CN110272611A - A kind of preparation method of Heat Conduction Material - Google Patents
A kind of preparation method of Heat Conduction Material Download PDFInfo
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- CN110272611A CN110272611A CN201810207156.5A CN201810207156A CN110272611A CN 110272611 A CN110272611 A CN 110272611A CN 201810207156 A CN201810207156 A CN 201810207156A CN 110272611 A CN110272611 A CN 110272611A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
Abstract
The embodiment of the present invention provides a kind of preparation method of Heat Conduction Material, is related to technical field of material.Method includes: that MAX phase material or Mxene phase material are ground to the powder that partial size is not higher than 40 μm, it is 2.5% powder, 40% curing agent, 40% polymer and 50% N by mass fraction, the mixing of N- dimethyl benzylamine, mixed slurry is coated in substrate, successively solidifies 1h, 160 DEG C of solidification 1h at 120 DEG C, 200 DEG C of solidification 2h, it is cooling, substrate is removed, Heat Conduction Material is obtained.Add the good MAX phase material of heating conduction or Mxene phase material, obtained composite material heating conduction and bending is good, it is not easily broken, it is coated at room temperature in substrate surface, avoid the influence of defect and interfacial reaction to thermal conductivity caused by influence and gas of the defect caused by high temperature to thermal conductivity.This method is easy to operate, is suitble to large-scale use.
Description
Technical field
The invention belongs to technical field of material more particularly to a kind of preparation methods of Heat Conduction Material.
Background technique
With the fast development of microelectronic integrated circuit industry, the volume of electronic component and logic circuit is smaller and smaller,
Working frequency sharply increases, and operating temperature tends to high temperature, works normally to guarantee that electronic component is reliable for a long time, heat radiation energy
Power becomes the restraining factors of service life.Traditional Heat Conduction Material is mostly metal and its oxide, nitride ceramics and carbon material.
Wherein, metal and its oxide is resistant to chemical etching, insulation performance and processing performance are poor, is unable to satisfy industrial production and science
The demand of development.The inorganic material such as nitride ceramics have excellent heating conduction and electrical insulation capability, but its scarcity of raw material, plus
The disadvantages of work difficult forming, restricts its development and application.Due to polymer matrix composite easy processing molding, it is resistant to chemical etching,
It light, the features such as electrical insulation capability is excellent, mechanics and anti-fatigue performance are excellent, gradually permeates and plays to thermally conductive field and want emphatically
Effect.
Currently, as thermally conductive polymer composites mainly include the following types: 1, fiber-reinforced polymer-matrix is compound
Material, comprising: continuous fiber, long fibre and chopped strand can be divided into metallic fiber, ceramic fibre and polymerization by fibrous material again
Fibres.2, whisker reinforced polymer based composites, i.e. whisker are micron-sized mono-crystlling fibre material.3, particle enhancing polymerization
Object based composites: such composite material is mainly the addition for passing through the reinforced particulates such as addition BN, C, improves composite material
The performances such as wearability, hardness and corrosion resistance.It is divided by particle size spacing: (1) disperse enhancing composite material；(2) pure particle is multiple
Condensation material；(3) tiny balloon composite material.
But above-mentioned material has the problem that 1, fiber reinforced polymer matrix composite is usually to be higher than environment
It is molding under conditions of temperature (150~300 DEG C).It, can be because of the volume contraction of resin and fiber not when system temperature reduces
Match and cause residual stress, results in internal defect and increase, to affect the heat diffusivity energy of compound.In order to improve fibre
The interlayer of peacekeeping high polymer material and the shear strength at interface, can be handled fiber surface, can make the anti-impact of composite material
Hit performance decline.2, the problem of whisker reinforced polymer based composites is that whisker growth theoretical developments are slower, with experiment
It compares, it is theoretical very not perfect, need further quantification and precision.And since whisker volume is excessively tiny, in process
In easily fracture, be not able to maintain certain draw ratio, be unable to reach ideal reinforcing effect at thermally conductive aspect, heating conduction is poor.
3, the shortcomings that particle enhancing polymer matrix composite is that enhancing particle is easy adsorbed gas during addition, can cause to lack
Sunken and interfacial reaction, leads to the reduction of heating conduction.
Summary of the invention
The present invention provides a kind of preparation method of Heat Conduction Material, it is intended to solve the above problem of existing Heat Conduction Material.
