CN110299327B - Multi-chip integrated circuit package - Google Patents
Multi-chip integrated circuit package Download PDFInfo
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- CN110299327B CN110299327B CN201910453648.7A CN201910453648A CN110299327B CN 110299327 B CN110299327 B CN 110299327B CN 201910453648 A CN201910453648 A CN 201910453648A CN 110299327 B CN110299327 B CN 110299327B
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- 238000007789 sealing Methods 0.000 claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- 230000003139 buffering effect Effects 0.000 claims abstract description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 67
- 229910052757 nitrogen Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 abstract description 10
- 230000006378 damage Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 6
- 238000005538 encapsulation Methods 0.000 description 22
- 229910001873 dinitrogen Inorganic materials 0.000 description 21
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QTTMOCOWZLSYSV-QWAPEVOJSA-M equilin sodium sulfate Chemical compound [Na+].[O-]S(=O)(=O)OC1=CC=C2[C@H]3CC[C@](C)(C(CC4)=O)[C@@H]4C3=CCC2=C1 QTTMOCOWZLSYSV-QWAPEVOJSA-M 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of integrated circuits, in particular to a multi-chip integrated circuit package, which comprises a frame body, a sealing cover and a locking block; at least two packaging grooves are arranged in the frame body, an air passage is arranged on the side wall of the frame body, and an annular sealing bag is bonded on the upper surface of the frame body; the chip is arranged in the packaging groove, the bottom of the packaging groove is provided with the buffering air bags, and the periphery of the packaging groove is provided with the moving groove; a locking block is arranged in the moving groove in a sliding manner; the end part of the locking block is connected to the side wall of the moving groove through a spring, and the locking block can lock the chip through screw fixation; the buffer air bag is communicated with the sealing bag through an air passage; the sealing cover is fixedly connected to the frame body through a screw, so that the inside of the frame body is sealed; the invention has simple structure and convenient operation, solves the problem that the integrated circuit is easy to damage in the vibration process of the package in the prior art, accelerates the cooling inside the package and prolongs the service life of the integrated circuit.
Description
Technical Field
The invention belongs to the technical field of integrated circuits, and particularly relates to a multi-chip integrated circuit package.
Background
The electronic industry is continuously shrinking the size of electronic devices and continuously increasing the functions of electronic devices, so that the functions and complexity of integrated circuits are continuously increasing. This trend has also driven the packaging technology of integrated circuit devices toward smaller size, higher pin count, and higher electrical or thermal performance, and also to meet predetermined industry standards. Because high-performance integrated circuit devices generate higher heat, and the existing small-scale packaging technology only provides a little heat dissipation mechanism for designers, a heat dissipation structure needs to be designed on a small-scale packaging structure of the high-performance integrated circuit devices to facilitate heat dissipation and prolong the service life of the integrated circuit.
The integrated circuit is often used in intelligent wearable equipment, and the internal chip can move in the process of violent shaking of the intelligent equipment worn by a human body, so that hidden dangers are buried in the service life of the integrated circuit.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides a multi-chip integrated circuit package which is simple in structure and convenient to operate, solves the problem that the integrated circuit is easy to damage in the vibration process of the package in the prior art, accelerates the cooling inside the package, and prolongs the service life of the integrated circuit.
