CN110287674A

CN110287674A - Encrypting and decrypting method, electronic equipment and non-volatile computer readable storage medium storing program for executing

Info

Publication number: CN110287674A
Application number: CN201910573587.8A
Authority: CN
Inventors: 袁石林; 杨自美
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2019-09-27

Abstract

This application discloses a kind of encrypting and decrypting method, electronic equipment and non-volatile computer readable storage medium storing program for executing.The encrypting and decrypting method includes: to obtain the first current finger print image of the user during user presses application program to be encrypted with the first duration, and first duration is greater than first threshold；After obtaining the first current finger print image, prompt to carry out cryptographic operation；And operated according to the first of user the input, using the first current finger print image as password to be encrypted to the application program to be encrypted.When encrypting and decrypting method, electronic equipment and the non-volatile computer readable storage medium storing program for executing of the application press application program to be encrypted with the first duration by user, obtain the fingerprint image of user, then prompt user carries out cryptographic operation, the encryption of application program can be rapidly completed according to the first of user the input operation (such as touching encryption icon), cryptographic operation is simple, better user experience.

Description

Encrypting and decrypting method, electronic equipment and non-volatile computer readable storage medium storing program for executing

Technical field

This application involves technical field of mobile terminals, in particular to a kind of encrypting and decrypting method, electronic equipment and non-volatile Property computer readable storage medium.

Background technique

In general, applying in encryption is the encipheror for requiring to carry using system or third-party encryption application program (Application, APP) etc. is realized.By taking third party encrypts APP as an example, in encryption, need to be introduced into third party APP setting Password, then selection needs the APP encrypted to be encrypted, cumbersome, poor user experience.

Summary of the invention

The application embodiment provides a kind of encrypting and decrypting method, electronic equipment and non-volatile computer readable storage Medium.

It is to be encrypted with the pressing of the first duration that the encrypting and decrypting method of the application program of the application embodiment is included in user During application program, the first current finger print image of the user is obtained, first duration is greater than first threshold；It is obtaining After taking the first current finger print image, prompt to carry out cryptographic operation；And operated according to the first of user the input, by described first Current finger print image is as password to encrypt to the application program to be encrypted.

The electronic equipment of the application embodiment includes fingerprint recognition mould group, display module and processor.In user with For the moment during long pressing application program to be encrypted, the fingerprint recognition mould group obtains the first current finger print figure of the user Picture, first duration are greater than first threshold；The fingerprint recognition mould group is located in the display area of the display module, is obtaining After taking the first current finger print image, the display module carries out cryptographic operation for prompting；The processor is used for basis The first input operation of user, using the fingerprint image as password to be encrypted to the application program to be encrypted.

The non-volatile computer readable storage medium storing program for executing comprising computer-readable instruction of the application embodiment, the meter When calculation machine readable instruction is executed by processor, so that the processor executes above-mentioned encrypting and decrypting method.

Encrypting and decrypting method, electronic equipment and the non-volatile computer readable storage medium storing program for executing of the application embodiment pass through When user presses application program to be encrypted with the first duration, obtain the fingerprint image of user, then prompt user into Adding for application program can be rapidly completed according to the first of user the input operation (such as touching encryption icon) in row cryptographic operation Close, cryptographic operation is simple, better user experience.

The additional aspect and advantage of the application embodiment will be set forth in part in the description, partially will be from following Become obvious in description, or is recognized by the practice of the application.

Detailed description of the invention

The above-mentioned and/or additional aspect and advantage of the application can be from combining in description of the following accompanying drawings to embodiment It will be apparent and be readily appreciated that, in which:

Fig. 1 is the flow diagram of the encrypting and decrypting method of the application certain embodiments.

Fig. 2 is the structural schematic diagram of the electronic equipment of the application certain embodiments.

Fig. 3 is the fingerprint identification region of the application certain embodiments and the schematic diagram of display area.

Fig. 4 is the schematic diagram of a scenario of the encrypting and decrypting method of the application certain embodiments.

Fig. 5 and Fig. 6 is the flow diagram of the encrypting and decrypting method of the application certain embodiments.

Fig. 7 is the schematic diagram of a scenario of the encrypting and decrypting method of the application certain embodiments.

Fig. 8 to Figure 10 is the flow diagram of the encrypting and decrypting method of the application certain embodiments.

Figure 11 is the schematic cross-section of the display module of the application certain embodiments.

Figure 12 is the schematic illustration for fingerprint recognition of the display module of the application certain embodiments.

Figure 13 is the schematic perspective view of the display module of the application certain embodiments.

Figure 14 is the photosensitive layer of the application certain embodiments and the structural schematic diagram of imager chip.

Figure 15 is the photosensitive layer of the application certain embodiments and the structural schematic diagram of display driving layer.

Figure 16 is the planar structure schematic diagram of the second substrate of the application certain embodiments.

Figure 17 and Figure 18 is the side structure schematic view of the display module of the application embodiment.

Figure 19 is the decomposition diagram of the display module of the application certain embodiments.

Figure 20 and Figure 21 is the schematic cross-section of the display module of the application certain embodiments.

Figure 22 is the structural schematic diagram of the capacitive fingerprint sensing device diaphragm of the application certain embodiments.

Figure 23 to Figure 25 is the schematic cross-section of the display module of the application certain embodiments.

Figure 26 is the schematic cross-section of the LCM display screen of the application certain embodiments.

Figure 27 is the schematic cross-section of the OLED display screen of the application certain embodiments.

Figure 28 and Figure 29 is the schematic cross-section of the display module of the application certain embodiments.

Figure 30 is the structural schematic diagram of the capacitive fingerprint sensing device diaphragm of the application certain embodiments.

Figure 31 is the non-volatile readable storage medium of the application certain embodiments and the interaction schematic diagram of processor.

Specific embodiment

Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein identical Or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining presently filed embodiment, and should not be understood as to this Shen The limitation of embodiment please.

It please refers to Fig.1 to Fig.3, the application provides a kind of encrypting and decrypting method of application program.Encrypting and decrypting method includes:

011: during user presses application program to be encrypted with the first duration, obtaining the first current finger print of user Image, the first duration are greater than first threshold；

012: after obtaining the first current finger print image, prompting to carry out cryptographic operation；And

013: being operated according to the first of user the input, using the first current finger print image as password to apply journey to be encrypted Sequence is encrypted.

The application also provides a kind of electronic equipment 1000.Electronic equipment 1000 includes fingerprint recognition mould group 200, display module 100 and processor 300, processor 300 can be one or more.The mistake of application program to be encrypted is pressed with the first duration in user Cheng Zhong, fingerprint recognition mould group 200 obtain the first current finger print image of user, and the first duration is greater than first threshold.Fingerprint recognition Mould group 200 is located in the display area 911 of display module 100, may is that 200 part of fingerprint recognition mould group covers display area 911；Be also possible to: fingerprint recognition mould group 200 covers entire display area 911, and this is not restricted, only needs fingerprint recognition mould group Region where 200 covering APP to be encrypted.After obtaining the first current finger print image, display module 100 for prompt into Row cryptographic operation；Processor 300 is used to be operated according to the first of user the input, using fingerprint image as password to answer to be encrypted It is encrypted with program.In other words, step 011 can be realized that step 012 can be by display mould by fingerprint recognition mould group 200 Group 100 realizes that step 013 can be realized by processor 300.It should be understood that fingerprint recognition mould group 200 shown in Fig. 2 is only It only indicates that it is arranged in electronic equipment 1000, can not explain its area size and setting position, 200th area fingerprint recognition Mo Zu Domain size is described below with setting position.

Wherein, electronic equipment 1000 can be mobile phone, tablet computer, laptop, intelligent wearable device (such as intelligent hand Table, Intelligent bracelet, intelligent helmet, intelligent glasses etc.), virtual reality device, display, automatic teller machine, game machine, intelligentized Furniture Etc..The application is illustrated so that electronic equipment 1000 is mobile phone as an example, it will be understood that the concrete form of electronic equipment 1000 is simultaneously It is not limited to mobile phone.

Please continue to refer to Fig. 2 and Fig. 3, fingerprint recognition mould group 200 can be optical finger print mould group, capacitive fingerprint mould group, surpass Sound wave fingerprint mould group etc..The corresponding fingerprint identification region 912 in display module 100 of fingerprint recognition mould group 200 is located at display mould In the display area 911 of group 100, specifically, the ratio of the area and the area of display area 911 of fingerprint identification region 912 is big In predetermined ratio, for example predetermined ratio can be 15%, the ratio of the area of the area and display area 911 of fingerprint identification region 912 Value can be 15%, 20%, 30%, 43%, 56%, 66.7%, 72%, 80%, 90%, 95%, 99%, 100% etc., when than The value range of value be [15%, 100%) when, region fingerprint recognition ((1) shown in) in Fig. 3 may be implemented；When ratio is 100%, full frame fingerprint recognition may be implemented (shown in (2) in Fig. 3).At this point, fingerprint recognition mould group 200 can be simultaneously to multiple The finger for touching fingerprint identification region 912 is identified, rather than is only capable of identifying a finger.

In the existing mobile phone with fingerprint identification function, when encrypting to APP, user needs to be introduced into encryption Password (numerical ciphers, pattern password, facial password or finger-print cipher etc.) is arranged in APP, then selects APP to be encrypted just can be real It now encrypts, operation is very complicated, and user experience is poor.

The application utilizes the advantage of region fingerprint recognition, and it is to be added in fingerprint identification region 912 that user only needs long-pressing to be located at Close APP, then carrying out cryptographic operation according to prompt, (pop-up of display module 100 encryption icon, user click encryption figure after such as long-pressing Mark) encryption can be rapidly completed.

Specifically, with fingerprint recognition mould group 200 be full frame fingerprint recognition mould group (that is, the area of fingerprint identification region 912 with The ratio of the area of display area 911 be 100%) for be illustrated.Want (to call to be encrypted some APP in the following text in user When APP) being encrypted, it is only necessary to find APP to be encrypted in main interface, then press APP to be encrypted with the first duration, wherein A length of user presses APP to be encrypted to the duration for decontroling APP to be encrypted when first, and the first duration is greater than or equal to the first threshold Value.It is appreciated that user when encrypting to APP, is generally not desired to starting APP, commonly touched since starting APP generally passes through Operation is realized, and the pressing duration of common touch operation is shorter (such as 0.2S, 0.3S, 0.4S), in order to grasp with common touch Distinguish, prevent APP error starting, influence the completion of cryptographic operation, settable larger of first threshold, as 2S, 3S, 4S, 6S, 8S, 10S etc., processor 300 can be to carry out common touch operation or encryption behaviour according to pressing duration accurate judgement user Make.During user presses APP to be encrypted with the first duration, the first of the acquisition user of fingerprint recognition mould group 200 currently refers to Print image.Then, display module 100 prompts user to carry out cryptographic operation, as shown in figure 4,100 ejection operation frame of display module S1, operation box S1 include encryption icon M1.According to the first of user the input operation, (such as user clicks encryption icon to processor 300 M1), the first current finger print image fingerprint recognition mould group 200 obtained encrypts APP to be encrypted as password.And It, can cancellation icon M2 in clicking operation frame S1 when user is not desired to encrypt APP to be encrypted.

The encrypting and decrypting method and electronic equipment 1000 of the application embodiment are by user with the first duration to be encrypted Application program when being pressed, obtain the fingerprint image of user, then user prompted to carry out cryptographic operation, according to the of user The encryption of application program can be rapidly completed in one input operation (such as touching encryption icon), and cryptographic operation is simple, user experience Preferably.

Please refer to Fig. 2 and Fig. 5, in some embodiments, encrypting and decrypting method further include:

014: during user has encrypted application program with the pressing of the second duration, obtaining the second current finger print of user Image, the second duration are greater than second threshold；

015: in the second current finger print image and password match, decryption has encrypted application program.

In some embodiments, during user has encrypted application program with the pressing of the second duration, fingerprint recognition Mould group 200 obtains the second current finger print image of user, and the second duration is greater than second threshold；Processor 300 is also used to second When current finger print image and password match, decryption has encrypted application program.In other words, step 014 can be by fingerprint recognition mould Group 200 realizes that step 015 can be realized by processor 300.

