CN110316970A - The preparation method of ultra-thin quartz glass piece - Google Patents
The preparation method of ultra-thin quartz glass piece Download PDFInfo
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- CN110316970A CN110316970A CN201910468977.9A CN201910468977A CN110316970A CN 110316970 A CN110316970 A CN 110316970A CN 201910468977 A CN201910468977 A CN 201910468977A CN 110316970 A CN110316970 A CN 110316970A
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- quartz glass
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- polishing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Surface Treatment Of Glass (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The present invention proposes a kind of preparation method of ultra-thin quartz glass piece.Precision machinery polishing is used in combination in the method and the method for acid etch prepares ultra-thin quartz glass piece；Its thickness≤100 μm, the thickness uniformity are -2 μm~2 μm, surface roughness Ra≤2nm；It the described method comprises the following steps: using precision machinery polishing by quartz glass slice lapping, polishing, obtaining the first quartz glass plate；Cleaning；Acid etch obtains ultra-thin quartz glass piece；The acid etch uses hydrofluoric acid, and concentration is 10~20mol/L, and the temperature of acid etch is 30 DEG C~40 DEG C, rate≤1 μm/min of acid etch.The method processing quartz glass plate that precision machinery polishing is used in combination in the method and hf etching combines, coordinated by the processing parameter matching to each process, avoid fragmentation in quartz glass thin slice preparation process, its the thickness uniformity and surface roughness are improved simultaneously, thus more suitable for practical.
Description
Technical field
The invention belongs to ultra-thin quartz glass piece manufacturing field, in particular to a kind of thickness≤100 μm, the thickness uniformity
For -2 μm~2 μm and the preparation method of surface roughness Ra≤2nm ultra-thin quartz glass piece.
Background technique
Ultra-thin quartz glass piece can be used as high-frequency circuit board, for making microcircuit on the surface thereof.With scientific skill
The development of art, frequency range is gradually increased by microwave, millimeter wave, THz wave, for the thickness uniformity of high-frequency circuit board
Higher requirement is proposed with surface roughness.
Mechanical lapping polishing is the most common optical means of optical materials such as processing quartz glass, sapphire and crystal.It should
Method keeps glass surface smooth by physics polishing, reduces the surface roughness of glass.But using mechanical lapping polishing
The quartz glass plate that method obtains, the most thin about 0.2mm of thickness limit.Since quartz glass belongs to fragile material, if continuing
It is thinned using mechanical means, then will appear the fragmentation of quartz glass plate in process and in uneven thickness etc. is asked
Topic.
Summary of the invention
It is that -2 μm~2 μm and surface are thick the main purpose of the present invention is to provide a kind of thickness≤100 μm, the thickness uniformity
The preparation method of the ultra-thin quartz glass piece of rugosity Ra≤2nm, it is solved the technical issues of be be used in combination precision machinery throw
The each process processing parameter matching in method processing quartz glass plate that light and hf etching combine is coordinated, and quartzy glass is avoided
Fragmentation in glass thin slice preparation process, while its thickness uniformity and surface roughness are improved, thus more suitable for practical.
The object of the invention to solve the technical problems adopts the following technical solutions to realize.It proposes according to the present invention
A kind of ultra-thin quartz glass piece preparation method, precision machinery polishing is used in combination and the method for acid etch prepares ultra-thin stone
English sheet glass；Thickness≤100 μm of the ultra-thin quartz glass piece, the thickness uniformity are -2 μm~2 μm, surface roughness Ra
≤2nm。
The object of the invention to solve the technical problems also can be used following technical measures and further realize.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the preparation method the following steps are included:
1) quartz glass slice lapping, polishing are obtained by the first quartz glass plate using precision machinery polishing；
2) it cleans；
3) acid etch obtains ultra-thin quartz glass piece.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein it is described the step of 1) the following steps are included:
Using abrasive material twin grinding quartz glass plate to specified thickness；Using polishing powder twin polishing quartz glass plate, obtain
First quartz glass plate.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the abrasive material selects partial size≤10 μm
Al2O3Particle；The polishing powder selects partial size≤100nm SiO2Particle.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein spheroidal graphite cast-iron conduct is selected in the grinding
Abrasive media；The polishing selects polyurethane as polishing medium.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the thickness of first quartz glass plate
For 0.2~0.3mm, the thickness uniformity is -5 μm~5 μm, surface roughness Ra≤1nm.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the cleaning the following steps are included: using
Hydrofluoric acid solution impregnates the first quartz glass plate；Then ultrasonic cleaning is carried out again.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the mass concentration of the hydrofluoric acid solution
It is 0.2~1%, soaking temperature is 20~30 DEG C, and soaking time is 2min~5min.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the liquid that the ultrasonic cleaning uses
For deionized water, resistivity >=18M Ω cm, supersonic frequency is 28~45kHz.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the acid etch uses hydrofluoric acid, it is dense
Degree is 10~20mol/L；The temperature of the acid etch is 30 DEG C~40 DEG C；Rate≤1 μm of the acid etch/min.
