CN110198622B - Dustproof plug-in box with high-efficient heat dispersion - Google Patents
Dustproof plug-in box with high-efficient heat dispersion Download PDFInfo
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- CN110198622B CN110198622B CN201910589581.XA CN201910589581A CN110198622B CN 110198622 B CN110198622 B CN 110198622B CN 201910589581 A CN201910589581 A CN 201910589581A CN 110198622 B CN110198622 B CN 110198622B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
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- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a dustproof plug-in box with high-efficiency heat dissipation performance, which belongs to the technical field of electricity and comprises an air duct component, wherein a heat dissipation module is inserted into the air duct component and forms an independent air duct structure after being matched with the air duct component; the air duct component is arranged inside the dustproof plug box, the dustproof plug box comprises an upper case cover plate and a lower case cover plate, and the upper case cover plate and the lower case cover plate are connected through two opposite case side plates. The invention redesigns the internal structure of the standard plug-in box and designs the air duct component and the heat dissipation module which are matched with the standard plug-in box, transfers the heat of the heat source chip to the heat dissipation module and dissipates the heat outside the plug-in box through the air duct component, thereby avoiding dust entering and foreign matter invasion caused by opening the air holes, and enhancing the heat dissipation performance and the environment adaptability of the plug-in box; the number of the air duct components and the installation positions can be flexibly configured, so that the plug-in units can be reasonably arranged, the anti-interference capability of a circuit is improved, and the internal wiring of the equipment is optimized.
Description
Technical Field
The invention belongs to the technical field of electricity, and particularly relates to a dustproof plug box with high-efficiency heat dissipation performance.
Background
With the development and the upgrade of intelligent substations and on-site devices, the use requirements of installation of the plug-in box in an outdoor cabinet, on-site installation and the like appear, and higher requirements are provided for the IP protection level and the heat dissipation performance of the device.
The heat dissipation mode of the existing common plug box easily causes various problems of reduction of the protection grade of the plug box, invasion of dust into a case, failure of electronic components and the like, and in addition, the heat dissipation mode has low efficiency and poor effect and cannot adapt to the installation and use requirements which increasingly improve the performance of the device.
When a high-power plug-in unit is configured in an existing 19-inch standard plug-in box, the mode that holes are formed in an upper cover plate and a lower cover plate is usually adopted to accelerate the air flow exchange between the inside and the outside of the plug-in box, and the heat dissipation performance of the plug-in box is enhanced. In addition to the holes on the upper and lower cover plates, there is also a method of installing a heat sink on the side plate or the top cover of the inserting box and fixing the heat sink and the heat generating chip in the inserting box, but the following defects still exist:
the plug box with the heat dissipation function in the form of the holes on the upper cover plate and the lower cover plate has the following problems during operation: because the upper and lower plug box cover plates are directly perforated, the protection grade of the plug box is greatly reduced, and internal electronic components are directly exposed in the air, so that dust is easily accumulated, and the service life of the electronic components is influenced by the invasion of foreign objects, and potential safety hazards are caused; the high-power chip is used as an internal main heat source, the heat exchange area is limited, and the airflow passing through the vent holes can not effectively act on the heat source, so the heat dissipation effect is poor; under the forced air cooling condition, airflow is easy to generate turbulence when passing through the cover plate and internal irregular components, and the heat exchange efficiency is greatly reduced.
(II) at subrack curb plate or top cap installation radiator, with the radiator with generate heat the chip at the inside fixed mode of subrack, the subrack of this form can be better with chip heat transfer to the subrack outside under the natural air cooling condition, but under the forced convection condition, the mounted position and the installation angle of fan receive the restriction, can't form effectual airflow channel, the radiating effect is relatively poor, and because the inside plate of subrack is fixed with the subrack lateral wall, cause the subrack configuration dumb, dismantle the maintenance difficulty.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a dustproof plug box with high-efficiency heat dissipation performance, which can solve the problems of poor protection performance, low heat dissipation efficiency and inflexible configuration of a side-layout radiator plug box of the conventional punched plug box.
