CN110323052A - A kind of preparation method and its inductance of the high-effect molding inductance of high magnetic permeability - Google Patents
A kind of preparation method and its inductance of the high-effect molding inductance of high magnetic permeability Download PDFInfo
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- CN110323052A CN110323052A CN201810265036.0A CN201810265036A CN110323052A CN 110323052 A CN110323052 A CN 110323052A CN 201810265036 A CN201810265036 A CN 201810265036A CN 110323052 A CN110323052 A CN 110323052A
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- stress relief
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- 238000000465 moulding Methods 0.000 title claims abstract description 44
- 230000035699 permeability Effects 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000011230 binding agent Substances 0.000 claims abstract description 37
- 238000000137 annealing Methods 0.000 claims abstract description 34
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 7
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- 238000012545 processing Methods 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 5
- 230000005389 magnetism Effects 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 4
- 239000010452 phosphate Substances 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 241000208140 Acer Species 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 3
- 239000011812 mixed powder Substances 0.000 claims description 3
- 229910000889 permalloy Inorganic materials 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 229910000702 sendust Inorganic materials 0.000 claims description 3
- 238000004227 thermal cracking Methods 0.000 claims description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 2
- DYUQAZSOFZSPHD-UHFFFAOYSA-N Phenylpropyl alcohol Natural products CCC(O)C1=CC=CC=C1 DYUQAZSOFZSPHD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 238000005469 granulation Methods 0.000 claims description 2
- 230000003179 granulation Effects 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 150000002466 imines Chemical class 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- -1 phenylpropyl alcohol oxazines Chemical class 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- 229920001021 polysulfide Polymers 0.000 claims description 2
- 239000005077 polysulfide Substances 0.000 claims description 2
- 150000008117 polysulfides Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 230000004580 weight loss Effects 0.000 claims 3
- 239000006247 magnetic powder Substances 0.000 claims 2
- 238000005260 corrosion Methods 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- GLBQVJGBPFPMMV-UHFFFAOYSA-N sulfilimine Chemical compound S=N GLBQVJGBPFPMMV-UHFFFAOYSA-N 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- 238000009700 powder processing Methods 0.000 abstract description 2
- 239000003085 diluting agent Substances 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011651 chromium Substances 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical compound OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000012938 design process Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- 229910005347 FeSi Inorganic materials 0.000 description 1
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 description 1
- 238000005842 biochemical reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
- H01F2017/046—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core helical coil made of flat wire, e.g. with smaller extension of wire cross section in the direction of the longitudinal axis
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Soft Magnetic Materials (AREA)
Abstract
The present invention provides the preparation methods and its inductance of a kind of high-effect molding inductance of high magnetic permeability.Wherein, high magnetic permeability is by obtaining after being molded inductance progress stress relief annealing；In addition, the iron loss and coil impedance of iron core substantially reduce by carrying out stress relief annealing to molding inductance；Finally, to be molded inductance after stress relief annealing with enough insulation characterisitics by developing insulating layer, insulating wrapped powder processing techniques resistant to high temperature and binder formula resistant to high temperature resistant to high temperature.In terms of comprehensive, stress relief annealing obtains a kind of high magnetic permeability, high efficiency is molded inductance by carrying out to molding inductance, and heavily loaded efficiency can achieve 90% or more.
Description
Technical field
The invention belongs to electronic information component fields, are related to a kind of preparation method of high-effect molding inductance of high magnetic permeability
And its inductance.
Background technique
As modern integrated circuits design and manufacturing process, chip design and manufacturing process, robot automation manufacture skill
The development of art, rapid photo detector and Internet application, intelligence have become information-intensive society or even next-generation industrial skill
The mainstream technology trend of art revolution.Currently, the various DC loads (including sensor) with intelligent calculation function are rapidly
Traditional industries and the survival condition of the mankind is transformed, person to person, object and object, people and object are connected with each other.
These complicated connections all depend on the transmitting, communication and calculating of information, therefore intelligentized terminal is come into being,
It can be the transmission end of information, be also possible to the receiving end of information and the tool of information communication, operation.In general, this
A little intelligentized terminals are required using tool of the chip as operation, therefore providing the preposition inductance of electric energy for it just must can not
It is few.Wherein, one of the preposition inductance of molding inductance as mainstream is with energy conversion efficiency is high, small in size, EMI characteristic is good, frequency
The reasons such as rate range is wide and be widely used, such as smart phone, smart television, tablet computer, laptop, LED television,
Various communicating terminals and server, intelligent appliance etc..
