CN110189664A - The method that pixel array detects substrate and production method, detection pixel array substrate - Google Patents
The method that pixel array detects substrate and production method, detection pixel array substrate Download PDFInfo
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- CN110189664A CN110189664A CN201910400565.1A CN201910400565A CN110189664A CN 110189664 A CN110189664 A CN 110189664A CN 201910400565 A CN201910400565 A CN 201910400565A CN 110189664 A CN110189664 A CN 110189664A
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- pixel array
- substrate
- circuit
- electrically connected
- array circuit
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Liquid Crystal (AREA)
Abstract
A kind of method that pixel array detects substrate and preparation method thereof and detection pixel array substrate.Described kind of pixel array detects substrate, including substrate, pixel array circuit are set on the substrate, insulating protective layer is set on the pixel array circuit, grid drive chip and voltage checking chip is electrically connected to the pixel array circuit and micro-chip processor is electrically connected to the voltage checking chip.The pixel array circuit is made with the mask of pixel array substrate to be measured.
Description
[technical field]
This announcement is related to field of display technology, in particular to a kind of pixel array detection substrate and preparation method thereof and inspection
The method for surveying pixel array substrate.
[background technique]
At present there are three types of the main methods of detection pixel array substrate.First method uses electron-beam excitation pixel electrode
And detect the secondary beam of reflection.This mode, which is required to will test chamber when detecting every time, to be vacuumized, when needing to spend longer
Between.
Second method uses the probe with liquid crystal material, and the liquid crystal molecule in probe is deflected by the electric field of pixel electrode
And pass through light, charge-coupled device (Charge Coupled Device, CCD) imaging sensor is reflexed to through reflecting mirror
Form image.Resolution ratio by CCD is influenced, and pixel electrode to be measured cannot be too small, and reflecting mirror vulnerable to particle pollution or is scraped
Wound.
The third method is detected using the mode of direct overlap joint detection chip, but as the resolution ratio of display is big
Width improves, and route to be measured is significantly increased, so that TCH test channel is not enough, and overlaps difficulty and improves.
[summary of the invention]
In order to solve the above technical problems, the one of this announcement is designed to provide a kind of pixel array detection substrate and its production
Method and the method for detecting pixel array substrate, realize low cost, high-precision and efficient detection, and detection substrate is easy more
Change maintenance.
To reach above-mentioned purpose, this announcement provides a kind of pixel array detection substrate, including substrate, pixel array circuit are set
It is placed on the substrate, insulating protective layer is set on the pixel array circuit, grid drive chip is electrically connected to the picture
Primitive matrix column circuits, voltage checking chip are electrically connected to the pixel array circuit and micro-chip processor is electrically connected to the voltage
Detection chip.The pixel array circuit is made with the mask of pixel array substrate to be measured.
In an embodiment of this announcement, the insulating protective layer has flat surface.
In an embodiment of this announcement, the pixel array circuit has structure identical as pixel array substrate to be measured
Pixel electrode and transistor circuit.
In an embodiment of this announcement, the pixel array circuit has a plurality of grid line and multiple data lines.It is described
Grid drive chip is electrically connected to a plurality of grid line.The voltage checking chip is electrically connected to the multiple data lines.
This announcement also provides a kind of production method of pixel array detection substrate, including the following steps:
Substrate is provided；
In production pixel array circuit on the substrate；
Insulating protective layer is provided to be set on the pixel array circuit；
Grid drive chip is provided and is electrically connected to the pixel array circuit；
Voltage checking chip is provided and is electrically connected to the pixel array circuit；And
Micro-chip processor is provided and is electrically connected to the voltage checking chip.The pixel array circuit is with picture element to be measured
The mask of array substrate makes.
In the production method of the pixel array detection substrate of an embodiment of this announcement, wherein provide insulating protective layer and set
The step being placed on the pixel array circuit further includes the steps that carrying out surface planarisation to insulating protective layer.
In the production method of the pixel array detection substrate of an embodiment of this announcement, wherein made on Yu Suoshu substrate
It further include in production on the substrate and the mutually isostructural picture element of pixel array substrate to be measured in the step of pixel array circuit
The step of electrode and transistor circuit.