By above-mentioned technical proposal, a kind of preparation method of ultra-thin quartz glass piece proposed by the present invention at least has following
Advantage:
1, precision machinery polishing and acid etch is used in combination in the preparation method of ultra-thin quartz glass piece proposed by the present invention
Method combines the advantages of machining and chemical etching are processed, and guarantees glass surface by precision machinery grinding and polishing first
Roughness, then micron order is thinned to by hf etching thickness, finally prepare thickness≤100 μm, the thickness uniformity is -2 μ
M~2 μm and surface roughness Ra≤2nm ultra-thin quartz glass piece；
2, quartz glass plate is passed through the method for machining by the preparation method of ultra-thin quartz glass piece proposed by the present invention
Its thickness is machined to 200~300 μ m thicks and then≤100 μm are thinned to its thickness by the chemical method of acid etch
Target thickness；It is that quartz glass plate is placed in hydrofluoric acid with special fixture when quartz glass plate is thinned using hf etching
In solution, without mechanical external force during this etching, it can be avoided the fragmentation of thin slice, overcome due to quartz glass plate brittleness itself
The caused quartz glass plate fragmentation occurred when continuing to use mechanical means and it being thinned and problem in uneven thickness；
3, hf etching processes quartz glass, is currently used primarily in the production of quartz glass device, can be in glass
On etch the shapes such as hole, microflute；Its principle is that hydrofluoric acid and quartz glass can chemically react, but this processing side
Method is easy the subsurface defect in exposure glass polishing face, and glass surface roughness is caused to increase；Ultra-thin quartz proposed by the present invention
The preparation method of sheet glass, is polished by using precision machinery, is controlled the abrasive material, the material of polishing powder and partial size and is ground
Mill, the technological parameter polished, make the surface roughness of first quartz glass plate reach the level of Ra≤1nm；Then again
Acid etch processing is carried out to it, overcomes the big defect of surface roughness present in harsh etching technique in the prior art.Pass through
Surface roughness Ra≤2nm of the ultra-thin quartz glass piece of technical solution of the present invention processing, can satisfy high-frequency circuit board
Use demand.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, with presently preferred embodiments of the present invention, detailed description is as follows below.
Specific embodiment
It is of the invention to reach the technical means and efficacy that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Preferred embodiment, to a kind of preparation method of ultra-thin quartz glass piece proposed according to the present invention, specific embodiment, knot
Structure, feature and its effect, detailed description is as follows.
The present invention proposes a kind of preparation method of ultra-thin quartz glass piece, and precision machinery polishing and acid etch is used in combination
Method prepare ultra-thin quartz glass piece；Thickness≤100 μm of the ultra-thin quartz glass piece, the thickness uniformity be -2 μm~
2 μm, surface roughness Ra≤2nm.
Grinding, polishing are a kind of surface processing techniques, can obtain the glass of required size and surface quality.Precision machinery
Grinding and polishing can polish the more fine of control than mechanical lapping.For superthin section, precision machinery polishing is in order to obtain
Good the thickness uniformity and surface roughness, hf etching is that thickness is thinned to 100 μm or less；It is wherein any in the two
Du≤100 μm Hou cannot be all implemented separately in one method, the thickness uniformity is -2 μm~2 μm, and Biao Mian Cu Cao Du≤2nm's is ultra-thin
The processing of piece.
Quartz glass plate of the invention before the grinding, need to first pre-process quartz glass plate, by flat stone mill or slightly
Mill makes its thickness reach about 400 μm or so.Then, it then adopts it is processed with the aforedescribed process.It is thrown by precision machinery
Then light is thinned the thickness of quartz glass plate by hf etching again, makes stone to ensure the surface roughness of quartz glass plate
English sheet glass is thinned to micron order, obtains ultra-thin quartz glass piece.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned comprising following steps:
1) quartz glass slice lapping, polishing are obtained by the first quartz glass plate using precision machinery polishing；
2) it cleans；
3) acid etch obtains ultra-thin quartz glass piece.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein it is described the step of 1) the following steps are included: adopting
With abrasive material twin grinding quartz glass plate to specified thickness；Using polishing powder twin polishing quartz glass plate, the first quartzy glass is obtained
Glass piece.
