CN110190376A - A kind of radio frequency system grade package module of antenna combination liquid-cooling heat radiation structure and preparation method thereof - Google Patents
A kind of radio frequency system grade package module of antenna combination liquid-cooling heat radiation structure and preparation method thereof Download PDFInfo
- Publication number
- CN110190376A CN110190376A CN201910450265.4A CN201910450265A CN110190376A CN 110190376 A CN110190376 A CN 110190376A CN 201910450265 A CN201910450265 A CN 201910450265A CN 110190376 A CN110190376 A CN 110190376A
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- Prior art keywords
- radio frequency
- base
- liquid cooling
- metal column
- antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201811650211 | 2018-12-31 | ||
CN2018116502114 | 2018-12-31 |
Publications (2)
Publication Number | Publication Date |
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CN110190376A true CN110190376A (en) | 2019-08-30 |
CN110190376B CN110190376B (en) | 2020-12-04 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910450265.4A Active CN110190376B (en) | 2018-12-31 | 2019-05-28 | Radio frequency system-in-package module with antenna combined with liquid cooling heat dissipation structure and manufacturing method thereof |
Country Status (1)
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CN (1) | CN110190376B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111698824A (en) * | 2020-05-22 | 2020-09-22 | 中国电子科技集团公司第二十九研究所 | Integrated interconnection structure of self-airtight packaging functional module and implementation method |
CN113192915A (en) * | 2021-04-26 | 2021-07-30 | 武汉新芯集成电路制造有限公司 | Three-dimensional integrated circuit module and manufacturing method |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1893053A (en) * | 2005-07-08 | 2007-01-10 | 三星电子株式会社 | Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure |
US20090057879A1 (en) * | 2007-08-28 | 2009-03-05 | Reseach Triangle Institute | Structure and process for electrical interconnect and thermal management |
CN202996893U (en) * | 2012-12-05 | 2013-06-12 | 钟细环 | An in-line large-power LED |
CN103456646A (en) * | 2013-09-05 | 2013-12-18 | 中国电子科技集团公司第十研究所 | Method for preparing multilayer low-temperature cofired ceramics integrated liquid cooling circulation channel |
US8617927B1 (en) * | 2011-11-29 | 2013-12-31 | Hrl Laboratories, Llc | Method of mounting electronic chips |
US9172132B2 (en) * | 2011-02-17 | 2015-10-27 | Globalfoundries Inc | Integrated antenna for RFIC package applications |
JP2015233099A (en) * | 2014-06-10 | 2015-12-24 | 国立研究開発法人産業技術総合研究所 | Semiconductor device, interposer, and manufacturing method of interposer |
US20170018507A1 (en) * | 2010-06-02 | 2017-01-19 | STATS ChipPAC Pte. Ltd. | Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die |
WO2017052636A1 (en) * | 2015-09-25 | 2017-03-30 | Intel Corporation | Package-integrated microchannels |
CN106847712A (en) * | 2016-12-28 | 2017-06-13 | 华进半导体封装先导技术研发中心有限公司 | A kind of fan-out-type wafer level packaging structure and preparation method thereof |
CN107275297A (en) * | 2017-05-25 | 2017-10-20 | 中国电子科技集团公司第二十九研究所 | A kind of microfluid heat dissipation channel, heat dissipating method and preparation method |
CN107452720A (en) * | 2017-08-03 | 2017-12-08 | 华天科技(昆山)电子有限公司 | Chip fan-out packaging structure, multi-chip integrated module and wafer-level packaging method |
CN107452689A (en) * | 2017-09-14 | 2017-12-08 | 厦门大学 | The embedded fan-out-type silicon pinboard and preparation method of three-dimensional systematic package application |
CN108461460A (en) * | 2017-12-15 | 2018-08-28 | 天津津航计算技术研究所 | A kind of two-phase laminated flow micro-channel heat sink |
