CN110272614A - A kind of composite heat-conducting high molecular material - Google Patents
A kind of composite heat-conducting high molecular material Download PDFInfo
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- CN110272614A CN110272614A CN201910649888.4A CN201910649888A CN110272614A CN 110272614 A CN110272614 A CN 110272614A CN 201910649888 A CN201910649888 A CN 201910649888A CN 110272614 A CN110272614 A CN 110272614A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Abstract
The invention discloses a kind of composite heat-conducting high molecular materials, heat filling and high molecular material matrix including surface modification, it is calculated by mass percentage, wherein, the heat filling content of surface modification is 0.1-70%, and wherein the face finish material of heat filling is the pi-conjugated polymer such as Polyaniline and its derivative, polyparaphenylene and its derivative, poly-phenylene vinylene (ppv) and its derivative, polythiophene and its derivative, polypyrrole and its derivative, polyparaphenylene's benzothiazole and its derivative.Using itself having the material of heating conduction to modify heat filling surface, interface resistance is effectively reduced, heat transfer efficiency is improved, to enhance the heating conduction of composite material.
Description
Technical field
The invention belongs to technical field of polymer materials more particularly to a kind of composite heat-conducting high molecular materials.
Background technique
With the development of integrated technology, microelectronic packaging technology and high power device, electronic component and electronic equipment are to small
Type and miniaturization, heat caused by electronic equipment accumulate rapidly increase, directly result in electronic equipment hot(test)-spot temperature
The increase with thermal stress is increased, functional reliability and service life to electronic device cause to seriously threaten.Therefore effective to dissipate
Heat is most important to the stability of electronic equipment, and just to the performance of electronic package material, more stringent requirements are proposed for this.
Since polymer material has the characteristics that simple light-weight, preparation process, insulation and inexpensive encapsulates in hyundai electronics
There is very important status in.However the heating conduction of polymer itself is very poor, is unable to satisfy electronic equipment to heat dissipation
Demand.Improving polymer material heat-conductive characteristic, commonly cost-effective method is to add thermally conductive fill out in the polymeric material
Material, common filler has metal material, carbon material and ceramic material, wherein graphene, carbon nanotube and boron nitride because with compared with
High theoretical thermal coefficient and be concerned.But they relatively have the promotion of polymer material heating conduction in practical applications
Limit, this is because heat filling and macromolecule matrix storeroom are there is higher interface resistance, the presence of interface resistance influences
Phonon transmitting thereby reduces heat conduction efficiency.
Summary of the invention
The object of the invention is to remedy the disadvantages of known techniques, provides a kind of composite heat-conducting high molecular material.
In order to achieve the above purpose, the present invention the following technical schemes are provided:
A kind of composite heat-conducting high molecular material, the heat-conducting polymer material include the heat filling and macromolecule material of surface modification
Expect matrix, be calculated by mass percentage, wherein the heat filling content of surface modification is 0.1-70%.
Preferably, the heat filling of the surface modification is graphene, carbon nanotube and boron nitride.
Preferably, the coating material of the heat filling of the surface modification is Polyaniline and its derivative, gathers to benzene
Support and its derivative, poly-phenylene vinylene (ppv) and its derivative, polythiophene and its derivative, polypyrrole and its derivative gather to benzene
Support the pi-conjugated polymer such as benzothiazole and its derivative.
Preferably, the high molecular material matrix is epoxy resin, polyimides and organosilicon material.
Further, the ratio of coating material and filler is 10:0.01-1 in the heat filling of the surface modification:
1。
The invention has the advantages that
The present invention, which passes through, is attached to heat filling surface for the high molecular material with heating conduction, effectively reduces interface heat
Resistance, improves phonon thermal conduction free path, to improve the heat conduction efficiency of composite material.
Specific embodiment
Below in conjunction with specific example, technical scheme is described further:
A kind of composite heat-conducting high molecular material, the heat-conducting polymer material include the heat filling and macromolecule material of surface modification
Expect matrix, be calculated by mass percentage, wherein the heat filling content of surface modification is 0.1-70%.
The heat filling of the surface modification is graphene, carbon nanotube and boron nitride.
The coating material of the heat filling of the surface modification is Polyaniline and its derivative, polyparaphenylene and its spreads out
Biology, poly-phenylene vinylene (ppv) and its derivative, polythiophene and its derivative, polypyrrole and its derivative, polyparaphenylene's benzo thiophene
The pi-conjugated polymer such as azoles and its derivative.
The high molecular material matrix is epoxy resin, polyimides and organosilicon material.
The ratio of coating material and filler is 10:0.01-1:1 in the heat filling of the surface modification.