The technical scheme adopted by the invention for solving the technical problems is as follows: a multi-chip integrated circuit package comprises a frame body, a sealing cover and a locking block; at least two packaging grooves are arranged in the frame body, an air passage is arranged on the side wall of the frame body, and an annular sealing bag is bonded on the upper surface of the frame body; the chip is arranged in the packaging groove, the bottom of the packaging groove is provided with the buffering air bags, and the periphery of the packaging groove is provided with the moving groove; a locking block is arranged in the moving groove in a sliding manner; the end part of the locking block is connected to the side wall of the moving groove through a spring, and the locking block can lock the chip through screw fixation; the buffer air bag is communicated with the sealing bag through an air passage; the sealing cover is fixedly connected to the frame body through screws, so that the inside of the frame body is sealed. When the sealing device works, a chip is placed on the buffering air bag in the packaging groove, the locking blocks on the periphery are moved, when the locking blocks are moved to a fixed position, the locking blocks are fixed by screws, then the sealing cover is clamped into the top end of the frame body, the sealing cover is fixed on the frame body by screws, and in the process of clamping the sealing cover and the top end of the frame body, the annular sealing bag is compressed, so that the gas in the sealing bag is guided into the buffering air bag through an air passage; the existing integrated circuit package is used on the intelligent wearable device, and along with the violent movement of a human body, if the integrated circuit in the intelligent wearable device is not fixed tightly enough, the stop work of the device and the reduction of the service life can be caused; this technical scheme passes through the cooperation between latch segment and the buffering gasbag, has realized the leakproofness of encapsulation on the one hand, avoids the moisture to get into and damages the chip, and on the other hand has realized supporting tightly the chip from top to bottom simultaneously, reduces the encapsulation and has acutely rocked the possibility that in-process chip removal caused the harm, improves integrated circuit's life.
Preferably, the periphery of the side wall of the sealing cover is provided with a cavity, and the middle part of the sealing cover is provided with a collecting cavity; the cavities are communicated with the collecting cavity, a through groove is formed in the top of each cavity, and liquid nitrogen is injected into each cavity; the through groove is sealed by a sealing plug; the bottom of the collecting cavity is provided with a through hole communicated with the inside of the frame body; the lower end of the through hole is provided with an arc-shaped plate; the two ends of the arc-shaped plate are respectively connected to the two sides of the locking block. The during operation, integrated circuit can produce certain heat at the in-process that the during operation increases, through pouring into the cavity with the liquid nitrogen through the through-slot, utilize the sealing plug to seal afterwards, the inside heat of encapsulation can make the liquid nitrogen evaporation become nitrogen gas, because the volume in the cavity is limited, nitrogen gas gets into the collection intracavity of intercommunication, along with the temperature in the encapsulation is higher, the nitrogen gas of collecting the intracavity is more, arc local deformation until promoting the below, thereby spill through the through-hole, nitrogen gas is fast to the inside cooling of encapsulation, so reciprocal, and then when having guaranteed encapsulation inside leakproofness, realized the control to the temperature in the encapsulation, avoid the too high integrated circuit that causes of encapsulation interior temperature to damage, integrated circuit's life has further been improved.
Preferably, the bottom of the locking block is provided with a pressing air bag, and the upper surfaces of two ends of the locking block are provided with sliding grooves; the side walls of the sliding chutes are provided with air cylinders; the air cavity of the air cylinder is communicated with the pressing air bag; the two ends of the arc-shaped plate are respectively contacted with the end parts of the cylinders. When the device works, the pressing air bag can avoid direct contact between the locking block and the surface of the chip, the locking block can compress the pressing air bag when fixed, part of gas in the pressing air bag enters the miniature cylinder, the miniature cylinder extends out to abut against the end part of the arc plate, the bottom of the arc plate abuts against the sealing cover, the arc plate realizes auxiliary clamping of the locking block, meanwhile, when the temperature rises, the gas in the pressing air bag is heated to expand, so that the end of the miniature cylinder extends out again, the distance between the two ends of the arc plate is reduced again, the top part of the arc plate contacting with the sealing cover is locally deformed, nitrogen in the collecting cavity is discharged, after the temperature is reduced, the gas in the pressing air bag contracts, the cylinder returns, the arc plate returns to an initial state, the distance change between the two ends of the arc plate is controlled by the cylinder, and the nitrogen in the collecting cavity is discharged intermittently, the realization is to the interior rapid cooling of encapsulation, can practice thrift nitrogen gas's use simultaneously, has further improved integrated circuit's life.
