CN110252905A - A kind of apparatus for bending of chip pin - Google Patents
A kind of apparatus for bending of chip pin Download PDFInfo
- Publication number
- CN110252905A CN110252905A CN201910687985.2A CN201910687985A CN110252905A CN 110252905 A CN110252905 A CN 110252905A CN 201910687985 A CN201910687985 A CN 201910687985A CN 110252905 A CN110252905 A CN 110252905A
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- CN
- China
- Prior art keywords
- bending
- chip
- plate
- pin
- seat
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Wire Processing (AREA)
Abstract
The invention discloses a kind of apparatus for bending of chip pin, including apparatus for bending, moulding bed and clamping device, the present invention is using the first clamping of setting cutting edge on the load mould of moulding bed, the second clamping of setting cutting edge in the gripping block of clamping device, it is clamped between two cutting edges by the pin that delivery device is intended to bending chip, bending is implemented using pin of the rotary cylinder driving bending plate to chip, the present invention is in the bending process of pin, the stress of bending has been blocked to be transmitted to chip from the root of pin, and in bending process, the plate face of bending plate and the pin of chip are in face contact, not only bending precision is high, and bending angle is adjustable, it completely avoids causing scratch or damage to the surface of pin, improve the assembling quality of chip, extend the service life of chip.
Description
Technical field
The present invention relates to the mounting technology field of chip, especially a kind of apparatus for bending of chip pin.
Background technique
As chip is more and more extensive in the utilization in high precise equipment, the requirement to chip pin bending quality is increasingly
It is high.Pin bending at present is mostly by having been manually done, and precision and consistency are hard to reach requirement, and there are also pin bending mechanisms
This problem is being solved, is carrying out chip pin bending, this folding such as a kind of track bending mechanism of application number CN106825162A
Bender structure be using a kind of fixed chute control bending angle and shape, the problem is that, this method to the protection of chip and
Existing defects in terms of the protection of pin coating, once misoperation, not only can cause to damage to the coating on pin, meanwhile,
In bending process, the stress of bending will be more or less transmitted on chip by the root of pin, cause to damage to chip, directly
The assembling quality for influencing chip is connect, is reduced the service life, the above problem is badly in need of those skilled in the art and is resolved.
Summary of the invention
The purpose of the present invention is in view of the deficiencies of the prior art and provide a kind of chip pin apparatus for bending, the present invention
Using the first clamping of setting cutting edge on the load mould of moulding bed, the second clamping cutting edge is set in the gripping block of clamping device, is led to
It crosses delivery device and is intended to the pin of bending chip and be clamped between two cutting edges, chip is drawn using rotary cylinder driving bending plate
Foot implements bending, and the present invention has blocked the stress of bending to be transmitted to chip from the root of pin in the bending process of pin, and
In bending process, the plate face of bending plate and the pin of chip are in face contact, and not only bending precision is high, and bending angle can
It adjusts, it is entirely avoided scratch or damage are caused to the surface of pin, improve the assembling quality of chip, extends the use of chip
Service life.
Realizing the specific technical solution of the object of the invention is:
A kind of apparatus for bending of chip pin, feature include apparatus for bending, moulding bed and clamping device；
The apparatus for bending is made of rack, shaft coupling, bending plate, main shaft, rotary cylinder and countershaft, and rack is by substrate and vertical plate
L-shaped setting, vertical plate are equipped with main bearing seat, and the outside of vertical plate is equipped with cylinder block, and substrate is equipped with supplementary bearing seat, push rod
Seat, track base and mould seat, the ram seat, the axis collinear of track base and mould seat and the axis are parallel with the face of vertical plate；
The bending plate is the plate that one end is equipped with axis hole, the other end is equipped with terminal pad；
The main shaft is set on main bearing seat, and countershaft is set on supplementary bearing seat, the axis collinear and axis of countershaft and main shaft and vertical
The face of plate is vertical；
The bending plate is set between main shaft and countershaft, and the terminal pad of bending plate is connect with main shaft, the axis hole and pair of bending plate
Axis is hinged；
The rotary cylinder is set on cylinder block, and shaft coupling is set between the output shaft and main shaft of rotary cylinder.
