CN110193442A - 一种网孔式超声波雾化片及制造工艺 - Google Patents

一种网孔式超声波雾化片及制造工艺 Download PDF

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Publication number
CN110193442A
CN110193442A CN201910333186.5A CN201910333186A CN110193442A CN 110193442 A CN110193442 A CN 110193442A CN 201910333186 A CN201910333186 A CN 201910333186A CN 110193442 A CN110193442 A CN 110193442A
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Prior art keywords
ring
film
pcb board
copper foil
mesh
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CN201910333186.5A
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郑瑶
苏秋红
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Shenzhen Shang Jin Electronic Science And Technology Co Ltd
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Shenzhen Shang Jin Electronic Science And Technology Co Ltd
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Priority to CN201910333186.5A priority Critical patent/CN110193442A/zh
Publication of CN110193442A publication Critical patent/CN110193442A/zh
Priority to PCT/CN2020/085890 priority patent/WO2020216212A1/zh
Priority to JP2021560341A priority patent/JP2022530329A/ja
Priority to EP20795057.7A priority patent/EP3957405A4/en
Priority to US17/485,422 priority patent/US20220008949A1/en
Pending legal-status Critical Current

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    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
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Abstract

本发明属于超声波雾化技术领域，具体涉及一种网孔式超声波雾化片及制造工艺。本发明公开了一种网孔式超声波雾化片包括上FPC材料PCB板和下FPC材料PCB板，所述上FPC材料PCB板包括第一PI薄膜、第一铜箔和上PI薄膜，所述下FPC材料PCB板包括第二PI薄膜、第二铜箔和下PI薄膜所述第一铜箔和第二铜箔之间连接有环形压电陶瓷，所述环形压电陶瓷的上下表面均设有无铅锡膏，所述环形压电陶瓷通过无铅锡膏与第一铜箔和第二铜箔焊接，所述第二PI薄膜的中心位置设有弧形过度面，所述弧形过度面设有微米级小孔，所述微米级小孔的为圆锥形台结构。

Description

一种网孔式超声波雾化片及制造工艺
技术领域
本发明属于超声波雾化技术领域，具体涉及一种网孔式超声波雾化片及制造工艺。
背景技术
目前市场上网孔式雾化驱动技术已经趋于成熟，更多行业开始导入超声波雾化技术，通过超声波雾化技术的导入解决了原先应用中的一些缺点，例如能耗得到大幅度降低，出雾颗粒缩小，出雾颗粒的一致性好等等；
