CN110233639A - A kind of novel 36 channel X-band transmitting-receiving subassembly - Google Patents
A kind of novel 36 channel X-band transmitting-receiving subassembly Download PDFInfo
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- CN110233639A CN110233639A CN201910635431.8A CN201910635431A CN110233639A CN 110233639 A CN110233639 A CN 110233639A CN 201910635431 A CN201910635431 A CN 201910635431A CN 110233639 A CN110233639 A CN 110233639A
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- H—ELECTRICITY
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- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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Abstract
The invention discloses a kind of novel 36 channel X-band transmitting-receiving subassemblies, it is related to microwave technical field, the transmitting-receiving subassembly is different from common T/R component, it is constructed using 3D structure, by the chip active circuit of transmitting-receiving subassembly, passive network and, liquid-cooling heat radiation fluid channel and paster antenna it is common it is integrated together, each Transmit-Receive Unit individually separates, realize transmission-receiving function, so as to complete the highly integrated design of multichannel transmitting-receiving module, and compared to traditional transmitting-receiving subassembly, transmitting-receiving subassembly disclosed in the present application has easy heat radiation, high reliablity, it is light-weight, it is small in size, channel spacing is from more perfect, use more flexible the advantages that facilitating, it can be used for navigating, positioning, the Military and civil fields such as search and rescue.
Description
Technical field
The present invention relates to microwave technical field, especially a kind of novel 36 channel X-band transmitting-receiving subassembly.
Background technique
T/R component refers to part and active phased array thunder between a wireless transceiver system IF process and antenna
The success or not of the key component reached, design determines the cost, productibility and system performance of whole radar.
With the development of microwave technology, novel T/R component uses highly integrated assembling, encapsulation technology, has body
Small, the light-weight, high reliablity of product, it is at low cost, high-efficient the advantages that, in miniaturization, the height for realizing airborne and Shipboard Radar System
Aspect of performance has very important strategy and realistic meaning.But although it is highdensity assembling reduce costs, quality and
Volume but will lead to the problems such as module operating temperature is higher, and technology difficulty is big, and the isolation performance between circuit reduces.
Summary of the invention
The present inventor regarding to the issue above and technical need, proposes a kind of novel 36 channel X-band transmitting-receiving subassembly, the receipts
Hair component realizes highly integrated design and easy heat radiation, high reliablity, light-weight, the small in size, channel of multichannel transmitting-receiving module
Between the advantages that more improving is isolated.
Technical scheme is as follows:
A kind of novel 36 channel X-band transmitting-receiving subassembly, the novel 36 channel X-band transmitting-receiving subassembly include the first circuit base
Plate, heat dissipation cold plate, second circuit substrate, tertiary circuit substrate, prevention at radio-frequency port, power port, inlet and liquid outlet, the first electricity
Base board, heat dissipation cold plate, second circuit substrate, tertiary circuit substrate are stacked, and inlet and liquid outlet are respectively communicated with heat dissipation
Cold plate；
36 radio frequency receiving and transmitting front end circuits of 6 × 6 array formats are laid on first circuit substrate；On second circuit substrate
36 width phase control circuits of 6 × 6 array formats are laid with, active division is also laid on second circuit substrate into network, function point
Synthesis network and 36 width phase control circuits are laid in the different circuit layers of second circuit substrate；It is each on first circuit substrate
Radio frequency receiving and transmitting front end circuit is respectively used to be connected with a paster antenna, each radio frequency receiving and transmitting front end electricity on the first circuit substrate
Vertical interconnection structure correspondence is connected between road passes through plate with each width phase control circuit on second circuit substrate respectively, second circuit
Each width phase control circuit on substrate passes through vertical interconnection structure in plate respectively and is connected with function division at network；Every group be connected
Radio frequency receiving and transmitting front end circuit and width phase control circuit constitute a transceiver channel, and 36 transceiver channels and function division are formed at network
The radio frequency link of novel 36 channel X-band transmitting-receiving subassembly；
The control link of novel 36 channel X-band transmitting-receiving subassembly is laid on tertiary circuit substrate, control link leads to respectively
Cross each width phase control circuit and function division between plate in vertical interconnection structure and second circuit substrate be connected at network realize with
The connection of radio frequency link, control link are also connected with prevention at radio-frequency port with power port.
