CN110238143A - FOUP cleaning device - Google Patents
FOUP cleaning device Download PDFInfo
- Publication number
- CN110238143A CN110238143A CN201910515897.4A CN201910515897A CN110238143A CN 110238143 A CN110238143 A CN 110238143A CN 201910515897 A CN201910515897 A CN 201910515897A CN 110238143 A CN110238143 A CN 110238143A
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- CN
- China
- Prior art keywords
- foup
- cleaning
- chamber
- cleaning device
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0217—Use of a detergent in high pressure cleaners; arrangements for supplying the same
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to technical field of manufacturing semiconductors more particularly to a kind of FOUP cleaning devices.The FOUP cleaning device includes: cleaning chamber, and for accommodating FOUP, the FOUP has the accommodating chamber for accommodating wafer；First jet, it is intracavitary positioned at the cleaning, it is used for the accommodating chamber jet cleaning liquid；Driving structure, for driving the FOUP in the intracavitary rotation of cleaning, the cleaning solution in the accommodating chamber is discharged；Second nozzle, it is intracavitary positioned at the cleaning, for spraying gas to the accommodating chamber, with the remaining cleaning solution of drying.The present invention improves FOUP cleaning efficiency, reduces the risk that FOUP is damaged in the process of cleaning, also saves the human cost in cleaning process；Moreover, reducing the occupied area of FOUP cleaning device entirety.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors more particularly to a kind of FOUP cleaning devices.
Background technique
IC is formed on wafer, this is subjected to many processing steps, and each processing step is required specific
It is carried out in wafer processing chamber, these wafer processing chambers require to be maintained at vacuum or intimate vacuum in many cases,
In the environment of, normal process could be carried out to wafer.Therefore, in the treatment process of wafer, by wafer from one
During reason chamber is transferred to another processing chamber housing, atmosphere transmission module (Atmosphere Transfer is needed
Module, ATM), gas lock (Airlock), vacuum transmission module (Vacuum Transfer Module, VTM), front end open-type
The collaboration of same specification transport chamber or front end open-type universal cavity (Front Opening Unified Pod, FOUP) etc. is made
With realization.
In semiconductor fabrication, FOUP is temporarily stored as wafer and is transmitted between each operation board brilliant
Round tool plays the role of extremely important.Wafer is placed in the airtight cavity of FOUP, and holding chamber vivo environment
It is stable to ensure what wafer-process process stabilizing carried out it is possible to prevente effectively from wafer is contacted with the direct of external environment with cleaning
Meanwhile reducing influence of the environmental factor to wafer.
The cleaning for keeping FOUP device, is the important step for avoiding wafer contamination.After long-time use, inside FOUP device
The dirts such as meeting remaining dust, metal, therefore, it is necessary to periodically be cleaned to FOUP device.Existing FOUP device cleaning system
It is made of a cleaning agent slot, three pure water potchers and a dry slot.This allows for entire FOUP device cleaning system
Occupied area is larger, for the toilet of an inch of land is an inch of gold, undoubtedly increases the cost of semiconductors manufacture.And in each slot
Between shift FOUP device operation it is time-consuming and laborious, reduce the cleaning efficiency of FOUP device.In addition, repeatedly transfer also increases
The risk of FOUP device and cell wall collision, easily leads to the damage of FOUP device.
Therefore, how to improve the cleaning efficiency of FOUP, while reducing the occupied area of FOUP cleaning device, be at present urgently
The technical issues of solution.
Summary of the invention
The present invention provides a kind of FOUP cleaning device, and for solving, existing FOUP cleaning device cleaning efficiency is lower, accounts for
The larger problem of ground area.
To solve the above-mentioned problems, the present invention provides a kind of FOUP cleaning devices, comprising:
Chamber is cleaned, for accommodating FOUP, the FOUP has the accommodating chamber for accommodating wafer；
First jet, it is intracavitary positioned at the cleaning, it is used for the accommodating chamber jet cleaning liquid；
Driving structure, for driving the FOUP in the intracavitary rotation of cleaning, described in being discharged in the accommodating chamber
Cleaning solution；
Second nozzle, it is intracavitary positioned at the cleaning, it is remaining described clear with drying for spraying gas to the accommodating chamber
Washing lotion.
Preferably, the cleaning chamber includes the roof and bottom wall of Relative distribution；The FOUP cleaning device further include:
Lifting column, one end is connect with the roof, the other end is equipped with supersonic generator, and the lifting column being capable of edge
Vertical direction carries out elevating movement.
