CN110340557B - Diffusion bonding die and diffusion bonding method - Google Patents
Diffusion bonding die and diffusion bonding method Download PDFInfo
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- CN110340557B CN110340557B CN201910660566.XA CN201910660566A CN110340557B CN 110340557 B CN110340557 B CN 110340557B CN 201910660566 A CN201910660566 A CN 201910660566A CN 110340557 B CN110340557 B CN 110340557B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/02—Combined welding or cutting procedures or apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/16—Arc welding or cutting making use of shielding gas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
- C23G1/086—Iron or steel solutions containing HF
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/12—Light metals
- C23G1/125—Light metals aluminium
Abstract
The invention relates to a diffusion connection die and a diffusion connection method, belongs to the technical field of precision sheet metal machining, and solves the problems of high-temperature sagging deformation, low welding rate and low efficiency of large-area diffusion connection of a multilayer board at present. The diffusion connection die comprises an upper die and a lower die matched with the upper die, wherein the upper die is provided with a first sealing stem, an air cavity and an air channel for filling high-pressure flexible air into the air cavity; the lower die is of a flat plate structure and is provided with a second sealing stem and a vacuum air passage. The diffusion bonding method is as follows: manufacturing a multi-layer board large-area diffusion connection blank; carrying out surface treatment on the multi-layer board large-area diffusion connection blank; manufacturing a pattern of the large-area diffusion bonding blank separant of the multilayer board; assembling the large-area diffusion connection blank of the multilayer board, performing peripheral fusion welding and vacuum tube welding to obtain a multilayer board sealing element; diffusion bonding a multilayer plate seal. The invention can be used for large-area diffusion connection of the multilayer board.
Description
Technical Field
The invention relates to the technical field of precision sheet metal machining, in particular to a diffusion connection die and a diffusion connection method.
Background
The superplastic forming/diffusion bonding process of parts is an advanced lightweight forming method, can be used for processing and manufacturing hollow multilayer structures, and the produced components are widely applied to the fields of aerospace, weaponry and the like. Diffusion bonding of multi-layer boards is typically accomplished prior to superplastic forming of the part, and therefore the strength requirements for the diffusion bonded joint between the boards are high. The diffusion welding rate is easy to ensure when the plate blanks with smaller sizes are subjected to diffusion connection; when the size of the plate blank is large and the diffusion bonding area is large, the diffusion bonding welding rate is difficult to guarantee, and the deformation problems such as high-temperature sagging and the like also exist. This reduces the strength of the diffusion bonded joints between the plies, not only making the superplastic forming process difficult to perform, but also affecting product quality.
Aiming at the problem of large-area diffusion connection of large-size parts, the prior art mainly adopts two methods: one is rigid diffusion bonding, namely, two flat plate molds press a multi-layer plate blank needing diffusion bonding between the two flat plate molds at high temperature and provide mold clamping force to realize diffusion bonding of parts. And secondly, the air pressure diffusion connection is realized, namely the multi-layer plate blank needing the diffusion connection is placed between the upper die and the lower die and is compressed, and high-pressure air is introduced into the die cavities of the upper die and the lower die to realize the diffusion connection of the parts. For the large-area diffusion connection process of large-size parts, the two existing main technical methods have the defects that: firstly, the rigid diffusion connection method has high requirements on the flatness of the coupling surface of the upper die and the lower die, so the die has high processing difficulty and high cost; in addition, it is difficult to achieve a high diffusion bonding rate due to problems such as mold processing accuracy and mold deformation. And secondly, although the diffusion welding rate can be ensured by the air pressure diffusion connection, the plate is easy to droop and deform at high temperature due to self gravity, and the quality and the qualification rate of the final part are influenced.
Disclosure of Invention
In view of the above analysis, an object of the present invention is to provide a diffusion bonding mold and a diffusion bonding method, which can solve at least one of the following problems: (1) the welding rate is low; (2) the processing difficulty of the die is high, and the cost is high; (3) high-temperature sagging deformation; (4) the qualified rate is low. In order to achieve the purpose, the invention is mainly realized by the following technical scheme:
in one aspect, the invention provides a diffusion bonding die, which comprises an upper die and a lower die matched with the upper die, wherein the upper die is provided with a first sealing stem, an air cavity and an air duct for filling high-pressure flexible air into the air cavity; the lower die is of a flat plate structure and is provided with a second sealing stem and a vacuum air passage.