The grinding is adopted with machinery method, used abrasive grain also thicker than the abrasive grain of polishing one
A bit；The main distinction of the two be polish attainable surface smoothness it is higher than grinding.The grinding and polishing
It can be realized on same plane polishing machine, but the configuration of the two is different from consumptive material.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the abrasive material selects partial size≤10 μm
Al2O3Particle；The polishing powder selects partial size≤100nm SiO2Particle.
The grinding and polishing can change the dimensional accuracy of quartz glass plate；Technical solution of the present invention is using first
The technique polished after grinding carries out.Grinding and polishing are carried out in the thickness direction of quartz glass plate.Due to grinding abrasive
Granularity it is big, therefore its for thickness removal rate be greater than polishing, grinding be polishing necessary program；And polishing is then in stone
English glass sheet thickness makes the surface of quartz glass plate become smooth while reduction.
In polishing, the polishing wheel of rotation presses to quartz glass plate, and polishing powder is made to generate rolling to quartz glass plate surface
And micro cutting, to obtain bright finished surface, surface roughness is generally up to nanoscale.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein spheroidal graphite cast-iron conduct is selected in the grinding
Abrasive media；The polishing selects polyurethane as polishing medium.
Heretofore described abrasive media and polishing medium refers to the abrasive wheel being fixed on precision machinery polishing machine,
By the movement of abrasive wheel, pushes the abrasive material and polishing powder in quartz glass plate apparent motion respectively, pass through abrasive material and throwing
Its grinding and polishing to quartz glass plate surface is realized in circulating for light powder.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the thickness of first quartz glass plate
For 0.2~0.3mm, the thickness uniformity is -5 μm~5 μm, surface roughness Ra≤1nm.
The thickness uniformity refers to the thickness value difference of any two points on ultra thin substrate；The thickness uniformity
Absolute value is smaller, then it represents that the thickness uniformity of the substrate is better.
The surface roughness (s μ rface ro μ ghness) is indicated using Ra, refers to that finished surface has smaller
The unevenness of spacing and small peak valley, the distance between two wave crests or two troughs (pitch of waves) very little (in 1mm or less), it belongs to
Microcosmos geometric shape error.The surface roughness of material is smaller, then surface is more smooth.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the cleaning the following steps are included: using
Hydrofluoric acid solution impregnates the first quartz glass plate；Then ultrasonic cleaning is carried out again.
The ultrasonic cleaning is to utilize cavitation, acceleration effect and the direct flow effect of ultrasonic wave in a liquid
To liquid and dirt directly, indirectly effect, make crud layer by dispersion, emulsification, removing and reach cleaning purpose.
Acid soak and ultrasonic cleaning are successively carried out according to above-mentioned step.The acid soak is intended to the first stone
English glass polishing piece SiO remained on surface2The dissolution of polishing powder particle reaction；The ultrasonic cleaning is intended to remove precise polished
The first quartz glass plate surface polishing powder residual, remove polished glass surface dust particale.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the mass concentration of the hydrofluoric acid solution
It is 0.2~1%, soaking temperature is 20~30 DEG C, and soaking time is 2min~5min.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the liquid that the ultrasonic cleaning uses
For deionized water, resistivity >=18M Ω cm, supersonic frequency is 28~45kHz.
Preferably, the preparation method of ultra-thin quartz glass piece above-mentioned, wherein the acid etch uses hydrofluoric acid, it is dense
Degree is 10~20mol/L；The temperature of the acid etch is 30 DEG C~40 DEG C；Rate≤1 μm of the acid etch/min.
Above-mentioned acid etch reduction process, by technological parameters such as the concentration of control hydrofluoric acid and etching temperatures, to ensure
Quartz glass plate can be thinned by hf etching at a suitable rate, and hydrofluoric acid is enable equably to etch first stone
English sheet glass, until the thickness of the quartz glass plate is thinned to specified thickness.By the control of harsh etching technique,
The thickness uniformity of the quartz glass plate can further increase.
The process of quartz glass plate is thinned in above-mentioned hf etching, is with special fixture by the quartz glass plate
It is placed in hydrofluoric acid solution, during etching herein, the quartz glass plate not will receive any mechanical external force, to avoid
Quartz glass thin slice problem easy to break.