Its further technical solution is that 36 width phase control circuits are laid in the surface of second circuit substrate, function division
The inside of second circuit substrate is laid at network, vertical interconnection structure respectively includes microstrip line, coaxial line and band in each plate
Shape line, microstrip line are arranged in the surface of second circuit substrate and are connected with a width phase control circuit, and strip line setting is in function point
Synthesis network where circuit layer and be connected with function division at network, microstrip line is connected with strip line by coaxial line；It hangs down between plate
Straight interconnection architecture includes but is not limited to insulator and hair button.
Its further technical solution is that control link includes programmable logic device, power circuit, sequence circuit, arteries and veins
Modulated circuit and temperature-control circuit, power circuit, temperature-control circuit, sequence circuit connect with programmable logic device respectively
It connects, programmable logic device, power circuit are connect with pulse modulated circuit respectively, and pulse modulated circuit is connected with radio frequency link
It connects；Power circuit includes negative pressure monitoring circuit and power supply regulator circuit, and negative pressure monitoring circuit is used to close electricity in abnormity of power supply
Source, power supply regulator circuit are used to guarantee the electrical stability of radio frequency link；Sequence circuit is based on timing controller, sequence circuit
For carrying out delay process to the transmitting-receiving pulse signal of input, and it is sent to programmable logic device；Programmable logic device is used
It is handled in the output signal to sequence circuit, obtain transmitting pulse signal and return pulse signal and is sent to impulse modulation
Circuit, pulse modulated circuit be used for receives transmitting pulse signal and return pulse signal, control radio frequency link time-sharing power and
Switch transmitting-receiving switching；Temperature-control circuit is based on temperature control chip, and temperature-control circuit is used for the novel 36 channel X of real-time monitoring
The temperature of wave band transmitting-receiving subassembly；
Wherein, negative pressure monitoring circuit include first diode, the second diode, triode, first resistor, second resistance and
3rd resistor, the negative voltage that the anode of first diode receives, the cathode of first diode connect respectively triode base stage,
The cathode and 3rd resistor of second diode, the other end ground connection of 3rd resistor, the anode of the second diode pass through second resistance
The positive voltage received, the emitter ground connection of triode, collector connect enabled output end, and the collector of triode passes through
First resistor connects positive voltage；Power supply regulator circuit is based on voltage stabilizing chip, and the enabled foot of voltage stabilizing chip connects negative pressure monitoring circuit
Enabled output end, output of the supply voltage, output end that the input of voltage stabilizing chip receives as power circuit.
Its further technical solution is that the first circuit substrate, second circuit substrate and tertiary circuit substrate are respectively adopted
High frequency plate TSM-DS3R.
The method have the benefit that:
This application discloses a kind of novel 36 channel X-band transmitting-receiving subassembly, which is different from common T/R group
Part is constructed using 3D structure, by the chip active circuit of transmitting-receiving subassembly, passive network and liquid-cooling heat radiation fluid channel and patch
Antenna is jointly integrated, and each Transmit-Receive Unit individually separates together, realizes transmission-receiving function, so as to complete multichannel receipts
Send out the highly integrated design of module, and compared to traditional transmitting-receiving subassembly, transmitting-receiving subassembly disclosed in the present application have easy heat radiation,
High reliablity, light-weight, small in size, channel spacing are from more perfect, using more flexible the advantages that facilitating, can be used for navigating, position,
The Military and civil fields such as search and rescue.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of novel 36 channel X-band transmitting-receiving subassembly disclosed in the present application.
Fig. 2 is the layout diagram of the circuit in 36 channels on circuit substrate.
Fig. 3 is the schematic diagram of four circuit planes in transmitting-receiving subassembly disclosed in the present application.
