CN110191621B - Printed circuit board stacking assembly with heat dissipation structure and electronic equipment - Google Patents
Printed circuit board stacking assembly with heat dissipation structure and electronic equipment Download PDFInfo
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- CN110191621B CN110191621B CN201910510875.9A CN201910510875A CN110191621B CN 110191621 B CN110191621 B CN 110191621B CN 201910510875 A CN201910510875 A CN 201910510875A CN 110191621 B CN110191621 B CN 110191621B
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The application discloses printed circuit board stack subassembly and electronic equipment with heat radiation structure relates to electron technical field. A printed circuit board stack with a heat dissipation structure comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; the first accommodating part is arranged between the first printed circuit board and the second printed circuit board and stores liquid; a communicating structure communicating with the first accommodating portion; and the second accommodating part is communicated with the first accommodating part through a communication structure. On the one hand, by dividing the printed circuit board into a first printed circuit board and a second printed circuit board arranged in a stack, the actual usable area of the printed circuit board can be increased. On the other hand, the liquid stored in the first accommodating part is vaporized into hot steam after absorbing the heat of the components in the printed circuit board, so that the high-efficiency heat dissipation of the printed circuit board can be realized.
Description
Technical Field
The present application relates to the field of electronic technologies, and in particular, to a printed circuit board stack assembly with a heat dissipation structure and an electronic device.
Background
Electronic devices such as smart phones and personal computers are gradually becoming necessities of people in life, and along with more and more functions of the electronic devices, more and more electronic components are integrated on a printed circuit board in the electronic devices, so that the area of the printed circuit board and the heat productivity of the electronic devices are increased, and therefore how to solve the problems of the area of the printed circuit board and the heat dissipation of the electronic devices becomes a key point for research of technical personnel in the field of electronic technology.
Disclosure of Invention
The application provides a printed circuit board stack subassembly and electronic equipment with heat radiation structure can improve printed circuit board's radiating efficiency, has solved the technical problem that printed circuit board radiating efficiency is low among the correlation technique.
A first aspect of the present application provides a printed circuit board stack having a heat dissipation structure, the printed circuit board stack including:
a first printed circuit board;
a second printed circuit board stacked with the first printed circuit board;
a first accommodating part which is arranged between the first printed circuit board and the second printed circuit board and in which liquid is stored;
a communicating structure communicating with the first accommodating portion;
and a second receiving portion communicating with the first receiving portion through the communication structure.
A second aspect of the present application provides an electronic device comprising a printed circuit board stack with a heat dissipation structure as described above.
The beneficial effects brought by the technical scheme provided by some embodiments of the application at least comprise:
the present application provides a printed circuit board stack assembly with a heat dissipation structure, which includes: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; the first accommodating part is arranged between the first printed circuit board and the second printed circuit board and stores liquid; a communicating structure communicating with the first accommodating portion; and the second accommodating part is communicated with the first accommodating part through a communication structure. On one hand, the printed circuit board is divided into the first printed circuit board and the second printed circuit board which are arranged in a stacked mode, so that the actual available area of the printed circuit board can be increased, and the occupied area of the printed circuit board can be reduced. On the other hand, set up first container portion between first printed circuit board and second printed circuit board, the liquid that stores in the first container portion vaporizes into hot steam after absorbing the heat of components and parts among the printed circuit board, hot steam liquefies into liquid and gives off the heat after passing through the communicating structure with heat transmission to the lower second container portion of temperature, liquid flows back to first container portion again through the communicating structure, so reciprocating cycle, can realize printed circuit board's high-efficient heat dissipation, reduce the temperature of components and parts among the printed circuit board, printed circuit board's radiating efficiency has been improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Figure 1 shows a schematic cross-sectional view of a printed circuit board stack with heat dissipation structures according to an embodiment of the present application;
fig. 2 illustrates an assembly view of a printed circuit board in a printed circuit board stack having a heat dissipation structure according to an embodiment of the present application;
figure 3A illustrates a schematic top view of a communication structure in a printed circuit board stack having a heat dissipation structure according to another embodiment of the present application;
figure 3B illustrates a schematic top view of another communication structure in a printed circuit board stack having heat dissipation structures according to another embodiment of the present application;
figure 4 illustrates a schematic partial cross-sectional view of a printed circuit board stack assembly having a heat dissipation structure according to another embodiment of the present application;
fig. 5 illustrates a schematic structural view of a communication structure in a printed circuit board stack having a heat dissipation structure according to another embodiment of the present application;
fig. 6 is a schematic structural view illustrating a communication structure in a printed circuit board stack having a heat dissipation structure according to another embodiment of the present application;
fig. 7 is a schematic structural view illustrating a first receiving portion in a printed circuit board stack assembly having a heat dissipation structure according to another embodiment of the present application.