A kind of preparation method of Heat Conduction Material provided by the invention, comprising:
MAX phase material or Mxene phase material are ground to the powder that partial size is not higher than 40 μm；
By mass fraction be 2.5%~20% powder, 20%~40% curing agent, 20%~40% polymerization
Object and 2.5%~50% N, N- dimethyl benzylamine mixing；
Mixed slurry is coated in substrate, successively solidifies 0.5~1h at 100~120 DEG C, 140~160 DEG C solid
Change 1~2h, 180~200 DEG C of 1~2h of solidification, it is cooling, substrate is removed, the Heat Conduction Material is obtained.
A kind of preparation method of Heat Conduction Material provided by the invention, it is good by adding heating conduction in the polymer
MAX phase material or Mxene phase material, obtained composite material heating conduction and bending is good, and toughness is strong, is not easily broken, in room
It can be carried out under the conditions of temperature, avoid influence of the internal flaw caused by high temperature to thermal conductivity, this method passes through in substrate surface
Coating obtains, will not adsorbed gas, avoid the influence of defect caused by gas and interfacial reaction to thermal conductivity.In addition, the party
Method is easy to operate, low in cost, is suitble to large-scale use.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention.
Fig. 1 is the bending test chart for the Heat Conduction Material that the embodiment of the present invention 1 is prepared；
Fig. 2 is the sem test figure for the Heat Conduction Material that the embodiment of the present invention 1 is prepared.
Specific embodiment
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, and not all embodiments.Based on the embodiments of the present invention, those skilled in the art
Member's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of preparation method of Heat Conduction Material, this method comprises:
Step 1: MAX phase material or Mxene phase material are ground to the powder that partial size is not higher than 40 μm；
Step 2: being 2.5%~20% powder, 20%~40% curing agent, 20%~40% by mass fraction
Polymer and 2.5%~50% N, N- dimethyl benzylamine mixing；
Step 3: by mixed slurry be coated on substrate on, successively at 100~120 DEG C solidify 0.5~1h, 140~
160 DEG C of solidifications 1~2h, 180~200 DEG C of 1~2h of solidification, it is cooling, substrate is removed, the Heat Conduction Material is obtained.
A kind of Heat Conduction Material provided by the invention and preparation method, it is good by adding heating conduction in the polymer
MAX phase material or Mxene phase material, obtained composite material heating conduction and bending is good, and toughness is strong, is not easily broken, in room
It can be carried out under the conditions of temperature, avoid influence of the internal flaw caused by high temperature to thermal conductivity, this method passes through in substrate surface
Coating obtains, will not adsorbed gas, avoid the influence of defect caused by gas and interfacial reaction to thermal conductivity.In addition, the party
Method is easy to operate, low in cost, is suitble to large-scale use.
In step 1, it is a kind of good thermal conductivity material that MAX phase material, which is a kind of ternary layered machinable ceramics,
Material, not only antioxygenic property is excellent, also with the traumatic resistance of good thermal shock resistance and height, chemical general formula Mn+ 1AXn, wherein M is transition metal, and A is mainly IIIA and IVA race element, and X is C or N element.Specifically, MAX phase material is
Mo2Ti2AlC3、Ti3SiC2、Ti3AlCN、Ta4AlC3、Ti4AlN3、Mo2Ti2AlC3、Ti3SiC2、Ti4SiC3、V3AlC2、
Nb4AlC3、Ti3GeC2、Ti3SnC2、Ti4AlN3、V4AlC3、Ti4GaC3、Ti4GeC3、(V0.5Cr0.5)3AlC2、(Ti0.5Nb0.5)2AlC and Ta3(Al0.6Sn0.4)C2At least one of.
Mxenes phase material is a kind of New Two Dimensional structural material, chemical general formula Mn+1XnTz, wherein M is transition
Race's metal, such as Ti, Zr, Hf, V, Nb, Ta, Cr, Sc, X are C or/and N element.Mxenes phase material is to utilize hydrochloric acid and fluorination
The mixed solution or HF acid of object will obtain in MAX phase material in conjunction with weaker A bit plain (such as Al atom) extraction, MXenes phase
Material inherits the high-termal conductivity of female race MAX phase material, and thermal conductivity is higher than most metals and semiconductor low-dimensional materials, such as
MoS2 and phosphorus heterocycle, for example, at room temperature, the armchair Sc of 5 μ m thicks2CF2Thermal conductivity be up to 472W/m.K, greatly
In the thermal conductivity (348W/m.K) of silver.Specifically, it is Ti that Mxenes phase material, which is Mxene phase material,3C2、Ti2C、Ti3CN、
TiNbC、Ta4C3、V2C、Nb2C、Nb4C3、Mo2C、Mo2TiC2、Mo2Ti2C3、(Ti0.5Nb0.5)2C、(Ti0.5V0.5)3C2、
(V0.5Nb0.5)4C3(V0.5Cr0.5)3C2At least one of.