Fig. 4 is the circuit diagram of the radio frequency link formed in transmitting-receiving subassembly disclosed in the present application.
Fig. 5 is connected between different physical units by vertical interconnection structure between plate in transmitting-receiving subassembly disclosed in the present application
Schematic diagram.
Fig. 6 is the simulation result of Fig. 5 structure.
Fig. 7 is between different circuit planes in transmitting-receiving subassembly disclosed in the present application on the same circuit substrate by plate
The connected schematic diagram of vertical interconnection structure.
Fig. 8 is the simulation result of Fig. 7 structure.
Fig. 9 is the structural schematic diagram of the control link in the transmitting-receiving subassembly of the application.
Figure 10 is the circuit diagram for controlling the power circuit in link.
Figure 11 is the circuit diagram for controlling the sequence circuit in link.
Figure 12 is the circuit diagram for controlling the temperature-control circuit in link.
Specific embodiment
The following further describes the specific embodiments of the present invention with reference to the drawings.
This application discloses a kind of novel 36 channel X-band transmitting-receiving subassembly, which constitutes upper main including penetrating in circuit
Frequency link and control this two parts functional circuit of link, component are constructed using 3D solid, all functional circuits are walked according to signal
To and function division it is laterally uniform to radio frequency receiving and transmitting front end, width phase control, function division at network and control four electricity of link
Be laid in the plane of road on three pieces of circuit substrates, referring to FIG. 1, the transmitting-receiving subassembly mainly include the first circuit substrate, heat dissipation it is cold
Plate, second circuit substrate, tertiary circuit substrate, prevention at radio-frequency port F, power port V, inlet IN and liquid outlet OUT, the first circuit
Substrate, heat dissipation cold plate, second circuit substrate, tertiary circuit substrate are stacked, and inlet IN and liquid outlet OUT are respectively communicated with scattered
Hot cold plate.High frequency plate TSM-DS3R is respectively adopted in first circuit substrate, second circuit substrate and tertiary circuit substrate.
36 radio frequency receiving and transmitting front end circuits of 6 × 6 array formats, layout stracture schematic diagram are laid on first circuit substrate
As shown in Fig. 2, such as CH1-1 indicates one of radio frequency receiving and transmitting front end circuit.Please refer to the circuit planes connection signal of Fig. 3
Figure, each radio frequency receiving and transmitting front end circuit mainly include circulator, high power RF amplifier HPA, low-noise amplifier LNA1 and
Limiter LMT.The particular circuit configurations of radio frequency receiving and transmitting front end circuit can refer to the structure of existing radio frequency receiving and transmitting front end circuit,
The application is not described in detail.
36 width phase control circuits of 6 × 6 array formats, layout stracture schematic diagram and figure are laid on second circuit substrate
2 is identical.Incorporated by reference to Fig. 3, each width phase control circuit mainly includes low-noise amplifier LNA2, driving amplifier DrA and width phase
Multifunctional circuit, width phase multifunctional circuit mainly include compensating amplifier, numerical-control attenuator, digital phase shifter and switching group etc.,
The particular circuit configurations of width phase control circuit can refer to the structure of existing width phase control circuit, and the application is not described in detail.
Active division is also laid on second circuit substrate into network, function division is laid at network and 36 width phase control circuits
In the different circuit layers of second circuit substrate, and 36 width phase control circuits are laid in the table of second circuit substrate by the application
Face, function division are laid in the inside of second circuit substrate at network.Function division can be with reference to existing at the particular circuit configurations of network
At the structure of network, the application is not described in detail for some function divisions.
