CN110323187A - A kind of bypass diode frame and monomer bypass diode - Google Patents
A kind of bypass diode frame and monomer bypass diode Download PDFInfo
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- CN110323187A CN110323187A CN201910692740.9A CN201910692740A CN110323187A CN 110323187 A CN110323187 A CN 110323187A CN 201910692740 A CN201910692740 A CN 201910692740A CN 110323187 A CN110323187 A CN 110323187A
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- 239000000178 monomer Substances 0.000 title claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000002788 crimping Methods 0.000 claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 238000003860 storage Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 230000006378 damage Effects 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a kind of bypass diode frame and monomer bypass diodes.This kind of bypass diode frame includes processing positioning unit, diode frame, frame connection strap, it processes there are two positioning units and is provided with multiple spaced diode frames between them, it is connected with each other between diode frame by frame connection strap, diode frame includes spaced first frame unit, the second frame unit, first frame unit includes the first crimping item, the first connection strap, the first framework, chip carrier, and the second frame unit includes the second crimping item, the second connection strap, second framework, conductive bar；A kind of monomer bypass diode, including diode frame, chip, copper wire jumper, chip are set to chip carrier, and chip is connected with copper wire jumper, and copper wire jumper is at least connect with a conductive bar.Bypass diode frame provides diode frame for monomer bypass diode is made；Monomer bypass diode reduces required installation space and copper material dosage.
Description
Technical field
The present invention relates to photovoltaic apparatus field, in particular to a kind of bypass diode frame and monomer bypass diode.
Background technique
Solar cell module inevitably falls shelter in the long-term use, these shelters are in solar battery group
Local shades are formed on part, the solar cell module under local shades in series arm will be taken as load, and consume other
Energy caused by solar cell module is formed " hot spot effect ", " hot spot effect " so that generating heat leads to local temperature rise
The solder joint on battery component will be made to melt and damage grid line when serious, in order to prevent solar battery due to " hot spot effect " and
It wrecks, is all the positive and negative interpolar bypass diode module in parallel in solar cell module, the mould in practical operation
At least there is a bypass diode in block, the component being masked to avoid energy caused by illumination component consumes.
Data of China library discloses the patent of an entitled solar photovoltaic assembly terminal box, application No. is
CN201621021039.2, applying date 2016-08-31, Authorization Notice No. CN206060676U, authorized announcement date are
2017-03-29, this kind of solar photovoltaic assembly terminal box, comprising: connection cables；Cable fastener is set to the connection
On cable and for fixing the connection cables；Pedestal is fixedly connected with the connection cables；Diode (led) module, with card
Fixed mode is connect on the pedestal, both ends are electrically connected with the connection cables respectively；Copper sheet is integrated in described two
In pole pipe module, for the connection cables and diode (led) module to be connected；Terminal block housings are removably sheathed on
Outside the pedestal, the interior accommodating cavity being equipped with for accommodating the diode (led) module；Cable fixed sleeving is set to described connect
On wire box shell, it is sheathed on outside the connection cables；Terminal box lid is removably connected to the terminal box shell
On body, radiating fin which is provided with.This art solutions are disadvantageous in that:
1, diode (led) module is single overall structure form, and appearance causes greatly occupancy junction box space big, consumption
Copper material is more, at high cost；
2, diode (led) module is the module as made of the series connection welding of multiple diode chip for backlight unit, and making technology requires to improve,
Homogeneity of product increases, other all to be restrained if wherein a chips are problematic, is not available, and entire product will be scrapped, after
Phase maintenance cost is high, at the same be also unfavorable for using with installation；
3, diode chip for backlight unit is series in same module, between radiate and influence each other, cause radiating efficiency to decline.
Summary of the invention
The object of the present invention is to provide a kind of bypass diode frames, and it is multiple which be segmented into diode (led) module
Monomer bypass diode.It is a further object to provide a kind of bypasses of the monomer as made from the bypass diode frame
Diode can effectively solve the problem that in technical background by the way that multiple this kind of monomer bypass diodes are arranged in a terminal box and mention
The technical issues of.
