CN110235108A - A kind of patch program check method, terminal device and computer readable storage medium - Google Patents

A kind of patch program check method, terminal device and computer readable storage medium Download PDF

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Publication number
CN110235108A
CN110235108A CN201880006902.2A CN201880006902A CN110235108A CN 110235108 A CN110235108 A CN 110235108A CN 201880006902 A CN201880006902 A CN 201880006902A CN 110235108 A CN110235108 A CN 110235108A
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China
Prior art keywords
patch
program
bill
materials
patch program
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CN201880006902.2A
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Chinese (zh)
Inventor
李海
邵俊
邱斌团
吴壬华
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Shenzhen Shinry Technologies Co Ltd
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Shenzhen Shinry Technologies Co Ltd
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Publication of CN110235108A publication Critical patent/CN110235108A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/36Preventing errors by testing or debugging software
    • G06F11/3668Software testing
    • G06F11/3672Test management
    • G06F11/3688Test management for test execution, e.g. scheduling of test suites

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Stored Programmes (AREA)

Abstract

It includes: acquisition bill of materials that the embodiment of the present application, which discloses a kind of patch program check method, terminal device and computer readable storage medium, the patch program check method,;Export the chip data in patch program;The bill of materials and the chip data are compared, comparing result is obtained;The patch program correctness is determined according to the comparing result, if mistake, the patch program is updated according to the comparing result.The embodiment of the present application, can be by comparison as a result, quick judgement patch program correctness, to improve the inspection efficiency of patch program by comparing the bill of materials of chip data and product in patch program.

Description

A kind of patch program check method, terminal device and computer readable storage medium
Technical field
This application involves field of computer technology more particularly to a kind of patch program check methods, terminal device and calculating Machine readable storage medium storing program for executing.
Background technique
With the development of science and technology, the quantity of electronic product realizes the growth of explosion type, almost everybody is using electronics Product.And good electronic product is necessary not only for feature-rich, it is often more important that the quality to have had, specifically, quality includes Its stability and durability etc..
The quality of surface mount (SMT, Surface Mount Technology) determines the quality of electronic product, and The quality of SMT is searched to the bottom depending on a complete correctly patch program.Placement equipment only utilizes complete correctly patch journey Sequence can just produce the product of high quality.Then the complete correctness of patch program is particularly important, but because product renewing changes In generation, part, stop production or the reasons such as part upward price adjustment, so that the structure and/or part in product adjust, causes original Patch program cannot use.If the wrong disabler or function for having used incorrect patch program to will lead to product It is incomplete.
Then before carrying out SMT, whether the information generally required in the bill of materials of manual inspection product changes, if It changes, needs to reprogram to obtain new patch program.But the mode efficiency of such manual inspection is very low.
Apply for content
Patch program can be improved in a first aspect, the embodiment of the present application provides a kind of patch program check method based on this Inspection efficiency, this method comprises:
Obtain bill of materials;
Export the chip data in patch program;
The bill of materials and the chip data are compared, comparing result is obtained;
The patch program correctness is determined according to the comparing result.
With reference to first aspect, described that the patch is determined according to the comparing result in the first realization of first aspect After program correctness, further includes: if the patch program error, update the patch journey according to the comparing result Sequence.
With reference to first aspect, described that the patch is updated according to the comparing result in being realized at second of first aspect After program, further includes:
It exports patch program and updated patch program before updating and is saved in the first patch collection of programs;And/or Record the comparing result.
With reference to first aspect, in the third realization of first aspect, the comparison bill of materials and the patch number According to, comprising:
Whether consistent compare the corresponding patch title in identical attachment position number.
With reference to first aspect, in being realized at the 4th kind of first aspect, after the acquisition bill of materials, described in the comparison Before bill of materials and the chip data, further includes:
The bill of materials is separated, so that the patch title in the bill of materials and attachment position number correspond.
4th kind of realization with reference to first aspect, in the 5th kind of first aspect realization, the acquisition bill of materials, Yi Jisuo After stating the chip data in export patch program, before the comparison bill of materials and the chip data, further includes:
The chip data and the bill of materials are merged, so that the same column of the chip data and the bill of materials Or the attachment position number of colleague is consistent.
5th kind of realization with reference to first aspect, is realized at the 6th kind of first aspect, the comparison bill of materials with The chip data, comprising:
Whether the patch title of comparison same column perhaps colleague consistent and/or the patch title of comparison same column or colleague are It is no consistent.
Second aspect, the embodiment of the present application provide a kind of terminal device, which includes for executing above-mentioned On the one hand to the unit of any one method realized of first aspect, which includes:
Acquiring unit, for obtaining bill of materials;
Lead-out unit, for exporting the chip data in patch program;
Comparison unit obtains comparing result for comparing the bill of materials and the chip data;
Determination unit determines the patch program correctness according to the comparing result.
