CN110189875A - High-accuracy chip Alloy Foil fixed resister and production method - Google Patents
High-accuracy chip Alloy Foil fixed resister and production method Download PDFInfo
- Publication number
- CN110189875A CN110189875A CN201910175126.5A CN201910175126A CN110189875A CN 110189875 A CN110189875 A CN 110189875A CN 201910175126 A CN201910175126 A CN 201910175126A CN 110189875 A CN110189875 A CN 110189875A
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- Prior art keywords
- alloy foil
- chip
- accuracy
- fixed resister
- resistance value
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/003—Apparatus or processes specially adapted for manufacturing resistors using lithography, e.g. photolithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/23—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by opening or closing resistor geometric tracks of predetermined resistive values, e.g. snapistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention belongs to Alloy Foil resistor fields.High-accuracy chip Alloy Foil fixed resister is surface-mount resistor device, as the alloy foil of block metal as resistance layer material.By being lithographically formed the fine Alloy Foil figure of special designing, then resistance value and precision are modified by precise laser resistance trimming.Alloy Foil chip surface protective mulch.Alloy Foil chip is electroplated, exit is formed.The Surface Mounting Technology of high-accuracy Alloy Foil product is realized, is minimized.High-accuracy chip Alloy Foil fixed resister, 4 models are shared, RM2012:2.0mm × 1.2mm × 0.6mm, RM3216:3.2mm × 1.6mm × 0.6mm, RM5025:5.0mm × 2.5mm × 0.6mm, RM6332:6.3mm × 3.2mm × 0.6mm are respectively as follows:.
Description
One, technical field
The invention belongs to Alloy Foil resistor fields.
Two, background technique
Existing chip film fixed resister, possesses the sizes such as RMK1005,1608,2012,3216,5025,6332
Resistor production capacity, there is experience abundant to the processing of different size chip resistors.It can accomplish small in size, weight
Gently, the advantages that reliable in quality, but resistance accuracy is up to ± 0.05%, and resistance-temperature characteristic highest can realize ± 10 × 10-6/
K。
There is lead Precise Alloy foil resistor production line to have foliation, photoetching technique and equipment, adds in graphic designs, photoetching
Work etc. has experience abundant.The type resistor has the function of automatic temperature compensating resistance characteristic, in wider temperature
Spending has lesser temperature characterisitic in range, have accurate, stable, the reliable characteristic of resistance value, and resistance accuracy reaches as high as ±
0.01%, resistance-temperature characteristic highest can realize ± 2 × 10-6/K.But small product size is big, be unsatisfactory for user demand to miniaturization,
The trend of lightness development.
Three, summary of the invention
In order to meet while having many advantages, such as surface mount, high-precision, highly reliable, low-temperature coefficient, to miniaturization, it is light-duty
Change, is high-accuracy, the trend that highly reliable direction is developed, the present invention provides a kind of sides of high-accuracy chip Alloy Foil fixed resister
Case and preparation method thereof.
The present invention is achieved by the following technical solutions:
Main conductive mechanism and the RJK711 of product of the present invention have the closely sealed goldleaf resistor product of lead essence type similar, structure
Feature and RMK chip film fixed resister product are similar, therefore according to the experience of both products, assess chip Alloy Foil
The reason of failure mode that fixed resister is likely to occur, analysis causes failure and mechanism study corresponding precautionary measures, and will
It is applied in product design.
The surface of the base body of chip Alloy Foil fixed resister is more much smaller than the surface of the base body of traditional column resistor, because
The heat dissipation area of this product reduces, power density increases, and the integrity problem it is possible that in terms of power load is used for a long time.
For this problem, we optimize product structure design by preferred substrate material and alloy foil to guarantee that product is good and dissipate
Thermal energy power and the anti-load-bearing capacity of film layer, make product have good reliability and stability at work with this.
In addition, chip resistor, using no pin configuration, exit is made of internal electrode layer and outer electrode layer, use
Different process formed internal electrode layer and outer electrode layer thickness differ greatly, it is this contact be it is unstable, with working environment
It may change with the variation contact condition of condition, by improving internal and external electrode formation process, improve product exit
Reliability.
The computing the resistor value R of resistor is directly proportional with its length L, directly proportional with its cross-sectional area S, also with the material of conductor
Material ρ has relationship, formula are as follows:
R=ρ L/S
Wherein ρ: being made the resistivity of the material of resistance,
L: the conductive lengths of resistance,
S: the conductive cross-sectional area of resistance.
The characteristics of according to chip Alloy Foil fixed resister, does a lot of work in the graphic designs that resistance value is realized, if
Proprietary resistance pattern is counted, by accumulating graphic designs experience, optimization design figure.And it is carried out in a manner of a kind of " building city wall "
Resistance value adjustment, by the parallel circuit in laser cutting resistance pattern, realizes the growth of resistance value, until target resistance value.
Therefore the production process and composed structure of chip Alloy Foil resistor are established.