Detailed Description
In order to make the purpose, features and advantages of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the related art, electronic equipment generally adopts a single-layer printed circuit board design, and the area of the printed circuit board is reduced by reasonably designing the arrangement of electronic components on the printed circuit board. For the heat dissipation structure of the single-layer printed circuit board, a metal back plate heat dissipation method can be used, specifically, based on heat dissipation of a graphite sheet, a metal back plate is added on the back of the mobile phone, and heat is transferred and distributed to the back of the mobile phone for the second time.
On one hand, the layout of electronic components on a single-layer printed circuit board is reasonably designed so as to reduce the area of the printed circuit board, and the reduction of the area of the printed circuit board is limited. On the other hand, the single-layer printed circuit board adopts the metal back plate for heat dissipation, so that the heat dissipation efficiency is low, the electronic equipment cannot be cooled in time, and therefore, a printed circuit board which occupies a small area and can dissipate heat efficiently needs to be designed.
The printed circuit board described in the following embodiments is an electronic component, which is a support for electronic components, i.e., a carrier for electrical connection of electronic components, and can be manufactured by electronic printing. In practical application, the printed circuit board can be classified into a single panel, a double-sided board and a multilayer board according to the number of circuit layers, wherein electronic components are concentrated on one surface of the printed circuit board in the single panel, and wires are concentrated on the other surface; the double-sided board has wiring on both sides of the printed circuit board and circuit connections between both sides of the printed circuit board. Multilayer printed circuit boards are constructed using a plurality of single-sided and/or double-sided circuit boards, for example, using one double-sided inner layer, two single-sided outer layers or two double-sided inner layers, two single-sided outer layers, which are alternately joined together by a positioning system and an insulating adhesive material, and the printed circuit boards after interconnection of conductive patterns as required by design are four-layer, six-layer printed circuit boards, also known as multilayer printed circuit boards.
In the present application, the pcb may be any one of a single-sided board, a double-sided board and a multi-layered board, and an appropriate type of the pcb may be selected according to actual circuit design requirements.
Fig. 1 is a schematic cross-sectional view of a printed circuit board stack assembly with a heat dissipation structure according to an embodiment of the present disclosure.
As shown in fig. 1, a printed circuit board stack 10 having a heat dissipation structure includes: a first printed circuit board 101, a second printed circuit board 103, a first receiving portion 105, a communicating structure 107, and a second receiving portion 109.
The first printed circuit board 101 and the second printed circuit board 103 are stacked, the first printed circuit board 101 and the second printed circuit board 103 may be any one of a single-sided board, a double-sided board and a multi-layer board, and the first printed circuit board 101 and the second printed circuit board 103 may have the same shape, a part of the same shape, or a part of the same shape of a frame, so that the first printed circuit board 101 and the second printed circuit board 103 may be better stacked together. The first printed circuit board 101 and the second printed circuit board 103 may be stacked in a thickness direction, and the first printed circuit board 101 and the second printed circuit board 103 may be assembled together by a fixing device or a fixing structure.
Fig. 2 shows a schematic diagram of a possible assembly of a first printed circuit board and a second printed circuit board in a printed circuit board stack having a heat dissipation structure, as shown in fig. 2, the first printed circuit board 101 has a first frame 1011 protruding downward, and the first frame 1011 has a pad connected to a component of the first printed circuit board 101 and a through hole connected to the pad, the second printed circuit board 103 has a second frame 1031 protruding upward, the second frame 1031 also has a pad connected to a component of the second printed circuit board 103 and a through hole connected to the pad, and the positions of the through hole on the first frame 1011 and the through hole on the second frame 1031 may be the same with respect to the first printed circuit board 101 and the second printed circuit board 103. When the first printed circuit board 101 and the second printed circuit board 103 are assembled, the through holes in the first frame 1011 correspond to the through holes in the second frame 1031 one by one, a liquid soldering material is injected into the through holes in the first frame 1011 and the second frame 1031, and after the soldering material in the through holes is solidified, the soldering material is connected with the soldering pads on the first printed circuit board 101 and the soldering pads on the second printed circuit board 103, so that the first printed circuit board 101 and the second printed circuit board 103 are fixed and electrically communicated.