In order to realize one object of the present invention, the present invention provides a kind of bypass diode frames:
A kind of bypass diode frame, including processing positioning unit, diode frame, frame connection strap, the processing are fixed
There are two bit locations, is provided with multiple diode frames being sequentially arranged at intervals between the processing positioning unit, adjacent
The diode frame between by the frame connection strap be connected with each other；Each diode frame includes the first frame
Frame unit, the second frame unit, first frame unit include the first crimping item, the first connection strap, the first framework, chip
Seat, second frame unit include the second crimping item, the second connection strap, second framework, conductive bar, first framework and the
There are gap between two frameworks, the side of the first framework towards the second framework is provided with the chip carrier, and described first
The other side of framework is provided with first connection strap, and the other end of first connection strap is provided with the first crimping item,
The side of the second framework towards first framework is provided with conductive bar described at least one, the second framework it is another
Side is provided with second connection strap, and the other end of second connection strap is provided with the second crimping item.
Compared with prior art, this kind of bypass diode frame has the beneficial effect that this kind of bypass diode frame knot
Structure is simple, and more conductive bars can increase the maximum current by this kind of diode frame, and chip carrier can weld biggish core
Split type bypass diode can be independently made in piece, each diode frame.
Based on the above technical solution, the present invention can also be improved as follows:
Further: the processing positioning unit includes be located by connecting item, positioning strip, and the positioning strip passes through at least one
The item that is located by connecting is connect with the diode frame, the location hole of positioning when the positioning strip is also provided with processing.This
Step the utility model has the advantages that positioning strip facilitates this kind of bypass diode frame to position in process equipment, be located by connecting item by cutting,
Diode frame can be separated with positioning strip.
Further: the positioning strip upper and lower ends be each provided with one described in be located by connecting item, the positioning of upper end
Connection strap is connect with first framework, and the item that is located by connecting of lower end is connect with the second framework.The beneficial effect of this step
Fruit: it is closer that this kind of connection structure connect diode frame with processing positioning unit.
Further: the conductive bar in the second frame unit has two, and the chip carrier is set between the conductive bar；
First framework, second framework offer the mounting hole for connecting with terminal box；First framework, conductive bar open up
There is at least one reinforced hole；First framework, second framework offer at least one for reducing the first recessed of stress
Slot.This step the utility model has the advantages that chip carrier is set between conductive bar, the length of later period copper wire jumper can be reduced, and make this kind
Diode frame structure is more compact；By the way that mounting hole is arranged, the convenient monomer as made from this kind of diode frame bypasses two poles
Pipe is installed on terminal box；When reinforced hole is used to increase plastic packaging, the attachment force between plastic packaging shell and this kind of diode frame；First groove
The stress that this kind of diode frame is subject to can be reduced, to reduce external force pullling to the chip for being installed on chip carrier.
Further: first framework, second framework offer storage molten tin bath.This step is used the utility model has the advantages that storing up molten tin bath
In placing block tin, facilitate welding busbar.
Further: first framework offers the first through hole passed through for busbar.First through hole to converge
Item is more easier to arrange.
In order to realize the present invention another purpose therein, the present invention provides a kind of monomer bypass diodes:
A kind of monomer bypass diode includes the diode frame, it further includes chip, copper wire jumper, the chip setting
In the chip carrier, the chip is connected with the copper wire jumper, and the copper wire jumper is at least connect with a conductive bar.
Compared with prior art, this kind of monomer bypass diode has the beneficial effect that monomer bypass diode reduces
Required installation space in terminal box, reduces the usage amount of copper material, reduces costs；And this kind bypass wherein
When diode damages, it is only necessary to replace that monomer bypass diode of damage, later period maintenance is at low cost；Monomer bypass
The good heat dissipation effect of diode.
