CN110253774B - Novel device for reducing size of semiconductor material - Google Patents
Novel device for reducing size of semiconductor material Download PDFInfo
- Publication number
- CN110253774B CN110253774B CN201910556621.0A CN201910556621A CN110253774B CN 110253774 B CN110253774 B CN 110253774B CN 201910556621 A CN201910556621 A CN 201910556621A CN 110253774 B CN110253774 B CN 110253774B
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- rod
- outer side
- semiconductor material
- fixedly installed
- side wall
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 239000000463 material Substances 0.000 title claims abstract description 51
- 238000007789 sealing Methods 0.000 claims abstract description 36
- 239000011261 inert gas Substances 0.000 claims abstract description 13
- 230000000694 effects Effects 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 20
- 239000007921 spray Substances 0.000 claims description 6
- 239000002912 waste gas Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The invention discloses a novel device for reducing the size of a semiconductor material, which comprises a sealing box, wherein two bearings are symmetrically and fixedly arranged on the top wall and the bottom wall of the inner side of the sealing box, the opposite ends of the two bearings can be rotatably inserted with annular rotating shafts, the opposite ends of the two annular rotating shafts are fixedly provided with fixed blocks, the outer side walls of the opposite sides of the two fixed blocks are respectively inserted with a first movable rod, the first movable rods penetrate through the fixed blocks, the outer side walls of the two fixed blocks are respectively in threaded connection with first fastening bolts matched with the first movable rods, and the opposite ends of the two first movable rods are respectively fixedly provided with a clamping plate. According to the invention, the processing operation is carried out in the sealing box, and the inert gas is continuously introduced into the processing part, so that the surface of the semiconductor material can be prevented from oxidation reaction and pollution in the processing process, the mechanical property and the using effect of the semiconductor material are improved, the design is reasonable, and the practical effect is good.
Description
Technical Field
The invention relates to the technical field of semiconductor material processing, in particular to a novel device for reducing the size of a semiconductor material.
Background
The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, and has wide application in radio, television and temperature measurement, for example, a diode is a device made of a semiconductor, the semiconductor is a material with controllable conductivity ranging from an insulator to a conductor, and the importance of the semiconductor is very great from the viewpoint of technology or economic development, most of the electronic products such as computers, mobile phones or digital audio recorders have close relationship with the semiconductor at present, common semiconductor materials include silicon, germanium, gallium arsenide and the like, and silicon is the most influential one of various semiconductor materials in commercial application.
In the prior art, a metal crushing tool is directly used for reducing the size of a semiconductor material, so that the operation is troublesome, and the surface of the semiconductor material is easy to generate oxidation reaction in the processing process, so that the purity of the semiconductor material is reduced, the mechanical property and the using effect of the semiconductor material are seriously influenced, and therefore, the improvement is needed.
Disclosure of Invention
The invention aims to solve the problem that semiconductor materials are polluted when being reduced in the prior art, and provides a novel device for reducing the size of the semiconductor materials.