The moulding bed is made of load mould with briquetting, and load mould is chip carrier and chip carrier a side equipped with recess
Frame unit equipped with the first clamping cutting edge；Moulding bed is set on the mould seat of apparatus for bending through load mould, and briquetting is placed on load
On mould.
The clamping device is made of linear guide, gripping block and delivery device, and gripping block is the square that bottom is equipped with slideway
Shape block, a side vertical with slideway is equipped with the second clamping cutting edge in gripping block, and gripping block is set in linear guide through slideway；
The delivery device is the component that pusher bar support is equipped with push rod and handle.
The linear guide of the clamping device is set on the track base of apparatus for bending, and the pusher bar support of delivery device is set to folding
In the ram seat of bending apparatus, and push rod is connect with gripping block.
A side of the bending plate is equipped with arc surface.
The handle is equipped with flange.
The bottom of the second clamping cutting edge is equipped with the chamfering of circular arc in the gripping block.
The present invention is arranged the using the first clamping of setting cutting edge on the load mould of moulding bed in the gripping block of clamping device
Two clamping cutting edges, are clamped between two cutting edges by the pin that delivery device is intended to bending chip, are driven and rolled over using rotary cylinder
Bent plate implements bending to the pin of chip, and the present invention has blocked root of the stress of bending from pin in the bending process of pin
Portion is transmitted to chip, and in bending process, and the plate face of bending plate and the pin of chip are in face contact, not only bending precision
Height, and bending angle is adjustable, it is entirely avoided scratch or damage are caused to the surface of pin, improve the assembling quality of chip,
Extend the service life of chip.
The present invention is blocked the stress that pin bending process generates by the second clamping cutting edge and the first clamping cutting edge, guarantees to answer
Power will not be transmitted on chip.In bending process, the plate face of bending plate and the pin of chip are in face contact, and bending angle can
It adjusts, scratch or damage will not be caused to the surface of pin.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the partial structural diagram in the section A-A of Fig. 1；
Fig. 3 is the structural schematic diagram of apparatus for bending of the present invention；
Fig. 4 is the structural schematic diagram of bending plate of the present invention；
Fig. 5 is the structural schematic diagram of load mould of the present invention；
Fig. 6 is the partial enlargement diagram of gripping block at the B of Fig. 2；
Fig. 7 is the structural schematic diagram of delivery device of the present invention.
Specific embodiment
Refering to fig. 1, Fig. 2, the present invention include apparatus for bending 1, moulding bed 2 and clamping device 3,
Refering to fig. 1, Fig. 3, the apparatus for bending 1 is by rack 11, shaft coupling 12, bending plate 13, main shaft 14, rotary cylinder 15, pair
Axis 16 is constituted；For the rack 11 by substrate and the L-shaped setting of vertical plate, vertical plate is equipped with main bearing seat 111, sets on the outside of vertical plate
There is cylinder block, substrate is equipped with supplementary bearing seat, ram seat 114, track base 115 and mould seat 116, the ram seat 114, guide rail
Seat 115 and mould seat 116 axis collinear and the axis it is parallel with the face of vertical plate.
Refering to fig. 1, Fig. 3, Fig. 4, the bending plate 13 are the plate that one end is equipped with axis hole 131, the other end is equipped with terminal pad 132
Part；
The main shaft 14 is set on main bearing seat 111, and countershaft 16 is set on supplementary bearing seat, the axis collinear of countershaft 16 and main shaft 14
And axis is vertical with the face of vertical plate；
The bending plate 13 is set between main shaft 14 and countershaft 16, and the terminal pad 132 of bending plate 13 is connect with main shaft 14, bending
The axis hole 131 and countershaft 16 of plate 13 are hinged；
The rotary cylinder 15 is set on cylinder block, and shaft coupling 12 is set between the output shaft and main shaft 14 of rotary cylinder 15.