Embodiment 1
It is in mass ratio the ratio of 10:9:0.1 by epoxy resin JY-257, curing agent modified methyl tetrahydro phthalic anhydride and promotor 2-
Ethyl -4-methylimidazole is uniformly mixed, and poly- (3- hexyl thiophene) (P3HT) modified graphene (MG) is then distributed to wherein (MG
Mass ratio with P3HT is 10:0.1, mass percentage 19%), bubble removing is sufficiently stirred under vacuum conditions, finally will
Mixture heats 4 hours to get P3HT@MG/ ring at heating 2 hours, 150 DEG C at successively heating 3 hours, 110 DEG C at 90 DEG C
Oxygen resin compounded Heat Conduction Material is 1.02Wm through conductometer heat conducting coefficient measuring-1k-1。
Embodiment 2
It is in mass ratio the ratio of 10:9:0.1 by epoxy resin JY-257, curing agent modified methyl tetrahydro phthalic anhydride and promotor 2-
Ethyl -4-methylimidazole is uniformly mixed, and poly- (3- hexyl thiophene) (P3HT) modified graphene (MG) is then distributed to wherein (MG
Mass ratio with P3HT is 10:0.5, mass percentage 21%), bubble removing is sufficiently stirred under vacuum conditions, finally will
Mixture heats 4 hours to get P3HT@MG/ ring at heating 2 hours, 150 DEG C at successively heating 3 hours, 110 DEG C at 90 DEG C
Oxygen resin compounded Heat Conduction Material is 1.23 Wm through conductometer heat conducting coefficient measuring-1k-1。
Embodiment 3
It is in mass ratio the ratio of 10:9:0.1 by epoxy resin JY-257, curing agent modified methyl tetrahydro phthalic anhydride and promotor 2-
Ethyl -4-methylimidazole is uniformly mixed, and poly- (3- hexyl thiophene) (P3HT) modified graphene (MG) is then distributed to wherein (MG
Mass ratio with P3HT is 10:1, mass percentage 24%), bubble removing is sufficiently stirred under vacuum conditions, will finally mix
It closes and heats 4 hours at heating 2 hours, 150 DEG C at object successively heats 3 hours, 110 DEG C at 90 DEG C to get P3HT@MG/ epoxy
Resin compounded Heat Conduction Material is 1.02 Wm through conductometer heat conducting coefficient measuring-1k-1。
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (5)
1. a kind of composite heat-conducting high molecular material, which is characterized in that the heat-conducting polymer material includes the thermally conductive of surface modification
Filler and high molecular material matrix, are calculated by mass percentage, wherein the heat filling content of surface modification is 0.1-70%.
2. composite heat-conducting high molecular material according to claim 1, which is characterized in that the thermally conductive of the surface modification is filled out
Material is graphene, carbon nanotube and boron nitride.
3. composite heat-conducting high molecular material according to claim 1, which is characterized in that the thermally conductive of the surface modification is filled out
The coating material of material is Polyaniline and its derivative, polyparaphenylene and its derivative, poly-phenylene vinylene (ppv) and its derivative, gathers
The pi-conjugated polymer such as thiophene and derivatives, polypyrrole and its derivative, polyparaphenylene's benzothiazole and its derivative.
4. composite heat-conducting high molecular material according to claim 1, which is characterized in that the high molecular material matrix is
Epoxy resin, polyimides and organosilicon material.
5. composite heat-conducting high molecular material according to claim 1, which is characterized in that the thermally conductive of the surface modification is filled out
The ratio of coating material and filler is 10:0.01-1:1 in material.
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| CN201910649888.4A CN110272614A (en) | 2019-07-18 | 2019-07-18 | A kind of composite heat-conducting high molecular material |
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| CN201910649888.4A CN110272614A (en) | 2019-07-18 | 2019-07-18 | A kind of composite heat-conducting high molecular material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022207695A1 (en) | 2021-03-30 | 2022-10-06 | Cambridge Display Technology Ltd. | Thermally conductive composition |
| CN115246994A (en) * | 2021-12-31 | 2022-10-28 | 浙江师范大学 | Heat conduction-wave absorption integrated flexible material and preparation method and application thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022207695A1 (en) | 2021-03-30 | 2022-10-06 | Cambridge Display Technology Ltd. | Thermally conductive composition |
| CN115246994A (en) * | 2021-12-31 | 2022-10-28 | 浙江师范大学 | Heat conduction-wave absorption integrated flexible material and preparation method and application thereof |
| CN115246994B (en) * | 2021-12-31 | 2024-04-05 | 浙江师范大学 | Heat conduction-wave absorption integrated flexible material and preparation method and application thereof |
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Application publication date: 20190924 |