CN110246977B - Organic light-emitting display panel and manufacturing method thereof - Google Patents
Organic light-emitting display panel and manufacturing method thereof Download PDFInfo
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- CN110246977B CN110246977B CN201810194961.9A CN201810194961A CN110246977B CN 110246977 B CN110246977 B CN 110246977B CN 201810194961 A CN201810194961 A CN 201810194961A CN 110246977 B CN110246977 B CN 110246977B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/868—Arrangements for polarized light emission
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The embodiment of the invention discloses an organic light-emitting display panel and a manufacturing method thereof. Wherein the organic light emitting display panel includes: a substrate base plate; an organic light emitting layer disposed on the substrate base plate; the thin film packaging layer covers the organic light emitting layer, and the polaroid is arranged on the thin film packaging layer; and a buffer layer is arranged between the film packaging layer and the polaroid. The technical scheme provided by the embodiment of the invention can solve the problem that the display of the organic light-emitting display panel is influenced because the film packaging layer is easily damaged when the polarizer is attached to the conventional organic light-emitting display panel.
Description
Technical Field
The embodiment of the invention relates to the technical field of organic light-emitting display, in particular to an organic light-emitting display panel and a manufacturing method thereof.
Background
Organic Light Emitting Display (OLED) panels have become one of the major directions in the development of the Display industry because they do not require a backlight, and have the technical advantages of high contrast, thin thickness, wide viewing angle, and fast response speed.
The existing organic light emitting display panel generally comprises a PI substrate layer, a TFT array layer, an organic light emitting layer, a thin film encapsulation layer, a polarizer, and the like. The organic light emitting layer is easily corroded by moisture and oxygen in the air, so that the display effect of the display panel is poor, and the organic light emitting layer is protected by manufacturing a thin film packaging layer on the organic light emitting layer to block the moisture and the oxygen.
The thin film encapsulation layer is generally formed by stacking an organic layer and an inorganic layer, and then performing module processes such as polarizer attachment. However, when the polarizer is attached, the polarizer is directly contacted and pressed with the upper surface (inorganic layer) of the film encapsulation layer, which is likely to cause damage to the inorganic layer in the film encapsulation layer. After the organic light emitting display panel is manufactured, color shortage or other problems are easily caused when a reliability test is performed.
Disclosure of Invention
The invention provides an organic light-emitting display panel and a manufacturing method thereof, which aim to solve the problem that when a polaroid is attached to the organic light-emitting display panel, a thin film packaging layer is easy to damage, so that the display of the organic light-emitting display panel is influenced.
In a first aspect, an embodiment of the present invention provides an organic light emitting display panel, including: a substrate base plate;
an organic light emitting layer disposed on the substrate base plate;
the thin film packaging layer covers the organic light emitting layer, and the polaroid is arranged on the thin film packaging layer;
and a buffer layer is arranged between the film packaging layer and the polaroid.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing an organic light emitting display panel, including:
forming a substrate base plate;
forming an organic light emitting layer on the base substrate;
forming a thin film encapsulation layer covering the organic light emitting layer;
forming a buffer layer on the thin film encapsulation layer; and attaching a polarizer on the buffer layer.
The organic light-emitting display panel and the manufacturing method thereof provided by the embodiment of the invention are sequentially provided with the substrate base plate, the organic light-emitting layer and the film packaging layer in a laminating way, and before the polarizer is arranged on the film packaging layer, the buffer layer is arranged between the film packaging layer and the polarizer, so that the direct contact and lamination of the polarizer on the film packaging layer are avoided, the damage of the polarizer on the film packaging layer is prevented, the problems of color deficiency or abnormal display caused by the attachment of the polarizer on the existing organic light-emitting display panel are solved, the probability of the organic light-emitting display panel passing the reliability test is increased, and the yield of the organic light-emitting display panel is improved.