In the production method of the pixel array detection substrate of an embodiment of this announcement, wherein the pixel array circuit
It with a plurality of grid line, provides in the step of grid drive chip is electrically connected to the pixel array circuit, further including will be described
Grid drive chip is electrically connected to the step of a plurality of grid line.
In the production method of the pixel array detection substrate of an embodiment of this announcement, wherein the pixel array circuit
It with multiple data lines, provides in the step of voltage checking chip is electrically connected to the pixel array circuit, further including will be described
Voltage checking chip is electrically connected to the step of multiple data lines.
This announcement also provides a kind of method for detecting pixel array substrate, including the following steps:
Pixel array detection substrate is provided to be placed on the pixel array substrate to be measured；
The pixel array, which is directed at, by contraposition mark detects substrate and the pixel array substrate；
The pixel electrode of the pixel array substrate to be measured is charged；And
The transistor on the pixel array detection substrate is opened line by line and records the voltage value that each column are read.The picture
Pixel array detect substrate the pixel array circuit have with the mutually isostructural pixel electrode of pixel array substrate to be measured and
Transistor circuit.
Pixel array detection substrate due to this revealed embodiment and preparation method thereof and detection pixel array substrate
Method in, using with the mutually isostructural pixel electrode of pixel array substrate to be measured and transistor circuit, therefore can with to
The pixel array substrate of survey accurately aligns.Utilize pixel electrode and pixel array substrate to be measured on pixel array detection substrate
On pixel electrode between capacity effect come sense the pixel electrode on pixel array substrate and using grid drive chip with
Voltage checking chip may achieve the effect quickly detected to control testing process.Insulating protective layer is set to the pixel array
To avoid component damage on circuit, use cost is reduced.Since this revealed embodiment is not required to vacuumize, replacement is eliminated
It the time for waiting vacuum breaker when pixel array detects substrate and vacuumizing, improves efficiency.
For the above content of this announcement can be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate institute's accompanying drawings, makees
Detailed description are as follows:
[Detailed description of the invention]
Fig. 1 shows the structural schematic diagram that substrate is detected according to the pixel array of an embodiment of this announcement；
Fig. 2, which is shown, detects cuing open for substrate and pixel array substrate to be measured according to the pixel array of an embodiment of this announcement
Face structural schematic diagram；
Fig. 3 shows the flow diagram that method for preparing substrate is detected according to the pixel array of an embodiment of this announcement；With
And
Fig. 4 shows the flow diagram of the method for the detection pixel array substrate according to an embodiment of this announcement.
[specific embodiment]
In order to which the above-mentioned and other purposes of this announcement, feature, advantage can be clearer and more comprehensible, it is excellent that spy is hereafter lifted into this announcement
Embodiment is selected, and cooperates institute's accompanying drawings, is described in detail below.Furthermore the direction term that this announcement is previously mentioned, such as above and below,
Top, bottom, front, rear, left and right, inside and outside, side layer, around, center, it is horizontal, laterally, vertically, longitudinally, axial direction, radial direction, top layer or
Lowest level etc. is only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand this announcement, and
It is non-to limit this announcement.
The similar unit of structure is to be given the same reference numerals in the figure.
Referring to FIG. 1 and FIG. 2, this announcement provides a kind of pixel array detection substrate 1000, including substrate 100, pixel array
Circuit 200 is set on the substrate 100, insulating protective layer 300 is set on the pixel array circuit 200, gate driving
Chip 400 is electrically connected to the pixel array circuit 200, voltage checking chip 500 is electrically connected to the pixel array circuit 200
And micro-chip processor 600 is electrically connected to the voltage checking chip 500.The pixel array circuit 200 is with picture to be measured
The mask of pixel array substrate 2000 makes.
Specifically, the pixel array circuit 200 and pixel array to be measured of the pixel array detection substrate 1000
Pixel array circuit on substrate 2000 is made with same set of mask.This announcement does not limit the thin of pixel array circuit 200
Section.Fig. 1 and pixel array circuit 200 shown in Fig. 2 are only one of embodiment, this announcement is without being limited thereto.