In order to achieve the purpose, the invention adopts the following technical scheme:
a novel device for reducing the size of a semiconductor material comprises a sealing box, wherein two bearings are symmetrically and fixedly arranged on the top wall and the bottom wall of the inner side of the sealing box, the opposite ends of the two bearings can be rotatably inserted with annular rotating shafts, the opposite ends of the two annular rotating shafts are fixedly provided with fixed blocks, the outer side wall of one side, opposite to the two fixed blocks, is inserted with a first movable rod, the first movable rod penetrates through the fixed blocks, the outer side walls of the two fixed blocks are in threaded connection with first fastening bolts matched with the first movable rods, the opposite ends of the two first movable rods are fixedly provided with clamping plates, the semiconductor material is clamped between the two clamping plates together, the annular rotating shaft at the top end is connected with a driving device, one side of the semiconductor material is movably provided with a clamp, and a cutter matched with the semiconductor material is inserted on the clamp, a plurality of second fastening bolts matched with the cutter are uniformly and threadedly connected to the outer side wall of the clamp, a sealing door is arranged on the outer side wall of one side of the sealing box, and a protection device is arranged in the sealing box;
the driving device comprises a driving motor fixedly arranged on the top wall of the sealing box, the output end of the driving motor is fixedly provided with a rotating shaft, the bottom end of the rotating shaft is fixedly provided with a first gear, and the outer side wall of the annular rotating shaft positioned at the top end is fixedly provided with a second gear which is meshed with the first gear;
the side, away from the cutter, of the clamp is provided with an installation rod, a fixed rod is fixedly installed on the inner side wall of one side of the sealing box, one end, close to the installation rod, of the fixed rod is inserted with a second movable rod, the end, away from the fixed rod, of the second movable rod is fixedly installed on the installation rod, the outer side wall, close to one end of the installation rod, of the fixed rod is in threaded connection with a third fastening bolt matched with the second movable rod, the outer side wall, away from one side of the cutter, of the clamp is fixedly provided with a connecting ring, the connecting ring is sleeved on the installation rod, the connecting ring is in clearance fit with the installation rod, threads are uniformly arranged on the outer side wall of the installation rod, the outer side wall of the installation rod is symmetrically in threaded connection with two;
the installation rod is characterized in that the bottom wall of the installation rod is provided with a roller, the bottom wall of the inner side of the sealing box is fixedly provided with a movable groove plate matched with the roller, and the top wall of the movable groove plate is provided with a movable groove matched with the roller.
Preferably, the sealing rubber pads are fixedly mounted at the joints of the sealing door and the sealing box.
Preferably, the protection device comprises an inert gas spray pipe inserted on the outer side wall of one side of the seal box, one end, far away from the seal box, of the inert gas spray pipe is connected with an inert gas input device, an air pump is fixedly mounted on the top wall of the seal box, an air exhaust pipe and an exhaust pipe are respectively mounted at two ends of the air pump, one end, far away from the air pump, of the air exhaust pipe is inserted in the seal box, and one end, far away from the air pump, of the exhaust pipe is connected with a waste gas collection device.
Compared with the prior art, the invention has the following beneficial effects:
1. the processing operation is carried out in the sealing box and the inert gas is continuously introduced into the processing part, so that the surface of the semiconductor material can be prevented from oxidation reaction and pollution in the processing process, the mechanical property and the using effect of the semiconductor material are improved, the design is reasonable, and the practical effect is good;
2. simple structure presss from both sides the tight semiconductor material between two splint and rotates the size that reduces semiconductor material that just can be convenient through driving motor drive semiconductor material, convenient operation not only, and the machining precision is high moreover, excellent in use effect.
Drawings
FIG. 1 is a cross-sectional front view of a novel apparatus for reducing the size of semiconductor material in accordance with the present invention;
FIG. 2 is a schematic front view of a sealing door of the novel apparatus for reducing the size of semiconductor material according to the present invention;
FIG. 3 is a schematic front view of a sealing door of the novel apparatus for reducing the size of semiconductor material according to the present invention;
fig. 4 is a schematic structural diagram of a gear portion of a novel apparatus for reducing the size of semiconductor material according to the present invention.
