CN110277511A - A kind of OLED device and its processing method of included external cabling - Google Patents
A kind of OLED device and its processing method of included external cabling Download PDFInfo
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- CN110277511A CN110277511A CN201810053694.3A CN201810053694A CN110277511A CN 110277511 A CN110277511 A CN 110277511A CN 201810053694 A CN201810053694 A CN 201810053694A CN 110277511 A CN110277511 A CN 110277511A
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- ito
- oled device
- conductive layer
- external cabling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to Organic Light Emitting Diode technical fields, disclose the OLED device and its processing method of a kind of included external cabling.It prepares OLED luminescent device on substrate using vacuum coating, and continuously prepares the anode external circuit of large-area OLEDs illumination panel device, faceplate cathode wiring is then realized using the electric conductivity of the etched line and ITO itself on the surface ITO.Without separately setting external cabling making apparatus and process, the preparation cost of OLED device is greatly reduced, while improving and preparing yield.The metal electrode of OLED device optimizes the conductive path of the surface face plate anode ITO and electrode, reduces the influence due to ITO sheet resistance to driving voltage.External cabling and the metal electrode of formation are deposited in OLED device, the connection of route is not necessarily to scolding tin, has more preferably electric conductivity.Compared to existing external cabling scheme, operating procedure step of the invention is few, and yield is high, and at low cost, controllability is strong, it is easy to accomplish.
Description
Technical field
The present invention relates to Organic Light Emitting Diode (OLED) lighting technical field more particularly to a kind of included external cablings
OLED luminescent device processing method.
Background technique
Recently, Organic Light Emitting Diode (Organic Light Emitting Diodes, OLED) cause scientific research circle and
The extensive concern of industrial circle.As a kind of area source, OLED has flexible, environmental protection, frivolous, low temperature, low-power consumption and eyeshield
The advantages that.In other words, the application prospect of OLED illumination is huge, it is expected to the mainstream as future illumination.
Currently, preparing big face to reduce influence of the ITO sheet resistance to large-area OLEDs illumination panel luminescent properties
Product (5*10cm2) OLED illumination panel during, it will usually pass through the external pressing route or the netted gold of photoetching of FPC soft board
Belong to auxiliary electrode, to reduce the power consumption of panel, promotes the efficiency of panel and the uniformity that panel is luminous.Both schemes, can be with
Influence of the ITO sheet resistance to device performance is effectively reduced, but during the preparation process, net metal auxiliary electrode needs light
Carve equipment, FPC wiring board needs to prepare FPC wiring board and press equipment, from certain for, this undoubtedly considerably increases OLED photograph
The preparation cost of funerary objects part.Secondly as both schemes increase the preparation section of OLED illumination panel in preparation processing,
Therefore the processing yield of OLED illumination panel can also be had adverse effect on.
Summary of the invention
Technical problem to be solved by the invention is to provide the OLED device and its processing method of a kind of included external cabling,
With overcome the deficiencies in the prior art.
In order to solve the above technical problems, present invention firstly provides a kind of processing sides of the OLED device of included external cabling
Method, comprising steps of
Position on ito anode layer close to substrate side etches a whole etched line, and the bottom of the etched line is supported
Up to substrate, the ITO conductive layer of etched line two sides is made to be separated into the first ITO conductive layer block and the second ITO conductive layer block, described second
ITO conductive layer block is located at substrate side；
ITO substrate after etching is fixed on specimen holder, is blocked using mask plate, in the first ITO conductive layer block
Organic luminous layer is deposited in upper selected light emitting region and the etched line.
It is blocked using mask plate, gold is deposited on the organic luminous layer and on the second ITO conductive layer block of part
Belonging to cathode layer, the substrate etching line is filled by organic layer, can effectively be separated metal Al electrode and the first ITO conductive layer,
Prevent OLED device short-circuit；Secondly, etch areas lacks device anode, therefore do not shine.
Blocked using mask plate, on the first ITO conductive layer block in addition to the etched line along week, sun is deposited out
Pole external connection film；
The metal cathode layer, organic luminous layer and part the first ITO conductive layer block are encapsulated with encapsulated layer, it is described
Anode external connection film, part the second ITO conductive layer block arrive the OLED device except the encapsulated layer.
