is detected successfully mark by the heat detection computer to indicate the electric-control system heat
It detects successfully.
Preferably, when in the reinspection temperature cloud picture there are after high temperature dot in the initial survey temperature cloud picture, this method
It is further comprising the steps of:
The heat detection computer is by the three-level fault component at the reinspection temperature cloud picture high temperature point position in institute
It states the position in circuit board and shows and check and replace for staff.
According to another aspect of the present invention, a kind of walk-in type Thermal test system of instrument electric-control system is additionally provided, is wrapped
Include infrared thermoviewer, heat detection computer, temperature sampler:
Wherein, the infrared thermoviewer includes: the first infrared detection unit, is used in normal temperature environment, to described automatically controlled
The circuit board that system includes carries out infrared detection, obtains the initial survey temperature cloud picture of the circuit board；First cloud atlas transmission unit is used
Computer is detected in the initial survey temperature cloud picture is sent to heat；
Wherein, the heat detection computer includes: first acquisition unit, for obtaining according to the initial survey temperature cloud picture
High temperature component on the circuit board at high temperature dot position；
Wherein, the temperature sampler includes: the first temperature collecting cell, is adopted for being deployed on the high temperature component
Collect when the high temperature component works in normal temperature environment the temperature of itself；Second temperature acquisition unit, it is described for being deployed in
The temperature of itself is acquired when the high temperature component works in several particular detection temperature environments respectively on high temperature component；
First temperature transmission unit is used for the collected high temperature component respectively in room temperature and several particular detection temperature
The temperature of itself is sent to the heat detection computer when working in environment；
The heat detection computer further include: the first analytical unit, for analyzing room temperature and several specific inspections respectively
Operating ambient temperature, own temperature and the operating temperature threshold of the high temperature component, obtain the height under testing temperature environment
The hot underproof failure component of detection performance in warm component.
Preferably, a kind of walk-in type Thermal test system of instrument electric-control system further includes chamber:
Wherein, the chamber includes: heating unit, for acquiring the high temperature member in first temperature collecting cell
When device works in normal temperature environment after the temperature of itself, place the electric-control system and by the temperature in the chamber from
Room temperature is stepped up with fixed heating rate；
The second temperature acquisition unit, specifically for reaching several particular detection temperature when the temperature in the chamber
When each particular detection temperature of degree, the high temperature component works after fixation duration and own temperature stabilization, is deployed in
Itself is acquired when the high temperature component works in each described particular detection temperature environment on the high temperature component
Temperature.
Preferably, the infrared thermoviewer further include: the second infrared detection unit, for when first analytical unit point
Not Fen Xi under room temperature and several particular detection temperature environments the operating ambient temperature of the high temperature component, own temperature with
And operating temperature threshold, it obtains in the high temperature component after the hot underproof failure component of detection performance, as work people
Circuit board progress after member replaces the failure component, in normal temperature environment, to replace after the failure component
Infrared detection obtains the reinspection temperature cloud picture of the circuit board；
Second cloud atlas transmission unit, for the reinspection temperature cloud picture to be sent to the heat detection computer；
The heat detection computer further include: the first judging unit, for comparing the initial survey temperature cloud picture and described multiple
Temperature cloud picture is examined, is judged in the reinspection temperature cloud picture with the presence or absence of the high temperature dot in the initial survey temperature cloud picture；
The temperature sampler further include: third temperature collecting cell, described in judging in first judging unit
When there is no the high-temperature area in the initial survey temperature cloud picture in reinspection temperature cloud picture, on the component after being deployed in replacement respectively
Component after acquiring the replacement works in each particular detection temperature environment of several particular detection temperature
The temperature of Shi Zishen；Third temperature transmission unit, for the third temperature collecting cell to be distinguished the collected replacement
The temperature of itself when component afterwards works in each particular detection temperature environment of several particular detection temperature
It is sent to heat detection computer.
Preferably, the heat detection computer further include: second judgment unit, in the third temperature transmission unit
By the component after the collected replacement respectively several particular detection temperature each particular detection temperature
The temperature of itself is sent to after the heat detection computer when working in environment, analyzes each described particular detection temperature respectively
Operating ambient temperature, own temperature and the operating temperature threshold of the component under environment after the replacement are spent, judgement is described more
It whether there is secondary failure component in component after changing；
Fisrt fault display unit, for there are two in the component after second judgment unit judges the replacement
When grade failure component, position of the secondary failure component in the circuit board is shown and is checked for staff
And it replaces；
Success flag display unit, for not existing in the component after second judgment unit judges the replacement
When secondary failure component, heat is detected into successfully mark and is shown to indicate that the electric-control system heat detects successfully.