Specifically, Mxenes phase material the preparation method comprises the following steps:
MAX phase material powder is added in the aqueous hydrogen fluoride solution that mass fraction is 40~60% at least 1min,
And at least 90h is stirred and kept the temperature under conditions of 50~60 DEG C, it is centrifuged, washing, when the pH of supernatant is greater than 6, filters, remove
Supernatant obtains Mxenes phase material.
Further, before step 1, further includes:
The simple substance of each element in MAX phase material or Mxene phase material is mixed, ball milling at least 10h；
Mixture after ball milling is mixed with MAX phase material or Mxene phase material, and with the heating of 5~10 DEG C/min speed
Rate is heated to 1400~1800 DEG C, and at least 4h is kept the temperature under atmosphere of inert gases, cooling.
Specifically, in step 2, curing agent is maleic anhydride, phthalic anhydride, phenylenediamine, diamino hexichol first
Alkane, diamino diphenyl sulfone, two cyanate ester of bisphenol-A, ethylenediamine, hexamethylene diamine, diethylenetriamine, triethylene tetramine or lignocaine
Any one in propylamine.Polymer is epoxy resin, polyimides, polyethylene terephthalate, polydimethylsiloxanes
Alkane, polyurethane, Kynoar, acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride, polyethylene, polystyrene, poly- third
Alkene, natural rubber, butadiene-styrene rubber, silicon rubber, butadiene rubber, isoprene rubber, neoprene, polymethyl methacrylate, polyamides
Any one in amine, polyformaldehyde or polycarbonate.
Preferably, the mass fraction of MAX phase material or Mxene phase material powder is 2.5~10%, the quality point of curing agent
Number is 20~30%, and the mass fraction of polymer is 10~30% and N, and the mass fraction of N- dimethyl benzylamine is 2.5~10%.
Specifically, in step 3, substrate is copper sheet.The method for removing copper sheet are as follows:
Slurry after cooling will be solidified and be placed in the supersaturated solution of ammonium persulfate and copper sulphate with substrate and stood, until copper
Plate etching finishes.
Optionally, substrate can also be other sheet metals, such as aluminium, iron, zinc or other alloy materials.Removing base
During plate, sheet metal need to be only added in the solution that can etch the above sheet metal.
Embodiment 1
1, Mo, Ti, Al and graphite powder are passed through to the sieve of 250 mesh, 325 mesh, 325 mesh and 300 mesh respectively, in molar ratio for
2 ﹕, 2 ﹕, 1.3 ﹕ 2.7 was mixed in plastic bottle, and with ball-milling method ball milling 18 hours.Take 100gMAX material Mo2Ti2AlC3, 5g is added
The mixture of Mo, Ti, Al and C, and mix powder is placed in the alumina crucible of capping, with the heating rate of 5 DEG C/min
1600 DEG C are heated to, keeps the temperature 4 hours in the argon atmosphere of flowing.After natural cooling, ground using the abrasive drill coated with TiN
Mill, and 400 meshes are crossed, obtain the powder that partial size is lower than 38 μm.
2, the powder obtained in 1 is mixed with the curing agent of 0.76g, shakes 10min, ultrasonic 10min, in 1500r/min
Revolving speed under be stirred under vacuum mixing 5min, removing have bubble, the epoxy resin of 0.7g and the N of 0.076g, N- dimethylbenzyl is added
Amine is stirred under vacuum mixing under the revolving speed of 1500r/min, obtains mixed slurry wherein, and the dosage of powder is system gross mass
2.5wt%.
3, the mixed slurry in 2 is coated in copper foil substrate using No. 6 screw thread coating rods of standard universal, 120
Solidify 1h at DEG C, 160 DEG C of solidification 2h, 200 DEG C of solidification 2h, natural cooling obtain film.Film is cut to strip to be placed in
It etches in ammonium sulfate and copper sulphate supersaturated solution, until copper foil etching finishes, cleans, it is dry, it is thin to obtain MAX/ epoxy resin
Film.