The third aspect, the embodiment of the present application provide another terminal device, including processor, input equipment, output are set Standby and memory, the processor, input equipment, output equipment and memory are connected with each other, wherein the memory is for depositing Storage supports terminal device to execute the computer program of the above method, and the computer program includes program instruction, the processor It is configured for calling described program instruction, the method to execute above-mentioned first aspect and its any one implementation.
Fourth aspect, the embodiment of the present application provide a kind of computer readable storage medium, the computer storage medium It is stored with computer program, the computer program includes program instruction, and described program instruction is when being executed by processor, to hold The method of the above-mentioned first aspect of row and its any one implementation.
The embodiment of the present application is by comparing the bill of materials of chip data and product in patch program, Ke Yitong Cross comparison as a result, quick judgement patch program correctness, to improve the inspection of patch program and update efficiency.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to needed in embodiment description Attached drawing is briefly described.
Fig. 1 is a kind of schematic flow diagram of patch program check method provided by the embodiments of the present application;
Fig. 2 is a kind of schematic flow diagram for patch program check method that another embodiment of the application provides;
Fig. 3 is a kind of schematic block diagram of terminal device provided by the embodiments of the present application;
Fig. 4 is a kind of structural diagram of terminal device provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application is described.It answers Work as understanding, when use in this specification and in the appended claims, term " includes " and "comprising" indicate described feature, Entirety, step, operation, the presence of element and/or component, but one or more of the other feature, entirety, step, behaviour is not precluded The presence or addition of work, element, component and/or its set.
It is also understood that mesh of the term used in this present specification merely for the sake of description specific embodiment And be not intended to limit the application.As present specification and it is used in the attached claims, unless on Other situations are hereafter clearly indicated, otherwise " one " of singular, "one" and "the" are intended to include plural form.
It will be further appreciated that the term "and/or" used in present specification and the appended claims is Refer to any combination and all possible combinations of one or more of associated item listed, and including these combinations.
As used in this specification and in the appended claims, term " if " can be according to context quilt Be construed to " when ... " or " once " or " in response to determination " or " in response to detecting ".Similarly, phrase " if it is determined that " or " if detecting [described condition or event] " can be interpreted to mean according to context " once it is determined that " or " in response to true It is fixed " or " once detecting [described condition or event] " or " in response to detecting [described condition or event] ".
In the specific implementation, terminal device described in the embodiment of the present application is including but not limited to such as with the sensitive table of touch Mobile phone, laptop computer or the tablet computer in face (for example, touch-screen display and/or touch tablet) etc it is other Portable device.It is to be further understood that in certain embodiments, equipment is not portable communication device, but has and touch The desktop computer of sensing surface (for example, touch-screen display and/or touch tablet).
In following discussion, the terminal device including display and touch sensitive surface is described.However, should manage Solution, terminal device may include that one or more of the other physical User of such as physical keyboard, mouse and/or control-rod connects Jaws equipment.
Terminal device supports various application programs, such as one of the following or multiple: drawing application program, demonstration application Program, word-processing application, website creation application program, disk imprinting application program, spreadsheet applications, game are answered With program, telephony application, videoconference application, email application, instant messaging applications, forging Refining supports application program, photo management application program, digital camera application program, digital camera application program, web-browsing to answer With program, digital music player application and/or video frequency player application program.
At least one of such as touch sensitive surface can be used in the various application programs that can be executed on the terminal device Public physical user-interface device.It can be adjusted among applications and/or in corresponding application programs and/or change touch is quick Feel the corresponding information shown in the one or more functions and terminal device on surface.In this way, the public physics frame of terminal device Structure (for example, touch sensitive surface) can be supported various using journey with user interface intuitive and transparent for a user Sequence.
In electronic product production process, sometimes because product function upgrading cause structure inside electronic product or Used component replacement etc., or even because members used in electronic product stop production or price improves, and have to Some changes are carried out to electronic product, but these changes are typically smaller, such as in a widgets of existing product It is added to a resistance, however there are also positions on circuit boards all not to become for the size shape of the widgets, or even connects function It does not all change much, is intended merely to then change title with original component progress version differences, during patch It does not need to carry out patch to each part in this widgets, but the ready-made widgets is directly welded on circuit board On, without what difference from the point of view of achievement of the patch after complete.Even if being so tiny change, since two products have not been It is complete the same, then it is still two different products, needs to reprogram for new product, otherwise product variations may Patch material and/or patch title is caused to change, so as to cause product function mistake or failure, product function is not complete or do not update To latest edition.
To solve the above-mentioned problems, the embodiment of the present application provides a kind of patch program check method and terminal device, can It is whether consistent with the bill of materials of chip data and product in rapid comparison patch program, illustrate the patch journey if consistent Sequence be it is correct and complete, do not need to be updated the patch program, illustrate that the patch program is incorrect if inconsistent Or it is imperfect, need according to the result of comparison update patch program, modify chip data in the different patch of bill of materials With the different attachment position number of bill of materials in piece title, and/or modification chip data, therefore only need to change in patch program The part of change is changed, without reprograming.Therefore the application can quickly check patch program correctness and Integrality, and improve the efficiency of patch program update.
