CN110335875A - 显示面板及其制作方法 - Google Patents
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10128—Display
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Abstract
本发明提供一种显示面板及其制作方法。显示面板设有弯折区和非弯折区,所述显示面板包括层叠设置的柔性衬底基板、第一走线层、绝缘层和第二走线层。所述第一走线层包括多个第一走线;在与每一第一走线相对应的所述绝缘层上设置至少两个贯穿所述绝缘层的过孔,所述过孔设于所述弯折区临近两端非弯折区的位置;所述第二走线层包括多个第二走线;所述第二走线与所述第一走线一一对应设置;所述第二走线延伸并穿过所述过孔与所述第一走线电连接。显示面板制作方法包括步骤:提供一柔性衬底基板、制作第一走线层、制作绝缘层和制作第二走线层。本发明解决了金属电极在弯折区发生破裂或断裂的问题。
Description
技术领域
本发明涉及显示领域,尤其涉及一种显示面板及其制作方法。
背景技术
当前的移动终端市场上,针对高屏占比的设计需求越来越高;如何在液晶显示屏设计上压缩非显示区边框成为各家厂商设计的焦点。将非显示区反折至显示屏侧面或背面的设计,成为当前高屏占比设计的热点。
柔性液晶显示屏由于薄膜晶体管(TFT)、彩膜基板(CF)衬底材料为聚酰亚胺(PI)或聚乙二醇对苯二甲酸酯(PET)等柔软的材料制成可弯曲、变形,较容易实现非显示区反折,但现有设计的金属电极为一层,其在弯曲时易发生金属电极断裂而影响信号传输。
因此,如何提供一种新型的显示面板及其制作方法,以降低金属电极发生破裂或断裂的风险,是本领域技术人员亟需解决的技术问题。
发明内容
本发明的目的在于,提供一种显示面板及其制作方法,其解决了金属电极在弯折区发生破裂或断裂的问题。
为了解决上述问题,本发明一实施例中提供一种显示面板,设有弯折区和位于所述弯折区两侧的非弯折区,所述显示面板包括层叠设置的柔性衬底基板、第一走线层、绝缘层和第二走线层。具体的,所述第一走线层设于所述柔性衬底基板的一面;所述第一走线层包括多个第一走线;所述绝缘层设于所述第一走线层背离所述柔性衬底基板的一面;在与每一第一走线相对应的所述绝缘层上设置至少两个贯穿所述绝缘层的过孔,所述过孔设于所述弯折区临近两端非弯折区的位置;所述第二走线层设于所述弯折区的所述绝缘层背离所述第一走线层的一面;所述第二走线层包括多个第二走线;所述第二走线与所述第一走线一一对应设置;所述第二走线延伸并穿过所述过孔与所述第一走线电连接。
进一步地,所述柔性衬底基板包括柔性衬底层和缓冲层。所述缓冲层设于所述柔性衬底层朝向所述第一走线层的一侧。
进一步地,在所述绝缘层和所述第二走线层之间还设有有机层,所述过孔同时贯穿所述绝缘层和所述有机层。
进一步地,所述柔性衬底层的材料包括聚酰亚胺。
进一步地,所述非弯折区包括用于显示的显示区,所述显示区包括层叠设置的透明电极层、液晶层和彩膜基板。具体的,所述透明电极层设于所述绝缘层背离所述第一走线层的一面;所述液晶层设于所述透明电极层背离所述绝缘层的一面;所述彩膜基板设于所述液晶层背离所述透明电极层的一面,所述彩膜基板通过密封胶与所述透明电极层连接并密封所述液晶层。
进一步地,所述非弯折区包括用于绑定外接电路的绑定区,所述绑定区包括与所述第一走线层电连接的柔性电路板;所述柔性电路板包括至少一集成电路(IC)。
本发明还提供一种显示面板的制作方法,包括步骤:
提供一柔性衬底基板;
在所述柔性衬底基板的一面制作多个第一走线构成第一走线层;
在所述第一走线层背离所述柔性衬底基板的一面制作绝缘层;在所述绝缘层上设置至少两个贯穿所述绝缘层的过孔,所述过孔设于所述弯折区临近两端非弯折区的位置;以及
在所述弯折区的所述绝缘层背离所述第一走线层的一面制作多个第二走线构成第二走线层;所述第二走线与所述第一走线一一对应设置;所述第二走线延伸并穿过所述过孔与所述第一走线电连接。