Embodiment 2
1, Mo, Ti, Al and graphite powder are passed through to the sieve of 250 mesh, 325 mesh, 325 mesh and 300 mesh respectively, in molar ratio for
2 ﹕, 2 ﹕, 1.3 ﹕ 2.7 was mixed in plastic bottle, and with ball-milling method ball milling 18 hours.Take 100gMAX material Mo2Ti2AlC3, 5g is added
The mixture of Mo, Ti, Al and C, and mix powder is placed in the alumina crucible of capping, with the heating rate of 5 DEG C/min
1600 DEG C are heated to, keeps the temperature 4 hours in the argon atmosphere of flowing.After natural cooling, ground using the abrasive drill coated with TiN
Mill, and 400 meshes are crossed, obtain the powder that partial size is lower than 38 μm.
2, the powder obtained in 1 is mixed with the curing agent of 0.76g, shakes 10min, ultrasonic 10min, in 1500r/min
Revolving speed under be stirred under vacuum mixing 5min, removing have bubble, the epoxy resin of 0.7g and the N of 0.076g, N- dimethylbenzyl is added
Amine is stirred under vacuum mixing under the revolving speed of 1500r/min, obtains mixed slurry wherein, and the dosage of powder is system gross mass
5wt%.
3, the mixed slurry in 2 is coated in copper foil substrate using No. 6 screw thread coating rods of standard universal, 120
Solidify 1h at DEG C, 160 DEG C of solidification 2h, 200 DEG C of solidification 2h, natural cooling obtain film.Film is cut to strip to be placed in
It etches in ammonium sulfate and copper sulphate supersaturated solution, until copper foil etching finishes, cleans, it is dry, it is thin to obtain MAX/ epoxy resin
Film.
Embodiment 3
1, Mo, Ti, Al and graphite powder are passed through to the sieve of 250 mesh, 325 mesh, 325 mesh and 300 mesh respectively, in molar ratio for
2 ﹕, 2 ﹕, 1.3 ﹕ 2.7 was mixed in plastic bottle, and with ball-milling method ball milling 18 hours.Take 100gMAX material Mo2Ti2AlC3, 5g is added
The mixture of Mo, Ti, Al and C, and mix powder is placed in the alumina crucible of capping, with the heating rate of 5 DEG C/min
1600 DEG C are heated to, keeps the temperature 4 hours in the argon atmosphere of flowing.After natural cooling, ground using the abrasive drill coated with TiN
Mill, and 400 meshes are crossed, obtain the powder that partial size is lower than 38 μm.
2, the powder obtained in 1 is mixed with the curing agent of 0.76g, shakes 10min, ultrasonic 10min, in 1500r/min
Revolving speed under be stirred under vacuum mixing 5min, removing have bubble, the epoxy resin of 0.7g and the N of 0.076g, N- dimethylbenzyl is added
Amine is stirred under vacuum mixing under the revolving speed of 1500r/min, obtains mixed slurry wherein, and the dosage of powder is system gross mass
10wt%.
3, the mixed slurry in 2 is coated in copper foil substrate using No. 6 screw thread coating rods of standard universal, 120
Solidify 1h at DEG C, 160 DEG C of solidification 2h, 200 DEG C of solidification 2h, natural cooling obtain film.Film is cut to strip to be placed in
It etches in ammonium sulfate and copper sulphate supersaturated solution, until copper foil etching finishes, cleans, it is dry, it is thin to obtain MAX/ epoxy resin
Film.
Embodiment 4
1, Mo, Ti, Al and graphite powder are passed through to the sieve of 250 mesh, 325 mesh, 325 mesh and 300 mesh respectively, in molar ratio for
2 ﹕, 2 ﹕, 1.3 ﹕ 2.7 was mixed in plastic bottle, and with ball-milling method ball milling 18 hours.Take 100gMAX material Mo2Ti2AlC3, 5g is added
The mixture of Mo, Ti, Al and C, and mix powder is placed in the alumina crucible of capping, with the heating rate of 5 DEG C/min
1600 DEG C are heated to, keeps the temperature 4 hours in the argon atmosphere of flowing.After natural cooling, ground using the abrasive drill coated with TiN
Mill, and 400 meshes are crossed, obtain the powder that partial size is lower than 38 μm.