The technical scheme is as follows: in order to achieve the purpose, the invention provides the following technical scheme:
a dustproof plug box with high-efficiency heat dissipation performance comprises an air duct component, wherein a heat dissipation module is inserted into the air duct component, and an independent air duct structure is formed after the heat dissipation module is matched with the air duct component.
Furthermore, the air duct component is arranged inside the dustproof plug-in box, the dustproof plug-in box comprises an upper case cover plate and a lower case cover plate, and the upper case cover plate and the lower case cover plate are connected through two opposite case side plates.
Furthermore, the two case side plates are connected through a case first cross beam and a case second cross beam respectively; the air duct component is provided with screw holes, and counter bores matched with the screw holes for fixing are arranged on the first cross beam of the case and the second cross beam of the case, so that modular assembly is realized; and a back plate is arranged on the vertical surface of the second cross beam.
Furthermore, the air duct component is of a structure with two open ends and a hollow middle part, and a heat dissipation module is inserted into the hollow middle part; the upper cover plate and the lower cover plate of the case are both provided with openings, and the openings are respectively connected with the openings at the two ends of the air duct component to form an independent air duct structure which is communicated up and down.
Furthermore, guide rails are arranged at the openings at the two ends, and a guide groove matched with the guide rails is arranged on the heat dissipation module; the heat dissipation module is fixed between the upper cover plate of the case and the lower cover plate of the case through the plug-in panel.
Furthermore, an epoxy board is arranged on the back of the heat dissipation module, a PCB is covered on the epoxy board, a heat source chip is arranged on the PCB, a heat conduction pad covers the surface of the heat source chip, and after the heat source chip is matched with the heat dissipation module, a heat source is transmitted to the heat dissipation module from the heat source chip through the heat conduction pad and the heat is transmitted out through the independent air duct structure.
Further, the heat dissipation module comprises a group of fins arranged in parallel, and baffles for preventing dust are arranged on the side faces of the fins, and the height of each baffle is higher than that of each fin.
Furthermore, foam is arranged at the joint of the air duct component and the air duct component.
Furthermore, a nut column for fixing the PCB is arranged on the back of the heat dissipation module.
Furthermore, the PCB board and the back board are connected through a connector male head and a connector female head which are matched and fixed.
The structure not only keeps the characteristic of flexible configuration of the traditional plug-in box structure, but also provides an air channel structure specially used for natural heat dissipation and forced convection, can effectively transmit a board card heat source to the outside of the plug-in box through the heat dissipation module, effectively divides the inner space and the outer space of an independent air channel through the sealing design of the matching surface of parts, prevents dust and foreign matters from invading the inside of the plug-in box, and ensures the protective performance of the plug-in box.
Has the advantages that: compared with the prior art, the dustproof plug-in box with high-efficiency heat dissipation performance is provided, the internal structure of the standard plug-in box is redesigned, the air duct component and the heat dissipation module which are matched with the standard plug-in box are designed, the heat of the heat source chip is transferred to the heat dissipation module and dissipated outside the plug-in box through the air duct component, dust entering and foreign matter invasion caused by opening air holes are avoided, and the heat dissipation performance and the environment adaptability of the plug-in box are enhanced; the number of the air duct components and the installation positions can be flexibly configured, so that the plug-in units can be reasonably arranged, the anti-interference capability of a circuit is improved, and the internal wiring of the equipment is simplified.
Drawings
FIG. 1 is a schematic diagram of a plug-in box with an upper cover plate hidden;
FIG. 2 is a schematic view of an air duct component;
FIG. 3 is a schematic structural diagram of a heat dissipation module;
FIG. 4 is a schematic diagram of a PCB structure;
FIG. 5 is a schematic view of a modular insert;
FIG. 6 is a schematic view showing the effect of the duct unit after being installed in the box;
reference numerals: the heat dissipation module comprises a case side plate 1, a case upper cover plate 2, a case lower cover plate 3, a case first cross beam 4, a case second cross beam 5, a nut strip 6, an air duct 7, an air duct part 8, a plug-in panel 9, a PCB 9, a heat conduction pad 10, a connector male head 11, a connector female head 12, a heat dissipation module 13, a back plate 14, a nut column 15, foam 16, an epoxy plate 17, a baffle 18, a heat source chip 19, a guide groove 20 and a guide rail 21.