Preferably, a group of arc-shaped diversion trenches are arranged on the upper surface of the arc-shaped plate at intervals. The during operation is through the guiding gutter that the arc upper surface set up to when making the through-hole open, the nitrogen gas of collecting the intracavity can remove the bottom that reachs the framework along the guiding gutter rapidly, further improves cooling rate, when practicing thrift the nitrogen gas use further improved integrated circuit's life.
Preferably, a group of inclined ribs with different lengths are arranged on the bottom wall of each flow guide groove; the length of the inclined ribs is gradually increased along the two ends of the arc-shaped plate. The during operation, through the brace diagonal that sets up different length in the guiding gutter, can be with the isolated dispersion of nitrogen gas air current of guiding gutter internal circulation to different positions in the encapsulation of leading rapidly realize the refrigerated effect with higher speed, can practice thrift nitrogen gas's use simultaneously, further improved integrated circuit's life.
Preferably, a metal spring is connected between the adjacent oblique ribs; and the surface of the metal spring is plated with an insulating layer on one side. The during operation, the temperature behind the metal spring contact nitrogen gas is lower than the temperature in the encapsulation to can keep certain low temperature state, the metal spring is strikeed to the air current simultaneously, and the metal spring can produce the shake, and then breaks away the nitrogen gas air current, further accelerates cooling rate, and the cladding material on metal spring surface can insulate simultaneously, avoids metal spring's electric conductivity to influence the normal work of chip.
The invention has the beneficial effects that:
1. according to the multi-chip integrated circuit package, the locking block is matched with the buffer air bag, so that on one hand, the sealing performance of the package is realized, moisture is prevented from entering and damaging the chip, on the other hand, the chip is propped up and down simultaneously, the possibility of damage caused by the movement of the chip in the severe shaking process of the package is reduced, and the service life of the integrated circuit is prolonged.
2. According to the multi-chip integrated circuit package, liquid nitrogen is injected into the cavity through the groove, then the sealing plug is used for sealing, the heat in the package can enable the liquid nitrogen to be evaporated into nitrogen, the nitrogen enters the communicated collecting cavity as the volume in the cavity is limited, the more nitrogen is collected in the collecting cavity along with the higher temperature in the package, the nitrogen is pushed to be locally deformed until the arc-shaped plate below the nitrogen is pushed, the nitrogen leaks out through the through hole, the nitrogen rapidly cools the interior of the package, the operation is repeated, the sealing performance of the interior of the package is guaranteed, the temperature in the package is controlled, the damage of an integrated circuit caused by the overhigh temperature in the package is avoided, and the service life of the integrated circuit is further prolonged.
3. According to the multi-chip integrated circuit package, the guide grooves formed in the upper surface of the arc-shaped plate are matched with the inclined ribs with different lengths, so that when the through hole is opened, nitrogen in the collecting cavity can rapidly move to the bottom of the frame body along the guide grooves, airflow is rapidly dispersed and enters the package in the moving process, the cooling speed is further improved, the use of nitrogen is saved, and the service life of the integrated circuit is further prolonged.
Drawings
The invention is further described with reference to the following figures and embodiments.
FIG. 1 is an axial cross-sectional view of the present invention;
FIG. 2 is an enlarged view of a portion of the invention at A in FIG. 1;
FIG. 3 is a top view of the present invention;
FIG. 4 is an enlarged view of a portion of the invention at B in FIG. 3;
FIG. 5 is a front view of the present invention;
in the figure: the device comprises a frame body 1, a sealing cover 2, a cavity 21, a collection cavity 22, a sealing plug 23 locking block 3, a packaging groove 4, a sealing bag 5, a chip 6, a buffer air bag 7, an arc-shaped plate 8, a flow guide groove 81, an inclined rib 82, a metal spring 83, a pressing air bag 9 and an air cylinder 10.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the effects of the invention easy to understand, the invention is further described below with reference to the specific embodiment, and all directions of the invention are based on fig. 5.