Being molded the application principle of inductance in various applications is BUCK or BOOST circuit, passes through the change of inductive magnetic flux amount
Change and generate the variation of induced electromotive force at inductance both ends, recycle other voltages cooperation in this induced electromotive force and circuit from
And the function of buck or boost is generated, it is provided simultaneously with energy and orderly stores and orderly transfer function.
Be molded inductance be also known as " Power Choke ", it be mainly characterized by the copper coil of excitation is placed in it is soft
Closed magnet circuit is formed inside magnetic metal powder and simultaneously and constituted with soft magnetic metal powder on molding machine, therefore eliminates numerous
Trivial winding process simultaneously obtains good EMI (electromagnetic interference) characteristic, while the electrode constituted by mold design is conveniently collecting
It is mounted at being automated on circuit.To sum up, molding inductance is that a kind of there is short route, high-performance, high degree of automation to show
It is the indispensable important electronic component of modern DC load equipment (especially intelligent electronic device) for electronic component.
Molding inductance material be made of soft magnetic metal powder and copper wire, soft magnetic metal powder be usually carbonyl iron dust,
FeCrSi alloy powder, FeSi alloy powder, atomized iron powder etc., the above metal powder have preferable soft magnetic characteristic, preferable
Mouldability and suitable cost are simultaneously used widely；But with the development of mobile electronic device especially smart phone,
It is required that electronic component power density is higher and higher, volume is smaller and smaller, thickness is more and more thinner, efficiency is higher and higher, therefore often
The soft magnetic metal powder of rule is increasingly difficult to meet the demand for development of industry.Then the various technologies for improving molding inductance gradually go out
It is existing, the representative are use the molding inductance of amorphous soft magnet powder, pressure sintering be molded inductance, lamination type inductance (material for
Nickel-zinc ferrite).But difficult point existing for this technique is that height is lost at present, usually its efficiency only has 80% under heavy loads
Left and right.The reason of constituting this problem is:
(1) it is molded inductance at present in order to meet the requirement of appearance flawless after binder solidifies, generallys use organic macromolecule
Binder, such as epoxy resin, phenolic resin etc. will lead to inductance cracking and insulation impedance failure by high annealing；
Therefore current its magnetic material initial permeability of molding inductance is between 20-30, and binder solidification internal stress is larger, and bring is asked
Topic is then that must increase coil turn to meet the needs of inductance, therefore copper loss is larger and becomes the loss of molding inductance energy and device
The main source of part fever；
(2) binder of molding inductance generates very big internal stress after solidifying inside magnetic material, on the one hand reduces material
Magnetic conductivity, on the other hand cause its magnetic hystersis loss larger, usual iron loss reaches 10000mW/cm3@(100kHz, 100mT) with
On；
(3) surface for being molded inductance Inside coil has high insulation resistance characteristic by polyester film, in stress relief annealing condition
Under cause oxide isolation to penetrate into inductance internal oxidation polyester film due to the failure of molding inductance binder, usual inductance moves back
Product insulation characterisitic fails after fire, and this is one of maximum risk in electronic product.
Summary of the invention
It is an object of the invention to develop the preparation method and its inductance of a kind of high-effect molding inductance of high magnetic permeability, from
And the light-load efficiency and heavy duty efficiency of molding inductance are improved, specific manifestation is:
1. by exploitation high temperature resistant and the molding inductance binder of resistance to cracking, insulating wrapped powder processing techniques resistant to high temperature and
It is molded inductance stress relief annealing technology and obtains high magnetic permeability, low-loss soft magnetic materials；
2. the number of turns of coil can be greatly reduced by the magnetic conductivity for improving iron core to obtain lower D.C. resistance, therefore copper
Damage greatly reduces.
The powder former that the present invention uses current industry generally to use, the type have high-efficient, easy to operate, applicable
The advantages that property is strong, is the general molding machine of current industry, therefore ensure that production cost is low, high production efficiency；In addition, in inductance
Stress relief annealing is carried out after molding can get the iron core that magnetic conductivity is high, iron loss is low；Finally, cooperation can binder formula resistant to high temperature
And temperature-resistant insulation layer, inductance can be subjected to 350 DEG C or more of high-temperature process:
One, the applicable material of the present invention can be reduced iron powder, atomized iron powder, carbonyl iron dust, iron silicon soft magnetism Series powder, iron silicon
Chromium soft magnetism Series powder, permalloy soft-magnetic alloy powder, Sendust powder, one kind of amorphous state soft magnetic metal powder and one
Kind or more mixed-powder.First soft magnetic metal powder surface is modified, modified purpose is that one layer of its Surface Creation has
Hardness is lower, with binder wellability is good, surface film with certain cohesive force, the main component of the film be silicate,
One kind or compound of phosphate and borate.Specific method is using silicate, dihydric phosphate or boric acid as metal
Surface modifier issues biochemical reaction in heat condition to obtain passivation layer, and total surface modifier content is in soft magnetic metal
Between the 0.0001-0.01 of powder weight.