Preferably, the heat detection computer further include: the second fault display unit, for working as first judging unit
Judge in the reinspection temperature cloud picture there are when high temperature dot in the initial survey temperature cloud picture, it will height in the reinspection temperature cloud picture
Position of the three-level fault component in the circuit board at warm spot position, which is shown, to be checked and is replaced for staff.
Compared with prior art, beneficial effects of the present invention are as follows:
Through the invention, infrared detection first is carried out to obtain high-temperature area when circuit board operation, in turn to circuit board
The component information at high temperature dot position is obtained, can effectively avoid carrying out hot inspection to component whole on circuit board in this way
It surveys to waste unnecessary manpower and time；Then thermocouple is installed on the component at high temperature dot position so as to accurate
The temperature for measuring when above-mentioned component works under room temperature and other particular detection temperature environments respectively itself, passes through analysis
The heat that operating temperature threshold, operating ambient temperature and the own temperature of each component obtains detects underproof component letter
Breath, so that staff carries out subsequent replacement.This hot detection mode can determine detection range quickly both to not waste
Additional manpower and time can accurately also detect the component of performance difference to be replaced.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In attached drawing:
Fig. 1 is a kind of flow chart of the walk-in type heat testing method of instrument electric-control system according to an embodiment of the present invention；
Fig. 2 is a kind of structural block diagram of the walk-in type Thermal test system of instrument electric-control system according to an embodiment of the present invention；
Fig. 3 is the process of the walk-in type heat testing method of according to embodiments of the present invention one another instrument electric-control system
Figure；
Fig. 4 is the process of the walk-in type heat testing method of according to embodiments of the present invention two another instrument electric-control system
Figure.
Specific embodiment
Below in conjunction with attached drawing of the present invention, technical solution of the present invention is described, but described embodiment is only
A part of the embodiment of the present invention, based on the embodiments of the present invention, those of ordinary skill in the art are not making creative labor
Every other embodiment obtained under the premise of dynamic, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a kind of walk-in type heat testing method of instrument electric-control system, Fig. 1 is according to the present invention
A kind of flow chart of the walk-in type heat testing method of instrument electric-control system of embodiment, as shown in Figure 1, comprising the following steps:
Step S101: in normal temperature environment, infrared thermoviewer carries out infrared detection to the circuit board that electric-control system includes, and obtains
The initial survey temperature cloud picture of sense circuit plate；
Step S102: initial survey temperature cloud picture is sent to heat detection computer by infrared thermoviewer；
Step S103: according to initial survey temperature cloud picture, heat detection computer obtains the high temperature on circuit board at high temperature dot position
Component；
Step S104: the temperature sampler acquisition high temperature component being deployed on high temperature component works in normal temperature environment
The temperature of Shi Zishen；
Step S105: the temperature sampler acquisition high temperature component being deployed on high temperature component is specific at several respectively
The temperature of itself when working in detection temperature environment；
Step S106: temperature sampler is by collected high temperature component respectively in room temperature and several particular detection temperature
The temperature of itself is sent to heat detection computer when working in degree environment；
Step S107: heat detection computer analyzes high temperature member device under room temperature and several particular detection temperature environments respectively
It is underproof to obtain hot detection performance in high temperature component for operating ambient temperature, own temperature and the operating temperature threshold of part
Failure component.
In implementation process, after step s 104, be placed with the chamber of electric-control system by the temperature in chamber from
Room temperature is stepped up with fixed heating rate；The specific embodiment of step 105 are as follows: when the temperature arrival in chamber is several
When each particular detection temperature of a particular detection temperature, duration is fixed in the work of high temperature component and own temperature stablizes it
Afterwards, the temperature sampler acquisition high temperature component being deployed on high temperature component works in each particular detection temperature environment
The temperature of Shi Zishen.