In the figure: the device comprises a sealing box 1, a bearing 2, an annular rotating shaft 3, a fixed block 4, a first movable rod 5, a first fastening bolt 6, a clamping plate 7, a semiconductor material 8, a driving motor 9, a rotating shaft 10, a first gear 11, a second gear 12, a clamp 13, a cutter 14, a second fastening bolt 15, a mounting rod 16, a roller 17, a movable groove plate 18, a fixed rod 19, a second movable rod 20, a third fastening bolt 21, a connecting ring 22, a fastening nut 23, a sealing door 24, an inert gas nozzle 25, an air suction pump 26 and an air suction pipe 27.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-4, a novel device for reducing the size of semiconductor materials comprises a sealing box 1, two bearings 2 are symmetrically and fixedly installed on the top wall and the bottom wall of the inner side of the sealing box 1, annular rotating shafts 3 are rotatably inserted into opposite ends of the two bearings 2, fixed blocks 4 are fixedly installed on opposite ends of the two annular rotating shafts 3, first movable rods 5 are inserted into outer side walls of opposite sides of the two fixed blocks 4, the first movable rods 5 are arranged to penetrate through the fixed blocks 4, first fastening bolts 6 which are matched with the first movable rods 5 are in threaded connection with outer side walls of the two fixed blocks 4, clamping plates 7 are fixedly installed on opposite ends of the two first movable rods 5, semiconductor materials 8 are clamped between the two clamping plates 7, a driving device is connected to the annular rotating shaft 3 on the top end, and comprises a driving motor 9 fixedly installed on the top wall of the sealing box 1, output fixed mounting of driving motor 9 has pivot 10, the bottom fixed mounting of pivot 10 has first gear 11, fixed mounting has second gear 12 with first gear 11 intermeshing on the lateral wall of the annular pivot 3 that is located the top, start driving motor 9, driving motor 9 drive pivot 10 drives first gear 11 and rotates, first gear 11 and second gear 12 intermeshing, consequently, first gear 11 rotates and can drive second gear 12, annular pivot 3, first movable rod 5, splint 7 and semiconductor material 8 rotate.
One side of semiconductor material 8 can be movably equipped with anchor clamps 13, insert on anchor clamps 13 and be equipped with the cutter 14 of mutually supporting with semiconductor material 8, even threaded connection has a plurality ofly on anchor clamps 13's the lateral wall and the mutually supporting second fastening bolt 15 of cutter 14, one side that cutter 14 was kept away from to anchor clamps 13 is equipped with installation pole 16, install gyro wheel 17 on the diapire of installation pole 16, fixed mounting has the movable frid 18 of mutually supporting with gyro wheel 17 on the diapire of seal box 1 inboard, seted up the movable groove of mutually supporting with gyro wheel 17 on the roof of movable frid 18, can promote the stability that installation pole 16 removed.
A fixed rod 19 is fixedly arranged on the inner side wall of one side of the sealing box 1, a second movable rod 20 is inserted into one end of the fixed rod 19 close to the mounting rod 16, one end of the second movable rod 20 far away from the fixed rod 19 is fixedly arranged on the mounting rod 16, a third fastening bolt 21 matched with the second movable rod 20 is connected with the outer side wall of one end of the fixed rod 19 close to the mounting rod 16 in a threaded manner, the mounting rod 16 can be conveniently moved horizontally and the mounting rod 16 is fixed, a connecting ring 22 is fixedly arranged on the outer side wall of one side of the clamp 13 far away from the cutter 14, the connecting ring 22 is sleeved on the mounting rod 16, the connecting ring 22 and the mounting rod 16 are in clearance fit with each other, threads are uniformly arranged on the outer side wall of the mounting rod 16, two fastening nuts 23 are symmetrically and threadedly connected on the outer side wall of the mounting rod 16, the two fastening nuts 23 are respectively arranged on the upper side, so that the clamp 13 and the cutter 14 can be easily moved to the proper positions.
Be equipped with sealing door 24 on the lateral wall of seal box 1 one side, the equal fixed mounting in junction of sealing door 24 and seal box 1 has sealing rubber pad, can promote sealing door 24's leakproofness.
Be equipped with protection device in seal box 1, protection device is including inserting the inert gas spray tube 25 of establishing on the lateral wall of seal box 1 one side, the one end that seal box 1 was kept away from to inert gas spray tube 25 is connected with inert gas input device, fixed mounting has aspiration pump 26 on the roof of seal box 1, aspiration pump 27 and blast pipe are installed respectively to the both ends of aspiration pump 26, and the one end that aspiration pump 26 was kept away from to aspiration tube 27 is inserted and is established in seal box 1, the one end that aspiration pump 26 was kept away from to the blast pipe is connected with waste gas collection device, place the processing operation and go on and continuously let in inert gas to the processing position in seal box 1, thereby can prevent that the surface of semiconductor material 8 from taking place oxidation reaction and contaminated in the course of working, the mechanical properties and the result of use of semiconductor material 8 have been improved.