如图1所示，传统网孔式超声波雾化片的主要结构由环形压电陶瓷、圆心部位有大量微米级小孔的不锈钢金属薄片、焊接在环形压电陶瓷一个电极上的导线和焊接在不锈钢金属薄片上的另外一条导线组成；但是传统网孔式超声波雾化片存在以下缺点：
1、由于形变能量是传递到不锈钢金属薄片上，且不锈钢金属材料的硬度较高，因此对压电陶瓷产生形变的力度要求较高，需要压电陶瓷产生更大的能量来拉动不锈钢金属薄片产生形变；
2、由于传递形变能量的载体是化学粘合剂，且粘合剂的导电性能无法和金属材料相比因此存在一定的电阻，导致了电流的传递损耗；
3、由于微米级的网孔是需要加工在不锈钢金属薄片上，因此对打孔设备的功率要求较高，打孔设备需足够的能量才能在金属的表面构成圆锥形状的孔，且由于金属的导热速度较快，因此在打孔的过程中因为热量传递的不均匀会产生很多飞溅的金属残渣，且部分金属残渣会呈现半熔融状态附着在孔的内壁，因此其网孔的锥形内壁和边缘十分粗糙，影响了液体通过的效率，同时当雾化片在工作的过程中金属反复的形变容易在粗糙的表面形成应力集中点，导致金属出现断裂；由于打孔过程中产生的金属残渣较多因此打孔后必须对金属薄片进行长时间的清洗，形成大量含有重金属颗粒的废水；
4、导线焊接的过程产生的高温容易导致环形压电陶瓷的部分区域出现失效，常规压电陶瓷的失效温度仅为250℃，但是导线焊接过程的局部温度能够达到380℃，从而导致压电陶瓷部分区域因为高温出现失效，进而导致了产品整体的一致性差；
5、由于不锈钢薄片并不属于理想的焊接材料，其表面和焊锡之间可焊性是否差，因此在不锈钢薄片上焊接导线需要事先使用酸性化学药剂将突出部分的不锈钢薄片位置进行腐蚀，从而使局部表面变得粗糙，提高可焊性，但是其实焊接过程中由于材料本身可焊性差还是会导致焊接强度不高，容易形成不良接触，影响导电的同时也容易脱落；且酸性化学药剂在使用过程中危险性较大，并且形成的污染物不易处理，工艺不符合环保要求；
6、产品在实际生产的过程中存在工艺流程过长，生产复杂度比较高，且部分工艺难以实现自动化制造。
针对上面的问题，因此行业需要一种制造流程简化，符合环保工艺并且适用于自动化制造的网孔式超声波雾化片。
发明内容
针对上述背景技术所提出的问题，本发明的目的是：旨在提供一种网孔式超声波雾化片及制造工艺。
为实现上述技术目的，本发明采用的技术方案如下：
一种网孔式超声波雾化片包括上FPC材料PCB板和下FPC材料PCB板，所述上FPC材料PCB板包括第一PI薄膜、第一铜箔和上PI薄膜，所述下FPC材料PCB板包括第二PI薄膜、第二铜箔和下PI薄膜所述第一铜箔和第二铜箔之间连接有环形压电陶瓷，所述环形压电陶瓷的上下表面均设有无铅锡膏，所述环形压电陶瓷通过无铅锡膏与第一铜箔和第二铜箔焊接，所述第二PI薄膜的中心位置设有弧形过度面，所述弧形过度面设有微米级小孔，所述微米级小孔的为圆锥形台结构。
作为本发明发的一种优选方案，所述上PI薄膜层和下PI薄膜层压合贴紧。
作为本发明发的一种优选方案，所述第二铜箔的内径尺寸小于环形压电陶瓷的内径尺寸，所述第二铜箔连接有环形PI薄膜，所述环形PI薄膜环形外径尺寸小于压环形压电陶瓷内径尺寸、大于弧形过度面的直径。
作为本发明发的一种优选方案，所述微米级小孔上部的直径尺寸为2μm～8μm、下部的直径尺寸为50μm～60μm。
一种网孔式超声波雾化片的制造工艺，包括以下步骤：
S1：将下FPC材料PCB板的第二PI薄膜中的弧形过度面通过激光打孔进行打孔；
S2：将无铅锡膏通过丝网漏印或点胶工艺印刷到环形压电陶瓷的上下两个表面；
S3：将S2得到环形压电陶瓷与上FPC材料PCB板和下FPC材料PCB板初步粘合；
S4：通过回流焊设备将环形压电陶瓷与上FPC材料PCB板和下FPC材料PCB板进行固化；
S5：检测，检测合格得到网孔式超声波雾化片。
本发明的有益效果：
1、本发明的网孔式超声波雾化片与传统的网孔式超声波雾化片的材料无论主要材料还是辅助材料都拥有良好的成熟制造工艺，但是本发明所使用的材料都符合环保的规范，而传统的网孔式超声波雾化片使用了不符合环保工艺的化学药剂，同时还多出了一倍的材料；
2、第二PI薄膜是属于高分子塑料材料的一种，因此其具有良好的可塑性，通过加热等方法可以很容易的将其塑形，所以圆心处的弧面可以很容易进行成型，并且该材料在使用激光打孔设备进行打孔时候仅需要很小的能量即可，该材料在激光打孔的过程中能够完全挥发，其打孔后的表面光滑，液体在通过孔的过程中阻力小，出雾效率高；
