CN110340539A - A kind of laser cutting method and laser cutting system - Google Patents
A kind of laser cutting method and laser cutting system Download PDFInfo
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- CN110340539A CN110340539A CN201810294061.1A CN201810294061A CN110340539A CN 110340539 A CN110340539 A CN 110340539A CN 201810294061 A CN201810294061 A CN 201810294061A CN 110340539 A CN110340539 A CN 110340539A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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Abstract
The invention discloses a kind of laser cutting method and laser cutting systems.This laser cutting method includes: the actual (real) thickness for obtaining workpiece to be cut；According to the actual (real) thickness of the workpiece to be cut, judge whether to adjust default cutting technique parameter；If so, being adjusted according to the actual (real) thickness of the workpiece to be cut, laser cutting mode and cutting beam type to technological parameter when being cut by laser, and it is cut by laser using the laser of technological parameter after adjustment；If it is not, being then cut by laser using the laser of the default cutting technique parameter.Technical solution of the present invention, technological parameter when by laser cutting is adjusted, and it is cut by laser using the laser of technological parameter after adjustment, the actual (real) thickness for being cut by laser technological parameter and workpiece to be cut used can be made to be adapted, solve the problems, such as that the cutting beam utilization rate generated when generalling use the workpiece to be cut of fixed parameter preset cutting different-thickness is not high or work piece cut is incomplete.
Description
Technical field
The present embodiments relate to transparent material laser cutting technique field more particularly to a kind of laser cutting method and swash
Light diced system.
Background technique
Transparent material laser cutting method mainly includes ablation and modified cutting at present, and ablation refers to laser arteries and veins
Punching acts on the surface of the material, takes away material, and cutting mode gradually deepening by forms such as melting, vaporization or ionization；It is modified
The effects of cutting is to focus the laser beam into material internal, is ionized by Multiphoton Absorbtion and tunnelling permanently changes Refractive Index of Material
Cutting mode.
When using laser cutting transparent material, it will usually set the default depth of cut of fixed predeterminated position and fixation
(depth of focus that default depth of cut is generally laser beam), and default depth of cut is usually set to the thickness of common workpiece, this
Sample leads to the utilization rate of laser beam in the workpiece of cutting thickness smaller (thickness of workpiece to be cut is less than default depth of cut)
It is lower；And when cutting the workpiece of thicker (actual (real) thickness of workpiece to be cut is greater than default depth of cut), since depth of cut is small
Cause work piece cut incomplete in thickness of workpiece, cutting effect is poor.
Summary of the invention
The present invention provides a kind of laser cutting method and laser cutting system, passes through the technological parameter for adjusting cutting, realizes
The cutting technique being adapted with thickness of workpiece to be cut.
In a first aspect, the embodiment of the present invention proposes a kind of laser cutting method method, this method comprises:
Obtain the actual (real) thickness of workpiece to be cut；
According to the actual (real) thickness of the workpiece to be cut, judge whether to adjust default cutting technique parameter；
If so, according to the actual (real) thickness of the workpiece to be cut, laser cutting mode and cutting beam type to laser
Technological parameter when cutting is adjusted, and is cut by laser using the laser of technological parameter after adjustment；
If it is not, being then cut by laser using the laser of the default cutting technique parameter.
Further, after the actual (real) thickness for obtaining workpiece to be cut further include:
Judge the actual (real) thickness whether within a preset range；
If within a preset range, being directly cut by laser according to preset technological parameter；
If not within a preset range, according to the difference or ratio of the actual (real) thickness of workpiece to be cut and preset thickness, with
And laser cutting mode and cutting beam type are adjusted technological parameter when being cut by laser.
Further, the laser cutting mode is modified cutting, when the cutting beam type is bessel beam, institute
State the actual (real) thickness according to workpiece to be cut, laser cutting mode and cutting beam type to laser cutting when technological parameter into
Row adjusts
The vertical position of cutting beam depth of focus and workpiece to be cut is adjusted.
Further, the laser cutting mode is modified cutting, when the cutting beam type is bessel beam, institute
State the actual (real) thickness according to workpiece to be cut, laser cutting mode and cutting beam type to laser cutting when technological parameter into
Row adjustment further include:
Cutting beam energy is adjusted.
Further, the cutting beam is laser beam after beam expanding lens carries out collimator and extender, through beam shaping element
Carry out the light beam that Shape correction obtains, the depth of focus and the collimator and extender of the cutting beam that the beam shaping element shaping obtains
The diameter direct proportionality of laser beam afterwards, described be adjusted to cutting beam depth of focus include:
The actual focal Lbr of the cutting beam is obtained according to the following formula:
Wherein, Lbs is the first default depth of focus of cutting beam, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is to be cut
First preset thickness of workpiece.
Further, the vertical position for treating cutting workpiece, which is adjusted, includes:
The practical vertical position Zbr of the workpiece to be cut is obtained according to the following formula:
Wherein, Zbs is the first default vertical position of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is
First preset thickness of workpiece to be cut.
Further, described be adjusted to cutting beam energy includes:
The actual energy Pbr of the cutting beam is obtained according to the following formula:
Wherein, Pbs is the preset energy of cutting beam, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is workpiece to be cut
The first preset thickness.
Further, the laser cutting mode is modified cutting, described when the cutting beam type is Gaussian beam
Technological parameter when according to the actual (real) thickness of workpiece to be cut, laser cutting mode and cutting beam type to laser cutting carries out
Adjustment includes:
Stepping number when to laser cutting is adjusted.
Further, stepping number when described pair of laser cutting, which is adjusted, includes:
Practical stepping times N gr is obtained according to the following formula:
Wherein, default stepping number when Ngs is laser cutting, number is rounded down to closest by int function stand
Integer, Tgs is the second preset thickness of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Lgs is cutting beam
Second default depth of focus.
Further, the laser cutting mode is ablation, described when the cutting beam type is Gaussian beam
Technological parameter when according to the actual (real) thickness of workpiece to be cut, laser cutting mode and cutting beam type to laser cutting carries out
Adjustment includes:
Stepping number and vertical initial position when to laser cutting are adjusted.
Further, stepping number when described pair of laser cutting and vertical initial position are adjusted and include:
Practical stepping times N gr is obtained according to the following formula:
Practical vertical initial position Zgr:Zgr=Zgs+ (Tgs-Tr) is obtained according to the following formula；
Wherein, default stepping number when Ngs is laser cutting, number is rounded down to closest by int function stand
Integer, Tgs is the second preset thickness of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Lgs is cutting beam
Second default depth of focus, Zgs preset vertical initial position for workpiece to be cut.
Second aspect, the embodiment of the present invention propose a kind of laser cutting system, which includes:
Laser light source；
At least one light path element, the laser beam for issuing laser light source are sent to workpiece to be cut；
Work stage, for carrying workpiece to be cut；
Thickness transducer, for detecting the thickness of the workpiece to be cut carried in work stage；
Controller is electrically connected with the thickness transducer, for obtaining the thickness of the workpiece to be cut, and according to institute
The thickness for stating workpiece to be cut judges whether to adjust default cutting technique parameter, if so, according to the thickness of the workpiece to be cut
Technological parameter when degree, laser cutting mode and cutting beam type are to laser cutting is adjusted, according to technique adjusted
At least one of laser light source described in state modulator, the light path element and described work stage are treated cutting workpiece and are cut
It cuts；If it is not, being then cut by laser using the laser of the default cutting technique parameter.
