CN110337191A - A method of the 3D printing great power LED printed circuit board based on Graphene conductive ink - Google Patents
A method of the 3D printing great power LED printed circuit board based on Graphene conductive ink Download PDFInfo
- Publication number
- CN110337191A CN110337191A CN201910595086.XA CN201910595086A CN110337191A CN 110337191 A CN110337191 A CN 110337191A CN 201910595086 A CN201910595086 A CN 201910595086A CN 110337191 A CN110337191 A CN 110337191A
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- Prior art keywords
- printed circuit
- circuit board
- conductive ink
- graphene conductive
- printing
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Abstract
The method of the invention discloses a kind of 3D printing great power LED printed circuit board based on Graphene conductive ink, include the following steps: step 1,10~30 parts of graphene powder, 10~20 parts of conductive photosensitive resin, 50~80 parts of solvent are mixed and uniform dispersion is made through ultrasonic wave, then uniform dispersion is ground to fineness less than 10 μm, Graphene conductive ink is made；Step 2, the light curing agent polyetheramine of 0.2~0.8wt% of photosensitive resin deal is added into Graphene conductive ink and is stirred until homogeneous dispersion；Step 3, the inkjet-fabricated layer printed circuit board of 3D printing.Circuit board made from the method for the present invention has preferable mechanical property and electric conductivity.
Description
Technical field
The present invention relates to the technical fields of production great power LED printed circuit board, are beaten more particularly, to one kind based on 3D
Print the method for Graphene conductive ink production great power LED printed circuit board.
Background technique
With LED input power be continuously improved, dissipated power bring big calorific value and demanding light extraction efficiency to
The printed circuit board production of LED brings higher requirement.The manufacture craft of general LED printed circuit board is all in Metal Substrate
It selectively processed, etched on plate, being drilled and the processes such as copper facing, being made different printed circuits, complex manufacturing technology,
Time is long, at high cost.
Graphene high carrier mobility makes it be highly suitable for the preparation of layer printed circuit board, and 3D printing is a kind of efficient
Preparation method.Graphene ink is that a kind of have conduction etc. by what functionalization graphene, binder, auxiliary agent and solvent etc. formed
The ink product of specific function, it is conductive can it is excellent, pattern quality is light, printability is good, condition of cure is mild and at
Originally the advantages such as cheap can realize printing printing on a variety of substrates, can be used for extremely fine wiring diagram, and can reduce most
Small line width and minimum line spacing are to obtain high-density circuit pattern.With existing nano metal (such as nano-silver powder, Nanometer Copper
Powder etc.) electrically conductive ink compares, and graphene ink has huge cost advantage.Compared with traditional carbon-based conductive ink product,
Graphene ink has significant advantage again in terms of electric conductivity.
Summary of the invention
In order to overcome above-mentioned technical problem, it is high-power that the present invention provides a kind of 3D printing based on Graphene conductive ink
The method of LED (wherein high-power to refer to that mono- power of LED is greater than 10 watts or more) printed circuit board.
The technical scheme adopted by the invention is as follows: a kind of 3D printing great power LED printing based on Graphene conductive ink
The method of circuit board, described method includes following steps:
Step 1, by the graphene powder of 10~30 parts by weight, the conductive photosensitive resin of 10~20 parts by weight, 50~80 weights
The solvent of amount part mixes and disperses through ultrasonic wave, and uniform dispersion is made；Then by uniform dispersion be transferred in grinder into
The Graphene conductive ink is made when fineness is less than 10 μm using Hegman grind gage test fineness in row grinding；
Step 2, light curing agent polyetheramine is added into Graphene conductive ink made from step 1 and is stirred until homogeneous point
It dissipates, the additional amount of the polyetheramine is 0.2~0.8wt% of photosensitive resin deal；
Step 3, the Graphene conductive ink of polyetheramine the inkjet-fabricated layer printed circuit board of 3D printing: will be added in step 2
The ink gun (3) of SLA3D printer is injected, under the control of the computer, the printing head of ink gun (3) presses preformed printing
Graphene conductive ink added with polyetheramine is sprayed on the surface of high power LED substrate (1) by circuit layer design configuration；Together
When argon ion laser (5) launch UV laser beam (6) and by layer printed circuit board cross-section data carry out line by line point by point scanning consolidate
Change, to obtain the 3D printing great power LED printed circuit board based on Graphene conductive ink.