It is to be understood that the first printed circuit board 101 having the downwardly convex first frame 1011 and the second printed circuit board 103 having the upwardly convex second frame 1031, the terms "upwardly" and "downwardly" and the like in the description of the embodiments of the present application and the following embodiments indicate orientations or positional relationships based on those shown in the drawings, which are only for convenience of describing the present application and simplifying the description, and do not imply or indicate that the referred device or component must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
Alternatively, the first accommodating part 105 is disposed between the first printed circuit board 101 and the second printed circuit board 103, the first accommodating part 105 is a sealing structure and has a certain accommodating space, and the shape of the first accommodating part 105 can be set according to the specific application, for example, the first accommodating part 105 can be a bag-shaped structure or a cube-shaped structure. Liquid is stored in the accommodating space of first accommodating part 105, the liquid stored in first accommodating part 105 is a liquid that can be vaporized by heating, and the types of liquid include, but are not limited to, water, ethanol, diethyl ether, acetone, chloroform, and benzene. The temperature of the liquid stored in the first receiving portion 105 is increased after absorbing heat generated from the components in the first and second printed circuit boards 101 and 103, and when the temperature of the liquid is increased to a certain temperature, the liquid is vaporized into hot vapor having a certain temperature.
Alternatively, one end of the communicating structure 107 communicates with the first accommodating portion 105, and the other end of the communicating structure 107 communicates with the second accommodating portion 109, that is, the second accommodating portion 109 communicates with the first accommodating portion 105 through the communicating structure 107. The communicating structure 107 serves to communicate the first receiving portion 105 with the second receiving portion 109, and thus the specific configuration of the communicating structure 107 may not be limited, and the shape of the communicating structure 107 and the length and width of the internal passage may be set according to the actual application.
Alternatively, the second accommodating portion 109 may have the same structure as the first accommodating portion 105 and also have a certain accommodating space, and the shape of the second accommodating portion 109 may also be set according to the specific application, for example, the second accommodating portion 109 may have a bag-shaped structure or a cube structure. The heat vapor generated by the vaporization of the liquid in the first receiving portion 105 flows to the second receiving portion 109 through the communicating structure 107, and the second receiving portion 109 may not be disposed adjacent to the heat generating components in the pcb stack, so that the temperature of the second receiving portion 109 is lower than the temperature of the first receiving portion 105 and the heat vapor, when the heat vapor flows into the second receiving portion 109 through the communicating structure 107, the heat vapor with higher temperature is liquefied into liquid and releases heat after encountering the second receiving portion 109 with lower temperature, the liquefied liquid flows back to the first receiving portion 105 through the communicating structure 107, and the liquid may be vaporized again, and so on. Through the vaporization process of the liquid stored in the first accommodating part 105, the heat generated by the components in the first printed circuit board 101 and the second printed circuit board 103 is transferred to the second accommodating part 109, then the heat is released in the second accommodating part 109 through the liquefaction process of the hot vapor, and the liquid generated after liquefaction flows back to the first accommodating part 105, so that the heat transfer and release are completed, and the timely and efficient heat dissipation of the first printed circuit board 101 and the second printed circuit board 103 is realized.
Alternatively, the height of the second accommodating portion 109 relative to the ground or horizontal plane may be greater than the height of the first accommodating portion 105 relative to the ground or horizontal plane, which is intended to be used for accommodating the electronic device of the pcb stack, and the electronic device may be mostly in a certain posture or position, for example, if the terminal is a mobile phone, the mobile phone is mostly in a flat state or a holding state in a certain direction, or if the electronic device is a personal computer, the personal computer is generally in a stationary state, and when the height of the second accommodating portion 109 relative to the ground or horizontal plane is greater than the height of the first accommodating portion 105 relative to the ground or horizontal plane, the heated vapor generated after the liquid in the first accommodating portion 105 is vaporized rises, and the heated vapor flows into the second accommodating portion 109 more easily, the liquefaction process of the hot vapor is facilitated, and the heat dissipation efficiency of the first and second printed circuit boards 101 and 103 is further improved.