Drawings
Fig. 1 is a cross-sectional view of an organic light emitting display panel according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of another organic light emitting display panel according to an embodiment of the present invention;
fig. 3 is a cross-sectional view of another organic light emitting display panel according to an embodiment of the present invention;
fig. 4 is a flowchart illustrating a method for fabricating an organic light emitting display panel according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a structure corresponding to each step of a method for manufacturing a display panel according to an embodiment of the present invention;
FIG. 6 is a flowchart illustrating a method for fabricating an organic light emitting display panel according to another embodiment of the present invention;
FIG. 7 is a flowchart illustrating a method for fabricating an organic light emitting display panel according to another embodiment of the present invention;
fig. 8 is a flowchart of another method for fabricating an organic light emitting display panel according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
An embodiment of the present invention provides an organic light emitting display panel, and referring to fig. 1, fig. 1 is a cross-sectional view of an organic light emitting display panel provided in an embodiment of the present invention, the organic light emitting display panel including:
a substrate base plate 11;
an organic light-emitting layer 12 provided on the base substrate 11;
a film encapsulation layer 13 covering the organic light emitting layer 12, and a polarizer 14 disposed on the film encapsulation layer 13;
a buffer layer 15 is provided between the film encapsulation layer 13 and the polarizer 14.
A thin film transistor driving circuit formed by a photolithography process is provided on the substrate base plate 11, and includes a plurality of thin film transistors for driving the organic light emitting layer 12 above the substrate base plate 11 to display an image. The upper side in this embodiment refers to the side close to the polarizer 14, and the lower side refers to the side close to the substrate base 11.
The organic light emitting layer 12 at least includes a first electrode, a light emitting layer and a second electrode from bottom to top, and under the driving of the voltage provided by the thin film transistor driving circuit, electrons and holes respectively migrate from the first electrode (second electrode) and the second electrode (first electrode) to the light emitting layer, and are combined in the light emitting layer to form excitons and excite light emitting molecules, thereby emitting visible light.
In order to prevent the intrusion of moisture and oxygen and protect the thin film transistor driving circuit and the organic light emitting layer 12 on the substrate 11, a thin film encapsulation layer 13 is disposed above the organic light emitting layer 12, and the thin film transistor driving circuit and the organic light emitting layer 12 are covered by the thin film encapsulation layer 13.
Alternatively, the thin film encapsulation layer 13 may include a first inorganic layer disposed on the organic light emitting layer 12; an organic layer disposed on the first inorganic layer; and a second inorganic layer disposed on the organic layer.
The film packaging layer 13 is formed by laminating an inorganic layer and an organic layer and is used for blocking water and oxygen, the film packaging layer 13 sequentially comprises a first inorganic layer, an organic layer and a second inorganic layer from bottom to top, if the second inorganic layer is directly contacted with the polaroid 14, the second inorganic layer is easy to be extruded to cause cracks due to weak strength, and after the polaroid 14 is attached, the organic light-emitting display panel is also subjected to reliability tests such as high temperature and high humidity, and in the reliability test process, water vapor and oxygen are easy to enter the organic light-emitting layer through the cracks to influence the display of the organic light-emitting display panel, so that the problems of color deficiency and the like are caused.
This implementation provides an organic light emitting display panel has set up buffer layer 15 between film packaging layer 13 and polaroid 14, and buffer layer 15 pliability is higher, can reduce the damage of polaroid 14 to the second inorganic layer. Polarizer 14 is then attached to buffer layer 15 over buffer layer 15 by adhesive glue layer 16.
The organic light-emitting display panel provided by the embodiment of the invention is sequentially provided with the substrate base plate, the organic light-emitting layer and the film packaging layer in a laminating way, and the buffer layer is arranged between the film packaging layer and the polaroid before the polaroid is arranged on the film packaging layer, so that the direct contact and lamination of the polaroid to the film packaging layer are avoided, the damage of the polaroid to the film packaging layer is prevented, the problems of color deficiency or abnormal display caused by the attachment of the polaroid to the existing organic light-emitting display panel are solved, the probability of the organic light-emitting display panel passing the reliability test is increased, and the yield of the organic light-emitting display panel production is improved.
