CN110213884A - Flexible electronic and preparation method thereof, flexible circuit and preparation method thereof - Google Patents
Flexible electronic and preparation method thereof, flexible circuit and preparation method thereof Download PDFInfo
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- CN110213884A CN110213884A CN201910547536.8A CN201910547536A CN110213884A CN 110213884 A CN110213884 A CN 110213884A CN 201910547536 A CN201910547536 A CN 201910547536A CN 110213884 A CN110213884 A CN 110213884A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 189
- 238000007639 printing Methods 0.000 claims abstract description 17
- 238000012546 transfer Methods 0.000 claims abstract description 15
- 206010040844 Skin exfoliation Diseases 0.000 claims abstract description 9
- 230000035618 desquamation Effects 0.000 claims abstract description 9
- 238000004090 dissolution Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000002195 soluble material Substances 0.000 claims description 4
- 230000008595 infiltration Effects 0.000 claims 1
- 238000001764 infiltration Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 12
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 7
- 230000006872 improvement Effects 0.000 description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 229910000846 In alloy Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 208000029549 Muscle injury Diseases 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Abstract
The present invention relates to flexible circuit technology fields, provide the preparation method of a kind of flexible electronic and preparation method thereof, flexible circuit, the bearing substrate of flexible electronic includes sequentially connected first substrate, the second substrate and third substrate, it only need to be by third substrate desquamation, so as to have the first substrate transfer of circuit structure layer and electronic component to printing body surface, required flexible circuit can be obtained；In technique, the first substrate, the second substrate and third substrate are in turn connected to form bearing substrate；Circuit structure layer is prepared on the first substrate；Electronic component is arranged on the circuit structure layer, can be obtained above-mentioned flexible electronic；To the bearing substrate of flexible electronic, third substrate desquamation is made, by the first substrate transfer with circuit structure layer and electronic component to printing body surface for after the dissolution of the second substrate through third substrate using medium, it can be obtained flexible circuit, preparation process is simple, easy to implement.
Description
Technical field
The present invention relates to flexible circuit technology field more particularly to flexible electronic and preparation method thereof, flexible circuit and its
Preparation method.
Background technique
Flexible circuit has bendable folding endurance, can be bonded various rules or irregular surface, signal-to-noise ratio is high, signal stabilization
The features such as, therefore, flexible electronic is widely used in fields such as medical diagnosis, automatic control, smart machines, such as is answered
For prosthesis control, human-computer interaction, wearable device etc..However, prior art can not be carried out on substrate flexible it is soft
Property circuit preparation, it usually needs by different substrates carry out repeatedly processing obtain, or utilize the skills such as photoetching, vapor deposition
Art carries out the preparation of flexible circuit, and preparation process haves the characteristics that step is complicated, technique is cumbersome, is unfavorable for being mass produced.
Summary of the invention
The scheme provided according to embodiments of the present invention provides flexible electronic and preparation method thereof, flexible circuit and its system
Preparation Method solves the technical problem that flexible circuit preparation process step is complicated, technique is cumbersome at least to a certain extent.
The technical proposal adopted by the invention to solve the above technical problems is that:
On the one hand the embodiment of the present invention provides a kind of flexible electronic, including bearing substrate and circuit module, in which: described
Bearing substrate includes sequentially connected first substrate, the second substrate and third substrate, and first substrate has a flexibility, and described the
Two substrates are placed between first substrate and the third substrate, and second substrate can be dissolved by medium, and described
Three substrates can be by the medium osmosis；The circuit module is arranged on first substrate.
As an improvement of the above technical solution, the circuit module includes circuit structure layer and electronic component, the circuit
Structure sheaf is arranged on first substrate, and the electronic component is set on the circuit structure layer.
As a further improvement of the above technical scheme, the circuit structure layer includes that the first conductive layer and second are conductive
Layer, first conductive layer are covered on first substrate, and first conductive layer has viscosity；Second conductive layer covers
It covers on first conductive layer.