Further, at least one described light path element includes:
Beam expanding lens, the laser beam for issuing to laser light source carry out collimator and extender；
Beam shaping element, the laser beam after expanding for collimation carry out Shape correction and obtain bessel beam, institute
State the diameter pass in direct ratio of the depth of focus and the laser beam after described expand of the cutting beam that beam shaping element shaping obtains
System.
Further, the controller includes at least one in following module:
Beam energy control module is electrically connected with the laser light source, the laser issued for controlling the laser light source
Beam energy；
Beam expanding lens control module is electrically connected with the beam expanding lens, expands multiplying power for control the beam expanding lens；
Stage control module is electrically connected with the work stage, for controlling the vertical position of workpiece to be cut.
Further, the laser cutting system further include:
Microscope group is scaled, is arranged between the beam shaping element and the work stage, for compressing the beam shaping
The depth of focus and diameter for the cutting beam that component shaping obtains.
Further, the laser cutting system further include:
At least one reflecting mirror, it is whole for the laser beam after the beam expanding lens collimator and extender to be emitted to the light beam
On shape element.
Further, at least one described light path element includes:
Beam expanding lens, the laser beam for issuing to laser light source carry out collimator and extender.
Further, the laser cutting system further include:
At least one reflecting mirror, it is described to be cut for the laser beam after the beam expanding lens collimator and extender to be emitted to
On workpiece.
Further, the controller includes:
Stage control module is electrically connected with the work stage, for controlling the stepping number of work stage.
Further, the controller includes:
Stage control module is electrically connected with the work stage, for control the work stage stepping number and to
Cut the initial vertical position of workpiece.
The embodiment of the invention provides a kind of laser cutting methods, by obtaining the actual (real) thickness of workpiece to be cut, according to
The actual (real) thickness of the workpiece to be cut judges whether to adjust default cutting technique parameter, if so, according to the work to be cut
Technological parameter when actual (real) thickness, laser cutting mode and the cutting beam type of part are to laser cutting is adjusted, and is used
The laser of technological parameter is cut by laser after adjustment, in this way, can make to be cut by laser technological parameter and workpiece to be cut used
Actual (real) thickness be adapted, generated when solving the workpiece to be cut for generalling use fixed parameter preset cutting different-thickness
Cutting beam utilization rate is not high or the incomplete problem of work piece cut.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to do one simply to introduce, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of flow diagram for laser cutting method that the embodiment of the present invention one provides；
Fig. 2 is the flow diagram for another laser cutting method that the embodiment of the present invention one provides；
Fig. 3 is the flow diagram for another laser cutting method that the embodiment of the present invention one provides；
Fig. 4 is a kind of light distribution contrast schematic diagram for cutting beam that the embodiment of the present invention one provides；
Fig. 5 is the light distribution contrast schematic diagram for another cutting beam that the embodiment of the present invention one provides；
Fig. 6 is the flow diagram for another laser cutting method that the embodiment of the present invention one provides；
Fig. 7 is that the embodiment of the present invention one provides also a kind of flow diagram of laser cutting method；
Fig. 8 is a kind of structural schematic diagram of laser cutting system provided by Embodiment 2 of the present invention；
Fig. 9 is a kind of structural schematic diagram for laser cutting system that the embodiment of the present invention three provides.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Embodiment one
Fig. 1 is a kind of flow diagram for laser cutting method that the embodiment of the present invention one provides.The embodiment of the present invention
Technical solution can apply the laser cutting parameter in the workpiece to be cut of multi-thickness.Referring to Fig.1, the laser cutting method packet
It includes:
S110, the actual (real) thickness for obtaining workpiece to be cut.
Wherein, when the technological parameter of laser cutting is matched with the actual (real) thickness of workpiece to be cut, it can be only achieved and preferably cut
Cut effect, i.e., the utilization rate of cutting beam is higher while work piece cut to be cut is complete, therefore need to obtain workpiece to be cut
Actual (real) thickness, technical arrangement plan when to cut are prepared.
Illustratively, the mode for obtaining the actual (real) thickness of workpiece to be cut may include measuring reality by thickness transducer
Thickness, or the difference of the upper and lower surface of workpiece to be cut is measured to obtain actual (real) thickness, herein not by height sensor
It limits.
S120, according to the actual (real) thickness of workpiece to be cut, judge whether to adjust default cutting technique parameter.
Wherein, if default cutting technique parameter is matched with the actual (real) thickness of workpiece to be cut, i.e., using default cutting technique
The laser of parameter is cut, and may make work piece cut to be cut completely and the utilization efficiency of cutting beam is higher, then without adjusting
Whole default cutting technique parameter (N) executes step S140；Otherwise (Y) executes step S130.
Step S130, laser is cut according to the actual (real) thickness of workpiece to be cut, laser cutting mode and cutting beam type
Technological parameter when cutting is adjusted, and is cut by laser using the laser of technological parameter after adjustment.
Wherein, laser cutting mode may include modified cutting or ablation, cutting beam type may include shellfish
Sai Er light beam or Gaussian beam, technological parameter when laser cutting may include the depth of focus of cutting beam, workpiece to be cut
The technological parameters such as stepping number and vertical initial position when vertical position, the energy of cutting beam, laser cutting are adjusted
Section, and the adjusting of above-mentioned technological parameter is associated with the thickness of workpiece to be cut, thus above-mentioned when by laser cutting
The adjustment of one or several technological parameters can be such that the actual (real) thickness of technological parameter and workpiece to be cut when cutting is adapted, thus
Reach preferable cutting effect.
The thickness of the laser of technological parameter and workpiece to be cut is adapted after adjustment, is carried out according to the laser of this technological parameter
Laser cutting, can reach preferable cutting effect.
The laser cutting method that the embodiment of the present invention one provides, by obtaining the actual (real) thickness of workpiece to be cut, according to institute
The actual (real) thickness for stating workpiece to be cut judges whether to adjust default cutting technique parameter, if so, according to the workpiece to be cut
Actual (real) thickness, laser cutting mode and cutting beam type to laser cutting when technological parameter be adjusted, and using adjust
The laser of technological parameter is cut by laser after whole, in this way, can make to be cut by laser technological parameter and workpiece to be cut used
Actual (real) thickness is adapted, and what is generated when solving the workpiece to be cut for generalling use fixed parameter preset cutting different-thickness cuts
Cut that beam utilization is not high or the incomplete problem of work piece cut.
Optionally, Fig. 2 is the flow diagram for another laser cutting method that the embodiment of the present invention one provides.Referring to figure
2, which includes:
S210, the actual (real) thickness for obtaining workpiece to be cut.
S220, judge actual (real) thickness whether within a preset range.
Illustratively, preset range may include preset thickness range or preset thickness difference range, can be by reality
Thickness is compared with preset thickness range to be judged, can also be by the difference of actual (real) thickness and preset thickness and preset thickness difference
Range comparison is judged, is not limited thereto.
If (Y), thens follow the steps S230.
Illustratively, actual (real) thickness is within the scope of preset thickness or the difference of actual (real) thickness and preset thickness is default
Within the scope of thickness difference, indicate that preset technological parameter is suitable for the actual (real) thickness of this workpiece to be cut, because without to cutting
When technological parameter be adjusted, i.e., execution step S230.
S230, it is directly cut by laser according to preset technological parameter.