After step S107, after staff replaces failure component, in normal temperature environment, infrared thermoviewer pair
The circuit board progress infrared detection after failure component has been replaced, the reinspection temperature cloud picture of circuit board is obtained；Infrared thermoviewer
Reinspection temperature cloud picture is sent to heat detection computer；Heat detection computer comparison initial survey temperature cloud picture and reinspection temperature cloud picture,
With the presence or absence of the high temperature dot in initial survey temperature cloud picture in judgement reinspection temperature cloud picture；If not, being deployed in the component after replacement
On temperature sampler acquire respectively replacement after component several particular detection temperature each particular detection temperature
The temperature of itself when working in environment；Temperature sampler is by the component after collected replacement respectively in several particular detections
The temperature of itself is sent to heat detection computer when working in each particular detection temperature environment of temperature.
Further, heat detection computer analyzes the component after replacing under each particular detection temperature environment respectively
Operating ambient temperature, own temperature and operating temperature threshold judge in the component after replacing with the presence or absence of secondary failure member
Device；If so, the position of secondary failure component in the circuit board is shown and is looked into for staff by heat detection computer
It sees and replaces；If not, heat detection computer by heat detect successfully mark show with indicate electric-control system heat detection at
Function.
Further, when rechecking there are after the high temperature dot in initial survey temperature cloud picture in temperature cloud picture, heat detects computer
The position of three-level fault component in the circuit board rechecked at temperature cloud picture high temperature point position is shown for the people that works
Member checks and replaces.
Through the above steps, the component range of heat detection is first determined, then reusable heat galvanic couple accurate detection is each out
The temperature of itself when component works in room temperature or other particular detection temperature environments respectively, to further analyze electricity
Heat detects underproof component to replace on the plate of road, can either quickly and easily determine the range of heat detection, Bu Huizao
At the waste of additional manpower and material resources, but can accurately detect when component works under different operating environment temperature from
Body temperature can accurately obtain the hot testing result of each component and be replaced according to testing result.
The embodiment of the invention also provides a kind of walk-in type Thermal test systems of instrument electric-control system, for realizing above-mentioned one
The walk-in type heat testing method of kind instrument electric-control system.
Fig. 2 is a kind of structural block diagram of the walk-in type Thermal test system of instrument electric-control system according to an embodiment of the present invention,
As shown in Fig. 2, the system includes infrared thermoviewer 10, heat detection computer 20, temperature sampler 30:
Wherein, infrared thermoviewer 10 includes: the first infrared detection unit 101, is used in normal temperature environment, to electric-control system
Including circuit board carry out infrared detection, obtain the initial survey temperature cloud picture of circuit board；First cloud atlas transmission unit 102, being used for will
Initial survey temperature cloud picture is sent to heat detection computer 20；
Wherein, heat detection computer 20 includes: first acquisition unit 201, for obtaining circuit according to initial survey temperature cloud picture
High temperature component on plate at high temperature dot position；
Wherein, temperature sampler 30 includes: the first temperature collecting cell 301, is acquired for being deployed on high temperature component
The temperature of itself when high temperature component works in normal temperature environment；Second temperature acquisition unit 302, for being deployed in high temperature member device
The temperature of itself when acquisition high temperature component works in several particular detection temperature environments respectively on part；First temperature is sent
Unit 303, when for collected high temperature component to work in room temperature and several particular detection temperature environments respectively
The temperature of itself is sent to heat detection computer 20；
Heat detection computer 20 further include: the first analytical unit 202, for analyzing room temperature and several specific inspections respectively
The operating ambient temperature of high temperature component, own temperature and operating temperature threshold under testing temperature environment obtain high temperature component
The middle underproof failure component of hot detection performance.
Further include chamber 40 for the walk-in type Thermal test system of instrument electric-control system:
Wherein, chamber 40 includes: heating unit 401, for acquiring high temperature component in the first temperature collecting cell 301
When working in normal temperature environment after the temperature of itself, place electric-control system and by the temperature in chamber 40 from room temperature with fixation
Heating rate be stepped up；Second temperature acquisition unit 302, specifically for reaching several spies when the temperature in chamber 40
When each particular detection temperature of regular inspection testing temperature, high temperature component works after fixation duration and own temperature stabilization, portion
Affix one's name to itself the temperature when acquiring high temperature component on high temperature component and working in each particular detection temperature environment.