Specifically, after user completes to the encryption of APP, if user wants to be decrypted to having encrypted APP, user can be with APP has been encrypted with the pressing of the second duration, wherein a length of user's pressing has encrypted APP and encrypted continuing for APP to relieving when second Time, the second duration are greater than or equal to second threshold, it will be understood that starting APP is generally intended to when user decrypts APP, it can Decryption oprerations are triggered only to carry out common touch operation, for example, user, which only touches, has encrypted APP (such as pressing 0.3S), Fingerprint recognition mould group 200 obtains the second current finger print image to complete decryption oprerations.Therefore, second threshold can be set compared with It is small, if second threshold can be set as 0.2s, 0.3s, 0.4s etc. as the pressing duration of common touch operation, thus fastly Speed complete APP decryption and starting, meanwhile, when being pressed into unencryption APP in order to prevent, fingerprint recognition mould group 200 also at once into Row obtains the operation of the second current finger print image, causes unnecessary resource (electricity, operational performance etc.) to waste, processor 300 Can be judged as the APP when user presses any APP is to have encrypted APP or unencryption APP, and the APP only pressed is to have added When close APP, fingerprint recognition mould group 200 just obtains the second current finger print image in the moment of pressing at once.Certainly, second threshold Also what be can be set is larger, such as 1S, 2S, 3S.In addition, in order to more accurately distinguish between decryption oprerations and cryptographic operation and guarantee Decryption oprerations are rapidly completed, and do not influence APP starting, and the first duration of ratio that the second duration should be arranged is small, and such as the second duration is arranged For 0.3S, the first duration is set as 2S etc..

During user has encrypted APP with the pressing of the second duration, fingerprint recognition mould group 200 obtains the second current finger print figure Picture.For example, control fingerprint recognition mould group 200 obtains at once when processor 300 judges the APP of user's pressing to have encrypted APP Second current finger print image, after first judging whether press duration reaches the second duration compared to processor 300, fingerprint recognition mould group For 200 obtain the second current finger print image again, the speed of decryption oprerations can be improved.It is current that second is got in processor 300 After fingerprint image, processor 300 judges whether the second current finger print image matches with password (that is, first current finger print image), For example, processor 300 judges the similarity of the second current finger print image and password, reach predetermined similarity (such as in similarity 85%) the second current finger print image and password match are determined after.In the second current finger print image and password match, decrypts and open It is dynamic to have encrypted APP.

Please refer to Fig. 2, Fig. 6 and Fig. 7, in some embodiments, encrypting and decrypting method further include:

016: during user has encrypted application program with the pressing of third duration, obtaining the second current finger print of user Image, third duration are greater than third threshold value；

017: in the second current finger print image and password match, prompting the operation for carrying out deleting password；And

018: being operated according to the second of user the input, password is deleted and is changed to unencryption so that application program will have been encrypted and answers Use program.

In some embodiments, during user has encrypted application program with the pressing of third duration, fingerprint recognition Mould group 200 obtains the second current finger print image of user, and third duration is greater than third threshold value；Display module 100 is also used to When two current finger print images and password match, the operation for carrying out deleting password is prompted；Processor 300 is also used to according to user Two input operations, password is deleted and is changed to unencryption application program will encrypt application program.In other words, step 016 It can be realized by fingerprint recognition mould group 200, step 017 can be realized by display module 100, and step 018 can be by processor 300 It realizes.

Specifically, when user wants to APP cancellation encryption has been encrypted, user can be pressed with third duration and encrypt APP, Wherein, a length of user's pressing has encrypted the duration that APP has encrypted APP to relieving when third, and third duration is greater than or equal to Third threshold value.It is appreciated that user when carrying out cancellation cryptographic operation, is not intended to decryption to start APP, due to starting APP mono- As realized by common touch operation, and the pressing duration of common touch operation is shorter (such as 0.2S, 0.3S, 0.4S), In order to be distinguished with common touch operation, prevents APP from misreading close and starting, influence the completion for cancelling cryptographic operation, third Settable larger of threshold value, such as 2S, 3S, 4S, 6S, 8S, 10S, so that accurate judgement user is to carry out common touch operation Or cryptographic operation.

Due to encrypt and cancel encryption be respectively to unencryption APP and encrypted APP progress operation, therefore the first duration with Third duration may be the same or different.And due to cancelling the operation for encrypting and decrypting be to APP has been encrypted, the Three durations need to be different from the second duration, at the same in order to guarantee decryption when start APP speed, settable third duration be greater than second Duration (a length of 3S when such as third, second when a length of 0.3S etc.).

When processor 300 judges the APP of pressing to have encrypted APP, control fingerprint recognition mould group 200 obtains second at once and works as Preceding fingerprint image, after first judging whether press duration reaches third duration compared to processor 300, fingerprint recognition mould group 200 is again For obtaining the second current finger print image, the speed for cancelling cryptographic operation can be improved.Second is got in processor 300 currently to refer to After print image, judge whether the second current finger print image matches with password (that is, first current finger print image), judges whether to match Mode can be similar with the judgment mode that aforementioned decryption oprerations are mentioned, details are not described herein.The second current finger print image with it is close When code matching, display module 100 prompts user to delete password to cancel encryption.For example, as shown in fig. 7, display module 100 pops up Operation box S2, operation box S2 include deleting password icon M3.Processor 300 operates (such as user's point according to the second of user the input Hit and delete password icon M3) password for having encrypted APP can be deleted, so that having encrypted APP is changed to unencryption APP.With When family is not desired to carry out cancellation cryptographic operation, cancellation icon M4 can be clicked and exit cancellation cryptographic operation.

Please refer to Fig. 2 and Fig. 8, in some embodiments, encrypting and decrypting method further include:

019: obtaining the pressing position of user；

020: judge that application program corresponding with pressing position has still encrypted application program as unencryption application program, When application program corresponding with pressing position is unencryption application program, the step for obtaining the first current finger print image of user is executed Suddenly.

In some embodiments, electronic equipment 1000 further includes touch module 400, and touch module 400 is used for obtaining The pressing position at family；When application program corresponding with pressing position is unencryption application program, fingerprint recognition mould group 200 is obtained First current finger print image.In other words, step 019 can be realized that step 020 can be by fingerprint recognition by touch module 400 Mould group 200 is realized.

Specifically, touch module 400 is arranged in display module 100, and touch module 400 covers entire display area 911, Touch module 400 can get the pressing position of user, and after user is pressed into touch module 400, touch module 400 continues Corresponding touching signals are sent to processor 300, processor 300 is the pressing position that can determine user according to touching signals, and The pressing duration of user is determined according to the duration for initially receiving touching signals to stopping reception touching signals.

When compared to the corresponding APP of pressing position of user being judged in processor 300 for the application program of unencryption, control For fingerprint recognition mould group 200 obtains the first current finger print image at once, judge that the pressing position of user is corresponding in processor 300 APP be unencryption application program, and the duration of user's pressing, when reaching the first duration, fingerprint recognition mould group 200 just obtains First current finger print image just obtains the first current finger print image when accurately determining user and wanting encryption APP, prevents big In the scene of part, user is only intended to starting APP, and fingerprint recognition mould group 200 can also obtain the first current finger print image, cause Unnecessary resource (electricity, operational performance etc.) waste.

Fig. 2 and Fig. 9 are please referred to, in some embodiments, encrypting and decrypting method includes:

019: obtaining the pressing position of user；And

021: judge that application program corresponding with pressing position has still encrypted application program as unencryption application program, Application program corresponding with pressing position is to have encrypted application program, executes the step for obtaining the second current finger print image of user Suddenly.

In some embodiments, touch module 400 is used to obtain the pressing position of user；Corresponding with pressing position Application program is when having encrypted application program, and fingerprint recognition mould group 200 obtains the second current finger print image.In other words, step 019 can be realized by touch module 400, and step 021 can be realized by fingerprint recognition mould group 200.

Specifically, when user presses touch module 400, processor 300 is according to the touching signals that touch module 400 generates It can determine the pressing position of user.The corresponding APP of pressing position of user is judged in processor 300 for the application program that has encrypted When, controllable fingerprint recognition mould group 200 obtains the second current finger print image at once, when first judging pressing compared to processor 300 After whether length reaches the second duration, for fingerprint recognition mould group 200 obtains the second current finger print image again, decryption oprerations can be improved With the speed for cancelling cryptographic operation.

Fig. 2 and Figure 10 are please referred to, in some embodiments, encrypting and decrypting method includes:

022: whether the first current finger print image of verifying belongs to the fingerprint image of the authorized user of electronic equipment 1000；And

023: if the first current finger print image belongs to the fingerprint image of the authorized user of electronic equipment, executing prompt and carry out The step of cryptographic operation.

In some embodiments, whether the first current finger print image of verifying belongs to the authorized user's of electronic equipment 1000 Fingerprint image；And in the fingerprint image for the authorized user that the first current finger print image belongs to electronic equipment 1000, display module 100 prompts carry out cryptographic operation.In other words, step 022 and step 023 can be realized by processor 300.

Specifically, it may be used by others after the mobile phone unlock of user sometimes, if other people want to add APP at this time It is close, then need to verify the fingerprint image whether the first current finger print image belongs to the authorized user of electronic equipment 1000, that is, verifying Whether the people currently encrypted is that current electronic device 1000 authorizes workable user, to prevent other users malice from adding APP is locked, causes APP that can not be opened.Therefore, when user presses unencryption APP with the first duration, fingerprint recognition mould group 200 The first current finger print image is got, then processor 300 verifies whether the first current finger print image belongs to electronic equipment 1000 Authorized user fingerprint image, belong to the fingerprint image of the authorized user of electronic equipment 1000 in the first current finger print image When, display module 100 just prompts to carry out cryptographic operation (such as popping up cryptographic operation frame S1 shown in Fig. 4), to guarantee that APP will not It is encrypted by other people.And in the fingerprint image for the authorized user that the first current finger print image is not belonging to electronic equipment 1000, display Mould group 100 will not display operation frame S1, but directly initiate corresponding APP.

In some embodiments, the first current finger print image and the second current finger print image are multiple.

Specifically, for user when encrypting to APP, settable multiple first current finger print images are multiple as password First current finger print image can be the fingerprint image of multiple fingers of a user, be also possible to multiple fingers of multiple users Fingerprint image.When decrypting and cancelling decryption, the second current finger print image and password match can be completed decryption and cancel solution It is close.Second current finger print image and password match may is that any second current finger print image and password match are considered as second Current finger print image and password match；Second current finger print image and password match may also is that the second current finger print image Quantity is identical as the first current finger print amount of images in password, multiple second current finger print images and multiple first current finger prints Image corresponds.In one example, user is in encryption, with the first current finger print figure of two fingers of thumb and index finger As being used as password, in decryption, due to needing quick start APP, so need to only obtain thumb or index finger second currently refers to Print image is simultaneously matched；And when cancelling encryption, need to obtain two fingers of thumb and index finger simultaneously second is worked as Preceding fingerprint image, and cancellation cryptographic operation can be just executed with two the first current finger print image Corresponding matchings.

Figure 11 and Figure 12 is please referred to, in some embodiments, display module 100 includes opposite display surface 91 and bottom surface 11, fingerprint recognition mould group 200 is arranged between display surface 91 and bottom surface 11, and fingerprint recognition mould group 200 includes photosensitive layer 201 and standard Straight unit 2021, collimation unit 2021 offer light hole 2022.Photosensitive layer 201 includes multiple photosensitive units 2011.Light hole 2022 can allow for optical signal to pass through to photosensitive unit 2011.Photosensitive layer 201 be used for receives include target optical signal at As optical signal, after target optical signal successively passes through display surface 91 and light hole 2022, the photosensitive unit of photosensitive layer 201 is reached 2011；Electronic equipment 1000 further includes noise obtaining module 500 (Figure 14 shows), and noise obtaining module 500 is set for obtaining electronics Noise signal in standby 1000；Processor 300 obtains the first current finger print image according to imaging electric signal and noise signal.