As shown in fig. 1 to 5, a multi-chip integrated circuit package according to the present invention includes a frame 1, a cover 2, and a locking block 3; at least two packaging grooves 4 are formed in the frame body 1, an air passage is formed in the side wall of the frame body 1, and an annular sealing bag 5 is bonded to the upper surface of the frame body 1; a chip 6 is arranged in the packaging groove 4, the bottom of the packaging groove 4 is provided with a buffer air bag 7, and the periphery of the packaging groove 4 is provided with a moving groove; a locking block 3 is arranged in the moving groove in a sliding manner; the end part of the locking block 3 is connected to the side wall of the moving groove through a spring, and the locking block 3 can lock the chip 6 through screw fixation; the buffer air bag 7 is communicated with the sealing bag 5 through an air passage; the sealing cover 2 is fixedly connected to the frame body 1 through screws, and the inside of the frame body 1 is sealed. When in work, the chip 6 is firstly placed on the buffer air bag 7 in the packaging groove 4, then the locking blocks 3 on the periphery are moved, when the locking block 3 is fixed by screws when the locking block is moved to a fixed position, then the sealing cover 2 is clamped into the top end of the frame body 1, the sealing cover 2 is fixed on the frame body 1 by screws, the annular sealing bag 5 is compressed when the sealing cover 2 is clamped with the top end of the frame body 1, thereby leading the gas inside into the buffering air bag 7 through the air passage, the sealing bag 5 realizes the sealing between the sealing cover 2 and the frame body 1 on one hand, and realizes the gas supply for the buffering air bag 7 at the bottom on the other hand, so that the buffering air bag 7 is inflated and expanded, the chip 6 is further fixed by matching with the locking block 3, so that the chip 6 is prevented from shaking caused by packaging vibration to influence the service life of the chip 6, and meanwhile, the buffering air bag 7 can provide certain buffering; the existing integrated circuit package is used on the intelligent wearable device, and along with the violent movement of a human body, if the integrated circuit in the intelligent wearable device is not fixed tightly enough, the stop work of the device and the reduction of the service life can be caused; this technical scheme passes through the cooperation between latch segment 3 and the buffering gasbag 7, has realized the leakproofness of encapsulation on the one hand, avoids the moisture to get into and damages chip 6, and on the other hand has realized supporting tightly chip 6 from top to bottom simultaneously, reduces the encapsulation and has violently rocked the possibility that in-process chip 6 removed and cause the harm, improves integrated circuit's life.
As one embodiment, the periphery of the side wall of the sealing cover 2 is provided with a cavity 21, and the middle part of the sealing cover 2 is provided with a collection cavity 22; the cavities 21 are all communicated with the collecting cavity 22, a through groove is formed in the top of each cavity 21, and liquid nitrogen is injected into each cavity 21; the through groove is sealed by a sealing plug 23; the bottom of the collecting cavity 22 is provided with a through hole communicated with the inside of the frame body 1; the lower end of the through hole is provided with an arc-shaped plate 8; two ends of the arc-shaped plate 8 are respectively connected to two sides of the locking block 3. The during operation, integrated circuit can produce certain heat at the in-process that the during operation increases, through pouring into cavity 21 with the liquid nitrogen through leading to the groove in, utilize sealing plug 23 to seal afterwards, the inside heat of encapsulation can make the liquid nitrogen evaporation become nitrogen gas, because the volume in cavity 21 is limited, nitrogen gas gets into in the collection chamber 22 of intercommunication, temperature along with in the encapsulation is higher, the nitrogen gas of collecting in the chamber 22 is more, 8 local deformations of arc board until promoting the below, thereby spill through the through-hole, nitrogen gas cools down to encapsulation inside fast, so reciprocal, and then when having guaranteed encapsulation inside leakproofness, realized the control to temperature in the encapsulation, avoid the encapsulation interior high temperature to cause integrated circuit to damage, integrated circuit's life has further been improved.