In an embodiment of the present application, a printed circuit board stack having a heat dissipation structure includes: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; the first accommodating part is arranged between the first printed circuit board and the second printed circuit board and stores liquid; a communicating structure communicating with the first accommodating portion; and the second accommodating part is communicated with the first accommodating part through a communication structure. On one hand, the printed circuit board is divided into the first printed circuit board and the second printed circuit board which are arranged in a stacked mode, so that the actual available area of the printed circuit board can be increased, and the occupied area of the printed circuit board can be reduced. On the other hand, set up first container portion between first printed circuit board and second printed circuit board, the liquid that stores in the first container portion vaporizes into hot steam after absorbing the heat of components and parts among the printed circuit board, hot steam becomes liquid and gives out the heat after passing through the communicating structure with the liquefaction of heat transmission to the lower second container portion of temperature, liquid after the liquefaction of hot steam flows back to first container portion through the communicating structure again, so reciprocating cycle, can realize printed circuit board's high-efficient heat dissipation, reduce the temperature of components and parts among the printed circuit board.
Fig. 3A is a schematic top view of another communication structure in a pcb stack with a heat dissipation structure according to an embodiment of the present disclosure.
As shown in fig. 3A, the printed circuit board stack 10 with a heat dissipation structure of the embodiment shown in fig. 3A is substantially the same as the printed circuit board stack 10 with a heat dissipation structure of the embodiment shown in fig. 1 to 2, except that in this embodiment, the communication structure 107 may be a tube-like structure, and the communication structure 107 may be made of a material that is easy to conduct heat, such as a copper tube, so that heat is dissipated from the heated vapor or the reflowed liquid through the communication structure during the transmission process.
Optionally, the communicating structure 107 may include a plurality of communicating pipes, on one hand, after the liquid in the first container 105 is vaporized into the hot vapor, the hot vapor may flow to the second container 109 more quickly through the plurality of communicating pipes, and after the hot vapor is liquefied in the second container 109, the liquefied liquid may also flow back to the first container 105 more quickly through the plurality of communicating pipes, so as to improve the transmission and conversion efficiency of the hot vapor and the liquid. On the other hand, some of the communicating pipes can be used for transmitting hot steam, and the other part of the communicating pipes can be used for refluxing the liquid liquefied by the hot steam, so that the transmission of the hot steam cannot be influenced in the liquid refluxing process, and the heat dissipation efficiency of the printed circuit board stacking assembly is improved.
Fig. 3B is a schematic top view of another communication structure in another pcb stack with a heat dissipation structure according to an embodiment of the present disclosure.
As shown in fig. 3B, the communication structure 107 may further include a first type communication pipe 1071 and a second type communication pipe 1073, both ends of the first type communication pipe 1071 respectively communicate with the first receiving portion 105 and the second receiving portion 109, and both ends of the second type communication pipe 1073 also respectively communicate with the first receiving portion 105 and the second receiving portion 109.
By dividing the communicating structure 107 into two types, it may be convenient for the hot vapor in the first accommodating part 105 to flow toward the second accommodating part 109 and the liquid in the second accommodating part 109 to flow back toward the first accommodating part 105, and optionally, at least one of the first-type communicating tube 1071 and the second-type communicating tube 1073 may include a plurality of communicating pipes, for example, the first-type communicating tube 1071 may include a plurality of communicating pipes and the second-type communicating tube 1073 may include a plurality of communicating pipes, so as to ensure the transfer of the hot vapor and the liquid and the conversion efficiency. The number of communication pipes in first-type communication pipes 1071 and second-type communication pipes 1073 may be specifically set according to the actual application of the pcb stack, for example, if the heat generation amount of components in first pcb 101 and second pcb 103 is larger or the amount of the liquid stored in first container 105 is larger, more heat vapor is generated when the liquid in first container 105 is vaporized, and thus more communication pipes are required to transmit heat vapor and to transmit the returned liquid.
Alternatively, the communicating tube 1071 of the first type has a membrane 10711 through which only gaseous substances can pass, and the membrane 10711 has a certain number of holes. Generally, the diameter of the molecules of the substance in the gaseous state is smaller than the diameter of the droplets of the substance in the liquid state, so that the membrane 10711 is selected such that the diameter of the pores of the membrane 10711 is larger than the diameter of the molecules of the liquid in the gaseous state, and the diameter of the pores of the membrane 10711 is smaller than the smallest diameter of the droplets of the liquid, the membrane 10711 may be a hydrophobic membrane or a membrane of similar structure to the hydrophobic membrane, so that the membrane is capable of passing the gaseous substance but not the liquid substance, and the membrane 10711 may be made of a polymer material, for example, a nanomaterial, so that the membrane has the property of passing the gaseous substance but not the liquid substance. After such a diaphragm 10711 is used in the first type communicating tube 1071, since the gaseous molecular diameter of the hot vapor generated after the vaporization of the liquid in the first containing part 105 is smaller than the hole diameter of the diaphragm 10711, the hot vapor generated after the vaporization of the liquid in the first containing part 105 can flow toward the second containing part 109 through the diaphragm 10711 in the first type communicating tube 1071, and the diameter of the smallest liquid droplet of the liquid in the first containing part 105 is larger than the hole diameter of the diaphragm 10711, so that the liquid in the first containing part 105 cannot pass through the diaphragm 10711 to be blocked inside the first containing part 105. The purpose of this is to allow the heat vapor generated after the liquid in the first accommodating portion 105 is vaporized to be transmitted to the second accommodating portion 109 through the membrane 10711, and to prevent the liquid in the first accommodating portion 105 from flowing into the second accommodating portion 109 through the communicating structure 107 by the membrane 10711, so as to avoid the heat absorption efficiency of the first accommodating portion 105 from being too low due to too little liquid in the first accommodating portion 105, thereby improving the heat dissipation efficiency of the whole printed circuit board stacked assembly.