Wherein, this step may include directly according to the default depth of focus of cutting beam, workpiece to be cut default vertical position,
Default stepping number when the preset energy of cutting beam, laser cutting and preset the progress of the technological parameters such as vertical initial position
Laser cutting.
(N) if not thens follow the steps S240 and step S250.
Illustratively, actual (real) thickness is not within the scope of preset thickness or the difference of actual (real) thickness and preset thickness does not exist
It in preset thickness difference range, indicates that preset technological parameter is no longer desirable for the actual (real) thickness of this workpiece to be cut, thus needs
Technological parameter when will be to cutting is adjusted and is cut by laser using the laser of technological parameter after adjustment, i.e. execution step
S240 and step S250.
S240, according to the actual (real) thickness of workpiece to be cut and the difference of preset thickness or ratio, and laser cutting mode
Technological parameter when with cutting beam type to laser cutting is adjusted.
S250, it is cut by laser using the laser of technological parameter after adjustment.
It should be noted that above-mentioned steps S230 can also regard as in step S240 according to multiple be 1 pair it is above-mentioned preset
Technological parameter is adjusted.
Optionally, Fig. 3 is the flow diagram for another laser cutting method that the embodiment of the present invention one provides, described to swash
Light cutting mode is modified cutting, and the cutting beam type is bessel beam, which includes:
S310, the actual (real) thickness (illustratively being shown with Tr) for obtaining workpiece to be cut.
S320, judge actual (real) thickness whether within a preset range.
Illustratively, it can be obtained according to the actual (real) thickness Tr of workpiece to be cut and the first preset thickness Tbs of workpiece to be cut
Take first thickness difference DELTA T1: Δ T1=Tbs-Tr；Judge the absolute value of first thickness difference DELTA T1 with thickness reserved T0's
Size relation.
Wherein, the relationship of thickness reserved T0 and the first preset thickness Tbs are as follows: T0=(1-k) × Tbs；K is known as influencing system
Number.
For the laser cutting method of cutting modified for bessel beam, show cutting beam with Lbs first is preset
Depth of focus, it is usual with the relationship of the first preset thickness Tbs are as follows: Lbs=k × Tbs.Illustratively, the value range of k are as follows: 0.9 < k
< 1, at this point, the first default depth of focus of cutting beam is both able to satisfy the body region for covering workpiece to be cut, it is convenient for subsequent sliver,
It will not be applied to the surface of workpiece to be cut again.
Illustratively, when the value of the first preset thickness Tbs is 2 millimeters (mm), the default depth of focus of the first of cutting beam
The value range of Lbs are as follows: 1.8mm < Lbs < 2mm, the value range of thickness reserved T0 are as follows: 0mm < T0 < 0.2mm.
If (Y), thens follow the steps S330.
Wherein, if first thickness difference DELTA T1 is within the scope of thickness reserved T0, i.e. first thickness difference DELTA T1 be less than or
Person is equal to thickness reserved T0, i.e. Δ T1≤T0 thens follow the steps S330.
Illustratively, when the actual (real) thickness Tr of workpiece to be cut is 1.9 millimeters (mm), first thickness difference DELTA T1 is 0.1
Millimeter (mm) thens follow the steps S330 in the value range of above-mentioned thickness reserved T0.
S330, it is cut by laser using the laser of predetermined process parameter.
(N) if not thens follow the steps S340 and step S360.
Wherein, if first thickness difference DELTA T1 is not within the scope of thickness reserved T0, i.e., first thickness difference DELTA T1 is greater than
Thickness reserved T0, i.e. Δ T1 > T0, then follow the steps S340 and step S360.
Illustratively, when the actual (real) thickness Tr of workpiece to be cut is 1.5 millimeters (mm), first thickness difference DELTA T1 is 0.5
Millimeter (mm) thens follow the steps S340 and step S360 not in the value range of above-mentioned thickness reserved T0.
S340, the vertical position of cutting beam depth of focus and workpiece to be cut is adjusted.
Wherein, when the actual (real) thickness Tr of workpiece to be cut is larger, depth of focus the covering in workpiece to be cut of cutting beam
Lid rate is insufficient, can reduce cutting efficiency；When the actual (real) thickness Tr of workpiece to be cut is smaller, the depth of focus of cutting beam will be applied to
The outside of workpiece to be cut reduces the utilization rate of cutting beam, and possible disfiguring workpiece platform, is needed as a result, according to workpiece to be cut
Actual (real) thickness Tr adjustment cutting beam depth of focus.
Meanwhile when the actual (real) thickness Tr of workpiece to be cut is larger, the center of the depth of focus of cutting beam will be skewed towards acting on
The lower part of workpiece to be cut；When the actual (real) thickness Tr of workpiece to be cut is smaller, the center of the depth of focus of cutting beam will be skewed towards making
Used in the top of workpiece to be cut, the vertical position that workpiece to be cut is adjusted according to the actual (real) thickness Tr of workpiece to be cut is needed as a result,
It sets, so that central role of the depth of focus of cutting beam is at the center of workpiece to be cut.
To sum up, when being adjusted to the vertical position of cutting beam depth of focus and workpiece to be cut, the practical coke of cutting beam
The vertical position (illustratively being shown with Zbr) and workpiece to be cut of deep (illustratively being shown with Lbr) and workpiece to be cut
The size relation of actual (real) thickness Tr and the first preset thickness Tbs are related, specifically, if the actual (real) thickness of workpiece to be cut is larger
Tr, i.e. Tr > Tbs then increase the actual focal of cutting beam, reduce the vertical position of workpiece to be cut；If workpiece to be cut
Actual (real) thickness smaller Tr, i.e. Tr < Tbs then reduce the actual focal of cutting beam, increase the vertical position of workpiece to be cut.
It should be noted that the term positions such as "upper" here, "lower", " reduction " and " raising " are relative to cutting
Light beam is from top to bottom incident on vertically for the situation of workpiece to be cut, only to laser cutting method provided by the invention
Illustrate, and non-limiting.In other embodiments, it using principle provided by the invention, can be adjusted according to actual positional relationship
It is whole.
Optionally, the cutting beam be laser beam through beam expanding lens carry out collimator and extender after, through beam shaping element into
After the light beam that row Shape correction obtains, the depth of focus of the cutting beam that the beam shaping element shaping obtains and the collimator and extender
Laser beam diameter direct proportionality, described be adjusted to cutting beam depth of focus include:
The actual focal Lbr of the cutting beam is obtained according to the following formula:
Wherein, Lbs is the first default depth of focus of cutting beam, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is to be cut
First preset thickness of workpiece.
Illustratively, the value of the first preset thickness Tbs of workpiece to be cut be 2 millimeters (mm), the first of cutting beam
Default 1.8 millimeters of depth of focus Lbs (mm), the actual (real) thickness Tr of workpiece to be cut are 1.5 millimeters (mm), then cutting beam is optimal
Actual focal Lbr is 1.35 millimeters (mm).
Illustratively, the value of the first preset thickness Tbs of workpiece to be cut be 2 millimeters (mm), the first of cutting beam
Default 1.8 millimeters of depth of focus Lbs (mm), the actual (real) thickness Tr of workpiece to be cut are 2.5 millimeters (mm), then cutting beam is optimal
Actual focal Lbr is 2.25 millimeters (mm).