For the walk-in type Thermal test system of instrument electric-control system, infrared thermoviewer 10 further include: the second infrared detection list
Member 103, for analyzing high temperature component under room temperature and several particular detection temperature environments respectively when the first analytical unit 202
Operating ambient temperature, own temperature and operating temperature threshold, obtain hot detection performance in high temperature component it is underproof therefore
After hindering component, after staff replaces failure component, in normal temperature environment, to after having replaced failure component
Circuit board carry out infrared detection, obtain the reinspection temperature cloud picture of circuit board；Second cloud atlas transmission unit 104, for that will recheck
Temperature cloud picture is sent to heat detection computer 20；
Heat detection computer 20 further include: the first judging unit 203, for comparing initial survey temperature cloud picture and reinspection temperature cloud
Figure judges to recheck in temperature cloud picture with the presence or absence of the high temperature dot in initial survey temperature cloud picture；
Temperature sampler 30 further include: third temperature collecting cell 304, for judging to recheck in the first judging unit 203
When there is no the high temperature dot in initial survey temperature cloud picture in temperature cloud picture, after acquisition is replaced respectively on the component after being deployed in replacement
Component itself temperature when working in each particular detection temperature environment of several particular detection temperature；Third temperature
Transmission unit 305 is spent, it is specific at several for third temperature collecting cell 304 to be distinguished to the component after collected replacement
It detects the temperature of itself when working in each particular detection temperature environment of temperature and is sent to heat detection computer 20.
For the walk-in type Thermal test system of instrument electric-control system, heat detection computer 20 further include: second judgment unit
204, in third temperature transmission unit 305 by the component after collected replacement respectively in several particular detection temperature
Each particular detection temperature environment in when working the temperature of itself be sent to after heat detection computer 20, analysis is every respectively
Operating ambient temperature, own temperature and the operating temperature threshold of component after being replaced under one particular detection temperature environment,
It whether there is secondary failure component in component after judgement replacement；Fisrt fault display unit 205, for when the second judgement
There are when secondary failure component in component after the judgement replacement of unit 204, in the circuit board by secondary failure component
Position, which is shown, to be checked and is replaced for staff；Success flag display unit 206, for sentencing when second judgment unit 204
When there is no secondary failure component in the component after disconnected replacement, heat is detected into successfully mark and is shown to indicate automatically controlled
System heat detects successfully.
For the walk-in type Thermal test system of instrument electric-control system, heat detection computer 20 further include: the second malfunction coefficient
Unit 207, for judging in reinspection temperature cloud picture there are when high temperature dot in initial survey temperature cloud picture when the first judging unit 203,
The position of three-level fault component in the circuit board rechecked at temperature cloud picture high temperature point position is shown for the people that works
Member checks and replaces.
It should be noted that the walk-in type Thermal test system of instrument electric-control system described in Installation practice is corresponding to upper
The embodiment of the method stated, concrete implementation process had carried out detailed description in embodiment of the method, and details are not described herein.
In order to keep technical solution of the present invention and implementation method clearer, below in conjunction with preferred embodiment in fact
Existing process is described in detail.
Embodiment one
The present embodiment provides the walk-in type heat testing methods of another instrument electric-control system, as shown in figure 3, Fig. 3 is basis
The flow chart of the walk-in type heat testing method of another instrument electric-control system of the embodiment of the present invention one, comprising the following steps:
Step S301: in normal temperature environment, infrared thermoviewer carries out infrared detection to the circuit board that electric-control system includes, and obtains
The initial survey temperature cloud picture of sense circuit plate；
In the present embodiment, structure is complicated for above-mentioned electric-control system, including several circuit boards, and on each circuit board
There are several components, infrared inspection is carried out to each circuit board that the electric-control system in work includes using infrared thermoviewer
It surveys, obtains the initial survey temperature cloud picture of circuit board, it can be with the high temperature exothermic of integral macroscopic found out on circuit board by temperature cloud picture
Region, and then staff is helped quickly to determine the component information for needing through check, so that the efficiency of heat detection can obtain
To raising；
As an alternative embodiment, staff, which needs to carry out, examines electric-control system heat before step S301
The preparation of survey, several circuit boards for specifically including by electric-control system disassemble to put humiture test box into again respectively
In, the humiture test box can temperature and humidity in autonomous regulating box, carried out to adjust out the temperature that heat detection needs
Heat detection；
Step S302: initial survey temperature cloud picture is sent to heat detection computer by infrared thermoviewer；