Optionally, a switch portion 10731 for allowing one-way flow of liquid is provided in the second type connection pipe 1073. The liquid inlet of the opening and closing part 10731 faces the second containing part 109, and the liquid outlet of the opening and closing part 10731 faces the first containing part 105, that is, when the liquid is transferred between the first containing part 105 and the second containing part 109 through the second type communication pipe 1073, the liquid can be transferred only from the second containing part 109 to the first containing part 105. This is done to ensure that, on the one hand, the liquid liquefied from the hot vapor in the second accommodating portion 109 can flow into the first accommodating portion 105 to ensure that the liquid in the first accommodating portion 105 is continuously used for absorbing the heat generated by the components in the first printed circuit board 101 and the second printed circuit board 103; on the other hand, the liquid in the first accommodation portion 105 can be blocked from flowing into the second accommodation portion 109 through the communication structure 107 by the switch portion 10731, further ensuring the heat dissipation efficiency of the printed circuit board stack as a whole.
Optionally, the switching section 10731 includes a one-way membrane or a one-way valve. The unidirectional film can also be made of high molecular materials, such as nano materials, and the unidirectional film only allows unidirectional flow of liquid through the design of the internal materials of the unidirectional film. The one-way valve may be a valve-like structure, which by design of the inside of the valve also allows only one-way flow of liquid.
In the embodiment of the application, the communicating structure comprises a first communicating pipe and a second communicating pipe, a diaphragm which can only pass through gaseous substances is arranged in the first communicating pipe, hot vapor generated after liquid in the first accommodating part is vaporized can be transmitted to the second accommodating part through the diaphragm, and liquid in the first accommodating part can be blocked by the diaphragm to flow into the second accommodating part through the communicating structure, so that the phenomenon that the heat absorption efficiency of the first accommodating part is too low due to too little liquid in the first accommodating part is avoided, and the overall heat dissipation efficiency of the stacked assembly of the printed circuit boards is ensured. And the second type communicating pipe is provided with a switch part which allows the liquid to flow in a one-way manner, so that the liquid liquefied by the hot vapor in the second accommodating part can flow into the first accommodating part, the first accommodating part is ensured to be continuously provided with the liquid for absorbing the heat of the first printed circuit board and the second printed circuit board, meanwhile, the liquid in the first accommodating part can be prevented from flowing into the second accommodating part through the communicating structure through the switch part, and the overall heat dissipation efficiency of the printed circuit board superposed assembly is further ensured.
Fig. 4 is a schematic partial cross-sectional view of another printed circuit board stack assembly with a heat dissipation structure according to an embodiment of the present application.
As shown in fig. 4, the printed circuit board stack assembly having the heat dissipation structure of the embodiment shown in fig. 4 is substantially the same as the printed circuit board stack assembly having the heat dissipation structure of the embodiment shown in fig. 1 to 2, except that in the present embodiment, an evaporator 1051 is disposed inside the first receiving portion 105, and a liquid is stored in the evaporator 1051.
Optionally, a part of the outer wall of the evaporator 1051 is in contact with the inner wall of the first accommodating part 105, that is, a gap exists between the partial outer wall of the evaporator 1051 and the inner wall of the first accommodating part 105, and the outer wall of the evaporator 1051, the inner wall of the first accommodating part 105, the inner wall of the communicating structure 107, and the inner wall of the second accommodating part 109 are all provided with capillary structures 1053 for liquid backflow, and the capillary structures 1053 in the outer wall of the evaporator 1051, the inner wall of the first accommodating part 105, the inner wall of the communicating structure 107, and the inner wall of the second accommodating part 109 are sequentially connected together, and the capillary structures are made of capillary porous materials and have wicks for absorbing liquid therein.