How it is by the signal of Different Plane that circuit is divided into multiple Planar realization Top-down designs to introduce maximum problem
Carry out reliable efficient interconnection.The volume that mutual contact mode does not require nothing more than occupancy wants small, and more requiring can be light between different physical units
Pine nut now separates, to facilitate each physical unit to carry out test assessment and maintenance and debugging.Please refer to the circuit planes connection signal of Fig. 3
Figure, the first circuit substrate are used to be connected by vertical interconnection structure between plate with antenna array, and antenna array includes 6 × 6 array shapes
36 paster antennas of formula, each radio frequency receiving and transmitting front end circuit on the first circuit substrate pass through vertical interconnection structure between plate respectively
It is connected with a paster antenna.Each radio frequency receiving and transmitting front end circuit on first circuit substrate and each on second circuit substrate
Vertical interconnection structure is corresponding connected between width phase control circuit passes through plate respectively.Each width phase control circuit on second circuit substrate
It is connected respectively with function division at network by vertical interconnection structure in plate.Every group of connected radio frequency receiving and transmitting front end circuit and phased
Circuit processed constitutes a transceiver channel, and each transceiver channel includes that driving amplifier DrA and high power amplifier HPA are constituted
The receiving branch that transmitting branch and limiter LMT and two-stage low-noise amplifier LNA1, LNA2 are constituted.Entire transmitting-receiving subassembly shape
At 36 transceiver channels, this 36 transceiver channels and function division form the radio frequency link of the component at network, the radio frequency formed
The circuit structure diagram of link is referring to FIG. 4, radio frequency link completes distribution, numerical control phase shift and the decaying of transmitting signal, transmitting signal
Saturation amplification；It receives signal low noise amplification, numerical control phase shift and decaying and receives Beam synthesis.
As can seen above, it is divided according to actual circuit and physical distribution, the component of the application is primarily present two kinds of vertical interconnections
Structure, first is that vertical interconnection structure in plate inside substrate, second is that vertical interconnection structure between plate between different physical units.Its
In:
(1), vertical interconnection structure between plate.Vertical interconnection structure includes but is not limited to insulator and hair button between plate, at this
In application, each radio frequency receiving and transmitting front end circuit on the first circuit substrate and between paster antenna use microwave coaxial insulator phase
Even, between each width phase control circuit on each radio frequency receiving and transmitting front end circuit and second circuit substrate on the first circuit substrate
Also it is connected using microwave coaxial insulator.Referring to FIG. 5, being connected between two physical units by insulator 51, insulator is not
The interconnection being only able to achieve between different physical units, moreover it is possible to facilitate each physical unit is discrete, simulation result referring to FIG. 6, from
Simulation result can be seen that in required frequency range, loss is less than 0.1dB, and standing-wave ratio is less than -15dB, can better meet and penetrate
Keep pouring in defeated requirement.
(2), vertical interconnection structure in plate.High-frequency multilayer plate itself has good radio frequency transmission capabilities, high-frequency multilayer plate
Front and back sides signal is mainly realized low-loss intercommunication by vertical interconnection structure in internal plate, referring to FIG. 7, vertical in each plate
Interconnection architecture respectively includes microstrip line 71, coaxial line 72 and strip line 73, and the surface of second circuit substrate is arranged in microstrip line 71
And be connected with one of width phase control circuit, strip line 73 be arranged in function division at the circuit layer where network and with function division
It is connected at network, microstrip line 71 is connected with strip line 73 by coaxial line 72.Radiofrequency signal passes through three in second circuit is basic
Kind transmission structure (microstrip line-coaxial line-strip line) is transmitted.It can be seen that from the simulation result shown in Fig. 8 in required frequency
In section, loss is less than 0.1dB, and standing-wave ratio is less than -20dB, can satisfy the requirement of radio frequency transmission.
The control link being laid in the component on tertiary circuit substrate, control link is for completing power supply control and logic
Timing control, control link are connected with prevention at radio-frequency port F and power port V, for by needed for acquisition outside corresponding port
Radiofrequency signal, control signal and power supply signal.Control link passes through between plate respectively in vertical interconnection structure and second circuit substrate
Each width phase control circuit be connected with function division at network, realize control link and radio frequency link connection so that control
Link processed is the amplifier power supply in radio frequency link, and according to the work of radiofrequency signal and control signal control radio frequency link.?