Detailed Description
For a better understanding of the contents of the present patent application, the technical solutions of the present invention will be further described below with reference to the accompanying drawings and specific examples.
The main components of the dustproof plug box with high-efficiency heat dissipation performance comprise: an air duct component 7, an upper case cover plate 2 with an air duct opening, a lower case cover plate 3 with an air duct opening, and other components for constructing a complete 19-inch case. The mounting position of the air duct part 7 and the positions of the holes of the upper cover plate and the lower cover plate correspond to the mounting position of the heat dissipation module 13, and the air duct part 7 is distributed according to the plug-in configuration of the chassis, so that the heat dissipation requirement of the plug-in configuration is met.
And one side of each of the first cross beam 4 and the second cross beam 5 of the case is provided with an array counter bore for installing an air duct component 7. The air duct component 7 is made of aluminum alloy stretching section, the opening space in the middle part is used for inserting the heat dissipation module 13, and the two ends of the opening are in a guide rail 21 structure and are matched with the guide groove 20 structure on the heat dissipation module 13. The two ends of the upper end face and the lower end face of the air duct component 7 are provided with step faces, the step faces are provided with screw holes, the step faces can be inserted into the plug-in box along the guide grooves 20 according to specific requirements, and the step faces are flexibly arranged at the counter bores of the first cross beam 4 of the case and the second cross beam 5 of the case and matched with the mounting holes of the first cross beam 4 of the case and the second cross beam 5 of the case, so that modular assembly is realized. After the installation is finished, the air duct component 7 is locked between the first cross beam 4 and the second cross beam 5 of the case, and the effects of enhancing the structural strength of the plug-in box and transferring heat are achieved.
The outer surface structure of the case consists of an upper case cover plate 2, a lower case cover plate 3, a side case plate 1 and a back plate 14. The upper cover plate 2 of the case is provided with a square hole at the position of the independent air duct layout, and the size of the square hole is superposed with the size of the opening of the inner wall of the air duct part 7 in the vertical direction; the periphery of the upper cover plate 2 of the case can be embedded into the grooves of the side plates 1 of the case, the first cross beams 4 of the case and the second cross beams 5 of the case at corresponding positions, so that the functions of dust prevention, protection and the like are achieved.
The lower cover plate 3 of the case is provided with a square hole at the position of the independent air duct layout, the square hole is superposed with the opening size of the inner wall of the air duct component 7 in the vertical direction, and the lower cover plate 3 of the case can be embedded into the grooves of the side plate 1 of the case, the first cross beam 4 of the case and the second cross beam 5 of the case at the corresponding positions, thereby playing roles of dust prevention, protection and the like.
The back plate 14 is fixed on the second cross beam 5 of the chassis, and one side of the back plate 14 is welded with the female connector 12 and is matched with the male connector 11 of the corresponding connector to play a role in connecting a circuit.
A standard chassis typically has a backplane 14 (bus) mounted to the front of the chassis, with electrical interconnections between the backplane 14 (bus) and the interposer (e.g., PCB board 9, etc.) being made through connectors. Typically, the package consists essentially of a package panel, circuit board components (including components and connectors), and fasteners. A modular insert with a heat sink module 13, the modular insert comprising: the heat dissipation module 13, the plug-in panel 8, the epoxy board 17, the PCB board 9, the heat conducting pad 10, the foam 16 and other parts.