Preferably, ITO substrate is respectively placed in deionized water-second before etched line by etching on ito anode layer
Ultrasound, O-zone processing in alcohol-acetone, to obtain clean substrate.
Preferably, the evaporation metal of the anode external connection film is that Cu, Ag, Al, Au or Fe have excellent conductive capability
Good conductor.
Preferably, the specimen holder is equipped with mask plate mounting groove and fixture, and the mask plate of different patterns passes through the peace
Tankage is slidably mounted on the specimen holder, and the fixture is used to mask plate being fixed on the specimen holder.Steaming sample
In coating apparatus under conditions of holding position, different mask plates is only needed to change, so that it may carry out the vapor deposition of different vapor deposition layers.This
Sample realizes the accurate control of vapor deposition area without repeatedly taking out sample.The specimen holder is easy to operate, both can be applied to reality
Research and development are tested, can also be applied to the volume production of industry.
Preferably, the specimen holder is equipped with multiple samples and window is deposited, and can disposably process multiple samples.
Preferably, the large-area OLEDs illumination panel needs to be arranged cathode according to the specification of product in encapsulation process
The reserved location of external electrode.Compared to existing external cabling scheme, the program have flexible operability and it is higher can
Control property.
The OLED device of the obtained included external cabling of the processing method of the OLED device of above-mentioned included external cabling,
Position on ito anode layer close to substrate side is etched with a whole etched line, and the bottom of the etched line is arrived at substrate, carved
The ITO conductive layer of corrosion line two sides is separated into the first ITO conductive layer block and the second ITO conductive layer block, second ITO conductive layer
Block is located at substrate side；External wiring of the anode external connection film as OLED device anode；Portion except the encapsulated layer
Divide the second ITO conductive layer block due to conductive, the external cabling as connection OLED device cathode.
Preferably, the metal of the metal cathode layer is Al, has excellent conductive capability.
Preferably, the anode external connection film with a thickness of 500-600nm.
Preferably, the large-area OLEDs illumination panel is flexible panel or glass panel, the substrate material depending on device
Matter.The substrate may be selected to be glass, PET, TPU or double-sided adhesive.
By above-mentioned process, the OLED device of complete uniform and low-power consumption the included external cabling that shines can be obtained
Part.The OLED device is all made of continuous vacuum coating process, is not necessarily to from substrate, panel and the production of external cabling
Separately plus equipment and process flow, greatly reduce the preparation cost of OLED luminescent panel, it is good to improve preparing for oled panel
Rate.The metal electrode of the OLED device optimizes the conductive path of the surface face plate anode ITO and electrode, can reduce due to
Influence of the ITO sheet resistance to driving voltage.Further, external cabling and the metal of formation are deposited in the OLED device
The connection of electrode, route is not necessarily to scolding tin, has more electric conductivity.It is of the invention compared to existing external cabling scheme
Operating procedure step is few, and yield is high, and at low cost, controllability is strong, it is easy to accomplish.
Detailed description of the invention
Technical solution of the present invention is further described in detail with reference to the accompanying drawings and detailed description.
Fig. 1 is OLED illuminating device principle schematic diagram in the present invention.
Fig. 2 is the schematic top plan view of complete OLED illumination panel in the present invention.
Fig. 3 is Fig. 2 from A-A ' to the schematic cross-section after splitting.
Fig. 4 is specimen holder schematic diagram in the present invention.
Fig. 5 is clamp detail schematic diagram in specimen holder of the present invention.
Fig. 6 is the mask plate J1 in the present invention.
Label is respectively as follows:
101: substrate material；102:ITO conductive layer；103: organic luminous layer；104: metal cathode layer；201:ITO substrate
Etched line；202: external anode wiring metal film plating layer；204: encapsulation cover plate；205: device light emitting region；301: sample cell；
302: exposure mask clamp；303: fixed screw；304: mask plate guide rail；401:J1 mask plate OLED device baffle；403: vapor deposition
The hollow out item of OLED anode external metallic circuit.