In another middle preferred embodiment, first conductive layer is covered on first lining by way of coating
On bottom and/or second conductive layer is covered on first conductive layer by way of coating.
As a further improvement of the above technical scheme, print setting circuit pattern on first substrate, the circuit
Structure sheaf is arranged on first substrate by the initialization circuit pattern.
On the one hand the embodiment of the present invention provides a kind of preparation method of flexible electronic: will have the first substrate flexible,
Can by medium dissolve the second substrate and bearing substrate can be in turn connected to form by the third substrate of the medium osmosis；
Circuit structure layer is prepared on the first substrate of bearing substrate；Electronic component is arranged on the circuit structure layer.
On the one hand the embodiment of the present invention, additionally provides a kind of preparation method of flexible circuit: using any of the above-described technical side
Flexible electronic described in case serves as a contrast the bearing substrate of the flexible electronic with the medium through the third substrate by second
After the dissolution of bottom, make third substrate desquamation, by the first substrate transfer with circuit structure layer and electronic component to printing body surface,
Obtain flexible circuit.
As an improvement of the above technical solution, second substrate is made of water-soluble material, and the third substrate is adopted
It is made of dank material, using water as the medium, the bearing substrate for carrying electronic component is impregnated in water
Setting time makes third substrate desquamation so that after second substrate dissolution.
As a further improvement of the above technical scheme, after the completion of transfer, to be transferred to printing body surface have electronics
First substrate of element is solidified.
On the one hand the embodiment of the present invention, additionally provides a kind of flexible circuit, the flexible circuit is by any of the above-described technical solution
In the preparation method of flexible circuit be made.
The embodiment of the present invention at least have the following advantages that or the utility model has the advantages that
Flexible electronic includes bearing substrate and circuit module, and bearing substrate includes sequentially connected first substrate, the second lining
Bottom and third substrate, only need to be by third substrate desquamation, so as to have the first substrate of circuit structure layer and electronic component to turn
Print can be obtained required flexible circuit to printing body surface；In technique, successively by the first substrate, the second substrate and third substrate
Connection forms bearing substrate；Circuit structure layer is prepared on the first substrate；Electronic component is arranged on the circuit structure layer,
It can be obtained above-mentioned flexible electronic；To the bearing substrate of flexible electronic, the second substrate is dissolved through third substrate using medium
Afterwards, make third substrate desquamation, the first substrate transfer with circuit structure layer and electronic component to printing body surface can obtain
Flexible circuit is obtained, preparation process is simple, easy to implement.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing briefly describes:
Fig. 1 is the structural schematic diagram of flexible electronic one embodiment of the present invention；
Fig. 2 is the decomposition diagram of embodiment illustrated in fig. 1；
Fig. 3 is will have schematic diagram of the first substrate transfer of circuit module in printing body.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to design of the invention, specific structure and generation clear
Chu is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this hair
Bright a part of the embodiment, rather than whole embodiments, based on the embodiment of the present invention, those skilled in the art are not being paid
Other embodiments obtained, belong to the scope of protection of the invention under the premise of creative work.In addition, being related in patent
All connection/connection relationships, not singly refer to that component directly connects, and refer to can according to specific implementation situation, by addition or
Reduce couple auxiliary, Lai Zucheng more preferably coupling structure.The orientation such as upper and lower, left and right involved in the present invention describe
Relative to the position relationship of the components of the invention in the accompanying drawings.Each technical characteristic in the present invention, not
It can be with combination of interactions under the premise of conflicting conflict.
Embodiment one:
The embodiment of the present invention one provides a kind of flexible electronic, and with reference to Fig. 1,2, flexible electronic includes bearing substrate 1 and circuit
Module 2, wherein bearing substrate 1 includes sequentially connected first substrate 11, the second substrate 12 and third substrate 13, circuit module 2
Setting on the first substrate 11, the first substrate 11 have flexibility, can be film；Second substrate 12 is placed in the first substrate 11 and third
Between substrate 13, the bearing substrate 1 of three-decker is formed, the second substrate 12 is connect with a side surface of the first substrate 11, circuit
Another surface of the first substrate 11 is arranged in structure sheaf 21, and the second substrate 12 can be dissolved by medium, and third substrate 13 can
By the medium osmosis.