In order to more fully understand the embodiment of the present application, will be situated between below to the method for application the embodiment of the present application It continues, the embodiment of the present application can be applied in the scene of patch program checkout and update.
When needing to check the integrality and correctness of patch program, the bill of materials of product, the material are first obtained Inventory describes the patch title for producing the required patch and patch needs mounted attachment position number, or even there are also various groups Then connection relationship, positional relationship and quantity of part etc. can pre-process bill of materials, reduce some subsequent right Than data not needed in process, for example whether being sample, version number and unit of quantity etc., so that it is clear at least to retain material Patch title and attachment position number in list.However, it can be seen that patch title and attachment position number are not one by one in bill of materials It is corresponding, this is because same patch may have multiple in the same product, and it is mounted on different location respectively, then exists Patch title and attachment position number in bill of materials are one-to-many relationships.For subsequent better comparison, then to bill of materials Lock out operation is carried out, so that the patch title and attachment position number in bill of materials correspond.
While carrying out pretreatment and lock out operation to bill of materials, the chip data in patch program can also be exported. It wherein, include program instruction in patch program, when program instruction is executed by chip mounter, patch is accurately welded on electricity On each fixed position of road plate, to realize full-automatic surface mount process.Then patch program can imported into patch In machine, then chip mounter can produce the corresponding product recorded of the chip data by executing the patch program, correspondingly, on The position mounted required for the title and patch that chip data includes patch contained by product corresponding to the patch program is stated, Then the title of the patch in the bill of materials and chip data and the corresponding mounted position of patch are compared, i.e., Can the corresponding patch title in more identical attachment position number it is whether consistent, can then compare to obtain bill of materials and chip data In whether the patch different containing title, and/or the different patch in attachment position number, if there is no then illustrating using executing the patch The chip mounter of piece program can successfully produce the product manufactured required for producer.If it is present needing according to comparison result In compare the different patch title come and/or mounting position is updated patch program.
The mode that another kind can be implemented is, before being compared, chip data is imported into object using function is searched Expect in inventory, searching function includes VLOOKUP function or HLLOKUP function, so that chip data and bill of materials are merged, It is more convenient compared to being compared before to two texts, and will be in chip data and bill of materials when merging The data of identical attachment position number are placed on same a line or same row.Then when comparison, it is true that contrast function etc. can be used Whether the patch title that approval column are perhaps gone together is consistent and/or comparison compares same column or whether the patch title of colleague is consistent, Illustrate if consistent the patch program be it is correct and complete, it is on the contrary then illustrate that the patch program is imperfect and/or incorrect, Thus according to contrast come as a result, checking in chip data which patch or the attachment position number of which patch lacked It changes, then targetedly modifies, also can be used after modification provided by the embodiments of the present application to attachment program Method checks attachment program again and is updated until attachment program is correct.
It should be noted that above-mentioned application scenarios are a kind of mode in the cards of the embodiment of the present application, do not constitute Restriction to the embodiment of the present application.
It is that the embodiment of the present application provides a kind of schematic flow diagram of patch program check method referring to Fig. 1, pastes as shown in the figure Piece program check method can include:
S101: bill of materials is obtained.
In the embodiment of the present application, bill of materials refers to SMT bill of materials, describes the patch of production required by electronic product The case where piece, including patch title, attachment position number, patch quantity, production, wherein attachment position number is that patch is mounted on circuit board On mounting position code name, by the attachment position number, placement equipment can quickly navigate to position to be mounted needed for the patch, Patch title is to claim in the generation of patch, can uniquely confirm patch by the patch title, therefore different patches is with different Patch title.
It should be noted that from the input equipment of terminal device or middle acquisition can be locally stored in above-mentioned bill of materials, It is obtained in can also being stored from server, other terminal devices or cloud, the embodiment of the present application does not limit this.
Further, before step S101, initial material inventory is obtained;Above-mentioned initial material inventory is pre-processed To obtain above-mentioned bill of materials, above-mentioned bill of materials at least remains patch title and attachment position in above-mentioned initial material inventory Number.
In the embodiment of the present application, before obtaining bill of materials, initial material inventory is first obtained, initial material inventory is compared Bill of materials contains more information other than the patch title of patch and attachment position number, which includes whether as sample Product, version number and unit of quantity etc..It is above-mentioned that initial material inventory is pre-processed, it exactly deletes in initial material inventory A part of data, such as no is sample, the data such as version number and unit of quantity, to obtain bill of materials, so that obtain Bill of materials includes at least patch title and the attachment position number of patch.
S102: the chip data in export patch program.
In the embodiment of the present application, patch program can be imported into chip mounter, and then chip mounter is by executing the patch Program can produce corresponding product, and patch program is used to describe welding step when patch is welded on circuit board Suddenly, including by which patch it is welded to which position up.Thus it is possible to chip data is exported from patch program, it should Chip data includes the patch title and the required patch mounted of patch of patch contained by product corresponding to the patch program Fill position number.
S103: the bill of materials and the chip data are compared, comparing result is obtained.