Step S303: according to initial survey temperature cloud picture, heat detection computer obtains the high temperature on circuit board at high temperature dot position
Component；
As an alternative embodiment, heat detects computer after obtaining initial survey temperature cloud picture, it can be by circuit board
On high temperature dot position at actual temp value calculate, can thus be determined according to temperature value and need further to use
The component information of temperature sampler temperature collection；
Step S304: the temperature sampler acquisition high temperature component being deployed on high temperature component works in normal temperature environment
The temperature of Shi Zishen；
Optionally, above-mentioned temperature sampler can be thermocouple, be also possible to temperature sensor, and the present embodiment does not limit
It is fixed；
Step S305: be placed with the chamber of electric-control system by the temperature in chamber from room temperature with fixed heating rate
It is stepped up；
As an alternative embodiment, the hot detection method of this implementation can be set when detecting electric-control system it is several
Specific detection temperature, such as room temperature, 40 DEG C, 50 DEG C, 60 DEG C and 70 DEG C, chamber does not surpass the raised rate of the temperature inside the box
10 DEG C are crossed, i.e., it is the temperature value increased on Current Temperatures no more than 10 DEG C that chamber increases the temperature inside the box all every time, in this way may be used
To guarantee that the temperature raising of the working environment of electric-control system tends towards stability, can bear convenient for testing out component on circuit board
Operating temperature limit；
Step S306: when the temperature in chamber reaches each particular detection temperature of several particular detection temperature
When, high temperature component works after fixation duration and own temperature stabilization, and the temperature sampler being deployed on high temperature component is adopted
The temperature of itself when collection high temperature component works in each particular detection temperature environment；
Step S307: temperature sampler is by collected high temperature component respectively in room temperature and several particular detection temperature
The temperature of itself is sent to heat detection computer when working in degree environment；
Step S308: heat detection computer analyzes high temperature member device under room temperature and several particular detection temperature environments respectively
It is underproof to obtain hot detection performance in high temperature component for operating ambient temperature, own temperature and the operating temperature threshold of part
Failure component.
For example, needing to be ready work before implementation of the embodiment of the present invention, specifically: with atomic absorption spectrophotometry
Object of the photometer electric-control system as heat detection, predominantly detects for example high pressing mold of several circuit boards that the electric-control system includes
Block, 15V switch DC power supply, mainboard, graphite gas path plate, flame gas path plate, driving lamp plate, signal plate and Power supply for deuterium lamp work
When heat condition, the present embodiment be arranged 27.9 DEG C, 40 DEG C, 50 DEG C, 60 DEG C, 70 DEG C of these detection temperature carry out hot inspection
It surveys, by being put into humiture test box comprising each circuit board for electric-control system；
Firstly, carrying out infrared detection, the at this time temperature in humiture test box to each circuit board using infrared thermoviewer
It is normal temperature state, that is, 27.9 DEG C, when electric-control system works normally in humiture test box, obtains each circuit board
Temperature cloud picture, according to temperature cloud picture it can be seen that on each circuit board component temperature, in conjunction with the temperature resistant range of component
It is assured that out potential high temperature risk point present in electric-control system, has found that there are 24 in the electric-control system of the present embodiment
A high temperature component；
The sticking temperature sensor on above-mentioned 24 high temperature components, in addition, also being needed according to customer requirement in graphite gas
3 solenoid valves of road plate and flame gas path plate left side solenoid valve are respectively arranged 1 test point, at this time first will be in the temperature in chamber
Be adjusted to 40 DEG C, then when electric-control system work normally one it is small when after, the temperature of high temperature component is stable at this time, at this moment leads to
Excess temperature sensor acquires the own temperature value of high temperature component, and this contact type temperature measuring can accurately get high temperature
The own temperature of component；Further, 50 DEG C will be adjusted in the temperature in chamber, then when electric-control system works normally one
Hour after, the temperature of high temperature component is stable at this time, at this moment by temperature sensor acquisition high temperature component itself
Temperature value；Further, 60 DEG C will be adjusted in the temperature in chamber, then when electric-control system work normally one it is small when after,
The temperature of high temperature component is stable at this time, and the own temperature value of high temperature component is at this moment acquired by temperature sensor；Into
One step, 70 DEG C will be adjusted in the temperature in chamber, then when electric-control system work normally one it is small when after, at this time high temperature member
The temperature of device is stable, and the own temperature value of high temperature component is at this moment acquired by temperature sensor；Above-mentioned temperature is surveyed
The own temperature value for the high temperature component measured at amount point is recorded, and available high temperature component is in different hot environments
Under temperature changing trend, and then clearly can efficiently judge there are the component of high temperature risk, to be subsequent replacement
Accurate foundation is provided.
