CN110223964B - Heat dissipation type chip fan-out structure and cooling scheme - Google Patents
Heat dissipation type chip fan-out structure and cooling scheme Download PDFInfo
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- CN110223964B CN110223964B CN201910471245.5A CN201910471245A CN110223964B CN 110223964 B CN110223964 B CN 110223964B CN 201910471245 A CN201910471245 A CN 201910471245A CN 110223964 B CN110223964 B CN 110223964B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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Abstract
The invention relates to the field of chip packaging, in particular to a heat dissipation type chip fan-out structure and a cooling scheme. The groove of the heat dissipation type chip fan-out structure is partially filled with the conductive substance, a space for the cooling medium to flow is reserved above the conductive substance in the groove, and the heat of components in the chip is transferred by utilizing the self structure of the circuit groove, so that the heat dissipation efficiency is improved, and the problem of chip heating is solved.
Description
Technical Field
The invention relates to the field of chip packaging, in particular to a heat dissipation type chip fan-out structure and a cooling scheme.
Background
In recent years, with the continuous progress of science and technology, microelectronic chips are applied everywhere, from various smart phones, wearable devices to national weighing machines such as missiles, satellites and super computers, the application of the chips runs through aspects of production life and national defense science and technology, and the chips are about to become indispensable devices for human survival progress. The current chip becomes more and more refined, the running speed is faster and faster, and the volume is smaller, so that the higher integration level is more beneficial to the application of the chip obviously. However, the problem of heat dissipation of the chip caused by the heat dissipation is increasingly prominent, more integrated transistors can generate huge heat while bringing strong computing power, if the excessive heat cannot be timely discharged out of the chip, the working stability of the chip is reduced, the error rate is increased, and meanwhile, the thermal stress formed by the chip module and the external environment can directly cause disorder of the electrical performance, the working frequency, the mechanical strength and the reliability of the chip.
Therefore, how to dissipate a large amount of heat in time so that the temperature of the chip can be kept at a low level has become an urgent problem to be solved. Among various thermal resistances of the chip, the thermal resistance introduced by an interface material between the chip and an external heat sink is a key for controlling the total thermal resistance, and is also a target of almost all thermal resistance research concerns so far. In the past, efforts have been made to reduce the thermal contact resistance between the chip and the external environment, and to reduce the temperature of the temperature internal components by means of an external intensive cooling technique. However, one of the neglected facts is that the heat generation source in the chip is the electronic components inside the chip, not the multi-layer package structure except the components, so if the heat of the components inside the chip can be directly removed through the fan-out structure, a great breakthrough is made in the problem of heat dissipation of the chip, and the heat load of the heat generating components and the chip can be reduced to the maximum extent. In a chip fan-out structure, the prior art usually only focuses on how to fan out an I/O, and neglects the problem of chip heat dissipation. The fan-out circuit is in complete contact with the packaging raw materials, and the heat can be dissipated only through the packaging raw materials with large thermal resistance after the core in the chip conducts the heat to the fan-out circuit. In addition, the fan-out mode is that copper wires or gold wires are often used for fan-out of the I/O port, the fan-out process is complex, the yield is low, and the packaging risk is uncontrollable.
Disclosure of Invention
In order to solve the above problems, the present invention provides a heat dissipation type chip fan-out structure and a cooling scheme, and the specific technical scheme is as follows:
a heat dissipation type chip fan-out structure comprises a chip lower substrate, a chip body and a chip upper substrate, wherein a chip groove and a groove are formed in the surface of the chip lower substrate, the chip body is fixed in the chip groove, the groove comprises a completely filled groove and/or a partially filled groove, and at least one groove is the partially filled groove; the full filling of the whole space in the groove is filled with the conductive substance, the partial space in the partial filling groove is filled with the conductive substance, the groove comprises a fan-in groove and a fan-out groove, the fan-in groove is connected with at least one fan-out groove, the fan-in groove and the fan-out groove are mutually connected, or the fan-in groove and the fan-out groove are mutually connected and are partially filled with the groove.