In the embodiment of the present application, by product corresponding to the bill of materials and patch program of the product of actual needs production Chip data be compared, therefore the difference of two products can be compared, thus check the patch program it is whether complete and Correctly, the product for producing actual needs production is further determined whether, bill of materials and patch are obtained by comparison The difference of sheet data compares in bill of materials with the presence or absence of the patch title not contained in chip data, and/or attachment position Number or the identical corresponding different patch title in attachment position number, export and integrate the difference of above-mentioned bill of materials and chip data It is different, to obtain comparing result.
Optionally, whether the corresponding patch title in the identical attachment position number of comparison is consistent.
In the embodiment of the present application, the method for above-mentioned comparison includes carrying out to the corresponding patch title in identical attachment position number pair Than because will use a variety of patches in a product, and the corresponding quantity of every kind of patch may then exist same to be multiple Same patch corresponds to multiple mounting positions in a product, and patch title and attachment position number are one-to-many relationships.However one It mounts position number and only corresponds to a patch title, then can determine material from the corresponding patch title in the identical attachment position number of comparison Inventory and chip data whether there is difference, so that it is determined that whether patch program is complete and correct.
Further, after step slol, before step S103, further includes: the bill of materials is separated, so that institute Patch title and the attachment position number stated in bill of materials correspond.
In the embodiment of the present application, due in bill of materials patch title and attachment position number be one-to-many relationship, Therefore often the corresponding multiple attachment positions number of a patch title are recorded together, for example, if bill of materials is with the shape of table If formula is expressed, then multiple attachment positions number are recorded in the same cell.In order to preferably more identical attachment position Whether number corresponding patch title consistent, then splits out the attachment position number for being recorded in a cell, establish respectively with Patch title corresponding relationship, i.e., the corresponding attachment position number of the patch title mutually gone together.
Further, after step s 102, before step S103, further includes: by the chip data and the object Expect that inventory merges, so that the same column of the chip data and the bill of materials or the attachment position number gone together are consistent.
In the application implementation, in order to compare conveniently, chip data and bill of materials can be merged into a table, So that the corresponding data in identical attachment position number in chip data and bill of materials are in same a line or same row.
Further, above-mentioned refer to chip data and bill of materials merging is led chip data using lookup function Enter into bill of materials, searching function includes VLOOKUP function or HLLOKUP function.
In the embodiment of the present application, above-mentioned combined method can be using function is searched, according to each of bill of materials The attachment position number of capable or each column, then lookup one by one are several by patch title corresponding to the identical attachment position number of chip data etc. According to the corresponding data in the identical attachment position number of bill of materials and chip data are then placed in same a line or same Column, specifically can be used the lookup function of Excel software, the lookup function of Excel software include VLOOKUP function or HLLOKUP function, wherein VLOOKUP function is longitudinal lookup function, can be according to the attachment position in bill of materials in each column Number, the corresponding data in identical attachment position number are searched in chip data, wherein it is transversely arranged to mount position number in bill of materials, Only one attachment position number of one column;HLLOKUP function is laterally to search function, can be according to the attachment in row every in bill of materials Position number, searches the corresponding data in identical attachment position number in chip data, wherein the longitudinal row in position number is mounted in bill of materials Column, only one attachment position number of a line.
Optionally, the above-mentioned comparison bill of materials and the method for the chip data are to compare same column or colleague Whether patch title consistent, and/or comparison same column or colleague patch title it is whether consistent.
In the embodiment of the present application, due in the above methods, by bill of materials and the identical attachment position of chip data Number corresponding data are placed in same a line, and perhaps then above-mentioned control methods can be to every row or each column same row Patch title compares, and checks whether consistent.
S104: the patch program correctness is determined according to the comparing result.
In the embodiment of the present application, patch program correctness determines that can chip mounter by executing the patch program Produce product corresponding to bill of materials.Comparing result contains the difference of two products, if do not remembered in comparing result Carry bill of materials and chip data difference, then illustrate the program be it is correct and complete, chip mounter can be by executing the patch Piece program produces product corresponding to bill of materials.
Further, if the patch program error, the patch program is updated according to the comparing result.If than Compared with describing the patch title not contained in chip data present in bill of materials in result, and/or attachment position number, Huo Zhexiang The same corresponding different patch title in attachment position number, then the patch program is imperfect and/or incorrect, then needs to the program It is further updated, i.e., program is modified according to the difference in comparison result between chip data and bill of materials, so that Chip mounter is able to produce product corresponding to bill of materials by the patch program after executing modification.
It further, further include patch program before output updates and updated after updating the patch program Patch program is simultaneously saved in the first patch collection of programs;And/or record the comparing result.
It in the embodiment of the present application, can also be by updated patch program and update after patch program is updated Preceding patch program is all saved in the first patch collection of programs, though because update before patch program and updated patch program Correspond to different product on right stricti jurise, but actually a big chunk program be all it is identical, then can be by phase It is saved in the same patch collection of programs like the patch program of product, needs new patch if there is new like product subsequent When piece program, a target patch program can be selected from the first patch collection of programs, then pasted again in the target It modifies on the basis of piece program, so that the new patch program that can be executed by chip mounter is generated, to produce above-mentioned New like product.
