CN110306091A - 一种高浸润性低热阻液态金属片及其制备方法 - Google Patents
一种高浸润性低热阻液态金属片及其制备方法 Download PDFInfo
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- CN110306091A CN110306091A CN201910651155.4A CN201910651155A CN110306091A CN 110306091 A CN110306091 A CN 110306091A CN 201910651155 A CN201910651155 A CN 201910651155A CN 110306091 A CN110306091 A CN 110306091A
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- liquid metal
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- metal sheet
- tin
- bismuth
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 189
- 238000002360 preparation method Methods 0.000 title claims abstract description 32
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052718 tin Inorganic materials 0.000 claims abstract description 52
- 239000002994 raw material Substances 0.000 claims abstract description 45
- 229910052738 indium Inorganic materials 0.000 claims abstract description 43
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 42
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910045601 alloy Inorganic materials 0.000 claims description 83
- 239000000956 alloy Substances 0.000 claims description 83
- 229910052733 gallium Inorganic materials 0.000 claims description 60
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims description 16
- 239000011574 phosphorus Substances 0.000 claims description 16
- 239000007769 metal material Substances 0.000 abstract description 3
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 description 42
- 238000003756 stirring Methods 0.000 description 14
- 238000002156 mixing Methods 0.000 description 13
- BSPSZRDIBCCYNN-UHFFFAOYSA-N phosphanylidynetin Chemical compound [Sn]#P BSPSZRDIBCCYNN-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 238000010008 shearing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005275 alloying Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010406 interfacial reaction Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- UJXZVRRCKFUQKG-UHFFFAOYSA-K indium(3+);phosphate Chemical compound [In+3].[O-]P([O-])([O-])=O UJXZVRRCKFUQKG-UHFFFAOYSA-K 0.000 description 1
- IGUXCTSQIGAGSV-UHFFFAOYSA-K indium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[In+3] IGUXCTSQIGAGSV-UHFFFAOYSA-K 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
- C09K5/12—Molten materials, i.e. materials solid at room temperature, e.g. metals or salts
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
实施例 | 热阻(cm<sup>2</sup>K/W) | 接触角 |
实施例1 | 0.07 | 15 |
实施例2 | 0.08 | 16 |
实施例3 | 0.08 | 15 |
实施例4 | 0.21 | 50 |
实施例5 | 0.17 | 34 |
实施例6 | 0.14 | 29 |
实施例7 | 0.12 | 23 |
实施例 | 热阻(cm<sup>2</sup>K/W) | 抗剪力变化率(%) |
实施例1 | 0.07 | 2 |
实施例4 | 0.21 | 0 |
实施例8 | 0.06 | 8 |
实施例9 | 0.06 | 8 |
实施例10 | 0.05 | 9 |
实施例11 | 0.18 | -18 |
实施例12 | 0.2 | 1 |
Claims (10)
Priority Applications (1)
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CN201910651155.4A CN110306091B (zh) | 2019-07-18 | 2019-07-18 | 一种高浸润性低热阻液态金属片及其制备方法 |
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CN201910651155.4A CN110306091B (zh) | 2019-07-18 | 2019-07-18 | 一种高浸润性低热阻液态金属片及其制备方法 |
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CN110306091A true CN110306091A (zh) | 2019-10-08 |
CN110306091B CN110306091B (zh) | 2021-01-08 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111235459A (zh) * | 2020-03-27 | 2020-06-05 | 云南中宣液态金属科技有限公司 | 一种低熔点合金热界面材料的制备工艺方法 |
CN114276785A (zh) * | 2021-11-29 | 2022-04-05 | 江阴镓力材料科技有限公司 | 一种金属基相变式界面导热材料、制备方法及其应用 |
CN116837265A (zh) * | 2023-07-26 | 2023-10-03 | 深圳市鸿富诚新材料股份有限公司 | 一种液态金属导热材料及其涂层与制备方法和应用 |
US11795529B1 (en) | 2022-06-20 | 2023-10-24 | Industrial Technology Research Institute | Low-melting-point alloy composite material and composite material structure |
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CN1955252A (zh) * | 2005-10-24 | 2007-05-02 | 中国科学院理化技术研究所 | 具有高传热性能的纳米金属流体 |
JP2007113050A (ja) * | 2005-10-19 | 2007-05-10 | Senju Metal Ind Co Ltd | 温度ヒューズ用合金 |
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CN101214591A (zh) * | 2008-01-18 | 2008-07-09 | 重庆工学院 | 一种电子微连接使用的低银亚共晶Sn-Cu-Ag无铅钎料 |
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EP3502155A1 (en) * | 2017-12-21 | 2019-06-26 | The Boeing Company | Conductive composites |
CN110016257A (zh) * | 2019-04-01 | 2019-07-16 | 中国科学院理化技术研究所 | 一种水基液态金属墨水及其制备方法与应用 |
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JP2007113050A (ja) * | 2005-10-19 | 2007-05-10 | Senju Metal Ind Co Ltd | 温度ヒューズ用合金 |
CN1955252A (zh) * | 2005-10-24 | 2007-05-02 | 中国科学院理化技术研究所 | 具有高传热性能的纳米金属流体 |
CN101089216A (zh) * | 2006-06-12 | 2007-12-19 | 冯本政 | 导电性液态合金及制备方法 |
CN101161837A (zh) * | 2006-10-11 | 2008-04-16 | 李明茂 | 一种锡液抗氧化添加剂 |
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CN101214591A (zh) * | 2008-01-18 | 2008-07-09 | 重庆工学院 | 一种电子微连接使用的低银亚共晶Sn-Cu-Ag无铅钎料 |
CN106636829A (zh) * | 2015-11-04 | 2017-05-10 | 中国科学院理化技术研究所 | 自封装液态金属笔及制作方法 |
CN105349866A (zh) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | 一种熔点为40~60℃的低熔点合金及其制备方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111235459A (zh) * | 2020-03-27 | 2020-06-05 | 云南中宣液态金属科技有限公司 | 一种低熔点合金热界面材料的制备工艺方法 |
CN111235459B (zh) * | 2020-03-27 | 2021-09-24 | 云南中宣液态金属科技有限公司 | 一种低熔点合金热界面材料的制备工艺方法 |
CN114276785A (zh) * | 2021-11-29 | 2022-04-05 | 江阴镓力材料科技有限公司 | 一种金属基相变式界面导热材料、制备方法及其应用 |
US11795529B1 (en) | 2022-06-20 | 2023-10-24 | Industrial Technology Research Institute | Low-melting-point alloy composite material and composite material structure |
CN116837265A (zh) * | 2023-07-26 | 2023-10-03 | 深圳市鸿富诚新材料股份有限公司 | 一种液态金属导热材料及其涂层与制备方法和应用 |
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