CN110257886A - A kind of anode assemblies and its application - Google Patents
A kind of anode assemblies and its application Download PDFInfo
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- CN110257886A CN110257886A CN201910608394.1A CN201910608394A CN110257886A CN 110257886 A CN110257886 A CN 110257886A CN 201910608394 A CN201910608394 A CN 201910608394A CN 110257886 A CN110257886 A CN 110257886A
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- Prior art keywords
- anode
- conducting base
- protective layer
- anode body
- assemblies
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- 238000000429 assembly Methods 0.000 title claims abstract description 60
- 230000000712 assembly Effects 0.000 title claims abstract description 60
- 239000011241 protective layer Substances 0.000 claims abstract description 47
- 238000007747 plating Methods 0.000 claims abstract description 33
- 239000010410 layer Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 12
- 238000002161 passivation Methods 0.000 claims abstract description 12
- 230000003647 oxidation Effects 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 37
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 18
- 229910052738 indium Inorganic materials 0.000 claims description 17
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000011810 insulating material Substances 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 13
- 229910052719 titanium Inorganic materials 0.000 claims description 13
- 239000010936 titanium Substances 0.000 claims description 13
- 229910052697 platinum Inorganic materials 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 8
- 239000010405 anode material Substances 0.000 claims description 7
- 229910052741 iridium Inorganic materials 0.000 claims description 5
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 5
- 239000004809 Teflon Substances 0.000 claims description 4
- 229920006362 Teflon® Polymers 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 3
- 210000000746 body region Anatomy 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical group 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of anode assemblies and its applications.The anode assemblies include conducting base and the anode body on the conducting base, and the surface of the conducting base has protective layer.By the way that protective layer is arranged on conducting base surface; effectively prevent conducting base causes resistance to change since oxidation and passivation occurs in the plating process; the uniformity of circuital current distribution and the stability of electroplating technology are improved, to improve the uniformity of electroplating parts electroplated layer.
Description
Technical field
The present invention relates to a kind of anode assemblies and its applications.
Background technique
In electroplating device, anode has soluble anode and two kinds of insoluble anode.Generally, the anode assemblies of soluble anode
Usually stablize transmission electric current by electrically-conductive backing plate.Anode construction has whole anode and two kinds of segmented anodes, when soluble anode is
When segmented anodes, which is generally also to be segmented, the region of each segmented anodes in each sectional area and anode assemblies
It is corresponding and identical.
When electro-coppering, anode material is usually copper or phosphor-copper.And the material of corresponding electrically-conductive backing plate is usually titanium, platinum, indium
Etc. inactive, conductive materials.When inertia conductive metallic material is titanium, titanium is easy to happen oxidation and passivation in the plating process, is formed
Oxide layer or passivation layer will not voluntarily fall off, and the resistance of each segmented conductive substrate itself will be made to change, makes its resistance
Cannot settle out, and bring simultaneously each segmented conductive substrate own face each point distribution of resistance it is uneven and unstable.
Between each segmented anodes, usually obstructed by insulating materials (such as PTFE).Between the electrically-conductive backing plate being respectively segmented,
Usually obstructed by insulating materials (such as PTFE).These insulating materials are usually linked together, and play the role of insulation and support.
Since in plating, segmented anodes, segmented conductive substrate, electroplate liquid, cathode are mutually conducted, therefore segmentation is led
Electric substrate resistance and its distribution of resistance it is uneven and unstable, it will influence the uneven of the current distribution of entire circuit and
It is unstable, and eventually affect the uneven and unstable of cathode electroplating deposition.
Summary of the invention
The technical problem to be solved by the present invention is to be electroplated for the electrically-conductive backing plate for overcoming the electroplating device of the prior art
It is easy to happen oxidation and passivation in journey, causes the distribution of resistance of electrically-conductive backing plate unevenly and unstable, it is final to influence cathode plating
The uneven and unstable defect of deposition, provides a kind of anode assemblies.
The present invention is to solve above-mentioned technical problem by following technical proposals:
The present invention provides a kind of anode assemblies, the anode assemblies include conducting base and are set on the conducting base
Anode body, the surface of the conducting base has protective layer.