It should be noted that it is above-mentioned select a target patch program from the first patch collection of programs when, can be with Using the patch program check method of the embodiment of the present application, the patch of each of the first patch collection of programs patch program is exported Sheet data, selects between a chip data and above-mentioned new like product the smallest patch program of difference as target program, Then it modifies to obtain above-mentioned new like product corresponding patch program on the basis of the target program again.
It records the comparing result it should also be noted that, above-mentioned and refers to the patch before above-mentioned comparing result, update Piece program and the bak stay program of update are associated together.The advantage of doing so is that in subsequently received above-mentioned new similar production When product, a patch program conduct can be quickly selected from the first patch collection of programs by the mode of human assistance Target patch program, wherein the mode of human assistance is that is, operator can learn each patch program pair according to comparing result The difference between product answered, then operator can manually select a patch program as mesh from the first patch program Beacon course sequence.
It, can be by by the patch in the bill of materials of chip data and product in patch program by the embodiment of the present application Dress position number and patch title compare, if there are the patches being not present in the chip data in patch program in bill of materials Title or the corresponding mounting position of identical patch title are different, then can determine chip data it is imperfect or It is incorrect, so as to by comparing as a result, quick judgement patch program correctness.Therefore the embodiment of the present application improves The inspection efficiency of patch program.
Referring to Fig. 2, Fig. 2 is the schematic flow diagram of another kind patch program check method disclosed in the embodiment of the present application, Method as shown in the figure can include:
S201: bill of materials is obtained.
In the embodiment of the present application, bill of materials refers to SMT bill of materials, describes the patch of production required by electronic product The case where piece, including patch title, attachment position number, patch quantity, production, wherein attachment position number is that patch is mounted on circuit board On mounting position code name, by the attachment position number, placement equipment can quickly navigate to position to be mounted needed for the patch, Patch title is to claim in the generation of patch, can uniquely confirm patch by the patch title, therefore different patches is with different Patch title.
It should be noted that from the input equipment of terminal device or middle acquisition can be locally stored in above-mentioned bill of materials, It is obtained in can also being stored from server, other terminal devices or cloud, the embodiment of the present application does not limit this.
Further, before step S201, initial material inventory is obtained;Above-mentioned initial material inventory is pre-processed To obtain above-mentioned bill of materials, above-mentioned bill of materials at least remains patch title and attachment position in above-mentioned initial material inventory Number.
In the embodiment of the present application, before obtaining bill of materials, initial material inventory is first obtained, initial material inventory is compared Bill of materials contains more information other than the patch title of patch and attachment position number, which includes whether as sample Product, version number and unit of quantity etc..It is above-mentioned that initial material inventory is pre-processed, it exactly deletes in initial material inventory A part of data, such as no is sample, the data such as version number and unit of quantity, to obtain bill of materials, so that obtain Bill of materials includes at least patch title and the attachment position number of patch.
S202: the chip data in export patch program.
In the embodiment of the present application, patch program can be imported into chip mounter, and then chip mounter is by executing the patch Program can produce corresponding product, and patch program is used to describe welding step when patch is welded on circuit board Suddenly, including by which patch it is welded to which position up.Thus it is possible to chip data is exported from patch program, it should Chip data includes the patch title and the required patch mounted of patch of patch contained by product corresponding to the patch program Fill position number.
S203: separating the bill of materials, so that the patch title in the bill of materials and attachment position number correspond.
In the embodiment of the present application, due in bill of materials patch title and attachment position number be one-to-many relationship, Therefore often the corresponding multiple attachment positions number of a patch title are recorded together, for example, if bill of materials is with the shape of table If formula is expressed, then multiple attachment positions number are recorded in the same cell.In order to preferably more identical attachment position Whether number corresponding patch title consistent, then splits out the attachment position number for being recorded in a cell, establish respectively with Patch title corresponding relationship, i.e., the corresponding attachment position number of the patch title mutually gone together.
S204: compare the corresponding patch title in identical attachment position number in the bill of materials and the chip data whether one It causes, obtains comparing result.
It in the embodiment of the present application, can be by bill of materials and patch number after obtaining bill of materials and chip data According to being compared, specifically, the corresponding patch title in attachment identical in bill of materials and chip data position number is compared, because To will use a variety of patches in a product, and the corresponding quantity of every kind of patch may be it is multiple, then there is the same production Same patch corresponds to multiple mounting positions in product, and patch title and attachment position number are one-to-many relationships.A however attachment Position number only corresponds to a patch title, then can determine bill of materials from the corresponding patch title in the identical attachment position number of comparison It whether there is difference with chip data, so that it is determined that whether patch program is complete and correct.