After absorbing heat generated by components in the first printed circuit board 101 and the second printed circuit board 103, the first accommodating part 105 transfers the heat to the evaporator 1051 inside, the liquid absorbed in the capillary structure arranged on the outer wall of the evaporator 1051 is vaporized into hot vapor, because a part of the outer wall of the evaporator 1051 is in contact with the inner wall of the first accommodating part 105, a part of the outer wall of the evaporator 1051, which is not in contact with the inner wall of the first accommodating part 105, can be used for vaporizing the liquid, the hot vapor flows to the second accommodating part 109 through the channel in the communication structure 107, after encountering the second accommodating part 109 with a lower temperature, the hot vapor is liquefied into the liquid and absorbed by the wick of the capillary structure in the inner wall of the second accommodating part 109, and the capillary force in the capillary structure drives the liquefied liquid to flow in the capillary structure, that is, the liquefied liquid flows along the capillary structure in the inner wall of the second accommodating part 109, The capillary structure on the inner wall of the communicating structure 107 and the capillary structure on the inner wall of the first accommodating part 105 flow and finally flow back to the evaporator 1051, and the above processes are circulated, so that the heat transfer and release are completed, and the timely and efficient heat dissipation of the first printed circuit board 101 and the second printed circuit board 103 is realized.
In this application embodiment, the inside evaporimeter that is provided with of first container portion, on the one hand, because the outer wall of evaporimeter is provided with the capillary structure, therefore the evaporimeter not only has the effect that can vaporize fast after guaranteeing that the liquid that the capillary structure absorbed is heated, can also make most liquid save in first container portion, can not lead to liquid to flow out from first container portion because of printed circuit board stack's position changes, has guaranteed the radiating efficiency of first printed circuit board and second printed circuit board. On the other hand, only one part of the outer wall of the evaporator is in contact with the inner wall of the first accommodating part, so that a gap exists between the outer wall of most parts of the evaporator and the inner wall of the first accommodating part, the area of the evaporator for liquid vaporization is increased, and the heat dissipation efficiency of the evaporator is improved.
Fig. 5 is a schematic structural diagram of a communication structure in another printed circuit board stack assembly with a heat dissipation structure according to an embodiment of the present disclosure.
As shown in fig. 5, the printed circuit board stack assembly having the heat dissipation structure of the embodiment shown in fig. 5 is substantially the same as the printed circuit board stack assembly having the heat dissipation structure of the embodiment shown in fig. 1 to 2, except that, in the present embodiment,
the communicating structure 107 is internally provided with a unidirectional film 1075, and the unidirectional film 1075 has air permeability and allows unidirectional flow of liquid. The one-way film 1075 may be made of a high molecular material, for example, a nano material, by making holes in the one-way film 1075 and adjusting the diameter of the holes, so that gaseous substances may pass through the one-way film 1075, that is, the one-way film 1075 has air permeability. The inner structure of the unidirectional film 1075 may be designed to allow only one-way flow of liquid, with the liquid inlet of the unidirectional film 1075 facing the second containing portion 109 and the liquid outlet of the unidirectional film 1075 facing the first containing portion 105, i.e., liquid can be transferred only from the second containing portion 109 to the first containing portion 105 when transferred between the first containing portion 105 and the second containing portion 109 through the communicating structure 107.
In this application embodiment, through at the inside one-way membrane that sets up of connectivity, the one-way membrane has the gas permeability and allows the one-way flow of liquid, both can guarantee the hot steam that produces after the liquid vaporization in the first holding portion, can flow to the second holding portion through the one-way membrane, can also block in the first holding portion liquid inflow second holding portion, this connectivity has only used the one-way membrane, consequently simple structure, with low costs, and realized printed circuit board's high-efficient heat dissipation, the temperature of components and parts among the reduced printed circuit board.
Fig. 6 is a schematic structural diagram of a communication structure in another printed circuit board stack assembly with a heat dissipation structure according to an embodiment of the present disclosure.
As shown in fig. 6, the printed circuit board stack assembly having the heat dissipation structure of the embodiment shown in fig. 6 is substantially the same as the printed circuit board stack assembly having the heat dissipation structure of the embodiment shown in fig. 1 to 2, except that in the present embodiment, the first receiving portion 105 is disposed adjacent to the heat generating component 1033 in the first printed circuit board 101 and/or the second printed circuit board 103 through the heat conductive layer 1013.