Preferably, the anode assemblies are made of conducting base and the anode body on the conducting base, it is described
The surface of conducting base has protective layer.
In the present solution, the anode assemblies are preferably the anode assemblies for being used for being electroplated.
The material of the conducting base can be the conductive material of this field routine, preferably, the material of the conducting base
For one of titanium, platinum, iridium and indium or a variety of.More preferably, the material of the conducting base is titanium.
In the present solution, described protective layer used in preventing the conducting base surface from oxidation and passivation occurs, material can be led
Electric or non-conductive, those skilled in the art can be configured on the surface of conducting base as needed, as long as energy when specific setting
Inhibit the surface of conducting base that oxidation and passivation occurs.
For example, the protective layer is covered in the conducting base and the anode body when the protective layer is non-conductive
Contact surface except region.
When the protective layer conduction, the protective layer can be covered in the whole surface of the conducting base, can also cover
In part of the surface (such as the area being covered in except the contact surface of the conducting base and the anode body of the conducting base
Domain).
The material of the protective layer is preferably one of inert metal, oxide and insulating materials or a variety of.By
The surface of the conducting base forms protective layer, and the oxidation and passivation on conducting base surface can be effectively prevented.
The inert metal can be this field routine inert metal, preferably, the chemical activity of the inert metal or
The electro-chemical activity conducting base is low, for example, when the material of conducting base is titanium, the material of protective layer can for indium,
One of iridium and platinum are a variety of.More preferably, the inert metal is one of indium, iridium and platinum or a variety of.
Preferably, the inert metal forms inertia gold on the surface of the conducting base by the method for coating or plating
Belong to layer.
The oxide can be the oxide of this field routine, preferably, the oxide is metal oxide, the gold
Belong to the material of the preferably conducting base.More preferably, the oxide is titanium dioxide.
Preferably, the oxide is by the method for Passivation Treatment (such as high-temperature oxydation etc.) or coating in the conductive base
The surface of body forms oxide skin(coating).
The insulating materials can be the insulating materials of this field routine, preferably, the insulating materials is Teflon
(PTFE)。
Preferably, the insulating materials is by the method for spraying or coating in the conducting base and the anode body
Region surface except contact surface forms insulating protective layer.
The thickness of the protective layer can be the general thickness of this field, preferably, the protective layer with a thickness of 0.5~
1.0 micron.
Preferably, the conducting base has one or more perforative holes, prevent the conducting base work in-process from becoming
Shape.
In the present solution, the material of the anode body can be the anode material of this field routine, for example, soluble anode
Material or insolubility anode material, preferably, the material of the anode body is soluble anode material.The soluble sun
Pole material is related with the material of electroplated layer to be formed, such as electro-coppering Shi Weitong or phosphor-copper.
Preferably, the side surface of the anode body also has the protective layer.When the anode body material be can
When dissolubility anode material, those skilled in the art can determine the protective layer in the case where not influencing anode body electrodissolution
Coverage area, such as the lower half portion of anode body side surface is only covered, which, which refers to, contacts side with conducting base, separately
Side is top half.The protective layer thickness of the side surface of the anode body is preferably 0.5~1.0 micron.
In the present solution, the anode assemblies can be able to be for whole anode or segmented anodes, i.e., the quantity of the described anode body
One or more, preferably 6~20.The conducting base is identical as the quantity of the anode body, shape is corresponding.
Preferably, each anode body is mutually not turned on when the quantity of the anode body is multiple.
When the quantity of the anode body is multiple, the volume of each anode body is identical or different.Preferably, every piece of sun
The volume of pole ontology is identical, and the raising efficiency of the better effect being electroplated at this time, i.e. thickness of coating uniformity coefficient is higher.
Preferably, the anode body is arranged mutually and coaxially, wherein position when the quantity of the anode body is multiple
Anode body in center is cylindrical body, and other anode bodies are cyclic structure.
Preferably, the conducting base is connected with the anode body by one or more fasteners, the fastener
Run through or not through the anode body, keeps contact of the conducting base with anode body closer, conducting base and anode body
Between gap can be ignored, usually less than 0.1mm prevents conducting base in the oxidation and passivation of contact surface.
More preferably, the fastener is screw.
More preferably, the quantity of the fastener is 2~6, is generally uniformly distributed.
