CN110244800A - High temperature heat test sensor pastes solidification equipment - Google Patents
High temperature heat test sensor pastes solidification equipment Download PDFInfo
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- CN110244800A CN110244800A CN201910554578.4A CN201910554578A CN110244800A CN 110244800 A CN110244800 A CN 110244800A CN 201910554578 A CN201910554578 A CN 201910554578A CN 110244800 A CN110244800 A CN 110244800A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
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- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention discloses can be used in sensor in a kind of large-scale parts or the high temperature heat test of aircraft complete machine ground to paste cured packaged type apparatus for baking, the device is by master control screen man-machine interaction unit, temperature controller unit, silicon-controlled unit, Switching Power Supply, infrared lamp, thermocouple, cabinet, the parts such as mobile bracket form, temperature controller unit acquires thermo-electric couple temperature data in real time, master control screen man-machine interaction unit is handled and is shown to the temperature data measured, according to set target value or setting curve, temperature controller unit controls silicon-controlled unit, adjust the voltage swing of access infrared lamp, to obtain suitable high-temperature baking temperature, high temperature adhesive is heated.High temperature heat test sensor stickup solidification equipment provided by the invention is reasonable in design, and the response time is fast, and heating and temperature control is accurate, can easily realize the stickup solidification of sensor in spacecraft high temperature heat test.
Description
Technical field
The invention belongs to aircraft ground heat test technical fields, and in particular to one kind is applied to high temperature heat test sensor
Paste solidification equipment.
Background technique
High temperature adhesive is generally used to paste measurement sensor, the high temperature that current maturation uses when spacecraft high temperature heat test
Adhesive generally requires to assist its solidification according to its solidification temperature curve when implementing barbola work.It is needed by heating cure
Temperature is grasped, temperature is excessively high, and liquid can be changed into steam in glue, so that glue bubble, or even rupture, temperature is too low, can prolong
Long curing time, solidification effect is not achieved；Therefore, high-low temperature chamber is often used to set in the small-sized parts test of spacecraft
The cured temperature of adhesive and duration, but height is not available in large component or the high temperature heat test of aircraft complete machine ground
Cryogenic box, it is therefore desirable to design a kind of conveniently moving, the high temperature heat test sensor of temperature-controllable pastes solidification equipment, test
Scene is used for the solidification of high temperature adhesive.
Current solidification equipment existing on the market mostly uses the Hot-blast Heating of contact conduction heating or convection type, this two
Kind heating method has the problem that heating rate is slow, and the temperature control reaction time is slow and precision is low, is not able to satisfy spacecraft heat examination
The demand tested.The stickup solidification equipment of infrared heating was invented by part of the manufacturer or research institute, but there are several aspects not
Foot cannot carry out curing operation to multiple sticking areas simultaneously first is that using single infrared heating head；Second is that controlling party
Formula is rough, cannot accurately adjust the output of solidification temperature；Third is that structure design is not able to satisfy the need of Large Spacecraft hot test
It asks, can only realize simple lifting or rotation, can not meet different height and angle affixed points heating requirements.
Summary of the invention
Based on above-mentioned technical problem, goal of the invention of the invention is to provide a kind of large-scale parts or aircraft complete machine
It can be used in sensor in the high temperature heat test of ground and paste cured packaged type device.