Based on above-mentioned flexible electronic, the second substrate 12 can be dissolved by medium through third substrate 13, third can be made to serve as a contrast
Bottom 13 can remove, and so as to have the first substrate 11 of circuit module 2 to be transferred to printing body surface, obtain setting pattern
Flexible circuit, it is easy to operate for acquiring the electric signal of printing body, and the flexible circuit can be bonded various rules or irregular
Surface has good contact conformability.
In present embodiment, the second substrate 12 has water solubility, then water or the solution including water can be used in its medium, accordingly
, third substrate 13 is set as with water penetration, it can be permeated by whom, thus, water is penetrated into third substrate 13 for the second substrate
12 dissolutions, can remove third substrate 13.When it is implemented, the second substrate can also have fat soluble materials composition, to pass through
Lipid medium can dissolve the second substrate, to separate third substrate.
The thin-film material with flexible and ductility also may be selected in first substrate 11, so as to holding for flexible adaptation variation
Body surface face is printed, advanced optimizes contact conformability, thus obtained flexible circuit can effectively reduce contact impedance and motion artifact.
Circuit module 2 includes circuit structure layer 21 and electronic component, and circuit structure layer 21 is arranged in setting pattern first
On substrate 11, electronic component is set on circuit structure layer 21.
Circuit structure layer is covered on the first substrate 11 by conductive material and is formed, so that electrode signal acquisition is formed,
Wherein, circuit structure layer includes the first conductive layer and the second conductive layer, and the first conductive layer is covered on the first substrate 11；Second leads
Electric layer is covered on the first conductive layer, and the first conductive layer is for carrying the second conductive layer.It is glued specifically, the first conductive layer has
Property, so as to the bearing bed as the second conductive layer, certainly, the same conductive energy of the first conductive layer is conductive logical to be formed
Road.
In present embodiment, the first conductive layer can be covered on the first substrate 11 by way of coating, the second conductive layer
It can also be covered on by way of coating on the first conductive layer.Certainly, in specific implementation process, the first conductive layer can pass through it
His mode is arranged on the first substrate 11, such as the first conductive layer of required pattern is first prefabricated into using the first conductive material, then
First conductive layer is adhered on the first substrate 11 again by modes such as bondings, similarly, the second conductive layer can also use second
Conductive material is pre-formed by the pattern progress of the first conductive layer, and then correspondence is attached on the first conductive layer again.
In present embodiment, the first conductive layer is made of conductive silver glue, and the second conductive layer is made of eutectic gallium-indium alloy, is led
Electric elargol realizes the bonding of eutectic gallium-indium alloy, and forms conductive path, so as to the acquisition of electric signal.
For the setting convenient for foregoing circuit structure sheaf and electronic component, first initialization circuit pattern can be arranged in the first substrate
The setting of circuit structure layer is carried out on 11 according still further to the initialization circuit pattern, circuit structure layer is by conductive material according to setting electricity
The region overlay of road pattern is formed on the first substrate 11, to form electrode signal acquisition, wherein circuit structure layer includes
First conductive layer and the second conductive layer, the first conductive layer is according to the region overlay of initialization circuit pattern on the first substrate 11；The
Two conductive layers are according to the region overlay of initialization circuit pattern on the first conductive layer.
Initialization circuit pattern can be printed upon on the first substrate 11 by way of printing, consequently facilitating the first conduction material
The correct coating of material and the second conductive material, and laser selenium may be selected in designability with higher, specific printing type
Drum printer is in 11 printout surface of the first substrate initialization circuit pattern.
In the bearing substrate 1 of flexible electronic, the second substrate 12 can be made of PVA (polyvinyl alcohol film) material, third lining
Bottom 13 can be made of paper material, water energy through the papery third substrate 13 PVA (polyvinyl alcohol film) is constituted second
Substrate 12 carry out it is water-soluble so that third substrate 13 is removed.