3、第二PI薄膜在打孔的过程中能够完全挥发因此在打孔工艺过后可以无需清洗，孔的边缘光滑，材料本身的疲劳寿命比金属好，所以在雾化片工作过程中的反复形变不会产生明显的应力集中点，不易出现材料断裂等风险，雾化片的整体工作寿命得到了很大的提高；
4、第二PI薄膜本身具备非常好的耐化学药剂性能，和非常好的生物相容性使得雾化片的应用场合得到了很大的拓宽，应用于医疗领域的安全性非常好；
5、本发明制备的网孔式超声波雾化片不仅减少了材料还大幅度的减少了生产制造的流程，使产品的制造成本得到了降低，同时提高了单位时间的产能；
6、本发明网孔式超声波雾化片的制备工艺通过部分流程使用机器人来实现产线的自动化可以实现产线完全流水化生产，所有的工艺均可实现同节奏运行单位时间的生产效率得到了很大的提高，对空间的要求极低，产能可以实现弹性化管理，产能进一步增加的情况下空间利用率提高了，降低了场地费用，最重要的是本发明的网孔式超声发雾化片在生产的过程中产生的污染物极低，是一种十分环保的制备工艺，本发明网孔式超声雾化片的制备工艺对设备种类的需求极少，仅需激光打孔设备和回流焊设备即可，生产线的建设成本得到了明显的下降。
附图说明
本发明可以通过附图给出的非限定性实施例进一步说明；
图1为传统式网孔式超声波雾化片的结构示意图；
图2为本发明一种网孔式超声波雾化片一种实施例的结构示意图；
图3为图2的剖面结构示意图；
图4为本发明一种网孔式超声波雾化片另一种实施例的剖面结构示意图；
图5为本发明一种网孔式超声波雾化片中弧形过度面处放大的结构示意图；
图6为通过无铅锡膏制备网孔式超声波雾化片的结构示意图；
图7为通过SMT胶制备网孔式超声波雾化片的结构示意图；图1为本发明一种网孔式超声波雾化片实施例的结构示意图；
图8为传统式网孔式超声波雾化片的工艺流程示意图；
图9为本发明一种网孔式超声波雾化片的工艺流程示意图；
主要元件符号说明如下：
上FPC材料PCB板1、第一PI薄膜11、第一铜箔12、上PI薄膜13、下FPC材料PCB板2、第二PI薄膜21、第二铜箔22、下PI薄膜23、弧形过度面24、环形压电陶瓷3、无铅锡膏31、微米级小孔4、环形PI薄膜5。
具体实施方式
为了使本领域的技术人员可以更好地理解本发明，下面结合附图和实施例对本发明技术方案进一步说明。
如图2、图3、图5所示，一种网孔式超声波雾化片包括上FPC材料PCB板1和下FPC材料PCB板2，上FPC材料PCB板1包括第一PI薄膜11、第一铜箔12和上PI薄膜13，下FPC材料PCB板2包括第二PI薄膜21、第二铜箔22和下PI薄膜23第一铜箔12和第二铜箔22之间连接有环形压电陶瓷3，环形压电陶瓷3的上下表面均设有无铅锡膏31，环形压电陶瓷3通过无铅锡膏31与第一铜箔12和第二铜箔22焊接，第二PI薄膜21的中心位置设有弧形过度面24，弧形过度面24设有微米级小孔4，微米级小孔4的为圆锥形台结构。
其中，上PI薄膜层13和下PI薄膜层23压合贴紧。上PI薄膜层13和下PI薄膜层23的压紧贴合，有助于将上FPC材料PCB板1和下FPC材料PCB板2连接在一起，从而增加网孔式超声波雾化片的稳固性，提升使用寿命，同时使得上FPC材料PCB板1和下FPC材料PCB板2导电平面平行，具有很好的交流信号耦合能力，使产品的空间辐射得到的有效降低。
如图4所示，其中，第二铜箔22的内径尺寸小于环形压电陶瓷3的内径尺寸，第二铜箔22连接有环形PI薄膜5，环形PI薄膜5环形外径尺寸小于压环形压电陶瓷3内径尺寸、大于弧形过度面24的直径。这样的设计，使得第二铜箔22的圆形面积更大，同时为了防止加大的部分第二铜箔22出现腐蚀问题使用了环形PI薄膜5对其部分多余面积进行了遮蔽；由此带来的好处是环形压电陶瓷3的形变能量可以更多的通过第二铜箔22进行传递。
其中，微米级小孔4上部的直径尺寸为2μm～8μm、下部的直径尺寸为50μm～60μm。微米级小孔4的孔径可以直接影响水雾的雾滴颗粒，这样的尺寸时间，可以使得雾化效果较佳。
本发明的的工作原理如下：