进一步地,所述柔性衬底基板的制作步骤包括:
提供一玻璃基板,在所述玻璃基板上涂布聚酰亚胺,并烘烤固化形成所述柔性衬底基板;以及
在所述柔性衬底基板上制作缓冲层。
进一步地,在制作所述绝缘层和制作所述第二走线层之间还包括制作有机层步骤,其为在所述弯折区的所述绝缘层背离所述第一走线层的一面制作所述有机层,在所述有机层上设置所述过孔,所述过孔同时贯穿所述绝缘层和所述有机层。
进一步地,所述非弯折区包括用于显示的显示区,在所述显示区还包括步骤:
在所述绝缘层背离所述第一走线层的一面制作透明电极层;
通过涂布、干燥、曝光、显影、固烤工艺制作彩膜基板,并将所述彩膜基板与述透明电极层相对设置;以及
在所述透明电极层和所述彩膜基板之间填充液晶层,并通过密封胶密封所述液晶层。
本发明的有益效果在于,提供一种显示面板及其制作方法,通过在所述弯折区将所述第二走线层设置于所述柔性衬底基板上,并通过过孔与下层的所述第一走线层连通传输信号。在所述弯折区弯折时所述柔性衬底基板可以缓冲所述第二走线层弯折产生的应力,并且可增加所述第二走线层在所述弯折区的弯折半径,避免因为所述第二走线层形变过大而导致局部应力过大而产生裂纹或断裂,从而使得金属电极在弯折时不易发生断裂。
附图说明
图1为本发明实施例中的一种显示面板结构示意图;
图2为本发明为图1中的所述弯折区弯折后的结构示意图;
图3为本发明实施例中所述彩膜基板的结构示意图;
图4为本发明实施例中的一种显示面板的制作流程图;
图5为本发明实施例中所述柔性衬底基板的制作流程图;
图6为本发明施例中所述显示区的制作流程图。
图中部件标识如下:
1、柔性衬底基板,2、第一走线层,3、绝缘层,4、第二走线层,
5、有机层,6、透明电极层,7、液晶层,8、彩膜基板,9、柔性电路板,
10、弯折区,11、柔性衬底层,12、缓冲层,20、非弯折区,21、显示区,
22、绑定区,30、过孔,81、聚酰亚胺基板,82色阻层,83、保护层,
100、显示面板。
具体实施方式
本发明所提到的方向用语,例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等,仅是附图中的方向,本文所使用的方向用语是用来解释和说明本发明,而不是用来限定本发明的保护范围。
此外,还应注意的是,在一些可替代的实现方式中,本文中所描述的所有方法的步骤可不按顺序发生。例如,示出为连续的两个步骤可实际上大致同时执行,或者这两个步骤可有时以相反的顺序执行。
请参阅图1、图2所示,本发明其中一实施例中提供一种显示面板100,定义有弯折区10和位于所述弯折区10两侧的非弯折区20,所述非弯折区20包括用于显示的显示区21和用于绑定外接电路的绑定区22。
所述显示面板100包括层叠设置的柔性衬底基板1、第一走线层2、绝缘层3和第二走线层4。具体的,所述第一走线层2设于所述柔性衬底基板1的一面;所述第一走线层2包括多个第一走线;所述绝缘层3设于所述第一走线层2背离所述柔性衬底基板1的一面;在与每一第一走线相对应的所述绝缘层3上设置至少两个贯穿所述绝缘层3的过孔30,所述过孔30设于所述弯折区10临近两端非弯折区20的位置;所述过孔30的形状包括圆形、方形、菱形、椭圆形之一或组合;所述第二走线层4设于所述弯折区10的所述绝缘层3背离所述第一走线层2的一面;所述第二走线层4包括多个第二走线;所述第二走线与所述第一走线一一对应设置;所述第二走线填充所述过孔30与所述第一走线电连接,亦即所述第二走线层4填充所述过孔30与所述第一走线层2电连接。其中,所述第一走线层2和所述第二走线层4的材料为金属。
本实施例中,通过在所述弯折区10设置所述第二走线层4于所述柔性衬底基板1上,并通过过孔30与下层的所述第一走线层2连通传输信号,即所述第一走线层2和所述第二走线层4以桥接方式构成金属电极。在所述弯折区10弯折时所述柔性衬底基板1可以缓冲所述第二走线层4弯折产生的应力,并且可增加所述第二走线层4在所述弯折区10的弯折半径,避免因为所述第二走线层4形变过大而导致局部应力过大而产生裂纹或断裂,从而使得金属电极在弯折时不易发生断裂。