In the present embodiment, wherein fingerprint recognition mould group 200 is optical finger print mould group, and optical finger print mould group includes photosensitive Layer 201 and collimation layer 202, collimation layer 202 include multiple collimation units 2021.Display module 100 includes that backlight layer 10, first is inclined Photosphere 20, first substrate 30, liquid crystal layer 50, the second substrate 60, the second polarizing layer 80 and cover board 90.Fingerprint recognition mould group 200 is set It sets between the display surface 91 and bottom surface 11 of display module 100, specifically, photosensitive layer 201 is arranged in first substrate 30 and liquid crystal Between layer 50, collimation layer 202 is arranged between the second substrate 60 and the second polarizing layer 80.Touch module 400 is integrated in display mould In group 100, specifically, touch module 400 be may be provided between cover board 70 and the second polarizing layer 80.Line in touch module 400 Road can receive light and display using the production of the transparent metal materials such as nanometer silver paste to avoid obtaining to optical finger print mould group Mould group 100 emits light and has an impact.

Incorporated by reference to Figure 13 and Figure 16, it is formed with multiple display units 61 in the second substrate 60 and is located at multiple display units 61 Between shading piece 62.Unthreaded hole 621 was offered on shading piece 62.Collimation unit 2021 offers light hole 2022, light hole 2022 and cross unthreaded hole 621 be aligned photosensitive unit 2011.Photosensitive unit 2011, which can receive, to be entered from the external world and successively passes through light hole 2022 and cross unthreaded hole 621 target optical signal, which is the reflected signal of finger by user, according to the mesh Mark optical signal can obtain the fingerprint image for touching the finger in display module 100, and fingerprint image can be used for fingerprint recognition.

Multiple photosensitive units 2011 in photosensitive layer 201 number can generate after receiving the letter of the imaging including target optical signal Electric signal is imaged.But optical signal is imaged other than including target optical signal, further includes interference optical signal, infrared signal etc., sense Light unit 2011 can also generate noise signal when working, and therefore, electric signal be imaged in addition to including the mesh generated by target optical signal Mark electric signal outside, further include generated by interference optical signal interference electric signal, by infrared signal generate infrared electric signal, by At least one of the noise electric signal of the generation of photosensitive unit 2011, the circuit noise signal generated by photosensitive unit 2011 noise Signal.For example, imaging electric signal includes target electric signal and interference two kinds of signals of electric signal；Alternatively, imaging electric signal includes mesh Mark electric signal, three kinds of infrared electric signal, noise electric signal signals；Alternatively, imaging electric signal includes target electric signal, infrared telecommunications Number, four kinds of noise electric signal, circuit noise signal signals；Alternatively, imaging electric signal include target electric signal, interference electric signal, Five kinds of infrared electric signal, noise electric signal, circuit noise signal signals etc..

The accuracy of the fingerprint image of acquisition can be had an impact in imaging electric signal by the electric signal that noise signal generates, It further will affect the accuracy rate of fingerprint recognition.Therefore, the encrypting and decrypting method of the application embodiment passes through setting noise Obtaining module 500 obtains noise signal, after photosensitive layer 201 gets imaging electric signal, will be imaged in electric signal and remove mesh The electric signal removal formed by noise signal other than mark electric signal, to avoid the electric signal formed by noise signal to target Electric signal interferes, so that the fingerprint image that fingerprint recognition mould group 200 obtains is more accurate, is based on more accurate fingerprint image Fingerprint recognition is carried out, the accuracy rate and safety of fingerprint recognition can be also promoted.

Referring to Fig. 2, the electronic equipment 1000 of the application embodiment further includes casing 600.Casing 600 can be used for installing Display module 100, in other words, casing 600 can be used as the installation carrier of display module 100, and casing 600 can also be used to install electronics The functional modules such as power supply unit, imaging device, the communication device of equipment 1000 so that casing 600 for functional module provide shatter-resistant, The protection of waterproof etc..Display module 100 can be used for showing the images such as picture, video, text.Display module 100 is mounted on casing On 600.

Fig. 2 and Figure 11 are please referred to Figure 13, in one example, fingerprint recognition mould group 200 is optical finger print mould group, light Learning fingerprint mould group includes photosensitive layer 201 and collimation layer 202.Display module 100 includes the backlight layer 10 stacked gradually, the first polarisation Layer 20, first substrate 30, liquid crystal layer 50, the second substrate 60, the second polarizing layer 80 and cover board 90.Fingerprint can identify that mould group 200 is set It sets between the display surface 91 and bottom surface 11 of display module 100, specifically, photosensitive layer 201 is arranged in first substrate 30 and liquid crystal Between layer 50, collimation layer 202 is arranged between the second substrate 60 and the second polarizing layer 80.

As shown in FIG. 11 and 12, backlight layer 10 can be used for emitting optical signal La or backlight layer 10 and can be used for leading The optical signal La that light lead source (not shown) issues.Optical signal La sequentially passes through the first polarizing layer 20, first substrate 30, photosensitive layer 201, liquid crystal layer 50, the second substrate 60, collimation layer 202, the second polarizing layer 80, touch module 400 and cover board are after 90s into outer Boundary.Backlight layer 10 includes bottom surface 11, and specifically, bottom surface 11 can be surface opposite with the first polarizing layer 20 in backlight layer 10.

First polarizing layer 20 is arranged in backlight layer 10, and the first polarizing layer 20 specifically can be polarizing film or polarizing coating.The One substrate 30 is arranged on the first polarizing layer 20, and first substrate 30 can be glass substrate.

Photosensitive layer 201 can be the film layer being produced on first substrate 30, such as pass through TFT (Thin Film Transistor) technique is produced on first substrate 30.Figure 13 to Figure 15 is please referred to, photosensitive layer 201 includes multiple photosensitive units 2011 and multiple circuit units 2012.

Photosensitive unit 2011 can use photoelectric effect and convert electric signal for the optical signal received, photosensitive by parsing The intensity for the electric signal that unit 2011 generates can reflect the intensity for the optical signal that photosensitive unit 2011 receives.In an example In, photosensitive unit 2011 can receive visible light signal only to be converted into electric signal, in another example, photosensitive unit 2011 Black light can be received only to be converted into electric signal, in another example, photosensitive unit 2011 can receive visible light and Black light is to be converted into electric signal.The type of multiple photosensitive units 2011 can be identical, the type of multiple photosensitive units 2011 It can also be not exactly the same.Multiple photosensitive units 2011 can be arranged in an arbitrary manner, multiple photosensitive units 2011 Arrangement mode specifically can the demands such as shape according to display module 100 set, it is in the embodiment of the present application, multiple photosensitive Unit 2011 is arranged in array, such as multiple photosensitive units 2011 line up the matrix of multiple lines and multiple rows.Each photosensitive unit 2011 is It can work independently without being influenced by other photosensitive units 2011, the optical signal that the photosensitive unit 2011 of different location receives Intensity may be different, therefore the intensity of electric signal that the photosensitive unit 2011 of different location generates may also be different.In addition, photosensitive Reflectorized material has can be set in the side towards bottom surface 11 of unit 2011, and the light of photosensitive unit 2011 is irradiated to from backlight layer 10 Signal can be reflected by reflectorized material, and the part optical signals is avoided to influence the accuracy that photosensitive layer 201 is imaged.

Circuit unit 2012 can be connect with photosensitive unit 2011.Circuit unit 2012 can generate photosensitive unit 2011 Electric signal transmission to electronic equipment 1000 processor 300.Circuit unit 2012 can specifically include the elements such as transistor.Electricity The quantity of road unit 2012 can be to be multiple, and each photosensitive unit 2011 can connect in a corresponding circuit unit 2012 On, multiple circuit units 2012 are connect by connecting line with processor 300.The arrangement mode of multiple circuit units 2012 can be with The arrangement mode of photosensitive unit 2011 is similar, such as multiple photosensitive units 2011 are arranged in the matrix of multiple lines and multiple rows, multiple circuits Unit 2012 can also be arranged in the matrix of multiple lines and multiple rows.

Figure 11 to Figure 13 is please referred to, liquid crystal layer 50 is arranged on photosensitive layer 201, and the liquid crystal molecule in liquid crystal layer 50 is in electric field Under the action of can be changed deflection direction, and then change can pass through the amount of the optical signal of liquid crystal layer 50.Correspondingly, incorporated by reference to Figure 15, Display driving layer 1a can also be made on first substrate 30, display driving layer 1a makees in the driving of driving chip (not shown) Electric field can be applied to liquid crystal layer 50 under, to control the deflection direction of the liquid crystal molecule of different location.Specifically, display driving Layer 1a includes multiple display driver element 1a1, and each display driver element 1a1 can independently control the liquid crystal of corresponding position Deflect direction.

Figure 11, Figure 13 and Figure 16 are please referred to, the second substrate 60 is arranged on liquid crystal layer 50.The second substrate 60 may include glass The multiple display units 61 and shading piece 62 of glass substrate and setting on the glass substrate.Display unit 61 can be colorized optical filtering Piece, for example, R indicates infrared fileter, G indicates that green color filter, B indicate blue color filter, by controlling across different colours Optical filter optical signal amount, to control the color that display module 100 is finally shown.The arrangement mode of multiple display units 61 Can be corresponding with the arrangement mode of multiple display driver element 1a1, such as a display unit 61 and a display driver element 1a1 alignment.

Shading piece 62 is between display unit 61, and shading piece 62 is spaced two adjacent display units 61, in an example In son, shading piece 62 can be black matrix" (Black Matrix, BM).The entity part of shading piece 62 can prevent light from wearing It crosses, enters the external world without display unit 61 to avoid the light in display module 100, shading piece 62 can also prevent light from believing Number pass through adjacent display unit 61 when occur optical crosstalk phenomenon.

Incorporated by reference to Figure 12, unthreaded hole 621 was offered on shading piece 62, crossing unthreaded hole 621 can be used for passing through for optical signal.Cross light The position in hole 621 is aligned with photosensitive unit 2011, wherein alignment can refer to that the center line of unthreaded hole 621 passed through photosensitive unit 2011.Optical signal was during passing through unthreaded hole 621, if optical signal reached the inner wall of unthreaded hole 621, optical signal can quilt The inner wall section for crossing unthreaded hole 621 is absorbed or is all absorbed, and is enabled to several across the direction of propagation for the optical signal for crossing unthreaded hole 621 It is overlapped with the extending direction for the center line for crossing unthreaded hole 621.The distribution mode for crossing unthreaded hole 621 can be with point of photosensitive unit 2011 Mode for cloth is identical, is aligned so that each photosensitive unit 2011 crosses unthreaded hole 621 with one.

Figure 11 to Figure 13 is please referred to, collimation layer 202 is arranged in the second substrate 60.Collimating layer 202 includes that multiple collimations are single Member 2021, collimation unit 2021 offer light hole 2022, and light hole 2022 is directed at photosensitive unit 2011.Specifically, light hole 2022 can also be aligned with unthreaded hole 621 is crossed, that is, the center line of light hole 2022 can be overlapped with the center line for crossing unthreaded hole 621, light Signal pass through light hole 2022 after, be then passed through unthreaded hole 621 to reach photosensitive unit 2011.The material of collimation unit 2021 can be with It is identical as the material of shading piece 62, such as collimation unit 2021 is made with shading piece 62 of light absorbent, optical signal reaches quasi- When the entity part of straight unit 2021, optical signal can be partially absorbed or all absorb, for example, optical signal reaches collimation unit When 2021 side wall or optical signal reaches the inner wall of light hole 2022, optical signal is collimated unit 2021 and absorbs, so that passing The optical signal that direction is overlapped with the extending direction of the center line of light hole 2022 is broadcast to be obtained through light hole 2022 and reach photosensitive Unit 2011 realizes that the collimation to optical signal, the interference optical signal that photosensitive unit 2011 receives are less.Multiple collimation units 2021 can be located in shading piece 62 in the orthographic projection in the second substrate 60, so that collimation unit 2021 will not block display list Member 61 guarantees that display module 100 has preferable display effect.