It wherein, can be by the laser after collimated expand to the adjusting of cutting beam depth of focus (illustratively being shown with L)
The adjusting of the diameter (illustratively being shown with w0) of light beam is realized, specifically, the relationship of the two are as follows:Its
In, n is the refractive index of beam shaping element, and α is the cone angle of beam shaping element (illustratively can be axicon).In light beam
In the case that shaping element is fixed, the depth of focus L diameter w0 with the laser beam for being incident on beam shaping element of cutting beam
Therefore direct proportionality can be realized by the adjusting of the diameter w0 to the laser beam for being incident on beam shaping element to cutting
The adjusting of the depth of focus L of light beam is cut, and the multiple adjusted needed for the two is consistent.
Illustratively, the depth of focus L of cutting beam is adjusted from 1.8 millimeters (mm) to 1.35 millimeters (mm), can be by will be incident
Diameter w0 to the laser beam of beam shaping element is adjusted to 2.25 millimeters of (mm) Lai Shixian from preset 3 millimeters (mm).
Illustratively, the depth of focus L of cutting beam is adjusted from 1.8 millimeters (mm) to 2.25 millimeters (mm), can be by will be incident
Diameter w0 to the laser beam of beam shaping element is adjusted to 3.75 millimeters of (mm) Lai Shixian from preset 3 millimeters (mm).
Optionally, the vertical position for treating cutting workpiece, which is adjusted, includes:
The practical vertical position Zbr of the workpiece to be cut is obtained according to the following formula:
Wherein, Zbs is the first default vertical position of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is
First preset thickness of workpiece to be cut.
After the depth of focus to cutting beam is adjusted, due to center (the referred to depth of focus total length of cutting beam
1/2 at) do not change, therefore the vertical position of workpiece to be cut need to be adjusted, make workpiece to be cut center (to
Cut workpiece 1/2 thickness position) be overlapped with the center of cutting beam, thus guarantee the depth of focus of cutting beam be respectively positioned on to
The inside for cutting workpiece, realizes making full use of for cutting beam.
Illustratively, the first of workpiece to be cut the default vertical position Zbs be 10 millimeters (mm), the first of workpiece to be cut
The value of preset thickness Tbs is 2 millimeters (mm), and the actual (real) thickness Tr of workpiece to be cut is 1.5 millimeters (mm), then workpiece to be cut
Practical vertical position Zbr be 10.25 millimeters (mm).
Illustratively, the first of workpiece to be cut the default vertical position Zbs be 10 millimeters (mm), the first of workpiece to be cut
The value of preset thickness Tbs is 2 millimeters (mm), and the actual (real) thickness Tr of workpiece to be cut is 2.5 millimeters (mm), then workpiece to be cut
Practical vertical position Zbr be 9.75 millimeters (mm).
S360, it is cut by laser using the laser of technological parameter after adjustment.
Laser is carried out according to the practical vertical position Zbr of the actual focal Lbr of cutting beam and workpiece to be cut to cut
It cuts.
Optionally, further include step S350 before step S360, the step S350 and step S340 can simultaneously into
Perhaps step S350 is carried out row after step S340 or step S350 is carried out before step S340.That is, the present invention is real
Example is applied to each laser cutting process parameter such as the vertical position of cutting beam depth of focus, workpiece to be cut and the energy of cutting beam
Adjustment sequence does not limit.
S350, cutting beam energy is adjusted.
Wherein, in the case where constant for the gross energy of cutting beam, when the actual (real) thickness Tr of workpiece to be cut is larger,
The depth of focus of cutting beam is matching, i.e., the actual focal Lbr of cutting beam increases, thus the light in each section of cutting beam
Beam energy (illustratively being indicated with the energy density of cutting beam) is opposite to be reduced, and can pass through the total energy of increase cutting beam at this time
Amount makes the beam energy on each section of cutting beam meet cutting demand；When the actual (real) thickness Tr of workpiece to be cut is smaller,
The depth of focus of cutting beam is matching, i.e., the actual focal Lbr of cutting beam is reduced, thus the light in each section of cutting beam
Beam energy (illustratively being indicated with the energy density of cutting beam) is opposite to be increased, and can pass through the total energy of reduction cutting beam at this time
Amount makes the beam energy on each section of cutting beam be no more than energy threshold.
To, when being adjusted to cutting beam energy, the actual energy (illustratively being shown with Pbr) of cutting beam with
The size relation of the actual (real) thickness Tr of workpiece to be cut and the first preset thickness Tbs is related, specifically, if workpiece to be cut
Actual (real) thickness larger Tr, i.e. Tr > Tbs then increase the actual energy of cutting beam；If the actual (real) thickness of workpiece to be cut is smaller
Tr, i.e. Tr < Tbs then reduce the actual energy of cutting beam.
Optionally, described be adjusted to cutting beam energy includes:
The actual energy Pbr of the cutting beam is obtained according to the following formula:
Wherein, Pbs is the preset energy of cutting beam, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is workpiece to be cut
The first preset thickness.
Illustratively, Fig. 4 and Fig. 5 illustrates the variation of cutting beam energy by cutting beam along axial light distribution.
Fig. 4 is a kind of light distribution contrast schematic diagram for cutting beam that the embodiment of the present invention one provides；Fig. 5 is the embodiment of the present invention one
The light distribution contrast schematic diagram of another cutting beam of offer.Referring to Fig. 4 and Fig. 5, abscissa represents the axis of cutting beam
To length Z, unit is micron (μm), and ordinate represents the intensity P of cutting beam, and unit is milliwatt (mW), camber line 111 and arc
Before the representative of line 121 does not adjust cutting beam energy, the diameter w0 for being incident on the laser beam of beam shaping element is what 1mm was obtained
Cutting beam along axial intensity distribution, camber line 112 represent adjust cutting beam depth of focus (it is illustrative, can be by will be incident
Diameter w0 to the laser beam of beam shaping element is adjusted to 2mm and realizes) but when not adjusting the energy of cutting beam, cut light
For beam along axial intensity distribution, the depth of focus that camber line 122 represents adjusting cutting beam (illustratively, can be by that will be incident on light beam
The diameter w0 of the laser beam of shaping element is adjusted to 2mm realization) while when adjusting the energy of cutting beam, cutting beam is along axis
To intensity distribution.Referring to fig. 4, corresponding to make if not adjusting the energy of cutting beam when the depth of focus of cutting beam reduces
The light intensity (corresponding energy density) used on workpiece to be cut will increase, and may exceed the threshold range of standard, cause to be cut
Cut the damage of workpiece.For this purpose, (light of the laser beam of beam shaping element can be incident on by changing cutting beam energy
This is adjusted by force), adjustment result can be found in Fig. 5, by the adjustment to cutting beam energy, so that cutting beam edge
Axial actual light intensity maximum is equal with the intensity maxima before adjustment, and beam energy distribution is constant, so that cutting light
The actual energy of beam is no more than energy threshold while meeting cutting demand.
So far, it may include vertical according to the actual focal Lbr of cutting beam, the reality of workpiece to be cut for executing step S360
The actual energy Pbr of position Zbr and cutting beam is cut by laser, and the depth of focus of cutting beam is covered to be cut
The main body of workpiece, the center of cutting beam is located at the center of workpiece to be cut, and the Energy distribution of cutting beam remains unchanged, from
And the actual (real) thickness of laser cutting method and workpiece to be cut is adapted to, the benefit of cutting beam is improved while improving cutting efficiency
With rate.