Further, the grooves may be in the same plane or in different planes.
Further, the cross-sectional shape of the groove includes one or more of a V-shape, a U-shape, a semi-circle shape, and a square shape.
Further, the conductive substance is one or more of graphene, carbon nanotubes, copper, gold and titanium.
Further, the chip groove and the groove are processed in one or more of electrostatic spinning, laser etching and mechanical processing.
Further, the trench fills the trench for the portion.
A cooling scheme for a heat dissipation chip fan-out structure includes a passive cooling scheme or an active cooling scheme.
Further, the cooling medium of the passive cooling scheme is air.
Further, the cooling medium of the active cooling area scheme is liquid, and a pump body is required to be arranged to pump the liquid into the partially filled groove by adopting the active cooling scheme.
The groove of the heat dissipation type chip fan-out structure is partially filled with the conductive substance, a space for the cooling medium to flow is reserved above the conductive substance in the groove, and the heat of components in the chip is transferred by utilizing the self structure of the circuit groove, so that the heat dissipation efficiency is improved, and the problem of chip heating is solved. The groove is only needed to be carved by a chemical or physical method for the micro-channel, and then the conductive substance is sprayed and printed, so that the processing is simple, the process performance is controllable, and the groove can be used for producing and manufacturing large-scale high-computing-power chips in the future.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a top view of a heat dissipating chip fan-out structure of example 1;
FIG. 2 is a front view of a fan-out structure of a heat-dissipating chip in example 1;
FIG. 3 is a sectional view of a completely filled trench and a partially filled trench in example 1;
FIG. 4 is a top view of a heat spreader chip fan-out structure of example 2;
fig. 5 is a top view of a fan-out structure of a heat-dissipating chip in example 3.
In the figure: 1 chip lower substrate, 2 chip bodies, 3 chip upper substrates, 4 chip grooves, 5 grooves, 51 completely filling grooves 51, 52 partially filling grooves and 6-shaped grooves.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to specific embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A heat dissipation type chip fan-out structure comprises a chip lower substrate, a chip body and a chip upper substrate, wherein a chip groove and a groove are formed in the surface of the chip lower substrate, the chip body is fixed in the chip groove, the groove comprises a completely filled groove and/or a partially filled groove, at least one groove is used for filling a conductive substance into the whole space in the completely filled groove of the partially filled groove, and the conductive substance is filled into the partial space in the partially filled groove; the filling of the conductive material in the grooves is used for the fan-in and fan-out of the circuit, and the gaps are left in the partially filled grooves, so that a cooling medium can flow in and out to conduct heat out of the interior of the chip.
The grooves comprise fan-in grooves and fan-out grooves, the fan-in grooves are connected with at least one fan-out groove, the fan-in grooves and the fan-out grooves which are connected are completely filled grooves, or the fan-in grooves and the fan-out grooves which are connected are partially filled grooves. The filling condition of the conductive materials in the fan-in groove and the fan-out groove which are connected with each other is the same, the grooves are in a 'rat hole structure' which is communicated with each other, namely at least one outlet can be found at any inlet, and the discrete topological structure is beneficial to the easier realization of the stacking structure between chips in the follow-up process.
Further, the grooves can be in the same plane or different planes, and stacking and heat dissipation of the chips are facilitated.
Further, the cross-sectional shape of the groove comprises one or more of a V shape, a U shape, a semicircle shape and a square shape, preferably a V shape, and the V shape is an inverted triangle. The shape and size of the grooves can be determined according to actual conditions, and the shapes and sizes of the grooves for different purposes can be combined at will.
Further, the conductive substance is one or more of graphene, carbon nanotubes, copper, gold and titanium. On the basis of ensuring the heat dissipation mechanism, the conductive substance can be metal with higher conductivity such as copper, gold, titanium and the like, and can also be new conductive materials such as graphene, carbon nano tubes and the like.