Refering to fig. 1, Fig. 2, Fig. 5, the moulding bed 2 are made of load mould 21 and briquetting 22, and load mould 21 is equipped with recessed
Sunken chip carrier 212 and 212 a side of chip carrier is equipped with the frame unit of the first clamping cutting edge 211；Moulding bed 2 is set through load mould 21
In on the mould seat 116 of apparatus for bending 1, briquetting 22 is placed on load mould 21.
Refering to fig. 1, Fig. 2, Fig. 7, the clamping device 3 are made of linear guide 31, gripping block 32 and delivery device 33；
The gripping block 32 is the rectangular block that bottom is equipped with slideway, and a side vertical with slideway is equipped with second in gripping block 32
Cutting edge 321 is clamped, gripping block 32 is set in linear guide 31 through slideway；
The delivery device 33 is that pusher bar support 333 is equipped with 331 component of push rod 332 and handle；
The linear guide 31 of the clamping device 3 is set on the track base 115 of apparatus for bending 1, the pusher bar support of delivery device 33
333 are set in the ram seat 114 of apparatus for bending 1, and push rod 332 is connect with gripping block 32.
Refering to Fig. 3, Fig. 4, a side of the bending plate 13 is equipped with arc surface 133.
Refering to fig. 1, Fig. 7, the handle 331 are equipped with flange.
Refering to Fig. 2, Fig. 6, the bottom of second clamping cutting edge 321 is equipped with the chamfering 323 of circular arc in the gripping block 32.
The present invention uses in this way:
Refering to fig. 1, Fig. 2, the present invention is for bending to chip pin, and when work, the chip 4 for being intended to bending first is placed on tire
On frame 2 on the chip carrier 212 of load mould 21, make to be intended to the pin 41 of bending chip vertically downward, and be located at load mould 21
Between first clamping cutting edge 211 and the second clamping cutting edge 321 of gripping block 32, briquetting 22 is placed on chip, chip is kept
With the stabilization of load mould 21.
Refering to fig. 1, Fig. 2, Fig. 7, inverse time needle plate move the handle 331 of delivery device 33, become handle 331 from horizontal position
Upright position, the flange compressing push rod 332 on handle 331 and gripping block 32 move to right in linear guide 31 at this time, gripping block 32
Second clamping cutting edge 321 to load mould 21 first clamping cutting edge 211 close up, be intended to bending chip pin clamp, and
It is bonded with the plate face of bending plate 13.
At this point, starting rotary cylinder 15, rotary cylinder 15 drives shaft coupling 12, main shaft 14 and drives bending plate 13 clockwise
Rotation, the plate face of bending plate 13 is by the bending in the horizontal direction of pin 41 of chip 4.
After the completion of bending, rotary cylinder 15 is resetted together with bending plate 13, and up time needle plate moves the handle 331 of delivery device 33,
Handle 331 is set to become horizontal position from upright position, the flange on handle 331 discharges the compressing to push rod 332, gripping block at this time
32 move to left, and the second clamping cutting edge 321 of gripping block 32 is separated with the first clamping cutting edge 211 of load mould 21, by drawing for chip 4
Foot 41 unclamps, and the commutation of chip 4 for being intended to bending is placed on the load mould 21 of moulding bed 2, to the pin 41 to 4 other side of chip
Implement bending.
Refering to fig. 1, Fig. 2 prevents stress of the pin 41 of chip 4 in bending to be transmitted on chip 4 to protect chip 4,
The present invention is closed up will be drawn first using the second clamping cutting edge 321 of gripping block 32 and the first clamping cutting edge 211 of load mould 21
Foot 41 clamps, the stress that then plate face of bending plate 13 generates the bending in the horizontal direction of pin 41 of chip 4, bending process again
It is blocked by the second clamping cutting edge 321 and the first clamping cutting edge 211, proof stress will not be transmitted on chip 4.