Further: the block tin for welding busbar is provided in the storage molten tin bath.This step is set the utility model has the advantages that passing through
Block tin is set, welding busbar is facilitated.
Further: the chip, chip carrier, copper wire jumper, conductive bar outside are provided with plastic packaging shell.The beneficial effect of this step
Fruit: plastic packaging shell can dust protection, can insulate, improve the service life of inner components
Further: the second through-hole passed through for busbar is equipped between the plastic packaging shell and the second framework.This step
The utility model has the advantages that the second through-hole makes busbar be more easier to arrange
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described.In all the appended drawings, similar element
Or part is generally identified by similar appended drawing reference.In attached drawing, each element or part might not be drawn according to actual ratio.
Fig. 1 is the structural schematic diagram of bypass diode frame；
Fig. 2 is monomer bypass diode structural schematic diagram when removing plastic packaging shell；
Fig. 3 is the structural schematic diagram of monomer bypass diode；
Fig. 4 is the right view of Fig. 3；
Fig. 5 is the bottom view of Fig. 3.
Wherein, 1 processing positioning unit, 101 are located by connecting item, 102 positioning strips, 103 location holes, 2 diode frames, and 201
First crimping item, 202 first connection straps, 203 first frameworks, 204 chip carriers, 205 second crimping items, 206 second connection straps,
207 second frameworks, 208 conductive bars, 209 second grooves, 210 mounting holes, 211 reinforced holes, 212 first grooves, 213 storage molten tin baths,
214 first through hole, 215 second through-holes, 3 frame connection straps, 4 chips, 5 bronze medal wire jumpers, 6 block tins, 7 plastic packaging shells.
Specific embodiment
It is described in detail below in conjunction with embodiment of the attached drawing to technical solution of the present invention.Following embodiment is only used for
Clearly illustrate technical solution of the present invention, therefore be only used as example, and cannot be used as a limitation and limit protection model of the invention
It encloses.
It should be noted that unless otherwise indicated, technical term or scientific term used in this application should be this hair
The ordinary meaning that bright one of ordinary skill in the art are understood.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply relatively important
Property or implicitly indicate the quantity of indicated technical characteristic.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In this application unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In this application unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Specific embodiment
As shown in Figure 1, a kind of bypass diode frame, including processing positioning unit 1, diode frame 2, frame connection strap
3, diode frame 2 has multiple and is sequentially arranged at intervals, and is interconnected between adjacent diode frame 2 by 3 phase of frame connection strap
It connects, first diode frame 2 and the last one diode frame 2 are provided with processing positioning unit 1, are processing this kind of side
When the diode frame of road, processing positioning unit 1 positions bypass diode frame in processing machine.In the present embodiment, two poles
Tube frame 2 is from left to right arranged successively, and the diode frame 2 of the leftmost side is set as first diode frame 2, first diode
The left side of frame 2 is provided with processing positioning unit 1, and the right side of the last one diode frame 2 is provided with processing positioning unit 1.
Diode frame 2 includes the first frame unit, the second frame unit, between being equipped between the first frame unit and the second frame unit
Gap, the first frame unit include the first crimping item 201, the first connection strap 202, the first framework 203, chip carrier 204, the second frame
Unit includes the second crimping item 205, the second connection strap 206, second framework 207, conductive bar 208, and the first framework 203 is set to the
The top of two framework 207 and it is spaced apart from each other setting, is provided with two frame connection straps 3 between adjacent diode frame 2, adjacent the
It is connected between one framework 203 by a frame connection strap 3, passes through another frame connection between adjacent second framework 207
Item 3 connects, and the side of the first framework 203 towards second framework 207 is provided with chip carrier 204, and the other side of the first framework 203 is set
It is equipped with the first connection strap 202, the other end of the first connection strap 202 is provided with the first crimping item 201, and second framework 207 is towards
The side of one framework 203 is provided at least one conductive bar 208, and the other side of second framework 207 is provided with the second connection strap
206, the other end of the second connection strap 206 is provided with the second crimping item 205.In the present embodiment, conductive bar 208 has two and symmetrical
It is set to 207 upper end-face edge of second framework, forms the second groove 209 of U-shaped, chip carrier between conductive bar 208 and second framework 207
204 are located in the second groove 209, and there are gaps between chip carrier 204 and conductive bar 208, second framework 207.