Further, the diffusion bonding die is made of stainless steel.
Further, the hardness of the diffusion bonding die is 35-45 HRC.
In another aspect, the present invention further provides a diffusion bonding method, including the steps of:
s1, manufacturing a multi-layer board large-area diffusion connection blank;
s2, performing surface treatment on the multi-layer board large-area diffusion connection blank;
s3, manufacturing a parting agent pattern of the large-area diffusion connection blank of the multilayer board;
s4, assembling the large-area diffusion connection blank of the multilayer board, and performing peripheral fusion welding and vacuum tube welding to obtain a multilayer board sealing element;
s5, diffusion bonding the multilayer plate sealing element;
the number of the multi-plate seals in S5 is 1 or more.
Further, in S1, each of the multilayer boards has the same size, which is:
L1＝L2+2W3；W1＝W2+2W3；
in the formula, L1For the length of each ply blank, L2Is the length of the sealing stem of the lower die, W3To weld width, W1Width of each ply of the blank, W2The width of the sealing stem of the lower die.
Further, in S1, the method for manufacturing the multi-layer board large-area diffusion bonding blank is water cutting, laser cutting or numerical control blanking.
Further, in S2, the surface treatment method is chemical pickling or grinding and polishing.
Further, in S3, the step of making the release agent pattern includes: and drawing a boundary line between a blank diffusion connection area and a non-diffusion connection area according to a multilayer plate part model, and spraying a release agent on the surface of the blank non-diffusion connection area.
Further, in S5, the diffusion bonding the multilayer plate seal comprises the steps of:
s51, placing the multilayer plate sealing element in the S4 between the upper die and the lower die, and respectively connecting the air duct of the upper die, the vacuum air duct of the lower die and the vacuum tube of the multilayer plate sealing element;
s52, before the upper die and the lower die are assembled, vacuum-pumping is carried out on the vacuum tubes of the multilayer plate sealing element, then the upper die and the lower die are assembled, and the vacuum tubes of the multilayer plate sealing element are continuously vacuumized;
s53, heating the die to the diffusion bonding temperature of the plate, preserving heat, applying mold closing force to the die, and continuously vacuumizing the space between the lower die and the sealing element of the multilayer plate; and introducing argon into the upper die gas cavity, keeping the pressure for 2-3h after the gas pressure reaches 2.5-3.5MPa, and completing the large-area diffusion connection of the multilayer board.
Further, the speed of introducing argon in the S53 is 0.04-0.07 MPa/min.
Compared with the prior art, the invention can realize at least one of the following beneficial effects:
a) the lower die of the diffusion connection die provided by the invention adopts a flat plate structure, the processing requirement on the die plane can be reduced, the die sealing is easy to realize, and meanwhile, the lower die of the flat plate structure is in direct contact with a large-area diffusion connecting piece to play a supporting role on the multi-layer board large-area diffusion connecting piece, so that the problem of sagging deformation of the multi-layer board large-area diffusion connecting piece due to self gravity at high temperature can be effectively avoided, the product quality is ensured, and the product percent of pass is improved.
b) The diffusion bonding die provided by the invention adopts a flat lower die, and high-pressure flexible gas is introduced into an upper die through an air duct to realize diffusion bonding. Therefore, on the premise of ensuring high diffusion welding rate, the processing difficulty and cost of the diffusion connection die can be reduced.
c) The die provided by the invention adopts a mode of vacuumizing the lower die and the multilayer plate and a double-sealing-stem structure, so that the sealing of parts can be effectively realized, and the qualification rate of the parts is improved.
d) The diffusion connection method provided by the invention is simple and easy to operate, can realize simultaneous diffusion connection of multiple workpieces in one mould, greatly shortens the production period and improves the production efficiency.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, wherein like reference numerals are used to designate like parts throughout.
FIG. 1 is a schematic cross-sectional view of a diffusion bonding die provided in accordance with the present invention;
FIG. 2 is a schematic view of a three-layer plate diffusion bonding area provided by the present invention;
FIG. 3 is an enlarged schematic view at A;
fig. 4 is a schematic view of a mold in a comparative example of the present invention.
Reference numerals:
1-upper mould; 2-lower mould; 3-a first sealing stem; 4-an air cavity; 5-an air duct; 6-a second sealing stem; 7-vacuum air channel; 8-a diffusion-bonded region; 9-non-diffusion bonding region.