As it can be seen that the non-contact infrared detection of the present embodiment combines the heat detection of the temperature sensor temperature collection of contact
Method can either quickly distinguish the high temperature component with high temperature risk and further detect for staff, and can be accurately
The own temperature of high temperature component at detection helps staff accurately to judge the high temperature resistance of high temperature component, in turn
It can judge underproof component accurately to be replaced.
Embodiment two
The present embodiment provides the walk-in type heat testing methods of another instrument electric-control system, as shown in figure 4, Fig. 4 is basis
The flow chart of the walk-in type heat testing method of another instrument electric-control system of the embodiment of the present invention two, comprising the following steps:
Step S401~step S408 is identical as step S301~content of step S308, and details are not described herein again；
Step S409: after staff replaces failure component, in normal temperature environment, infrared thermoviewer is to having replaced
Circuit board after failure component carries out infrared detection, obtains the reinspection temperature cloud picture of circuit board；
As an alternative embodiment, there are just need to be replaced after the component of high temperature risk at detection
For the stronger component of high temperature resistance, after having replaced component, in order to ensure testing result is correct or detection does not have
It omits, it is also necessary to the hot testing result of electric-control system further be verified, therefore can be preliminary by step S409
Whether there is also high temperature risks for component after judging replacement；
Step S410: infrared thermoviewer will recheck temperature cloud picture and be sent to heat detection computer；
Step S411: heat detection computer comparison initial survey temperature cloud picture and reinspection temperature cloud picture judge to recheck temperature cloud picture
In with the presence or absence of the high temperature dot in initial survey temperature cloud picture；If so, thening follow the steps S412；If not, thening follow the steps S413
~step S415；
In the present embodiment, if there is also the high temperature dots occurred in initial survey temperature cloud picture in reinspection temperature cloud picture, with regard to explanation
The high temperature resistance of component after replacement can't reach requirement, it is also necessary to re-replace as the higher first device of high temperature resistance
Then part just further uses temperature if there is no the high temperature dots occurred in initial survey temperature cloud picture in rehabilitation temperature cloud picture
Own temperature when component after sensor detection replacement works normally in other particular detection temperature environments, further
Judge replacement after component it is whether qualified；
Step S412: heat detection computer will recheck the three-level fault component at temperature cloud picture high temperature point position in electricity
Position in the plate of road, which is shown, to be checked and is replaced for staff；
Step S413: if the component that the temperature sampler on the component being deployed in after replacement acquires after replacement respectively exists
The temperature of itself when working in each particular detection temperature environment of dry particular detection temperature；
Step S414: temperature sampler is by the component after collected replacement respectively in several particular detection temperature
The temperature of itself is sent to heat detection computer when working in each particular detection temperature environment；
Step S415: heat detection computer analyzes the component after replacing under each particular detection temperature environment respectively
Operating ambient temperature, own temperature and operating temperature threshold judge in the component after replacing with the presence or absence of secondary failure member
Device；If so, thening follow the steps S416；If not, thening follow the steps S417；
In the present embodiment, if replacement after component in there are secondary failure components, just illustrate replacement after first device
Part high temperature resistance is not strong, it is also necessary to further re-replace, if there is no secondary failure members in the component after replacement
The high temperature resistance of device, the component after just illustrating replacement is good, and the accuracy of the hot testing result of the present embodiment is higher；
Step S416: heat detection computer shows the position of secondary failure component in the circuit board for the people that works
Member checks and replaces；
Step S417: heat detection computer by heat detect successfully mark show with indicate electric-control system heat detection at
Function.
In summary, through the foregoing embodiment, infrared detection first is carried out to circuit board to obtain when circuit board is run
High-temperature area, and then the component information at high temperature dot position is obtained, it can effectively avoid to whole on circuit board in this way
Component carries out heat detection to waste unnecessary manpower and time；Then heat is installed on the component at high temperature dot position
Galvanic couple is accurately to measure when above-mentioned component works under room temperature and other particular detection temperature environments respectively itself
Temperature, operating temperature threshold, operating ambient temperature and own temperature by analyzing each component obtain heat detection not
Qualified component information, so that staff carries out subsequent replacement.This hot detection mode both can quickly determine detection
Range can accurately also detect the component of performance difference to not waste additional manpower and time to be replaced.In
Replaced also continue carrying out the component after replacement heat detection after failure component so as to verify primary detection the result is that
It is no correct, it may insure that the result of heat detection is correct in this way.