In the invention, a semiconductor material 8 is placed between two clamping plates 7, two first movable rods 5 are moved to clamp and fix the semiconductor material 8, first fastening bolts 6 are turned tight to fix the first movable rods 5, the clamping plates 7 and the semiconductor material 8, a cutter 14 matched with the semiconductor material 8 is inserted into a clamp 13 and a second fastening bolt 15 is turned tight to fix the cutter 14, a telescopic rod 20 and a mounting rod 16 are moved in the horizontal direction and move the cutter 14 to a proper position in the horizontal direction, then a third fastening bolt 21 is turned tight to fix the telescopic rod 20, the mounting rod 16 and the cutter 14, a connecting ring 22, the clamp 13 and the cutter 14 are moved to a proper height, then two fastening nuts 23 are respectively turned tight and the fastening nuts 23 and the connecting ring 22 are in tight contact with each other, so that the connecting ring 22, the clamp 13 and the cutter 14 can be fixed, a driving motor 9 is started, the driving rotating shaft 10 drives a first gear 11 to rotate, the first gear 11 and the second gear 12 are meshed with each other, so that the rotation of the first gear 11 can drive the second gear 12, the annular rotating shaft 3, the first movable rod 5, the clamping plate 7 and the semiconductor material 8 to rotate, and the size of the semiconductor material 8 can be reduced when the semiconductor material 8 and the cutter 14 are contacted with each other.
Further, unless otherwise specifically stated or limited, the above-described fixed connection is to be understood in a broad sense, and may be, for example, welded, glued, or integrally formed as is conventional in the art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (3)
1. A new device for reducing the size of semiconductor materials, comprising a sealed box (1), characterized in that: two bearings (2) are symmetrically and fixedly installed on the top wall and the bottom wall of the inner side of the sealing box (1), one ends, opposite to the two bearings (2), can be rotatably inserted with annular rotating shafts (3), the other ends, opposite to the two annular rotating shafts (3), are fixedly installed with fixed blocks (4), the outer side walls of the two fixed blocks (4) are respectively inserted with a first movable rod (5), the first movable rods (5) penetrate through the fixed blocks (4) for arrangement, the outer side walls of the two fixed blocks (4) are respectively in threaded connection with first fastening bolts (6) which are mutually matched with the first movable rods (5), the ends, opposite to the first movable rods (5), are respectively and fixedly installed with clamping plates (7), a semiconductor material (8) is clamped between the two clamping plates (7), and the annular rotating shaft (3) positioned at the top end is connected with a driving device, a clamp (13) is movably arranged on one side of the semiconductor material (8), a cutter (14) matched with the semiconductor material (8) is inserted into the clamp (13), a plurality of second fastening bolts (15) matched with the cutter (14) are uniformly and threadedly connected to the outer side wall of the clamp (13), a sealing door (24) is arranged on the outer side wall of one side of the sealing box (1), and a protection device is arranged in the sealing box (1);
the driving device comprises a driving motor (9) fixedly installed on the top wall of the sealing box (1), a rotating shaft (10) is fixedly installed at the output end of the driving motor (9), a first gear (11) is fixedly installed at the bottom end of the rotating shaft (10), and a second gear (12) meshed with the first gear (11) is fixedly installed on the outer side wall of the annular rotating shaft (3) located at the top end;
one side of the clamp (13) far away from the cutter (14) is provided with an installation rod (16), a fixed rod (19) is fixedly installed on the inner side wall of one side of the sealing box (1), one end, close to the installation rod (16), of the fixed rod (19) is inserted with a second movable rod (20), one end, far away from the fixed rod (19), of the second movable rod (20) is fixedly installed on the installation rod (16), the outer side wall, close to one end of the installation rod (16), of the fixed rod (19) is connected with a third fastening bolt (21) matched with the second movable rod (20) in a threaded manner, the outer side wall, far away from one side of the cutter (14), of the clamp (13) is fixedly provided with a connecting ring (22), the connecting ring (22) is sleeved on the installation rod (16), the connecting ring (22) is in clearance fit with the installation rod (16), threads are uniformly arranged on the outer side wall, the outer side wall of the mounting rod (16) is symmetrically and threadedly connected with two fastening nuts (23), and the two fastening nuts (23) are respectively positioned on the upper side and the lower side of the connecting ring (22);
install on the diapire of installation pole (16) gyro wheel (17), fixed mounting has movable frid (18) of mutually supporting with gyro wheel (17) on the diapire of seal box (1) inboard, set up the activity groove of mutually supporting with gyro wheel (17) on the roof of activity frid (18).