In an embodiment of this announcement, the insulating protective layer 300 has flat surface.
Specifically, the capacitor that the flat surfaces of the insulating protective layer 300 can avoid different location generates difference, and avoid
It collides when close to pixel array substrate 2000 to be measured.
In an embodiment of this announcement, the pixel array circuit 200 has and pixel array substrate 2000 to be measured
Mutually isostructural pixel electrode 210 and transistor circuit 220.
Specifically, the pixel array circuit 200 and pixel array to be measured of the pixel array detection substrate 1000
Pixel array circuit on substrate 2000 is made with same set of mask.Therefore, the pixel array circuit 200 can have with
The mutually isostructural pixel electrode 210 of pixel array substrate 2000 to be measured and transistor circuit 220.This announcement does not limit picture element electricity
The details of pole 210 and transistor circuit 220.Fig. 1 and pixel electrode shown in Fig. 2 210 and transistor circuit 220 are only wherein one
A embodiment, this announcement are without being limited thereto.
In an embodiment of this announcement, the pixel array circuit 200 has a plurality of grid line 240 and multiple data lines
230.The grid drive chip 400 is electrically connected to a plurality of grid line 240.The voltage checking chip 500 is electrically connected to
The multiple data lines 230.
It detects in substrate 1000, is electrically connected specifically, opening the pixel array line by line by the grid drive chip 400
It connects the transistor 220 of the row grid line 240 and records the voltage value that each column data line 230 is read.By the micro process core
Piece 600 handles and forms the voltage pattern comprising each pixel voltage value on entire substrate to be measured.
Referring to Fig. 3 and Fig. 1, Fig. 2, this announcement also provides a kind of production method of pixel array detection substrate 1000, packet
Include the following steps:
Step S110: substrate 100 is provided；
Pixel array circuit 200 is made on S120: Yu Suoshu substrate 100 of step；
Step S130: insulating protective layer 300 is provided and is set on the pixel array circuit 200；
Step S140: grid drive chip 400 is provided and is electrically connected to the pixel array circuit 200；
Step S150: voltage checking chip 500 is provided and is electrically connected to the pixel array circuit 200；And
Step S160: micro-chip processor 600 is provided and is electrically connected to the voltage checking chip 500.The pixel array electricity
Road 200 is made with the mask of pixel array substrate 2000 to be measured.
Specifically, the pixel array circuit 200 and pixel array to be measured of the pixel array detection substrate 1000
Pixel array circuit on substrate 2000 is made with same set of mask.This announcement does not limit the thin of pixel array circuit 200
Section.Fig. 1 and pixel array circuit 200 shown in Fig. 2 are only one of embodiment, this announcement is without being limited thereto.
In the production method of the pixel array detection substrate of an embodiment of this announcement, wherein provide insulating protective layer 300
The step S130 being set on the pixel array circuit 200 further includes the step that surface planarisation is carried out to insulating protective layer 200
Suddenly.
Specifically, the capacitor that the flat insulating protective layer 300 in surface can avoid different location generates difference, and avoid
It collides when close to pixel array substrate 2000 to be measured.
In the production method of the pixel array detection substrate of an embodiment of this announcement, wherein made on Yu Suoshu substrate 100
Make in the step S120 of pixel array circuit 200, further includes in production on the substrate 100 and pixel array substrate to be measured
The step of 2000 mutually isostructural pixel electrodes 210 are with transistor circuit 220.
Specifically, the pixel array circuit 200 and pixel array to be measured of the pixel array detection substrate 1000
Pixel array circuit on substrate 2000 is made with same set of mask.Therefore, the pixel array circuit 200 can have with
The mutually isostructural pixel electrode 210 of pixel array substrate 2000 to be measured and transistor circuit 220.This announcement does not limit picture element electricity
The details of pole 210 and transistor circuit 220.Fig. 1 and pixel electrode shown in Fig. 2 210 and transistor circuit 220 are only wherein one
A embodiment, this announcement are without being limited thereto.