Four, Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1-a is ceramic substrate front view schematic diagram；
Fig. 1-b is the left view schematic diagram of Fig. 1-a；
Fig. 2-a is foliation substrate schematic diagram；
Fig. 2-b is the left view schematic diagram of Fig. 2-a；
Fig. 3-a is lithography first edition substrate front view schematic diagram；
Fig. 3-b is the left view schematic diagram of Fig. 3-a；
Fig. 4-a is punching substrate front view schematic diagram；
Fig. 4-b is the left view schematic diagram of Fig. 4-a；
Fig. 5-a is lithography substrate front view schematic diagram；
Fig. 5-b is Fig. 6-a partial enlarged view and cross-sectional view schematic diagram；
Fig. 6 is scribing line substrate front view schematic diagram；
Fig. 7-a is text substrate front view schematic diagram；
Fig. 7-b is Fig. 7-a partial enlarged view and cross-sectional view schematic diagram；
Fig. 8-a is termination electrode film resistance front view schematic diagram；
Fig. 8-b is Fig. 8-a partial enlarged view and cross-sectional view schematic diagram；
Fig. 9-a is fragment resistor disc front view schematic diagram；
Fig. 9-b is Fig. 9-a side view schematic diagram；
Figure 10-a is high-accuracy chip Alloy Foil resistor front view schematic diagram；
Figure 10-b is Figure 10-a side view schematic diagram；
1 represents in figure: ceramic substrate；2 represent: bonding agent；3 represent: Alloy Foil；4 represent: photoresist；5 represent: tin-lead
Layer；6 represent: etched features；7 represent: positive electrode film；8 represent: protective layer；9 represent: back electrode film；10 represent: text；11 generations
Table: termination electrode film.
Five, specific embodiment
Specific process are as follows:
(1) ceramic substrate is selected according to product type, then ceramic substrate is cleaned；At the same time, according to product
Model, resistance value and the suitable foil of temperature coefficient requirements selection thickness, free state temperature coefficient, and foil is located in advance
Reason；Then together with processed ceramic substrate 1 and foil 3 being pasted with binder 2.
(2) lithography first edition is carried out by photoresist 4, forms figure shown in Fig. 3-a.
(3) substrate for having carried out lithography first edition is punched, later process is facilitated to position.
(4) lithography is carried out by photoresist 4, forms resistance lines.And form Alloy Foil resistive layer by corrosion
Figure, step processing need to select processing method according to the width of resistance pattern lines.
(5) after carrying out resistance value adjustment to resistance lines, laser scribing is carried out to ceramic substrate.
(6) printing and sintering of back electrode, protective layer, text are carried out respectively.
(7) it carries out slitting and end applies, form the end face internal electrode layer of product.
(8) particle and plating are carried out, the complete exit of product formation by plating.Height shown in Figure 10-b is made
Accurate chip Alloy Foil fixed resister.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by anyone skilled in the art,
It should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with scope of protection of the claims
Subject to.
Claims (4)
- It is surface-mount resistor device 1. according to the present invention is a kind of high-accuracy chip Alloy Foil fixed resister, using as block gold The alloy foil of category is as resistance layer material.By being lithographically formed the fine Alloy Foil figure of special designing, then by precision Resistance value and precision are modified in laser resistor trimming.Alloy Foil chip surface protective mulch.Alloy Foil chip is electroplated, shape At exit.
- 2. the high-accuracy chip Alloy Foil fixed resister of RM type according to claim 1, shares 4 models, is respectively as follows: RM2012:2.0mm × 1.2mm × 0.6mm, RM3216:3.2mm × 1.6mm × 0.6mm, RM5025:5.0mm × 2.5mm × 0.6mm, RM6332:6.3mm × 3.2mm × 0.6mm.
- 3. the high-accuracy chip Alloy Foil fixed resister of RM type according to claim 1, it is characterized in that: being surface-mount resistor Device is made of ceramic substrate, resistive layer, exit and encapsulated layer.
- 4. the high-accuracy chip Alloy Foil fixed resister of RM type is required according to the 1st, it is characterized in that: chip Alloy Foil is solid The resistance value adjustment for determining resistor is carried out in a manner of a kind of " building city wall ", and the parallel connection electricity in laser cutting resistance pattern is passed through The growth of resistance value is realized on road, until target resistance value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910175126.5A CN110189875A (en) | 2019-03-07 | 2019-03-07 | High-accuracy chip Alloy Foil fixed resister and production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910175126.5A CN110189875A (en) | 2019-03-07 | 2019-03-07 | High-accuracy chip Alloy Foil fixed resister and production method |
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| Publication Number | Publication Date |
|---|---|
| CN110189875A true CN110189875A (en) | 2019-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910175126.5A Pending CN110189875A (en) | 2019-03-07 | 2019-03-07 | High-accuracy chip Alloy Foil fixed resister and production method |
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| Country | Link |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1162825A (en) * | 1996-03-11 | 1997-10-22 | 松下电器产业株式会社 | Electric resistor and manufacture thereof |
| CN1641801A (en) * | 2004-01-09 | 2005-07-20 | 国巨股份有限公司 | Method for manufacturing surface-bonded metal foil chip resistor |
| CN107359035A (en) * | 2017-07-13 | 2017-11-17 | 中国振华集团云科电子有限公司 | The manufacture method of chip fixed resister and chip fixed resister |
-
2019
- 2019-03-07 CN CN201910175126.5A patent/CN110189875A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1162825A (en) * | 1996-03-11 | 1997-10-22 | 松下电器产业株式会社 | Electric resistor and manufacture thereof |
| CN1641801A (en) * | 2004-01-09 | 2005-07-20 | 国巨股份有限公司 | Method for manufacturing surface-bonded metal foil chip resistor |
| CN107359035A (en) * | 2017-07-13 | 2017-11-17 | 中国振华集团云科电子有限公司 | The manufacture method of chip fixed resister and chip fixed resister |
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Application publication date: 20190830 |