Two, the selection of binder material.The binder formula can be silicate, dihydric phosphate, polyimides, cyanic acid
One kind of high temperature resistant binders such as ester, phenylpropyl alcohol oxazines, polysulfide imines, poly- maple, bismaleimide or more, in not modified item
Molding inductance under part using its production can crack after solidifying, therefore the present invention accounts for weight of binder percentage by addition
The rubber elastomer of 3-15% realizes the balance of high temperature resistant and resistance to cracking；In addition binder is also possible to the modification of the above binder
Binder；The thermal cracking temperature of binder reaches 350 DEG C or more, and insulation impedance intensity reaches 1M Ω/cm or more.
Specifically, binder of the present invention is configured to binder: metal powder=1:20-1:100 (weight ratio).First will
Binder is diluted to certain proportion with diluent, then mixes and is uniformly dispersed with the metal powder of surface insulation processing, later
By mixture pelleting, prilling powder is finally carried out heating removal diluent, temperature between 75um-250um by the granularity of granulation
Generally between 50-150 DEG C, soaking time is between 0.2-2 hours.
Three, it is molded the molding compacting of inductance.Forming processes are carried out in molding machine and corresponding mould, forming pressure is in 200-
Between 1000MPa, the dwell time, press temperature selected between 20-200 DEG C as needed between 0.5-120 seconds.
Four, it is molded the annealing of inductance.The molding inductance suppressed is first put into progress binder curing process in drying box,
Treatment temperature is between 100-250 DEG C, and for soaking time between 10-300 minutes, atmosphere is atmosphere or protective atmosphere, has to
Guarantee binder completion of cure；Then, the inductance after solidification is put into vacuum heat treatment furnace and carries out high temperature stress relief annealing, processing
Temperature between 300-500 DEG C, soaking time between 0.2-3 hours, annealing atmosphere be vacuum (vacuum degree 0.5Pa and with
Under) or protective atmosphere (such as nitrogen, argon gas, helium etc.).
Five, treatment of electrode surfaces.The tin coating of inductance after stress relief annealing its electrode surface at high temperature can be waved partially
Hair, it is therefore desirable to which tin plating in electrode surface according to application requirement, tin coating thickness is between 1-10um.
Six, back-end processing.Electrode terminal is converted into according to application requirement and is suitable for surface-pasted form, and is tested
The processes such as packaging, lettering.
Just attached drawing in conjunction with the embodiments below, the embodiment of the present invention is described in further detail, so that of the invention
Technical solution should be readily appreciated that, grasp.
Detailed description of the invention
Fig. 1 is the X-RAY figure after the molding inductance annealing in the embodiment of the present invention 1-3.
Specific implementation method
Embodiment 1:
The present embodiment is Fe with ingredient92Si3.5Cr4.5Metal powder as main material, average grain diameter (D50) is
10um, shape are essentially strip.
Surface treating agent selects phosphoric acid and mebor, and content is the 0.001 of metal powder weight, phosphoric acid and boric acid
Weight ratio is 100:20, and diluent selects alcohol, and the weight of alcohol is the 3% of metal powder.
Binder selects modified polyimide, and total weight of binder is the 3% of metal powder, and diluent uses diformazan
Benzene, the weight of dimethylbenzene are the 5% of metal powder, and solidification temperature is 220 DEG C of * 1h.
Pressing pressure is 600MPa, and inductance profile is previously placed in die cavity having a size of 6.6*6.5, coil, then by 0.6g
Powder filling die cavity simultaneously forms, then demould and takes out inductance.
Annealing uses vacuum annealing furnace, and parameter is 400 DEG C and keeps the temperature 30 minutes, and vacuum degree is less than 1.0Pa, then furnace cooling
It takes out and tests to room temperature, then do back-end processing.
For comparative example bring effect, compared using the general inductance of industry, composition is
Fe92Si4.5Cr3.5。
Molding inductive data after suppressing and annealing is as follows:
Embodiment 2:
The present embodiment is Fe with ingredient76(SiB)24The metal powder of work is as main material, average grain diameter (D50)
10um, shape are essentially strip.
Surface treating agent selects phosphoric acid and mebor, and content is the 0.001 of metal powder weight, phosphoric acid and boric acid
Weight ratio is 100:20, and diluent selects alcohol, and the weight of alcohol is the 3% of metal powder.