2, the powder obtained in 1 is mixed with the curing agent of 0.76g, shakes 10min, ultrasonic 10min, in 1500r/min
Revolving speed under be stirred under vacuum mixing 5min, removing have bubble, the epoxy resin of 0.7g and the N of 0.076g, N- dimethylbenzyl is added
Amine is stirred under vacuum mixing under the revolving speed of 1500r/min, obtains mixed slurry wherein, and the dosage of powder is system gross mass
15wt%.
3, the mixed slurry in 2 is coated in copper foil substrate using No. 6 screw thread coating rods of standard universal, 120
Solidify 1h at DEG C, 160 DEG C of solidification 2h, 200 DEG C of solidification 2h, natural cooling obtain film.Film is cut to strip to be placed in
It etches in ammonium sulfate and copper sulphate supersaturated solution, until copper foil etching finishes, cleans, it is dry, it is thin to obtain MAX/ epoxy resin
Film.
Embodiment 5
1, Mo, Ti, Al and graphite powder are passed through to the sieve of 250 mesh, 325 mesh, 325 mesh and 300 mesh respectively, in molar ratio for
2 ﹕, 2 ﹕, 1.3 ﹕ 2.7 was mixed in plastic bottle, and with ball-milling method ball milling 18 hours.Take 100gMAX material Mo2Ti2AlC3, 5g is added
The mixture of Mo, Ti, Al and C, and mix powder is placed in the alumina crucible of capping, with the heating rate of 5 DEG C/min
1600 DEG C are heated to, keeps the temperature 4 hours in the argon atmosphere of flowing.After natural cooling, ground using the abrasive drill coated with TiN
Mill, and 400 meshes are crossed, obtain the powder that partial size is lower than 38 μm.
2, the powder obtained in 1 is mixed with the curing agent of 0.76g, shakes 10min, ultrasonic 10min, in 1500r/min
Revolving speed under be stirred under vacuum mixing 5min, removing have bubble, the epoxy resin of 0.7g and the N of 0.076g, N- dimethylbenzyl is added
Amine is stirred under vacuum mixing under the revolving speed of 1500r/min, obtains mixed slurry wherein, and the dosage of powder is system gross mass
20wt%.
3, the mixed slurry in 2 is coated in copper foil substrate using No. 6 screw thread coating rods of standard universal, 120
Solidify 1h at DEG C, 160 DEG C of solidification 2h, 200 DEG C of solidification 2h, natural cooling obtain film.Film is cut to strip to be placed in
It etches in ammonium sulfate and copper sulphate supersaturated solution, until copper foil etching finishes, cleans, it is dry, it is thin to obtain MAX/ epoxy resin
Film.
As illustrated in fig. 1 and 2, Fig. 1 and Fig. 2 is the bend test figure and scanning electron microscope for the conductive material that embodiment is prepared
Test chart, as seen from Figure 2, the MAX material Mo in the Heat Conduction Material2Ti2AlC3Stratiform point is distributed as in epoxy resin
Cloth.As seen from Figure 1, the Heat Conduction Material bending and good toughness.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (9)
1. a kind of preparation method of Heat Conduction Material, which is characterized in that the described method includes:
MAX phase material or Mxene phase material are ground to the powder that partial size is not higher than 40 μm；
By mass fraction be 2.5~20% powder, 20~40% curing agent, 20~40% polymer and 2.5~
The mixing of 50% N, N- dimethyl benzylamine；
Mixed slurry is coated in substrate, successively solidifies 0.5~1h, 140~160 DEG C of solidifications 1 at 100~120 DEG C
~2h, 180~200 DEG C of 1~2h of solidification, it is cooling, substrate is removed, the Heat Conduction Material is obtained.
2. the method according to claim 1, wherein by before MAX phase material or the grinding of Mxene phase material, also
Include:
The simple substance of each element in MAX phase material or Mxene phase material is mixed, ball milling at least 10h；
Mixture after ball milling is mixed with MAX phase material or Mxene phase material, and is added with the heating rate of 5~10 DEG C/min
Heat keeps the temperature at least 4h to 1400~1800 DEG C under atmosphere of inert gases, cooling.