Optionally, Fig. 6 is the flow diagram for another laser cutting method that the embodiment of the present invention one provides, described to swash
Light cutting mode is modified cutting, and the cutting beam type is Gaussian beam, which includes:
S410, the actual (real) thickness (illustratively being shown with Tr) for obtaining workpiece to be cut.
S420, judge actual (real) thickness whether within a preset range.
Illustratively, it can be obtained according to the actual (real) thickness Tr of workpiece to be cut and the second preset thickness Tgs of workpiece to be cut
Second thickness difference DELTA T2 is taken, Δ T2=| Tgs-Tr |；Judge the size of the default depth of focus Lgs of second thickness difference DELTA T2 and second
Relationship.
Illustratively, the second default depth of focus Lgs can be Focal Depth for Gaussian Beam.
If (Y), thens follow the steps S430.
Wherein, if second thickness difference DELTA T2 is within the scope of the second default depth of focus Lgs, i.e., second thickness difference DELTA T2 is less than
Or being equal to the second default depth of focus Lgs, i.e. Δ T2≤Lgs thens follow the steps S430.
Illustratively, the second default depth of focus Lgs can be 45 microns (μm), and the second preset thickness Tgs is 50 microns (μm), to
When the actual (real) thickness Tr for cutting workpiece is 70 microns (μm), second thickness difference DELTA T2 is 25 microns (μm), pre- above-mentioned second
If thening follow the steps S430 in depth of focus Lgs value range.
S430, it is cut by laser using the laser of predetermined process parameter.
Illustratively, technological parameter may include stepping number.It is cut by laser using default stepping number.
(N) if not thens follow the steps S440 and step S450.
Wherein, if second thickness difference DELTA T2 is not within the scope of the second default depth of focus Lgs, i.e., second thickness difference DELTA T2 is big
In the second default depth of focus Lgs, i.e. Δ T2 > Lgs thens follow the steps S440 and step S450.
Illustratively, the second default depth of focus Lgs can be 45 microns (μm), and the second preset thickness Tgs is 50 microns (μm), to
When the actual (real) thickness Tr for cutting workpiece is 100 microns (μm), second thickness difference DELTA T2 is 55 microns (μm), not above-mentioned second
In default depth of focus Lgs value range, S440 and step S450 are thened follow the steps.
S440, stepping number when being cut by laser is adjusted.
Wherein, for Gaussian beam, (illustratively may be used since the adjustment of its depth of focus needs replacing focus optics
For amasthenic lens), and changeable focal depth range is smaller, therefore does not adjust to depth of focus generally in laser cutting process.
Meanwhile when treating cutting workpiece using modified cutting mode and being cut, it is desirable that cutting beam acts on inside workpiece to be cut,
Therefore the vertical initial position of cutting can be theoretically inside workpiece to be cut close to bottom surface or inside workpiece to be cut
Close to the position of upper bottom surface；But to prevent in cutting beam Multiple-Scan cutting process, previous cutting beam is to be cut
Cutting the variation of workpiece material structure bring can cause to scatter and reflect etc. to a rear cutting beam to influence, and usually utilize Gauss
It is more reasonable using step-scan mode from lower to upper when light beam is modified cutting.It is therefore not necessary to treat the first of cutting workpiece
Beginning vertical position is adjusted, it is only necessary to its stepping number (vertical stepping number) is adjusted according to the actual (real) thickness of workpiece to be cut,
Then change the overlay area of cutting beam effect.
It should be noted that the term positions such as "upper", "lower" here are vertical from top to bottom relative to cutting beam
It is incident on for the situation of workpiece to be cut, only the explanation to laser cutting method provided by the invention, and non-limiting.?
In other embodiments, using principle provided by the invention, it can be adjusted according to actual positional relationship.
To, when being adjusted to stepping number, practical stepping number (illustratively being shown with Ngr) and workpiece to be cut
Actual (real) thickness Tr and the second preset thickness Tgs size relation it is related, specifically, if the actual (real) thickness of workpiece to be cut compared with
Big Tr, i.e. Tr > Tgs then increase practical stepping number；If the actual (real) thickness of workpiece to be cut smaller Tr, i.e. Tr < Tgs is then reduced
Practical stepping number.
Optionally, stepping number when described pair of laser cutting, which is adjusted, includes:
Practical stepping times N gr is obtained according to the following formula:
Wherein, default stepping number when Ngs is laser cutting, number is rounded down to closest by int function stand
Integer, Tgs is the second preset thickness of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Lgs is cutting beam
Second default depth of focus.
Illustratively, the second default depth of focus Lgs can be 45 microns (μm), and the second preset thickness Tgs is 50 microns (μm), to
When the actual (real) thickness Tr for cutting workpiece is 100 microns (μm), presetting stepping times N gs is 1 time, then practical stepping times N gr is 3
It is secondary.
S450, it is cut by laser using the laser of technological parameter after adjustment.
It is cut by laser according to practical stepping times N gr.
Optionally, Fig. 7 is that the embodiment of the present invention one provides also a kind of flow diagram of laser cutting method, described to swash
Light cutting mode is ablation, and the cutting beam type is Gaussian beam, which includes:
S510, the actual (real) thickness (illustratively being shown with Tr) for obtaining workpiece to be cut.
S520, judge actual (real) thickness whether within a preset range.
Illustratively, it can be obtained according to the actual (real) thickness Tr of workpiece to be cut and the second preset thickness Tgs of workpiece to be cut
Second thickness difference DELTA T2 is taken, Δ T2=| Tgs-Tr |；Judge the size of the default depth of focus Lgs of second thickness difference DELTA T2 and second
Relationship.
Illustratively, the second default depth of focus Lgs can be Focal Depth for Gaussian Beam.
If (Y), thens follow the steps S530.
Wherein, if second thickness difference DELTA T2 is within the scope of the second default depth of focus Lgs, i.e., second thickness difference DELTA T2 is less than
Or being equal to the second default depth of focus Lgs, i.e. Δ T2≤Lgs thens follow the steps S530.
Illustratively, the second default depth of focus Lgs can be 45 microns (μm), and the second preset thickness Tgs is 50 microns (μm), to
When the actual (real) thickness Tr for cutting workpiece is 70 microns (μm), second thickness difference DELTA T2 is 25 microns (μm), pre- above-mentioned second
If thening follow the steps S530 in depth of focus Lgs value range.
S530, it is cut by laser using the laser of predetermined process parameter.
Illustratively, technological parameter may include stepping number and vertical initial position.I.e. using default stepping number and in advance
If vertical initial position is cut by laser.
(N) if not thens follow the steps S540 and step S550.
Wherein, if second thickness difference DELTA T2 is not within the scope of the second default depth of focus Lgs, i.e., second thickness difference DELTA T2 is big
In the second default depth of focus Lgs, i.e. Δ T2 > Lgs thens follow the steps S540 and step S550.
Illustratively, the second default depth of focus Lgs can be 45 microns (μm), and the second preset thickness Tgs is 50 microns (μm), to
When the actual (real) thickness Tr for cutting workpiece is 100 microns (μm), second thickness difference DELTA T2 is 55 microns (μm), not above-mentioned second
In default depth of focus Lgs value range, S540 and step S550 are thened follow the steps.
S540, to laser cutting when stepping number and vertical initial position be adjusted.
Wherein, for Gaussian beam, (illustratively may be used since the adjustment of its depth of focus needs replacing focus optics
For amasthenic lens), and changeable focal depth range is smaller, therefore does not adjust to depth of focus generally in laser cutting process.