Detailed Description
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate preferred embodiments of the invention and together with the description, serve to explain the principles of the invention and not to limit the scope of the invention.
Example 1
As shown in fig. 1, the present embodiment provides a diffusion bonding mold. The diffusion connection mould comprises an upper mould 1 and a lower mould 2 matched with the upper mould, wherein the upper mould 1 is provided with a first sealing stem 3, an air cavity 4 and an air duct 5 for filling high-pressure flexible air into the air cavity; the lower die 2 is of a flat plate structure, and the lower die 2 is provided with a second sealing stem 6 and a vacuum air passage 7.
The upper die is provided with a sealing stem, an air cavity and an air duct; the lower die is of a flat plate structure and is provided with a sealing stem and a vacuum air channel. The air duct of the upper die is used for filling high-pressure flexible gas into the air cavity, and the vacuum air duct of the lower die is used for vacuumizing the gap between the lower die and the multilayer board. Compared with the prior art, the lower die of the die provided by the invention adopts a flat plate structure, so that the deformation problems of high-temperature sagging and the like of large-size plates are prevented; meanwhile, the lower die is provided with a vacuum air channel, so that air between the lower die and the multilayer plate can be effectively pumped out, and the flatness of the part is ensured; the upper die is in air pressure loading diffusion connection with the air cavity, so that the requirement on the flatness of the die can be lowered, high diffusion welding rate can be realized, and the processing cost and difficulty of the die are reduced; in addition, the upper die and the lower die are provided with double sealing stems, so that the sealing performance of parts can be guaranteed.
Specifically, in order to ensure the uniformity of the gas in the gas cavity of the upper die, the connecting position of the air duct 5 and the gas cavity 4 is positioned in the middle of the gas cavity 4, so that the gas filled from the air duct 5 can be rapidly and uniformly dispersed into the gas cavity, and the uniformity of the gas in the gas cavity is ensured.
Specifically, the diffusion bonding die is used for performing large-area diffusion bonding of a multilayer board. Preferably, the number of layers N of the multilayer board is more than or equal to 2, and the large area refers to the area S of more than or equal to 0.4m2。
Specifically, the diffusion bonding die is made of stainless steel, 1Cr18Ni9Ti is preferred, and the die made of the material has good high-temperature oxidation resistance, high heat strength and good heat stability; the high-temperature-resistant multilayer board has good high-temperature-resistant growth performance, can ensure the quality, the size precision and the like of the multilayer board, and has longer service life.
Specifically, the tensile strength of the diffusion bonding die is 500-600MPa, and the hardness is 35-45 HRC.
Example 2
This example provides a diffusion bonding method using, for example, the diffusion bonding die of example 1, the diffusion bonding method including the steps of:
s1, manufacturing a diffusion connection die;
s2, designing and manufacturing a large-area diffusion connection blank of the multilayer board;
s3, performing surface treatment on the multi-layer board large-area diffusion connection blank;
s4, manufacturing a pattern of the large-area diffusion bonding blank separant of the multilayer board;
s5, assembling the large-area diffusion connection blank of the multilayer board, and performing peripheral fusion welding and vacuum tube welding to obtain a multilayer board sealing element;
s6, diffusion bonding of the multi-layer plate sealing element, comprising the following steps:
s61, placing the multilayer board sealing element in the S5 between the upper die and the lower die, and connecting an air duct of the upper die with an inflation pipe of forming equipment in a ferrule type pipe joint mode; connecting the vacuum air passage of the lower die with a vacuum-pumping pipe of forming equipment in a ferrule type pipe joint; the vacuum tube of the multi-layer plate sealing element is connected with a vacuum pumping tube of the forming equipment in a ferrule type tube joint mode.
S62, before the upper die and the lower die are closed, carrying out vacuum pumping treatment on the vacuum tube of the multi-layer plate sealing element, specifically, carrying out vacuum pumping three times for 1-2min each time; then, the upper die and the lower die are assembled and the vacuum tube of the multi-layer plate sealing element is continuously vacuumized to ensure that the vacuum degree inside the multi-layer plate sealing element is 100-200Pa in the diffusion connection process, and the requirement on vacuum pumping equipment is high due to overhigh vacuum degree, so that the energy consumption is high and the cost is high; the vacuum degree is too low, the oxygen content is large, and the diffusion connection is affected.