The purpose of the present invention is what is be achieved through the following technical solutions:
Sensor pastes solidification equipment, including band thermocouple when for large-scale parts or aircraft complete machine high temperature heat test
The temperature control subsystem of signal input and control voltage output, mobile adjustable infrared heating subsystem, 24V Switching Power Supply, cabinet；
The temperature control subsystem specifically includes that master control screen man-machine interaction unit, temperature controller unit, silicon-controlled unit, adjusting
Voltage output unit connects input unit with signal, and five units of temperature control subsystem are integrated in cabinet；Infrared heating subsystem
It specifically includes that signal output unit, adjust voltage input unit, measuring unit, infrared heating unit and vertical height and cross
To length and the mobile bracket of adjustable angle, 24V Switching Power Supply is system module power supply；Wherein, the signal of measuring unit is logical
The signal connection input unit of signal output unit access temperature control subsystem is crossed, temperature controller unit acquires electric thermo-couple temperature number in real time
According to master control screen man-machine interaction unit is handled and shown to the temperature data measured, bent according to set target value or setting
Line, temperature controller unit control silicon-controlled unit, the voltage swing of voltage output unit output are adjusted, according to temperature controller list
The pid algorithm output of the Self-tuning System of member adjusts the voltage of voltage output unit output by adjusting voltage input unit access digit
Infrared heating unit on adjustable mobile bracket, infrared heating unit heat high temperature adhesive.
Wherein, the human-computer interaction master control screen unit and 4 temperature controller units pass through RS485 bus communication, each unit
Module has a unique address in RS485 bus, each unit module defers to MODBUS RTU communication protocol, by touch-control
Screen carries out parameter setting and reading data to each circuit temperature-controlling instrument as main control unit.
Wherein, the temperature controller unit leads to 0.25 grade of 40 sections of temperature control curve intelligent PID number of MAC3D using the Japan island SHIMA
Regulation device temperature controller, acquires thermo-electric couple temperature data in real time, according to the target value of master control screen setting or setting curve, to can
Control silicon unit is controlled, and the voltage swing of voltage output unit output is adjusted.
Wherein, the silicon-controlled unit is silicon-controlled using Shanghai Jing Zheng Electronic Science and Technology Co., Ltd. MT2AC-1-220V 25A
Module, the control mode of silicon controlled module are 4-20mA current control mode.
Wherein, the signal measurement unit is thermocouple, and signal accesses temperature controller host by thermocouple extension line
Signal introduces unit, and temperature controller acquires thermo-electric couple temperature data in real time.
Wherein, the Switching Power Supply uses the DC power supply of 24V 5A 120W, is the mould of system in rated operating range
Block power supply.
Wherein, the cabinet uses standard 4U cabinet.
Wherein, the mobile bracket of the infrared lamp uses modularized design, and main building block includes: movable pedestal, erects
Straight telescopic rod, horizontal extension bar, lamp cap fixation member and rotary part.Vertical telescopic rod is stood on movable pedestal, and level is stretched
Contracting bar is connect by rotary part with vertical telescopic rod, and lamp cap fixation member is connect with horizontal extension bar.
Wherein, movable pedestal is X-shaped steel plate, and universal wheel is installed in quadrangle；
Wherein, vertical telescopic rod 1.3-2.6 meters adjustable, rotating nuts counterclockwise stretch out connecting rod and are screwed again to reach
Regulating effect；
Wherein, maximum scalable 1 meter of horizontal extension bar, main function is fixed lamp cap, links vertical telescopic rod；It can 180
Degree rotation is adjusted, and lamp cap can 270 degree of adjustings；
Wherein, lamp cap fixation member includes small aluminium sheet and regulating member, and small aluminium sheet connects lamp and horizontal extension bar, junction
Universal adjustment is carried out using ball；Rotary part left end connects vertical telescopic rod, and right end connects horizontal extension bar, intermediate orbit
Cross bar can be made to achieve the effect that 180 degree rotates, right end handle plays fastening effect.
High temperature heat test sensor provided by the invention paste solidification equipment it is reasonable in design, it can be achieved that move freely,
Vertical height and lateral length and three-dimensional perspective are freely adjusted；Infrared heating unit energy density is high, and the response time is fast, can
To be brought rapidly up in a short time；Heating unit is accurately controlled by control system, to meet curing process requirement；
Whole device is easy to use, can easily realize the stickup solidification of sensor in spacecraft high temperature heat test.