Meanwhile using ablation mode treat cutting workpiece cut when, it is desirable that cutting process is from the surface layer of workpiece to be cut
It is gradually carried out to the inside of workpiece to be cut, therefore when the thickness change of workpiece to be cut, the focal position of cutting beam is remote
Surface from workpiece to be cut, therefore not only the vertical stepping number of stepping needs to adjust, the vertical initial position of workpiece to be cut
It is also required to adjust.
When being adjusted to stepping number and vertical initial position, practical stepping number (illustratively being shown with Ngr) and
Practical vertical initial position Zgr is related with the size relation of the actual (real) thickness Tr of workpiece to be cut and the second preset thickness Tgs,
Specifically, if the actual (real) thickness of workpiece to be cut larger Tr, i.e. Tr > Tgs, then increase practical stepping number, reduce work to be cut
The vertical initial position of the reality of part；If the actual (real) thickness of workpiece to be cut smaller Tr, i.e. Tr < Tgs, then practical stepping time is reduced
Number, increases the vertical initial position of reality of workpiece to be cut.
It should be noted that the term positions such as " reduction " and " raising " here be relative to cutting beam by up to
It is incident on vertically down for the situation of workpiece to be cut, the explanation only to laser cutting method provided by the invention, not
It limits.In other embodiments, it using principle provided by the invention, can be adjusted according to actual positional relationship.
Optionally, stepping number when described pair of laser cutting and vertical initial position are adjusted and include:
Practical stepping times N gr is obtained according to the following formula:
Practical vertical initial position Zgr:Zgr=Zgs+ (Tgs-Tr) is obtained according to the following formula；
Wherein, default stepping number when Ngs is laser cutting, number is rounded down to closest by int function stand
Integer, Tgs is the second preset thickness of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Lgs is cutting beam
Second default depth of focus, Zgs preset vertical initial position for workpiece to be cut.
Illustratively, the second default depth of focus Lgs can be 45 microns (μm), and the second preset thickness Tgs is 50 microns (μm), to
The vertical initial position Zgs that presets of cutting workpiece is 200 microns (μm), when the actual (real) thickness Tr of workpiece to be cut is 100 microns
When (μm), presetting stepping times N gs is 1 time, then practical stepping times N gr is 3 times, the vertical initial bit of the reality of workpiece to be cut
Setting Zgr is 150 microns (μm).
S550, it is cut by laser using the laser of technological parameter after adjustment.
It is cut by laser according to practical stepping times N gr and practical vertical initial position Zgr
The laser cutting method that the embodiment of the present invention one provides, by obtaining the actual (real) thickness of workpiece to be cut, according to
It cuts the actual (real) thickness of workpiece and is cut by laser the technological parameter of mode and cutting beam type to laser cutting when and adjust
It is whole, and be cut by laser using the laser of technological parameter after adjustment, can make to be cut by laser technological parameter used with it is to be cut
The actual (real) thickness of workpiece is adapted, and improves cutting efficiency while improving the utilization efficiency of cutting beam, solves and generally use
The cutting beam utilization rate generated when the workpiece to be cut of fixed parameter preset cutting different-thickness is not high or work piece cut not
Complete problem.
Embodiment two
Fig. 8 is a kind of structural schematic diagram of laser cutting system provided by Embodiment 2 of the present invention, for executing above-mentioned reality
Apply laser cutting method when cutting beam is bessel beam in example one.Referring to Fig. 8, on the basis of the above embodiment 1,
The laser cutting system includes: laser light source 10；At least one light path element 20, the laser light for issuing laser light source 10
Beam (illustratively showing direction of beam propagation in Fig. 8 with the straight line with filled arrows) is sent on workpiece 100 to be cut；Workpiece
Platform 30, for carrying workpiece 100 to be cut；Thickness transducer 40, for detecting the workpiece to be cut 100 carried in work stage 30
Thickness；Controller 50 is electrically connected with thickness transducer 40, the thickness of the workpiece to be cut 100 for acquisition, and according to be cut
The thickness for cutting workpiece 100 judges whether to adjust default cutting technique parameter, if so, according to the thickness of the workpiece 100 to be cut
Degree, laser cutting mode and cutting beam type and technological parameter when to laser cutting are adjusted, according to adjusted
At least one of process parameter control laser light source 10, light path element 20 and work stage 30 are treated cutting workpiece 100 and are cut
It cuts；If it is not, being then cut by laser using the laser of the default cutting technique parameter.
Wherein, work stage 30 is the work stage that can be moved in X, Y, Z and Rz four dimensions, and wherein represent can be for Rz dimension
It is rotated in X/Y plane along Z axis.
Optionally, at least one light path element 20 includes: beam expanding lens 21, the laser beam for issuing to laser light source 10
Carry out collimator and extender；Beam shaping element 22, the laser beam after expanding for collimation carry out Shape correction and obtain Bezier
Light beam (depth of focus for illustratively showing bessel beam in Fig. 8 with 200), the cutting beam that 22 shaping of beam shaping element obtains
Depth of focus (illustratively being shown with L) with expand after laser beam (illustratively being shown with w0) diameter pass in direct ratio
System:
Specifically,Wherein, n is the refractive index of beam shaping element, and α is that beam shaping element (shows
Example property can be axicon) cone angle.
Illustratively, beam shaping element 22 may include axicon, diffraction element or non-axial symmetrical lens.Beam shaping
Element 22, so that the depth of focus of the cutting beam after shaping adapts to cutting demand, can be incited somebody to action by the depth of focus of extension elongation cutting beam
The inside that cutting beam after this shaping is applied to workpiece to be cut is modified cutting, and cutting efficiency can be improved.
Merely exemplary in the present embodiment with axicon is to illustrate the effect of beam shaping element 22.Pass through axicon
The Diode laser shaping light beam that shaping is formed is known as bessel beam, and bessel beam has center spot energy height, side-lobe energy
Low feature.When laser cutting, the main interaction using between center spot and workpiece material to be cut, and theoretically exist
On beam Propagation direction, center spot diameter radially does not change；The depth of focus of bessel beam can by adjust into
The laser beam spot sizes for being mapped to axicon determine.
Optionally, controller 50 includes at least one in following module:
Beam energy control module 51 is electrically connected with laser light source 10, for controlling the laser light of the sending of laser light source 10
Beam energy；Beam expanding lens control module 52 is electrically connected with beam expanding lens 21, expands multiplying power for control beam expanding lens 21；Work stage control
Molding block 53 is electrically connected with work stage 30, for controlling the vertical position of workpiece 100 to be cut.
Wherein, the multiplying power that expands of beam expanding lens 21 determines the diameter w0 of the laser beam after expanding, to further determine warp
The depth of focus L for the cutting beam that 22 shaping of beam shaping element obtains.
Illustratively, the multiplying power that expands of beam expanding lens may be expressed as:The actual (real) thickness Tr of workpiece i.e. to be cut and default thickness
Spend the ratio of Ts.
Optionally, laser cutting system further include: scaling microscope group 60 is arranged in beam shaping element 22 and work stage 30
Between, depth of focus and diameter for the cutting beam that 22 shaping of compression light beam shaping element obtains.
Illustratively, the depth of focus of the bessel beam directly obtained by 22 shaping of beam shaping element is much larger than work to be cut
The thickness of part, and spot size is larger, is compressed to bessel beam along the direction XY and Z-direction by scaling microscope group 60, from
And depth of focus and spot size needed for reaching the corresponding laser cutting light beam of workpiece to be cut.