And S63, placing the die in a forming device, heating to the diffusion bonding temperature of the multilayer board, then preserving heat for 1-2 hours, applying a proper mold closing force (the mold closing force is required to ensure that the pressure of a diffusion bonding area is 15MPa) to the die by the forming device, continuously vacuumizing the space between the lower die and the sealing element of the multilayer board, then introducing high-pressure argon into an upper die gas cavity, and maintaining the pressure for a certain time after the gas pressure reaches 2.5-3.5MPa to complete the large-area diffusion bonding of the multilayer board.
Considering that the die material is different from the part material, the die and the part in S1 have different coefficients of high-temperature linear expansion, and if the die is not properly scaled, the machined part has a large dimensional error; the size of the large area diffusion bonded area of the die is appropriately scaled according to the size of the part.
Specifically, the design principle of multiply wood diffusion bonding blank size is for guaranteeing to go up the mould and the closed back of lower mould four sides of multiply wood all press the region outside sealed stalk in S2, and every layer of plate size is the same when the multiply wood preparation, considers that the multiply wood will pass through banding fusion welding, so the size of every layer of plate blank is:
L1＝L2+2W3；W1＝W2+2W3；
in the formula, L1Is the length of the blank, L2Is the length of the sealing stem of the lower die, W3To weld width, W1Is the width of the blank, W2The width of the sealing stem of the lower die.
Specifically, the manufacturing method of the multi-layer plate diffusion bonded blank in S2 may adopt a water cutting method, a laser cutting method or a numerical control blanking method.
Specifically, the surface treatment method of the multi-layer board diffusion bonding blank in S3 may be chemical pickling or polishing, and the purpose of the surface treatment is to remove an oxide layer on the surface and prevent the oxide layer from affecting the diffusion bonding quality. Preferably, the chemical pickling may be performed by cleaning with a mixed solution of hydrofluoric acid and nitric acid.
Specifically, the step of patterning the release agent in S4 includes: drawing the boundary of the diffusion bonding area 8 and the non-diffusion bonding area 9 of the diffusion bonding blank of the multilayer board according to the model of the part of the multilayer board, as shown in FIGS. 2-3; and spraying a release agent on the surface of the non-diffusion bonding area 9 of the multi-layer board diffusion bonding blank, wherein the release agent mainly comprises BN.
Specifically, the multilayer boards are assembled in the step S5 according to the sequence, then peripheral fusion welding and vacuum tube welding are carried out on the assembled multilayer boards, only one vacuum tube is left to be communicated with the outside in order to enable the inside of the multilayer boards to form a closed space, and vacuum pumping is carried out through the vacuum tube during diffusion connection, so that no air residue or vacuum state exists in the multilayer boards, and the higher the vacuum degree is, the higher the diffusion connection quality and the diffusion welding rate in the multilayer boards can be improved.
Specifically, the number of the multilayer plate seals in S61 may be 1 or more.
Specifically, in S6, the temperature of the multilayer plate sealing element and the die is raised simultaneously, and a method of raising the temperature of the die and then placing the multilayer plate sealing element is not adopted, because the multilayer plate sealing element is vacuumized and then pressed by the sealing stem, the internal vacuum degree can be ensured to the maximum extent, and the diffusion bonding quality is improved; if the mold is heated and then placed into the sealing element, firstly, high-temperature operation is difficult, and secondly, the interior of the part is easier to be oxidized at high temperature.
Specifically, in S63, the requirement on the gas filling pipe is high due to the fact that the high-pressure argon gas is introduced at an excessive speed, and the sealing performance is poor; the retention time is long at the high temperature when the speed is too low, the growth of the structure crystal grains is obvious, and the material performance is influenced, so the speed of introducing the high-pressure argon is controlled to be 0.04-0.07 MPa/min.
Specifically, in S63, the dwell time is 2-3 hours. The pressure maintaining time is short, the diffusion connection is insufficient, and the welding rate is low; the dwell time is long, the residence time is long at high temperature, the growth of structure crystal grains is obvious, and the material performance is influenced.