Optionally, the heat conducting layer 1013 is made of a heat conducting material including, but not limited to, heat conducting silicone or silicone grease, heat conducting phase change material, and heat conducting material made of high heat conducting filler. The heat generating component 1033 may refer to a component in a printed circuit board, which generates a large amount of heat or does not easily dissipate heat, such as a cpu, a graphic processor, and a communication module. The first receiving portion 105 is disposed adjacent to the heat generating component 1033 through the heat conductive layer 1013, and heat generated by the heat generating component 1033 is rapidly transferred to the first receiving portion 105 through the heat conductive layer, so that the first receiving portion 105 rapidly absorbs heat of the heat generating component 1033.
Fig. 7 is a schematic structural diagram of a first receiving portion in another printed circuit board stacked assembly having a heat dissipation structure according to an embodiment of the present disclosure.
As shown in fig. 7, the first receiving portion 105 has a convex portion 1055 and a concave portion 1057, the direction of the convex in the convex portion 1055 is away from the first receiving portion 105, and the direction of the concave in the concave portion 1057 is directed toward the inside of the first receiving portion 105.
Optionally, the protrusion 1055 is embedded in the electronic components of the first printed circuit board 101 and/or the second printed circuit board 103, and the protrusion 1055 may include a plurality of protrusions, where the specific shape of each protrusion, the length, the width, and the height of the protrusion may be set according to the arrangement of the electronic components in the printed circuit board, so that the protrusion is better embedded in the gap between the electronic components.
Optionally, the recess 1057 encases the electronic components in the first printed circuit board 101 and/or the second printed circuit board 103. Similar to the structure of the protruding portion 1055, the recessed portion 1057 also includes a plurality of recesses, and the specific shape of each recess and the length, width, and depth of the recess can be set according to the arrangement of electronic components in the printed circuit board, so that the recesses can be better wrapped around the electronic components.
In the description of the present application, "plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
The first accommodating part 105 can be better contacted with the first printed circuit board 101 and/or the second printed circuit board 103 through the convex part 1055 and the concave part 1057, the contact area of the first accommodating part 105 and components in the printed circuit board is increased, heat generated by the components in the printed circuit board can be better absorbed, and the overall heat dissipation efficiency of the printed circuit board stacked assembly is improved.
Optionally, the first accommodating portion 105 and the second accommodating portion 109 are made of flexible materials, and since the flexible materials have good fitting performance, the contact area between the first accommodating portion 105 and the printed circuit board and the contact area between the second accommodating portion 109 and the printed circuit board can be increased, so that heat of components in the printed circuit board can be absorbed conveniently.
Alternatively, the first receiving portion 105 and the second receiving portion 109 may be made of an elastic material, which may better receive hot vapor generated after the liquid is vaporized due to its ductility.
Optionally, an air cooling device may be further disposed between the first printed circuit board 101 and the second printed circuit board 103, an air inlet of the air cooling device is located in an inner space of the first printed circuit board 101 and the second printed circuit board 103, an air outlet of the air cooling device is located in a region with a lower temperature outside the first printed circuit board 101 and the second printed circuit board 103, and the air cooling device sucks hot air located near the air inlet in the inner space of the first printed circuit board 101 and the second printed circuit board 103 and blows the hot air to the region with a lower temperature near the air outlet, so that heat dissipation of the first printed circuit board 101 and the second printed circuit board 103 is achieved.
Alternatively, since the first printed circuit board 101 and the second printed circuit board 103 are stacked, a certain accommodating space exists between the first printed circuit board 101 and the second printed circuit board 103, a plurality of heat conducting pipes made of heat conducting material, such as copper pipes, may be disposed in the accommodating space, the heat conducting pipes may surround the accommodating space between the first printed circuit board 101 and the second printed circuit board 103, so as to better absorb heat between the first printed circuit board 101 and the second printed circuit board 103, the heat conducting pipes may also pass through the accommodating space between the first printed circuit board 101 and the second printed circuit board 103 and then contact with other lower temperature components or structures, for example, when the printed circuit board stacked assembly is applied to a mobile phone, the heat conducting pipes may contact with lower temperature regions such as a frame, a front case, a rear case, and a battery of the mobile phone, the heat dissipation efficiency of the first and second printed circuit boards 101 and 103 is improved.
Embodiments of the present application further provide an electronic device including a printed circuit board stack having a heat dissipation structure. The electronic device may be a variety of electronic devices having a printed circuit board stack including, but not limited to, smart phones, tablet computers, laptop portable computers, desktop computers, and the like.