Optionally, in addition to whether directly comparing the corresponding patch title in bill of materials attachment position number identical with chip data It unanimously to obtain except comparing result, can also use: the chip data and the bill of materials be merged, so that described The same column of chip data and the bill of materials or the attachment position number gone together are consistent;Compare same column or the patch title of colleague It is whether consistent, and/or whether the attachment position number of comparison same column or colleague consistent.
In the application implementation, in order to compare conveniently, chip data and bill of materials can be merged into a table, So that the corresponding data in identical attachment position number in chip data and bill of materials are then being compared in same a line or same row When, so that it may easily the patch title of every row or each column is compared, is checked whether consistent.
Further, above-mentioned refer to chip data and bill of materials merging is led chip data using lookup function Enter into bill of materials, searching function includes VLOOKUP function or HLLOKUP function.
In the embodiment of the present application, above-mentioned combined method can be using function is searched, according to each of bill of materials The attachment position number of capable or each column, then lookup one by one are several by patch title corresponding to the identical attachment position number of chip data etc. According to the corresponding data in the identical attachment position number of bill of materials and chip data are then placed in same a line or same Column, specifically can be used the lookup function of Excel software, the lookup function of Excel software include VLOOKUP function or HLLOKUP function, wherein VLOOKUP function is longitudinal lookup function, can be according to the attachment position in bill of materials in each column Number, the corresponding data in identical attachment position number are searched in chip data, wherein it is transversely arranged to mount position number in bill of materials, Only one attachment position number of one column;HLLOKUP function is laterally to search function, can be according to the attachment in row every in bill of materials Position number, searches the corresponding data in identical attachment position number in chip data, wherein the longitudinal row in position number is mounted in bill of materials Column, only one attachment position number of a line.
S205: the patch program correctness is determined according to the comparing result.
In the embodiment of the present application, patch program correctness determines that can chip mounter by executing the patch program Produce product corresponding to bill of materials.Comparing result contains the difference of two products, if do not remembered in comparing result Carry bill of materials and chip data difference, then illustrate the program be it is correct and complete, chip mounter can be by executing the patch Piece program produces product corresponding to bill of materials.
S206: if the patch program error, the patch program is updated according to the comparing result.
In the embodiment of the present application, it if finding out patch program error according to the result of comparison, is then tied further according to comparison Fruit updates the patch program.If describing the patch not contained in chip data present in bill of materials in comparison result Title, and/or attachment position number or the identical corresponding different patch title in attachment position number, then the patch program it is imperfect and/ Or it is incorrect, it then needs further to update the program, i.e., according to chip data in comparison result and bill of materials Between difference modify program so that by the patch program after executing modification to be able to produce bill of materials institute right for chip mounter The product answered.
S207: patch program and updated patch program before updating are exported and is saved in the first patch collection of programs; And/or record the comparing result.
It in the embodiment of the present application, can also be by updated patch program and update after patch program is updated Preceding patch program is all saved in the first patch collection of programs, though because update before patch program and updated patch program Correspond to different product on right stricti jurise, but actually a big chunk program be all it is identical, then can be by phase It is saved in the same patch collection of programs like the patch program of product, needs new patch if there is new like product subsequent When piece program, a target patch program can be selected from the first patch collection of programs, then pasted again in the target It modifies on the basis of piece program, so that the new patch program that can be executed by chip mounter is generated, to produce above-mentioned New like product.
It should be noted that it is above-mentioned select a target patch program from the first patch collection of programs when, can be with Using the patch program check method of the embodiment of the present application, the patch of each of the first patch collection of programs patch program is exported Sheet data, selects between a chip data and above-mentioned new like product the smallest patch program of difference as target program, Then it modifies to obtain above-mentioned new like product corresponding patch program on the basis of the target program again.
It records the comparing result it should also be noted that, above-mentioned and refers to the patch before above-mentioned comparing result, update Piece program and the bak stay program of update are associated together.The advantage of doing so is that in subsequently received above-mentioned new similar production When product, a patch program conduct can be quickly selected from the first patch collection of programs by the mode of human assistance Target patch program, wherein the mode of human assistance is that is, operator can learn each patch program pair according to comparing result The difference between product answered, then operator can manually select a patch program as mesh from the first patch program Beacon course sequence.
The embodiment of the present application comparison it is upper one apply embodiment for, described in more detail bill of materials and chip data into The process of row comparison, and patch program can also be updated according to the result of comparison.If passing through comparison patch program In chip data and product bill of materials in attachment position number and patch title, judge that patch program is incorrect, then basis The result of comparison is updated the patch program, targetedly according to part inconsistent in chip data and bill of materials It modifies to patch program, and it is incorrect or product renewing is all reprogramed not have to each program, thus effectively The update efficiency for improving patch program.Generally speaking, the embodiment of the present application improves the inspection of patch program and updates effect Rate.
The embodiment of the present application also provides a kind of terminal device, which is used to execute the list of any one of aforementioned method Member.It specifically, is a kind of schematic block diagram of terminal device provided by the embodiments of the present application referring to Fig. 3.The terminal of the present embodiment is set Standby includes: acquiring unit 301, lead-out unit 302, comparison unit 303 and determination unit 304.