Preferably, the FOUP includes the front of Relative distribution, rear portion and between the front and rear and phase
To the top and bottom of distribution, the front has the opening for wafer disengaging；
The cleaning chamber further includes between the roof and the bottom wall and the first side wall of Relative distribution and second
Side wall；
The second sidewall surface has a bracket, for connecting with the bottom of the FOUP；
The axis rotation that the driving structure is used to that the FOUP to be driven to surround the FOUP, the axis is from the top
It is directed toward the bottom and passes through the center of the FOUP.
Preferably, the driving structure includes the driver and connecting rod outside the cleaning chamber；The one of the connecting rod
End connects the driver, the other end connects the bracket, for driving the bracket whole along the axis rotation.
Preferably, the driving structure includes the driver and connecting rod outside the cleaning chamber；Have in the bracket
There is a turntable for connecting with the bottom of the FOUP；One end of the connecting rod connects the driver, the other end connects institute
Bracket is stated, for driving the turntable around the axis rotation.
It preferably, further include shell and partition；Cavity made of the partition surrounds the shell is divided into described
Cleaning chamber and driving chamber, the driver are located at the driving chamber.
Preferably, the quantity of the first jet is multiple, and multiple first jets are at least distributed in described first
Side wall and the roof.
Preferably, the quantity of the second nozzle is multiple, and multiple second nozzles are at least distributed in described first
Side wall and the second sidewall.
Preferably, the bottom of the FOUP has an at least through-hole；The FOUP cleaning device further includes an at least pipeline,
The pipeline is used to transmit the gas from the through-hole to the accommodating chamber.
Preferably, the FOUP further includes the door-plate for closing the opening；There is a support on the first side wall
Plate；The support plate extends towards the second sidewall, for carrying the door-plate.
FOUP cleaning device provided by the invention, can one cleaning it is intracavitary be automatically performed wet-cleaning and drying, subtract
The transfer number in FOUP cleaning process is lacked, has improved FOUP cleaning efficiency, has reduced what FOUP was damaged in the process of cleaning
Risk also saves the human cost in cleaning process；Moreover, because multiple cleanings can be completed walking a cleaning is intracavitary
Suddenly, to reduce the occupied area of FOUP cleaning device entirety, the cost of semiconductors manufacture is reduced indirectly.
Detailed description of the invention
Attached drawing 1 is structural schematic diagram of the FOUP cleaning device of the specific embodiment of the invention in a cleaning state；
Attached drawing 2 is structural schematic diagram of the FOUP cleaning device of the specific embodiment of the invention in another cleaning state；
Attached drawing 3 is the structural schematic diagram of FOUP in the specific embodiment of the invention.
Specific embodiment
It elaborates with reference to the accompanying drawing to the specific embodiment of FOUP cleaning device provided by the invention.
Present embodiment provides a kind of FOUP cleaning device, and attached drawing 1 is the FOUP of the specific embodiment of the invention
Structural schematic diagram of the cleaning device in a cleaning state, attached drawing 2 is that the FOUP cleaning device of the specific embodiment of the invention exists
Structural schematic diagram when another cleaning state, attached drawing 3 are the structural schematic diagrams of FOUP in the specific embodiment of the invention.As Fig. 1,
Shown in Fig. 2 and Fig. 3, the FOUP cleaning device that present embodiment provides includes:
Chamber 10 is cleaned, for accommodating FOUP 11, the FOUP 11 has the accommodating chamber 115 for accommodating wafer；
First jet 12 is located in the cleaning chamber 10, is used for the 115 jet cleaning liquid of accommodating chamber；
Driving structure 14, for driving the FOUP 11 to rotate in the cleaning chamber 10, the accommodating chamber is discharged
The cleaning solution in 115；
Second nozzle 13 is located in the cleaning chamber 10, for spraying gas to the accommodating chamber 115, with dry residual
The cleaning solution.
Specifically, when being cleaned to the FOUP 11, the FOUP 11 is placed in the cleaning chamber 10,
Then the cleaning solution is sprayed to the accommodating chamber 115 by the first jet 12, to realize to the wet of the accommodating chamber 115
Method cleaning.Then, the FOUP 11 is driven to rotate in the cleaning chamber 10 by the driving mechanism 14, it is described to pour out
The cleaning solution in accommodating chamber 115.Then, gas is sprayed into the accommodating chamber 115 by the second nozzle 13, to remove
The cleaning solution remained in the accommodating chamber 115 is removed, realizes the drying to the accommodating chamber 115.