WO2018182756A1 (en) * | 2017-04-01 | 2018-10-04 | Intel Corporation | 5G mmWAVE COOLING THROUGH PCB |
-
2019
- 2019-05-28 CN CN201910450265.4A patent/CN110190376B/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1893053A (en) * | 2005-07-08 | 2007-01-10 | 三星电子株式会社 | Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure |
US20090057879A1 (en) * | 2007-08-28 | 2009-03-05 | Reseach Triangle Institute | Structure and process for electrical interconnect and thermal management |
US20170018507A1 (en) * | 2010-06-02 | 2017-01-19 | STATS ChipPAC Pte. Ltd. | Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die |
US9172132B2 (en) * | 2011-02-17 | 2015-10-27 | Globalfoundries Inc | Integrated antenna for RFIC package applications |
US8617927B1 (en) * | 2011-11-29 | 2013-12-31 | Hrl Laboratories, Llc | Method of mounting electronic chips |
CN202996893U (en) * | 2012-12-05 | 2013-06-12 | 钟细环 | An in-line large-power LED |
CN103456646A (en) * | 2013-09-05 | 2013-12-18 | 中国电子科技集团公司第十研究所 | Method for preparing multilayer low-temperature cofired ceramics integrated liquid cooling circulation channel |
JP2015233099A (en) * | 2014-06-10 | 2015-12-24 | 国立研究開発法人産業技術総合研究所 | Semiconductor device, interposer, and manufacturing method of interposer |
WO2017052636A1 (en) * | 2015-09-25 | 2017-03-30 | Intel Corporation | Package-integrated microchannels |
CN106847712A (en) * | 2016-12-28 | 2017-06-13 | 华进半导体封装先导技术研发中心有限公司 | A kind of fan-out-type wafer level packaging structure and preparation method thereof |
WO2018182756A1 (en) * | 2017-04-01 | 2018-10-04 | Intel Corporation | 5G mmWAVE COOLING THROUGH PCB |
CN107275297A (en) * | 2017-05-25 | 2017-10-20 | 中国电子科技集团公司第二十九研究所 | A kind of microfluid heat dissipation channel, heat dissipating method and preparation method |
CN107452720A (en) * | 2017-08-03 | 2017-12-08 | 华天科技(昆山)电子有限公司 | Chip fan-out packaging structure, multi-chip integrated module and wafer-level packaging method |
CN107452689A (en) * | 2017-09-14 | 2017-12-08 | 厦门大学 | The embedded fan-out-type silicon pinboard and preparation method of three-dimensional systematic package application |
CN108461460A (en) * | 2017-12-15 | 2018-08-28 | 天津津航计算技术研究所 | A kind of two-phase laminated flow micro-channel heat sink |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111698824A (en) * | 2020-05-22 | 2020-09-22 | 中国电子科技集团公司第二十九研究所 | Integrated interconnection structure of self-airtight packaging functional module and implementation method |
CN113192915A (en) * | 2021-04-26 | 2021-07-30 | 武汉新芯集成电路制造有限公司 | Three-dimensional integrated circuit module and manufacturing method |
CN113192915B (en) * | 2021-04-26 | 2024-02-27 | 武汉新芯集成电路制造有限公司 | Three-dimensional integrated circuit module and manufacturing method |
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Publication number | Publication date |
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CN110190376B (en) | 2020-12-04 |
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CB03 | Change of inventor or designer information | ||
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Inventor after: Zhang Bing Inventor after: Zhang Xun Inventor after: Song Qihe Inventor before: Yu Faxin Inventor before: Feng Guangjian Inventor before: Zhang Bing Inventor before: Zhou Qi Inventor before: Zhang Xun Inventor before: Wang Zhiyu |
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Address after: Room 502, building 5, No. 3, Xiyuan 3rd road, Sandun Town, Xihu District, Hangzhou City, Zhejiang Province Patentee after: Zhejiang Zhenlei Technology Co., Ltd Address before: Room 502, building 5, No. 3, Xiyuan Third Road, Sandun Town, Xihu District, Hangzhou City, Zhejiang Province Patentee before: HANGZHOU ZHENLEI MICROWAVE TECHNOLOGY Co.,Ltd. |