请参阅图1所示,在本实施例中,所述柔性衬底基板1包括柔性衬底层11和缓冲层12。具体的,所述柔性衬底层11的材料为聚酰亚胺;所述缓冲层12设于所述柔性衬底层11朝向所述第一走线层2的一侧;所述缓冲层12的材料为SiNx、SiOx中的一种或两者的堆栈组合。
在本实施例中,在所述绝缘层3和所述第二走线层4之间还设有有机层5,所述过孔30同时贯穿所述绝缘层3和所述有机层5。
在本实施例中,所述显示区21包括层叠设置的透明电极层6、液晶层7和彩膜基板8。具体的,所述透明电极层6设于所述绝缘层3背离所述第一走线层2的一面;所述透明电极层6的材料包括氧化铟锡(ITO);所述液晶层7设于所述透明电极层6背离所述绝缘层3的一面;所述彩膜基板8设于所述液晶层7背离所述透明电极层6的一面,所述彩膜基板8通过密封胶与所述透明电极层6连接并密封所述液晶层7。
请参阅图3所示,所述彩膜基板8包括聚酰亚胺基板81、位于所述聚酰亚胺基板81上的色阻层82、位于所述色阻层82上的保护层83,所述保护层83一侧与所述液晶层7连接;其中所述色阻层82包括黑色矩阵及位于所述黑色矩阵之间的红色色阻、绿色色阻及蓝色色阻。值得说明的是,所述彩膜基板8为现有技术,其详细的结构特征在此不做赘述,但上述提供的所述彩膜基板8结构的描述并非旨在限制要求保护的本发明的范围,而是仅仅表示本发明的优选实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本实施例中,所述绑定区22包括与所述第一走线层2电连接的柔性电路板9;所述柔性电路板9包括至少一集成电路。
请参阅图4所示,本发明其中一实施例中提供一种显示面板100的制作方法,包括步骤S1-S4。
步骤S1:提供一柔性衬底基板1。
步骤S2:在所述柔性衬底基板1的一面制作多个第一走线构成第一走线层2;所述第一走线层2的材料为金属。
步骤S3:在所述第一走线层2背离所述柔性衬底基板1的一面制作绝缘层3;在所述绝缘层3上设置至少两个贯穿所述绝缘层3的过孔30,所述过孔30设于所述弯折区10临近两端非弯折区20的位置。所述过孔30的形状包括圆形、方形、菱形、椭圆形之一或组合。本实施例设置所述过孔30的目的为实现所述第二走线层4填充所述过孔30与所述第一走线层2电连接,对所述过孔30的形状不做严格限定。
步骤S4:在所述弯折区10的所述绝缘层3背离所述第一走线层2的一面制作多个第二走线构成第二走线层4;所述第二走线与所述第一走线一一对应设置;所述第二走线延伸并穿过所述过孔30与所述第一走线电连接,亦即所述第二走线层4延伸并穿过所述过孔30与所述第一走线层2电连接。所述第二走线层4的材料为金属。
请参阅图5所示,在本实施例中,所述柔性衬底基板1的制作步骤包括:
步骤S11:提供一玻璃基板,在所述玻璃基板上涂布聚酰亚胺,并烘烤固化形成所述柔性衬底基板1;以及
步骤S12:在所述柔性衬底基板1上通过化学气相沉积方式沉积SiNx、SiOx中的一种或两者的堆栈组合形成制作缓冲层。
请参阅图4所示,在本实施例中,在制作所述绝缘层3和制作所述第二走线层4之间还包括制作有机层5步骤S31,其为在所述弯折区10的所述绝缘层3背离所述第一走线层2的一面制作所述有机层5,在所述有机层5上设置所述过孔30,所述过孔30同时贯穿所述绝缘层3和所述有机层5。
请参阅图6所示,在本实施例中,所述非弯折区20包括用于显示的显示区21,在所述显示区21在完成步骤S4之后还包括步骤:
步骤S51:在所述绝缘层3背离所述第一走线层2的一面制作透明电极层6;所述透明电极层6的材料包括氧化铟锡;
步骤S52:通过涂布、干燥、曝光、显影、固烤工艺制作彩膜基板8,并将所述彩膜基板8与述透明电极层6相对设置;以及
步骤S53:在所述透明电极层6和所述彩膜基板8之间填充液晶层7,并通过密封胶密封所述液晶层7。