On the basis of the above embodiment, the buffer layer 15 can be formed by coating or ink-jetting, and a uniform and flat buffer layer 15 is formed on the thin film encapsulation layer 13. Optionally, the buffer layer 15 is made of acrylic polymer, silicon-based polymer, or epoxy polymer. The materials are heated to be in a softening or melting state, are formed on the thin film packaging layer 13 in a coating or ink-jet mode, and are recovered to be in a solid state after being at normal temperature to form the buffer layer 15 with strong transparency, high chemical stability, high heat resistance and strong weather resistance.
Alternatively, the buffer layer 15 is attached to the film encapsulation layer 13 through a protective film. The formation material of the buffer layer 15 may be coated on a protective film having the same size as the thin film encapsulation layer 13 in a direction parallel to the organic light emitting display panel, and then the side of the protective film coated with the buffer layer 15 is attached to the thin film encapsulation layer 13, so that the buffer layer 15 is attached to the thin film encapsulation layer 13, which is a simple process. Meanwhile, the existence of the protective film can also protect the thin film packaging layer 13 in the subsequent moving process of the organic light-emitting display panel, so that the thin film packaging layer 13 is prevented from being scratched. Then, the protective film is removed before attaching polarizer 14. In this embodiment, the release force between the protection film and the buffer layer 15 is smaller than the release force between the buffer layer 15 and the thin film encapsulation layer 13, preferably, the protection film may be a release film, which is convenient for attaching the buffer layer 15 to the thin film encapsulation layer 13.
The release force is a peeling force for peeling the buffer layer 15 from the adhered surface, and the peeling force for peeling the protective film from the buffer layer 15 is smaller than the peeling force for peeling the buffer layer 15 from the film encapsulation layer 13, so that the buffer layer 15 does not have the phenomena of degumming and the like in the subsequent process.
Optionally, the protective film is made of polypropylene, polyethylene, polyvinyl chloride, styrene or ABS plastic. The product surface of the material of the protective film has a greasy feeling and small release force, and the scheme of attaching the buffer layer 15 through the protective film in the embodiment is convenient to realize.
Optionally, the buffer layer 15 is made of a pressure sensitive adhesive or an optically transparent adhesive. When the buffer layer 15 is attached through the protective film, the buffer layer 15 needs to have high bonding strength, and the pressure-sensitive adhesive or the optical transparent adhesive has high light transmittance and good bonding strength. Can be cured at room temperature or medium temperature, and has small curing shrinkage. And the buffer layer 15 made of pressure-sensitive adhesive or optical transparent adhesive has good temperature resistance, high oxidation resistance and strong corrosion resistance, and can play a good role in protecting the thin film packaging layer 13.
Optionally, referring to fig. 2, fig. 2 is a cross-sectional view of another organic light emitting display panel according to an embodiment of the present invention, in another embodiment of the present invention, the buffer layer 15 is reused as a first adhesive layer for adhering the thin film encapsulation layer 13 and the polarizer 14, and a thickness of the buffer layer 15 is in a range of 20 to 50 μm. In the organic light emitting display panel shown in fig. 1, when the buffer layer 15 is disposed by coating, ink-jetting or by a protective film attachment, the polarizer 14 is subsequently required to be attached to the film encapsulation layer 13 through the adhesive layer 16, in order to save the process, the material of the buffer layer 15 may be selected as a material with strong cohesiveness, so that the buffer layer 15 can not only play a role in preventing the polarizer 14 from damaging the film encapsulation layer 13, but also can be attached to the buffer layer 15, i.e., the buffer layer 15 is reused as a first adhesive layer for adhering the film encapsulation layer 13 and the polarizer 14, and the adhesive layer 16 is not required to be disposed, optionally, the material of the buffer layer 15 of the organic light emitting display panel shown in fig. 2 is a pressure-sensitive adhesive, i.e., the material of the first adhesive layer is a pressure-sensitive adhesive, but when the existing material of the adhesive layer 16 is a pressure-sensitive adhesive, the thickness is generally set to be 10 to 20 μm, if the thickness of the buffer layer 15 (first adhesive layer) is 20 to 50 μm, the protection effect of the buffer layer 15 is enhanced. The material of the buffer layer 15 may be other materials with strong cementation property, and this embodiment is not limited to this.