The heat dissipation module 13 is made of aluminum alloy tensile section, and the upper end and the lower end of the heat dissipation module are provided with symmetrical guide grooves 20 which are machined. When assembling the device, the end face of the heat dissipation module 13 is tightly attached to the inner side of the plug-in panel 8, and 3 screw holes on the end face of the heat dissipation module 13 and 3 counter bores on the plug-in panel 8 are connected through bolts. One side of the heat dissipation module 13 is provided with a baffle 18, and the height of the baffle 18 is higher than that of the fin, so that a certain dustproof effect is achieved.
The middle of the surface of the epoxy board 17 is dug with a hole at the position corresponding to the heat source chip 19 on the PCB 9, and one side of the epoxy board 17 is provided with a back adhesive and is tightly adhered and fixed with the heat dissipation module 13, so that the heat dissipation module is insulated.
One end of the PCB 9 is welded with a male connector 11, and the male connector 11 is matched with a female connector 12 on a back plate 14. A heat source chip 19 is welded on the panel of the PCB 9, and the surface of the heat source chip 19 is covered with a heat conducting pad 10. The PCB 9 is connected and fixed with the heat dissipation module 13 through the nut column 15 at the back side of the heat dissipation module, the heat conduction pad 10 penetrates through the middle square hole part of the epoxy plate 17 and is pressed with the back side of the heat dissipation module 13, so that a heat source is transmitted to the heat dissipation module 13 from the heat source chip 19 of the PCB 9 through the heat conduction pad 10, and the heat is transmitted out through the independent air channel.
The foam 16 is adhered to the surface of the matching part of the heat dissipation module 13 and the air duct component 7 through the back adhesive on one side of the foam, plays a role in isolating the inner space and the outer space of the plug-in box, and has certain dustproof and protective effects.
When the device is operated, the heat source chip 19 on the PCB 9 works to generate heat, the generated heat is transmitted to the heat dissipation module 13 through the heat conduction pad 10, the heat dissipation module 13 conducts the heat from inside to outside, and finally the heat is dissipated to the air in the air duct through the external fins of the heat dissipation module 13. The air flow in the air duct is accelerated by the driving of the external circulating system, and the heat transfer capacity of the case is enhanced, so that the working temperature of the internal heat source chip 19 is reduced. In the process, the inner space and the outer space of the device are relatively isolated, the heat dissipation capacity of the plug box is increased, meanwhile, higher dustproof grade and protection grade can be kept, and the problems that the existing punched plug box is poor in protection performance, low in heat dissipation efficiency, inflexible in heat dissipation part configuration and the like can be effectively solved.
Example takes a 19-inch standard plug box structure as an example
As shown in fig. 1-6, a dustproof plug box with high heat dissipation performance, which aims to solve the problems of low protection and poor heat dissipation of the existing plug box with holes opened up and down, adopts a scheme that a heat dissipation module 13 is matched with an independent air duct component 7 installed in a box body to isolate main heat of a heat source outside the plug box for heat dissipation, and the installation and implementation processes are as follows.
The inner side of the plug-in panel 8 is tightly attached to the end face of the radiator module, and 3 screws are screwed to fix the plug-in panel and the radiator module after aligning with the hole positions. The side, with the back glue, of the epoxy plate 17 is tightly attached to the inner side of the heat dissipation module 13, the heat conducting pad 10 covers the upper portion of the heat source chip 19, the position of the heat conducting pad 10 is aligned to the square hole of the epoxy plate 17, after the hole position of the PCB 9 is aligned to the nut column 15, a screw is screwed in, the heat conducting pad 10 tightly presses the inner surface of the heat dissipation module 13, and the PCB 9 is fixed with the heat dissipation module 13.
The air channel member 7 is installed. The method comprises the specific steps of detaching a side case side plate 1 on one side, extending an upper case cover plate 2 and a lower case cover plate 3 and detaching the side plates, pushing an independent air channel component 7 into one end of a plug-in box along a gap between a first case cross beam 4 and a second case cross beam 5, aligning screw holes at two ends of the air channel component 7 with counter bores of the first case cross beam 4 and the second case cross beam 5 after reaching a designated position, and screwing screws to fix the air channel component 7 and the plug-in box. If multiple air channel members 7 are required, they are installed in place at this step.