It is described further below by more specific embodiment.
Embodiment 1
The present invention proposes a kind of preparation method of ultra-thin quartz glass piece, comprising the following steps:
1) quartz glass plate roughing: before the milling by quartz glass plate flat stone mill or corase grinding, control its with a thickness of
0.4mm；
2) precision machinery grinding and polishing: using spheroidal graphite cast-iron for abrasive media, 10 μm of partial size of Al2O3 particle be abrasive material into
Row twin grinding, remove quartz glass plate with a thickness of 80~170 μm；Use polyurethane for polishing medium, 50~100nm of partial size
SiO2 particle be polishing powder carry out twin polishing, remove quartz glass plate with a thickness of 20~30 μm；It is processed by this step,
Quartz glass plate is machined to a thickness of 0.2~0.3mm, the thickness uniformity is -5 μm~5 μm, surface roughness Ra≤1nm
First quartz glass polished silicon wafer；
Cleaning: first quartz glass is first impregnated at 20 DEG C with the hydrofluoric acid aqueous solution that mass concentration is 0.5%
Polished silicon wafer 5min；Then to its ultrasonic cleaning, the ultrasonic cleaning is using water as medium, resistivity >=18M Ω cm,
Supersonic frequency is 45kHz；
Acid etch is thinned: configuration concentration is the hydrofluoric acid solution of 15mol/, and etching temperature is set as 35 DEG C, measurement etching speed
Rate (two-sided removal rate) is 0.8 μm/min.During acid etch, the quartz glass plate is horizontal positioned, and acid solution is from upper
And the lower dynamic circulation of pump.
300 μm of thickness of the first quartz glass plate etching is thinned to 50 μm, time-consuming about 5 hours.
The thickness uniformity of ultra-thin quartz glass piece prepared by the present embodiment is -2 μm~2 μm, surface roughness Ra
=2nm.
Embodiment 2-6
Step is the same as embodiment 1.
The technological parameter of each embodiment is adjusted according to the data in following tables 1, prepared ultra-thin quartz glass
The size of piece is shown in Table 1.
The technological parameter and properties of product of 1 embodiment 1-6 of table
The embodiment 1 as shown in above-mentioned table 1 to the technological parameter of embodiment 6 and the performance data of prepared product can
See, the method processing quartz glass that precision machinery polishing is used in combination in technical solution of the present invention and hf etching combines
Piece avoids the fragmentation during the preparation process of quartz glass thin slice by the matching and coordination to technological parameter in each process, while
Improve the thickness uniformity and surface roughness of ultra-thin quartz glass piece.Prepared ultra-thin quartz glass piece, thickness≤
100 μm, the thickness uniformity be -2 μm~2 μm and surface roughness Ra≤2nm, can satisfy high-frequency circuit board use need
It asks.
Technical characteristic in the claims in the present invention and/or specification can be combined, and a combination thereof mode is not limited to weigh
The combination obtained in benefit requirement by adduction relationship.It is combined by the technical characteristic in claim and/or specification
The technical solution and protection scope of the present invention arrived.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, according to
According to technical spirit any simple modification, equivalent change and modification to the above embodiments of the invention, this hair is still fallen within
In the range of bright technical solution.
Claims (10)
1. a kind of preparation method of ultra-thin quartz glass piece, which is characterized in that
The method that precision machinery polishing and acid etch is used in combination prepares ultra-thin quartz glass piece；
Thickness≤100 μm of the ultra-thin quartz glass piece, the thickness uniformity are -2 μm~2 μm, surface roughness Ra≤
2nm。
2. the preparation method of ultra-thin quartz glass piece according to claim 1, which is characterized in that itself the following steps are included:
1) quartz glass slice lapping, polishing are obtained by the first quartz glass plate using precision machinery polishing；
2) it cleans；
3) acid etch obtains ultra-thin quartz glass piece.
3. the preparation method of ultra-thin quartz glass piece according to claim 2, which is characterized in that the step 1) includes
Following steps:
Using abrasive material twin grinding quartz glass plate to specified thickness；Using polishing powder twin polishing quartz glass plate, first is obtained
Quartz glass plate.
4. the preparation method of ultra-thin quartz glass piece according to claim 3, which is characterized in that
The abrasive material selects the Al of partial size≤10 μm2O3Particle；The polishing powder selects partial size≤100nm SiO2Particle.