3. method according to claim 1 or 2, which is characterized in that MAX phase material is Mo2Ti2AlC3、Ti3SiC2、
Ti3AlCN、Ta4AlC3、Ti4AlN3、Mo2Ti2AlC3、Ti3SiC2、Ti4SiC3、V3AlC2、Nb4AlC3、Ti3GeC2、Ti3SnC2、
Ti4AlN3、V4AlC3、Ti4GaC3、Ti4GeC3、(V0.5Cr0.5)3AlC2、(Ti0.5Nb0.5)2AlC and Ta3(Al0.6Sn0.4)C2In
It is at least one.
4. the method according to claim 1, wherein Mxene phase material is Ti3C2、Ti2C、Ti3CN、TiNbC、
Ta4C3、V2C、Nb2C、Nb4C3、Mo2C、Mo2TiC2、Mo2Ti2C3、(Ti0.5Nb0.5)2C、(Ti0.5V0.5)3C2、(V0.5Nb0.5)4C3With
(V0.5Cr0.5)3C2At least one of.
5. the method according to claim 1, wherein curing agent is maleic anhydride, phthalic anhydride, benzene
Diamines, diaminodiphenylmethane, diamino diphenyl sulfone, two cyanate ester of bisphenol-A, ethylenediamine, hexamethylene diamine, diethylenetriamine, three
Any one in ethylene tetramine or diethylaminopropylamine.
6. the method according to claim 1, wherein polymer is epoxy resin, polyimides, poly- terephthaldehyde
Sour glycol ester, dimethyl silicone polymer, polyurethane, Kynoar, acrylonitrile-butadiene-styrene copolymer, polychlorostyrene second
Alkene, polyethylene, polystyrene, polypropylene, natural rubber, butadiene-styrene rubber, silicon rubber, butadiene rubber, isoprene rubber, neoprene rubber
Any one in glue, polymethyl methacrylate, polyamide, polyformaldehyde or polycarbonate.
7. the method according to claim 1, wherein substrate is copper sheet.
8. the method according to the description of claim 7 is characterized in that the method for removing substrate are as follows:
Slurry after cooling will be solidified and be placed in the supersaturated solution of ammonium persulfate and copper sulphate with substrate and stood, until copper sheet loses
Quarter finishes.
9. according to the method for claim 1 it is characterized in that, Mxenes phase material the preparation method comprises the following steps:
MAX phase material powder is added in the aqueous hydrogen fluoride solution that mass fraction is 40~60% at least 1min, and
At least 90h is stirred and kept the temperature under conditions of 50~60 DEG C, is centrifuged, and washing, when the pH of supernatant is greater than 6, filtering removes supernatant
Liquid obtains Mxenes phase material.
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| CN113278250A (en) * | 2021-03-30 | 2021-08-20 | 上海凌云工业科技有限公司凌云汽车技术分公司 | Ti3SiC2Method for preparing ceramic reinforced composite material |
| CN114280109A (en) * | 2021-12-16 | 2022-04-05 | 电子科技大学 | Bimetal MXene/MoS with in-situ heterogeneous enhancement2Composite film-based nitrogen dioxide sensor and preparation method thereof |
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| CN110628155B (en) * | 2019-09-27 | 2022-01-04 | 中国科学院深圳先进技术研究院 | MXene/metal composite aerogel, preparation method and application thereof, and thermal interface material comprising MXene/metal composite aerogel |
| CN110760189A (en) * | 2019-11-11 | 2020-02-07 | 上海第二工业大学 | Different layer type Ti3C2Filled high-thermal-conductivity silicone grease thermal interface material and preparation method thereof |
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| CN112958127A (en) * | 2021-02-26 | 2021-06-15 | 上海大学材料基因组工程(萍乡)研究院 | Method for loading catalyst on ceramic fiber |
| CN113278250A (en) * | 2021-03-30 | 2021-08-20 | 上海凌云工业科技有限公司凌云汽车技术分公司 | Ti3SiC2Method for preparing ceramic reinforced composite material |
| CN114280109A (en) * | 2021-12-16 | 2022-04-05 | 电子科技大学 | Bimetal MXene/MoS with in-situ heterogeneous enhancement2Composite film-based nitrogen dioxide sensor and preparation method thereof |
| CN114280109B (en) * | 2021-12-16 | 2023-11-24 | 电子科技大学 | In-situ heterogeneous enhanced bimetallic MXene/MoS 2 Composite membrane-based nitrogen dioxide sensor and preparation method thereof |
| CN114940804A (en) * | 2022-04-22 | 2022-08-26 | 厦门稀土材料研究所 | Rare earth-based insulating material and preparation process thereof |
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