Further, the chip groove and the groove are processed in one or more of electrostatic spinning, laser etching and mechanical processing. The processing mode of the groove can be selected independently according to the size and the shape of the required groove.
A manufacturing method of a heat dissipation type chip fan-out structure comprises the following steps: (1) manufacturing the chip groove and the groove on the lower chip substrate; (2) the groove is not completely filled or is completely filled with a conductive substance; (3) and bonding the chip lower substrate and the chip substrate, and marking the groove which is not completely filled with the conductive substance.
A cooling scheme for a heat dissipation chip fan-out structure includes a passive cooling scheme or an active cooling scheme.
Furthermore, the cooling medium of the passive cooling scheme is air, the air freely flows in each groove, and according to the law of thermodynamics and the law of entropy increase, the air automatically exchanges heat inside the chip out, so that the cooling effect is achieved.
Further, the cooling medium of the active cooling area scheme is liquid, and a pump body is required to be arranged to pump the liquid into the partially filled groove by adopting the active cooling scheme. When the active cooling scheme is adopted, a micro injector and a small pump body are required to be arranged, part of groove openings are used as liquid input openings, and part of groove openings are used as liquid output openings. The outlet and inlet of the cooling medium are not set explicitly, and technicians can flexibly configure the outlet, inlet and outlet of the cooling medium according to the actual chip design condition.
Example 1
The utility model provides a heat dissipation type chip fan-out structure, as shown in fig. 1 and fig. 2, includes chip infrabasal plate 1, chip body 2, chip upper substrate 3, chip groove 4 and slot 5 have been seted up on the surface of chip infrabasal plate 1, chip groove 4 internal fixation chip body 2, part slot 5 with chip groove 4 is connected, slot 5 is including filling slot 51 and partial filling slot 52 completely, slot 5 is the V-arrangement slot, and the conducting material of packing is graphite alkene. A cross-sectional view of a fully filled trench 51 and a partially filled trench 52 is shown in fig. 3.
Example 2
Compared with embodiment 1, the present embodiment is different only in that: as shown in fig. 4, all of the trenches 5 are partially filled trenches 52.
In the heat dissipation type chip fan-out structure of the present embodiment, all the grooves can be filled with the cooling medium, and the heat dissipation effect is better than that of embodiment 1.
Example 3
Compared with embodiment 1, the present embodiment is different only in that: as shown in fig. 5, the lower chip substrate 1 is further provided with a square-shaped groove 6, the square-shaped groove 6 is not connected to the chip slot 4, and graphene is partially filled in the square-shaped groove 6.
The inside of the square-shaped groove can be used for flowing of a cooling medium, so that the heat dissipation effect of the fan-out structure of the embodiment is weaker than that of embodiment 1.
Example 4
Compared with embodiment 1, the present embodiment is different only in that: and completely filling graphene in the square groove.
Example 5
Compared with embodiment 1, the present embodiment is different only in that: the surface of the groove 13 is plated with a copper and titanium lamination layer.
Example 6
A manufacturing method of a heat dissipation type chip fan-out structure comprises the following steps:
(1) covering a special material on a lower substrate made of a thermoplastic material, wherein a groove pattern is drawn on the special material, and manufacturing a groove on the substrate along the groove pattern by applying a laser etching technology;
(2) and plating a conductive layer, such as a copper layer, a gold layer and the like, or a lamination of a plurality of metals, such as a lamination of copper and titanium, on each groove by using an electroplating process.
(3) And adhering the upper substrate to the lower substrate by using a special adhesive, and marking the groove opening which is not plated with the conductive substance.
Example 7
Compared with embodiment 6, the present embodiment is different only in that: the manufacturing method of the groove adopts an electrostatic spinning method, specifically, a male die of a required fan-out circuit is punched on a glass substrate by using an electrostatic spinning technology, wherein the material of the male die is a substance which is easy to degrade or remove, and a thermoplastic material is reverse-molded on the glass substrate to obtain the lower chip substrate with the groove.