And pushing the upper case cover plate 2 and the lower case cover plate 3 into the grooves of the first case cross beam 4 and the second case cross beam 5, and aligning the positions of the openings of the upper case cover plate 2 and the lower case cover plate 3 with the air duct. Then, the cabinet side plate 1 is installed, and the back plate 14 is installed. The previously installed heat dissipation module 13 is pushed into the corresponding position of the back of the plug-in box along the guide rail 21, the foam 16 at the position of the guide groove 20 is tightly attached to the outer surface of the air duct component 7 and compressed, after the heat dissipation module is pushed into the bottom, the male connector 11 is in butt joint with the female connector 12, after the hand-screwed screw on the plug-in panel 8 is screwed into the nut strip 6, the foam 16 in the baffle 18 is tightly pressed with the contact surface of the air duct component 7, and the space isolation of the inner part and the outer part of the plug-in box is.
And (3) completing the assembly of other plug-in units of the plug-in box, filling the gap at the back of the plug-in box, operating the device, starting the heat source chip 19 to generate heat, and transferring the heat from the surface of the heat source chip 19 to the heat dissipation module 13 through the heat conduction pad 10. The heat dissipation module 13 has raised fin temperature to form airflow inside the air duct, so that heat is continuously transferred to the outer side of the plug box.
In the whole operation process of the device, most heat directly exchanges heat with the outside air through the heat dissipation module 13, and the air inside and outside the device is relatively isolated because the matching gap is filled by the compression of the foam 16 at the joint, so that the protection performance of the plug box is not influenced.
By designing the 19-inch standard plug box which is combined with the radiating modules 13 to form an independent air duct, the radiating performance and the protection capability of the plug box are enhanced while the characteristic of flexible configuration of the plug box is kept, and good wind field conditions are created for adding an air cooling device to the plug box in the vertical direction. The invention effectively solves the problems of low protective performance, poor heat dissipation effect and inflexible configuration when the high-power plug-in is configured in the conventional plug-in box, and can be widely applied to various occasions with high power and high dustproof requirements of the plug-in chip.
The above is only a preferred embodiment of the present invention, and it should be noted that: it will be apparent to those skilled in the art that the location of each facility can be adjusted without departing from the principles of the invention, and such adjustments should be considered within the scope of the invention.
Claims (8)
1. The utility model provides a dustproof subrack with high-efficient heat dispersion, its characterized in that: the air duct structure comprises an air duct component (7), wherein a heat dissipation module (13) is inserted into the air duct component (7) and forms an independent air duct structure after being matched with the air duct component; arranging an epoxy plate (17) on the back of the heat dissipation module (13), covering the epoxy plate (17) with a PCB (9), arranging a heat source chip (19) on the PCB (9), covering the surface of the heat source chip (19) with a heat conduction pad (10), after matching, transmitting a heat source from the heat source chip (19) to the heat dissipation module (13) through the heat conduction pad (10), and transmitting the heat out through the independent air duct structure; the air duct component (7) is of a structure with two open ends and a hollow middle part, and a heat dissipation module (13) is inserted into the hollow middle part; the upper cover plate (2) and the lower cover plate (3) of the case are both provided with openings which are respectively connected with openings at two ends of the air duct component (7) to form an independent air duct structure which is communicated up and down.
2. The dustproof jack box with high heat dissipation performance according to claim 1, wherein: the dustproof plug-in box comprises a box upper cover plate (2) and a box lower cover plate (3), wherein the box upper cover plate (2) is connected with the box lower cover plate (3) through two opposite box side plates (1).
3. The dustproof jack box with high heat dissipation performance according to claim 2, wherein: the two case side plates (1) are connected through a case first cross beam (4) and a case second cross beam (5) respectively; screw holes are formed in the air duct component (7), and counter bores matched with the screw holes for fixing are formed in the first cross beam (4) of the case and the second cross beam (5) of the case, so that modular assembly is realized; and a back plate (14) is arranged on the vertical surface of the second cross beam (5).