Specific embodiment
The principle schematic diagram of OLED device of the invention as shown in Figure 1, include substrate material 101 from bottom to up,
ITO conductive layer 102, organic luminous layer 103 and metal cathode layer 104.The substrate material 101 of present embodiment is ito glass lining
Bottom, the luminescent device of substrate center, the external anode link electrode of substrate perimeter, encapsulation cover plate and packaging plastic above device.
The size of ito glass substrate is 6*11cm in this example2。
The processing method of the OLED device of the included external cabling of present embodiment, comprising steps of
In conjunction with shown in Fig. 2,3, the position on ito anode layer close to substrate side etches a whole etched line 201, carves
Substrate 101 is arrived in the bottom of corrosion line 201, makes the ITO conductive layers apart of 201 two sides of etched line at the first ITO conductive layer block 105
With the second ITO conductive layer block 106, the second ITO conductive layer block is located at substrate side；
Sample is placed respectively with half an hour ultrasonic in deionized water-ethanol-acetone, and it is then small with O-zone half
When to obtain clean substrate.
ITO substrate is fixed in the sample cell 301 on specimen holder, ITO by specimen holder as shown in Figure 4 by adhesive tape etc.
It is conductive face-down.As shown in connection with fig. 5, mask plate is passed through the sliding push-in sample of mask plate guide rail 304 by the mask plate for selecting adaptation
In frame, mask plate guide rail and mask plate are respectively positioned on the lower section of sample cell 301.The end of mask plate guide rail 304 is equipped with exposure mask clamp bar
Tool 302 and fixed screw 303 after mask plate is completely installed to position, adjust fixed screw 303 to adjust exposure mask clamp 302
Tightness fixes mask plate.Make sample in evaporated device under conditions of holding position, only needs to change different exposure masks
Version, so that it may carry out the vapor deposition of different vapor deposition layers.In this way, realizing the accurate control of vapor deposition area without repeatedly taking out sample.Institute
The specimen holder stated is easy to operate, both can be applied to experiment research and development, can also be applied to the range production of industry.Specimen holder is equipped with more
Window is deposited in a sample, can disposably process multiple samples.
It is blocked using mask plate, the light emitting region selected on the first ITO conductive layer block 105 and etch areas 201 are deposited
Organic luminous layer 103；
One piece of mask plate is replaced, is blocked using mask plate, on organic luminous layer 103 and the second ITO conductive layer of part
Evaporation metal cathode layer 104 on block 106.The metal film deposited in etched line 201 is covered on organic matter.Metal cathode layer 104
Metal be Al, have excellent conductive capability.It, can be effectively by metal since the etched line 201 on substrate is filled by organic layer
Al electrode is separated with the first ITO conductive layer, prevents OLED device short-circuit；Secondly, etched line lacks device anode, Gu Keshixianqu
Domain does not shine.
Mask plate is replaced again, as shown in fig. 6, mask plate J1 is equipped with OLED device baffle 401 and vapor deposition OLED anode
The hollow out item 403 of external metallization route.The width of hollow out item 403 is 3mm on mask plate J1.It is blocked using mask plate J1,
On one ITO conductive layer block in addition to etched line along week, an anode external connection film 202 is deposited out；The steaming of anode external connection film
Plating metal is the good conductor that Cu, Ag, Al, Au or Fe have excellent conductive capability.Anode external connection film with a thickness of 500-
600nm。
With organic resin encapsulated layer by the first ITO conductive layer block of metal cathode layer 104, organic luminous layer 103 and part
105 encapsulation, anode external connection film 202, part the second ITO conductive layer block 106 are except encapsulated layer 204.Obtained OLED device
Part is as shown in Figure 2,3, and 205 directions are the device light emitting regions formed after encapsulating.