Example 3
This example provides a large area diffusion bonding method for a 5a90 aluminum lithium alloy three-layer plate part (1200 mm long, 400mm wide), using, for example, the mold of example 1, comprising the steps of:
s1, designing and manufacturing a diffusion bonding die according to the three-dimensional model size of the 5A90 aluminum lithium alloy three-layer plate part, and amplifying the size of a large-area diffusion bonding area by 3.5 per mill according to the size of the part;
s2, designing a 5A90 aluminum lithium alloy three-layer plate blank, wherein the blanking sizes of three plates are 1220mm multiplied by 420mm, and the blanking method adopts water cutting;
s3, carrying out acid cleaning surface treatment on the 5A90 aluminum lithium alloy three-piece plate by adopting mixed solution of hydrofluoric acid and nitric acid, and removing surface oxide skin; drawing a boundary line between a blank diffusion connection area and a non-diffusion connection area according to a three-layer plate part model, and uniformly spraying a BN (boron nitride) release agent on the surfaces of the non-diffusion connection areas of the three plates, as shown in figure 2;
s4, assembling the 5A90 aluminum lithium alloy three-sheet plate sprayed with the BN separant, wherein the surface sprayed with the BN separant pattern faces inwards during assembling, clamping the multilayer plate by using a flange to prevent dislocation after assembling, and performing peripheral fusion welding and vacuum tube welding on the 5A90 aluminum lithium alloy three-layer plate by adopting a manual argon arc welding mode to obtain a three-layer plate sealing element;
s5, placing the three-layer plate sealing element into a mould; respectively connecting an air duct of the upper die, a vacuum air duct of the lower die and a vacuum tube of the three-layer plate sealing element with a tube of equipment, and vacuumizing the vacuum tube of the three-layer plate sealing element before the upper die and the lower die are closed, wherein vacuumizing is carried out for three times, and each time lasts for 1-2 min; after the vacuum pumping is finished, the upper die and the lower die are assembled and the vacuum tube of the three-layer plate sealing element is continuously pumped to vacuum so as to ensure the vacuum degree in the three-layer plate sealing element in the diffusion connection process; placing the mold in a forming device, heating at the speed of 2 ℃/min, and preserving heat for 1 hour when the temperature reaches 535-545 ℃; the forming equipment applies proper mold closing force to the mold and continuously vacuumizes the space between the lower mold and the three-layer plate sealing element; then introducing high-pressure argon into the upper die gas cavity at the speed of 0.04MPa/min, and keeping the pressure for 2.5 hours after the gas pressure reaches 3.0MPa to finish the large-area diffusion connection of the 5A90 aluminum-lithium alloy three-layer plate.
Specifically, the number of the three-layer plate sealing members in S5 was 6, that is, the present example simultaneously performed 6 parts at a time (nos. 1 to 6), and the results of the dwell time, the sagging deformation amount, the diffusion welding rate, and the pass or fail are shown in table 1 below.
Comparative example 1
Comparative example 1 a 5a90 aluminum lithium alloy three-layer plate part was prepared using a conventional die having cavities on both the top and bottom (as shown in fig. 4), with 1 part prepared each time for a total of 6 parts (nos. D1-D6); the results of the preparation time, the sagging deformation amount, the diffusion welding rate and the pass or fail are shown in table 1 below.
As can be seen from Table 1, the 6 parts prepared in example 3 of the present application exhibited sag deformations of not more than 0.3mm, which were lower than those (0.4 to 0.8mm) of the comparative examples; the part qualification rate of this application embodiment is 100%, is higher than the qualification rate 67% of comparative example, and 6 parts of this application go on simultaneously, dwell time 2.5h, 6 part dwell time 15h of comparison file, this application embodiment efficiency obviously promotes.
Table 1 results of example 1 and comparative example 1
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Claims (10)
1. The diffusion connection mold is characterized by comprising an upper mold (1) and a lower mold (2) matched with the upper mold, wherein the upper mold (1) is provided with a first sealing stem (3), an air cavity (4) and an air duct (5) for filling high-pressure flexible air into the air cavity; the lower die (2) is of a flat plate structure, and the lower die (2) is provided with a second sealing stem (6) and a vacuum air channel (7); the lower die is provided with a vacuum air channel, so that air between the lower die and the multilayer plate can be effectively pumped out, and the flatness of the part is ensured; the position where the air duct (5) is connected with the air cavity (4) is positioned in the middle of the air cavity (4).