Binder selects modified polyimide, and total weight of binder is the 3% of metal powder, and diluent uses diformazan
Benzene, the weight of dimethylbenzene are the 5% of metal powder, and solidification temperature is 220 DEG C of * 1h.
Pressing pressure is 600MPa, and inductance profile is previously placed in die cavity having a size of 6.6*6.5, coil, then by 0.6g
Powder filling die cavity simultaneously forms, then demould and takes out inductance.
Annealing uses vacuum annealing furnace, and parameter is 400 DEG C and keeps the temperature 30 minutes, and vacuum degree is less than 1.0Pa, then furnace cooling
It takes out and tests to room temperature, then do back-end processing.
For comparative example bring effect, compared using the general inductance of industry, composition is
Fe92Si4.5Cr3.5。
Molding inductive data after suppressing and annealing is as follows:
Embodiment 3:
The present embodiment is Fe with ingredient92Si3.5Cr4.5Metal powder as main material, average grain diameter (D50) is
10um, shape are essentially strip.
Surface treating agent selects phosphoric acid and mebor, and content is the 0.001 of metal powder weight, phosphoric acid and boric acid
Weight ratio is 100:20, and diluent selects alcohol, and the weight of alcohol is the 3% of metal powder.
Binder select polyimides, total weight of binder be metal powder 3%, diluent use dimethylbenzene, two
The weight of toluene is the 5% of metal powder, and solidification temperature is 220 DEG C of * 1h.
Pressing pressure is 600MPa, and inductance profile is previously placed in die cavity having a size of 6.6*6.5, coil, then by 0.6g
Powder filling die cavity simultaneously forms, then demould and takes out inductance.
Annealing uses vacuum annealing furnace, and annealing temperature is respectively 300,400 DEG C, 500 DEG C, 550 DEG C and keeps the temperature 30 minutes, very
Reciprocal of duty cycle is less than 1.0Pa, and then furnace cooling is taken out and tested to room temperature, then does back-end processing.
For comparative example bring effect, compared using the general inductance of industry, composition is
Fe92Si4.5Cr3.5。
Molding inductive data after suppressing and annealing is as follows:
From the results, it was seen that this shows magnetic material the north as annealing temperature raising inductance efficiency and inductance value all increase
Stress be released, when reaching 550 DEG C inductance efficiency and inductance value decline, or even than it is unannealed when it is also poor, this shows material
Material fails during heat treatment, and powder and coil insulating capacity is caused to decline even short circuit, so that inductance characteristic declines.
Claims (5)
1. the preparation method and its inductance of a kind of high-effect molding inductance of high magnetic permeability, it is characterised in that: (1) the molding inductance
Heavily loaded efficiency reaches 92% or more, light-load efficiency and reaches 85% or more；(2) binder material of the molding inductance can be born
350 DEG C of temperatures above needed for stress relief annealing and there is preferable insulation impedance and intensity simultaneously；(3) the molding inductance leads
The insulating layer on surface can bear 350-500 DEG C of annealing requirement in * 1 hour under vacuum conditions and insulating layer thermal weight loss is small simultaneously
In 15%；(4) preparation process of the molding inductance is subjected to soft magnetic metal powder insulation processing, granulation, powder drying, molding
Necessity process such as compacting, stress relief annealing, and the temperature of stress relief annealing is at 350 DEG C or more；(5) the applicable metal of the present invention
Soft magnetic powder can be reduced iron powder, atomized iron powder, carbonyl iron dust, iron silicon soft magnetism Series powder, permalloy soft-magnetic alloy powder
End, one kind of Sendust powder, amorphous state soft magnetic metal powder and more than one mixed-powders.
2. the preparation method and its inductance of the high-effect molding inductance of a kind of high magnetic permeability according to claim 1, feature
Be: the heavily loaded efficiency of the molding inductance reaches 92% or more, and light-load efficiency reaches 85% or more.
3. the preparation method and its inductance of the high-effect molding inductance of a kind of high magnetic permeability according to claim 1, feature
Be: the binder formula of the molding inductance can bear 350 DEG C of temperatures above needed for stress relief annealing and have simultaneously compared with
Good insulation impedance, the binder formula can be silicate, dihydric phosphate, polyimides, cyanate, phenylpropyl alcohol oxazines, gather
One kind of high temperature resistant binders such as sulfilimine, poly- maple, bismaleimide or more, the modification for being also possible to the above binder are viscous
Agent is tied, the thermal cracking temperature of the binder reaches 350 DEG C or more, and insulation impedance intensity reaches 1M Ω/cm or more.