Refering to fig. 1, Fig. 2, Fig. 4, in bending process, the plate face of bending plate 13 and the pin 41 of chip 4 are in face contact, no
Scratch or damage can be caused to the surface of pin 41.In addition, the top edge of bending plate 13 is also designed as arc surface by the present invention
133, scuffing is generated when the bending part of the top edge and pin 41 that prevent bending plate 13 contacts.
Refering to fig. 1, Fig. 2 is placed on the load mould 21 of moulding bed 2 for the chip that stable subtracting is intended to bending pin, when
After desire bending chip is placed on load mould 21, the present invention placed briquetting 22 on chip, and the setting of briquetting 22 both guaranteed
Chip is placed on relatively stable on load mould 21, in turn avoids to chip causing to scratch using other compressing methods, and
The placement of briquetting 22 with fetch it is extremely convenient.
Refering to fig. 1, Fig. 2, Fig. 3, the frame of the invention 11 is by substrate and the L-shaped setting of vertical plate, wherein main shaft 14 is set to master
On bearing block 111, countershaft 16 is set on supplementary bearing seat, the axis collinear of the countershaft 16 and main shaft 14 and face of axis and vertical plate is hung down
Directly；Since bending plate 13 is set between main shaft 14 and countershaft 16, for this purpose, bending plate 13 turns around the axis of countershaft 16 and main shaft 14
It is dynamic, in addition, ram seat 114, the axis collinear of track base 115 and mould seat 116 and the axis are parallel with the face of vertical plate, at this point,
The axis vertical take-off that the axis and ram seat 114 of countershaft 16 and main shaft 14, track base 115 and mould seat 116 are constituted, when gripping block 32
After moving to right in linear guide 31, guarantee the second clamping cutting edge 321 of gripping block 32 and the first clamping cutting edge of load mould 21
211 gap is parallel with the axis of main shaft 14 with countershaft 16, to guarantee the flatness of several pin bendings of chip upper side.
Refering to Fig. 2, Fig. 6, present invention bottom of the second clamping cutting edge 321 in gripping block 32 is equipped with the chamfering 323 of circular arc,
Radius bend of the chamfering 323 of circular arc to control pin prevents the bending part of pin 41 from generating right angle, so that it is guaranteed that drawing
The intensity of foot bending part will not be led because of bending to be influenced.
Claims (4)
1. a kind of apparatus for bending of chip pin, which is characterized in that it includes apparatus for bending (1), moulding bed (2) and clamping device
(3)；
The apparatus for bending (1) is by rack (11), shaft coupling (12), bending plate (13), main shaft (14), rotary cylinder (15) and pair
Axis (16) is constituted；
The rack (11) is equipped with main bearing seat (111) by substrate and the L-shaped setting of vertical plate, vertical plate, sets on the outside of vertical plate
There is cylinder block, substrate is equipped with supplementary bearing seat, ram seat (114), track base (115) and mould seat (116), the ram seat
(114), the axis collinear of track base (115) and mould seat (116) and the axis is parallel with the face of vertical plate；
The bending plate (13) is the plate that one end is equipped with axis hole (131), the other end is equipped with terminal pad (132)；
The main shaft (14) is set on main bearing seat (111), and countershaft (16) is set on supplementary bearing seat, countershaft (16) and main shaft (14)
Axis collinear and axis it is vertical with the face of vertical plate；
The bending plate (13) is set between main shaft (14) and countershaft (16), and the terminal pad (132) and main shaft of bending plate (13)
(14) it connects, the axis hole (131) of bending plate (13) and countershaft (16) are hinged；
The rotary cylinder (15) is set on cylinder block, and shaft coupling (12) is set to output shaft and main shaft (14) of rotary cylinder (15)
Between；
The moulding bed (2) is made of load mould (21) and briquetting (22), and load mould (21) is the chip carrier equipped with recess
(212) and chip carrier (212) a side is equipped with the first frame unit for clamping cutting edge (211), and moulding bed (2) is set through load mould (21)
In on the mould seat (116) of apparatus for bending (1), briquetting (22) is placed on load mould (21)；
The clamping device (3) is made of linear guide (31), gripping block (32) and delivery device (33), and gripping block (32) is bottom
Portion is equipped with the rectangular block of slideway, and a side vertical with slideway is equipped with the second clamping cutting edge (321) in gripping block (32), clamps
Block (32) is set on linear guide (31) through slideway；
The delivery device (33) is the component that pusher bar support (333) are equipped with push rod (332) and handle (331), clamping device
(3) linear guide (31) is set on the track base (115) of apparatus for bending (1), and the pusher bar support (333) of delivery device (33) is set
In in the ram seat (114) of apparatus for bending (1), and push rod (332) is connect with gripping block (32).