Claims (10)
1. a kind of walk-in type heat testing method of instrument electric-control system, which comprises the following steps:
In normal temperature environment, infrared thermoviewer carries out infrared detection to the circuit board that the electric-control system includes, and obtains the electricity
The initial survey temperature cloud picture of road plate；
The initial survey temperature cloud picture is sent to heat detection computer by the infrared thermoviewer；
According to the initial survey temperature cloud picture, the heat detection computer obtains the member of the high temperature on the circuit board at high temperature dot position
Device；
The temperature sampler being deployed on the high temperature component acquires when the high temperature component works in normal temperature environment certainly
The temperature of body；
The temperature sampler being deployed on the high temperature component acquires the high temperature component respectively in several particular detections
The temperature of itself when working in temperature environment；
The temperature sampler is by the collected high temperature component respectively in room temperature and several particular detection temperature rings
The temperature of itself is sent to the heat detection computer when working in border；
The heat detection computer analyzes the high temperature component under room temperature and several particular detection temperature environments respectively
It is underproof to obtain hot detection performance in the high temperature component for operating ambient temperature, own temperature and operating temperature threshold
Failure component.
2. the method according to claim 1, wherein the temperature sampler being deployed on the high temperature component is adopted
Collect when the high temperature component works in normal temperature environment after the temperature of itself, further comprising the steps of:
Be placed with the chamber of the electric-control system by the temperature in the chamber from room temperature with fixed heating rate gradually
It increases；
The temperature sampler being deployed on the high temperature component acquires the high temperature component respectively in several particular detections
The temperature of itself when working in temperature environment, specifically:
When the temperature in the chamber reaches each particular detection temperature of several particular detection temperature, the high temperature
After the fixed duration of component work and own temperature are stablized, the temperature sampler being deployed on the high temperature component acquires institute
State when high temperature component works in each described particular detection temperature environment the temperature of itself.
3. according to the method described in claim 2, it is characterized in that, the heat detection computer analyzes room temperature and several respectively
Operating ambient temperature, own temperature and the operating temperature threshold of the high temperature component, are obtained under a particular detection temperature environment
It takes in the high temperature component after the hot underproof failure component of detection performance, further comprising the steps of:
After staff replaces the failure component, in normal temperature environment, the infrared thermoviewer is described to having replaced
Circuit board after failure component carries out infrared detection, obtains the reinspection temperature cloud picture of the circuit board；
The reinspection temperature cloud picture is sent to the heat detection computer by the infrared thermoviewer；
The heat detection computer compares the initial survey temperature cloud picture and the reinspection temperature cloud picture, judges the reinspection temperature cloud
With the presence or absence of the high temperature dot in the initial survey temperature cloud picture in figure；
If not, the temperature sampler on the component being deployed in after replacement acquires the component after the replacement described respectively
The temperature of itself when working in each particular detection temperature environment of several particular detection temperature；
The temperature sampler is by the component after the collected replacement respectively in several particular detection temperature
The temperature of itself is sent to heat detection computer when working in each particular detection temperature environment.
4. according to the method described in claim 3, it is characterized in that, the temperature sampler will distinguish the collected replacement
The temperature of itself when component afterwards works in each particular detection temperature environment of several particular detection temperature
It is sent to after heat detection computer, further comprising the steps of:
The heat detection computer analyzes the component under each described particular detection temperature environment after the replacement respectively
Operating ambient temperature, own temperature and operating temperature threshold, in the component after judging the replacement with the presence or absence of second level therefore
Hinder component；
If so, position of the secondary failure component in the circuit board is shown confession by the heat detection computer
Staff checks and replaces；
It shows if not, heat is detected successfully mark by the heat detection computer to indicate that the electric-control system heat detects
Success.
5. according to the method described in claim 3, it is characterized in that, when there are the initial survey temperature in the reinspection temperature cloud picture
It is further comprising the steps of after high temperature dot in cloud atlas:
The heat detection computer is by the three-level fault component at the reinspection temperature cloud picture high temperature point position in the electricity
Position in the plate of road, which is shown, to be checked and is replaced for staff.