The cleaning of completion cleaning solution and gas that present embodiment can automate in a cleaning chamber 10 are dry
Dry two steps, reduce the transfer number of FOUP in the process of cleaning, thus improve the cleaning efficiency of FOUP, reduce
The risk that FOUP is damaged in the process of cleaning also saves the human cost in cleaning process.In addition, as only needing described in one
Cleaning solution cleaning and gas dry can be completed in cleaning chamber 10, thus reduce the occupied area of FOUP cleaning device entirety,
Connect the cost for reducing semiconductors manufacture.
Preferably, the cleaning chamber 10 includes the roof 101 and bottom wall 102 of Relative distribution；The FOUP cleaning device is also
Include:
Lifting column 23, one end is connect with the roof 101, the other end is equipped with supersonic generator 24, and the lifting
Column 23 can carry out elevating movement along the vertical direction.
Preferably, the front 111, rear portion 112 of the FOUP 11 including Relative distribution and it is located at 111 and of front
Between the rear portion 112 and top 113 and bottom 114 of Relative distribution, the front 111 have the opening for wafer disengaging；
The cleaning chamber 10 further includes between the roof 101 and the bottom wall 102 and the first side of Relative distribution
Wall 103 and second sidewall 104；
104 surface of second sidewall has a bracket 22, for connecting with the bottom 114 of the FOUP 11；
The axis rotation that the driving structure 14 is used to that the FOUP 11 to be driven to surround the FOUP 11, the axis is certainly
It is directed toward the bottom 114 and passes through the center of the FOUP 11 in the top 113.X-direction of the i.e. described axis in Fig. 1
Extend, and passes through the center of the FOUP 11.
In order to further increase the cleaning efficiency of the FOUP, improve cleaning effect, it is preferred that the first jet 12
Quantity is multiple, and multiple first jets 12 are at least distributed in the first side wall 103 and the roof 101.
Preferably, the quantity of the second nozzle 13 is multiple, and multiple second nozzles 13 be at least distributed in it is described
The first side wall 103 and the second sidewall 104.
Specifically, when being cleaned using the cleaning solution to the FOUP 11, by the bottom of the FOUP 11
It is fixed on the bracket 22, so that the front 111 of the FOUP 11 is upward (i.e. Y-axis positive direction in Fig. 1), described in exposure
The accommodating chamber 115 of FOUP 11, i.e., the described FOUP 11 is opening up for wafer disengaging, as shown in Figure 1.Then, it opens
It opens the first jet 12, close the second nozzle 13, be located at least in the institute of the first side wall 103 and the roof 101
First jet 12 is stated to start to spray the cleaning solution into the accommodating chamber 115 of the cleaning chamber 10 and the FOUP.When described
When the amount of cleaning solution in cleaning chamber 10 reaches a preset value, such as the cleaning solution floods the FOUP 11, the liter completely
It drops column 23 to decline, so that the supersonic generator 24 for being located at 23 end of lifting column immerses the cleaning solution, such as will
The supersonic generator 24 immerses in the cleaning solution in the accommodating chamber 115.24 tranmitting frequency of supersonic generator is big
In or equal to 20KHz ultrasonic signal, so that microbubble in the cleaning solution is kept vibration, destroy pollutant and the FOUP
Suction-operated between 11 surfaces, so that pollutant and the FOUP 11 are removed.Present embodiment is described super by being arranged
Sonic generator 24 improves the cleaning effect of the FOUP 11 using the cavitation and diffusion of ultrasonic wave.Due to
The first jet 12 is at least distributed in the first side wall 103 and the roof 101, therefore, can play simultaneously to described
Play cleaning effect in the outer surface of FOUP 11.Wherein, the cleaning solution can be deionized water.
After ultrasonic cleaning terminates, the supersonic generator 24 is closed, and the lifting column 23 rises to initial bit
It sets, so that the supersonic generator 24 is separated with the cleaning solution.It drives the FOUP 11 to rotate along the axis, i.e., will
The FOUP 11 is overturn along the vertical direction (i.e. Y direction), as shown in Fig. 2, making the cleaning solution from before the FOUP 11
The opening in portion 111 is discharged.The vacuum being connected to the first discharge port 191 for being located at cleaning 10 bottom of chamber is opened simultaneously
The cleaning solution in the cleaning chamber 10 in time, is quickly discharged in pump.At the same time it can also continue starting the first jet
12, it is cleaned with the outer surface further to the FOUP 11.Later, it closes the first jet 12, open described second
Nozzle 13, with the dry cleaning solution remained in the FOUP 11.It, can be with during drying 11 FOUP
The second outlet 192 for being located at cleaning 10 bottom of chamber is opened simultaneously, and the cleaning solution and/or dirt are mingled with timely discharge
Contaminate the gas of object.