2. a kind of apparatus for bending of chip pin according to claim 1, which is characterized in that the one of the bending plate (13)
Side is equipped with arc surface (133).
3. a kind of apparatus for bending of chip pin according to claim 1, which is characterized in that set on the handle (331)
There is flange.
4. a kind of apparatus for bending of chip pin according to claim 1, which is characterized in that on the gripping block (32)
The bottom of two clampings cutting edge (321) is equipped with the chamfering (323) of circular arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910687985.2A CN110252905B (en) | 2019-07-29 | 2019-07-29 | Bending device of chip pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910687985.2A CN110252905B (en) | 2019-07-29 | 2019-07-29 | Bending device of chip pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110252905A true CN110252905A (en) | 2019-09-20 |
| CN110252905B CN110252905B (en) | 2020-08-28 |
Family
ID=67912210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910687985.2A Active CN110252905B (en) | 2019-07-29 | 2019-07-29 | Bending device of chip pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110252905B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111331019A (en) * | 2020-03-06 | 2020-06-26 | 常熟理工学院 | Part bending method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202398741U (en) * | 2012-01-05 | 2012-08-29 | 健大电业制品（昆山）有限公司 | Pin bending jig |
| CN203955962U (en) * | 2014-07-14 | 2014-11-26 | 广州金升阳科技有限公司 | A kind of electronic devices and components pin apparatus for bending |
| CN205341744U (en) * | 2015-12-11 | 2016-06-29 | 武汉联特科技有限公司 | Automatic curved scissors pin device of optical device |
| CN206009671U (en) * | 2016-08-30 | 2017-03-15 | 苏州埃博斯电气有限公司 | A kind of high accuracy stitch apparatus for bending |
| CN107820452A (en) * | 2016-10-27 | 2018-03-20 | 深圳欣锐科技股份有限公司 | The shaped device of transistor |
| CN207615557U (en) * | 2017-11-28 | 2018-07-17 | 合肥华耀电子工业有限公司 | A kind of axial lead component forming frock |
-
2019
- 2019-07-29 CN CN201910687985.2A patent/CN110252905B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202398741U (en) * | 2012-01-05 | 2012-08-29 | 健大电业制品（昆山）有限公司 | Pin bending jig |
| CN203955962U (en) * | 2014-07-14 | 2014-11-26 | 广州金升阳科技有限公司 | A kind of electronic devices and components pin apparatus for bending |
| CN205341744U (en) * | 2015-12-11 | 2016-06-29 | 武汉联特科技有限公司 | Automatic curved scissors pin device of optical device |
| CN206009671U (en) * | 2016-08-30 | 2017-03-15 | 苏州埃博斯电气有限公司 | A kind of high accuracy stitch apparatus for bending |
| CN107820452A (en) * | 2016-10-27 | 2018-03-20 | 深圳欣锐科技股份有限公司 | The shaped device of transistor |
| CN207615557U (en) * | 2017-11-28 | 2018-07-17 | 合肥华耀电子工业有限公司 | A kind of axial lead component forming frock |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111331019A (en) * | 2020-03-06 | 2020-06-26 | 常熟理工学院 | Part bending method |
| CN111331019B (en) * | 2020-03-06 | 2021-07-30 | 常熟理工学院 | Part bending method |
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| Publication number | Publication date |
|---|---|
| CN110252905B (en) | 2020-08-28 |
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