In the application, control link is connected between network by hair button with each width phase control circuit and function division.In the application,
Control link is mainly completed to function such as negative pressure monitoring, power protection, power supply pressure stabilizing adjustment and the logical-sequential controls of transmitting-receiving subassembly
Can, control link mainly includes programmable logic device, power circuit, sequence circuit, pulse modulated circuit and temperature control electricity
Road, referring to FIG. 9, power circuit, temperature-control circuit, sequence circuit are connect with programmable logic device respectively, it is programmable to patrol
Volume device, power circuit are connect with pulse modulated circuit respectively, and pulse modulated circuit is connected with radio frequency link, specifically, arteries and veins
Modulated circuit is connected with each amplifier in radio frequency link.Programmable logic device can be realized by CPLD.Control link
Transmitting-receiving subassembly work when from outside obtain signal include but is not limited to negative voltage V1, positive voltage V2, supply voltage V3, power supply
Voltage V5, transmitting-receiving pulse signal TP and standby signal STDi.
Power circuit includes negative pressure monitoring circuit and power supply regulator circuit, please refers to the power circuit of Figure 10, negative pressure monitoring
Circuit includes first diode D1, the second diode D2, triode D3, first resistor R1, second resistance R2 and 3rd resistor R3,
The anode of first diode D1 meets negative voltage V1, and the cathode of first diode D1 connects the base stage of triode D3, the two or two pole respectively
The cathode and 3rd resistor R3 of pipe D2, the other end ground connection of 3rd resistor R3, the anode of the second diode D2 pass through second resistance
The emitter ground connection of R2 connection positive voltage V2, triode D3, collector connect enabled output end EN, and the collector of triode D3 is logical
Cross first resistor R1 connection positive voltage V2.Power supply regulator circuit includes two branches, and two branches are based respectively on voltage stabilizing chip AV1
And AV2, the EN pin of voltage stabilizing chip AV1 and AV2 are all connected to the enabled output end EN, voltage stabilizing chip AV1 of negative pressure monitoring circuit
IN pin connect supply voltage V3, the OUT foot of voltage stabilizing chip AV1 is as supply voltage V4 output, and voltage stabilizing chip AV1 is by power supply
Voltage V3 is converted to supply voltage V4.The IN pin of voltage stabilizing chip AV2 connects supply voltage V5, and the OUT foot of voltage stabilizing chip AV2 is made
For supply voltage V6 output, the voltage stabilizing chip AV2 electricity supply voltage V5 that will power is converted to supply voltage V6, in power supply regulator circuit
Other peripheral circuits of voltage stabilizing chip of two branches please refer to Figure 10.Power supply adjusts the power supply shown in two branches of branch
Voltage V4 and V6 give to emit in radio frequency link respectively and power with the amplifier of receiving branch, guarantee transmitting and receiving branch amplifier
The stability of power supply, when transmitting-receiving subassembly internal electric source not normally establish or negative supply burst power down, that is, negative voltage V1 exception when, bear
It presses monitoring circuit to export enable signal, closes positive supply, the output of adjustment circuit, since the closing velocity of power supply regulator circuit exists
The control signal of musec order, the output of negative pressure monitoring circuit simultaneously closes off the modulation power source for being supplied to amplifier in radio frequency link,
To accelerate closing velocity, to realize the protection of transmitting-receiving subassembly internal components.
Sequence circuit is used to carry out delay process to the transmitting-receiving pulse signal TP of input and is sent to programmable logic device.
Sequence circuit is adjusted and splits to transmitting-receiving pulse signal TP, completes to receive transmitting-receiving subassembly, transmitting and the states such as standby
Control.Specifically, as shown in figure 11, sequence circuit is based on timing controller D1, sequence circuit receives transmitting-receiving pulse signal TP
Line delay of going forward side by side handles to obtain TD signal and RD signal, and TD signal and the output of RD signal are then sent to programmable logic device
Part.