将一定频率的交流电压施加于第一铜箔12和第二铜箔22上，交流电压的频率假设为108KHz，此时电压通过第一铜箔12和第二铜箔22和焊接好的无铅锡膏31传递到环形压电陶瓷3的两个电极，环形压电陶瓷3受到外部电场的控制产生和输入频率一致的规律性形变，形变的能量通过无铅锡膏31传递到第一铜箔12和第二铜箔22上，第二铜箔22和第二PI薄膜21本身为压合一体，因此第二铜箔22的形变能量集中到了第二PI薄膜21上，第二PI薄膜21圆心位置设有一个弧形过度面24，且二次加工好的微米级小孔4均在弧形过度面24区域内，此时弧形过度面24区域产生了和输入频率一致的往复运动，且运动方向垂直于网孔式超声波雾化片的表面，此时第二PI薄膜21的下表面接触到需要雾化的液体，液体在受到第二PI薄膜21挤压的情况下沿孔的位置喷射；由于微米级小孔4为圆锥形台结构，因此液体越往第二PI薄膜21的上表面运动所受到的挤压力越大，液体也越容易通过第二PI薄膜21上的微米级小孔4，从而形成水雾。
通过分析本发明的网孔式超声波雾化片和传统式网孔式超声波雾化片的结构差异应该从零件和材料方面进行，得到表1：
表1：本发明雾化片与传统式雾化片使用材料对照表
根据表1，可以看出本发明的网孔式超声波雾化片与传统的网孔式超声波雾化片的材料无论主要材料还是辅助材料都拥有良好的成熟制造工艺；但是本发明所使用的材料都符合环保的规范，而传统的网孔式超声波雾化片使用了不符合环保工艺的化学药剂，同时传统式的超声波雾化片还多出了一倍的材料种类；材料种类的的复杂程度导致了传统式网孔式超声波雾化片的制造流程的更复杂。
如图9所示，一种网孔式超声波雾化片的制造工艺，包括以下步骤：
S1：将下FPC材料PCB板2的第二PI薄膜21中的弧形过度面24通过激光打孔进行打孔；
S2：将无铅锡膏31通过丝网漏印或点胶工艺印刷到环形压电陶瓷7的上下两个表面；
S3：将S2得到环形压电陶瓷7与上FPC材料PCB板1和下FPC材料PCB板2初步粘合；
S4：通过回流焊设备将环形压电陶瓷7与上FPC材料PCB板1和下FPC材料PCB板2进行固化；
S5：检测，检测合格得到网孔式超声波雾化片。
图8为传统式网孔式超声波雾化片工艺的流程图，通过图8和图9的对比，可以看出，新型网孔式超声波雾化片不仅减少了材料还大幅度的减少了生产制造的流程，使产品的制造成本得到了降低，同时提高了单位时间的产能，具体差异如下：
传统式网孔式超声波雾化片制备过程中的清洗和烘烤工艺，由于清洗设备和烘烤设备都是非流水线设备，因此需产线积累一定的数量再通过人工转移至设备，并在设备中持续作业，此工艺造成了制造过程中的短板效应，导致了生产线需要大量的中转存储，且人工的需求量较大；
传统式网孔式超声波雾化片制备过程中的导线焊接严重依赖熟练的焊接工人，由于不锈钢金属材料的可焊性差，导致了焊接本身的效率不高，并且焊接过程中所产生的高温容易损坏压电陶瓷；
传统式网孔式超声波雾化片制备工艺由于需要大量的中转存储，且流程过于复杂导致了场地需求量大，提升产能的同时空间利用率下降严重；
传统式网孔式超声波雾化片对生产设备的种类要求较多，导致生产线的建设成本高，设备折旧导致成本较高；
反观本发明的网孔式超声波雾化片制备工艺通过部分流程使用机器人来实现产线的自动化可以实现产线完全流水化生产，所有的工艺均可实现同节奏运行单位时间的生产效率得到了很大的提高，对空间的要求极低，产能可以实现弹性化管理，产能进一步增加的情况下空间利用率提高了，降低了场地费用，最重要的是新的雾化片在生产的过程中产生的污染物极低，是一种十分环保的制备工艺，新的雾化片制备工艺对设备种类的需求极少，仅需激光打孔设备和回流焊设备即可，生产线的建设成本得到了明显的下降。
通过对比本发明网孔式超声波雾化片与传统式网孔式超声波雾化片的各自的特点，见可以得到本发明雾化片与传统式雾化片对照表，见表2；
表2：本发明雾化片与传统式雾化片对照表
通过表2，可以看出，本发明通过对网孔式超声波雾化片进行材料、结构应用上的创新，带来了生产工艺上的进一步创新，最终得到了一款性能优于传统产品，且生产工艺更加环保的新产品。
需要说明的是，环形压电陶瓷的工作原理如下：在环形压电陶瓷的两面电极上施加电压即可使环形压电陶瓷产生形变，同时由于环形压电陶瓷的陶瓷本身为非导体，因此其产生形变的原因是电极上的电压所产生的空间电荷场导致的；因此环形压电陶瓷的特性可以理解为当上FPC材料PCB板和下FPC材料PCB板贴合在环形压电陶瓷的两面后，即使不和电极产生连接的情况下在上FPC材料PCB板和下FPC材料PCB板中的金属层施加电压也可以在环形压电陶瓷的两面形成一个空间电荷场从而产生形变，基于以上原理我们可以使用一个未被覆电极的环形压电陶瓷，即环形压电陶瓷两面没有金属电极的涂层，将其置于上FPC材料PCB板和下FPC材料PCB板中间，同时使用绝缘粘合剂将其粘合，粘合剂起到传递形变力的作用，同时起到将上FPC材料PCB板和下FPC材料PCB板固定在环形压电陶瓷两面的作用，此时将电压施加于导电金属层即可使环形压电陶瓷产生形变，并且形变的能量会由粘合剂传递到下FPC材料PCB板上从而利用其能量，在此应用中可以将上FPC材料PCB板和下FPC材料PCB板的铜箔层理解为压电陶瓷的电极方便后续阅读。