As one embodiment, the bottom of the locking block 3 is provided with a pressing air bag 9, and the upper surfaces of two ends of the locking block 3 are provided with sliding grooves; the side walls of the sliding chutes are provided with air cylinders 10; the air cavity of the air cylinder 10 is communicated with the pressing air bag 9; both ends of the arc plate 8 contact the ends of the cylinder 10, respectively. In operation, the compressing air bag 9 can avoid the direct contact between the locking block 3 and the surface of the chip 6, and the locking block 3 can compress the compressing air bag 9 when fixed, so that a part of gas in the compressing air bag 9 enters the inside of the miniature air cylinder 10, the miniature air cylinder 10 extends out to abut against the end part of the arc-shaped plate 8, the bottom of the arc-shaped plate 8 abuts against the sealing cover 2, the arc-shaped plate 8 realizes the auxiliary clamping of the locking block 3, and simultaneously, when the temperature rises, the gas in the compressing air bag 9 is heated to expand, so that the end of the miniature air cylinder 10 is pushed to extend out again, the distance between the two ends of the arc-shaped plate 8 is reduced again, the top part of the arc-shaped plate 8 contacting with the sealing cover 2 is deformed locally, nitrogen in the collecting cavity 22 is discharged, after the temperature is reduced, the gas in the compressing air bag 9 contracts, the air cylinder 10 returns, the arc-shaped plate 8 returns to the initial state, and the, and nitrogen in the collection cavity 22 is discharged intermittently, so that the encapsulation is quickly cooled, the nitrogen can be saved, and the service life of the integrated circuit is further prolonged.
In one embodiment, a set of arc-shaped diversion grooves 81 are arranged on the upper surface of the arc-shaped plate 8 at intervals. The during operation, through the guiding gutter 81 that the upper surface of arc 8 set up to when making the through-hole open, the nitrogen gas in the collection chamber 22 can remove the bottom that reachs framework 1 along guiding gutter 81 rapidly, further improves cooling rate, when practicing thrift the nitrogen gas use further improves integrated circuit's life.
As an embodiment, a group of oblique ribs 82 with different lengths are arranged on the bottom wall of each diversion trench 81; the length of the inclined rib 82 gradually increases along the two ends of the arc-shaped plate 8. The during operation, through the brace 82 that inclines that sets up different length in guiding gutter 81, can be with the isolated dispersion of nitrogen gas air current of circulation in the guiding gutter 81 to different positions in the encapsulation of leading rapidly realize the effect of cooling with higher speed, can practice thrift nitrogen gas's use simultaneously, have further improved integrated circuit's life.
As one embodiment, a metal spring 83 is connected between adjacent tilted ribs 82; the surface of the metal spring 83 is plated with a side insulating layer. The during operation, the temperature after metal spring 83 contacts nitrogen gas is lower than the temperature in the encapsulation to can keep certain low temperature state, metal spring 83 is strikeed to the air current simultaneously, and metal spring 83 can produce the shake, and then breaks away the nitrogen gas air current, further accelerates cooling rate, and the cladding material on metal spring 83 surface can be insulated simultaneously, avoids metal spring 83's electric conductivity to influence chip 6 and normally works.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A multi-chip integrated circuit package, comprising: comprises a frame body (1), a sealing cover (2) and a locking block (3); at least two packaging grooves (4) are arranged in the frame body (1), an air passage is arranged on the side wall of the frame body (1), and an annular sealing bag (5) is bonded on the upper surface of the frame body (1); a chip (6) is installed in the packaging groove (4), the bottom of the packaging groove (4) is provided with a buffer air bag (7), and the periphery of the packaging groove (4) is provided with a moving groove; a locking block (3) is arranged in the moving groove in a sliding manner; the end part of the locking block (3) is connected to the side wall of the moving groove through a spring, and the locking block (3) can lock the chip (6) through screw fixation; the buffer air bag (7) is communicated with the sealing bag (5) through an air passage; the sealing cover (2) is fixedly connected to the frame body (1) through screws, so that the inside of the frame body (1) is sealed; when the sealing device works, a chip (6) is placed on the buffering air bag (7) in the packaging groove (4), then the locking blocks (3) on the periphery are moved, when the locking blocks (3) are moved to a fixed position, the locking blocks (3) are fixed by using screws, then the sealing cover (2) is clamped into the top end of the frame body (1), the sealing cover (2) is fixed on the frame body (1) by using screws, when the sealing cover (2) is clamped with the top end of the frame body (1), the annular sealing bag (5) is compressed, so that the internal gas is guided into the buffering air bag (7) through an air passage, on one hand, the sealing bag (5) realizes the sealing between the sealing cover (2) and the frame body (1), on the other hand, the air supply of the buffering air bag (7) at the bottom is realized, the buffering air bag (7) is inflated and expanded, and then the chip (6) is fixed by matching with the locking blocks (3), and the chip (6) caused by packaging vibration is prevented from, the service life of the chip (6) is influenced, and meanwhile, the buffering air bag (7) can provide certain buffering.