Optionally, laser cutting system further include: at least one reflecting mirror 70, being used for will be through 21 collimator and extender of beam expanding lens
Laser beam afterwards is emitted on beam shaping element 22.
It should be noted that merely exemplary in Fig. 8 show 3 reflecting mirrors 70, but not to the embodiment of the present invention two
The restriction of the laser cutting system of offer, in other embodiments, can be arranged according to actual needs reflecting mirror 70 number and
Position, can reach will be emitted on beam shaping element 22 by the laser beam after 21 collimator and extender of beam expanding lens.
Laser cutting system provided by Embodiment 2 of the present invention generates laser beam by laser light source, passes through at least one
A light path element sends the laser beam emitted by laser light source on workpiece to be cut, by thickness transducer detection to
The thickness for cutting workpiece is cut by the thickness for the workpiece to be cut that controller is detected according to thickness transducer, and in conjunction with laser
Cut mode and cutting beam type to laser cutting when technological parameter be adjusted, and using adjustment after technological parameter swash
Light is cut by laser, so that the actual (real) thickness of technological parameter adjusted and workpiece to be cut is adapted, improves laser cutting
The utilization rate that cutting beam is improved while efficiency solves and generallys use the to be cut of fixed parameter preset cutting different-thickness
The cutting beam utilization rate generated when cutting workpiece is not high or the incomplete problem of work piece cut.
Embodiment three
Fig. 9 is a kind of structural schematic diagram for laser cutting system that the embodiment of the present invention three provides, for executing above-mentioned reality
Apply laser cutting method when a kind of cutting beam of example is Gaussian beam.It, on the basis of the above embodiment 1, should referring to Fig. 9
Laser cutting system includes: laser light source 10；At least one light path element 20, the laser beam for issuing laser light source 10
(illustratively showing direction of beam propagation in Fig. 9 with the straight line with filled arrows) is sent on workpiece 100 to be cut；Work stage
30, for carrying workpiece 100 to be cut；Thickness transducer 40, for detecting the workpiece to be cut 100 carried in work stage 30
Thickness；Controller 50 is electrically connected with thickness transducer 40, the thickness of the workpiece to be cut 100 for acquisition, and according to be cut
The thickness of workpiece 100 judges whether to adjust default cutting technique parameter, if so, according to the thickness of the workpiece 100 to be cut
Degree, laser cutting mode and cutting beam type and technological parameter when to laser cutting are adjusted, according to adjusted
At least one of process parameter control laser light source 10, light path element 20 and work stage 30 are treated cutting workpiece 100 and are cut
It cuts；If it is not, being then cut by laser using the laser of the default cutting technique parameter.
Wherein, work stage 30 is the work stage that can be moved in X, Y, Z and Rz four dimensions, and wherein represent can be for Rz dimension
It is rotated in X/Y plane along Z axis.
Optionally, at least one light path element 20 includes: beam expanding lens 21, the laser beam for issuing to laser light source 10
Carry out collimator and extender.
Wherein, light path element 20 can also include focus lens group 22, and illustratively, focus lens group 22 can be focus lamp
Head.
Optionally, laser cutting system further include: at least one reflecting mirror 70, being used for will be through 21 collimator and extender of beam expanding lens
Laser beam afterwards is emitted on workpiece 100 to be cut.
It should be noted that merely exemplary in Fig. 9 show 3 reflecting mirrors 70, but not to the embodiment of the present invention three
The restriction of the laser cutting system of offer, in other embodiments, can be arranged according to actual needs reflecting mirror 70 number and
Position, can reach will be emitted on workpiece 100 to be cut by the laser beam after 21 collimator and extender of beam expanding lens.
Optionally, when the laser cutting mode is modified cutting, controller 50 includes: stage control module 53,
It is electrically connected with work stage 30, for controlling the stepping number of work stage 30.
Wherein, when treating cutting workpiece using modified cutting mode and being cut, it is desirable that cutting beam acts on to be cut
Inside workpiece, therefore the vertical initial position cut can be theoretically inside workpiece to be cut close to bottom surface or to be cut
Inside workpiece is close to the position of upper bottom surface；But to prevent in cutting beam Multiple-Scan cutting process, previous cutting light
Beam treats the variation of cutting workpiece material structure bring and can cause to scatter and reflect etc. to a rear cutting beam to influence, and usually exists
It is more reasonable using step-scan mode from lower to upper when being modified cutting using Gaussian beam.It is therefore not necessary to to be cut
The initial vertical position of workpiece is adjusted, it is only necessary to adjust its stepping number (vertical step according to the actual (real) thickness of workpiece to be cut
Into number), then change the overlay area of cutting beam effect.
It should be noted that the term positions such as "upper", "lower" here are vertical from top to bottom relative to cutting beam
It is incident on for the situation of workpiece to be cut, only the explanation to laser cutting method provided by the invention, and non-limiting.?
In other embodiments, using principle provided by the invention, it can be adjusted according to actual positional relationship.
Optionally, when the laser cutting mode is ablation, controller 50 includes: stage control module 53,
It is electrically connected with work stage 30, for controlling the stepping number of work stage 30 and the initial vertical position of workpiece to be cut.
Wherein, using ablation mode treat cutting workpiece cut when, it is desirable that cutting process is from work to be cut
The surface layer of part is gradually carried out to the inside of workpiece to be cut, therefore when the thickness change of workpiece to be cut, and cutting beam gathers
Surface of the burnt position far from workpiece to be cut, therefore not only the vertical stepping number of stepping needs to adjust, workpiece to be cut it is vertical
Initial position is also required to adjust.
The laser cutting system that the embodiment of the present invention three provides generates laser beam by laser light source, passes through at least one
A light path element sends the laser beam emitted by laser light source on workpiece to be cut, by thickness transducer detection to
The thickness for cutting workpiece is cut by the thickness for the workpiece to be cut that controller is detected according to thickness transducer, and in conjunction with laser
Cut mode and cutting beam type to laser cutting when technological parameter be adjusted, and using adjustment after technological parameter swash
Light is cut by laser, so that the actual (real) thickness of technological parameter adjusted and workpiece to be cut is adapted, improves laser cutting
The utilization rate that cutting beam is improved while efficiency solves and generallys use the to be cut of fixed parameter preset cutting different-thickness
The cutting beam utilization rate generated when cutting workpiece is not high or the incomplete problem of work piece cut.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (20)
1. a kind of laser cutting method characterized by comprising
Obtain the actual (real) thickness of workpiece to be cut；
According to the actual (real) thickness of the workpiece to be cut, judge whether to adjust default cutting technique parameter；
If so, according to the actual (real) thickness of the workpiece to be cut, laser cutting mode and cutting beam type to laser cutting
When technological parameter be adjusted, and be cut by laser using the laser of technological parameter after adjustment；
If it is not, being then cut by laser using the laser of the default cutting technique parameter.
2. the method according to claim 1, wherein after the actual (real) thickness for obtaining workpiece to be cut also
Include:
Judge the actual (real) thickness whether within a preset range；
If within a preset range, being directly cut by laser according to preset technological parameter；
If not within a preset range, according to the difference or ratio of the actual (real) thickness of workpiece to be cut and preset thickness, and swashing
Technological parameter when light cutting mode and cutting beam type are to laser cutting is adjusted.