6. a kind of walk-in type Thermal test system of instrument electric-control system, which is characterized in that calculated including infrared thermoviewer, heat detection
Machine, temperature sampler:
Wherein, the infrared thermoviewer includes:
First infrared detection unit, for carrying out infrared detection to the circuit board that the electric-control system includes in normal temperature environment,
Obtain the initial survey temperature cloud picture of the circuit board；
First cloud atlas transmission unit, for the initial survey temperature cloud picture to be sent to heat detection computer；
Wherein, the heat detection computer includes:
First acquisition unit, for obtaining the high temperature on the circuit board at high temperature dot position according to the initial survey temperature cloud picture
Component；
Wherein, the temperature sampler includes:
First temperature collecting cell acquires the high temperature component in normal temperature environment for being deployed on the high temperature component
The temperature of itself when work；
Second temperature acquisition unit acquires the high temperature component respectively at several for being deployed on the high temperature component
The temperature of itself when working in particular detection temperature environment；
First temperature transmission unit is used for the collected high temperature component respectively in room temperature and several particular detections
The temperature of itself is sent to the heat detection computer when working in temperature environment；
The heat detection computer further include:
First analytical unit, for analyzing the high temperature component under room temperature and several particular detection temperature environments respectively
It is underproof to obtain hot detection performance in the high temperature component for operating ambient temperature, own temperature and operating temperature threshold
Failure component.
7. system according to claim 6, which is characterized in that further include chamber:
Wherein, the chamber includes:
Heat up unit, for acquiring when the high temperature component works in normal temperature environment certainly in first temperature collecting cell
After the temperature of body, place the electric-control system and by the temperature in the chamber from room temperature with fixed heating rate gradually
It increases；
The second temperature acquisition unit, specifically for reaching several particular detection temperature when the temperature in the chamber
When each particular detection temperature, the high temperature component works after fixation duration and own temperature stabilization, is deployed in described
The temperature of itself is acquired when the high temperature component works in each described particular detection temperature environment on high temperature component.
8. system according to claim 7, which is characterized in that the infrared thermoviewer further include:
Second infrared detection unit, for analyzing room temperature and several particular detection temperature respectively when first analytical unit
Operating ambient temperature, own temperature and the operating temperature threshold of the high temperature component under environment, obtain the high temperature member device
In part after the hot underproof failure component of detection performance, after staff replaces the failure component, in room temperature
In environment, infrared detection is carried out to the circuit board replaced after the failure component, obtains the reinspection temperature of the circuit board
Spend cloud atlas；
Second cloud atlas transmission unit, for the reinspection temperature cloud picture to be sent to the heat detection computer；
The heat detection computer further include:
First judging unit judges the reinspection temperature for comparing the initial survey temperature cloud picture and the reinspection temperature cloud picture
With the presence or absence of the high temperature dot in the initial survey temperature cloud picture in cloud atlas；
The temperature sampler further include:
Third temperature collecting cell, it is described first for judging not existing in the reinspection temperature cloud picture in first judging unit
When examining the high temperature dot in temperature cloud picture, the component after acquiring the replacement on the component after being deployed in replacement respectively is described
The temperature of itself when working in each particular detection temperature environment of several particular detection temperature；
Third temperature transmission unit, for the third temperature collecting cell to be distinguished to the component after the collected replacement
The temperature of itself is sent to hot inspection when working in each particular detection temperature environment of several particular detection temperature
Survey computer.
9. system according to claim 8, which is characterized in that the heat detection computer further include:
Second judgment unit, for the component after the collected replacement respectively to exist in the third temperature transmission unit
The temperature of itself is sent to the heat when working in each particular detection temperature environment of several particular detection temperature
After detecting computer, the building ring of the component under each described particular detection temperature environment after the replacement is analyzed respectively
Border temperature, own temperature and operating temperature threshold whether there is secondary failure member device in the component after judging the replacement
Part；
Fisrt fault display unit, for there are second level events in the component after second judgment unit judges the replacement
When hindering component, position of the secondary failure component in the circuit board is shown and is checked for staff and more
It changes；
Success flag display unit, for not there is no second level in the component after second judgment unit judges the replacement
When failure component, heat is detected into successfully mark and is shown to indicate that the electric-control system heat detects successfully.
10. system according to claim 8, which is characterized in that the heat detection computer further include:
Second fault display unit, for judging that there are the initial surveies in the reinspection temperature cloud picture when first judging unit
When high temperature dot in temperature cloud picture, by the three-level fault component at the reinspection temperature cloud picture high temperature point position in the electricity
Position in the plate of road, which is shown, to be checked and is replaced for staff.
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