Programmable logic device is by TD signal and TP signal phase or, then defeated with the enabled output end EN of negative pressure monitoring circuit
The temperature signal and standby signal STDi phase of enable signal, temperature-control circuit out and obtain transmitting pulse signal TP-0.It can
Programmed logic device by RD signal and TP signal phase with, then with the signal of the enabled output end EN of negative pressure monitoring circuit, temperature
The temperature signal and standby signal STDi phase of control circuit and obtain return pulse signal TR-0.Programmable logic device will emit
Pulse signal TP-0 and return pulse signal TR-0 is sent to pulse modulated circuit, transmitting pulse signal TP-0 and reception pulse letter
Number TR-0 can guarantee that the receiving branch of radio frequency link and the switching time of transmitting branch time-sharing work meet system requirements and group
The normal trouble free service of part.
Pulse modulated circuit is for receiving transmitting pulse signal TP-0 and return pulse signal TR-0, controlling in radio frequency link
Time-sharing power and switch transmitting-receiving switching of the transmitting with receiving branch, guarantee transmitting are isolated with reception state, improve transmitting-receiving subassembly
Power-efficient.Pulse modulated circuit is important component general in conventional transmitting-receiving subassembly, is typically based on field-effect tube structure
It builds, the application is no longer discussed in detail.
Figure 12 is please referred to, temperature-control circuit is based on temperature control chip D2, such as using model LM74CIMX-3's
Temperature control chip, temperature control chip are connect with programmable logic device.Temperature control chip is used to receive and dispatch the temperature to component
Degree carries out real-time monitoring, and the temperature transition monitored is that binary string code is deposited in chip interior by temperature control chip, can compile
Journey logical device is to temperature control chip transmission timing signal SC and reads and writes enable signal CS, reading string code signal SI.It is programmable
Logical device handles the temperature signal read, will if programmable logic device judges that temperature reaches rated temperature
The pulse signal for being sent to pulse modulated circuit is set to 0, and the amplifier chip in radio frequency link stops working, and plays temperature protection
Effect.
Above-described is only the preferred embodiment of the application, and present invention is not limited to the above embodiments.It is appreciated that this
The other improvements and change that field technical staff directly exports or associates without departing from the spirit and concept in the present invention
Change, is considered as being included within protection scope of the present invention.
Claims (4)
1. a kind of novel 36 channel X-band transmitting-receiving subassembly, which is characterized in that the novel 36 channel X-band transmitting-receiving subassembly includes
First circuit substrate, heat dissipation cold plate, second circuit substrate, tertiary circuit substrate, prevention at radio-frequency port, power port, inlet and go out
Liquid mouth, first circuit substrate, heat dissipation cold plate, second circuit substrate, tertiary circuit substrate are stacked, the inlet and
Liquid outlet is respectively communicated with the heat dissipation cold plate；
36 radio frequency receiving and transmitting front end circuits of 6 × 6 array formats are laid on first circuit substrate；The second circuit base
It is laid with 36 width phase control circuits of 6 × 6 array formats on plate, also lays active division networking on the second circuit substrate
Network, the function division are laid in the different circuit layers of the second circuit substrate at network and 36 width phase control circuits；
Each radio frequency receiving and transmitting front end circuit on first circuit substrate is respectively used to be connected with a paster antenna, first electricity
Each width phase control circuit on each radio frequency receiving and transmitting front end circuit and the second circuit substrate on base board passes through respectively
Vertical interconnection structure is corresponding between plate is connected, and each width phase control circuit on the second circuit substrate passes through vertical in plate respectively
Interconnection architecture is connected with the function division at network；Every group of connected radio frequency receiving and transmitting front end circuit and width phase control circuit constitute one
A transceiver channel, 36 transceiver channels and the function division form penetrating for the novel 36 channel X-band transmitting-receiving subassembly at network
Frequency link；
The control link of the novel 36 channel X-band transmitting-receiving subassembly, the Quality Initiative are laid on the tertiary circuit substrate
Road passes through each width phase control circuit and function division networking between plate in vertical interconnection structure and the second circuit substrate respectively
The connected connection realized with the radio frequency link of network, the control link are also connected with the prevention at radio-frequency port with power port.