3. the method according to claim 1, wherein the laser cutting mode is modified cutting, the cutting
It is described according to the actual (real) thickness of workpiece to be cut, laser cutting mode and cutting beam class when beam type is bessel beam
Technological parameter when type is to laser cutting, which is adjusted, includes:
The vertical position of cutting beam depth of focus and workpiece to be cut is adjusted.
4. according to the method described in claim 3, it is characterized in that, the laser cutting mode is modified cutting, the cutting
It is described according to the actual (real) thickness of workpiece to be cut, laser cutting mode and cutting beam class when beam type is bessel beam
Technological parameter when type is to laser cutting is adjusted further include:
Cutting beam energy is adjusted.
5. according to the method described in claim 3, it is characterized in that, the cutting beam is that laser beam is quasi- through beam expanding lens progress
After direct expansion beam, the light beam that Shape correction obtains, the cutting that the beam shaping element shaping obtains are carried out through beam shaping element
The diameter direct proportionality of laser beam after the depth of focus of light beam and the collimator and extender, it is described that cutting beam depth of focus is carried out
Adjustment includes:
The actual focal Lbr of the cutting beam is obtained according to the following formula:
Wherein, Lbs is the first default depth of focus of cutting beam, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is workpiece to be cut
The first preset thickness.
6. according to the method described in claim 3, it is characterized in that, the vertical position for treating cutting workpiece is adjusted packet
It includes:
The practical vertical position Zbr of the workpiece to be cut is obtained according to the following formula:
Wherein, Zbs is the first default vertical position of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is to be cut
Cut the first preset thickness of workpiece.
7. according to the method described in claim 4, it is characterized in that, described be adjusted to cutting beam energy includes:
The actual energy Pbr of the cutting beam is obtained according to the following formula:
Wherein, Pbs is the preset energy of cutting beam, and Tr is the actual (real) thickness of workpiece to be cut, and Tbs is the of workpiece to be cut
One preset thickness.
8. the method according to claim 1, wherein the laser cutting mode is modified cutting, the cutting
It is described according to the actual (real) thickness of workpiece to be cut, laser cutting mode and cutting beam type when beam type is Gaussian beam
Technological parameter when to laser cutting, which is adjusted, includes:
Stepping number when to laser cutting is adjusted.
9. according to the method described in claim 8, it is characterized in that, described pair laser cutting when stepping number be adjusted packet
It includes:
Practical stepping times N gr is obtained according to the following formula:
Wherein, default stepping number when Ngs is laser cutting, number is rounded down to immediate whole by int function stand
Number, Tgs are the second preset thickness of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Lgs is the second of cutting beam
Default depth of focus.
10. the method according to claim 1, wherein the laser cutting mode is ablation, the cutting
It is described according to the actual (real) thickness of workpiece to be cut, laser cutting mode and cutting beam type when beam type is Gaussian beam
Technological parameter when to laser cutting, which is adjusted, includes:
Stepping number and vertical initial position when to laser cutting are adjusted.
11. according to the method described in claim 10, it is characterized in that, described pair laser cutting when stepping number and it is vertical just
Beginning position, which is adjusted, includes:
Practical stepping times N gr is obtained according to the following formula:
Practical vertical initial position Zgr:Zgr=Zgs+ (Tgs-Tr) is obtained according to the following formula；
Wherein, default stepping number when Ngs is laser cutting, number is rounded down to immediate whole by int function stand
Number, Tgs are the second preset thickness of workpiece to be cut, and Tr is the actual (real) thickness of workpiece to be cut, and Lgs is the second of cutting beam
Default depth of focus, Zgs preset vertical initial position for workpiece to be cut.
12. a kind of laser cutting system characterized by comprising
Laser light source；
At least one light path element, the laser beam for issuing laser light source are sent to workpiece to be cut；
Work stage, for carrying workpiece to be cut；
Thickness transducer, for detecting the thickness of the workpiece to be cut carried in work stage；
Controller is electrically connected with the thickness transducer, for obtaining the thickness of the workpiece to be cut, and according to it is described to
Cut workpiece thickness, judge whether to adjust default cutting technique parameter, if so, according to the thickness of the workpiece to be cut,
Technological parameter when laser cutting mode and cutting beam type are to laser cutting is adjusted, according to technological parameter adjusted
Control at least one of the laser light source, the light path element and described work stage treat cutting workpiece cut；If
It is no, then it is cut by laser using the laser of the default cutting technique parameter.
13. laser cutting system according to claim 12, which is characterized in that at least one described light path element includes:
Beam expanding lens, the laser beam for issuing to laser light source carry out collimator and extender；
Beam shaping element, the laser beam after expanding for collimation carry out Shape correction and obtain bessel beam, the light
The diameter direct proportionality of the depth of focus for the cutting beam that beam shaping element shaping obtains and the laser beam after described expand.
14. laser cutting system according to claim 13, which is characterized in that the controller include in following module extremely
It is one few:
Beam energy control module is electrically connected with the laser light source, the laser beam issued for controlling the laser light source
Energy；
Beam expanding lens control module is electrically connected with the beam expanding lens, expands multiplying power for control the beam expanding lens；
Stage control module is electrically connected with the work stage, for controlling the vertical position of workpiece to be cut.
15. laser cutting system shown in 4 according to claim 1, which is characterized in that further include:
Microscope group is scaled, is arranged between the beam shaping element and the work stage, for compressing the beam shaping element
The depth of focus and diameter for the cutting beam that shaping obtains.
16. laser cutting system according to claim 15, which is characterized in that further include:
At least one reflecting mirror, for the laser beam after the beam expanding lens collimator and extender to be emitted to the beam shaping member
On part.
17. laser cutting system according to claim 12, which is characterized in that at least one described light path element includes:
Beam expanding lens, the laser beam for issuing to laser light source carry out collimator and extender.
18. laser cutting system according to claim 17, which is characterized in that further include:
At least one reflecting mirror, for the laser beam after the beam expanding lens collimator and extender to be emitted to the workpiece to be cut
On.
19. laser cutting system according to claim 18, which is characterized in that the controller includes:
Stage control module is electrically connected with the work stage, for controlling the stepping number of work stage.
20. laser cutting system according to claim 18, which is characterized in that the controller includes:
Stage control module is electrically connected with the work stage, for controlling the stepping number of the work stage and to be cut
The initial vertical position of workpiece.
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| CN111505831A (en) * | 2020-04-01 | 2020-08-07 | 中国科学院西安光学精密机械研究所 | Focal spot focal depth variable Bessel beam laser processing system and method |
| CN111571033A (en) * | 2020-05-29 | 2020-08-25 | 上海正雅齿科科技股份有限公司 | Laser cutting system for preparing shell-shaped tooth appliance and preparation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111505831A (en) * | 2020-04-01 | 2020-08-07 | 中国科学院西安光学精密机械研究所 | Focal spot focal depth variable Bessel beam laser processing system and method |
| CN111505831B (en) * | 2020-04-01 | 2021-06-22 | 中国科学院西安光学精密机械研究所 | Focal spot focal depth variable Bessel beam laser processing system and method |
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| CN113369712A (en) * | 2021-06-23 | 2021-09-10 | 业成科技（成都）有限公司 | Laser cutting method, laser cutting device and computer readable storage medium |
| CN114161005A (en) * | 2021-12-23 | 2022-03-11 | 中国科学院西安光学精密机械研究所 | Method and device for processing three-dimensional scanning type micro-pore structure |
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