Acquiring unit 301, for obtaining bill of materials;
Lead-out unit 302, for exporting the chip data in patch program;
Comparison unit 303 obtains comparing result for comparing the bill of materials and the chip data;
Specifically, whether consistent for comparing the corresponding patch title in identical attachment position number;For comparing same column or same Whether capable patch title is consistent, and/or comparison compares same column or whether the patch title of colleague is consistent.
Determination unit 304 determines the patch program correctness according to the comparing result.
Further, above-mentioned terminal device further includes updating unit 305, if being used for the patch program error, basis The comparing result updates the patch program.
Further, above-mentioned terminal device further includes output unit 306, storage unit 307 and recording unit 308, described Output unit 306 is used to export the patch program and updated patch program before updating;The storage unit 307 is used for institute It states patch program and the updated patch program before updating and is saved in the first patch collection of programs;And/or the record Unit 308 is for recording the comparing result.
Further, above-mentioned terminal device further includes separative unit 309, for separating the bill of materials, so that described Patch title and attachment position number in bill of materials correspond.
Further, above-mentioned terminal device further includes combining unit 310, for the chip data and the material is clear It is single to merge, so that the same column of the chip data and the bill of materials or the attachment position number gone together are consistent.
It is a kind of terminal device schematic block diagram provided by the embodiments of the present application referring to Fig. 3 and Fig. 4.This reality as shown in the figure Applying the terminal device in example may include: one or more processors 410;One or more input equipments 420, it is one or more Output equipment 430 and memory 440.Above-mentioned processor 410, input equipment 420, output equipment 430 and memory 440 pass through total Line 450 connects.Memory 420 includes program instruction for storing computer program, computer program, and processor 410 is for holding The program instruction that line storage 420 stores.Wherein, processor 410 is configured for caller instruction.
Processor 410, for executing the function of lead-out unit 302, for exporting the chip data in patch program;Also use Comparing result is obtained, specifically for comparing the bill of materials and the chip data in the function of executing comparison unit 303 , it is whether consistent for comparing the corresponding patch title in identical attachment position number, more specifically, for comparing same column or colleague Whether patch title is consistent, and/or comparison compares same column or whether the patch title of colleague is consistent;It is also used to execute and determines list The function of member 304, determines the patch program correctness according to the comparing result.
Input equipment 420, for executing the function of acquiring unit 301, for obtaining bill of materials.
Output equipment 430, for executing the function of output unit 306, for exporting patch program and update before updating Patch program afterwards.
Further, processor 410 are also used to execute the function of updating unit 305, if being used for the patch program error Accidentally, then the patch program is updated according to the comparing result;It is also used to execute the function of storage unit 307, being used for will be described Patch program and the updated patch program before update are saved in the first patch collection of programs;And/or it is also used to execute The function of recording unit 308, for recording the comparing result;It is also used to execute the function of separative unit 309, for separating Bill of materials is stated, so that the patch title in the bill of materials and attachment position number correspond;It is also used to execute combining unit 310 function, for merging the chip data and the bill of materials, so that the chip data and the bill of materials Same column or colleague attachment position number it is consistent.
It should be appreciated that in the embodiment of the present application, alleged processor 410 can be central processing unit (Central Processing Unit, CPU), which can also be other general processors, digital signal processor (Digital Signal Processor, DSP), specific integrated circuit (Application Specific Integrated Circuit, ASIC), ready-made programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic Device, discrete gate or transistor logic, discrete hardware components etc..General processor can be microprocessor or this at Reason device is also possible to any conventional processor etc..
Input equipment 420 may include that Trackpad, fingerprint adopt sensor (for acquiring the finger print information and fingerprint of user Directional information), microphone etc., output equipment 430 may include display (LCD etc.), loudspeaker etc..
The memory 440 may include read-only memory and random access memory, and to processor 410 provide instruction and Data.The a part of of memory 440 can also include nonvolatile RAM.For example, memory 440 can also be deposited Store up the information of device type.
In the specific implementation, processor 410, input equipment 420 described in the embodiment of the present application, output equipment 430 can Execute realization described in the first embodiment and second embodiment of patch program check method provided by the embodiments of the present application The implementation of terminal device described in the embodiment of the present application also can be performed in mode, and details are not described herein.
A kind of computer readable storage medium is provided in another embodiment of the application, computer readable storage medium is deposited Computer program is contained, computer program includes program instruction, and program instruction is executed by processor.
Computer readable storage medium can be the internal storage unit of the terminal device of aforementioned any embodiment, such as eventually The hard disk or memory of end equipment.Computer readable storage medium is also possible to the External memory equipment of terminal device, such as terminal The plug-in type hard disk being equipped in equipment, intelligent memory card (Smart Media Card, SMC), secure digital (Secure Digital, SD) card, flash card (Flash Card) etc..Further, computer readable storage medium can also both include eventually The internal storage unit of end equipment also includes External memory equipment.Computer readable storage medium for store computer program with And other programs and data needed for terminal device.Computer readable storage medium can be also used for temporarily storing and export Or the data that will be exported.