The extending direction of light hole 2022 can be perpendicular to display surface 91, so that light hole 2022 is only capable of through propagation side To the optical signal vertical with display surface 91, in other words, light hole 2022 is only capable of by propagating vertically downward from display surface 91 Optical signal.The ratio of the depth of the cross-sectional width and light hole 2022 of light hole 2022 is less than 0.2, wherein light hole 2022 Depth can be light hole 2022 along the depth of centerline direction, the cross-sectional width of light hole 2022 can be light hole 2022 by The maximum of the figure cut perpendicular to the plane of center line across size, ratio specifically can be 0.1,0.111,0.125, 0.19, the numerical value such as 0.2, so that collimation unit 2021 is preferable to the collimating effect of optical signal.

In one example, collimation layer 202 further includes matrix 2023, and matrix 2023 can be basic light transmission, and collimation is single Member 2021 is formed on matrix 2023.In another example, collimation layer 202 can only include collimation unit 2021, and collimation is single Member 2021 can be formed in the second substrate 60 by modes such as plated film, sputterings.

For the setting of second polarizing layer 80 on collimation layer 202, the second polarizing layer 80 specifically can be polarizing film or polarizing coating.

Please continue to refer to Figure 11 and Figure 12, cover board 90 is arranged on the second polarizing layer 80.Cover board 90 can be by glass, Lan Bao The materials such as stone are made.Cover board 90 includes display surface 91 and the back side 92.After the optical signal that display module 100 issues passes through display surface 91 Into the external world, extraneous light enters display module 100 after passing through display surface 91.The back side 92 can be pasted with the second polarizing layer 80 It closes.In some examples, display module 100 can not also include cover board 90, and display surface 91 is formed in the second polarizing layer 80 at this time On.

Display surface 91 is formed with display area 911, and display area 911 refers to the region for being displayed for image, viewing area Domain 911 can be in the shapes such as the rectangle of rectangle, circle, round rectangle, band " fringe ", and this is not restricted.In addition, in some examples In son, display surface 91 also could be formed with non-display area, and non-display area can be formed in the peripheral position of display area 911, non- Viewing area can be used for being attached with casing 600.On display surface 91 accounting of display area 911 can for 80%, 90%, Any numbers such as 100%.

In the embodiment of the present application, multiple photosensitive units 2011 are located in display area 911 in the orthographic projection of display surface 91. So that multiple photosensitive units 2011 can be imaged the object touched in display area 911, finger is used for user For the example for touching display area 911, multiple photosensitive units 2011 can be to the finger for touching the finger on display area 911 Line is imaged, and is used for fingerprint recognition.

Figure 11 and Figure 12 is please referred to, will be described by way the detail that display module 100 is imaged: display module below The 100 optical signal La issued sequentially pass through the first polarizing layer 20, first substrate 30, photosensitive layer 201, liquid crystal layer 50, the second substrate 60, collimate layer 202, the second polarizing layer 80, touch module 400 and cover board it is after 90s enter extraneous, extraneous optical signal may also be according to It is secondary pass through cover board 90, touch module 400, the second polarizing layer 80, collimation layer 202, the second substrate 60, reach after liquid crystal layer 50 it is photosensitive Layer 201.If optical signal reaches exactly on the photosensitive unit 2011 in photosensitive layer 201, photosensitive unit 2011 can generate telecommunications Number to reflect the intensity of the optical signal.As a result, by the intensity of the electric signal of multiple photosensitive units 2011, can reflect into aobvious Show the strength distribution of the optical signal of mould group 100.

By user by taking finger 2000 touches display surface 91 as an example.When display module 100 is sending out optical signal La, hand Refer to 2000 predetermined positions for touching display surface 91, finger 2000 can carry out optical signal La to reflect to form L1, and optical signal L1 is subsequent Display module 100 is initially entered, optical signal L1 initially passes through cover board 90 and the second polarizing layer 80, for the direction of propagation and light hole 2022 and cross unthreaded hole 621 extending direction identical optical signal L1, optical signal L1 can also pass through light hole 2022 and cross unthreaded hole After 621, optical signal L1 pass through light hole 2022 and cross unthreaded hole 621, optical signal L1 reaches photosensitive unit after being then passed through liquid crystal layer 50 2011.For the different optical signal of extending direction of the direction of propagation and light hole 2022 or unthreaded hole 621 excessively, optical signal passes through lid Plate 90 and the second polarizing layer are after 80s, and optical signal by light hole 2022 or can not cross unthreaded hole 621, and then can not reach and light hole 2022 and cross unthreaded hole 621 be aligned photosensitive unit 2011.

It is appreciated that there are wave crests and trough for finger print, and when finger 2000 touches display surface 91, wave crest and display surface 91 Directly contacting, there are gaps between trough and display surface 91, after optical signal La reaches wave crest and trough, the optical signal of peak reflection The intensity for the optical signal (calling the second optical signal in the following text) that the intensity of (calling the first optical signal in the following text) is reflected with trough has differences, and then makes The electric signal (calling the first electric signal in the following text) generated due to receiving the first optical signal is obtained to generate with due to receiving the second optical signal The intensity of electric signal (calling the second electric signal in the following text) have differences, processor 300 is according to the first electric signal and the second electric signal Distribution situation, the image of available fingerprint.The image of the fingerprint can be further used for carrying out fingerprint recognition.

It is appreciated that user touches in the overlying regions for being arbitrarily provided with photosensitive unit 2011, can reach pair The purpose that fingerprint is imaged and is identified.When 911 lower section of display area is correspondingly arranged on photosensitive unit 2011, user is aobvious Show that any position in region 911 is touched, can achieve the purpose that fingerprint is imaged and is identified, and is not limited to show Certain specific positions in region 911.Meanwhile user can also touch multiple positions on display area 911 simultaneously with multiple fingers It sets or the multiple fingers of multiple users while touching multiple positions on display area 911, multiple fingerprints are carried out with realizing The purpose for being imaged and identifying, in this way, the verification mode and applicable scene of electronic equipment 1000 can be enriched, such as only when more A fingerprint is just authorized after passing through verifying simultaneously.

Certainly, with user with finger touch touch module 400 when similarly, any object (example for being capable of reflecting light signal La The arm of such as user, forehead, clothing, flowers and plants) touch touch module 400 after can to the surface texture of the object carry out at Picture, the subsequent processing carried out to imaging can be set according to user demand, and this is not restricted.

Figure 14 and Figure 17 is please referred to, in some embodiments, noise signal includes interference optical signal L2, and noise obtains mould Group 500 includes veiling glare photosensitive unit 501.Ink layer 93, veiling glare photosensitive unit 501 and ink are provided on the back side 92 of cover board 90 The position of layer 93 is corresponding, and ink layer 93 is used to obstruct the optical signal Lb for penetrating cover board 90 from the external world.

In actual use, it is directly pierced by from display surface 91 from the signal portions issued in backlight layer 10, part meeting One or many reflections are carried out between display surface 91 and backlight layer 10, and part reflected optical signal L2 may reach sense Light unit 2011 simultaneously interferes the imaging of display module 100.That is, further including interference in the imaging optical signal for imaging Optical signal L2, interference optical signal L2 are reflected by display module 100 and reach the photosensitive unit 2011 on photosensitive layer 201.

Position corresponding with veiling glare photosensitive unit 501 is provided with ink layer 93 on the above-mentioned back side 92, in display module 100 Light is largely absorbed by ink layer 93 after reaching the ink layer 93, and fraction (such as 4%) is reflected by ink layer 93, by this Ink layer 93 can simulate cover board 90 to the reflex of the optical signal inside display module 100, in addition, veiling glare photosensitive unit 501 are also possible to receive the optical signal L2 from the side of veiling glare photosensitive unit 501 to arrival veiling glare photosensitive unit 501.It is comprehensive next It sees, veiling glare photosensitive unit 501 can receive the interference optical signal L2 same with remaining photosensitive unit 2011, and simultaneously, ink Layer 93 can obstruct the optical signal Lb that (reflection or absorption) penetrates cover board 90 from the external world, so that veiling glare photosensitive unit 501 only receives To interference optical signal L2, remaining photosensitive unit 2011 can then receive interference optical signal L2 simultaneously, and penetrate cover board from the external world 90 optical signal Lb.

The type and performance of veiling glare photosensitive unit 501 and remaining photosensitive unit 2011 are all the same, and veiling glare photosensitive unit 501 will For the interference electric signal transmission generated by interference optical signal L2 to processor 300, processor 300 will be according to interference electricity in imaging Signal is corrected image, such as will be imaged after the imaging electric signal that optical signal generates subtracts interference electric signal and use as final The accuracy rate of image recognition is improved in the electric signal of imaging to obtain the higher image of accuracy.

In one example, veiling glare photosensitive unit 501 and remaining photosensitive unit 2011 are ccd image sensor, at this point, Imaging electric signal can be carried out with subtracting each other for electric signal of interference in processor 300, i.e. imaging electric signal and interference electric signal is equal It is sent in processor 300, electric signal will be imaged by, which being executed by processor 300, subtracts the operation of interference electric signal, alternatively, electricity is imaged Signal can also be carried out with subtracting each other for electric signal of interference in analog-digital converter, i.e., imaging electric signal is first passed with interference electric signal It send into analog-digital converter, electric signal will be imaged and subtract the operation of interference electric signal by being executed by analog-digital converter, then by the two phase The electric signal obtained after subtracting is sent in processor 300.In another example, veiling glare photosensitive unit 501 and remaining photosensitive list Member 2011 is cmos image sensor, at this point, imaging electric signal and interfere electric signal subtract each other can in processor 300 into Row, i.e. imaging electric signal and interference electric signal are sent in processor 300, are executed by processor 300 and are subtracted imaging electric signal Go interference electric signal operation, alternatively, imaging electric signal and interfere electric signal subtract each other can also in photosensitive unit 2011 into It goes, the first memory block, the second memory block and the powered down road of logic, the imaging that photosensitive unit 2011 generates is added in photosensitive unit 2011 Electric signal is stored in the first memory block, and interference electric signal is sent to photosensitive unit 2011 by veiling glare photosensitive unit 501 and is stored In the second memory block, the powered down road of logic will execute after the operation that electric signal subtracts interference electric signal being imaged, then the two is subtracted each other The electric signal obtained afterwards is sent in processor 300.The above-mentioned description subtracted each other for imaging electric signal and interference electric signal is only For example, it should not be understood as the limitation to the application.

In one example, overleaf 92 position by proximal edge is arranged in ink layer 93, and veiling glare photosensitive unit 501 is located at The marginal position of photosensitive layer 201.Such as veiling glare photosensitive unit 501 is set, wherein the region a is located in the region a as shown in figure 14 On one column of the leftmost side of 2011 array of photosensitive unit of Figure 14 and a column of the rightmost side.Avoid ink layer 93 to display module 100 display effect causes too much influence.Specifically, photosensitive unit 2011 can arrange in the matrix of multiple lines and multiple rows, veiling glare The marginal position in the matrix can be set in photosensitive unit 501, such as close to a column to three column for matrix edge, close matrix side A line of edge is to three rows, to adapt to the position of ink layer 93.

Further, since veiling glare photosensitive unit 501 has multiple, multiple interference electric signals, Duo Gegan can correspondingly be generated Disturb electric signal size may it is inconsistent, then, will be imaged electric signal subtract interfere electric signal when, in one example, can To be averaged to multiple interference electric signals, then will be imaged electric signal subtract be averaged after obtained interference electric signal.At another In example, subregion can be carried out respectively to photosensitive unit 2011 and veiling glare photosensitive unit 501, each region includes at least one sense Light unit 2011 or including at least one veiling glare photosensitive unit 501.It then, can be according to each comprising photosensitive unit 2011 The position in the position in region (calling first area in the following text) and each region (calling second area in the following text) comprising veiling glare photosensitive unit 501 To determine with each first area at a distance of nearest second area.For each of each first area photosensitive unit 2011, the imaging electric signal that each photosensitive unit 2011 can be generated is subtracted with the first area at a distance of the secondth nearest area The interference electric signal that veiling glare photosensitive unit 501 in domain generates is to obtain each photosensitive unit 2011 eventually for the electricity of imaging Signal, if in second area veiling glare photosensitive unit 501 number be it is multiple, can be first to multiple miscellaneous in the second area Multiple interference electric signals that light sensation light unit 501 generates take mean value, then will imaging electric signal subtract the mean value obtain eventually for The electric signal of imaging.It is appreciated that veiling glare photosensitive unit 501 and photosensitive unit 2011 be at a distance of closer, veiling glare photosensitive unit 501 and The amount for the interference optical signal that photosensitive unit 2011 receives is also more close, and the interference electric signal of generation is also more close, will be at As electric signal subtract interference electric signal after finally obtain for imaging electric signal it is also more accurate.