In the production method of the pixel array detection substrate of an embodiment of this announcement, wherein the pixel array circuit
200 have a plurality of grid line 240, provide the step S140 that grid drive chip 400 is electrically connected to the pixel array circuit 200
In, further include the steps that the grid drive chip 400 being electrically connected to a plurality of grid line 240.
In the production method of the pixel array detection substrate of an embodiment of this announcement, wherein the pixel array circuit
200 have multiple data lines 230, provide the step S150 that voltage checking chip 500 is electrically connected to the pixel array circuit 200
In, further include the steps that the voltage checking chip 500 being electrically connected to the multiple data lines 230.
It detects in substrate 1000, is electrically connected specifically, opening the pixel array line by line by the grid drive chip 400
It connects the transistor 220 of the row grid line 240 and records the voltage value that each column data line 230 is read.By the micro process core
Piece 600 handles and forms the voltage pattern comprising each pixel voltage value on entire substrate to be measured.
Referring to Fig. 4 and Fig. 2, this announcement also provides a kind of method for detecting pixel array substrate, including the following steps:
Step S210: pixel array detection substrate 1000 is provided and is placed on the pixel array substrate 2000 to be measured；
Step S220: the pixel array is directed at by contraposition mark and detects substrate 1000 and the pixel array substrate
2000；
Step S230: the pixel electrode 2210 of the pixel array substrate 2000 to be measured is charged；And
Step S240: the transistor 220 on the pixel array detection substrate 1000 is opened line by line and records each column and is read
The voltage value taken.The pixel array circuit 200 of the pixel array detection substrate 1000 has and pixel array to be measured
The mutually isostructural pixel electrode 210 of substrate 2000 and transistor circuit 220.
Specifically, utilizing the picture element electricity on the pixel electrode and pixel array substrate to be measured on pixel array detection substrate
Capacity effect between pole senses whether the pixel electrode on pixel array substrate works normally.
It detects in substrate 1000, is electrically connected specifically, opening the pixel array line by line by the grid drive chip 400
It connects the transistor 220 of the row grid line 240 and records the voltage value that each column data line 230 is read.By the micro process core
Piece 600 handles and forms the voltage pattern comprising each pixel voltage value on entire substrate to be measured.With quick detection and position
Accurate effect.
Pixel array detection substrate due to this revealed embodiment and preparation method thereof and detection pixel array substrate
Method in, using with the mutually isostructural pixel electrode of pixel array substrate to be measured and transistor circuit, therefore can with to
The pixel array substrate of survey accurately aligns.Utilize pixel electrode and pixel array substrate to be measured on pixel array detection substrate
On pixel electrode between capacity effect come sense the pixel electrode on pixel array substrate and using grid drive chip with
Voltage checking chip may achieve the effect quickly detected to control testing process.Insulating protective layer is set to the pixel array
To avoid component damage on circuit, use cost is reduced.Since this revealed embodiment is not required to vacuumize, replacement is eliminated
The time for waiting vacuum breaker when pixel array detects substrate and vacuumizing.It improves efficiency.
Although this announcement, those skilled in the art have shown and described relative to one or more implementations
It will be appreciated that equivalent variations and modification based on the reading and understanding to the specification and drawings.This announcement includes all such repairs
Change and modification, and is limited only by the scope of the following claims.In particular, to various functions executed by the above components, use
It is intended to correspond in the term for describing such component and executes the specified function of the component (such as it is functionally of equal value
) random component (unless otherwise instructed), even if in structure with execute the exemplary of this specification shown in this article and realize
The open structure of function in mode is not equivalent.In addition, although the special characteristic of this specification is relative to several realization sides
Only one in formula is disclosed, but this feature can with such as can be for a given or particular application expectation and it is advantageous
One or more other features combinations of other implementations.Moreover, with regard to term " includes ", " having ", " containing " or its deformation
For being used in specific embodiments or claims, such term is intended to wrap in a manner similar to the term " comprising "
It includes.