Embodiment two:
Second embodiment of the present invention provides the preparation methods of flexible electronic:
By with the first substrate flexible, can by medium dissolve the second substrate and can be by the medium osmosis
Third substrate is in turn connected to form bearing substrate；
Circuit structure layer is prepared on the first substrate of bearing substrate；
Electronic component is arranged on the circuit structure layer.
Based on the preparation method of above-mentioned flexible electronic, when preparing bearing substrate, can be used with water-soluble second lining
Bottom and third substrate with water penetration prepare bearing substrate, so as to be used as medium osmosis third substrate using water to dissolve
Second substrate is easily peeled off third substrate.
When preparing circuit structure layer, the first conductive layer can be first set on the first substrate, then be arranged on the first conductive layer
Second conductive layer, the sticking electrically conductive material of tool can be used in the first conductive layer, for the second conductive layer to be carried and connected
Connect fixation.
When preparing circuit structure layer, can the first print setting pattern on the first substrate of bearing substrate, then by setting figure
Circuit structure layer is arranged in the region of case, convenient for the preparation of circuit structure layer, thus the circuit structure layer of pattern needed for accurately obtaining,
And designability with higher.Laser selenium drum printer may be selected and print the setting pattern in the first substrate surface.
The preparation method of circuit structure layer: on the first substrate according to the region overlay tool sticking first of setting pattern
Then conductive layer covers the second conductive layer on the first conductive layer, form circuit structure layer.Painting can be used in the mode of above-mentioned covering
The mode covered alternatively, the first conductive material to be prefabricated into the first conductive layer of the setting pattern, then first conductive layer is passed through
The modes such as bonding are adhered on the first substrate again, and similarly, the second conductive layer can also be pre-formed by the progress of above-mentioned setting pattern, so
It is attached on the first conductive layer again afterwards.
Present embodiment uses conductive silver glue on the first substrate, it is conductive to form first according to the region coating for setting pattern
Layer is coated on the first conductive layer using liquid eutectic gallium-indium alloy and forms the second conductive layer, enhances electric conductivity and extensibility, so
It is cleaned afterwards using low-concentration hcl, removes extra liquid metal.
First the first conductive layer can be solidified, the first conductive layer will closely be connect with the first substrate after sintering, then
Second conductive layer is set on one conductive layer, so that the first conductive layer be made to accelerate molding, improves stability, facilitates subsequent second and lead
The setting of electric layer material layer.The method that heating can be used is solidified, settable when using conductive silver glue as the first conductive layer
Solidification temperature is 60 DEG C or so, and curing time is 30min or so, and during actual implementation, solidification temperature and curing time can roots
Rationally it is arranged according to actual conditions.Above-mentioned curing schedule can certainly be saved, the first conductive layer spontaneous curing is made.
Flexible electronic is prepared using the above method, preparation process is simple, it is easy to accomplish.
Embodiment three:
The embodiment of the present invention three provides the preparation method of flexible circuit:
Second substrate can be dissolved to the bearing substrate of the flexible electronic using the flexible electronic of above-described embodiment one
Medium, by after the dissolution of the second substrate, makes third substrate desquamation, to isolate the first substrate, will have circuit through third substrate
First substrate 11 ' of structure sheaf and electronic component is transferred to the surface printing body A (with reference to Fig. 3), to obtain flexible circuit, can use
In the electric signal of acquisition printing body.
Second substrate can be used water-soluble material and be made, correspondingly, third substrate is made of porous material, therefore,
The method of water transfer can be used by the first substrate transfer to supporting body surface, specifically, water saturates third substrate can be used, be second
Substrate dissolution, or the bearing substrate for carrying electronic component can be impregnated setting time in water so that the second substrate dissolves
Afterwards, make third substrate desquamation.
Above-mentioned water transfer process, the deionized water or tap water that can be used 20 DEG C or so dissolve the second substrate, make
First substrate and the separation of third substrate, separation process is about 5min.In specific implementation process, the temperature and disengaging time of water can roots
Rationally it is arranged according to actual conditions.