Optionally, the buffer layer 15 is reused as a second adhesive layer for adhering the film packaging layer 13 and the polarizer 14, and the thickness of the buffer layer is 10-20 μm.
Referring to fig. 3, fig. 3 is a cross-sectional view of another organic light emitting display panel according to an embodiment of the present invention, in which the buffer layer 15 in this embodiment can be reused as a second adhesive layer for adhering the thin film encapsulation layer 13 and the polarizer 14, the second adhesive layer and the first adhesive layer are made of different materials, and the second adhesive layer has higher buffer performance compared to the first adhesive layer, that is, the second adhesive layer has stronger protection capability. The thickness of the buffer layer 15 (second adhesive layer) may be set to 10 to 20 μm. The thickness of the organic light emitting display panel can be reduced as a whole, and the manufacturing process of the organic light emitting display panel can be reduced.
Alternatively, the buffer layer 15 of the organic light emitting display panel shown in fig. 3 may be made of an optically transparent adhesive. The optical transparent adhesive has better buffering performance than a pressure-sensitive adhesive, and can better protect the second inorganic layer at the top of the thin film packaging layer 13 on the premise of saving materials.
The embodiment of the invention also provides a manufacturing method of the organic light-emitting display panel, which can be used for manufacturing the organic light-emitting display panel shown in any embodiment. Referring to fig. 4, fig. 4 is a flowchart of a method for manufacturing an organic light emitting display panel according to an embodiment of the present invention, where the method includes:
and S110, forming a substrate base plate.
And S120, forming an organic light-emitting layer on the substrate.
And S130, forming a thin film packaging layer covering the organic light emitting layer.
S140, forming a buffer layer on the thin film packaging layer; and attaching a polarizer on the buffer layer.
The manufacturing method of the organic light-emitting display panel provided by the embodiment of the invention is characterized in that the substrate base plate, the organic light-emitting layer and the film packaging layer are sequentially stacked, the buffer layer is arranged between the film packaging layer and the polaroid before the polaroid is arranged on the film packaging layer, the direct contact and lamination of the polaroid on the film packaging layer are avoided, the damage of the polaroid on the film packaging layer is prevented, the problems of color deficiency or abnormal display caused by the attachment of the polaroid on the existing organic light-emitting display panel are solved, the probability of the organic light-emitting display panel passing the reliability test is increased, and the yield of the organic light-emitting display panel is improved.
Specifically, a specific process of a manufacturing method of a display panel is described below by way of example, and fig. 5 is a cross-sectional view of a structure corresponding to each step of the manufacturing method of the display panel according to the embodiment of the present invention.
A base substrate 11 is formed.
An organic light emitting layer 12 is formed to cover the base substrate 11, and a thin film encapsulation layer 13 is formed to cover the organic light emitting layer 12.
The surface of the protective film 17 coated with the buffer layer 15 is attached to the film encapsulation layer 13.
The protective film 17 is peeled off and the buffer layer 15 remains on the thin film encapsulation layer 13.
The polarizer 14 is attached to the buffer layer 15 by an adhesive layer 16.
In this embodiment, before attaching the polarizer 14, first, a buffer layer 15 is attached on the film encapsulation layer 13 through the protection film 17, and then the protection film 17 is easily peeled off because the protection film 17 has a small release force, so that only one buffer layer 15 remains on the film encapsulation layer 13, and the process is simple and easy to operate.
Optionally, the buffer layer 15 is made of a pressure sensitive adhesive or an optically transparent adhesive.
Optionally, the protective film 17 is made of polypropylene, polyethylene, polyvinyl chloride, styrene or ABS plastic. The product surface of the material of the protective film has a greasy feeling and small release force, and the scheme of attaching the buffer layer 15 through the protective film in the embodiment is convenient to realize.