基于以上原理同时为了简化工艺可做出如下优化：将无铅锡膏替换为“SMT红胶‘以下简称SMT胶’”粘合剂，通过使用丝网印刷，或者点胶等设备将SMT胶涂覆于环形压电陶瓷的两面，再将环形压电陶瓷与上FPC材料PCB板和下FPC材料PCB板进行初步粘接，然后将其置于回流焊接设备中进行进一步固化，最终可得到与本发明工作完全一致的产品；可以理解为其工作原理和之前介绍一致，仅将粘合材料由无铅锡膏更换为SMT胶，并且制造流程完全不变；改良工艺的好处是可以进一步的降低产品的制造成本，SMT胶材料的操作温度也低于无铅锡膏，进一步降低环形压电陶瓷在焊接过程中产生的影响，同时可以使用未被覆电极的环形压电陶瓷，降低了环形压电陶瓷的采购成本，并且由于SMT胶是绝缘粘合剂，因此在制造过程中可无需担心电极短路的问题出现，即使出现溢胶也不会对产品性能造成影响，提高了生产工艺的容错性；
如图6图7所示，图6为通过无铅锡膏制备网孔式超声波雾化片的结构示意图，图7为通过SMT胶制备网孔式超声波雾化片的结构示意图，图6、图7中隐藏了产品的其它层，例如PI薄膜层等，为了方便理解改进的位置添加了环形压电陶瓷电极层A3、A5，并对其安装顺序进行了编号，各个层的明细请见表3：
表3：无铅锡膏制备雾化片与SMT胶制备雾化片对照表
通过表3可以看出，通过使用SMT胶，降低了对环形压电陶瓷的要求，不再需要环形压电陶瓷具备导电涂层，同时SMT胶和环形压电陶瓷的陶瓷本体均为绝缘材料，杜绝了焊接过程中由于溢胶等造成的电极短路故障；同时不对环形压电陶瓷的工作性能产生影响。
上述实施例仅示例性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (5)

1.一种网孔式超声波雾化片，其特征在于：包括上FPC材料PCB板（1）和下FPC材料PCB板（2），所述上FPC材料PCB板（1）包括第一PI薄膜（11）、第一铜箔（12）和上PI薄膜（13），所述下FPC材料PCB板（2）包括第二PI薄膜（21）、第二铜箔（22）和下PI薄膜（23）所述第一铜箔（12）和第二铜箔（22）之间连接有环形压电陶瓷（3），所述环形压电陶瓷（3）的上下表面均设有无铅锡膏（31），所述环形压电陶瓷（3）通过无铅锡膏（31）与第一铜箔（12）和第二铜箔（22）焊接，所述第二PI薄膜（21）的中心位置设有弧形过度面（24），所述弧形过度面（24）设有微米级小孔（4），所述微米级小孔（4）的为圆锥形台结构。
2.根据权利要求1所述的一种网孔式超声波雾化片，其特征在于：所述上PI薄膜层（13）和下PI薄膜层（23）压合贴紧。
3.根据权利要求1所述的一种网孔式超声波雾化片，其特征在于：所述第二铜箔（22）的内径尺寸小于环形压电陶瓷（3）的内径尺寸，所述第二铜箔（22）连接有环形PI薄膜（5），所述环形PI薄膜（5）环形外径尺寸小于压环形压电陶瓷（3）内径尺寸、大于弧形过度面（24）的直径。
4.根据权利要求1所述的一种网孔式超声波雾化片，其特征在于：所述微米级小孔（4）上部的直径尺寸为2μm～8μm、下部的直径尺寸为50μm～60μm。
5.一种如权利要求1～4任意一项所述的网孔式超声波雾化片的制造工艺，其特征在于：包括以下步骤：
S1：将下FPC材料PCB板（2）的第二PI薄膜（21）中的弧形过度面（24）通过激光打孔进行打孔；
S2：将无铅锡膏（31）通过丝网漏印或点胶工艺印刷到环形压电陶瓷（7）的上下两个表面；
S3：将S2得到环形压电陶瓷（7）与上FPC材料PCB板（1）和下FPC材料PCB板（2）初步粘合；
S4：通过回流焊设备将环形压电陶瓷（7）与上FPC材料PCB板（1）和下FPC材料PCB板（2）进行固化；
S5：检测，检测合格得到网孔式超声波雾化片。
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