2. The diffusion bonding die of claim 1, wherein the material of the diffusion bonding die is stainless steel.
3. The diffusion bonding die of claim 1, wherein the hardness of the diffusion bonding die is 35-45 HRC.
4. A diffusion bonding method using the diffusion bonding mold according to any one of claims 1 to 3, the diffusion bonding method comprising the steps of:
s1, manufacturing a multi-layer board large-area diffusion connection blank;
s2, performing surface treatment on the multi-layer board large-area diffusion connection blank;
s3, manufacturing a parting agent pattern of the large-area diffusion connection blank of the multilayer board;
s4, assembling the large-area diffusion connection blank of the multilayer board, and performing peripheral fusion welding and vacuum tube welding to obtain a multilayer board sealing element;
s5, diffusion bonding the multilayer plate sealing element;
in S5, the number of the multilayer plate seals is 1 or more.
5. The diffusion bonding method of claim 4, wherein in S1, the size of each of the multi-layer plate blanks is the same, and the size of each of the multi-layer plate blanks is:
L1＝L2+2W3；W1＝W2+2W3；
in the formula, L1For the length of each ply blank, L2Is the length of the sealing stem of the lower die, W3To weld width, W1Width of each ply of the blank, W2The width of the sealing stem of the lower die.
6. The diffusion bonding method of claim 4, wherein in step S1, the method for making the multi-layer board large area diffusion bonding blank is water cutting, laser cutting or numerical control blanking.
7. The diffusion bonding method of claim 4, wherein in S2, the surface treatment method is chemical pickling or grinding and polishing.
8. The diffusion bonding method of claim 4, wherein in S3, the step of forming a release agent pattern comprises: and drawing a boundary line between a blank diffusion connection area and a non-diffusion connection area according to a multilayer plate part model, and spraying a release agent on the surface of the blank non-diffusion connection area.
9. The diffusion bonding method of claim 4 wherein in S5, diffusion bonding a multi-layer plate seal comprises the steps of:
s51, placing the multilayer plate sealing element in the S4 between the upper die and the lower die, and respectively connecting the air duct of the upper die, the vacuum air duct of the lower die and the vacuum tube of the multilayer plate sealing element;
s52, before the upper die and the lower die are assembled, vacuum-pumping is carried out on the vacuum tubes of the multilayer plate sealing element, then the upper die and the lower die are assembled, and the vacuum tubes of the multilayer plate sealing element are continuously vacuumized;
s53, heating the die to the diffusion bonding temperature of the multilayer board, then preserving heat, applying mold closing force to the die, and continuously vacuumizing the space between the lower die and the sealing element of the multilayer board; and introducing argon into the upper die gas cavity, keeping the pressure for 2-3h after the gas pressure reaches 2.5-3.5MPa, and completing the large-area diffusion connection of the multilayer board.
10. The diffusion bonding method of claim 9, wherein the argon gas is introduced into S53 at a rate of 0.04 to 0.07 MPa/min.
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| CN112959002B (en) * | 2021-02-01 | 2022-05-20 | 哈尔滨工业大学 | Superplastic forming/diffusion connection forming method for hollow lightweight structure with local weight-reduction thin-wall complex profile |
| CN113500263A (en) * | 2021-07-27 | 2021-10-15 | 苏州世沃电子科技有限公司 | Copper sheet welding method using new auxiliary carrier |
| CN113814655B (en) * | 2021-08-23 | 2023-12-08 | 成都飞机工业（集团）有限责任公司 | Complex-profile pneumatic loading superplastic forming diffusion connection method |
| CN114346396A (en) * | 2021-12-28 | 2022-04-15 | 北京航星机器制造有限公司 | Double-layer opening cover wall plate superplastic forming diffusion connection mold and method |
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| JPS56119686A (en) * | 1980-02-27 | 1981-09-19 | Mitsubishi Heavy Ind Ltd | Method for joining metal utilizing gaseous pressure |
| US5098011A (en) * | 1990-12-14 | 1992-03-24 | Mcdonnell Douglas Corporation | Method and tooling for fabricating monolithic metal or metal matrix composite structures |
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| CN108673909A (en) * | 2018-04-28 | 2018-10-19 | 武汉理工大学 | A kind of carbon fiber product molding/decoration integrated technique |
| CN109604410A (en) * | 2018-11-09 | 2019-04-12 | 南京航空航天大学 | A kind of titanium alloy multilayer plates fast shaping apptss and its manufacturing process |
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