5. the preparation method of ultra-thin quartz glass piece according to claim 2, which is characterized in that
The grinding selects spheroidal graphite cast-iron as abrasive media；The polishing selects polyurethane as polishing medium.
6. according to the preparation method of the described in any item ultra-thin quartz glass pieces of claim 2-5, which is characterized in that
First quartz glass plate with a thickness of 0.2~0.3mm, the thickness uniformity is -5 μm~5 μm, surface roughness Ra
≤1nm。
7. the preparation method of ultra-thin quartz glass piece according to claim 6, which is characterized in that
The cleaning the following steps are included:
First quartz glass plate is impregnated using hydrofluoric acid solution；Then ultrasonic cleaning is carried out again.
8. the preparation method of ultra-thin quartz glass piece according to claim 7, which is characterized in that
The mass concentration of the hydrofluoric acid solution be 0.2~1%, soaking temperature be 20~30 DEG C, soaking time be 2min~
5min。
9. the preparation method of ultra-thin quartz glass piece according to claim 7, which is characterized in that
The liquid that the ultrasonic cleaning uses is deionized water, resistivity >=18M Ω cm, supersonic frequency be 28~
45kHz。
10. the preparation method of ultra-thin quartz glass piece according to claim 6, which is characterized in that
The acid etch uses hydrofluoric acid, and concentration is 10~20mol/L；
The temperature of the acid etch is 30 DEG C~40 DEG C；
Rate≤1 μm of the acid etch/min.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110790512A (en) * | 2019-10-12 | 2020-02-14 | 天津大学 | Method for stripping quartz plate by wet etching |
| CN110977629A (en) * | 2019-12-23 | 2020-04-10 | 苏州纳迪微电子有限公司 | Sapphire window sheet and polishing process thereof |
| CN112408806A (en) * | 2020-11-16 | 2021-02-26 | 凯盛科技集团有限公司 | Processing method of K9 ultrathin glass |
| CN112679101A (en) * | 2020-12-25 | 2021-04-20 | 安徽金龙浩光电科技有限公司 | Glass with different thicknesses and processing technology thereof |
| CN112692650A (en) * | 2020-12-23 | 2021-04-23 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Processing method of optical spherical surface |
| CN113213769A (en) * | 2021-04-16 | 2021-08-06 | 河北光兴半导体技术有限公司 | Etching thinning system |
| WO2023077563A1 (en) * | 2021-11-05 | 2023-05-11 | 北京理工大学 | Method for reducing roughness of quartz surface to sub-nanometer scale |
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| US6099389A (en) * | 1998-10-05 | 2000-08-08 | The United States Of America As Represented By The United States Department Of Energy | Fabrication of an optical component |
| CN104934499A (en) * | 2014-03-17 | 2015-09-23 | 信越化学工业株式会社 | Methods For Working And Sensing Synthetic Quartz Glass Substrate |
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| US6099389A (en) * | 1998-10-05 | 2000-08-08 | The United States Of America As Represented By The United States Department Of Energy | Fabrication of an optical component |
| CN104934499A (en) * | 2014-03-17 | 2015-09-23 | 信越化学工业株式会社 | Methods For Working And Sensing Synthetic Quartz Glass Substrate |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110790512A (en) * | 2019-10-12 | 2020-02-14 | 天津大学 | Method for stripping quartz plate by wet etching |
| CN110977629A (en) * | 2019-12-23 | 2020-04-10 | 苏州纳迪微电子有限公司 | Sapphire window sheet and polishing process thereof |
| CN110977629B (en) * | 2019-12-23 | 2022-04-15 | 苏州纳迪微电子有限公司 | Sapphire window sheet and polishing process thereof |
| CN112408806A (en) * | 2020-11-16 | 2021-02-26 | 凯盛科技集团有限公司 | Processing method of K9 ultrathin glass |
| CN112692650A (en) * | 2020-12-23 | 2021-04-23 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Processing method of optical spherical surface |
| CN112679101A (en) * | 2020-12-25 | 2021-04-20 | 安徽金龙浩光电科技有限公司 | Glass with different thicknesses and processing technology thereof |
| CN113213769A (en) * | 2021-04-16 | 2021-08-06 | 河北光兴半导体技术有限公司 | Etching thinning system |
| CN113213769B (en) * | 2021-04-16 | 2023-09-15 | 河北光兴半导体技术有限公司 | Etching thinning system |
| WO2023077563A1 (en) * | 2021-11-05 | 2023-05-11 | 北京理工大学 | Method for reducing roughness of quartz surface to sub-nanometer scale |
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