The conducting base is additionally provided with conductive column, is connect by the conductive column with positive pole, the material of the conductive column
Material can be one of conductive material, such as titanium, platinum and indium of this field routine or a variety of.The material of the conductive column with it is described
Conducting base is identical or different, preferably identical.
Preferably, each conducting base is equipped with 2 conductive columns.
Preferably, the surface of the conductive column has the protective layer.
The present invention also provides application of the anode assemblies described in one kind in plating.
On the basis of common knowledge of the art, above-mentioned each optimum condition, can any combination to get each preferable reality of the present invention
Example.
The positive effect of the present invention is that: by the way that protective layer is arranged on conducting base surface, effectively prevent conduction
Matrix causes resistance to change since oxidation and passivation occurs in the plating process, improves the uniformity of circuital current distribution
With the stability of electroplating technology, to improve the uniformity of electroplating parts electroplated layer.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of 1 anode assemblies of the embodiment of the present invention.
Fig. 2 is the structural schematic diagram of 4 anode assemblies of the embodiment of the present invention.
Fig. 3 is the stereoscopic schematic diagram of 4 anode assemblies of the embodiment of the present invention.
Description of symbols:
1- anode body, 2- conducting base, 3- protective layer, 4- conductive column, 5- fastener.
Specific embodiment
The present invention is further illustrated below by the mode of embodiment, but does not therefore limit the present invention to the reality
It applies among a range.In the following examples, the experimental methods for specific conditions are not specified, according to conventional methods and conditions, or according to quotient
The selection of product specification.
Embodiment 1
As shown in Figure 1, present embodiments providing a kind of anode assemblies for plating, which includes conducting base
2 and the anode body 1 on the conducting base 2, the surface of conducting base 2 has protective layer 3.
In the present embodiment, protective layer 3 is covered in the whole surface of conducting base 2.When specific production, if the material of protective layer 3
Material is conductive, then can according to need whole surface or part of the surface (such as conducting base 2 and anode body 1 in conducting base 2
Contact surface except region) on be arranged；If the material of protective layer 3 is non-conductive, protective layer 3 is covered in conducting base 2 and sun
Region except the contact surface of pole ontology 1.
In the present embodiment, the material of protective layer 3 is inert metal indium, when specific production, can as needed inert metal,
It is selected in oxide and insulating materials.
In the present embodiment, the plating of inert metal indium is overlying on to the surface of conducting base 2 by the method for plating, formed with a thickness of
0.5 micron of indium layer.When specific production, the thickness of protective layer 3 can be selected in the range of 0.5~1.0 micron as needed
It selects.
In the present embodiment, anode body 1 is soluble anode, and the material of soluble anode is and electroplated layer to be formed
Material is related, such as copper facing Shi Weitong.
In the present embodiment, the quantity of anode body 1 is 7, and the volume of each anode body is identical.Anode body is mutually nested
If other anode bodies are cyclic structure, including circular ring shape knot and coaxially, wherein centrally located anode body is cylindrical body
Structure and semicircular configuration (centrally located anode body only being shown in figure, the anode body of other cyclic structures is not shown).When
When powering to anode assemblies, these anode bodies are mutually not turned on.
When specific production, the quantity of anode body 1 can be chosen in 6~20 ranges as needed.Certainly, quantity is arranged
More, the area of the upper surface of every piece of anode body is smaller, higher to the modified accuracy of electroplating evenness.
Correspondingly, the quantity of conducting base 2 is also 7 in the present embodiment, and shape is corresponding with anode body 1.
In the present embodiment, the material of conducting base 2 is titanium, when specific production, can as needed in titanium, platinum and indium one
It plants or is selected in a variety of.
In the present embodiment, conducting base 2 has 20 perforative holes, this some holes can effectively place conducting base 2 and add
It is deformed in work, the flowing of electroplate liquid in electroplating process can also be made more full and uniform.
Conducting base 2 is connect by conductive column 4 with positive pole, and in the present embodiment, each conducting base is equipped with 2 and leads
Electric column 4.The material of conductive column 4 is that titanium can be as needed in one of titanium, platinum and indium or a variety of middle progress specifically when production
Selection.The surface of conductive column 4 is also plated with one layer of inert metal indium (not shown), the indium layer with a thickness of 0.5 micron.