Figure 14 and Figure 18 is please referred to, in some embodiments, noise signal includes that photosensitive unit 2011 itself generates Noise electric signal.Noise obtaining module 500 includes noise photosensitive unit 502.Display module 100 further includes lightproof unit 2024, Lightproof unit 2024 is arranged on collimation unit 2021, and lightproof unit 2024 is used to block to be aligned with noise photosensitive unit 502 Light hole 2022.

In use, the temperature of photosensitive unit 2011 or the temperature of environment can change, and as temperature becomes Change, the performance of photosensitive unit 2011 may change, and lead to the electric signal generated when the optical signal for receiving same intensity Also inconsistent, therefore, when being imaged, need to interfere being corrected caused by temperature change.

In present embodiment, the type and performance of noise photosensitive unit 502 and remaining photosensitive unit 2011 are all the same, shading Unit 2024 blocks light hole 2022, so that noise photosensitive unit 502 does not almost receive optical signal.Noise photosensitive unit 502 Electric signal can be generated in use, but since noise photosensitive unit 502 does not almost receive optical signal, noise sense The electric signal that light unit 502 generates can be considered the noise telecommunications for causing photosensitive unit 2011 to generate because of material and temperature change Number.At this point, remaining photosensitive unit 2011 can then generate noise electric signal simultaneously, and imaging optical signal is received to generate imaging Electric signal.Noise photosensitive unit 502 will make an uproar noise electric signal transmission to processor 300, processor 300 in imaging according to this Acoustoelectric signal is corrected image, such as will be imaged after the imaging electric signal that optical signal generates subtracts noise electric signal and be used as most The electric signal for imaging improves the accuracy rate of image recognition to obtain the higher image of accuracy eventually.

Specifically, lightproof unit 2024 can also be made of light absorbent, and lightproof unit 2024 can be filled in light hole In 2022, lightproof unit 2024 can be fabricated together with collimation unit 2021.In one example, lightproof unit 2024 It can be arranged directly on noise photosensitive unit 502, so that noise photosensitive unit 502 is received entirely less than optical signal.Noise Photosensitive unit 502 can be set in the region by proximal edge of 2011 array of photosensitive unit, and noise photosensitive unit 502 can also be set It sets in the region adjacent with veiling glare photosensitive unit 501, such as can be located in matrix one arranges to three column, or is located in matrix A line to three rows, this is not restricted, noise photosensitive unit 502 is arranged in the region b shown in Figure 14, wherein the region b is located at The secondary series from left to right of 2011 array of photosensitive unit of Figure 14 and from right to left on secondary series.

Further, since noise photosensitive unit 502 has multiple, multiple noise electric signals can be correspondingly generated, it is multiple to make an uproar The size of acoustoelectric signal may be inconsistent, then, it, in one example, can when that electric signal will be imaged and subtract noise electric signal To be averaged to multiple noise electric signals, then will be imaged electric signal subtract be averaged after obtained noise electric signal.At another In example, subregion can be carried out respectively to photosensitive unit 2011 and noise photosensitive unit 502, each region includes at least one sense Light unit 2011 or including at least one noise photosensitive unit 502.It then, can be according to each comprising photosensitive unit 2011 The position in the position in region (calling first area in the following text) and each region (calling third region in the following text) comprising noise photosensitive unit 502 To determine with each first area at a distance of nearest third region.For each of each first area photosensitive unit 2011, the imaging electric signal that each photosensitive unit 2011 can be generated is subtracted with the first area at a distance of nearest third area The noise electric signal that noise photosensitive unit 502 in domain generates is to obtain each photosensitive unit 2011 eventually for the electricity of imaging Signal, if in third region the number of noise photosensitive unit 502 be it is multiple, can first make an uproar to multiple in the third region Multiple noise electric signals that phonoreception light unit 502 generates take mean value, then will imaging electric signal subtract the mean value obtain eventually for The electric signal of imaging.It is appreciated that noise photosensitive unit 502 and photosensitive unit 2011 be at a distance of closer, noise photosensitive unit 502 and The temperature of photosensitive unit 2011 is also more close, and the noise electric signal of generation is also more close, subtracts noise electric signal will be imaged The electric signal for imaging finally obtained after electric signal is also more accurate.

Figure 14 is please referred to, in some embodiments, circuit unit 2012 includes photosensitive circuit unit 20121 and noise electricity Road unit 20122, photosensitive circuit unit 20121 are connect with photosensitive unit 2011, are not connected on Noise Circuits unit 20122 photosensitive Unit 2011.

For photosensitive circuit itself there are hardware noise, which will lead to circuit noise signal, circuit noise signal meeting Therefore the intensity for influencing the electric signal for being finally transferred to processor 300 when being imaged, needs to make circuit noise signal At interference be corrected.

In present embodiment, photosensitive unit 2011, Noise Circuits unit 20122 are not connected on Noise Circuits unit 20122 The circuit noise signal of upper generation is the hardware noise for Noise Circuits unit 20122 itself.Noise Circuits unit 20122 The circuit noise signal is transmitted to processor 300, processor 300 in imaging will according to the circuit noise signal to image into Row correction, such as the imaging electric signal that optical signal generates will be imaged and subtract after circuit noise signal as the electricity eventually for imaging Signal improves the accuracy rate of image recognition to obtain the higher image of accuracy.

Specifically, multiple circuit units 2012 can be in the array arrangement of multiple lines and multiple rows, and Noise Circuits unit 20122 is at least Complete a line and a complete column are arranged in, so that Noise Circuits unit 20122 has in any a line and any one column Distribution, Noise Circuits unit 20122 generate circuit noise signal sample more comprehensively, according to the circuit noise signal to image When being corrected, the effect of correction is more preferable.Noise Circuits unit 20122, which also can be set, to be lined up in multiple circuit units 2012 The marginal position of array, or be arranged close to above-mentioned veiling glare photosensitive unit 501 and noise photosensitive unit 502.Noise Circuits list The distribution of member 20122 can cover a complete column to five column, and the complete a line of covering and not limit herein to the five-element System.In example as shown in figure 14, Noise Circuits unit 20122 is set, wherein the region c is located in the region c of photosensitive layer 201 In the column of third from left to right of 2012 array of circuit unit of Figure 14, from right to left third column, a line of top side and a line of lower side.

Further, since Noise Circuits unit 20122 has multiple, multiple circuit noise signals can be correspondingly generated, it is more The size of a circuit noise signal may be inconsistent, then, when that electric signal will be imaged and subtract circuit noise signal, in an example In son, multiple circuit noise signals can be averaged, then will be imaged electric signal subtract be averaged after obtained circuit noise believe Number.In another example, subregion, each region can be carried out respectively to photosensitive unit 2011 and Noise Circuits unit 20122 Including at least one photosensitive unit 2011 or including at least one Noise Circuits unit 20122.It then, can be according to each packet The position in the region (calling first area in the following text) containing photosensitive unit 2011 and each region comprising Noise Circuits unit 20122 The position of (calling the fourth region in the following text) is determined with each first area at a distance of nearest the fourth region.For in each first area Each photosensitive unit 2011, the imaging electric signal that each photosensitive unit 2011 can be generated subtracts and the first area The circuit noise signal that Noise Circuits unit 20122 in nearest the fourth region generates is to obtain each photosensitive unit 2011 eventually for imaging electric signal, if in the fourth region Noise Circuits unit 20122 number be it is multiple, can be first Mean value is taken to multiple circuit noise signals that multiple Noise Circuits units 20122 in the fourth region generate, then will imaging electricity Signal subtracts the mean value and obtains the electric signal eventually for imaging.

Figure 14 is please referred to, in some embodiments, noise signal includes infrared signal.Noise obtaining module 500 is wrapped Multiple infrared photosensitive units 503 are included, infrared photosensitive unit 503 is for detecting infrared light.

Since there are infrared lights in external environment, and infrared light may penetrate certain objects and enter display module 100.Example Such as, infrared light may penetrate the finger of user, pass through display surface 91, light hole 2022 and cross unthreaded hole 621 and by photosensitive unit 2011 receive, and the part infrared light and the fingerprint of user be not relevant, which generates Infrared electric signal interfere when processor 300 can be imaged.Therefore, it when being imaged, needs to believe infrared light Interference caused by number is corrected.

Infrared photosensitive unit 503 can only receive infrared signal, and generate infrared electric signal according to infrared signal, remaining Photosensitive unit 2011 can receive infrared signal and visible light signal simultaneously, and generate according to infrared signal and visible light signal Electric signal is imaged.Infrared electric signal is further transmitted to processor 300, and processor 300 will be according to the infrared telecommunications in imaging Number image is corrected, for example, will be imaged the imaging electric signal that optical signal generates subtract after infrared electric signal as eventually for The electric signal of imaging improves the accuracy rate of image recognition to obtain the higher image of accuracy.

Specifically, multiple infrared photosensitive units 503 can be spaced apart, such as be evenly distributed on 2011 array of photosensitive unit Interior, infrared photosensitive unit 503 ratio shared in photosensitive unit 2011 can be smaller, such as accounts for 1%, 7%, 10% etc..Please In conjunction with Figure 12, when user touches display surface 91, touch module 400 can sense the position touched, and processor 300 is read The infrared electric signal for taking the infrared photosensitive unit 503 of one or more corresponding with the position touched to generate, and it is infrared according to this Electric signal is corrected image.

In addition, in some embodiments, infrared photosensitive unit 503 can also be not provided with, but in photosensitive layer 201 and shown Show and infrared cut coating is set between face 91, such as infrared cut coating setting in the second substrate 60 and collimates between layer 202, infrared section Only film is higher to the transmitance of visible light, can achieve 90% or more, and lower to the transmitance of infrared signal, to prevent Extraneous infrared signal reaches photosensitive unit 2011.

Further, since infrared photosensitive unit 503 has multiple, multiple infrared electric signals, Duo Gehong can correspondingly be generated The size of outer electric signal may be inconsistent, then, it, in one example, can when that electric signal will be imaged and subtract infrared electric signal To be averaged to multiple infrared electric signals, then will be imaged electric signal subtract be averaged after obtained infrared electric signal.At another In example, subregion can be carried out respectively to photosensitive unit 2011 and infrared photosensitive unit 503, each region includes at least one sense Light unit 2011 or including at least one infrared photosensitive unit 503.It then, can be according to each comprising photosensitive unit 2011 The position in region (calling first area in the following text) and each position in the region (calling the 5th region in the following text) comprising infrared photosensitive unit 503 To determine with each first area at a distance of the 5th nearest region.For each of each first area photosensitive unit 2011, the imaging electric signal that each photosensitive unit 2011 can be generated is subtracted with the first area at a distance of the 5th nearest area The infrared electric signal that infrared photosensitive unit 503 in domain generates is to obtain each photosensitive unit 2011 eventually for the electricity of imaging Signal, if in the 5th region infrared photosensitive unit 503 number be it is multiple, can be first to multiple red in the 5th region Multiple infrared electric signals that outer photosensitive unit 503 generates take mean value, then will imaging electric signal subtract the mean value obtain eventually for The electric signal of imaging.It is appreciated that infrared photosensitive unit 503 and photosensitive unit 2011 be at a distance of closer, infrared photosensitive unit 503 and The amount for the infrared light of photosensitive unit 2011 received is also more close, and the infrared electric signal of generation is also more close, will be imaged It is also more accurate that electric signal subtracts the electric signal for imaging finally obtained after infrared electric signal.