Further, conduction photosensitive resin described in step 1 includes the photosensitive resin of 70~80 parts by weight, 5~10 weight
The organic silicon surfactant of part and the nano-silver conductive particle of 10~20 parts by weight.
Further, ultrasonic frequency described in step 1 be 50KHZ, ultrasonic disperse power be 1000~
1500W, time are 30~60min.
Technical effect obtained by the present invention is as follows: (1) polyetheramine being added is under the action of ultraviolet light or laser beam, energy
Enough so that Graphene conductive ink rapid curing, can be obtained the conductive film being fully cured after the completion of ink-jet, heat cure is compared
Or sintering, curing time is reduced, and enhance elasticity, toughness, shock resistance and the pliability of solidfied material.(2) of the invention
Conductive photosensitive resin solves the problems, such as that general photosensitive resin does not have electric conductivity and mechanical property is poor, and has after solidifying excellent
Different electric conductivity and mechanical property.(3) present invention combines ball-milling method to prepare electrically conductive ink with SLA3D printing, obtains fine granularity
Graphene conductive ink less than 10 μm, so that molding printed circuit board precision is very high, most thin layer thickness can reach 16 microns.
(4) conductive film being fully cured can be obtained after the completion of technical solution of the present invention ink-jet, compares heat cure or burning
Knot, reduces curing time, improves the discrimination efficiency of great power LED printed circuit board, and to the high temperature resistance of substrate without
It is required that.In addition, this case preparation method applies also for the printing printing electricity on glass substrate, plastic film substrate in addition to aluminum substrate
Road plate.
Detailed description of the invention
Fig. 1 is that the present invention is based on the principles of the method for the 3D printing great power LED printed circuit board of Graphene conductive ink
Figure.
1. high-power LED aluminum substrate, 2. layer printed circuit boards, the ink gun of 3.SLA3D printer, 4. graphene conductives oil
Ink, 5. argon laser generators, 6. UV laser beams.
Specific embodiment
The present invention is described in further detail below with reference to embodiment:
Embodiment 1:
A method of the 3D printing great power LED printed circuit board based on Graphene conductive ink includes the following steps:
Step 1, Graphene conductive ink is prepared: by 10 parts of graphene powder, 20 parts of conductive photosensitive resin, 70 parts
Xylene solvent mixes and disperses through ultrasonic wave, and uniform dispersion is made；Then by uniform dispersion be transferred in grinder into
The Graphene conductive ink is made when fineness is less than 10 μm using Hegman grind gage test fineness in row grinding；
Step 2, light curing agent polyetheramine is added into Graphene conductive ink made from step 1 and is stirred until homogeneous point
It dissipates, the additional amount of the polyetheramine is the 0.2wt% of photosensitive resin deal；
Step 3, the Graphene conductive ink of polyetheramine the inkjet-fabricated layer printed circuit board of 3D printing: will be added in step 2
The ink gun 3 of SLA3D printer is injected, under the control of the computer, the printing head of ink gun 3 presses preformed printed circuit
Graphene conductive ink added with polyetheramine, is sprayed on the surface of high-power LED aluminum substrate 1 by layer design configuration；Argon simultaneously
Ion laser 5, which launches UV laser beam 6 and layer printed circuit board cross-section data is carried out point by point scanning line by line, to be solidified, to obtain
Obtain the 3D printing great power LED printed circuit board based on Graphene conductive ink.
Conductive photosensitive resin includes 70wt% photosensitive resin (SOMOS8000), 10wt% organosilyl surface in above-mentioned steps 1
Activating agent and 20wt% nano-silver conductive particle.Ultrasonic frequency is 50KHZ, and ultrasonic disperse power is 1500W, and the time is
30min。
Embodiment 2:
A method of the 3D printing great power LED printed circuit board based on Graphene conductive ink includes the following steps:
Step 1, Graphene conductive ink is prepared: by 20 parts of graphene powder, 15 parts of conductive photosensitive resin, 65 parts
Acetone solvent mixes and disperses through ultrasonic wave, and uniform dispersion is made；Then uniform dispersion is transferred in grinder and is carried out
The Graphene conductive ink is made when fineness is less than 10 μm using Hegman grind gage test fineness in grinding；
Step 2, light curing agent polyetheramine is added into Graphene conductive ink made from step 1 and is stirred until homogeneous point
It dissipates, the additional amount of the polyetheramine is the 0.5wt% of photosensitive resin deal；
Step 3, the Graphene conductive ink of polyetheramine the inkjet-fabricated layer printed circuit board of 3D printing: will be added in step 2
The ink gun 3 of SLA3D printer is injected, under the control of the computer, the printing head of ink gun 3 presses preformed printed circuit
Graphene conductive ink added with polyetheramine, is sprayed on the surface of high-power LED aluminum substrate 1 by layer design configuration；Argon simultaneously
Ion laser 5, which launches UV laser beam 6 and layer printed circuit board cross-section data is carried out point by point scanning line by line, to be solidified, to obtain
Obtain the 3D printing great power LED printed circuit board based on Graphene conductive ink.