Example 8
A cooling scheme of a heat dissipation type chip fan-out structure adopts an active cooling scheme: and a micro injector and a small pump body are arranged on the basis of the fan-out structure to pump cooling water into the partial filling groove and flow out from an outlet of the partial filling groove connected with the cooling water.
The active cooling scheme can control the inlet and outlet positions and flow of cooling water according to the heating condition of the chip, and the cooling effect is superior and controllable.
Example 9
A cooling scheme of a heat dissipation type chip fan-out structure adopts a passive cooling scheme, a cooling medium is air, a pump body is not needed, and heat of a chip is dissipated by means of free flow of the air.
Passive cooling is less effective than active cooling, but has the advantage of a simple process without additional cost.
Claims (9)
1. A cooling scheme of a heat dissipation type chip fan-out structure is characterized by comprising a passive cooling scheme or an active cooling scheme, wherein the cooling scheme adopts a chip fan-out structure, the chip fan-out structure comprises a chip lower substrate, a chip body and a chip upper substrate, a chip groove and a groove are formed in the surface of the chip lower substrate, the chip body is fixed in the chip groove, the groove comprises a completely filled groove and/or a partially filled groove, at least one groove is the partially filled groove, all spaces in the completely filled groove are filled with conductive substances, and the partial spaces in the partially filled groove are filled with the conductive substances;
the grooves comprise fan-in grooves and fan-out grooves, the fan-in grooves are connected with at least one fan-out groove, the fan-in grooves and the fan-out grooves which are connected are completely filled grooves, or the fan-in grooves and the fan-out grooves which are connected are partially filled grooves.
2. The cooling scheme of the fan-out structure of claim 1, wherein the cooling medium of the passive cooling scheme is air.
3. The cooling scheme of the fan-out structure of claim 1, wherein the cooling medium of the active cooling area scheme is a liquid, and a pump body is further required to pump the liquid into the partially filled trench.
4. The cooling scheme of the fan-out structure of claim 1, wherein the grooves are in the same plane or in different planes.
5. The cooling scheme of the fan-out structure of claim 1, wherein the cross-sectional shape of the grooves comprises one or more of a V-shape, a U-shape, a semi-circle, a square.
6. The cooling scheme of the fan-out structure of claim 1, wherein the conductive substance is one or more of graphene, carbon nanotubes, copper, gold, titanium.
7. The cooling scheme of the fan-out structure of claim 1, wherein the chip grooves and the grooves are machined by one or more of electrospinning, laser etching and machining.
8. The cooling scheme of the fan-out structure of claim 1, wherein the trench is the partially filled trench.
9. The cooling scheme of the fan-out structure of claim 1, wherein the surface of the lower substrate of the chip is further provided with a circular groove, the circular groove is connected with the groove, and the circular groove is partially filled or completely filled with the conductive substance.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101853840A (en) * | 2009-04-01 | 2010-10-06 | 日月光半导体制造股份有限公司 | Structure of embedded line substrate and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8018037B2 (en) * | 2009-04-16 | 2011-09-13 | Mediatek Inc. | Semiconductor chip package |
| CN202736972U (en) * | 2012-07-16 | 2013-02-13 | 桂林电子科技大学 | Wafer-grade large power LED packaging structure based on silicon through hole technology |
| CN207149548U (en) * | 2017-07-19 | 2018-03-27 | 江西凯强实业有限公司 | A kind of radiator structure of package substrate |
| CN109585399B (en) * | 2018-11-22 | 2020-07-14 | 北京遥感设备研究所 | Efficient heat-conducting chip substrate structure and preparation method |
| CN210073819U (en) * | 2019-05-31 | 2020-02-14 | 王晗 | Heat dissipation type chip fan-out structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101853840A (en) * | 2009-04-01 | 2010-10-06 | 日月光半导体制造股份有限公司 | Structure of embedded line substrate and manufacturing method thereof |
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