4. the preparation method and its inductance of the high-effect molding inductance of a kind of high magnetic permeability according to claim 1, feature
Be: the insulating layer on the molding inductance leads surface can bear 350 DEG C of temperatures above needed for stress relief annealing and simultaneously absolutely
Edge layer thermal weight loss is less than 15%, and for more preferably thermal weight loss less than 10%, which can be silicate binder, phosphoric acid
One kind of high temperature resistant engineerings resin such as salt binder and polyimides, polysulfide imines, poly- maple, polyethers or more, is also possible to
The modified resin of the above resin, it is strong that the thermal cracking temperature of the binder formula resin reaches 350 DEG C or more general insulation impedances
Degree reaches 1M Ω/cm.
5. the preparation method and its inductance of the high-effect molding inductance of a kind of high magnetic permeability according to claim 1, feature
Be: the preparation process of the molding inductance be subjected to soft magnetic metal powder surface treatment, be granulated, powder drying, molding compacting,
Necessity process such as stress relief annealing, and the temperature of stress relief annealing, at 350 DEG C or more, soaking time of annealing was at 0.1-2 hours
Between, annealing atmosphere is vacuum (vacuum degree 0.5Pa and following) or protective atmosphere (such as nitrogen, argon gas, helium etc.), metal
Soft magnetic powder can be reduced iron powder, atomized iron powder, carbonyl iron dust, iron silicon soft magnetism Series powder, iron silicochromium soft magnetism Series powder,
Permalloy soft-magnetic alloy powder, Sendust powder, one kind of amorphous state soft magnetic metal powder and more than one mixed-powders,
It is surface-treated insulation characterisitic and the anti-corrosion property etc. for generating insulating layer to improve powder.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828104A (en) * | 2019-10-23 | 2020-02-21 | 上海太朔材料技术有限公司 | Moulded inductor made of aqueous epoxy resin and manufacturing process thereof |
| CN111243853A (en) * | 2020-03-02 | 2020-06-05 | 深圳市铂科新材料股份有限公司 | Manufacturing method of integrally-formed high-density inductor |
| CN113963929A (en) * | 2020-07-20 | 2022-01-21 | 昆山磁通新材料科技有限公司 | Method for improving insulation impedance of molded inductor |
| WO2022077150A1 (en) * | 2020-10-12 | 2022-04-21 | 昆山磁通新材料科技有限公司 | Magnetic composite material and preparation method therefor, and inductor and manufacturing method therefor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1516204A (en) * | 2003-01-08 | 2004-07-28 | 湖州科达磁电有限公司 | Method for making soft magnet silicon aluminium alloy powder core |
| CN102637518A (en) * | 2011-11-30 | 2012-08-15 | 同济大学 | Method for preparing iron-based composite magnetic powder core |
| CN105355408A (en) * | 2015-11-18 | 2016-02-24 | 韵升控股集团有限公司 | Moulding surface mounting inductor manufacture method |
| CN107689280A (en) * | 2017-06-30 | 2018-02-13 | 安泰科技股份有限公司 | Powder core, molding inductance and its manufacture method |
-
2018
- 2018-03-28 CN CN201810265036.0A patent/CN110323052A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1516204A (en) * | 2003-01-08 | 2004-07-28 | 湖州科达磁电有限公司 | Method for making soft magnet silicon aluminium alloy powder core |
| CN102637518A (en) * | 2011-11-30 | 2012-08-15 | 同济大学 | Method for preparing iron-based composite magnetic powder core |
| CN105355408A (en) * | 2015-11-18 | 2016-02-24 | 韵升控股集团有限公司 | Moulding surface mounting inductor manufacture method |
| CN107689280A (en) * | 2017-06-30 | 2018-02-13 | 安泰科技股份有限公司 | Powder core, molding inductance and its manufacture method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828104A (en) * | 2019-10-23 | 2020-02-21 | 上海太朔材料技术有限公司 | Moulded inductor made of aqueous epoxy resin and manufacturing process thereof |
| CN111243853A (en) * | 2020-03-02 | 2020-06-05 | 深圳市铂科新材料股份有限公司 | Manufacturing method of integrally-formed high-density inductor |
| CN113963929A (en) * | 2020-07-20 | 2022-01-21 | 昆山磁通新材料科技有限公司 | Method for improving insulation impedance of molded inductor |
| WO2022077150A1 (en) * | 2020-10-12 | 2022-04-21 | 昆山磁通新材料科技有限公司 | Magnetic composite material and preparation method therefor, and inductor and manufacturing method therefor |
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