In another example of the present invention, a specific process of another method for manufacturing a display panel is described, and referring to fig. 6, fig. 6 is a flowchart of another method for manufacturing an organic light emitting display panel according to an embodiment of the present invention, where the method includes:
and S210, forming a substrate base plate.
And S220, forming an organic light-emitting layer on the substrate.
And S230, forming a thin film packaging layer covering the organic light emitting layer.
And S240, forming a buffer layer on the thin film packaging layer in a coating or ink-jet mode.
And S250, attaching the polarizer to the buffer layer through the adhesive layer.
The method of fabricating the organic light emitting display panel shown in fig. 6 can form the organic light emitting display panel with a cross-sectional structure as shown in fig. 1, and form a uniform and flat buffer layer 15 on the thin film encapsulation layer 13 by coating or ink-jet. Optionally, the buffer layer 15 is made of acrylic polymer, silicon-based polymer, or epoxy polymer. The material has the characteristics of strong transparency, high chemical stability, high strength and strong weather resistance, and is favorable for protecting the second inorganic layer on the uppermost layer in the film packaging layer 13.
Referring to fig. 7, fig. 7 is a flowchart of a method for manufacturing another organic light emitting display panel according to an embodiment of the present invention, where the method includes:
and S310, forming a substrate base plate.
And S320, forming an organic light-emitting layer on the substrate.
And S330, forming a thin film packaging layer covering the organic light emitting layer.
S340, thickening the first adhesive layer between the film packaging layer and the polarizer to form a buffer layer, wherein the thickness of the buffer layer is 20-50 μm.
And S350, attaching a polarizer on the buffer layer.
The method for manufacturing the organic light emitting display panel shown in fig. 7 can form the organic light emitting display panel with the cross-sectional structure shown in fig. 2, when the polarizer 14 is attached to the film encapsulation layer 13 by using the adhesive layer 16, the first adhesive layer is selected as the adhesive layer 16, and the first adhesive layer is thickened, so that the first adhesive layer can function in adhering the polarizer 14 and the film encapsulation layer 13, and can be reused as the buffer layer 15, and the buffer layer 15 is coated without another process, thereby saving the manufacturing cost. Optionally, the buffer layer 15 is made of pressure sensitive adhesive.
Referring to fig. 8, fig. 8 is a flowchart of a method for manufacturing another organic light emitting display panel according to an embodiment of the present invention, where the method includes:
and S410, forming a substrate base plate.
And S420, forming an organic light-emitting layer on the substrate.
And S430, forming a thin film packaging layer covering the organic light emitting layer.
S440, replacing the first adhesive layer between the film packaging layer and the polarizer with a second adhesive layer with stronger buffering performance to form a buffer layer, wherein the thickness range of the buffer layer is 10-20 microns.
S450, attaching a polarizer on the buffer layer.
The method for manufacturing the organic light emitting display panel shown in fig. 8 can form the organic light emitting display panel with a cross-sectional structure shown in fig. 3, the method for manufacturing shown in fig. 8 corresponds to the method for manufacturing shown in fig. 7, the first adhesive layer for bonding the thin film encapsulation layer 13 and the polarizer 14 is replaced by the second adhesive layer with better buffering performance, and similarly, the second adhesive layer is reused as the buffer layer, so that the manufacturing process and the material cost are saved, and the thickness range of the second adhesive layer (buffer layer) is 10-20 μm because the second adhesive layer has stronger buffering performance, so that the thickness of the whole organic light emitting display panel is reduced, and optionally, the buffer layer is made of an optically transparent adhesive.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (5)
1. An organic light emitting display panel, comprising: a substrate base plate;
an organic light emitting layer disposed on the substrate base plate;
the thin film packaging layer covers the organic light emitting layer, and the polaroid is arranged on the thin film packaging layer;
a buffer layer is arranged between the thin film packaging layer and the polaroid;
the polaroid is attached to the buffer layer through an adhesive layer;
the buffer layer is attached to the thin film packaging layer through a protective film; removing the protective film before attaching the polarizer; the release force between the protective film and the buffer layer is smaller than the release force between the buffer layer and the thin film packaging layer;
the buffer layer is made of pressure-sensitive adhesive, the buffer layer is reused as a first adhesive layer for adhering the film packaging layer and the polaroid, and the thickness range of the first adhesive layer is 20-50 microns; or the buffer layer is made of optical transparent adhesive, the buffer layer is a second adhesive layer for adhering the film packaging layer and the polaroid, and the thickness range of the second adhesive layer is 10-20 microns.