Anode assemblies provided in this embodiment for plating are denoted as anode assemblies -1.
Embodiment 2
Compared with Example 1, in the anode assemblies provided in this embodiment for plating, difference is, the material of protective layer 3
Material is titanium dioxide, grows oxide layer in the whole surface of conducting base 2 by 200 DEG C of oxidations, likewise, conductive column 4
Surface, which is also grown, oxide layer.
Anode assemblies provided in this embodiment for plating are denoted as anode assemblies -2.
Embodiment 3
Compared with Example 1, in the anode assemblies provided in this embodiment for plating, difference is, the material of protective layer 3
Material is insulating materials Teflon (PTFE), passes through region of the method for spraying except the contact surface of 2 anode body 1 of conducting base
Surface forms insulating protective layer.Likewise, the surface of conductive column 4 is also coated with insulating protective layer.
Anode assemblies provided in this embodiment for plating are denoted as anode assemblies -3.
Embodiment 4
As shown in figures 2-3, compared with Example 1, in the anode assemblies provided in this embodiment for plating, difference exists
In conducting base 2 and anode body 1 are also connected by fastener 5, and the gap between conducting base 2 and anode body 1 is less than
Conducting base 2 can be effectively prevented in the oxidation and passivation of contact surface so that the contact of the two is closer in 0.1mm.
In the present embodiment, the fastener 5 is not through anode body 1, when actual fabrication, run through or not through, as long as
In plating, its resistance will not change.
In the present embodiment, fastener 5 is conductive screw, and quantity is 6, is evenly distributed on conducting base 2.Actual fabrication
When, fastener 5 is conductive or non-conductive, and quantity can be selected in the range of 2~6 as needed.
Anode assemblies provided in this embodiment for plating are denoted as anode assemblies -4.
Embodiment 5
Compared with Example 3, in the anode assemblies provided in this embodiment for plating, difference is, anode body 1
Also matcoveredn 3, the material of the protective layer 3 are insulating materials Teflon for lateral surface lower half portion.
Anode assemblies provided in this embodiment for plating are denoted as anode assemblies -5.
Embodiment 6
Compared with Example 1, in the anode assemblies provided in this embodiment for plating, difference is, 3 (indium of protective layer
Layer) thickness be respectively 0.3,0.8 and 1.0 micron, likewise, the thickness of the indium layer on 4 surface of conductive column also be respectively 0.3,0.8
With 1.0 microns, corresponding anode assemblies are denoted as anode assemblies -6 (0.3 micron), anode assemblies -7 (0.8 micron) and anode respectively
Component -8 (1.0 microns).
Comparative example 1
Compared with Example 1, in the anode assemblies for plating that this comparative example provides, difference is, conducting base 2
Surface does not have protective layer, likewise, the surface of conductive column 4 is also without plating inert metal indium.What this comparative example provided is used for electricity
The anode assemblies of plating are denoted as anode assemblies -9.
Effect example 1
The electroplanting device that this effect example uses includes: Examples 1 to 6 and the anode assemblies in comparative example 1, control
Device, power module, electroplating bath and fixed frame.Anode assemblies are fixed on fixed frame, the lead channel of electroplate liquid built in fixed frame.Gu
Determine frame to be arranged and be fixed in electroplating bath.Controller is electrically connected with power module.
When being electroplated, the anode of power module is electrically connected by electrically-conductive backing plate with anode body, cathode and galvanizer
Part (such as wafer) electrical connection.Anode assemblies and electroplating parts are arranged in parallel relatively, specific: when carrying out horizontal plating, anode unit
Part is set to below electroplating parts；And the radius of the plate surface of anode assemblies is identical as the radius of electroplating parts, i.e. anode assemblies
Shape and size it is identical as the shape and size of electroplating parts.Controller sends power supply instruction to power module.Power module
When receiving power supply instruction, power to one or a few target anode ontology, target anode ontology is mutually not turned at this time.
In this effect example, power module can individually power to one or a few anode body, realize to electroplating parts
Regional area be electroplated, thus can realize to one or many plating (initial plating) afterwards the non-uniform situation of electroplated layer into
Row amendment.