The OLED device of the obtained included external cabling of the processing method of this OLED device, anode external connection film conduct
The external wiring of OLED device anode；The 2nd ITO conductive layer block of part except encapsulated layer is due to conductive, as even
The external cabling for connecing OLED device cathode is connect with metallic cathode film layer 104.As shown in Fig. 2, the outside of OLED illumination panel connects
Line anode external route as composed by the anode external connection film 202 for being located at three sides passes through Al metallic cathode film layer 104 certainly
The cathode circuit of body conduction.Electronics can effectively be imported the cathode of OLED luminescent device by the second ITO conductive layer block.Anode is external
Line film 202 and the first ITO conductive layer block are interconnected, and hole can effectively be connected.
Specification of the OLED illumination panel in encapsulation process according to product needs to be arranged the reserved place of the external electrode of cathode
It sets.Compared to existing external cabling scheme, the program has flexible operability and higher controllability.
The present invention is applied to the outside of large-area OLEDs illuminating device using evaporation coating technique common in OLED luminescent device
Wiring.Wherein, OLED luminescent device can be not only prepared on substrate using vacuum coating, but also prepare large-area OLEDs illumination simultaneously
The anode external circuit of panel device.External circuit is controlled by mask plate, has very high controllability.In order to avoid steaming
Influence of the external cabling metallic diaphragm to OLED luminescent device is plated, designed mask plate is set up in OLED device area portions
One difference in height, no OLED device on the part that mask plate is contacted with sample, realizes envelope as with encapsulation cover plate contact surface
Dress.Secondly, faceplate cathode wiring is then realized using the electric conductivity of the etched line and ITO itself on the surface ITO.OLED illuminated area
The external cabling of plate is more demanding to the alignment of position, in order to realize that accurate position control, the present invention devise specimen holder,
Pass through the different mask plate of sliding plug under the premise of not taking sample, keeps the position of sample in vapor deposition process fixed, it is real
It does not sample now and completes the processing of OLED illumination panel, avoid sampling, setting-out bring sample displacement repeatedly to the full extent and made
At mismachining tolerance.Therefore, the present invention has operating procedure step few, and yield is high, and at low cost, controllability is strong, it is easy to accomplish
Advantage.The experimental results showed that with this solution prepared external cabling can by ITO surface point and external electrode and ITO
The resistance of substrate surface point is reduced to the range of 9.8-12 Ω from the range of 14-30 Ω, and luminous intensity is in the last point of panel
Difference is maintained at 800cd/m2Within.
It should be noted last that the above specific embodiment is only used to illustrate the technical scheme of the present invention and not to limit it,
Although being described the invention in detail referring to preferred embodiment, those skilled in the art should understand that, it can be right
Technical solution of the present invention is modified or replaced equivalently, without departing from the spirit and scope of the technical solution of the present invention,
It is intended to be within the scope of the claims of the invention.
Claims (10)
1. a kind of processing method of the OLED device of included external cabling, which is characterized in that comprising steps of
Position on ito anode layer close to substrate side etches a whole etched line, and lining is arrived in the bottom of the etched line
Bottom makes the ITO conductive layer of etched line two sides be separated into the first ITO conductive layer block and the second ITO conductive layer block, the 2nd ITO
Conductive layer block is located at substrate side；
ITO substrate after etching is fixed on specimen holder, is blocked using mask plate, is selected on the first ITO conductive layer block
Organic luminous layer is deposited in fixed light emitting region and the etched line；
It is blocked using mask plate, evaporation metal yin on the organic luminous layer and on the second ITO conductive layer block of part
Pole layer；
Blocked using mask plate, on the first ITO conductive layer block in addition to the etched line along week, be deposited out outside anode
Wiring film；
The metal cathode layer, organic luminous layer and part the first ITO conductive layer block are encapsulated with organic resin encapsulated layer,
The anode external connection film, part the second ITO conductive layer block are except the encapsulated layer.
2. the processing method of the OLED device of included external cabling according to claim 1, which is characterized in that in ITO sun
ITO substrate is respectively placed in deionized water-ethanol-acetone at ultrasonic, O-zone by etching before etched line on the layer of pole
Reason, to obtain clean substrate.
3. the processing method of the OLED device of included external cabling according to claim 1, which is characterized in that the anode
The evaporation metal of external connection film is the good conductor that Cu, Ag, Al, Au or Fe have excellent conductive capability.