During using 11 FOUP described in gas dry, it can also be driven by the driving structure 14 described
FOUP 11 is along the axis quick rotation, to further speed up the drying efficiency of the FOUP 11.The temperature of the gas
Preset value can be higher than, to further speed up drying efficiency.Wherein, the gas can be nitrogen or inert gas, it is described
Inert gas can be argon gas.
Preferably, the driving structure 14 includes the driver and connecting rod outside the cleaning chamber 10；The connecting rod
One end connect the driver, the other end connects the bracket 22, for drive the bracket 22 whole along the axis from
Turn.
Specifically, the bracket 22 is removably connect with the bottom 114 of the FOUP 11, such as the bracket 22
On be provided with multiple clamping jaws, the FOUP 11 is engaged by the clamping jaw, those skilled in the art can select according to actual needs
Select the specific connection type of the bracket 22 and FOUP 11.The driver drives the bracket edge by the connecting rod
The axis rotation, since the FOUP 11 is fixedly connected with the bracket 22, the rotation of the bracket 22 drives institute
State the rotation of FOUP 11.The driver can be but not limited to motor.
In other specific embodiments, the driving structure 14 include positioned at it is described cleaning chamber 10 outside driver with
Connecting rod；With a turntable for being connect with the bottom of the FOUP 11 in the bracket；Described in one end connection of the connecting rod
Driver, the other end connect the bracket, for driving the turntable along the axis rotation.In this fashion, the branch
On the one hand frame is used to limit position of the FOUP 11 in the cleaning chamber 10, on the other hand connect institute by the turntable
State FOUP 11.The driver only drives FOUP 11 described in the driven by rotary disc to rotate along the axis, rather than entire institute
State bracket synchronous rotation.
Preferably, the FOUP cleaning device further includes shell 15 and partition；The partition surrounds the shell 15
Made of cavity be divided into the cleaning chamber 10 and driving chamber 16, the driver is located at the driving chamber 16.
Present embodiment divides cavity made of the shell surrounds by the partition so that the driver with
Cleaning solution physical isolation in the cleaning chamber 10, avoids causing to damage to the driver, to improve the FOUP
The service life of cleaning device.
Preferably, the bottom 114 of the FOUP has an at least through-hole 30；The FOUP cleaning device further includes at least one
Pipeline 17, the pipeline 17 are used to transmit the gas from the through-hole 30 to the accommodating chamber 115.
Specifically, the FOUP 11 is during accommodating wafer, in order to avoid the wafer oxidation, usually in institute
State FOUP bottom 114 be arranged at least one through-hole 30, by the through-hole 30 to the accommodating chamber 115 be passed through nitrogen or
Inert gas.
Present embodiment, by opening valve 18, utilizes the pipeline 17 during drying 11 FOUP
The gas is transmitted into the accommodating chamber 115 from the through-hole 30, can be further improved the dry effect of the FOUP 11
Rate.The quantity of the through-hole 30 is preferably several, and multiple through-holes 30 connect one to one with a plurality of pipeline 17.This
Specific embodiment is illustrated by taking two through-holes 30 and two pipelines 17 as an example.
Preferably, the FOUP 11 further includes the door-plate 21 for closing the opening；Have on the first side wall 103
There is a support plate 20；The support plate 20 extends towards the second sidewall 104, for carrying the door-plate 21.
Specifically, the support plate 20 extends along the x axis.During cleaning 11 FOUP, remove described
Door-plate 21, the exposure accommodating chamber 115, and the door-plate 21 is placed in the support plate 20, so that the door-plate 21 is interior
Side is upward.In this way, cleaning the same of 11 other component of FOUP (such as described accommodating chamber 115) using the cleaning solution
When, the door-plate 21 can also be cleaned；While using 11 other component of FOUP described in the gas dry, also can
The door-plate 21 is dried.