As shown in Figure 1, processing positioning unit 1 includes be located by connecting item 101, positioning strip 102, positioning strip 102 is by least
Piece item 101 that is located by connecting is connect with diode frame 2, the location hole 103 of positioning when positioning strip 102 is also provided with processing.
In the present embodiment, the upper and lower ends of 102 the same side of positioning strip are each provided with the item 101 that is located by connecting, and upper end is located by connecting
Item 101 is connect with the first framework 203, and the item 101 that is located by connecting of lower end is connect with second framework 207.
As shown in Figure 1, the first framework 203, second framework 207 offer the mounting hole 210 for connecting with terminal box, this
In embodiment, the mounting hole 210 that the first framework 203 opens up is symmetrically disposed at left and right sides of 203 upper end of the first framework, second framework
207 mounting holes 210 opened up are symmetrically disposed at left and right sides of 207 lower end of second framework.First framework 203, conductive bar 208 are opened
Equipped at least one reinforced hole 211, in the present embodiment, reinforced hole 211 is waist typed through hole, and 203 lower end two sides of the first framework are opened
The reinforced hole 211 being provided symmetrically, the conductive bar 208 in each second frame unit offer a reinforced hole 211, add
Solid hole 211 plays when plastic packaging is connected to the chip 4 and conductive bar 208 of chip carrier 204 and increases plastic packaging material and this kind of diode
Attachment force between frame 2；First framework 203, second framework 207 offer at least one for reducing the first recessed of stress
Slot 212, in the present embodiment, the first framework 203, second framework 207 offer first groove 212, and the first groove 212 is used
In reduce machining stress, and the monomer bypass diode as made from this kind of diode frame 2 after being installed on terminal box by
Stress, avoid external force from pullling damage crystal grain, mitigate the injury to crystal grain.
As shown in Figure 1, the first framework 203, second framework 207 all offer storage molten tin bath 213, storage molten tin bath 213 is for placing
Block tin 6；First framework 203 offers the first through hole 214 passed through for busbar.
This kind of bypass diode frame through the stamping process, is integrally formed.
As shown in Fig. 2, a kind of monomer bypass diode, including an above-mentioned diode frame 2, it further include chip 4,
Copper wire jumper 5, chip 4 are welded in chip carrier 204 by scolding tin, and chip 4 is welded with copper wire jumper 5 by scolding tin, copper wire jumper 5 at least with
A piece conductive bar 208 connects.In the present embodiment, copper wire jumper 5 welds together with two conductive bars 208, to increase this kind
Diode can by maximum current, in actual production, by two copper wire jumpers 5 or a root long copper wire jumper 5 by two conductions
Item 208 is connect with chip 4, high when cost is than only connecting a conductive bar, it should which the maximum current passed through according to actual needs closes
The radical of the copper wire jumper 5 of reason selection connection or the length of copper wire jumper 5, just can only needing to connect a conductive bar 208
When meeting the maximum current passed through, a conductive bar 208 is only connected, so that the cost of entire monomer bypass diode is reduced, two
The first crimping item 201, second in pole pipe frame 2 crimps item 205 and is bent into U-shaped, convenient to connect with cable in terminal box.