Optionally, the second receiving portion of the printed circuit board stacked assembly having the heat dissipation structure is disposed adjacent to any one of a bezel, a front case, a rear case, and a battery of the electronic device through the heat conductive layer. Because electronic equipment's frame, preceding shell, backshell and the regional temperature of battery are lower, and keep away from the components and parts that generate heat, consequently the second portion of holding sets up behind these regions, and the hot steam in the second portion of holding can liquefy more fast to in time release the heat, improve the holistic radiating efficiency of printed circuit board stack subassembly.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of modules is merely a division of logical functions, and an actual implementation may have another division, for example, a plurality of modules or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or modules, and may be in an electrical, mechanical or other form.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In view of the above description, it is intended to provide a printed circuit board stack and an electronic device with a heat dissipation structure, and variations of the embodiments and application ranges of the printed circuit board stack and the electronic device according to the concepts of the embodiments of the present disclosure.
Claims (11)
1. A printed circuit board stack with a heat dissipation structure, comprising:
a first printed circuit board;
a second printed circuit board stacked with the first printed circuit board;
a first accommodating part which is arranged between the first printed circuit board and the second printed circuit board and in which liquid is stored;
a communicating structure communicating with the first accommodating portion;
a second accommodating portion communicating with the first accommodating portion through the communication structure;
the height of the second accommodating part relative to the ground or the horizontal plane is greater than that of the first accommodating part relative to the ground or the horizontal plane;
the communicating structure comprises a first communicating pipe and a second communicating pipe, two ends of the first communicating pipe and the second communicating pipe are respectively communicated with the first accommodating part and the second accommodating part, a diaphragm which can only pass through gaseous substances is arranged in the first communicating pipe, and a switch part which allows liquid to flow in a single direction is arranged in the second communicating pipe;
the first accommodating part is provided with a convex part and a concave part, the convex part is embedded into the electronic elements of the first printed circuit board and the second printed circuit board, and the concave part wraps the electronic elements in the first printed circuit board and the second printed circuit board.
2. The printed circuit board stack with heat dissipation structure of claim 1, wherein the communication structure comprises a plurality of communication ducts.
3. The printed circuit board stack assembly with a heat dissipation structure of claim 1, wherein at least one of the first-type communication pipe and the second-type communication pipe includes a plurality of communication pipes.
4. The printed circuit board stack with heat dissipation structure of claim 1,
the switching portion includes a one-way membrane or a one-way valve.
5. The printed circuit board stack assembly with a heat dissipation structure as set forth in claim 1, wherein an evaporator is disposed inside the first receiving portion;
the outer wall of evaporimeter, the inner wall of first container portion, the inner wall of intercommunication structure and the inner wall of second container portion all is provided with the capillary structure that is used for liquid reflux.
6. The printed circuit board stack assembly with a heat dissipation structure of claim 1, wherein the first receiving portion is disposed adjacent to a heat generating component in the first printed circuit board and/or the second printed circuit board through a heat conductive layer.
7. The printed circuit board stack with a heat dissipation structure of claim 1, wherein the liquid stored in the first receiving portion is a liquid vaporized by heating.
8. The printed circuit board stack assembly having a heat dissipation structure of claim 1, wherein the first receiving portion and the second receiving portion are made of a flexible material.
9. The printed circuit board stack assembly having a heat dissipation structure of claim 1, wherein the first receiving portion and the second receiving portion are made of an elastic material.
10. An electronic device comprising the printed circuit board stack with the heat dissipation structure as recited in any one of claims 1 to 9.
11. The electronic device of claim 10, wherein the second receiving portion of the printed circuit board stack with heat dissipation structure is disposed adjacent to any one of a bezel, a front case, a rear case, and a battery of the electronic device through a heat conductive layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910510875.9A CN110191621B (en) | 2019-06-13 | 2019-06-13 | Printed circuit board stacking assembly with heat dissipation structure and electronic equipment |
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| CN201910510875.9A CN110191621B (en) | 2019-06-13 | 2019-06-13 | Printed circuit board stacking assembly with heat dissipation structure and electronic equipment |
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| CN110191621B true CN110191621B (en) | 2021-03-19 |
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| CN111552327A (en) * | 2020-05-15 | 2020-08-18 | 上海蔚星科技有限公司 | Dual-drive space thermal switch for spacecraft based on phase change material and metal micro-expansion |
| CN113808566B (en) * | 2021-07-29 | 2024-01-12 | RealMe重庆移动通信有限公司 | Vibration noise processing method and device, electronic equipment and storage medium |
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