在本实施例中,所述非弯折区20包括用于绑定外接电路的绑定区22,在所述绑定区22在完成步骤S4之后还包括步骤:在所述第一走线层2上绑定柔性电路板9,实现所述柔性电路板9与所述第一走线层2电连接;其中,所述柔性电路板9包括至少一集成电路。
本发明的有益效果在于,提供一种显示面板及其制作方法,通过在所述弯折区设置所述第二走线层于所述柔性衬底基板上,并通过过孔与下层的所述第一走线层连通传输信号。在所述弯折区弯折时所述柔性衬底基板可以缓冲所述第二走线层弯折产生的应力,并且可增加所述第二走线层在所述弯折区的弯折半径,避免因为所述第二走线层形变过大而导致局部应力过大而产生裂纹或断裂,从而使得金属电极在弯折时不易发生断裂。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (10)
1.一种显示面板,设有弯折区和位于所述弯折区两侧的非弯折区,其特征在于,所述显示面板包括:
柔性衬底基板;
第一走线层,设于所述柔性衬底基板的一面;所述第一走线层包括多个第一走线;
绝缘层,设于所述第一走线层背离所述柔性衬底基板的一面;在与每一第一走线相对应的所述绝缘层上设置至少两个贯穿所述绝缘层的过孔,所述过孔设于所述弯折区临近两端非弯折区的位置;
第二走线层,设于所述弯折区的所述绝缘层背离所述第一走线层的一面;所述第二走线层包括多个第二走线;所述第二走线与所述第一走线一一对应设置;所述第二走线延伸并穿过所述过孔与所述第一走线电连接。
2.根据权利要求1所述的显示面板,其特征在于,所述柔性衬底基板包括:
柔性衬底层;以及
缓冲层,设于所述柔性衬底层朝向所述第一走线层的一侧。
3.根据权利要求2所述的显示面板,其特征在于,所述柔性衬底层的材料包括聚酰亚胺。
4.根据权利要求1所述的显示面板,其特征在于,在所述绝缘层和所述第二走线层之间还设有有机层,所述过孔同时贯穿所述绝缘层和所述有机层。
5.根据权利要求1所述的显示面板,其特征在于,所述非弯折区包括用于显示的显示区,所述显示区包括
透明电极层,设于所述绝缘层背离所述第一走线层的一面;
液晶层,设于所述透明电极层背离所述绝缘层的一面;以及
彩膜基板,设于所述液晶层背离所述透明电极层的一面,所述彩膜基板通过密封胶与所述透明电极层连接并密封所述液晶层。
6.根据权利要求1所述的显示面板,其特征在于,所述非弯折区包括用于绑定外接电路的绑定区,所述绑定区包括
柔性电路板,与所述第一走线层电连接;
其中,所述柔性电路板包括至少一集成电路。
7.一种显示面板的制作方法,其特征在于,包括步骤:
提供一柔性衬底基板;
在所述柔性衬底基板的一面制作多个第一走线构成第一走线层;
在所述第一走线层背离所述柔性衬底基板的一面制作绝缘层;在所述绝缘层上设置至少两个贯穿所述绝缘层的过孔,所述过孔设于所述弯折区临近两端非弯折区的位置;以及
在所述弯折区的所述绝缘层背离所述第一走线层的一面制作多个第二走线构成第二走线层;所述第二走线与所述第一走线一一对应设置;所述第二走线延伸并穿过所述过孔与所述第一走线电连接。
8.一种如权利要求7所述的显示面板的制作方法,其特征在于,所述柔性衬底基板的制作步骤包括:
提供一玻璃基板,在所述玻璃基板上涂布聚酰亚胺,并烘烤固化形成所述柔性衬底基板;以及
在所述柔性衬底基板上制作缓冲层。
9.一种如权利要求7所述的显示面板的制作方法,其特征在于,在制作所述绝缘层和制作所述第二走线层之间还包括制作有机层步骤:
在所述弯折区的所述绝缘层背离所述第一走线层的一面制作所述有机层,在所述有机层上设置所述过孔,所述过孔同时贯穿所述绝缘层和所述有机层。
10.一种如权利要求7所述的显示面板的制作方法,其特征在于,所述非弯折区包括用于显示的显示区,在所述显示区还包括步骤:
在所述绝缘层背离所述第一走线层的一面制作透明电极层;
通过涂布、干燥、曝光、显影、固烤工艺制作彩膜基板,并将所述彩膜基板与述透明电极层相对设置;以及
在所述透明电极层和所述彩膜基板之间填充液晶层,并通过密封胶密封所述液晶层。
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