The as above electroplanting device comprising 1 Anodic component of Examples 1 to 6 and comparative example is respectively adopted to carry out 12 cun of wafers
Plating continues to use a period of time, investigates the electroplating evenness for continuing electroplating device in use process, should plating every time in the process
Parameter it is all the same, and frequency of use is identical, investigates that the results are shown in Table 1.
Table 1
In upper table, the uniformity of electroplated layer when electroplanting device was used to the 90th day to plating after crystal column surface electroplated layer
It is tested to obtain, the calculation formula of the uniformity of electroplated layer is as follows:
H=(Hmax-Hmin)/2Havg；
Wherein, H is the uniformity of electroplated layer, HmaxFor the maximum thickness of electroplated layer, HminIt is minimum for the thickness of electroplated layer
Value, HavgFor the thickness average value of electroplated layer.
Claims (11)
1. a kind of anode assemblies, which is characterized in that the anode assemblies include conducting base and on the conducting base
The surface of anode body, the conducting base has protective layer.
2. anode assemblies as described in claim 1, which is characterized in that the anode assemblies are led by conducting base and set on described
Anode body composition on electric matrix, the surface of the conducting base have protective layer.
3. anode assemblies as claimed in claim 1 or 2, which is characterized in that the anode assemblies are the anode unit for plating
Part；
And/or the material of the conducting base is one of titanium, platinum, iridium and indium or a variety of；Preferably, the conducting base
Material be titanium；
And/or the materials conductive or non-conductive of the protective layer, when the protective layer is non-conductive, the protective layer is covered in
Region except the contact surface of the conducting base and the anode body；When the protective layer conduction, the protective layer covers
It is placed on the whole surface or part of the surface of the conducting base, the part of the surface refers to the conducting base and the anode body
Contact surface except region.
4. anode assemblies as claimed in claim 1 or 2, which is characterized in that the material of the protective layer is inert metal, oxidation
One of object and insulating materials are a variety of.
5. anode assemblies as claimed in claim 4, which is characterized in that the inert metal is existed by the method for coating or plating
The surface of the conducting base forms inert metal layer；
And/or chemical activity or the electro-chemical activity conducting base of the inert metal are low；The inert metal is
One of indium, iridium and platinum are a variety of；
And/or the oxide is metal oxide, the metal is preferably the material of the conducting base；
And/or the oxide forms oxide skin(coating) on the surface of the conducting base by Passivation Treatment or the method for coating；
And/or the insulating materials is Teflon；
And/or the insulating materials passes through spraying or the method coated in the contact of the conducting base and the anode body
Region surface except face forms insulating protective layer.
6. anode assemblies as claimed in claim 1 or 2, which is characterized in that the protective layer with a thickness of 0.5~1.0 micron.
7. anode assemblies as claimed in claim 1 or 2, which is characterized in that the conducting base runs through with one or more
Hole.
8. anode assemblies as claimed in claim 1 or 2, which is characterized in that the material of the anode body is soluble anode
Material；
And/or the side surface of the anode body also has the protective layer；
And/or the quantity of the anode body is one or more, the quantity phase of the conducting base and the anode body
Together, shape is corresponding；When the quantity of the anode body is multiple, each anode body is mutually not turned on；When the anode body
When quantity is multiple, the volume of each anode body is preferably identical；When the quantity of the anode body is multiple, the anode
Ontology is arranged mutually and coaxially, wherein centrally located anode body is cylindrical body, other anode bodies are cyclic structure.
9. anode assemblies as claimed in claim 1 or 2, which is characterized in that the conducting base and the anode body pass through
One or more fastener connections, the fastener run through or not through the anode bodies；The fastener is preferably screw；
The quantity of the fastener is preferably 2~6.
10. anode assemblies as claimed in claim 1 or 2, which is characterized in that the conducting base is equipped with conductive column, passes through institute
Conductive column is stated to connect with positive pole；
Preferably, the material of the conductive column is identical as the conducting base；
Preferably, each conducting base is equipped with 2 conductive columns；
Preferably, the surface of the conductive column has the protective layer.
11. a kind of such as application of the described in any item anode assemblies of claim 1~10 in plating.
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