4. The dustproof jack box with high heat dissipation performance according to claim 1, wherein: guide rails (21) are arranged at the openings at the two ends, and a guide groove (20) matched with the guide rails (21) is arranged on the heat dissipation module (13); the heat dissipation module (13) is fixed between the upper cover plate (2) and the lower cover plate (3) of the case through the plug-in panel (8).
5. The dustproof jack box with high heat dissipation performance according to any one of claims 1 to 4, wherein: the heat dissipation module (13) comprises a group of fins arranged in parallel, wherein baffles (18) used for dust prevention are arranged on the side faces of the fins, and the height of the baffles (18) is higher than that of the fins.
6. The dustproof jack box with high heat dissipation performance according to any one of claims 1 to 4, wherein: and foam (16) is arranged at the joint of the heat dissipation module (13) and the air duct component (7) to construct an air duct structure with separated inside and outside.
7. The dustproof jack box with high heat dissipation performance according to any one of claims 1 to 4, wherein: and a nut column (15) for fixing the PCB (9) is arranged on the back surface of the heat dissipation module (13).
8. The dustproof jack box with high heat dissipation performance according to claim 3, wherein: the PCB (9) and the back plate (14) are connected through a male connector head (11) and a female connector head (12) which are matched and fixed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910589581.XA CN110198622B (en) | 2019-07-02 | 2019-07-02 | Dustproof plug-in box with high-efficient heat dispersion |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910589581.XA CN110198622B (en) | 2019-07-02 | 2019-07-02 | Dustproof plug-in box with high-efficient heat dispersion |
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| CN110198622A CN110198622A (en) | 2019-09-03 |
| CN110198622B true CN110198622B (en) | 2020-12-01 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110661185B (en) * | 2019-10-23 | 2021-01-22 | 湖南恒力通电气设备科技有限公司 | Power distribution cabinet convenient to mount and dismount |
| CN110996600B (en) * | 2019-12-02 | 2021-04-09 | 积成电子股份有限公司 | Electronic equipment plug-in box and assembling method thereof |
| CN111698848A (en) * | 2020-05-22 | 2020-09-22 | 国网河北省电力有限公司石家庄市藁城区供电分公司 | Power pipe gallery communication device and power pipe gallery data management system |
| CN112087923B (en) * | 2020-08-28 | 2022-11-04 | 国电南瑞科技股份有限公司 | Heat transfer unit suitable for totally closed subrack |
| CN115047942A (en) * | 2022-05-31 | 2022-09-13 | 中科长城海洋信息***有限公司长沙分公司 | Air-cooled sealed type reinforced computer |
| CN116301246B (en) * | 2023-05-24 | 2023-08-08 | 四川华鲲振宇智能科技有限责任公司 | Waterproof air-cooled blade formula machine case |
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| CN202455251U (en) * | 2012-03-08 | 2012-09-26 | 成都希望电子研究所有限公司 | Cooling and dustproof structure of small frequency converter |
| CN204119683U (en) * | 2014-09-02 | 2015-01-21 | 北京四方继保自动化股份有限公司 | A kind of IP protects subrack |
| CN205902244U (en) * | 2016-06-15 | 2017-01-18 | 北京东土军悦科技有限公司 | High available module electronic equipment |
| CN109769367A (en) * | 2017-11-09 | 2019-05-17 | 株洲中车时代电气股份有限公司 | A kind of vehicle-mounted cabinet |
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| CN203040081U (en) * | 2012-12-25 | 2013-07-03 | 中兴通讯股份有限公司 | Guide rail structure and plug box with guide rail structure |
| CN207560596U (en) * | 2017-04-26 | 2018-06-29 | 南京航天银山电气有限公司 | A kind of industrial emissions, dust-proof, moisture-proof subrack |
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