Figure 14 is please referred to, the photosensitive list of veiling glare photosensitive unit 501, noise can also be set simultaneously on the same photosensitive layer 201 Member 502, Noise Circuits unit 20122 and infrared photosensitive unit 503, so that processor 300 is in processing electric signal to carry out into When picture, at the same in view of the interference of above-mentioned interference electric signal, noise electric signal, circuit noise signal and infrared electric signal etc. because Element, to obtain accurate image.

Veiling glare photosensitive unit 501, noise photosensitive unit 502, noise electricity can also be set simultaneously on the same photosensitive layer 201 It is any one or more in road unit 20122 and infrared photosensitive unit 503, for example, simultaneously be arranged veiling glare photosensitive unit 501 with Noise photosensitive unit 502, processor 300 will carry out school to image according to interference electric signal and noise electric signal in imaging at this time Just, for example, will be imaged optical signal generate imaging electric signal subtract interference electric signal and noise electric signal after as eventually at The electric signal of picture.For another example veiling glare photosensitive unit 501 and Noise Circuits unit 20122 are arranged simultaneously, processor 300 exists at this time Image will be corrected according to interference electric signal and circuit noise signal when imaging, such as the imaging that optical signal generation will be imaged Electric signal subtract interference electric signal and circuit noise signal after as the electric signal eventually for imaging.For another example being arranged simultaneously Noise Circuits unit 20122 and infrared photosensitive unit 503, at this time processor 300 in imaging will according to circuit noise signal and Infrared signal is corrected image, such as the imaging electric signal that optical signal generates will be imaged and subtract circuit noise signal and red As the electric signal eventually for imaging after outer electric signal.For another example noise photosensitive unit 502, Noise Circuits list are arranged simultaneously Member 20122 and infrared photosensitive unit 503, at this time processor 300 in imaging will according to noise electric signal, circuit noise signal and Infrared signal is corrected image, such as subtracts noise electric signal, circuit for the imaging electric signal that optical signal generates is imaged As the electric signal eventually for imaging after noise signal and infrared electric signal.For another example veiling glare photosensitive unit is arranged simultaneously 501, noise photosensitive unit 502, Noise Circuits unit 20122 and infrared photosensitive unit 503, processor 300 is in imaging at this time Image will be corrected according to interference electric signal, noise electric signal, circuit noise signal and infrared signal, such as will imaging The imaging electric signal that optical signal generates is made after subtracting interference electric signal, noise electric signal, circuit noise signal and infrared electric signal For the electric signal etc. eventually for imaging.

Figure 15 is please referred to, in some embodiments, multiple display driver element 1a1 are in the array arrangement of multiple lines and multiple rows, Multiple photosensitive units 2011 are in the array arrangement of multiple lines and multiple rows, positioned at the display driver element 1a1 of same a line or same row and sense The effective time of light unit 2011 is interspersed.

Specifically, in production, display driving layer 1a can be first manufactured on first substrate 30, is then driven again in display Photosensitive layer 201 is manufactured on layer 1a.Display driver element 1a1 and the interval of photosensitive unit 2011 are arranged.In an array, may have multiple Photosensitive unit 2011 and multiple display driver element 1a1 are located at same a line or same row simultaneously, positioned at same a line or same row Display driver element 1a1 and the effective time of photosensitive unit 2011 are interspersed.In example as shown in figure 15, it is located at figure Multiple display driver element 1a1 of bottom a line are worked at the same time in 15, and multiple photosensitive units 2011 of bottom a line are same When work, and the working time of multiple display driver element 1a1 and the working time of multiple photosensitive units 2011 do not intersect, and reduce The interference for the display driver element 1a1 that photosensitive unit 2011 is subject at work, improves the accuracy of imaging.

Figure 19 and Figure 20 are please referred to, in another example, fingerprint recognition mould group 200 is capacitance type fingerprint mould group 40,.Electricity Appearance formula fingerprint mould group 40 is integrated in display module 100.Specifically, display module 100 includes cover board 70, display screen 10 and colloid 51.Display screen 10, capacitance type fingerprint mould group 40 and cover board 70 along display module 100 light direction (namely display screen 10 go out Light direction) setting.

Cover board 70 is for protecting capacitance type fingerprint mould group 40.The material of cover board 70 can be sapphire (Sapphire), glass Glass, Kapton (Polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) or composite plate in any one.Composite plate includes polymethyl methacrylate (Polymethyl Methacrylate, PMMA) and polyamide (Polycarbonate, PC).When the material of cover board 70 is sapphire, lid The thickness of plate 70 can be 0.2mm~0.5mm, high with hardness, intensity is high, sand paper falls that effect is good (to bear on cement floor 1.2m height is fallen), scratch resistance the advantages that.When the material of cover board 70 is PI or PET, the thickness of cover board 70 can for 0.1mm~ 0.3mm, cover board 70 are flexible cover plate, and when having many advantages, such as that sand paper falls the material of the good cover board 70 of effect as composite plate, cover board 70 with a thickness of 0.1mm~0.4mm, cover board 70 has many advantages, such as scratch resistance, good toughness.Cover board 70 includes opposite cover board light-emitting surface 72 and the cover board back side 73.The cover board back side 73 and capacitance type fingerprint mould group 40 are opposite.Please refer to Figure 21, it is settable on the cover board back side 73 There is ink layer 87.Ink layer 13 has higher attenuation rate to visible light, such as can reach 70% or more, so that user normally makes In, it is visually difficult to see that the region covered in electronic equipment 1000 by ink.The thickness of ink layer 87 is less than or equal to 0.2mm.The thickness of ink layer 87 is less than or equal to 0.2mm, so that the thinner thickness of display module 100, is also beneficial to reduce electricity The thickness of sub- equipment 1000.

Capacitance type fingerprint mould group 40 between cover board 70 and display screen 10 and cover display screen 10 display surface 71, with sense It should touch to the user fingerprints of cover board 70.Capacitance type fingerprint mould group 40 can be arranged on cover board 70 by colloid 51, specific to be arranged In the side at the cover board back side 73.Capacitance type fingerprint mould group 40 includes opposite sensor light-emitting surface 41 and the sensor back side 42.It passes Sensor light-emitting surface 41 and cover board 70 are opposite (specifically opposite with the cover board back side 73), and the sensor back side 42 and display screen 10 are opposite.Electricity Appearance formula fingerprint mould group 40 can partly or entirely cover entire display surface 71, preferably to realize full frame fingerprint identification function.Capacitor Formula fingerprint mould group 40 with a thickness of 0.3mm or so.Material (namely the following sensor base plate 48 of capacitance type fingerprint mould group 40 Material) it is glass or PI.The route material (material of i.e. following sensor line layer 49) of capacitance type fingerprint mould group 40 includes Any one in metal, tin indium oxide (Indium tin oxide, ITO) or nanometer silver paste.Capacitance type fingerprint mould group 40 The route material of material and capacitance type fingerprint mould group 40 can carry out any collocation.

Figure 22 is please referred to, capacitance type fingerprint mould group 40 may include element sensor 43, sensor board 44, pixel amplifier 45, outlet line 46 and power supply 47.Element sensor 43 is arranged on sensor board 44.Element sensor 43 is in array distribution. For example, inside a capacitance type fingerprint mould group 40, it may include the element sensor 43 of 100*100, i.e. 10000 miniature pictures Plain sensor 43.The side of sensor board 44 is arranged in element sensor 43, and pixel amplifier 45 and the setting of outlet line 46 exist The other side of sensor board 44.Pixel amplifier 45 is used to amplify the signal of element sensor 43, and defeated by outlet line 46 Out.Outlet line 46 may include a plurality of, the corresponding pixel amplifier 45 of each element sensor 43, and correspond to an output line Road 46.Power supply 47 is connect with sensor board 44, for applying voltage to form electric field.Power supply 47 can be set in sensor board 44 On, it can also be not arranged on sensor board 44.When power supply 47 can be set on sensor board 44, power supply 47 can pass through weldering It connects mode or laminating type is mounted on sensor board 44.Capacitance type fingerprint mould group 40 can also include that (figure is not for semiconductor substrate Show), at this point, semiconductor substrate and sensor board 44 are opposite, the other side of sensor board 44 is arranged in semiconductor substrate, and pixel is put Big device 45 and outlet line 46 are respectively provided on a semiconductor substrate.Make the side for being provided with element sensor 43 of sensor board 44 For sensor light-emitting surface 41, the side where semiconductor substrate is as the sensor back side 42.

When electronic equipment 1000 is used for fingerprint recognition, the finger of user is pressed by cover board 70 in capacitance type fingerprint mould group On 40, element sensor 43 constitutes a pole plate of capacitor, and finger skin constitutes another pole plate of capacitor.Due to finger surface There are wave crest and trough, wave crest and trough are different from the distance between corresponding element sensor 43, therefore the capacitance formed Size is also different, can obtain corresponding fingerprint image according to the size of the capacitance.

Capacitance type fingerprint mould group 40 is applied not only to realize fingerprint identification function, is also used as the touch module of display screen 10 Realize touch function.In other words, display screen 10, can be real by capacitance type fingerprint mould group 40 without in addition setting touch module Existing fingerprint recognition and touch-control dual function, the structure of display module 100 is simple, thinner thickness, integrated level are high, cost is relatively low, thoroughly Photosensitiveness is also more preferable, moreover it is possible to reduce the quantity, volume and design difficulty of the connection terminal of display module 100.Capacitance type fingerprint mould group 40 fingerprint identification function and touch function can be with time-sharing multiplex.When capacitance type fingerprint mould group 40 is for realizing fingerprint identification function When, capacitance type fingerprint mould group 40 is not used in realization touch function；When capacitance type fingerprint mould group 40 is for realizing touch function, electricity Appearance formula fingerprint mould group 40 is not used in realization fingerprint identification function.Figure 19 is please referred to, display module 100 may also include sensor chip 201 (when processor 300 is multiple, sensor 201 is one of processor 300), sensor chip 201 and capacitance type fingerprint Mould group 40 connects.Sensor chip 201 is used to read capacitance type fingerprint mould group 40 and detects obtained capacitance, then according to the electricity Capacitance forms fingerprint image and carries out fingerprint recognition, to realize fingerprint identification function.Alternatively, sensor chip 201 is for reading It takes capacitance type fingerprint mould group 40 to detect obtained capacitance, touch point coordinate, pressing track etc. is then judged according to the capacitance, To realize touch function.

Figure 20 is please referred to, display screen 10 is arranged in capacitance type fingerprint mould group 40 by colloid 51, is specifically located at sensing The side at the device back side 42.Display screen 10 includes opposite display module front 102 and the display module back side 103.Display module is just Face 102 and capacitance type fingerprint mould group 40 are opposite (specifically opposite with the sensor back side 42).Display screen 10 can be hard screen or flexibility Screen.Preferably, the material of capacitance type fingerprint mould group 40 is glass, and cost is relatively low when display screen 10 is hard screen；Capacitance type fingerprint The route material of mould group 40 includes any one in metal, ITO or nanometer silver paste.When display screen 10 is flexible screen, capacitor The material of formula fingerprint mould group 40 is PI, to form flexible sensor；The route material of capacitance type fingerprint mould group 40 includes ITO or receives Rice silver paste, to form flexible circuitry.Display screen 10 can be LCM display screen or Organic Light Emitting Diode (Organic Light- Emitting Diode, OLED) display screen.

Colloid 51 is for bonding cover board 70, capacitance type fingerprint mould group 40 and display screen 10.Using colloid 51 bond cover board 70, Full frame capacitance type fingerprint mould group 40 and display screen 10, it is ensured that the structural strength of display component 100 and fingerprint recognition performance Reliability.Colloid 51 can be optical cement, specially OCA (Optically Clear Adhesive), polyvinyl butyral Any one in film (PolyVinyl Butyral Film, PVB) or DAF (Die attach film).