2. A novel apparatus for reducing the size of semiconductor materials according to claim 1, wherein: and sealing rubber pads are fixedly arranged at the joints of the sealing door (24) and the sealing box (1).
3. A novel apparatus for reducing the size of semiconductor materials according to claim 1, wherein: the protection device is including inserting inert gas spray tube (25) of establishing on seal box (1) one side lateral wall, the one end that seal box (1) was kept away from in inert gas spray tube (25) is connected with inert gas input device, fixed mounting has aspiration pump (26) on the roof of seal box (1), aspiration tube (27) and blast pipe are installed respectively to the both ends of aspiration pump (26), and aspiration tube (27) keep away from the one end of aspiration pump (26) and insert and establish in seal box (1), the one end that aspiration pump (26) were kept away from to the blast pipe is connected with waste gas collection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910556621.0A CN110253774B (en) | 2019-06-25 | 2019-06-25 | Novel device for reducing size of semiconductor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910556621.0A CN110253774B (en) | 2019-06-25 | 2019-06-25 | Novel device for reducing size of semiconductor material |
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| Publication Number | Publication Date |
|---|---|
| CN110253774A CN110253774A (en) | 2019-09-20 |
| CN110253774B true CN110253774B (en) | 2021-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910556621.0A Active CN110253774B (en) | 2019-06-25 | 2019-06-25 | Novel device for reducing size of semiconductor material |
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| CN (1) | CN110253774B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104162939B (en) * | 2014-08-07 | 2016-07-06 | 陈菊芳 | Device is fixed in slip on slabstone chamfered machine |
| CN206335192U (en) * | 2016-12-19 | 2017-07-18 | 包头市三隆稀有金属材料有限责任公司 | Rare earth metal cutting equipment |
| JP6855117B2 (en) * | 2017-03-06 | 2021-04-07 | 株式会社ディスコ | Flange mechanism |
| CN109746593A (en) * | 2017-11-07 | 2019-05-14 | 扬州未来塑胶制品有限公司 | A kind of environment-friendly type welded tube mill convenient for collecting waste residue |
| CN208005461U (en) * | 2017-12-31 | 2018-10-26 | 郑州元泽信息技术有限公司 | Facilitate the polishing fixing device of cooling |
| CN207807359U (en) * | 2018-02-07 | 2018-09-04 | 上饶市西中光学科技有限公司 | Device for improving grinding quality of lens edge |
| CN208006001U (en) * | 2018-03-09 | 2018-10-26 | 福建龙威特电子科技发展有限公司 | A kind of cutter device for quartz crystal processing |
| CN108621309B (en) * | 2018-05-11 | 2020-06-05 | 合肥鼎鑫模具有限公司 | Cutting device is used in mould production |
| CN208575656U (en) * | 2018-07-16 | 2019-03-05 | 天津市澜鹏金属制品制造有限公司 | A kind of metal component fast shaping apptss |
| CN108818981A (en) * | 2018-07-27 | 2018-11-16 | 宋文斌 | A kind of glass processing cutting and positioning device |
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Effective date of registration: 20240517 Address after: 221600 3rd Floor, Building A11, North Side of Pei Highway and East Side of Hanrun Road (Science and Technology Entrepreneurship Park), Peixian Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Security Emergency Medical Industry Technology Research Institute (Xuzhou) Co.,Ltd. Country or region after: China Address before: 221600 South Ring Road (Fengpei Road) North of Peixian County, Xuzhou City, Jiangsu Province Patentee before: Jiangsu Navigation Industry Co.,Ltd. Country or region before: China |
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