Detailed description of the invention
Fig. 1 is that sensor when being used for large-scale parts or aircraft complete machine high temperature heat test of the invention pastes solidification equipment
The structural schematic diagram of middle temperature control subsystem；
Fig. 2 is that sensor when being used for large-scale parts or aircraft complete machine high temperature heat test of the invention pastes solidification equipment
The structural schematic diagram of middle heating sub-system；
Fig. 3 is that sensor when being used for large-scale parts or aircraft complete machine high temperature heat test of the invention pastes solidification equipment
Electrical connection schematic diagram.
Fig. 4 is that sensor when being used for large-scale parts or aircraft complete machine high temperature heat test of the invention pastes solidification equipment
The mobile supporting structure schematic diagram of middle infrared lamp.
Specific embodiment
Introduced below is the specific embodiment as content of the present invention, below by specific embodiment to this
The content work of invention further illustrates.Certainly, description following detailed description is only example not Tongfang of the invention
The content in face but should not be understood as the limitation scope of the invention.
Pasting solidification equipment for high temperature heat test sensor mainly includes two parts: band thermocouple signal is inputted and is controlled
The temperature control subsystem of voltage output and mobile adjustable infrared heating subsystem.As shown in Figure 1, as shown in Figure 1, temperature control subsystem
It specifically includes that master control screen man-machine interaction unit 1, temperature controller unit 2, silicon-controlled unit 3, adjust voltage output unit 4 and signal
Connect input unit 5.As shown in Fig. 2, infrared heating subsystem specifically includes that signal output unit 6, adjusts voltage input unit
7, the mobile bracket 10 of measuring unit 8, infrared heating unit 9 and vertical height and lateral length and adjustable angle.
Temperature control subsystem specifically includes that master control screen man-machine interaction unit 1, temperature controller unit 2, silicon-controlled unit 3, adjusts electricity
Pressure output unit 4 connects input unit 5 with signal.As shown in Fig. 2, infrared heating subsystem specifically includes that signal output unit
6, voltage input unit 7, measuring unit 8, infrared heating unit 9 and vertical height and lateral length and adjustable angle are adjusted
Mobile bracket 10.Present invention is mainly used for large-scale parts or the high temperature heat tests of aircraft complete machine ground, are not available height
In the case where cryogenic box, the solidification of high temperature adhesive is completed by infrared lamps in testing ground.
Before carrying out high temperature barbola work, thermocouple signal will be tested by thermocouple extension line and access temperature control subsystem
Signal connects input unit 5, and acquisition thermo-electric couple temperature data, master control show the data progress to measuring to temperature controller unit 2 in real time
It handles and shows, silicon-controlled unit 3 is controlled according to set target value or setting curve, temperature controller unit 2, adjusts electricity
The voltage swing for pressing output unit 4 to export is exported according to the pid algorithm of the Self-tuning System of temperature controller 2.It is defeated to adjust voltage output unit 4
Voltage out is accessed by adjusting voltage input unit 7, and infrared heating unit 9 is heated.The temperature controller unit uses day
The island this SHIMA leads to 0.25 grade of 40 sections of temperature control curve intelligent PID digital governer temperature controller of MAC3D.
As shown in figure 3, the control of apparatus of the present invention temperature is mainly completed by following several modular units: master control screen is man-machine
The units such as interactive unit, temperature controller unit, silicon-controlled unit, 24V Switching Power Supply, infrared lamp and thermocouple, cabinet.Master control screen and
It being communicated between temperature controller unit by RS485, each unit module has a unique address in RS485 bus, each
Unit module defers to MODBUS RTU communication protocol, and outputting and inputting for each unit is controlled as master control by touch screen.
By the temperature control curve of the settable each temperature controller module of master control screen, different songs is realized by different process requirements
The control of line temperature.The output of silicon controlled module unit controls the voltage of infrared heat lamp to realize temperature controlled function.
The present apparatus can carry out temperature control to 4 regions simultaneously.By PID Self-tuning System algorithm, can simplify efficient
Temperature spot is controlled.
The mobile bracket of infrared lamp uses modularized design, and whole height is controllably within the scope of 1.3 meters -3.6 meters, and main group
It include: movable pedestal 11, vertical telescopic rod 12, horizontal extension bar 13, lamp cap fixation member 14 and rotary part 15 at component,
Effect in kind is as shown in Figure 4.