4. the processing method of the OLED device of included external cabling according to claim 1, which is characterized in that the sample
Frame is equipped with mask plate mounting groove and fixture, and the mask plate of different patterns is slidably mounted on the specimen holder by the mounting groove
On, the fixture is used to mask plate being fixed on the specimen holder.
5. the processing method of the OLED device of included external cabling according to claim 1, which is characterized in that the sample
Frame is equipped with multiple samples and window is deposited, for disposably processing multiple OLED device samples.
6. the processing method of the OLED device of included external cabling according to claim 1, which is characterized in that the big face
Specification of the product OLED illumination panel in encapsulation process according to product needs to be arranged the reserved location of the external electrode of cathode.
7. a kind of OLED device of included external cabling obtained according to claim 1, which is characterized in that leaned on ito anode layer
The position of nearly substrate side is etched with a whole etched line, and substrate, the ITO of etched line two sides are arrived in the bottom of the etched line
Conductive layers apart is located at substrate side at the first ITO conductive layer block and the second ITO conductive layer block, the second ITO conductive layer block；
External wiring of the anode external connection film as OLED device anode；The 2nd ITO of part except the encapsulated layer is led
External cabling of the electric layer block due to conductive, as connection OLED device cathode.
8. the OLED device of included external cabling according to claim 7, which is characterized in that the gold of the metal cathode layer
Belonging to is Al.
9. the OLED device of included external cabling according to claim 7, which is characterized in that the anode external connection film
With a thickness of 500-600nm.
10. the OLED device of included external cabling according to claim 7, which is characterized in that the large-area OLEDs shine
Bright panel is flexible panel or glass panel, the substrate material depending on device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053694.3A CN110277511A (en) | 2018-01-19 | 2018-01-19 | A kind of OLED device and its processing method of included external cabling |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810053694.3A CN110277511A (en) | 2018-01-19 | 2018-01-19 | A kind of OLED device and its processing method of included external cabling |
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| CN110277511A true CN110277511A (en) | 2019-09-24 |
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| CN201810053694.3A Pending CN110277511A (en) | 2018-01-19 | 2018-01-19 | A kind of OLED device and its processing method of included external cabling |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498047A (en) * | 2002-10-21 | 2004-05-19 | 国际商业机器公司 | Organic electroluminescence device and its making method and organic electroluminescence display device |
| CN1759638A (en) * | 2003-03-10 | 2006-04-12 | 日本板硝子株式会社 | Display panel and method of manufacturing the same |
| JP2008181832A (en) * | 2007-01-26 | 2008-08-07 | Matsushita Electric Works Ltd | Organic electroluminescnet light emitting device and lighting apparatus |
| CN101276882A (en) * | 2007-03-28 | 2008-10-01 | 中国科学院微电子研究所 | Organic electroluminescent element and manufacturing method thereof |
| CN101536608A (en) * | 2006-09-07 | 2009-09-16 | 法国圣-戈班玻璃公司 | Substrate for an organic light-emitting device, use and process for manufacturing this substrate, and organic light-emitting device |
-
2018
- 2018-01-19 CN CN201810053694.3A patent/CN110277511A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498047A (en) * | 2002-10-21 | 2004-05-19 | 国际商业机器公司 | Organic electroluminescence device and its making method and organic electroluminescence display device |
| CN1759638A (en) * | 2003-03-10 | 2006-04-12 | 日本板硝子株式会社 | Display panel and method of manufacturing the same |
| CN101536608A (en) * | 2006-09-07 | 2009-09-16 | 法国圣-戈班玻璃公司 | Substrate for an organic light-emitting device, use and process for manufacturing this substrate, and organic light-emitting device |
| JP2008181832A (en) * | 2007-01-26 | 2008-08-07 | Matsushita Electric Works Ltd | Organic electroluminescnet light emitting device and lighting apparatus |
| CN101276882A (en) * | 2007-03-28 | 2008-10-01 | 中国科学院微电子研究所 | Organic electroluminescent element and manufacturing method thereof |
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Application publication date: 20190924 |