Figure 20 is please referred to, in one embodiment, colloid 51 includes the first optical cement 511 and the second optical cement 512.First Optical cement 511 is for bonding cover board 70 and capacitance type fingerprint mould group 40, specific adhesive cover back 73 and sensor light-emitting surface 41. Second optical cement 512 is specific to bond the sensor back side 42 and display mould for bonding capacitance type fingerprint mould group 40 and display screen 10 Group front 102.In the present embodiment, along the opposite direction of the light direction of display module 100, cover board 70, the first optical cement 511, electricity Appearance formula fingerprint mould group 40, the second optical cement 512 and display screen 10 stack gradually setting.

Full laminating type bonding cover board 70 and capacitance type fingerprint mould group 40 can be used in first optical cement 511.Specifically, it will cover Plate 70 and capacitance type fingerprint mould group 40 are pasted together completely in seamless mode, and the first optical cement 511 applies cover plate 70 Air layer is not present in the whole face of whole face or capacitance type fingerprint mould group 40 between cover board 70 and capacitance type fingerprint mould group 40.Using complete Laminating type bonds cover board 70 and capacitance type fingerprint mould group 40, so that bonding more between cover board 70 and capacitance type fingerprint mould group 40 Securely, capacitance type fingerprint mould group 40 will not be conducive to relative to the position of cover board 70 with using the increase of time to shift The reliability that capacitance type fingerprint mould group 40 carries out fingerprint recognition is improved, enters cover board 70 alternatively, it is also possible to reduce dust, moisture etc. With the probability between capacitance type fingerprint mould group 40.First optical cement 511 may include any one in OCA, PVB or DAF.When When first optical cement 511 is OCA, the first optical cement 511 is softer, and fitting processing technology is simple, and when the pressing of the finger of user exists When on cover board 70, the first optical cement 511 can play certain buffer function to cover board 70 and capacitance type fingerprint mould group 40.When When one optical cement 511 is PVB, the bonding effect of the first optical cement 511 is stronger, advantageously ensures that cover board 70 and capacitance type fingerprint mould The stability of structure between group 40.When the first optical cement 511 is DAF, it is possible to reduce the air bubble problem generated during fitting, Be conducive to improve binding yield, and improve the flatness between cover board 70 and capacitance type fingerprint mould group 40.When the first optical cement 511 be OCA, PVB or DAF when, the thickness of the first optical cement 511 is 0.05mm~0.15mm.

Full laminating type can be used in second optical cement 512 or frame patch mode bonds capacitance type fingerprint mould group 40 and display screen 10。

With display screen 10 be using full laminating type bonding capacitance type fingerprint mould group 40: by capacitance type fingerprint mould group 40 and Display screen 10 is pasted together completely in seamless mode, and the second optical cement 512 coats the whole face of capacitance type fingerprint mould group 40 Or the whole face of display screen 10, air layer is not present between capacitance type fingerprint mould group 40 and display screen 10.It is viscous using full laminating type Close capacitance type fingerprint mould group 40 and display screen 10 so that bonded between capacitance type fingerprint mould group 40 and display screen 10 it is more secured, Display screen 10 will not be conducive to improve relative to the position of capacitance type fingerprint mould group 40 with using the increase of time to shift The consistency of display area and fingerprint identification region 912 enters capacitance type fingerprint mould alternatively, it is also possible to reduce dust, moisture etc. Probability between group 40 and display screen 10.

Figure 23 is please referred to, bonding capacitance type fingerprint mould group 40 with display screen 10 using frame patch mode is: condenser type is referred to The frame portion or marginal portion of line mould group 40 and display screen 10 are pasted together, and the second optical cement 512 coats capacitance type fingerprint The surrounding of mould group 40 or the surrounding (week makes a circle) of display screen 10, may be present sky between capacitance type fingerprint mould group 40 and display screen 10 Gas-bearing formation.Certainly, certain transparent materials (such as PET, PET cost are lower than optical cement) can also be used to fill the air layer, so that Structure is more stable, and reduce the probability that dust, moisture etc. enter between capacitance type fingerprint mould group 40 and display screen 10.Using Frame patch mode bonds capacitance type fingerprint mould group 40 and display screen 10, so that the usable floor area of the second optical cement 512 is smaller, is conducive to Cost is saved, and binding yield is higher.In addition, when capacitance type fingerprint mould group 40 is damaged, it can be easily by capacitor Formula fingerprint mould group 40 is disassembled from display screen 10, the replacement of capacitance type fingerprint mould group 40 is carried out, without referring to condenser type Line mould group 40 and display screen 10 are all replaced；Alternatively, when display screen 10 is damaged, it can be easily by display screen 10 It is disassembled from capacitance type fingerprint mould group 40, carries out the replacement of display screen 10, without by display screen 10 and capacitance type fingerprint Mould group 40 is all replaced.

Second optical cement 512 may include any one in OCA, PVB or DAF.When the second optical cement 512 is OCA, Second optical cement 512 is softer, and fitting processing technology is simple, and when the pressing of the finger of user is on cover board 70, the second optical cement 512 can play certain buffer function to capacitance type fingerprint mould group 40 and display screen 10.When the second optical cement 512 is PVB, The bonding effect of second optical cement 512 is stronger, advantageously ensures that the steady of structure between capacitance type fingerprint mould group 40 and display screen 10 It is qualitative.When the second optical cement 512 is DAF, it is possible to reduce it is good to be conducive to raising fitting for the air bubble problem generated during fitting Rate, and improve the flatness between capacitance type fingerprint mould group 40 and display screen 10.When the second optical cement 512 be OCA, PVB or When DAF, the thickness of the second optical cement 512 is 0.05mm~0.15mm.

Figure 24 is please referred to, display module 100 can also include strengthening course 83, and strengthening course 83 is located at capacitance type fingerprint mould group 40 Between display screen 10, it is particularly located between the sensor back side 42 and display surface 71.Strengthening course 83 includes that opposite reinforcement goes out light Face 831 and the reinforcement back side 832.Reinforcement light-emitting surface 831 and the sensor back side 42 are opposite, the reinforcement back side 832 and display module front 102 is opposite.Strengthening course 83 and cover board 70 form double-layer cover plate structure.Strengthening course 83 can only have 0.3mm in the thickness of cover board 70 Or it is thinner in the case where, reinforce the intensity of entire display module 100, reduce in subsequent use process electronic equipment 1000 due to Impacted or hit the probability for causing capacitance type fingerprint mould group 40 to fail.The material of strengthening course 83 can for sapphire, glass, Any one in PI, PET or composite plate.Strengthening course 83 with a thickness of 0.1mm~0.5mm.

When display module 100 includes strengthening course 83, colloid 51 is for bonding cover board 70, capacitance type fingerprint mould group 40, mending Strong layer 83 and display screen 10.Figure 24 is please referred to, in one embodiment, colloid 51 includes the first optical cement 511, third optical cement 513 and the 4th optical cement 514.First optical cement 511 specifically bonds cover board for bonding cover board 70 and capacitance type fingerprint mould group 40 The back side 73 and sensor light-emitting surface 41.Third optical cement 513 is specific viscous for bonding capacitance type fingerprint mould group 40 and strengthening course 83 Close the sensor back side 42 and reinforcement light-emitting surface 831.4th optical cement 514 is specific viscous for bonding reinforcement layer 83 and display screen 10 Close the reinforcement back side 832 and display module front 102.In the present embodiment, along the opposite direction of the light direction of display module 100, Cover board 70, the first optical cement 511, capacitance type fingerprint mould group 40, third optical cement 513, strengthening course 83,514 and of the 4th optical cement Display screen 10 stacks gradually setting, i.e., original second optical cement 512 is replaced by third optical cement 513 and the 4th optical cement 514, And increase the strengthening course 83 being arranged between capacitance type fingerprint mould group 40 and display screen 10.Third optical cement 513 can be used entirely Laminating type or frame patch mode bond capacitance type fingerprint mould group 40 and strengthening course 83, and full fitting side can be used in the 4th optical cement 514 Formula or frame patch mode bonding reinforcement layer 83 and display screen 10.Third optical cement 513 and the 4th optical cement 514 may each comprise OCA, Any one in PVB or DAF.When the thickness of third optical cement 513 and the 4th optical cement 514 can be 0.05mm~ 0.15mm。

Figure 25 is please referred to, in some embodiments, display module 100 may also include polaroid 84.Polaroid 84 passes through Colloid 51 is arranged on cover board 70, is specifically located at the side at the cover board back side 73.Polaroid 84 is located at cover board 70 and refers to condenser type Between line mould group 40, it is particularly located between the cover board back side 73 and sensor light-emitting surface 41.Polaroid 84 includes that opposite polarisation goes out Smooth surface 841 and the polarisation back side 842.Polarisation light-emitting surface 841 and the cover board back side 73 are opposite, the polarisation back side 842 and sensor light-emitting surface 41 is opposite.The thickness of polaroid 84 can be 100 μm~150 μm.One layer is added between cover board 70 and capacitance type fingerprint mould group 40 Polaroid 84 can reduce the brightness that ambient is incident to the incident light of capacitance type fingerprint mould group 40 by cover board 70, to subtract It is few because caused by metal grill walks line reflection in capacitance type fingerprint mould group 40 100 appearance of display module there is the different of certain angle (khaki phenomenon is such as presented) in color phenomenon.

Polaroid 84 can be rotatory polarization piece.Polaroid 84 include along display module 100 light direction be arranged protective film, Triafol T (Triacetyl Cellulose, TAC) functional membrane, polyvinyl alcohol (polyvinyl alcohol, PVA) Film, tabula rasa TAC film, pressure sensitive adhesive and release film.Wherein it is possible to which the surface to TAC functional membrane carries out some process, to reach To corresponding additional function.For example, non-glare treated (AG) can be carried out to the surface of TAC functional membrane, anti-dazzle+low reflection handles (AG+ LR), transparent hard+low reflection processing (CHC+LR), transparent hard processing (CHC), antireflection process (AR) etc..Different surfaces Processing mode can meet the different application demand of electronic equipment 1000.The application embodiment carries out the surface of TAC functional membrane Antireflection process, so that there is TAC functional membrane anti-reflective function (to be made the reflected light on former and later two surfaces of film using interference effect Mutually eliminate to reduce reflection), to reduce the reflected light of the generation of capacitance type fingerprint mould group 40, to further mitigate display module 100 are presented khaki phenomenon since the reflection of metal grill route is caused in capacitance type fingerprint mould group 40 under special angle.

Since polaroid 84 can reduce the brightness of display screen 10, polaroid original in display screen 10 can be cancelled. Specifically, (1) for please referring to Figure 26, when display screen 10 is LCM display screen, LCM display screen includes going out along display module 100 The backlight layer 11 of light direction setting, the first polarizing layer 12, first substrate 13, liquid crystal layer 14, (including the Figure 11 of color filter layers 17 Shown in the second substrate 60 and the display unit 61 being arranged in the second substrate 60) and the second polarizing layer 16, then can be by second Polarizing layer 16 is cancelled, i.e., LCM display screen includes the backlight layer 11 being arranged along the light direction of display module 100, the first polarizing layer 12, first substrate 13, liquid crystal layer 14 and color filter layers 17 (shown in (2) of such as Figure 26), polaroid 84 can be used as LCM and show The second polarizing layer 16 in screen.(1) for please referring to Figure 27, when display screen 10 is OLED display screen, OLED display screen includes edge Glass TFT substrate 181, Organic Light Emitting Diode 182, packaged glass 183 and the OLED of the light direction setting of display module 100 Polaroid 184 can then cancel OLED polaroid 184, i.e., OLED display screen includes setting along the light direction of display module 100 Glass TFT substrate 181, Organic Light Emitting Diode 182 and the packaged glass 183 (shown in (2) of such as Figure 27) set, polaroid 84 can As the OLED polaroid 184 in OLED display screen.