2. novel 36 channel X-band transmitting-receiving subassembly according to claim 1, which is characterized in that 36 width phase controls
Circuit is laid in the surface of the second circuit substrate, and the function division is laid in the second circuit substrate at network
Portion, vertical interconnection structure respectively includes microstrip line, coaxial line and strip line in each plate, and the microstrip line is arranged described
The surface of second circuit substrate is simultaneously connected with a width phase control circuit, and the strip line is arranged in the function division into network institute
Circuit layer and be connected with the function division at network, the microstrip line is connected with the strip line by the coaxial line；
Vertical interconnection structure includes but is not limited to insulator and hair button between the plate.
3. novel 36 channel X-band transmitting-receiving subassembly according to claim 1, which is characterized in that the control link includes
Programmable logic device, power circuit, sequence circuit, pulse modulated circuit and temperature-control circuit, the power circuit, temperature
Control circuit, sequence circuit are connect with the programmable logic device respectively, the programmable logic device, power circuit difference
It is connect with the pulse modulated circuit, the pulse modulated circuit is connected with radio frequency link；The power circuit includes negative pressure
Monitoring circuit and power supply regulator circuit, the negative pressure monitoring circuit is for closing power supply, the power supply adjustment in abnormity of power supply
Circuit is used to guarantee the electrical stability of the radio frequency link；The sequence circuit is based on timing controller, the timing electricity
Road is used to carry out delay process to the transmitting-receiving pulse signal of input, and is sent to the programmable logic device；It is described programmable
Logical device obtains transmitting pulse signal and return pulse signal simultaneously for handling the output signal of the sequence circuit
It is sent to the pulse modulated circuit, the pulse modulated circuit is for receiving transmitting pulse signal and return pulse signal, control
Make time-sharing power and the switch transmitting-receiving switching of the radio frequency link；The temperature-control circuit is based on temperature control chip, described
Temperature of the temperature-control circuit for novel 36 channel X-band transmitting-receiving subassembly described in real-time monitoring；
Wherein, the negative pressure monitoring circuit include first diode, the second diode, triode, first resistor, second resistance and
3rd resistor, the negative voltage that the anode of the first diode receives, the cathode of the first diode connect described respectively
The base stage of triode, the cathode of second diode and the 3rd resistor, the other end ground connection of the 3rd resistor are described
The positive voltage that the anode of second diode is received by the second resistance, the emitter ground connection of the triode, collection
Electrode connects enabled output end, and the collector of the triode connects the positive voltage by first resistor；The power supply adjustment
Circuit is based on voltage stabilizing chip, and the enabled foot of the voltage stabilizing chip connects the enabled output end of the negative pressure monitoring circuit, described steady
Output of the supply voltage, output end that the input of pressure chip receives as the power circuit.
4. novel 36 channel X-band transmitting-receiving subassembly according to claim 1 to 3, which is characterized in that first electricity
High frequency plate TSM-DS3R is respectively adopted in base board, second circuit substrate and tertiary circuit substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910635431.8A CN110233639B (en) | 2019-07-15 | 2019-07-15 | Novel 36-channel X-band receiving and transmitting assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910635431.8A CN110233639B (en) | 2019-07-15 | 2019-07-15 | Novel 36-channel X-band receiving and transmitting assembly |
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| CN110233639A true CN110233639A (en) | 2019-09-13 |
| CN110233639B CN110233639B (en) | 2024-05-10 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111835376A (en) * | 2020-08-10 | 2020-10-27 | 航天科工通信技术研究院有限责任公司 | High-integration multi-channel tile type T/R assembly and arrangement method |
| CN113098551A (en) * | 2021-04-27 | 2021-07-09 | 电子科技大学 | HTCC three-dimensional receiving and transmitting assembly |
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| CN110233639B (en) | 2024-05-10 |
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