2. The organic light-emitting display panel according to claim 1, wherein:
the buffer layer is formed by coating or ink-jetting.
3. The organic light-emitting display panel according to claim 1, wherein the thin film encapsulation layer comprises:
a first inorganic layer disposed on the organic light emitting layer; an organic layer disposed on the first inorganic layer; and a second inorganic layer disposed on the organic layer.
4. A method for manufacturing an organic light emitting display panel includes:
forming a substrate base plate;
forming an organic light emitting layer on the base substrate;
forming a thin film encapsulation layer covering the organic light emitting layer;
attaching the surface of the protective film coated with the buffer layer to the thin film packaging layer;
stripping the protective film and enabling the buffer layer to remain on the thin film packaging layer;
attaching a polarizer on the buffer layer;
the buffer layer is made of pressure-sensitive adhesive, the buffer layer is a first adhesive layer for adhering the thin film packaging layer and the polaroid, and the thickness range of the first adhesive layer is 20-50 microns; or the buffer layer is made of optical transparent adhesive, the buffer layer is a second adhesive layer for adhering the film packaging layer and the polaroid, and the thickness range of the second adhesive layer is 10-20 microns.
5. The method of claim 4, wherein forming a buffer layer on the thin film encapsulation layer comprises:
and forming a buffer layer on the thin film packaging layer by coating or ink-jetting.
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| KR101141533B1 (en) * | 2005-06-25 | 2012-05-04 | 엘지디스플레이 주식회사 | Method for carrying substrate and method for flexible display using the same |
| TWI437526B (en) * | 2012-04-02 | 2014-05-11 | Au Optronics Corp | Flexible display panel and method of packaging flexible display panel |
| CN104685018B (en) * | 2012-08-02 | 2017-02-22 | Lg化学株式会社 | Adhesive film and method for encapsulating organic electronic device using same |
| CN104659051B (en) * | 2013-11-20 | 2018-11-23 | 昆山国显光电有限公司 | Organic light emitting diode display |
| CN103682154B (en) * | 2013-12-10 | 2016-01-27 | 京东方科技集团股份有限公司 | A kind of organic elctroluminescent device and display unit |
| TWI514564B (en) * | 2013-12-10 | 2015-12-21 | Au Optronics Corp | Display panel and method of making the same |
| CN103682155A (en) * | 2013-12-10 | 2014-03-26 | 京东方科技集团股份有限公司 | Organic electroluminescence display, optical thin film stacking body of organic electroluminescence display and preparing method of optical thin film stacking body |
| CN104049294A (en) * | 2014-06-09 | 2014-09-17 | 上海和辉光电有限公司 | Polaroid structure, display panel and manufacturing method of polaroid |
| CN205608343U (en) * | 2016-04-28 | 2016-09-28 | Tcl显示科技（惠州）有限公司 | Display device |
| CN107464824B (en) * | 2016-06-03 | 2020-02-21 | 上海和辉光电有限公司 | Display panel |
| CN106711174B (en) * | 2016-12-07 | 2020-01-17 | 上海天马微电子有限公司 | Display mother board, flexible display panel, flexible display device and manufacturing method |
| CN106711184B (en) * | 2017-03-14 | 2020-01-31 | 上海天马微电子有限公司 | Display panel manufacturing method, display panel and display device |
| CN107706216A (en) * | 2017-09-19 | 2018-02-16 | 信利（惠州）智能显示有限公司 | AMOLED modules and preparation method thereof |
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