2. The multi-chip integrated circuit package of claim 1, wherein: cavities (21) are formed in the periphery of the side wall of the sealing cover (2), and a collecting cavity (22) is formed in the middle of the sealing cover (2); the cavities (21) are all communicated with the collecting cavity (22), a through groove is formed in the top of each cavity (21), and liquid nitrogen is injected into each cavity (21); the through groove is sealed by a sealing plug (23); the bottom of the collecting cavity (22) is provided with a through hole communicated with the inside of the frame body (1); the lower end of the through hole is provided with an arc-shaped plate (8); the two ends of the arc-shaped plate (8) are respectively connected to the two sides of the locking block (3).
3. The multi-chip integrated circuit package of claim 2, wherein: the bottom of the locking block (3) is provided with a pressing air bag (9), and the upper surfaces of two ends of the locking block (3) are provided with sliding grooves; the side walls of the sliding chutes are provided with air cylinders (10); the air cavity of the air cylinder (10) is communicated with the pressing air bag (9); two ends of the arc-shaped plate (8) are respectively contacted with the end part of the cylinder (10).
4. A multi-chip integrated circuit package according to claim 3, wherein: a group of arc-shaped diversion trenches (81) are arranged on the upper surface of the arc-shaped plate (8) at intervals.
5. The multi-chip integrated circuit package of claim 4, wherein: the bottom walls of the diversion trenches (81) are provided with a group of inclined ribs (82) with different lengths; the length of the inclined ribs (82) is gradually increased along the two ends of the arc-shaped plate (8).
6. The multi-chip integrated circuit package of claim 5, wherein: a metal spring (83) is connected between the adjacent inclined ribs (82); and the surface of the metal spring (83) is plated with an insulating layer on one side.
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| CN201910453648.7A CN110299327B (en) | 2019-05-28 | 2019-05-28 | Multi-chip integrated circuit package |
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| CN201910453648.7A CN110299327B (en) | 2019-05-28 | 2019-05-28 | Multi-chip integrated circuit package |
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| CN110299327B true CN110299327B (en) | 2021-02-26 |
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| CN117790426B (en) * | 2024-02-26 | 2024-05-14 | 中航捷锐(西安)光电技术有限公司 | Chip packaging structure and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203553129U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Integrated circuit package with anti-shock function |
| CN208175180U (en) * | 2018-02-28 | 2018-11-30 | 深圳市银联宝电子科技有限公司 | Packaging structure of power supply chip |
| CN208154127U (en) * | 2018-05-23 | 2018-11-27 | 深圳市芯华科技有限公司 | A kind of LED lamp bead |
| CN208142166U (en) * | 2018-06-01 | 2018-11-23 | 深圳市科信达电子有限公司 | A kind of environmental protection chip |
-
2019
- 2019-05-28 CN CN201910453648.7A patent/CN110299327B/en not_active Expired - Fee Related
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| CN110299327A (en) | 2019-10-01 |
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