Those of ordinary skill in the art may be aware that list described in conjunction with the examples disclosed in the embodiments of the present disclosure Member and algorithm steps, can be realized with electronic hardware, computer software, or a combination of the two, in order to clearly demonstrate hardware With the interchangeability of software, each exemplary composition and step are generally described according to function in the above description.This A little functions are implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Specially Industry technical staff can use different methods to achieve the described function each specific application, but this realization is not It is considered as beyond scope of the present application.
It is apparent to those skilled in the art that for convenience of description and succinctly, the end of foregoing description The specific work process of end equipment and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed terminal device and method, Ke Yitong Other modes are crossed to realize.For example, the apparatus embodiments described above are merely exemplary, for example, the division of unit, only Only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components can be tied Another system is closed or is desirably integrated into, or some features can be ignored or not executed.In addition, shown or discussed phase Mutually between coupling, direct-coupling or communication connection can be through some interfaces, the INDIRECT COUPLING or communication of device or unit Connection is also possible to electricity, mechanical or other form connections.
Unit may or may not be physically separated as illustrated by the separation member, shown as a unit Component may or may not be physical unit, it can and it is in one place, or may be distributed over multiple networks On unit.It can select some or all of unit therein according to the actual needs to realize the mesh of the embodiment of the present application scheme 's.
It, can also be in addition, each functional unit in each embodiment of the application can integrate in one processing unit It is that each unit physically exists alone, is also possible to two or more units and is integrated in one unit.It is above-mentioned integrated Unit both can take the form of hardware realization, can also realize in the form of software functional units.
It, can if integrated unit is realized in the form of SFU software functional unit and when sold or used as an independent product To be stored in a computer readable storage medium.Based on this understanding, the technical solution of the application substantially or Say that all or part of the part that contributes to existing technology or the technical solution can embody in the form of software products Out, which is stored in a storage medium, including some instructions are used so that a computer equipment The all or part of (can be personal computer, server or the network equipment etc.) execution each embodiment method of the application Step.And storage medium above-mentioned include: USB flash disk, it is mobile hard disk, read-only memory (ROM, Read-Only Memory), random Access various Jie that can store program code such as memory (RAM, Random Access Memory), magnetic or disk Matter.

Claims (10)

1. a kind of patch program check method characterized by comprising
Obtain bill of materials;
Export the chip data in patch program;
The bill of materials and the chip data are compared, comparing result is obtained;
The patch program correctness is determined according to the comparing result.
2. patch program check method according to claim 1, which is characterized in that described to be determined according to the comparing result After the patch program correctness, further includes:
If the patch program error, the patch program is updated according to the comparing result.
3. patch program check method according to claim 2, which is characterized in that described to be updated according to the comparing result After the patch program, further includes:
It exports patch program and updated patch program before updating and is saved in the first patch collection of programs;
And/or record the comparing result.
4. patch program check method according to claim 1, which is characterized in that described to compare the bill of materials and institute State chip data, comprising:
Whether consistent compare the corresponding patch title in identical attachment position number.
5. patch program check method according to claim 1, which is characterized in that after the acquisition bill of materials, institute It states before comparing the bill of materials and the chip data, further includes:
The bill of materials is separated, so that the patch title in the bill of materials and attachment position number correspond.
6. patch program check method according to claim 5, which is characterized in that the acquisition bill of materials, Yi Jisuo After stating the chip data in export patch program, before the comparison bill of materials and the chip data, further includes:
The chip data and the bill of materials are merged so that the same column of the chip data and the bill of materials or The attachment position number of colleague is consistent.
7. patch program check method according to claim 6, which is characterized in that described to compare the bill of materials and institute State chip data, comprising:
Compare same column perhaps colleague whether patch title consistent and/or the attachment position number of comparison same column or colleague whether one It causes.
8. a kind of terminal device requires the described in any item patch program check methods of 1-7 for perform claim, feature exists In, comprising:
Acquiring unit, for obtaining bill of materials;
Lead-out unit, for exporting the chip data in patch program;
Comparison unit obtains comparing result for comparing the bill of materials and the chip data;
Determination unit determines the patch program correctness according to the comparing result.
9. a kind of terminal device, which is characterized in that including processor, input equipment, output equipment and memory, the processing Device, input equipment, output equipment and memory are connected with each other, wherein the memory is for storing computer program, the meter Calculation machine program includes program instruction, and the processor is configured for calling described program instruction, to execute such as claim The described in any item patch program check methods of 1-7.
10. a kind of computer readable storage medium, which is characterized in that the computer storage medium is stored with computer program, The computer program includes program instruction, and described program instruction makes the processor execute such as right when being executed by a processor It is required that the described in any item patch program check methods of 1-7.
CN201880006902.2A 2018-08-02 2018-08-02 A kind of patch program check method, terminal device and computer readable storage medium Pending CN110235108A (en)

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