When display module 100 includes polaroid 84, colloid 51 is for bonding cover board 70, polaroid 84, capacitance type fingerprint Mould group 40 and display screen 10.Figure 25 is please referred to, in one embodiment, when colloid 51 includes the first optical cement 511 and the second light When learning glue 512, the first optical cement 511 goes out light with polarisation for bonding cover board 70 and polaroid 84, specific adhesive cover back 73 Face 841.Second optical cement 512 for bonding capacitance type fingerprint mould group 40 and display screen 10, it is specific bond the sensor back side 42 and Display module front 102.In the present embodiment, along the opposite direction of the light direction of display module 100, cover board 70, the first optics Glue 511, polaroid 84, capacitance type fingerprint mould group 40, the second optical cement 512 and display screen 10 stack gradually setting.First optics Full laminating type bonding cover board 70 and polaroid 84 can be used in glue 511.Full laminating type or frame patch can be used in second optical cement 512 Mode bonds capacitance type fingerprint mould group 40 and display screen 10.

Figure 28 is please referred to, in some embodiments, display module 100 may also include T-coating 85.T-coating 85 Between cover board 70 and capacitance type fingerprint mould group 40, it is particularly located between the cover board back side 73 and sensor light-emitting surface 41.Counnter attack Light film 85 includes opposite reflection-proof light-emitting surface 851 and the reflection-proof back side 852.Reflection-proof light-emitting surface 851 and 73 phase of the cover board back side Right, the reflection-proof back side 852 and sensor light-emitting surface 41 are opposite.T-coating 85 with a thickness of 200nm~300nm.T-coating 85 also referred to as anti-reflective film, antireflective anti-reflection film, AR (Anti-Refletance) film etc..T-coating 85 is to pass through sputtering Technique is plated MULTILAYER COMPOSITE optical film on substrate and is formed, and low-refraction (L) and high refractive index (H) material is used to be alternatively formed film Heap is reduced substrate surface using interference effect and is reflected by film layer design and film thickness monitoring.In the application embodiment, substrate It can be cover board 70 or capacitance type fingerprint mould group 40.Specifically, T-coating 85 can be formed in 73 (not shown) of the cover board back side, Or it is formed in sensor light-emitting surface 41 (as shown in figure 28).T-coating is formed at the cover board back side 73 or sensor light-emitting surface 41 85, it is possible to reduce the reflected light that capacitance type fingerprint mould group 40 generates, so that metal grill route is anti-in capacitance type fingerprint mould group 40 10 side yellowing phenomenon of display screen caused by light mitigates, and improves appearance display effect；It can also play the role of anti-dazzle simultaneously, Under strong light action, user clearer can see the image of the display of display screen 10 clearly.

Figure 20 and Figure 29 are please referred to, in some embodiments, display module 100 may also include high impedance film 86.At this point, Capacitance type fingerprint mould group 40 includes the sensor base plate 48 and sensor line layer 49 being arranged along the light direction of display module 100 (i.e. aforementioned metal grid cabling).Sensor line layer 49 is arranged on sensor base plate 48, and sensor line layer 49 is used for Capacitance detect when fingerprint recognition to obtain fingerprint image.High impedance film 86 is located at sensor line layer 49 and sensor base Between plate 48.Incorporated by reference to Figure 30, in one example, high impedance film 86 can offer through-hole, in order to sensor line layer 49 It is formed on sensor base plate 48 across through-hole.High impedance film 86 includes opposite high impedance light-emitting surface 861 and the high impedance back side 862.High impedance light-emitting surface 861 and sensor line layer 49 are opposite, and the high impedance back side 861 and sensor base plate 48 are opposite.High resistant Anti- film 86 with a thickness of 20nm~60nm.The ingredient of high impedance film 86 is graphite oxide, tin oxide, surfactant and crosslinking agent Mixture.Between sensor line layer 49 and sensor base plate 48 increase by one layer of high impedance film 86, can to avoid or subtract Interfering with each other between few capacitance type fingerprint mould group 40 and display screen 10, avoids due to capacitance type fingerprint mould group 40 and display screen 10 Between interfere with each other, and influence the function of capacitance type fingerprint mould group 40 and display screen 10.

Capacitance type fingerprint mould group 40 in the application embodiment can be with capacitance type fingerprint mould group 40 shown in Figure 22 Identical or corresponding structure or two different structures.When it is identical or corresponding structure, sensor base plate 48 can be equivalent to sensor board 44, and sensor line layer 49 can be equivalent to element sensor 43, pixel amplifier 45 and output line Road 46；Or when capacitance type fingerprint mould group 40 further includes semiconductor substrate, sensor base plate 48 can be equivalent to semiconductor substrate, Sensor line layer 49 can be equivalent to element sensor 43, sensor board 44, pixel amplifier 45 and outlet line 46.Certainly, Capacitance type fingerprint mould group 40 can also be without including pixel amplifier 45, herein with no restrictions.

The application also provides a kind of non-volatile computer readable storage medium storing program for executing 2000.Non-volatile computer readable storage Medium 2000 includes computer-readable instruction.When computer-readable instruction is executed by processor 3000, so that processor 3000 is held Encrypting and decrypting method described in the above-mentioned any one embodiment of row.

For example, incorporated by reference to Fig. 1 and Fig. 2, when computer-readable instruction is executed by processor 3000, so that processor 3000 is held Row following steps: 011: during user presses application program to be encrypted with the first duration, controlling fingerprint recognition mould group 200 The first current finger print image of user is obtained, the first duration is greater than first threshold；012: after obtaining the first current finger print image, It controls the prompt of display module 100 and carries out cryptographic operation；And 013: being operated according to the first of user the input, by the first current finger print figure As being used as password to encrypt to application program to be encrypted.

For another example incorporated by reference to Fig. 2 and 5, when computer-readable instruction is executed by processor 3000, so that processor 3000 is held Row following steps: 014: during user has encrypted application program with the pressing of the second duration, controlling fingerprint recognition mould group 200 The second current finger print image of user is obtained, the second duration is greater than second threshold；015: in the second current finger print image and password When matching, decryption has encrypted application program.

For another example incorporated by reference to Fig. 2 and Fig. 6, when computer-readable instruction is executed by processor 3000, so that processor 3000 Execution following steps: 016: during user has encrypted application program with the pressing of third duration, controlling fingerprint recognition mould group 200 obtain the second current finger print image of user, and third duration is greater than third threshold value；017: the second current finger print image with it is close When code matching, control display module 100 prompts the operation for carrying out deleting password；And 018: it is operated according to the second of user the input, Password is deleted and is changed to unencryption application program so that application program will have been encrypted.

In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation The description of mode ", " example ", specific examples or " some examples " etc. means the tool described in conjunction with the embodiment or example Body characteristics, structure, material or feature are contained at least one embodiment or example of the application.In the present specification, Schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.In addition, In the case where not conflicting, those skilled in the art can by different embodiments or examples described in this specification and The feature of different embodiments or examples is combined.

Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion Point, and the range of the preferred embodiment of the application includes other realization, wherein can not press shown or discussed suitable Sequence, including according to related function by it is basic simultaneously in the way of or in the opposite order, Lai Zhihang function, this should be by the application Embodiment person of ordinary skill in the field understood.

Although presently filed embodiment has been shown and described above, it is to be understood that above embodiment is Illustratively, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be right Above embodiment is changed, modifies, replacement and variant.

Claims

1. a kind of encrypting and decrypting method of application program, which is characterized in that the encrypting and decrypting method includes:

During user presses application program to be encrypted with the first duration, the first current finger print figure of the user is obtained Picture, first duration are greater than first threshold；

After obtaining the first current finger print image, prompt to carry out cryptographic operation；And

According to the first of user the input operation, using the first current finger print image as password to described to be encrypted using journey Sequence is encrypted.

2. the encrypting and decrypting method of application program according to claim 1, which is characterized in that the encrypting and decrypting method is also Include:

During the user has encrypted application program with the pressing of the second duration, the second current finger print of the user is obtained Image, second duration are greater than second threshold；

In the second current finger print image and the password match, decryption is described to have encrypted application program.

3. the encrypting and decrypting method of application program according to claim 1, which is characterized in that the encrypting and decrypting method is also Include:

During the user has encrypted application program with the pressing of third duration, the second current finger print of the user is obtained Image, the third duration are greater than third threshold value；

In the second current finger print image and the password match, the operation for delete the password is prompted；And

According to the second of user the input operation, by the password delete with by it is described encrypted application program and be changed to unencryption answer Use program.

4. the encrypting and decrypting method of application program according to claim 1, which is characterized in that the encrypting and decrypting method is also Include:

Obtain the pressing position of user；

When the application program corresponding with the pressing position is unencryption application program, the acquisition user is executed The first current finger print image the step of.

5. the encrypting and decrypting method of application program according to claim 2 or 3, which is characterized in that the encrypting and decrypting side Method further include:

Obtain the pressing position of user；And

It is to have encrypted application program in the application program corresponding with the pressing position, executes the acquisition user's The step of second current finger print image.

6. the encrypting and decrypting method of application program according to claim 1, which is characterized in that the encrypting and decrypting method is also Include:

Verify the fingerprint image whether the first current finger print image belongs to the authorized user of electronic equipment；And

If so, executing the step of prompt carries out cryptographic operation.

7. a kind of electronic equipment, which is characterized in that the electronic equipment includes:

Fingerprint recognition mould group, during user presses application program to be encrypted with the first duration, the fingerprint recognition mould group The first current finger print image of the user is obtained, first duration is greater than first threshold；

Display module, the fingerprint recognition mould group are located in the display area of the display module, current obtaining described first After fingerprint image, the display module carries out cryptographic operation for prompting；And

Processor, the processor be used for according to the first of user input operate, using first fingerprint image as password with The application program to be encrypted is encrypted.

8. electronic equipment according to claim 7, which is characterized in that

During the user has encrypted application program with the pressing of the second duration, the fingerprint recognition mould group obtains the use The second current finger print image at family, second duration are greater than second threshold；

The processor is also used in the second current finger print image and the password match, and decryption is described to have encrypted application Program.

9. electronic equipment according to claim 7, which is characterized in that

During the user has encrypted application program with the pressing of third duration, the fingerprint recognition mould group obtains the use The second current finger print image at family, the third duration are greater than third threshold value；

The display module is also used in the second current finger print image and when the password match, prompt to be deleted described in The operation of password；And

The processor is also used to be deleted the password to have encrypted described using journey according to the second of user the input operation Sequence is changed to unencryption application program.

10. electronic equipment according to claim 7, which is characterized in that the electronic equipment further include:

Touch module, the touch module are used to obtain the pressing position of user；

When the application program corresponding with the pressing position is unencryption application program, the fingerprint recognition mould group is obtained The first current finger print image.

11. electronic equipment according to claim 8 or claim 9, which is characterized in that the electronic equipment further include:

Touch module, the touch module are used to obtain the pressing position of user；And

When the application program corresponding with the pressing position is to have encrypted application program, the fingerprint recognition mould group is obtained The second current finger print image.

12. electronic equipment according to claim 7, which is characterized in that the processor is also used to verify described first and works as Whether preceding fingerprint image belongs to the fingerprint image of the authorized user of the electronic equipment；If the first current finger print image belongs to The fingerprint image of the authorized user of the electronic equipment, the display module prompt carry out cryptographic operation.

13. electronic equipment according to claim 7, which is characterized in that the display module include opposite display surface and Bottom surface, the fingerprint recognition mould group are arranged between the display surface and the bottom surface, and the fingerprint recognition mould group includes photosensitive Layer and collimation unit, the collimation unit offer light hole, and the photosensitive layer is for receiving the imaging including target optical signal Optical signal is to form imaging electric signal, after the target optical signal successively passes through the display surface and the light hole, reaches institute State photosensitive layer；The display module further includes noise obtaining module, and the noise obtaining module is for obtaining the electronic equipment Interior noise signal；The processor obtains the first current finger print figure according to the imaging electric signal and the noise signal Picture.

14. electronic equipment according to claim 7, which is characterized in that the fingerprint recognition mould group is capacitance type fingerprint mould Group, the display module include display screen, cover board and colloid, and the colloid is for bonding the cover board, the capacitance type fingerprint Mould group and the display screen.

15. a kind of non-volatile computer readable storage medium storing program for executing comprising computer-readable instruction, which is characterized in that the calculating When machine readable instruction is executed by processor, so that the processor perform claim requires encrypting and decrypting described in 1-6 any one Method.