Movable pedestal is X-shaped steel plate, and universal wheel is installed in quadrangle；
Vertical 1.3-2.6 meters of telescopic rod is adjustable, rotating nuts counterclockwise, stretches out connecting rod and is screwed again to reach and adjust effect
Fruit；
Maximum scalable 1 meter of horizontal extension bar, main function is fixed lamp cap, links vertical telescopic rod；It can 180 degree rotation
It adjusts, lamp cap can 270 degree of adjustings；
Lamp cap fixation member includes small aluminium sheet and regulating member, and small aluminium sheet connection lamp and horizontal extension bar, junction use
Ball carries out universal adjustment；
Rotary part left end connects vertical telescopic rod, and right end connects horizontal extension bar, and intermediate orbit can be such that cross bar reaches
The effect rotated to 180 degree, right end handle play fastening effect.
Although the detailed description and description of the specific embodiments of the present invention are given above, it should be noted that
Those skilled in the art can spirit according to the present invention various equivalent changes and modification, institute are carried out to above embodiment
The function of generation, should all be within that scope of the present invention in the spirit covered without departing from specification and attached drawing.
Claims (11)
1. sensor pastes solidification equipment when for large-scale parts or aircraft complete machine high temperature heat test, including band thermocouple is believed
Temperature control subsystem, mobile adjustable the infrared heating subsystem, 24V Switching Power Supply, cabinet of number input and control voltage output；
The temperature control subsystem specifically includes that master control screen man-machine interaction unit, temperature controller unit, silicon-controlled unit, adjusts voltage
Output unit connects input unit with signal, and five units of temperature control subsystem are integrated in cabinet；Infrared heating subsystem is main
Include: signal output unit, adjust voltage input unit, measuring unit, infrared heating unit and vertical height and laterally length
The mobile bracket of degree and adjustable angle, 24V Switching Power Supply are system module power supply；Wherein, the signal of measuring unit passes through letter
The signal of number output unit access temperature control subsystem connects input unit, and temperature controller unit acquires thermo-electric couple temperature data in real time,
Master control screen man-machine interaction unit is handled and is shown to the temperature data measured, according to set target value or sets curve,
Temperature controller unit controls silicon-controlled unit, the voltage swing of voltage output unit output is adjusted, according to temperature controller unit
Self-tuning System pid algorithm output, adjust voltage output unit output voltage by adjust voltage input unit access is located at
Infrared heating unit on adjustable mobile bracket, infrared heating unit heat high temperature adhesive.
2. sensor as described in claim 1 pastes solidification equipment, wherein the human-computer interaction master control screen unit and 4 controls
Warm instrument unit has a unique address, each list by RS485 bus communication, each unit module in RS485 bus
Element module defers to MODBUS RTU communication protocol, by touch screen as main control unit to each circuit temperature-controlling instrument carry out parameter setting and
Reading data.
3. sensor as described in claim 1 pastes solidification equipment, wherein the temperature controller unit is using temperature control curve intelligence
Pid number adjuster temperature controller, acquires thermo-electric couple temperature data in real time, bent according to the target value of master control screen setting or setting
Line controls silicon-controlled unit, adjusts the voltage swing of voltage output unit output.
4. sensor as described in claim 1 pastes solidification equipment, wherein the control mode of the silicon-controlled unit is 4-
20mA current control mode.
5. sensor as described in claim 1 pastes solidification equipment, wherein the signal measurement unit is thermocouple, letter
Number unit is introduced by the signal that thermocouple extension line accesses temperature controller host, temperature controller acquires thermo-electric couple temperature data in real time.
6. sensor as described in claim 1 pastes solidification equipment, wherein the Switching Power Supply uses DC power supply, in volume
Determine the module for power supply in power bracket for system.