As in Figure 3-5, the block tin 6 being provided in molten tin bath 213 for welding busbar is stored up, this kind of diode is installed on
After terminal box, busbar is welded in by this kind of monomer bypass diode by block tin 6；Chip 4, copper wire jumper 5, is led at chip carrier 204
Plastic packaging shell 7 is provided with by plastic package process on the outside of electric item 208, is equipped between the plastic packaging shell 7 and second framework 207 of formation for busbar
Across the second through-hole 215, first through hole 214 and the second through-hole 215 be set to 7 liang of plastic packaging shell, first through hole 214, second
Through-hole 215 facilitates the arrangement of busbar, plastic packaging shell 7 more easily consolidates its inner body for allowing busbar to pass therethrough
It is fixed, increase the stability of diode, and can dust protection, can insulate, improve the service life of inner components.
In production application, the bypass diode module being arranged in the terminal box of Solar panel backside, usually
Three Diode series form, so in the present embodiment, three diode frames can be made in this kind of bypass diode frame
2, three correspondences of diode frame 2 obtain three monomer bypass diodes, and three monomer bypass diodes are passed through series system
It is installed on same terminal box, i.e., the monomer bypass diode as made from one piece of this kind of bypass diode frame is just able to satisfy one
The demand of bypass diode quantity in terminal box can also change two poles in one piece of bypass diode frame according to actual needs
The number of tube frame 2, thus with needing number of diodes to be mounted to match in a terminal box；Monomer bypass diode is being pacified
When being fitted into terminal box, two block tin 6 need using one of them, and weld busbar on a block tin 6 wherein, confluence
Item is directly led out to be connect with terminal box again across first through hole 214 and the second through-hole 215, and the diode (led) module of monoblock type, is needed
It is connect again with terminal box after connecing extended line, so this kind of monomer bypass diode makes relative to the diode (led) module of monoblock type
Used time more saves lead, to reduce use cost.
The advantages of this kind of monomer solar energy module, is:
1, a monolith bypass diode module is changed to multiple monomer solar energy modules, required for reducing in terminal box
Installation space, and reduce the usage amount of copper material, reduce costs.
2, the mutual coherence request of monomer solar energy module declines, this kind of monomer solar energy module damage in terminal box
When, only that corresponding replacement of damage need to be reduced the maintenance replacement cost in later period.
3, mutually isolated between this kind of monomer solar energy module, relative in the same bypass diode module, reduce
The influence of mutual heat dissipation.
4, using this kind of monomer bypass diode, shorten the length of lead in terminal box, reduce the later period installation at
This.
In specification of the invention, numerous specific details are set forth.It is to be appreciated, however, that the embodiment of the present invention can be with
It practices without these specific details.In some instances, well known method, structure and skill is not been shown in detail
Art, so as not to obscure the understanding of this specification.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme should all cover within the scope of the claims and the description of the invention.
Claims (10)
1. a kind of bypass diode frame, it is characterised in that: including processing positioning unit, diode frame, frame connection strap, institute
It states there are two processing positioning units, is provided with multiple diode frames being sequentially arranged at intervals between the processing positioning unit
Frame is connected with each other between the adjacent diode frame by the frame connection strap；
Each diode frame includes the first frame unit, the second frame unit, and first frame unit includes the
One crimping item, the first connection strap, the first framework, chip carrier, second frame unit include the second crimping item, the second connection
Item, second framework, conductive bar, there are gap between first framework and second framework, first framework is towards described second
The side of framework is provided with the chip carrier, and the other side of first framework is provided with first connection strap, and described first
The other end of connection strap be provided with it is described first crimping item, the side of the second framework towards first framework be provided with to
A few conductive bar, the other side of the second framework are provided with second connection strap, second connection strap it is another
One end is provided with the second crimping item.
2. bypass diode frame according to claim 1, it is characterised in that: the processing positioning unit includes that positioning connects
Narrow bars, positioning strip, the positioning strip are connect by the item that is located by connecting described at least one with the diode frame, the positioning
The location hole of positioning when item is also provided with processing.
3. bypass diode frame according to claim 2, it is characterised in that: the positioning strip upper and lower ends are each provided with
Be located by connecting item described in one, and the item that is located by connecting of upper end is connect with first framework, and the described of lower end is located by connecting
Item is connect with the second framework.