After the completion of above-mentioned transfer process, the first substrate with electronic component for being transferred to printing body surface can be consolidated
Change, enhance stability, facilitates the first substrate reliable attachment in the surface of printing body, thus the first substrate of optimization and printing body
Conformability is contacted, helps to reduce contact impedance and motion artifact.The mode of heating cure can be used, solidification temperature can be 80 DEG C
Left and right, curing time can be 60min or so, and during actual implementation, solidification temperature and curing time can close according to the actual situation
Reason setting.Above-mentioned curing schedule can certainly be saved, spontaneous curing is carried out.
The preparation method of the flexible circuit, preparation process is simple, reliably, easy to implement.
Example IV:
The flexible circuit prepared by the preparation method of above-mentioned flexible circuit, can be applied to medical domain, artificial limb manufacture,
The fields such as Robot Design, wearable device, for example, the first substrate transfer with the first electronic component is corresponding to robot
Surface, can allow robot perception relevant information.
In recent years, with the continuous development of the flexible electronics technologies such as human-computer interaction, skin electronics, prosthesis control.Muscle electricity
Signal is gradually transferred to transport from directions such as the analysis of the kinetic system in medicine direction, muscular fatigue analysis, muscle damage rehabilitations
The dynamic directions such as mode estimation and Mechanical course.
The preparation method of above-mentioned flexible circuit can also be applied to the preparation of flexible electronic skin: pass through above-mentioned flexible circuit
The first above-mentioned substrate transfer to human skin surface is formed flexible electronic skin by preparation method, can be used for acquiring physiology letter
Number.It is equally useful for the electronic skin of processing machinery equipment, can there will be circuit by the preparation method of above-mentioned flexible circuit
First substrate transfer of structure sheaf and electronic component is to equipment surface, such as is transferred to the corresponding surface of robot, can allow machine
The perceptually relevant information of device people.
It above are only presently preferred embodiments of the present invention, but the present invention is not restricted to above-described embodiment, be familiar with this field
Technical staff can also make a variety of equivalent deformation or replacement on the premise of without prejudice to spirit of the invention, these equivalent deformations
Or replacement is all included in the scope defined by the claims of the present application.
Claims (10)
1. flexible electronic, it is characterised in that: including bearing substrate and circuit module, in which: the bearing substrate includes successively connecting
The first substrate, the second substrate and the third substrate connect, first substrate have flexibility, and second substrate is placed in described first
Between substrate and the third substrate, second substrate can be dissolved by medium, and the third substrate can be given an account of
Matter infiltration；The circuit module is arranged on first substrate.
2. flexible electronic according to claim 1, it is characterised in that: the circuit module includes circuit structure layer and electronics
Element, the circuit structure layer are arranged on first substrate, and the electronic component is set on the circuit structure layer.
3. flexible electronic according to claim 2, it is characterised in that: the circuit structure layer includes the first conductive layer and the
Two conductive layers, first conductive layer are covered on first substrate, and first conductive layer has viscosity；Described second leads
Electric layer is covered on first conductive layer.
4. flexible electronic according to claim 3, it is characterised in that: first conductive layer is covered by way of coating
On first substrate and/or second conductive layer is covered on first conductive layer by way of coating.
5. flexible electronic according to any one of claim 2 to 4, it is characterised in that: print and set on first substrate
Determine circuit pattern, the circuit structure layer is arranged on first substrate by the initialization circuit pattern.
6. the preparation method of flexible electronic, it is characterised in that:
By with the first substrate flexible, can by medium dissolve the second substrate and can be by the third of the medium osmosis
Substrate is in turn connected to form bearing substrate；
Circuit structure layer is prepared on the first substrate of bearing substrate；
Electronic component is arranged on the circuit structure layer.