7. sensor as described in claim 1 pastes solidification equipment, wherein the mobile bracket of the infrared lamp is set using modularization
Meter, main building block include: movable pedestal, vertical telescopic rod, horizontal extension bar, lamp cap fixation member and rotary part,
Vertical telescopic rod is stood on movable pedestal, and horizontal extension bar is connect by rotary part with vertical telescopic rod, lamp cap fixed part
Part is connect with horizontal extension bar.
8. sensor as described in claim 1 pastes solidification equipment, wherein movable pedestal is X-shaped steel plate, quadrangle installation ten thousand
To wheel.
9. sensor as described in claim 1 pastes solidification equipment, wherein vertical 1.3-2.6 meters of telescopic rod is adjustable, counterclockwise
Rotating nuts stretch out connecting rod and are screwed again to reach regulating effect.
10. sensor as described in claim 1 pastes solidification equipment, wherein maximum scalable 1 meter of horizontal extension bar, mainly
Effect is fixed lamp cap, connects vertical telescopic rod, can 180 degree rotation adjust, lamp cap can 270 degree adjust.
11. sensor as described in claim 1 pastes solidification equipment, wherein lamp cap fixation member includes small aluminium sheet and adjusting
Component, small aluminium sheet connection lamp and horizontal extension bar, junction carry out universal adjustment using ball；The connection of rotary part left end is perpendicular
Straight telescopic rod, right end connect horizontal extension bar, and intermediate orbit makes cross bar achieve the effect that 180 degree rotates, and right end handle plays
Fastening effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910554578.4A CN110244800A (en) | 2019-06-25 | 2019-06-25 | High temperature heat test sensor pastes solidification equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910554578.4A CN110244800A (en) | 2019-06-25 | 2019-06-25 | High temperature heat test sensor pastes solidification equipment |
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| CN110244800A true CN110244800A (en) | 2019-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910554578.4A Pending CN110244800A (en) | 2019-06-25 | 2019-06-25 | High temperature heat test sensor pastes solidification equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110918418A (en) * | 2019-11-29 | 2020-03-27 | 西安航天动力测控技术研究所 | Curing device for high-temperature strain pasting of large test piece |
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|---|---|---|---|---|
| CN102391794A (en) * | 2011-07-27 | 2012-03-28 | 上海交通大学 | Device and method for controlling glue joint curing deformation of dissimilar material |
| CN103399600A (en) * | 2013-08-19 | 2013-11-20 | 大连交通大学 | Coil bar solidification heating control system |
| CN105388938A (en) * | 2015-11-23 | 2016-03-09 | 上海卫星装备研究所 | Precise temperature control device applied to large-sized non-collimated earth simulator |
| CN207981573U (en) * | 2017-11-27 | 2018-10-19 | 杭州莱维光电技术有限公司 | Infrared heating viscose glue solidification equipment |
| CN208512941U (en) * | 2018-05-30 | 2019-02-19 | 广州福耀玻璃有限公司 | Glass glue-spreading solidifies heating device |
-
2019
- 2019-06-25 CN CN201910554578.4A patent/CN110244800A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102391794A (en) * | 2011-07-27 | 2012-03-28 | 上海交通大学 | Device and method for controlling glue joint curing deformation of dissimilar material |
| CN103399600A (en) * | 2013-08-19 | 2013-11-20 | 大连交通大学 | Coil bar solidification heating control system |
| CN105388938A (en) * | 2015-11-23 | 2016-03-09 | 上海卫星装备研究所 | Precise temperature control device applied to large-sized non-collimated earth simulator |
| CN207981573U (en) * | 2017-11-27 | 2018-10-19 | 杭州莱维光电技术有限公司 | Infrared heating viscose glue solidification equipment |
| CN208512941U (en) * | 2018-05-30 | 2019-02-19 | 广州福耀玻璃有限公司 | Glass glue-spreading solidifies heating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110918418A (en) * | 2019-11-29 | 2020-03-27 | 西安航天动力测控技术研究所 | Curing device for high-temperature strain pasting of large test piece |
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Application publication date: 20190917 |
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