Present embodiment provide FOUP cleaning device, can one cleaning it is intracavitary be automatically performed wet-cleaning and
It is dry, reduce the transfer number in FOUP cleaning process, improve FOUP cleaning efficiency, reduces FOUP in the process of cleaning
The risk of damage also saves the human cost in cleaning process；Moreover, because a cleaning it is intracavitary can complete it is multiple clear
Step is washed, to reduce the occupied area of FOUP cleaning device entirety, reduces the cost of semiconductors manufacture indirectly.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of FOUP cleaning device characterized by comprising
Chamber is cleaned, for accommodating FOUP, the FOUP has the accommodating chamber for accommodating wafer；
First jet, it is intracavitary positioned at the cleaning, it is used for the accommodating chamber jet cleaning liquid；
Driving structure, for driving the FOUP in the intracavitary rotation of cleaning, the cleaning in the accommodating chamber is discharged
Liquid；
Second nozzle, it is intracavitary positioned at the cleaning, for spraying gas to the accommodating chamber, with the remaining cleaning of drying
Liquid.
2. FOUP cleaning device according to claim 1, which is characterized in that the cleaning chamber includes the roof of Relative distribution
And bottom wall；The FOUP cleaning device further include:
Lifting column, one end is connect with the roof, the other end is equipped with supersonic generator, and the lifting column can be along vertical
Direction carries out elevating movement.
3. FOUP cleaning device according to claim 2, which is characterized in that the FOUP include Relative distribution front,
Rear portion and between the front and rear and the top and bottom of Relative distribution, the front has to be passed in and out for wafer
Opening；
The cleaning chamber further includes between the roof and the bottom wall and the first side wall and second side of Relative distribution
Wall；
The second sidewall surface has a bracket, for connecting with the bottom of the FOUP；
The axis rotation that the driving structure is used to that the FOUP to be driven to surround the FOUP, the axis are directed toward from the top
The bottom and the center for passing through the FOUP.
4. FOUP cleaning device according to claim 3, which is characterized in that the driving structure includes being located at the cleaning
Driver and connecting rod outside chamber；One end of the connecting rod connects the driver, the other end connects the bracket, for driving
The bracket is entirely around the axis rotation.
5. FOUP cleaning device according to claim 3, which is characterized in that the driving structure includes being located at the cleaning
Driver and connecting rod outside chamber；With a turntable for being connect with the bottom of the FOUP in the bracket；The connecting rod
One end connect the driver, the other end connects the bracket, for driving the turntable along the axis rotation.
6. FOUP cleaning device according to claim 4 or 5, which is characterized in that further include shell and partition；It is described every
Cavity made of plate surrounds the shell is divided into the cleaning chamber and driving chamber, and the driver is located at the driving chamber.
7. FOUP cleaning device according to claim 3, which is characterized in that the quantity of the first jet is multiple, and
Multiple first jets are at least distributed in the first side wall and the roof.
8. FOUP cleaning device according to claim 3, which is characterized in that the quantity of the second nozzle is multiple, and
Multiple second nozzles are at least distributed in the first side wall and the second sidewall.
9. FOUP cleaning device according to claim 3, which is characterized in that the bottom of the FOUP is logical at least one
Hole；The FOUP cleaning device further includes an at least pipeline, and the pipeline is used to transmit institute from the through-hole to the accommodating chamber
State gas.
10. FOUP cleaning device according to claim 3, which is characterized in that the FOUP further includes described for closing
The door-plate of opening；There is a support plate on the first side wall；The support plate extends towards the second sidewall, for carrying
The door-plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910515897.4A CN110238143A (en) | 2019-06-14 | 2019-06-14 | FOUP cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910515897.4A CN110238143A (en) | 2019-06-14 | 2019-06-14 | FOUP cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110238143A true CN110238143A (en) | 2019-09-17 |
Family
ID=67887138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910515897.4A Pending CN110238143A (en) | 2019-06-14 | 2019-06-14 | FOUP cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110238143A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210370363A1 (en) * | 2020-05-29 | 2021-12-02 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and method for making |
| WO2024061538A1 (en) * | 2022-09-22 | 2024-03-28 | Gsec German Semiconductor Equipment Company Gmbh | Apparatus and method for cleaning cup-shaped hollow bodies, in particular transport containers for semiconductor wafers or for euv lithography masks |
| WO2024104702A1 (en) * | 2022-11-17 | 2024-05-23 | Gsec German Semiconductor Equipment Company Gmbh | Cleaning apparatus, treatment apparatus and method for respectively cleaning and treating pot-shaped hollow bodies, in particular transporting containers for semiconductor wafers or for lithography masks |
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| US20210370363A1 (en) * | 2020-05-29 | 2021-12-02 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and method for making |
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