7. the preparation method of flexible circuit, it is characterised in that: right using flexible electronic described in any one of claims 1 to 5
The bearing substrate of the flexible electronic makes third substrate for after the dissolution of the second substrate through the third substrate with the medium
The first substrate transfer with circuit structure layer and electronic component to printing body surface is obtained flexible circuit by removing.
8. the preparation method of flexible circuit according to claim 7, it is characterised in that: second substrate is using water-soluble
Material is made, and the third substrate is made of dank material, using water as the medium, will carry electronic component
The bearing substrate impregnates setting time in water so that after second substrate dissolution, makes third substrate desquamation.
9. the preparation method of flexible circuit according to claim 7 or 8, it is characterised in that: after the completion of transfer, to being transferred to
First substrate with electronic component on printing body surface is solidified.
10. flexible circuit, it is characterised in that: the preparation method system of the flexible circuit as described in any one of claim 7 to 9
At.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910547536.8A CN110213884A (en) | 2019-06-24 | 2019-06-24 | Flexible electronic and preparation method thereof, flexible circuit and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910547536.8A CN110213884A (en) | 2019-06-24 | 2019-06-24 | Flexible electronic and preparation method thereof, flexible circuit and preparation method thereof |
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| CN110213884A true CN110213884A (en) | 2019-09-06 |
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| CN201910547536.8A Pending CN110213884A (en) | 2019-06-24 | 2019-06-24 | Flexible electronic and preparation method thereof, flexible circuit and preparation method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020182970A1 (en) * | 2001-06-01 | 2002-12-05 | Wen-Tsang Liu | Method of fabricating emitter of field emission display |
| WO2010086901A1 (en) * | 2009-01-30 | 2010-08-05 | L'oreal | Layered structure for cosmetic use |
| KR20130126062A (en) * | 2012-05-10 | 2013-11-20 | 한국과학기술원 | Method for manufacturing flexible electronic device using water-soluble adhesive and flexible electronic device manufactured by the same |
| JP2015016612A (en) * | 2013-07-10 | 2015-01-29 | 日立化成株式会社 | Nano thin film transfer sheet and method of producing nano thin film transfer sheet |
| US20160031192A1 (en) * | 2013-02-08 | 2016-02-04 | Hitachi Chemical Company, Ltd. | Nano thin-film transfer sheet, method for manufacturing nano thin-film transfer sheet, and mthod for transferring nano thin-fiilm layer into adherend |
| CN105690974A (en) * | 2016-01-21 | 2016-06-22 | 京东方科技集团股份有限公司 | Flexible thin film attaching method, flexible thin film stripping method, flexible substrate preparation method and base substrate |
| CN210381467U (en) * | 2019-06-24 | 2020-04-21 | 清华大学深圳研究生院 | Flexible electronics |
-
2019
- 2019-06-24 CN CN201910547536.8A patent/CN110213884A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020182970A1 (en) * | 2001-06-01 | 2002-12-05 | Wen-Tsang Liu | Method of fabricating emitter of field emission display |
| WO2010086901A1 (en) * | 2009-01-30 | 2010-08-05 | L'oreal | Layered structure for cosmetic use |
| KR20130126062A (en) * | 2012-05-10 | 2013-11-20 | 한국과학기술원 | Method for manufacturing flexible electronic device using water-soluble adhesive and flexible electronic device manufactured by the same |
| US20160031192A1 (en) * | 2013-02-08 | 2016-02-04 | Hitachi Chemical Company, Ltd. | Nano thin-film transfer sheet, method for manufacturing nano thin-film transfer sheet, and mthod for transferring nano thin-fiilm layer into adherend |
| JP2015016612A (en) * | 2013-07-10 | 2015-01-29 | 日立化成株式会社 | Nano thin film transfer sheet and method of producing nano thin film transfer sheet |
| CN105690974A (en) * | 2016-01-21 | 2016-06-22 | 京东方科技集团股份有限公司 | Flexible thin film attaching method, flexible thin film stripping method, flexible substrate preparation method and base substrate |
| CN210381467U (en) * | 2019-06-24 | 2020-04-21 | 清华大学深圳研究生院 | Flexible electronics |
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