Including 75wt% photosensitive resin (SOMOS11122), 10wt% organosilicon in conductive photosensitive resin in above-mentioned steps 1
Surfactant and 15wt% nano-silver conductive particle.Ultrasonic frequency is 50KHZ, and ultrasonic disperse power is 1200W, and the time is
45min。
Embodiment 3:
A method of the 3D printing great power LED printed circuit board based on Graphene conductive ink includes the following steps:
Step 1, Graphene conductive ink is prepared: by 30 parts of graphene powder, 10 parts of conductive photosensitive resin, 60 parts
Alcohol solvent mixes and disperses through ultrasonic wave, and uniform dispersion is made；Then uniform dispersion is transferred in grinder and is carried out
The Graphene conductive ink is made when fineness is less than 10 μm using Hegman grind gage test fineness in grinding；
Step 2, light curing agent polyetheramine is added into Graphene conductive ink made from step 1 and is stirred until homogeneous point
It dissipates, the additional amount of the polyetheramine is the 0.8wt% of photosensitive resin deal；
Step 3, the Graphene conductive ink of polyetheramine the inkjet-fabricated layer printed circuit board of 3D printing: will be added in step 2
The ink gun 3 of SLA3D printer is injected, under the control of the computer, the printing head of ink gun 3 presses preformed printed circuit
Graphene conductive ink added with polyetheramine, is sprayed on the surface of high-power LED aluminum substrate 1 by layer design configuration；Argon simultaneously
Ion laser 5, which launches UV laser beam 6 and layer printed circuit board cross-section data is carried out point by point scanning line by line, to be solidified, to obtain
Obtain the 3D printing great power LED printed circuit board based on Graphene conductive ink.
Including 80wt% photosensitive resin (SOMOS19120), 5wt% organosilicon table in conductive photosensitive resin in above-mentioned steps 1
Face activating agent and 15wt% nano-silver conductive particle.Ultrasonic frequency is 50KHZ, and ultrasonic disperse power is 1000W, and the time is
60min。
Seen from table 1: the thermal coefficient of the printed circuit board printed using Graphene conductive ink of the invention is common
4 times or so of printed circuit board, thermal resistance (DEG C/W) only have a quarter of common printed circuit board.And with graphene conductive oil
The deal of graphene powder increases in ink, and the thermal coefficient of printed circuit board can be promoted accordingly, and thermal resistance then can be reduced accordingly.Cause
This, the printed circuit board printed using Graphene conductive ink of the invention is conductive can excellent, printing precision height, printing
Adaptive is good, the advantages such as at low cost, has broad application prospects.
1 performance test of table
| Main performance index | Embodiment 1 | Embodiment 2 | Embodiment 3 | Common printed circuit board |
| Thermal coefficient W (mk) | 480 | 492 | 500 | 125 |
| Thermal resistance (DEG C/W) | 0.208 | 0.203 | 0.2 | 0.8 |
Claims (3)
1. a kind of method of the 3D printing great power LED printed circuit board based on Graphene conductive ink, it is characterised in that: described
Method includes the following steps:
Step 1, Graphene conductive ink is prepared: by the graphene powder of 10~30 parts by weight, the conductive light of 10~20 parts by weight
Quick resin, 50~80 parts by weight solvent mix and disperse through ultrasonic wave, be made uniform dispersion；Then uniform dispersion is turned
It moves on in grinder and is ground, the graphene is made and leads when fineness is less than 10 μm using Hegman grind gage test fineness
Electric ink；
Step 2, light curing agent polyetheramine is added into Graphene conductive ink made from step 1 and is stirred until homogeneous dispersion, institute
The additional amount for stating polyetheramine is 0.2~0.8wt% of photosensitive resin deal；
Step 3, the inkjet-fabricated layer printed circuit board of 3D printing: the Graphene conductive ink that polyetheramine is added in step 2 is injected
The ink gun (3) of SLA3D printer, under the control of the computer, the printing head of ink gun (3) press preformed printed circuit
Graphene conductive ink added with polyetheramine, is sprayed on the surface of high power LED substrate (1) by layer design configuration；Argon simultaneously
Ion laser (5), which launches UV laser beam (6) and layer printed circuit board cross-section data is carried out point by point scanning line by line, to be solidified, from
And obtain the 3D printing great power LED printed circuit board based on Graphene conductive ink.