4. bypass diode frame according to claim 1, it is characterised in that: the conductive bar in the second frame unit has two
Root, the chip carrier are set between the conductive bar；First framework, second framework are offered for connecting with terminal box
Mounting hole；First framework, conductive bar offer at least one reinforced hole；First framework, second framework are opened
Equipped at least one for reducing the first groove of stress.
5. bypass diode frame according to claim 1 to 4, it is characterised in that: first framework, the second frame
Body offers storage molten tin bath.
6. according to any bypass diode frame of claim 5, it is characterised in that: first framework is offered for converging
Flow the first through hole that item passes through.
7. a kind of monomer bypass diode, it is characterised in that: including the diode frame described in claim 6, it further includes
Chip, copper wire jumper, the chip are set to the chip carrier, and the chip is connected with the copper wire jumper, and the copper wire jumper is at least
It is connect with a conductive bar.
8. monomer bypass diode according to claim 7, it is characterised in that: be provided in the storage molten tin bath for welding
The block tin of busbar.
9. monomer bypass diode according to claim 8, it is characterised in that: the chip, copper wire jumper, is led at chip carrier
Plastic packaging shell is provided on the outside of electric item.
10. monomer bypass diode according to claim 9, it is characterised in that: the plastic packaging shell and the second framework
Between be equipped with for busbar pass through the second through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910692740.9A CN110323187A (en) | 2019-07-30 | 2019-07-30 | A kind of bypass diode frame and monomer bypass diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910692740.9A CN110323187A (en) | 2019-07-30 | 2019-07-30 | A kind of bypass diode frame and monomer bypass diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110323187A true CN110323187A (en) | 2019-10-11 |
Family
ID=68124839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910692740.9A Pending CN110323187A (en) | 2019-07-30 | 2019-07-30 | A kind of bypass diode frame and monomer bypass diode |
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| JP2008300553A (en) * | 2007-05-30 | 2008-12-11 | I-Chiun Precision Industry Co Ltd | Manufacturing method of frame combination member for surface mounted light emitting diode, and structure thereof |
| CN203859129U (en) * | 2014-05-29 | 2014-10-01 | 扬州扬杰电子科技股份有限公司 | Photovoltaic module |
| CN206293450U (en) * | 2016-11-28 | 2017-06-30 | 扬州虹扬科技发展有限公司 | A kind of photovoltaic bypass diode die block structure |
| CN206490644U (en) * | 2017-01-17 | 2017-09-12 | 扬州扬杰电子科技股份有限公司 | Split type module |
| CN108540086A (en) * | 2018-01-18 | 2018-09-14 | 浙江人和光伏科技有限公司 | A kind of conductive module of solar battery connecting box |
| CN210110743U (en) * | 2019-07-30 | 2020-02-21 | 扬州虹扬科技发展有限公司 | Bypass diode frame and monomer bypass diode |
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2019
- 2019-07-30 CN CN201910692740.9A patent/CN110323187A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300553A (en) * | 2007-05-30 | 2008-12-11 | I-Chiun Precision Industry Co Ltd | Manufacturing method of frame combination member for surface mounted light emitting diode, and structure thereof |
| CN203859129U (en) * | 2014-05-29 | 2014-10-01 | 扬州扬杰电子科技股份有限公司 | Photovoltaic module |
| CN206293450U (en) * | 2016-11-28 | 2017-06-30 | 扬州虹扬科技发展有限公司 | A kind of photovoltaic bypass diode die block structure |
| CN206490644U (en) * | 2017-01-17 | 2017-09-12 | 扬州扬杰电子科技股份有限公司 | Split type module |
| CN108540086A (en) * | 2018-01-18 | 2018-09-14 | 浙江人和光伏科技有限公司 | A kind of conductive module of solar battery connecting box |
| CN210110743U (en) * | 2019-07-30 | 2020-02-21 | 扬州虹扬科技发展有限公司 | Bypass diode frame and monomer bypass diode |
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