The above is only the preferred embodiments of this announcement, it is noted that for those of ordinary skill in the art, is not departing from
Under the premise of this announcement principle, several improvements and modifications can also be made, these improvements and modifications also should be regarded as the guarantor of this announcement
Protect range.
Claims (10)
1. a kind of pixel array detects substrate characterized by comprising
Substrate；
Pixel array circuit is set on the substrate；
Insulating protective layer is set on the pixel array circuit；
Grid drive chip is electrically connected to the pixel array circuit；
Voltage checking chip is electrically connected to the pixel array circuit；And
Micro-chip processor is electrically connected to the voltage checking chip, wherein the pixel array circuit is with picture element battle array to be measured
The mask of column substrate makes.
2. pixel array as described in claim 1 detects substrate, which is characterized in that the insulating protective layer has flat table
Face.
3. pixel array as claimed in claim 2 detects substrate, which is characterized in that the pixel array circuit have with it is to be measured
The mutually isostructural pixel electrode of pixel array substrate and transistor circuit.
4. pixel array as claimed in claim 3 detects substrate, which is characterized in that the pixel array circuit has a plurality of grid
Polar curve and multiple data lines, the grid drive chip are electrically connected to a plurality of grid line, and the voltage checking chip is electrically connected
It is connected to the multiple data lines.
5. a kind of production method of pixel array detection substrate, characterized in that it comprises the following steps:
Substrate is provided；
In production pixel array circuit on the substrate；
Insulating protective layer is provided to be set on the pixel array circuit；
Grid drive chip is provided and is electrically connected to the pixel array circuit；
Voltage checking chip is provided and is electrically connected to the pixel array circuit；And
Micro-chip processor is provided and is electrically connected to the voltage checking chip, wherein the pixel array circuit is with picture to be measured
The mask of pixel array substrate makes.
6. the production method of pixel array detection substrate as claimed in claim 5, which is characterized in that provide insulating protective layer and set
The step being placed on the pixel array circuit further includes the steps that carrying out surface planarisation to insulating protective layer.
7. the production method of pixel array detection substrate as claimed in claim 6, which is characterized in that made on Yu Suoshu substrate
It further include in production on the substrate and the mutually isostructural picture element of pixel array substrate to be measured in the step of pixel array circuit
The step of electrode and transistor circuit.
8. the production method of pixel array detection substrate as claimed in claim 7, which is characterized in that the pixel array circuit
It with a plurality of grid line, provides in the step of grid drive chip is electrically connected to the pixel array circuit, further including will be described
Grid drive chip is electrically connected to the step of a plurality of grid line.
9. the production method of pixel array detection substrate as claimed in claim 7, which is characterized in that the pixel array circuit
It with multiple data lines, provides in the step of voltage checking chip is electrically connected to the pixel array circuit, further including will be described
Voltage checking chip is electrically connected to the step of multiple data lines.
10. a kind of method for detecting pixel array substrate, characterized in that it comprises the following steps:
Pixel array detection substrate is provided to be placed on the pixel array substrate to be measured；
The pixel array, which is directed at, by contraposition mark detects substrate and the pixel array substrate；
The pixel electrode of the pixel array substrate to be measured is charged；And
The transistor on the pixel array detection substrate is opened line by line and records the voltage value that each column are read, wherein described
The pixel array circuit that pixel array detects substrate has and the mutually isostructural pixel electrode of pixel array substrate to be measured
With transistor circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910400565.1A CN110189664A (en) | 2019-05-15 | 2019-05-15 | The method that pixel array detects substrate and production method, detection pixel array substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910400565.1A CN110189664A (en) | 2019-05-15 | 2019-05-15 | The method that pixel array detects substrate and production method, detection pixel array substrate |
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| Publication Number | Publication Date |
|---|---|
| CN110189664A true CN110189664A (en) | 2019-08-30 |
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ID=67716318
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910400565.1A Pending CN110189664A (en) | 2019-05-15 | 2019-05-15 | The method that pixel array detects substrate and production method, detection pixel array substrate |
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| US20020167472A1 (en) * | 2001-03-30 | 2002-11-14 | Yushi Jinno | Active matrix display device and inspection method therefor |
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