2. the method for the 3D printing great power LED printed circuit board according to claim 1 based on Graphene conductive ink,
It is characterized by: conduction photosensitive resin described in step 1 includes 70~80 parts by weight photosensitive resins, 5~10 parts by weight organosilicons
Surfactant and 10~20 parts by weight nano-silver conductive particles, wherein photosensitive resin be SOMOS8000, SOMOS19120,
Any one in SOMOS11122.
3. the method for the 3D printing great power LED printed circuit board according to claim 1 based on Graphene conductive ink,
It is characterized by: ultrasonic frequency described in step 1 be 50KHZ, ultrasonic disperse power be 1000~1500W, the time be 30~
60min；Solvent described in step 1 is any one in water, dimethylbenzene, ethyl alcohol or acetone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910595086.XA CN110337191A (en) | 2019-07-03 | 2019-07-03 | A method of the 3D printing great power LED printed circuit board based on Graphene conductive ink |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910595086.XA CN110337191A (en) | 2019-07-03 | 2019-07-03 | A method of the 3D printing great power LED printed circuit board based on Graphene conductive ink |
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| CN110337191A true CN110337191A (en) | 2019-10-15 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112970337A (en) * | 2019-02-14 | 2021-06-15 | 奥宝科技有限公司 | Method and apparatus for preparing PCB products with highly dense conductors |
| CN114326213A (en) * | 2022-01-19 | 2022-04-12 | 京东方科技集团股份有限公司 | Support piece of display module backlight source, manufacturing method of support piece and display module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102079847A (en) * | 2009-11-27 | 2011-06-01 | 东莞市立高电子制品有限公司 | Photosensitive silver slurry conductive adhesive and preparation method thereof |
| CN104672402A (en) * | 2013-11-28 | 2015-06-03 | 比亚迪股份有限公司 | Conducting photosensitive resin for 3D printing and preparation method thereof |
| CN104830159A (en) * | 2014-12-17 | 2015-08-12 | 青岛科技大学 | Preparation method and application of photo-curing color paste containing graphene |
| CN108314932A (en) * | 2018-01-16 | 2018-07-24 | 湖南国盛石墨科技有限公司 | One kind being based on photocuring Graphene conductive ink printing process |
-
2019
- 2019-07-03 CN CN201910595086.XA patent/CN110337191A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102079847A (en) * | 2009-11-27 | 2011-06-01 | 东莞市立高电子制品有限公司 | Photosensitive silver slurry conductive adhesive and preparation method thereof |
| CN104672402A (en) * | 2013-11-28 | 2015-06-03 | 比亚迪股份有限公司 | Conducting photosensitive resin for 3D printing and preparation method thereof |
| CN104830159A (en) * | 2014-12-17 | 2015-08-12 | 青岛科技大学 | Preparation method and application of photo-curing color paste containing graphene |
| CN108314932A (en) * | 2018-01-16 | 2018-07-24 | 湖南国盛石墨科技有限公司 | One kind being based on photocuring Graphene conductive ink printing process |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112970337A (en) * | 2019-02-14 | 2021-06-15 | 奥宝科技有限公司 | Method and apparatus for preparing PCB products with highly dense conductors |
| US11596070B2 (en) | 2019-02-14 | 2023-02-28 | Orbotech Ltd. | Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer |
| CN114326213A (en) * | 2022-01-19 | 2022-04-12 | 京东方科技集团股份有限公司 | Support piece of display module backlight source, manufacturing method of support piece and display module |
| CN114326213B (en) * | 2022-01-19 | 2023-11-28 | 京东方科技集团股份有限公司 | Support piece of backlight source of display module, manufacturing method of support piece and display module |
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Application publication date: 20191015 |
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